Bonding device visual system, method for determining pose of part to be bonded and storage medium

Abstract

The invention provides a visual system of a bonding device, a method for determining the pose of a part to be bonded and a computer readable storage medium. The visual system of the bonding device comprises a plurality of imaging modules and a view field adjusting mechanism. And the plurality of imaging modules are used for collecting images of a plurality of marks on a to-be-bonded piece so as to represent the position and / or posture of the to-be-bonded piece. And the field-of-view adjusting mechanism is used for rotating at least one imaging module and adjusting the field-of-view position of the imaging module so as to cover the plurality of marks on the to-be-bonded piece. According to the invention, the visual field positions of the plurality of imaging modules can be rotated and adjusted, so that images of a plurality of marks on to-be-bonded pieces with various sizes can be acquired, and the bonding efficiency of a wafer bonding process can be improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device processing, and in particular to a visual system of a bonding device, a method for determining the position and posture of a part to be bonded, and a computer-readable storage medium. Background Art

[0002] In the manufacturing process of bonding chips to wafers, the bonded chips often have multiple sizes. However, in traditional high-precision vision systems, the field of view of its imaging module is generally only a few millimeters. When the size of the chips to be collected varies by tens of millimeters, traditional vision systems cannot fully cover all chip sizes, which affects the collection of the position and / or posture of the chip, thereby affecting the bonding efficiency of the wafer and chip.

[0003] In order to overcome the above-mentioned defects of the prior art, there is an urgent need in the art for an improved vision system of a bonding device for collecting images of multiple marks on parts to be bonded of various sizes, so as to improve the bonding efficiency of the wafer bonding process. Summary of the invention

[0004] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a visual system for a bonding device, a method for determining the posture of a part to be bonded, and a computer-readable storage medium, which can be used to collect images of multiple marks on parts to be bonded of various sizes by rotating and adjusting the field of view positions of multiple imaging modules, so as to improve the bonding efficiency of the wafer bonding process.

[0006] Specifically, the visual system of the bonding device provided according to the first aspect of the present invention comprises a plurality of imaging modules and a field of view adjustment mechanism. The plurality of imaging modules are used to capture images of a plurality of marks on the part to be bonded to characterize the position and / or posture of the part to be bonded. The field of view adjustment mechanism is used to rotate at least one of the imaging modules to adjust its field of view position to cover the plurality of marks on the part to be bonded.

[0007] Furthermore, in some embodiments of the present invention, the visual system also includes a controller, which is configured to: obtain spacing information between the multiple marks to determine whether the field of view of one of the imaging modules can cover the multiple marks at the same time; in response to the determination result that the field of view of one of the imaging modules can cover the multiple marks at the same time, rotate one of the imaging modules via the field of view adjustment mechanism to capture images of the multiple marks to characterize the position and / or posture of the part to be bonded; and in response to the determination result that the field of view of one of the imaging modules cannot cover the multiple marks at the same time, rotate multiple imaging modules via the field of view adjustment mechanism to capture images of the multiple marks in cooperation with each other to characterize the position and / or posture of the part to be bonded.

[0008] Furthermore, in some embodiments of the present invention, the step of rotating one of the imaging modules via the field of view adjustment mechanism to capture images of the multiple markers includes: obtaining coarse position information of the multiple markers and the first posture information of the first imaging module to determine a first rotation angle and a first rotation path range of the first imaging module; obtaining the current second posture information of the second imaging module, and combining it with the first rotation path range to determine whether the second imaging module affects the rotation of the first imaging module; and in response to the judgment result that the second imaging module affects the rotation of the first imaging module, determining the second rotation angle of the second imaging module according to the second posture information and the first rotation path range, and rotating the second imaging module via the field of view adjustment mechanism to avoid affecting the rotation of the first imaging module.

[0009] Furthermore, in some embodiments of the present invention, the step of rotating one of the imaging modules via the field of view adjustment mechanism to capture images of the multiple markers also includes: in response to a judgment result that the second imaging module does not affect the rotation of the first imaging module, rotating the first imaging module according to the first rotation angle via the field of view adjustment mechanism to capture images of the multiple markers.

