Chip packaging structure, preparation method thereof and electronic equipment

Abstract

The invention provides a chip packaging structure and a preparation method thereof, and an electronic device, the chip packaging structure comprises a substrate, a first chip located on one side of the substrate, a support body located on the same side of the substrate as the first chip, and a packaging layer covering the first chip and the support body, and the support body is located on at least one side of the first chip. According to the chip packaging structure, the preparation method thereof and the electronic equipment provided by the invention, the supporting body is arranged in the chip packaging structure, so that the mechanical strength of the chip packaging structure is enhanced, and the product performance of the chip packaging structure is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a chip packaging structure and a preparation method thereof, and an electronic device. Background Art

[0002] As chip products are used more and more widely in electronic products, the requirements for the product performance of chip packaging structures are becoming higher and higher, and the performance of chip packaging structures also needs to be improved.

[0003] Therefore, there is an urgent need for a chip packaging structure and a preparation method thereof, and an electronic device to solve the above technical problems. Summary of the invention

[0004] In view of this, the present application provides a chip packaging structure and a preparation method thereof, and an electronic device capable of improving mechanical strength.

[0005] To solve the above problems, the technical solutions provided by this application are as follows:

[0006] The present application provides a chip packaging structure, including:

[0007] substrate;

[0008] A first chip, located on one side of the substrate;

[0009] a support body, located on the same side of the substrate as the first chip, and the support body is located on at least one side of the first chip;

[0010] The packaging layer covers the first chip and the support body.

[0011] In some embodiments of the present application, the support body includes a first support member extending along a first direction and a second support member connected between the first support member and the substrate, and the first direction is parallel to the plane where the substrate is located;

[0012] Wherein, one of the second supporting members is connected between the middle portion of one of the first supporting members and the substrate; or,

[0013] Along the first direction, a plurality of the second supporting members are arranged between one of the first supporting members and the substrate, and in the first direction, a distance between adjacent second supporting members is greater than zero.

[0014] In some embodiments of the present application, the support body further includes a third support member extending along the first direction, and the third support member is connected between the second support member and the substrate.

[0015] In some embodiments of the present application, the first support member, the second support member and the third support member are integrally provided; or,

[0016] The first support member is bonded and fixed to the second support member, and the third support member is bonded and fixed to the second support member.

[0017] In some embodiments of the present application, in the second direction, the size of the first support member is greater than or equal to the size of the third support member, and the second direction is parallel to the plane where the substrate is located and intersects with the first direction.

[0018] In some embodiments of the present application, the support body also includes a fourth support member extending along the first direction, the fourth support member is connected between adjacent second support members, and the fourth support member is located between both ends of the second support member in the direction from the first support member to the substrate.

[0019] In some embodiments of the present application, the chip packaging structure also includes a second chip, the second chip and the first chip are located on the same side of the substrate, and in the direction from the second chip to the first chip, at least one of the support bodies is located between the first chip and the second chip.

[0020] In some embodiments of the present application, the first chip includes a memory chip, and the second chip includes a controller chip.

[0021] In some embodiments of the present application, along the direction from the substrate to the first support member, the height of the support body is greater than or equal to the height of the first chip, and the height of the support body is greater than or equal to the height of the second chip.

[0022] In some embodiments of the present application, the encapsulation layer includes a first encapsulation sublayer and a second encapsulation sublayer, the first encapsulation sublayer covers the second encapsulation sublayer and the support body, and the second encapsulation sublayer covers the first chip and the second chip;

[0023] The elastic modulus of the first encapsulation sublayer is smaller than the elastic modulus of the second encapsulation sublayer.

[0024] The present application also provides a method for preparing a chip packaging structure, comprising:

[0025] Disposing a first chip on a first side of the substrate;

[0026] Disposing a support body on at least one side of the first chip on the first side of the substrate;

[0027] A packaging layer is formed on a side of the support body away from the substrate, and the packaging layer covers the support body and the first chip.

[0028] In some embodiments of the present application, the step of providing a support body on at least one side of the first chip on the first side of the substrate includes:

[0029] providing a first support member and a second support member;

[0030] One end of the second support member is connected to the first support member, and one end of the second support member away from the first support member is connected to the first side of the substrate to form the support body.

