Double-station eutectic heating machine and eutectic method

Abstract

The invention relates to a double-station eutectic heating machine and an eutectic method, and relates to the technical field of semiconductor packaging equipment. The eutectic table is used for heating and bonding the substrate, the first chip and the second chip, the eutectic table is arranged on the workbench, and a first station and a second station are arranged on the eutectic table at an interval; the first chip feeding device is used for conveying a first chip to the eutectic table, and the first chip feeding device is arranged on the workbench; the second chip feeding device is used for conveying a second chip to the eutectic table, and the second chip feeding device is arranged on the workbench; and the substrate feeding and discharging device is used for conveying substrates to the first station and the second station and discharging finished products of the first station and the second station, and the substrate feeding and discharging device is arranged on the workbench. Through the arrangement of double stations of the eutectic table, unnecessary time waste in the production process of finished products can be reduced, and then the production efficiency of the eutectic heating machine is improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor packaging equipment, and in particular to a double-station eutectic heating machine and a eutectic method. Background Art

[0002] Eutectic heater is a device used in the microelectronic packaging process. It melts the solder by precisely controlling the temperature curve to bond the substrate to the chip. This equipment is very important in the COB and COC process.

[0003] At present, the existing eutectic heating machine mainly includes a first chip loading mechanism, a second chip loading mechanism, a substrate loading mechanism and a eutectic table. The substrate loading mechanism conveys the substrate to the eutectic table, the first chip loading mechanism conveys the first chip to the eutectic table, and the second chip loading mechanism conveys the second chip to the eutectic table. When the substrate, the first chip and the second chip are on the eutectic table, the eutectic table is heated, so that the substrate, the first chip and the second chip are heated and bonded to obtain a finished product.

[0004] Existing eutectic heating machines mostly adopt a single-station setting, that is, a single crystal table can only prepare one finished product at a time. This means that after the eutectic table completes the eutectic operation of a finished product, it is necessary to wait for the eutectic table to cool down and take out the finished product before processing the next finished product. This will cause unnecessary waste of time, and then reduce the production efficiency of the eutectic heating machine. Summary of the invention

[0005] The present application provides a double-station eutectic heating machine and a eutectic method, the purpose of which is to reduce unnecessary time waste in the finished product production process, thereby improving the production efficiency of the eutectic heating machine.

[0006] In the first aspect, the present application provides a dual-station eutectic heating machine that adopts the following technical solution: A double-station eutectic heating machine comprises a workbench; a eutectic table for heating and bonding a substrate, a first chip and a second chip, the eutectic table being arranged on the workbench, and a first station and a second station being arranged at intervals on the eutectic table; a first chip loading device for conveying a first chip toward the eutectic table, the first chip loading device being arranged on the workbench; a second chip loading device for conveying a second chip toward the eutectic table, the second chip loading device being arranged on the workbench; a substrate loading and unloading device for conveying a substrate toward the first station and the second station, and unloading finished products from the first station and the second station, the substrate loading and unloading device being arranged on the workbench.

[0007] By adopting the above technical scheme, through the cooperation of the eutectic table, the substrate loading and unloading device, the first chip loading device and the second chip loading device, the substrate, the first chip and the second chip can be transported in sequence on the eutectic table, which can realize the stacking of the substrate, the first chip and the second chip, and then through heating on the eutectic table, the substrate, the first chip and the second chip can be heated and bonded to obtain a finished product, and finally the finished product can be unloaded from the eutectic table through the substrate loading and unloading device, so that the eutectic heating machine can realize fully automatic production.

[0008] Since the eutectic table is provided with a first station and a second station, when the eutectic operation is performed at the first station, the second station can load the substrate, the first chip and the second chip, and when the eutectic operation is performed at the second station, the first station can load the substrate, the first chip and the second chip. By setting up the double stations, the continuity of the eutectic operation can be achieved, thereby improving the production efficiency.

[0009] Therefore, by setting up a double-station eutectic table, unnecessary time waste in the finished product production process can be reduced, thereby improving the production efficiency of the eutectic heating machine.

[0010] Optionally, the substrate loading and unloading device includes a material supply and receiving mechanism, which is used to provide substrates and store finished products, and the material supply and receiving mechanism is arranged on the workbench; the substrate loading and unloading device also includes a material picking robot and a robot driving mechanism, the material picking robot is used to suck substrates and finished products, the robot driving mechanism is arranged on the workbench, and the material picking robot is arranged on the robot driving mechanism, and the robot driving mechanism is used to drive the material picking robot to reciprocate between the eutectic table and the material supply and receiving mechanism and to reciprocate between the first workstation and the second workstation.

[0011] By adopting the above technical solution, the substrate loading and unloading device realizes substrate supply and finished product recovery through the supply and receiving mechanism, and the coordinated arrangement of the material picking robot and the robot driving mechanism can reciprocate between the supply and receiving mechanism and the eutectic table, which can realize the substrate transportation and finished product transportation between the supply and receiving mechanism and the eutectic table, thereby realizing the function of the substrate loading and unloading device.

[0012] Optionally, the material picking robot is provided with two suction nozzles, and both of the suction nozzles are used to pick up substrates or finished products; the robot driving mechanism includes two Z-axis driving components, and the Z-axis driving components are arranged in a one-to-one correspondence with the suction nozzles, the Z-axis driving components are arranged on the material picking robot, and the suction nozzles are arranged on the corresponding Z-axis driving components, and the Z-axis driving components are used to drive the suction nozzles to move in a vertical direction.