[0010] Furthermore, in some embodiments of the present invention, the controller is also configured to: determine the fine position information of the multiple marks based on the positions of the multiple marks in the image and the first rotation angle of the first imaging module; and determine the position and / or posture of the part to be bonded based on the fine position information of the multiple marks.

[0011] Further, in some embodiments of the present invention, the part to be bonded is a chip, and two marks are provided at two characteristic positions of its edge. The visual system includes two imaging modules. The step of rotating the plurality of imaging modules via the field of view adjustment mechanism to cooperatively capture images of the plurality of marks includes: respectively acquiring the coarse position information of each mark and the posture information of each imaging module; determining the first rotation angle of the first imaging module according to the first coarse position information of the first mark and the first posture information of the first imaging module, and rotating the first imaging module via the field of view adjustment mechanism to capture the first image of the first mark; and determining the second rotation angle of the second imaging module according to the second coarse position information of the second mark and the second posture information of the second imaging module, and rotating the second imaging module via the field of view adjustment mechanism to capture the second image of the second mark.

[0012] Furthermore, in some embodiments of the present invention, the controller is also configured to: determine first fine position information of the first mark based on a first position of the first mark in the first image and a first rotation angle of the first imaging module; determine second fine position information of the second mark based on a second position of the second mark in the second image and a second rotation angle of the second imaging module; and determine the position and / or posture of the part to be bonded based on the first fine position information and the second fine position information.

[0013] Furthermore, in some embodiments of the present invention, the field of view adjustment mechanism includes a driving module, a transmission module, a limiting module and a stopping module. The driving module is used to provide a rotational driving force. The transmission module is used to transmit the rotational driving force to the corresponding imaging module to make it perform a rotational motion. The limiting module is used to limit the rotation range of the imaging module to avoid it colliding with other components. The stopping module is used to lock the rotating shaft of the imaging module after the imaging module rotates to a target angle.

[0014] Furthermore, in some embodiments of the present invention, the imaging module includes a prism, a tube lens, and a camera. The prism is located at one end of the imaging module close to the part to be bonded, and is used to rotate the field of view of the imaging module. The tube lens is located between the prism and the camera, and is used to project the image of the part to be bonded onto the imaging surface of the camera. The camera is located at one end of the imaging module away from the part to be bonded, and is used to collect images of the multiple marks on the part to be bonded via the tube lens and the prism.

[0015] Furthermore, in some embodiments of the present invention, the part to be bonded is a chip, and the length of its long side ranges from 0.1 mm to 50 mm. The field of view of the imaging module is circular, and its diameter is between 1 and 10 mm. Alternatively, the field of view of the imaging module is rectangular, and its long side length is between 1 and 10 mm.

[0016] In addition, the above-mentioned method for determining the position and posture of the part to be bonded provided in accordance with the second aspect of the present invention includes the following steps: obtaining the spacing information between multiple marks on the part to be bonded to determine whether the field of view of an imaging module of the visual system provided in the first aspect of the present invention can cover the multiple marks at the same time; in response to the judgment result that the field of view of one imaging module can cover the multiple marks at the same time, rotating one imaging module via a field of view adjustment mechanism to capture images of the multiple marks to characterize the position and / or posture of the part to be bonded; and in response to the judgment result that the field of view of one imaging module cannot cover the multiple marks at the same time, rotating multiple imaging modules via the field of view adjustment mechanism to capture images of the multiple marks in cooperation with each other to characterize the position and / or posture of the part to be bonded.

[0017] In addition, the computer-readable storage medium provided in the third aspect of the present invention stores computer instructions, which, when executed by a processor, implement the method for determining the position and posture of the component to be bonded provided in the second aspect of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0019] Figure 1 A schematic structural diagram of a visual system of a bonding device provided according to some embodiments of the present invention is shown.

[0020] Figure 2 A schematic structural diagram of a visual system of a bonding device provided according to some embodiments of the present invention is shown.

[0021] Figure 3 A schematic flow chart of a method for determining the posture of a part to be bonded provided according to some embodiments of the present invention is shown.