[0031] In some embodiments of the present application, the step of providing a support body on at least one side of the first chip on the first side of the substrate includes:

[0032] Providing a first support member, a second support member and a third support member;

[0033] The support body is formed by connecting one end of the second support member to the first support member, connecting one end of the second support member away from the first support member to the third support member, and connecting one side of the third support member away from the second support member to the first side of the substrate.

[0034] In some embodiments of the present application, the step of providing a support body on at least one side of the first chip on the first side of the substrate includes:

[0035] providing a first support material layer;

[0036] Patterning the first supporting material layer to form a first supporting member extending along a first direction and a second supporting member extending along a third direction, wherein the first direction intersects the third direction;

[0037] The end of the second supporting member away from the first supporting member is connected to the first side of the substrate to form the supporting body.

[0038] In some embodiments of the present application, the step of patterning the first supporting material layer to form a first supporting member extending along a first direction and a second supporting member extending along a second direction includes:

[0039] Cutting the first supporting material layer to a preset depth to form a pre-support member with a preset thickness, the pre-support member comprising a first pre-support member extending along the first direction and a second pre-support member extending along the third direction, the preset thickness being less than or equal to the thickness of the first supporting material layer;

[0040] The pre-support is separated from the first support material layer to form the first support and the second support.

[0041] In some embodiments of the present application, the step of cutting the first supporting material layer to a preset depth to form a pre-support member having a preset thickness includes:

[0042] forming the first pre-supporting member and the second pre-supporting member having one end connected to the middle of the first pre-supporting member in the first supporting material layer; or,

[0043] The first pre-supporting member and a plurality of second pre-supporting members arranged along the first direction are formed in the first supporting material layer, and in the first direction, a distance between adjacent second pre-supporting members is greater than zero.

[0044] In some embodiments of the present application, the step of providing a support body on at least one side of the first chip on the first side of the substrate includes:

[0045] providing a first support material layer;

[0046] Patterning the first support material layer to form a first support member and a third support member extending along a first direction, and a second support member located between the first support member and the third support member and extending along a third direction, wherein the first direction intersects the third direction;

[0047] A side of the third support member that is away from the second support member in the third direction is connected to the first side of the substrate to form the support body.

[0048] In some embodiments of the present application, the step of providing a support body on at least one side of the first chip on the first side of the substrate includes:

[0049] providing a first support material layer;

[0050] Patterning the first supporting material layer to form a first supporting member extending along a first direction, a second supporting member extending along a third direction, and a fourth supporting member extending along the first direction, wherein the fourth supporting member is located between two ends of the second supporting member in the third direction, and the first direction intersects the third direction;

[0051] The end of the second supporting member away from the first supporting member is connected to the first side of the substrate to form the supporting body.

[0052] In some embodiments of the present application, the method for preparing the chip packaging structure further includes:

[0053] A second chip is disposed on the first side of the substrate.

[0054] In some embodiments of the present application, the step of forming an encapsulation layer on a side of the support body away from the substrate includes:

[0055] forming a second packaging sublayer covering the first chip and the second chip on the first side of the substrate;

[0056] A first encapsulation sublayer covering the second encapsulation sublayer and the support body is formed on a side of the second encapsulation sublayer away from the substrate, wherein the elastic modulus of the first encapsulation sublayer is smaller than the elastic modulus of the second encapsulation sublayer.

[0057] The present application also provides an electronic device, comprising the chip packaging structure as described above.

[0058] The chip packaging structure and its preparation method, and electronic device provided in the present application enhance the mechanical strength of the chip packaging structure and improve the product performance of the chip packaging structure by setting a support body in the chip packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] In order to more clearly illustrate the technical solutions in some embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0060] Figure 1 This is a schematic diagram of the first structure of the chip packaging structure provided in the embodiment of the present application;

[0061] Figure 2 is a schematic diagram of a second structure of a chip packaging structure provided in an embodiment of the present application;

[0062] Figure 3 This is a schematic diagram of the first structure of the support body of the chip packaging structure provided in an embodiment of the present application;

[0063] Figure 4 This is a second structural schematic diagram of the support body of the chip packaging structure provided in an embodiment of the present application;

[0064] Figure 5 This is a schematic diagram of a third structure of the support body of the chip packaging structure provided in an embodiment of the present application;

[0065] Figure 6 This is a fourth structural schematic diagram of the support body of the chip packaging structure provided in an embodiment of the present application;