[0013] By adopting the above technical solution, since two suction nozzles are arranged on the material-retrieving robot, each suction nozzle can work independently under the drive of the corresponding Z-axis drive component, so each suction nozzle can independently pick up the substrate and the finished product. The setting of the two suction nozzles on the material-retrieving robot enables one suction nozzle to load the substrate and the other suction nozzle to unload the eutectic finished product, so the setting of the double suction nozzles on the material-retrieving robot can effectively increase the speed of unloading and loading the eutectic table. Furthermore, the coordinated setting of the double suction nozzles and the double workstations can effectively improve the continuity of the eutectic operation of the eutectic heating machine and improve the production efficiency of the eutectic heating machine.

[0014] Optionally, the material supply and receiving mechanism includes a frame, which is arranged on the workbench, and the frame is spaced apart from the eutectic table; the frame is provided with a loading station, a working station and an unloading station in sequence along its own length direction, and a substrate material bin and a finished product material bin for storing material trays are provided on the frame, and the substrate material bin and the finished product material bin are both provided on the frame, and the substrate material bin is located at the loading station, the material picking robot is located at the working station, and the finished product material bin is located at the unloading station; a conveying member for conveying the material tray is provided on the frame, and the conveying direction of the conveying member is provided along the length direction of the frame; a tray taking component for moving the material tray in the substrate material bin to the conveying member is provided on the substrate material bin; and a tray placing component for moving the material tray on the conveying member to the finished product bin is provided on the finished product bin.

[0015] By adopting the above technical solution, the material receiving mechanism can move the tray full of substrates from the loading station to the working station through the arrangement of the substrate bin, finished product bin and conveyor on the frame, and then the material taking robot can take the substrates in the tray, and can also convey the finished products of the eutectic table into the tray, and then after the tray is full of finished products, it can be conveyed to the unloading station, and then the tray full of finished products can be stored in the finished product bin. Such a structural arrangement can realize the loading of substrates and the unloading of finished products.

[0016] Optionally, a third workstation is further provided on the eutectic table, a vacuum adsorption hole is opened on the eutectic table, the vacuum adsorption hole is located at the third workstation, and a vacuum pump is provided on the eutectic table, and the vacuum pump is connected to the vacuum adsorption hole.

[0017] By adopting the above technical scheme, the third station is set up, and a vacuum adsorption hole and an exhaust piece are opened at the third station. With the cooperation of the vacuum adsorption hole and the exhaust piece, the first chip sent to the third station can be fixed by the vacuum adsorption hole, and then the second chip can be stacked on the first chip. At this time, the eutectic table is heated to achieve heating and bonding of the first chip and the second chip, which can realize the COC packaging process, and then the eutectic heating machine of the present application can realize two packaging processes, thereby broadening the scope of application of the eutectic heating machine of the present application.

[0018] Optionally, a eutectic visual element is disposed on the eutectic table, and the eutectic visual element is disposed on the upper side of the eutectic table in the vertical direction, and the eutectic visual element and the eutectic table are disposed opposite to each other in the vertical direction.

[0019] By adopting the above technical solution and setting the eutectic visual element, the eutectic condition of the finished product on the eutectic table can be monitored in real time.

[0020] Optionally, a compensation driving mechanism is further provided on the workbench, and the eutectic table is arranged on the compensation driving mechanism, and the compensation driving mechanism is used to drive the eutectic table to move on the workbench.

[0021] By adopting the above technical solution and the setting of the compensation driving mechanism, the first station can be adjusted to face the eutectic visual element, or the second station can be adjusted to face the eutectic visual element, so that when eutectic is performed at the corresponding first station or second station, the eutectic visual element can be aligned with the corresponding station.

[0022] In a second aspect, a eutectic method provided in the present application adopts the following technical solution: A eutectic method, utilizing the above-mentioned double-station eutectic heating machine for eutectic, comprises the following steps: S1, loading a tray full of substrates; S2, simultaneously conveying the substrate to a first station and a second station; S3, sequentially conveying a first chip and a second chip to the first station; S4, eutecticizing at the first station to obtain a finished product, and simultaneously conveying the first chip and the second chip to the second station in sequence; S5, eutecticizing at the second station to obtain a finished product, and simultaneously unloading the finished product and loading the substrate, the first chip and the second chip in sequence at the first station; S6, eutecticizing at the first station to obtain a finished product, and simultaneously unloading the finished product and loading the substrate, the first chip and the second chip in sequence at the second station; S7, repeating steps S5-S6 until the tray is full of finished products; S8, unloading the tray full of finished products.

[0023] By adopting the above technical solution, the method is set up with two workstations. When the first workstation is eutectic, the second workstation can load and preheat. When the second workstation is eutectic, the first workstation can load and preheat. Such a eutectic method can speed up the eutectic operation speed and improve the production efficiency of the eutectic heating machine.

[0024] Optionally, in step S5, the first station sequentially unloads finished products and loads substrates, first chips, and second chips, including the following steps: the material picking robot moves to the material tray, and a suction nozzle of the material picking robot sucks the substrate; the material picking robot moves to the upper side of the eutectic table, and a suction nozzle of the material picking robot sucks the finished product of the first station, and the other suction nozzle places the substrate at the first station; the material picking robot moves to the material tray, the material picking robot loads the finished product onto the material tray, and simultaneously conveys the first chip and the second chip sequentially to the first station.

[0025] By adopting the above technical solution, the method uses the setting of double suction nozzles, so that one suction nozzle can realize the suction of the finished product corresponding to the first station, and the other suction nozzle can realize the loading of the substrate on the first station. Similarly, one suction nozzle can realize the suction of the finished product corresponding to the second station, and the other suction nozzle can realize the loading of the substrate on the second station. This can speed up the loading and unloading speed, thereby increasing the eutectic operation speed and improving the production efficiency of the eutectic heating machine.