[0022] Figure 4 A schematic diagram showing the field of view of an imaging module and the positions of components to be bonded according to some embodiments of the present invention is shown.

[0023] Figure 5A schematic diagram showing the field of view of an imaging module and the positions of components to be bonded according to some embodiments of the present invention is shown.

[0024] Figure 6 A schematic diagram showing the field of view of an imaging module and the positions of components to be bonded according to some embodiments of the present invention is shown. DETAILED DESCRIPTION

[0025] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0028] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0029] As mentioned above, in traditional high-precision vision systems, the field of view of the imaging module is generally only a few millimeters. When the size of the chip to be collected varies by tens of millimeters, the traditional vision system cannot fully cover all chip sizes, which affects the collection of the chip position and / or posture, thereby affecting the bonding efficiency of the wafer and chip.

[0030] In order to overcome the above-mentioned defects of the prior art, the present invention provides a visual system for a bonding device, a method for determining the posture of a part to be bonded, and a computer-readable storage medium, which can be used to collect images of multiple marks on parts to be bonded of various sizes by rotating and adjusting the field of view positions of multiple imaging modules, so as to improve the bonding efficiency of the wafer bonding process.

[0031] Please refer to Figure 1 and Figure 2 . Figure 1 A schematic structural diagram of a visual system of a bonding device provided according to some embodiments of the present invention is shown. Figure 2 A schematic structural diagram of a visual system of a bonding device provided according to some embodiments of the present invention is shown.

[0032] exist Figure 1 In the illustrated embodiment, the visual system of the bonding device provided by the first aspect of the present invention includes a plurality of imaging modules and a field of view adjustment mechanism. Here, the plurality of imaging modules are used to capture images of a plurality of marks on the part to be bonded to characterize the position (x, y) of the part to be bonded in the world coordinate system and / or the rotation angle θ relative to a preset direction in the horizontal plane. The field of view adjustment mechanism is used to rotate at least one imaging module and adjust its field of view position to cover the plurality of marks on the part to be bonded.

[0033] In addition, Figure 1 In the illustrated embodiment, the field of view adjustment mechanism includes a driving module 11, a transmission module 12, a limiting module 13 and a stopping module 14. Here, the driving module 11 is used to provide a rotational driving force. The transmission module 12 is used to transmit the rotational driving force to the corresponding imaging module to make it perform a rotational motion. The limiting module 13 is used to limit the rotation range of the imaging module to prevent it from colliding with other components. The stopping module 14 is used to lock the rotating shaft of the imaging module after the imaging module rotates to the target angle to prevent the jitter from introducing additional errors.

[0034] Further, in Figure 1 In the embodiment shown, the above-mentioned limit module 13 can limit the rotation range of the imaging module through a photoelectric signal. Figure 2 In the illustrated embodiment, the limiting module 13 can limit the rotation range of the imaging module through a mechanical structure.

[0035] In addition, Figure 1 In the illustrated embodiment, the imaging module includes a prism 21, a tube lens 22 and a camera 23. Here, the prism 21 is located at one end of the imaging module close to the part to be bonded, and is used to rotate the field of view of the imaging module. Specifically, the prism 21 can change the optical path inside the imaging module so that the field of view of the imaging module rotates synchronously around the rotation center during the rotation of the imaging module around the rotation center. The tube lens 22 is located between the prism 21 and the camera 23, and is used to project the image of the part to be bonded onto the imaging surface of the camera. The camera 23 is located at one end of the imaging module away from the part to be bonded, and is used to collect images of multiple marks on the part to be bonded via the tube lens 22 and the prism 21.

[0036] Further, in some embodiments, the above-mentioned part to be bonded is a chip, and the length of its long side ranges from 0.1 mm to 50 mm. The field of view of the above-mentioned imaging module is circular, and its diameter is between 1 and 10 mm. Alternatively, in some embodiments, the field of view of the above-mentioned imaging module is rectangular, and its long side length is between 1 and 10 mm.