[0026] Optionally, a eutectic method, utilizing the above-mentioned dual-station eutectic heating machine for eutectic, includes the following steps: S1, loading an empty tray; S2, conveying a first chip and a second chip in sequence to a third station; S3, eutecticizing at the third station to obtain a finished product; S4, unloading the finished product from the third station, and unloading the finished product into the tray; S5, repeating steps S2-S4 until the tray is filled with finished products; S6, unloading the tray filled with finished products.

[0027] By adopting the above technical solution, the method can realize the loading of the first chip and the second chip, and then realize the heating bonding of the first chip and the second chip, which can meet the COC packaging process requirements.

[0028] In summary, the present application includes at least one of the following beneficial technical effects: 1. The present application can reduce unnecessary time waste in the finished product production process by setting up a double-station eutectic table, thereby improving the production efficiency of the eutectic heating machine.

[0029] 2. The present application can effectively increase the speed of loading and unloading materials on the eutectic table by setting up double suction nozzles on the material picking robot, and then the coordinated setting of the double suction nozzles and the double workstations can effectively improve the continuity of the eutectic operation of the eutectic heating machine and improve the production efficiency of the eutectic heating machine.

[0030] 3. The present application can realize the COC packaging process by setting up the third workstation, thereby enabling the eutectic heating machine of the present application to realize two packaging processes, thereby expanding the scope of application of the eutectic heating machine of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the overall structure of the eutectic heating machine of the present application.

[0032] Figure 2 It is a schematic diagram of the overall structure of the first chip loading device, the second chip loading device and the eutectic table of the present application.

[0033] Figure 3 It is a schematic diagram of the overall structure of the eutectic table of this application.

[0034] Figure 4 It is a schematic diagram of the cross-sectional structure of the eutectic table of the present application.

[0035] Figure 5 It is a schematic diagram of the overall structure of the substrate loading and unloading device of the present application.

[0036] Figure 6 It is a schematic diagram of the overall structure of the substrate loading and unloading device of the present application from another perspective.

[0037] Figure 7 It is a partial structural schematic diagram of the substrate loading and unloading device of the present application.

[0038] In the figure, 1, workbench; 2, eutectic table; 21, first station; 22, second station; 23, third station; 24, heating tank; 25, heating table; 251, heating rod; 252, heating cavity; 253, vacuum adsorption hole; 254, exhaust part; 255, auxiliary heating element; 2551, air supply part; 2552, heating tube; 256, wind knife; 2561, wind hole; 2562, auxiliary tube; 26, transparent plate; 261, first hole; 262, second hole; 263, third hole; 264, eutectic chamber; 27, air storage part; 271, air duct; 28, eutectic visual element; 29, compensation drive mechanism; 291, first drive member; 292, second drive member; 3, first chip loading device; 31, feeding mechanism; 32, material transfer Transport mechanism; 33, calibration mechanism; 34, loading and transfer mechanism; 4, second chip loading device; 5, substrate loading and unloading device; 51, material picking robot; 511, suction nozzle; 52, robot drive mechanism; 521, Y-axis drive member; 522, X-axis drive member; 523, Z-axis drive member; 53, material supply and receiving mechanism; 531, rack; 5311, loading station; 5312, working station; 5313, unloading station; 532, conveying member; 533, substrate silo; 534, finished product silo; 535, first locking assembly; 5351, limit member; 5352, limit plate; 5353, limit drive member; 536, second locking assembly; 537, tray picking assembly; 5371, lifting drive member; 5372, lifting platform; 538, tray placing assembly. DETAILED DESCRIPTION

[0039] The following is combined with Figure 1 -Attached Figure 7 , further details of this application are given.

[0040] Example 1: A double-station eutectic heating machine, referring to Figure 1 , including a workbench 1, a eutectic table 2, a first chip loading device 3, a second chip loading device 4 and a substrate loading and unloading device 5. The eutectic table 2, the first chip loading device 3, the second chip loading device 4 and the substrate loading and unloading device 5 are all arranged on the workbench 1, and the first chip loading device 3, the second chip loading device 4 and the substrate loading and unloading device 5 are arranged around the eutectic table 2.

[0041] The substrate is transported to the eutectic table 2 by the substrate loading and unloading device 5, the first chip loading device 3 transports the first chip to the eutectic table 2, and the first chip is superimposed on the substrate, and the second chip loading device 4 transports the second chip to the eutectic table 2, and the second chip is superimposed on the first chip. At this time, the eutectic table 2 is heated, and the substrate, the first chip and the second chip are heated and bonded to obtain a finished product. Then the finished product is unloaded by the substrate loading and unloading device 5 to realize the recycling of the finished product. With such a device, fully automatic production can be achieved.

[0042] Reference Figure 1 and Figure 2 In this embodiment, the first chip loading device 3 and the second chip loading device 4 have the same structure, and this embodiment is described by taking the first chip loading device 3 as an example.

[0043] Reference Figure 1 and Figure 2 The first chip loading device 3 includes a feeding mechanism 31, which is arranged on the workbench 1 and is spaced apart from the eutectic table 2. A material fetching and transporting mechanism 32, a calibration mechanism 33 and a material loading and transporting mechanism 34 are sequentially arranged on the side of the feeding mechanism 31 facing the eutectic table 2, and the material fetching and transporting mechanism 32, the calibration mechanism 33 and the material loading and transporting mechanism 34 are all located between the feeding mechanism 31 and the eutectic table 2.

[0044] The feeding mechanism 31 provides the corresponding first chip; the material fetching and transporting mechanism 32 reciprocates between the feeding mechanism 31 and the calibration mechanism 33, and the material fetching and transporting mechanism 32 transports the first chip provided by the feeding mechanism 31 to the calibration mechanism 33; the calibration mechanism 33 calibrates the angle and position of the first chip; the loading and transporting mechanism 34 reciprocates between the calibration mechanism 33 and the eutectic table 2, and the loading and transporting mechanism 34 obtains the first chip calibrated by the calibration mechanism 33, and transports the first chip to the eutectic table 2. Through such a structural setting of the first chip loading device 3, the first chip can be automatically fetched, calibrated and transported to the eutectic table 2, which can realize the fully automatic loading of the first chip.

[0045] Reference Figure 3 and Figure 4 A heating groove 24 is provided on the eutectic table 2, a heating table 25 is provided in the heating groove 24, the heating table 25 is connected to the bottom of the heating groove 24, a heating rod 251 is embedded in the eutectic table 2, one end of the heating rod 251 is provided in the heating table 25, and the other end extends to the outside of the eutectic table 2. The arrangement of the heating table 25 and the heating rod 251 can realize the heating function of the eutectic table 2.

[0046] Reference Figure 3 and Figure 4 A transparent plate 26 is provided on the eutectic stage 2, and the transparent plate 26 closes the heating groove 24. A first hole 261 and a second hole 262 are formed through the transparent plate 26, and the first hole 261 and the second hole 262 are arranged at intervals. The first hole 261 and the second hole 262 can both accommodate the substrate, the first chip and the second chip, so that the substrate can contact the heating stage 25, thereby ensuring the heating effect of the eutectic stage 2.

[0047] Reference Figure 3 and Figure 4 The eutectic table 2 is provided with a first station 21 and a second station 22, the first station 21 and the second station 22 are arranged at intervals, and the first hole 261 is located at the first station 21, and the second hole 262 is located at the second station 22. The first station 21 and the second station 22 on the eutectic table 2 can both perform heating bonding of the substrate, the first chip and the second chip, which enables the eutectic table 2 of the present application to work at both stations simultaneously.

[0048] Reference Figure 3 and Figure 4 , the transparent plate 26 is spaced apart from the heating stage 25, and a eutectic chamber 264 is formed between the transparent plate 26 and the heating stage 25. A gas storage member 27 is provided on one side of the eutectic stage 2, and a plurality of air ducts 271 are provided between the gas storage member 27 and the eutectic stage 2. One end of the air duct 271 is connected to the gas storage member 27, and the other end is connected to the eutectic stage 2, and the air duct 271 is connected to the eutectic chamber 264. This allows cold nitrogen to be injected into the eutectic chamber 264 to form a nitrogen atmosphere, thereby achieving a better tin melting effect during the eutectic process.

[0049] Reference Figure 3 and Figure 4 A wind knife 256 is also provided on one side of the eutectic table 2. A plurality of wind holes 2561 are provided on the side of the wind knife 256 facing the eutectic table 2. The plurality of wind holes 2561 are all provided toward the upper side of the transparent plate 26. An auxiliary pipe 2562 is provided between the wind knife 256 and the gas storage member 27. One end of the auxiliary pipe 2562 is connected to the gas storage member 27, and the other end is connected to the wind knife 256. The plurality of wind holes 2561 are all connected to the auxiliary pipe 2562. This allows cold nitrogen to be blown toward the transparent plate 26, thereby reducing the temperature difference between the inside and outside of the transparent plate 26 and reducing the possibility of fogging of the transparent plate 26.

[0050] Reference Figure 3 and Figure 4 The eutectic table 2 is also provided with a third station 23, and the first station 21, the second station 22 and the third station 23 are arranged in sequence. A third hole 263 is opened through the transparent plate 26, and the third hole 263 is located at the third station 23. The third hole 263 can accommodate the first chip and the second chip, so that the first chip can contact the heating table 25, and then the first chip can be bonded with the second chip, and the COC packaging process can be realized.

[0051] Reference Figure 3 and Figure 4 A heating cavity 252 is provided in the heating table 25, and one end of the heating rod 251 is inserted into the heating cavity 252. A vacuum adsorption hole 253 is provided on the heating table 25, and the vacuum adsorption hole 253 is connected to the heating cavity 252. A suction piece 254 is provided on one side of the eutectic table 2, and the suction piece 254 is connected to the heating table 25 through a pipeline, and the suction piece 254 is connected to the heating cavity 252 through a pipeline. The vacuum adsorption hole 253 is located at the third station 23, and the vacuum adsorption hole 253 is arranged opposite to the third hole 263.

[0052] When bonding the first chip to the second chip, the air in the heating cavity 252 is extracted by the vacuum element 254, so that negative pressure can be formed at the vacuum adsorption hole 253, thereby adsorbing the first chip to achieve fixation of the first chip.

[0053] Reference Figure 3 and Figure 4 An auxiliary heating element 255 is provided on one side of the eutectic table 2. The auxiliary heating element 255 includes a gas supply member 2551 and a heating tube 2552. A heating wire is provided on the inner wall of the heating tube 2552. One end of the heating tube 2552 is connected to the gas supply member 2551, and the other end is connected to the heating table 25. The heating tube 2552 is connected to the heating cavity 252. This enables the gas supply member 2551 to inject nitrogen into the heating tube 2552. The nitrogen is heated by the heating tube 2552 and then discharged into the heating cavity 252. The hot nitrogen can fill the gap in the heating cavity 252, thereby improving the uniformity of heating of the heating table 25.

[0054] Reference Figure 2 A eutectic visual element 28 is disposed on the upper side of the eutectic stage 2. The eutectic visual element 28 is disposed at intervals on the upper side of the eutectic stage 2 in the vertical direction, and the eutectic visual element 28 is directly facing the eutectic stage 2 in the vertical direction. The setting of the eutectic visual element 28 can monitor the corresponding finished product bonding effect in real time.