[0037] In some non-limiting embodiments, the visual system of the bonding device provided in the first aspect of the present invention includes a memory and a controller. Here, the memory includes but is not limited to the computer-readable storage medium provided in the third aspect, on which computer instructions are stored. The controller is connected to the memory and is configured to execute the computer instructions stored in the memory to implement the method for determining the posture of the bonded parts provided in the first aspect of the present invention.

[0038] The working principle of the visual system of the above-mentioned bonding device will be described below in conjunction with some embodiments of the method for determining the position and posture of the parts to be bonded. Those skilled in the art will understand that these embodiments of the method for determining the position and posture of the parts to be bonded are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than limiting all functions or all working modes of the visual system of the bonding device. Similarly, the visual system of the bonding device is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the execution subject and execution order of each step in these methods for determining the position and posture of the parts to be bonded.

[0039] Please refer to the reference for details Figure 3 to Figure 6 . Figure 3 A schematic flow chart of a method for determining the posture of a part to be bonded provided according to some embodiments of the present invention is shown. Figure 4 A schematic diagram showing the field of view of an imaging module and the positions of components to be bonded according to some embodiments of the present invention is shown. Figure 5 A schematic diagram showing the field of view of an imaging module and the positions of components to be bonded according to some embodiments of the present invention is shown. Figure 6A schematic diagram showing the field of view of an imaging module and the positions of components to be bonded according to some embodiments of the present invention is shown.

[0040] like Figure 3 As shown, the controller may first obtain the spacing information between multiple marks on the component to be bonded to determine whether the field of view of an imaging module of the above-mentioned visual system provided in the first aspect of the present invention can cover multiple marks at the same time.

[0041] Afterwards, if Figure 4 As shown, in response to the judgment result that the field of view of an imaging module can cover multiple marks simultaneously, the controller can rotate an imaging module via the field of view adjustment mechanism to capture images of multiple marks to characterize the position and / or posture of the part to be bonded 30.

[0042] In this way, the visual system of the above-mentioned bonding device provided in the first aspect of the present invention can collect the position and / or posture of the smaller-sized parts to be bonded by using only the field of view of one imaging module, so as to overcome the problem that the blind area of ​​the field of view of multiple imaging modules cannot cover the small chip mark, and reduce the secondary calculation requirements and errors of coordinate system conversion, thereby improving the alignment efficiency and accuracy of the parts to be bonded.

[0043] Alternatively, in response to the judgment that the field of view of an imaging module cannot cover multiple marks at the same time, the controller can rotate multiple imaging modules via the field of view adjustment mechanism to cooperate with each other to capture images of multiple marks to characterize the position and / or posture of the part 30 to be bonded.

[0044] Specifically, the controller may first obtain coarse position information of multiple markers in the world coordinate system (eg, approximate positions with millimeter-level accuracy) and the first position information of the first imaging module to determine the first rotation angle and the first rotation path range of the first imaging module.

[0045] Afterwards, the controller may obtain the current second position information of the second imaging module, and combine it with the first rotation path range to determine whether the second imaging module affects the rotation of the first imaging module.

[0046] Thereafter, in response to the judgment result that the second imaging module affects the rotation of the first imaging module, the controller can determine the second rotation angle of the second imaging module according to the second posture information and the first rotation path range, and rotate the second imaging module via the field of view adjustment mechanism to avoid affecting the rotation of the first imaging module.

[0047] Alternatively, in some other embodiments, in response to the judgment result that the second imaging module does not affect the rotation of the first imaging module, the controller rotates the first imaging module according to the first rotation angle via the field of view adjustment mechanism to collect images of multiple marks. In this way, the controller can directly control the second imaging module to return to a preset position that does not affect the rotation of the first imaging module without performing calculations and judgments.

[0048] In addition, in some preferred embodiments, the controller can also determine the fine position information of the multiple markers according to the positions of the multiple markers in the image in the image coordinate system and the first rotation angle of the first imaging module, and determine the position and / or posture of the to-be-bonded part according to the fine position information of the multiple markers in the world coordinate system. Here, the accuracy of the fine position information is determined by the positioning accuracy level of the imaging module, which is less than 0.01 mm.