[0055] Reference Figure 2A compensation drive mechanism 29 is provided between the eutectic table 2 and the workbench 1. The compensation drive mechanism 29 includes a first drive member 291 and a second drive member 292. The first drive member 291 and the second drive member 292 are both linear modules driven by servo motors. The first drive member 291 is provided on the workbench 1, the second drive member 292 is provided on the first drive member 291, and the eutectic table 2 is provided on the second drive member 292. The driving directions of the first drive member 291 and the second drive member 292 are both provided in the horizontal direction, and the driving directions of the first drive member 291 and the second drive member 292 are provided perpendicularly to each other. By providing the compensation drive mechanism 29, the position of the eutectic table 2 can be adjusted, thereby ensuring that when the first station 21, the second station 22, or the third station 23 is operating, the eutectic visual element 28 can be aligned with the first station 21, the second station 22, or the third station 23 operating.

[0056] Reference Figure 1 and Figure 5 The substrate loading and unloading device 5 includes a material taking robot 51 and a robot driving mechanism 52. The robot driving mechanism 52 includes a Y-axis driving member 521. The Y-axis driving member 521 adopts a linear module driven by a servo motor. The driving direction of the Y-axis driving member 521 is set in the horizontal direction, and one end of the Y-axis driving member 521 in the length direction is set toward the eutectic table 2. The robot driving mechanism 52 also includes an X-axis driving member 522. The X-axis driving member 522 adopts a linear module driven by a servo motor. The driving direction of the X-axis driving member 522 is set in the horizontal direction, and the driving direction of the X-axis driving member 522 is set in the spacing direction between the first station 21 and the second station 22. The X-axis driving member 522 is set perpendicular to the driving direction of the Y-axis driving member 521. The X-axis driving member 522 is set on the Y-axis driving member 521, and the material taking robot 51 is set on the X-axis driving member 522. Driven by the Y-axis driving component 521, the material picking robot 51 moves closer to or away from the eutectic table 2; driven by the X-axis driving component 522, the material picking robot 51 can reciprocate between the first station 21, the second station 22 and the third station 23, so the cooperation between the Y-axis driving component 521 and the X-axis driving component 522 can realize the substrate loading and finished product unloading of the three stations.

[0057] Reference Figure 5, the material-retrieving robot 51 is provided with two suction nozzles 511, both of which are arranged in the vertical direction, and the two suction nozzles 511 are arranged at intervals in the horizontal direction, and the spacing direction of the two suction nozzles 511 is arranged along the driving direction of the X-axis driving member 522. The robot driving mechanism 52 also includes two Z-axis driving members 523, and the Z-axis driving member 523 adopts a linear module or a gear rack mechanism driven by a servo motor, and the driving direction of the Z-axis driving member 523 is arranged in the vertical direction. The Z-axis driving member 523 is arranged in a one-to-one correspondence with the suction nozzle 511, and the suction nozzle 511 is connected to the corresponding Z-axis driving member 523. This enables the two suction nozzles 511 on the material-retrieving robot 51 to both retrieve and unload the substrate and retrieve and unload the finished product, which can meet the requirements of the eutectic table 2 double-station simultaneous operation.

[0058] Reference Figure 5 and Figure 6 The substrate loading and unloading device 5 also includes a feeding and receiving mechanism 53, which includes a frame 531, which is connected to the workbench 1, and the length direction of the frame 531 is arranged in the horizontal direction, and the length direction of the frame 531 is arranged vertically along the driving direction of the X-axis driving member 522. The frame 531 is located at the lower side of the Y-axis driving member 521 in the vertical direction, and the frame 531 is spaced from the eutectic table 2 in its own width direction. This allows the material-retrieving robot 51 to reciprocate between the frame 531 and the eutectic table 2 under the drive of the Y-axis driving member 521.

[0059] Reference Figure 5 and Figure 6 The frame 531 is provided with a conveying member 532, which includes two linear modules driven by servo motors, the two linear modules are arranged parallel to each other, and the two linear modules are arranged at intervals along their own width direction, and the length direction of the two linear modules is arranged along the length direction of the frame 531. This makes the conveying direction of the conveying member 532 arranged along the length direction of the frame 531.

[0060] The frame 531 is sequentially provided with a loading station 5311, a working station 5312 and a unloading station 5313 along its length direction. This enables the conveying member 532 to convey the material tray from the loading station 5311 to the working station 5312 in sequence, and finally to the unloading station 5313.

[0061] Reference Figure 5 and Figure 6, a substrate silo 533 and a finished product silo 534 are provided on the frame 531, and a plurality of trays containing substrates are stacked in the substrate silo 533, and a plurality of silos containing finished products are stacked in the finished product silo 534. In this embodiment, the substrate silo 533 and the finished product silo 534 can stack five trays. The substrate silo 533 and the finished product silo 534 are both located on the upper side of the frame 531, and the substrate silo 533 is located at the loading station 5311, the finished product silo 534 is located at the unloading station 5313, and the material taking manipulator 51 is located at the working station 5312.

[0062] Reference Figure 5 and Figure 7 The substrate bin 533 is provided with a first locking assembly 535, which includes two limit members 5351, which are arranged on opposite sides of the substrate bin 533, and the limit members 5351 include a limit plate 5352 and a limit driving member 5353. The limit driving member 5353 adopts a cylinder, and the two limit driving members 5353 drive the two limit plates 5352 to move closer to each other. At this time, the two limit plates 5352 can clamp and fix the lowermost tray in the substrate bin 533, and then can fix the stacked trays. The finished product bin 534 is provided with a second locking assembly 536, and the first locking assembly 535 and the second locking assembly 536 have the same structure. The setting of the second locking assembly 536 can realize the fixation of several trays in the finished product bin 534.

[0063] Reference Figure 5 and Figure 6 A tray taking assembly 537 is provided at the lower side of the substrate bin 533. The tray taking assembly 537 includes a lifting drive 5371 and a lifting platform 5372. The lifting drive 5371 adopts a linear module driven by a servo motor. The driving direction of the lifting drive 5371 is set in the vertical direction. The lifting platform 5372 is connected to the output end of the lifting drive 5371. A tray placing assembly 538 is provided at the lower side of the finished product bin 534. The tray placing assembly 538 has the same structure as the tray taking assembly 537.

[0064] Reference Figure 5 Through the cooperation of the conveying member 532, the substrate bin 533, the finished product bin 534, the first locking assembly 535, the second locking assembly 536, the tray taking assembly 537 and the tray placing assembly 538, the substrate loading and the finished product unloading can be realized. The specific process is as follows: Reference Figure 5, Substrate loading: The tray assembly 537 rises to contact the tray in the substrate bin 533, the first locking assembly 535 unlocks the tray, and the tray assembly 537 descends to the height of a tray. At this time, the tray at the bottom of the substrate bin 533 is located on the tray assembly 537, the first locking assembly 535 re-locks the tray, and then the tray assembly 537 descends to the height of the conveyor 532, and the tray is placed on the conveyor 532. At this time, the tray is located at the loading station 5311, and then under the action of the conveyor 532, the tray will be transported to the working station 5312. The tray at the working station 5312 can transport the substrate in the tray to the eutectic table 2, and can also transport the finished product on the eutectic table 2 back to the tray under the cooperation of the Y-axis driving member 521, the Z-axis driving member 523, the material taking manipulator 51 and the conveyor 532. During this process, the cooperation between the conveying member 532 and the Y-axis driving member 521 enables the material picking robot 51 to cover the entire material tray, thereby being able to load all substrates in the material tray and also to load all finished products into the material tray.

[0065] Specifically: the tray assembly 537 is lifted from the space between the two linear modules of the conveying member 532 to realize the tray taking, and the tray will fall onto the two linear modules. At this time, the two linear modules work together to realize the tray conveying. In addition, the conveying member 532 also adopts a conveyor belt mechanism.

[0066] Reference Figure 5 , Finished product unloading: After the tray at the working station 5312 is filled with finished products, the conveyor 532 conveys the tray to the unloading station 5313. At this time, the tray placing assembly 538 descends to the conveyor 532, and the conveyor 532 conveys the tray to the tray placing assembly 538. The tray placing assembly 538 rises and makes the tray contact the lowest tray in the finished product bin 534. At this time, the second locking assembly 536 releases the lock on the tray, and the tray placing assembly 538 continues to rise to the height of a tray. At this time, the tray is conveyed into the finished product bin 534, and the second locking assembly 536 resumes the lock on the tray. This realizes the unloading of finished products.

[0067] The implementation principle of the embodiment of the present application is as follows: First, the design of the first station 21 and the second station 22 on the eutectic table 2 is that when the first station 21 performs eutectic operation, the second station 22 can load the substrate, the first chip and the second chip, and when the second station 22 performs eutectic operation, the first station 21 can load the substrate, the first chip and the second chip. Through the setting of the double station, the continuity of the eutectic operation can be achieved, thereby improving the production efficiency. In addition, when the first station 21 performs eutectic operation, the second station 22 can be preheated. Similarly, when the second station 22 performs eutectic operation, the first station 21 can be preheated, which can speed up the eutectic operation speed and improve the quality of the final product.

[0068] Secondly, the two suction nozzles 511 on the material-retrieving manipulator 51 are arranged so that one suction nozzle 511 can load the substrate and the other suction nozzle 511 can unload the eutectic product. The arrangement of the double suction nozzles 511 on the material-retrieving manipulator 51 and the arrangement of the double stations on the eutectic table 2 can effectively improve the continuity of the eutectic operation of the eutectic heating machine and improve the production efficiency of the eutectic heating machine.

[0069] In addition, the setting of the third station 23 on the eutectic table 2 can realize the heating and bonding of the first chip and the second chip to obtain a finished product, and the substrate loading and unloading device 5 is used to unload the finished product. At this time, the COC packaging process can be realized. This enables the eutectic heating machine of the present application to realize two different eutectic packaging processes, thereby expanding the scope of application of the eutectic heating machine of the present application.

[0070] This embodiment also discloses a eutectic method, comprising the following steps: S1. The tray in the substrate material bin 533 is transported from the loading station 5311 to the working station 5312 to load the tray. In the embodiment, the tray in the substrate material bin 533 is a tray full of substrates.

[0071] S2. Convey the substrate to the first station 21 and the second station 22 simultaneously.

[0072] Specifically, the two suction nozzles 511 of the material taking robot 51 both take the substrates from the material tray of the working station 5312, and under the drive of the robot driving mechanism 52, the two substrates are placed in the first station 21 and the second station 22 respectively.

[0073] S3, loading at the first workstation 21.

[0074] Specifically, the first chip is transported to the first station 21 of the eutectic stage 2 so that the first chip is stacked on the upper side of the substrate. Then the second chip is transported to the first station 21 of the eutectic stage 2 so that the second chip is stacked on the upper side of the first chip.

[0075] The first chip is loaded by the first chip loading device 3, and the second chip is loaded by the second chip loading device 4. Since the first chip loading device 3 and the second chip loading device 4 have the same structure, the loading steps of the first chip and the second chip are the same. This embodiment takes the specific loading steps of the first chip as an example for description. The specific loading steps of the first chip are as follows: The feeding mechanism 31 provides the first chip.