[0049] exist Figure 5 and Figure 6 In the embodiment shown, the above-mentioned part to be bonded 30 is a chip, and two marks are provided at two characteristic positions of its edge. The above-mentioned visual system includes two imaging modules. Here, in the process of rotating multiple imaging modules via the field of view adjustment mechanism to cooperate with each other to collect images of multiple marks, the controller can respectively obtain the rough position information of each mark (for example: the approximate position with millimeter-level accuracy), and the posture information of each imaging module.

[0050] Afterwards, the controller may determine a first rotation angle of the first imaging module according to the first coarse position information of the first marker and the first posture information of the first imaging module, and rotate the first imaging module via the field of view adjustment mechanism to capture a first image of the first marker.

[0051] Thereafter, the controller may determine a second rotation angle of the second imaging module according to the second rough position information of the second marker and the second posture information of the second imaging module, and rotate the second imaging module via the field of view adjustment mechanism to capture a second image of the second marker.

[0052] In addition, in some preferred embodiments, the controller may also determine the first fine position information of the first mark in the world coordinate system according to the first position of the first mark in the first image in the image coordinate system and the first rotation angle of the first imaging module. Afterwards, the controller may determine the second fine position information of the second mark in the world coordinate system according to the second position of the second mark in the second image in the image coordinate system and the second rotation angle of the second imaging module. Afterwards, the controller may determine the position and / or posture of the part to be bonded according to the first fine position information and the second fine position information.

[0053] In this way, the visual system of the above-mentioned bonding device provided in the first aspect of the present invention can collect the position and / or posture of larger-sized parts to be bonded by utilizing the field of view of multiple imaging modules, so as to reduce the demand of large chips for the field of view size of a single imaging module, thereby reducing the cost of aligning large chips.

[0054] In summary, the visual system of the above-mentioned bonding device, the method for determining the position and posture of the parts to be bonded, and the computer-readable storage medium provided by the present invention can all be used to collect images of multiple marks on parts to be bonded of various sizes by rotating the field of view positions of multiple imaging modules, so as to improve the bonding efficiency of the wafer bonding process.

[0055] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0056] Those skilled in the art will appreciate that information, signals, and data may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips cited throughout the above description may be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, optical fields or optical particles, or any combination thereof.

[0057] Although the controller described in the above embodiments can be implemented by a combination of software and hardware. However, it is understood that the controller can also be implemented in software and hardware. For hardware implementation, the controller can be implemented in one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, other electronic devices for performing the above functions, or a selection combination of the above devices. For software implementation, the controller can be implemented by independent software modules such as procedures and functions running on a general-purpose chip, each of which performs one or more functions and operations described herein.

[0058] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0059] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0060] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A visual system for a bonding device, characterized in that: include: A plurality of imaging modules, used for collecting images of a plurality of marks on the parts to be bonded, so as to characterize the position and / or posture of the parts to be bonded; as well as The field of view adjustment mechanism is used to rotate at least one of the imaging modules to adjust the field of view position thereof so as to cover the multiple marks on the component to be bonded.

2. The visual system according to claim 1, wherein: The visual system also includes a controller configured to: Acquiring spacing information between the multiple marks to determine whether the field of view of one of the imaging modules can cover the multiple marks simultaneously; In response to a judgment result that the field of view of one of the imaging modules can simultaneously cover the multiple marks, rotating one of the imaging modules via the field of view adjustment mechanism to capture images of the multiple marks to characterize the position and / or posture of the to-be-bonded component; as well as In response to the judgment result that the field of view of one imaging module cannot cover the multiple marks at the same time, the multiple imaging modules are rotated via the field of view adjustment mechanism to cooperate with each other to capture images of the multiple marks to characterize the position and / or posture of the parts to be bonded.

3. The visual system according to claim 2, characterized in that The step of rotating one of the imaging modules via the field of view adjustment mechanism to collect images of the plurality of markers comprises: Acquire the coarse position information of the multiple markers and the first pose information of the first imaging module to determine a first rotation angle and a first rotation path range of the first imaging module; Acquire current second position information of the second imaging module, and combine it with the first rotation path range to determine whether the second imaging module affects the rotation of the first imaging module; and In response to the judgment result that the second imaging module affects the rotation of the first imaging module, the second rotation angle of the second imaging module is determined according to the second posture information and the first rotation path range, and the second imaging module is rotated via the field of view adjustment mechanism to avoid affecting the rotation of the first imaging module.