[0076] The material taking and transferring mechanism 32 absorbs the first chip provided by the material feeding mechanism 31 , and transfers the first chip to the calibration mechanism 33 .

[0077] The calibration mechanism 33 calibrates the position and angle of the first chip.

[0078] The loading and transporting mechanism 34 absorbs the first chip calibrated by the calibrating mechanism 33 , and transports the first chip to the first workstation 21 of the eutectic table 2 .

[0079] S4, the first station 21 eutectics, and the second station 22 loads materials at the same time.

[0080] Specifically, the first station 21 eutectic: the heating platform 25 is heated to the eutectic temperature, at which time the substrate, the first chip and the second chip located at the first station 21 are heated and bonded to obtain a finished product.

[0081] Specifically, the second station 22 is loaded: the first chip is conveyed to the second station 22 of the eutectic table 2, so that the first chip is stacked on the upper side of the substrate. Then the second chip is conveyed to the second station 22 of the eutectic table 2, and the second chip is stacked on the upper side of the first chip. The loading steps of the second station 22 are the same as the loading steps of the first station 21 in step S3.

[0082] S5, the second station 22 performs eutectic crystallization, and at the same time, the first station 21 sequentially performs finished product unloading and substrate, first chip and second chip loading.

[0083] Specifically, S51, eutectic crystallization at the second station 22: the substrate, the first chip and the second chip at the second station 22 are heated and bonded to obtain a finished product.

[0084] S52, the first workstation 21 sequentially unloads finished products and loads substrates, first chips and second chips, and step S51 is performed synchronously with step S52.

[0085] The specific steps of step S52 are as follows: The material picking robot 51 moves to the material tray of the working station 5312, and a suction nozzle 511 of the material picking robot 51 sucks the substrate.

[0086] The material taking robot 51 moves to the upper side of the eutectic table 2 , and one suction nozzle 511 of the material taking robot 51 sucks the finished product of the first station 21 , and the other suction nozzle 511 places the substrate in the first station 21 .

[0087] The material picking robot 51 moves to the material tray of the working station 5312, and the material picking robot 51 loads the finished product onto the material tray; and at the same time, the above step S3 is performed to sequentially convey the first chip and the second chip to the first station 21.

[0088] S6, the first station 21 performs eutectic crystallization, and at the same time the second station 22 performs unloading of finished products and loading of substrates, first chips and second chips in sequence.

[0089] Specifically, S61, the eutectic in the first station 21 is the same as step S4.

[0090] S62, the second station 22 sequentially unloads finished products and loads substrates, first chips and second chips, and steps S61 and S62 are performed simultaneously. The specific steps of step S62 are the same as those of step S52.

[0091] S7. Repeat the above steps S5-S6 until the finished products fill the tray of the working station 5312.

[0092] S8. When the tray is fully filled with finished products, the tray at the work station 5312 is transported to the unloading station 5313, and the tray is stored in the finished product bin 534 to realize tray unloading.

[0093] S9, repeat the above steps S1-S8 until the substrates in the substrate bin 533 are used up or the finished product bin 534 is full of trays.

[0094] The implementation principle of the embodiment of the present application is as follows: the method uses the coordination of the double stations and the double suction nozzles 511, so that when the first station 21 is performing eutecticization, the second station 22 can perform loading and preheating. When the second station 22 is performing eutecticization, the first station 21 can perform loading and preheating. Such a eutectic method can speed up the eutectic operation speed and improve the production efficiency of the eutectic heating machine.

[0095] Embodiment 2: A eutectic method comprising the following steps: S1, the material tray is in place, and the material tray in the substrate material bin 533 is transported from the loading station 5311 to the working station 5312. In this embodiment, the material tray in the substrate material bin 533 is an empty material tray.

[0096] S2 , conveying the first chip and the second chip in sequence to the third station 23 , and stacking the second chip on the upper side of the first chip.

[0097] S3, the third station 23 eutectic, to obtain the finished product.

[0098] Specifically, the heating stage 25 is heated to the eutectic temperature, and at this time, the first chip and the second chip located at the first station 21 are heated and bonded to obtain a finished product.

[0099] S4, unloading the finished product from the third station 23, and unloading the finished product into the material tray.

[0100] Specifically, the following steps are included: The material taking robot 51 moves to the third station 23 and takes the finished product.

[0101] The material taking robot 51 moves to the working station, and the material taking robot 51 loads the finished product into the material tray located at the working station.

[0102] S5. Repeat the above steps S2-S4 until the finished products fill the tray of the working station.

[0103] S6. When the tray is filled with finished products, the tray at the working station 5312 is transported to the unloading station 5313, and the tray is stored in the finished product bin 534.

[0104] S7, repeat the above steps S1-S6 until the substrates in the substrate bin 533 are used up or the finished product bin 534 is full of trays.

[0105] The implementation principle of the embodiment of the present application is: the method can bond the first chip and the second chip, which can realize the COC packaging process. Therefore, the eutectic heating machine of the present application can realize two packaging processes, which can improve the practical scope of the eutectic heating machine of the present application.

[0106] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A double-station eutectic heating machine, characterized in that: include: Workbench (1); A eutectic table (2) for heating and bonding the substrate, the first chip and the second chip, the eutectic table (2) being arranged on the workbench (1), and having a first workstation (21) and a second workstation (22) arranged at intervals on the eutectic table (2); A first chip loading device (3) for conveying a first chip toward the eutectic table (2), the first chip loading device (3) being arranged on the workbench (1); A second chip loading device (4) is used to transport a second chip toward the eutectic table (2), the second chip loading device (4) being arranged on the workbench (1); A substrate loading and unloading device (5) is used to transport substrates toward the first workstation (21) and the second workstation (22), and to unload finished products from the first workstation (21) and the second workstation (22); the substrate loading and unloading device (5) is arranged on the workbench (1).

2. A double-station eutectic heating machine according to claim 1, characterized in that: The substrate loading and unloading device (5) comprises a material supply and receiving mechanism (53), the material supply and receiving mechanism (53) is used to provide substrates and store finished products, and the material supply and receiving mechanism (53) is arranged on the workbench (1); The substrate loading and unloading device (5) further comprises a material picking robot (51) and a robot driving mechanism (52), wherein the material picking robot (51) is used to pick up substrates and finished products, the robot driving mechanism (52) is arranged on the workbench (1), and the material picking robot (51) is arranged on the robot driving mechanism (52), and the robot driving mechanism (52) is used to drive the material picking robot (51) to reciprocate between the eutectic table (2) and the material supply and receiving mechanism (53), and to reciprocate between the first station (21) and the second station (22).

3. A double-station eutectic heating machine according to claim 2, characterized in that: The material taking robot (51) is provided with two suction nozzles (511), and the two suction nozzles (511) are used to suck the substrate or the finished product; The robot drive mechanism (52) includes two Z-axis drive components (523), and the Z-axis drive components (523) are arranged in a one-to-one correspondence with the suction nozzles (511). The Z-axis drive components (523) are arranged on the material picking robot (51), and the suction nozzles (511) are arranged on the corresponding Z-axis drive components (523), and the Z-axis drive components (523) are used to drive the suction nozzles (511) to move in a vertical direction.

4. A double-station eutectic heating machine according to claim 2, characterized in that: The material supply and receiving mechanism (53) comprises a frame (531), wherein the frame (531) is arranged on the workbench (1), and the frame (531) and the eutectic table (2) are arranged at a distance; The frame (531) is provided with a loading station (5311), a working station (5312) and a unloading station (5313) in sequence along its length direction; a substrate material bin (533) and a finished product material bin (534) for storing material trays are provided on the frame (531); the substrate material bin (533) and the finished product material bin (534) are both provided on the frame (531); the substrate material bin (533) is located at the loading station (5311); the material taking robot (51) is located at the working station (5312); and the finished product material bin (534) is located at the unloading station (5313); The frame (531) is provided with a conveying member (532) for conveying the material tray, and the conveying direction of the conveying member (532) is arranged along the length direction of the frame (531); The substrate material bin (533) is provided with a tray removal assembly (537) for moving a material tray in the substrate material bin (533) to the conveying member (532); The finished product bin (534) is provided with a tray placement assembly (538) for moving a tray on the conveying member (532) into the finished product bin (534).

5. The double-station eutectic heating machine according to claim 1, characterized in that: The eutectic table (2) is also provided with a third workstation (23), the eutectic table (2) is provided with a vacuum adsorption hole (253), the vacuum adsorption hole (253) is located at the third workstation (23), and the eutectic table (2) is provided with a vacuum pump (254), the vacuum pump (254) is connected to the vacuum adsorption hole (253).

6. A double-station eutectic heating machine according to claim 1, characterized in that: A eutectic visual element (28) is arranged on the eutectic table (2), the eutectic visual element (28) is arranged on the upper side of the eutectic table (2) in the vertical direction, and the eutectic visual element (28) and the eutectic table (2) are arranged opposite to each other in the vertical direction.

7. A double-station eutectic heating machine according to claim 6, characterized in that: The workbench (1) is also provided with a compensation drive mechanism (29), the eutectic table (2) is arranged on the compensation drive mechanism (29), and the compensation drive mechanism (29) is used to drive the eutectic table (2) to move on the workbench (1).

8. A eutectic method, using a double-station eutectic heating machine as described in any one of claims 1 to 7 to perform eutectic, characterized in that: The following steps are involved: S1, loading the tray filled with substrates; S2, transporting the substrate toward the first station (21) and the second station (22) simultaneously; S3, conveying the first chip and the second chip in sequence toward the first workstation (21); S4, eutecticizing at the first station (21) to obtain a finished product, while sequentially conveying the first chip and the second chip to the second station (22); S5, the second station (22) performs eutectic crystallization to obtain a finished product, while the first station (21) sequentially performs unloading of the finished product and loading of the substrate, the first chip, and the second chip; S6, the first station (21) performs eutectic crystallization to obtain a finished product, while the second station (22) sequentially performs unloading of the finished product and loading of the substrate, the first chip, and the second chip; S7, repeat steps S5-S6 until the finished product fills the tray; S8. Unload the tray filled with finished products.

9. A eutectic method according to claim 8, characterized in that: In step S5, the first station (21) sequentially performs unloading of finished products and loading of substrates, first chips and second chips, including the following steps: The material taking robot (51) moves onto the material tray, and a suction nozzle (511) of the material taking robot (51) sucks the substrate; The material taking robot (51) moves to the upper side of the eutectic table (2), and one suction nozzle (511) of the material taking robot (51) sucks the finished product of the first workstation (21), and the other suction nozzle (511) places the substrate on the first workstation (21); The material picking robot (51) moves onto the material tray, loads the finished product onto the material tray, and simultaneously sequentially transports the first chip and the second chip toward the first workstation (21).

10. A eutectic method, using a double-station eutectic heating machine as described in any one of claims 1 to 7 to perform eutectic, characterized in that: The following steps are involved: S1, empty tray loading; S2, conveying the first chip and the second chip in sequence toward the third workstation (23); S3, the third station (23) eutectic to obtain a finished product; S4, unloading the finished product from the third station (23) and unloading the finished product into the material tray; S5, repeat steps S2-S4 until the finished product fills the tray; S6. Unload the tray filled with finished products.

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