4. The visual system according to claim 3, wherein: The step of rotating one of the imaging modules via the field of view adjustment mechanism to collect images of the plurality of markers further comprises: In response to a determination that the second imaging module does not affect the rotation of the first imaging module, the first imaging module is rotated according to the first rotation angle via the field of view adjustment mechanism to capture images of the plurality of markers.

5. The visual system according to claim 4, characterized in that The controller is also configured to: Determining detailed position information of the multiple markers according to the positions of the multiple markers in the image and a first rotation angle of the first imaging module; as well as The position and / or posture of the to-be-bonded parts are determined according to the detailed position information of the multiple marks.

6. The visual system according to claim 2, wherein: The part to be bonded is a chip, and two marks are provided at two characteristic positions on its edge. The visual system includes two imaging modules. The step of rotating the plurality of imaging modules via the field of view adjustment mechanism to cooperatively collect images of the plurality of marks includes: Respectively obtaining the rough position information of each of the markers and the position and posture information of each of the imaging modules; Determining a first rotation angle of the first imaging module according to first rough position information of the first marker and first position information of the first imaging module, and rotating the first imaging module via the field of view adjustment mechanism to capture a first image of the first marker; and According to the second rough position information of the second mark and the second posture information of the second imaging module, the second rotation angle of the second imaging module is determined, and the second imaging module is rotated via the field of view adjustment mechanism to capture the second image of the second mark.

7. The visual system according to claim 6, characterized in that The controller is also configured to: Determining first detailed position information of the first mark according to a first position of the first mark in the first image and a first rotation angle of the first imaging module; Determining second detailed position information of the second mark according to a second position of the second mark in the second image and a second rotation angle of the second imaging module; as well as The position and / or posture of the part to be bonded is determined according to the first fine position information and the second fine position information.

8. The visual system according to claim 1, wherein: The field of view adjustment mechanism comprises: A driving module, used for providing a rotational driving force; A transmission module, used for transmitting the rotational driving force to the corresponding imaging module to make it perform rotational motion; a limiting module, used for limiting the rotation range of the imaging module to prevent it from colliding with other components; and The stopping module is used to lock the rotating shaft of the imaging module after the imaging module rotates to a target angle.

9. The visual system according to claim 1, wherein: The imaging module comprises: A prism, located at one end of the imaging module close to the part to be bonded, and used to rotate the field of view of the imaging module; a cylindrical lens, located between the prism and the camera, for projecting an image of the workpiece to be bonded onto an imaging surface of the camera; and The camera is located at one end of the imaging module away from the workpiece to be bonded, and is used to collect images of the multiple marks on the workpiece to be bonded via the tube lens and the prism.

10. The visual system according to claim 1, wherein: The part to be bonded is a chip, the length of its long side ranges from 0.1 mm to 50 mm, wherein: The field of view of the imaging module is circular, with a diameter between 1 and 10 mm, or The field of view of the imaging module is rectangular, and the length of the long side thereof is between 1 and 10 mm.

11. A method for determining the position and posture of a part to be bonded, characterized in that: The following steps are involved: Acquiring spacing information between a plurality of marks on the to-be-bonded component to determine whether the field of view of an imaging module of the visual system according to claim 1 can simultaneously cover the plurality of marks; In response to a judgment result that the field of view of one of the imaging modules can simultaneously cover the multiple marks, rotating one of the imaging modules via a field of view adjustment mechanism to capture images of the multiple marks to characterize the position and / or posture of the to-be-bonded component; as well as In response to the judgment result that the field of view of one imaging module cannot cover the multiple marks at the same time, the multiple imaging modules are rotated via the field of view adjustment mechanism to cooperate with each other to capture images of the multiple marks to characterize the position and / or posture of the parts to be bonded.

12. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the method for determining the position and posture of a part to be bonded as claimed in claim 11 is implemented.

Images