[0066] Figure 7 This is a fifth structural schematic diagram of the support body of the chip packaging structure provided in an embodiment of the present application;

[0067] Figure 8 yes Figure 7A schematic diagram of a three-dimensional structure of a support body of a chip packaging structure shown;

[0068] Fig. 9 This is a sixth structural schematic diagram of the support body of the chip packaging structure provided in an embodiment of the present application;

[0069] Fig.10 This is a schematic diagram of a first structure of a three-point bending test of a chip packaging structure provided in an embodiment of the present application;

[0070] Fig.11 This is a second structural schematic diagram of a three-point bending test of a chip packaging structure provided in an embodiment of the present application;

[0071] Fig.12 is a flowchart of the steps of the method for preparing the chip packaging structure provided in an embodiment of the present application;

[0072] FIG. 13A to FIG. 13C It is a structural schematic diagram corresponding to each process in the method for preparing a chip packaging structure provided in an embodiment of the present application;

[0073] Fig.14 This is a schematic diagram of the first structure of a support body formed in the method for preparing a chip packaging structure provided in an embodiment of the present application;

[0074] Fig.15 This is a schematic diagram of a second structure of a support body formed in the method for preparing a chip packaging structure provided in an embodiment of the present application;

[0075] Fig.16 This is a schematic diagram of a third structure of a support body formed in the method for preparing a chip packaging structure provided in an embodiment of the present application;

[0076] Fig.17 This is a schematic diagram of a fourth structure of a support body formed in the method for preparing a chip packaging structure provided in an embodiment of the present application;

[0077] Fig.18 This is a schematic diagram of a first structure of a first supporting material layer in a method for preparing a chip packaging structure provided in an embodiment of the present application;

[0078] Fig.19 This is a schematic diagram of a second structure of the first supporting material layer in the method for preparing the chip packaging structure provided in an embodiment of the present application;

[0079] Fig. 20 yes Fig.19 A cross-sectional view of the first supporting material layer along section AA' is shown;

[0080] Fig.21 This is a schematic diagram of the first structure of a pre-support member in the method for preparing a chip packaging structure provided in an embodiment of the present application;

[0081] Fig. 22 This is a fifth structural schematic diagram of a support body formed in the method for preparing a chip packaging structure provided in an embodiment of the present application;

[0082] Fig.23 This is a schematic diagram of a third structure of the first supporting material layer in the method for preparing a chip packaging structure provided in an embodiment of the present application;

[0083] Fig.24 This is a sixth structural schematic diagram of a support body formed in the method for preparing a chip packaging structure provided in an embodiment of the present application;

[0084] Fig.25 This is a fourth structural schematic diagram of the first supporting material layer in the method for preparing the chip packaging structure provided in an embodiment of the present application;

[0085] Fig.26 This is a seventh structural schematic diagram of a support body formed in the method for preparing a chip packaging structure provided in an embodiment of the present application;

[0086] Fig. 27 This is a fifth structural schematic diagram of the first supporting material layer in the method for preparing the chip packaging structure provided in an embodiment of the present application;

[0087] Fig.28 This is a schematic diagram of the eighth structure of a support body formed in the method for preparing a chip packaging structure provided in an embodiment of the present application;

[0088] Fig.29 It is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0089] The following will be combined with the drawings in some embodiments of the present application to clearly and completely describe the technical solutions in some embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application.

[0090] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0091] The present application may repeat reference numerals and / or reference letters in different implementations. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various implementations and / or settings discussed.

[0092] The present application is aimed at the increasingly widespread application of chip products in electronic products, and the increasingly higher requirements for the product performance of the chip packaging structure. The performance of the chip packaging structure needs to be improved. For example, the thinning of the chip packaging structure leads to a decrease in the mechanical strength of the chip packaging structure, and the impact resistance and other performance needs to be improved. By providing a support body in the chip packaging structure, the mechanical properties of the chip packaging structure can be enhanced, and the product performance of the chip packaging structure can be improved.

[0093] See also Figures 1 to 11 , the embodiment of the present application provides a chip packaging structure 100, including:

[0094] substrate 101;

[0095] A first chip 102, located on one side of the substrate 101;

[0096] A support body 103 is located on the same side of the substrate 101 as the first chip 102 , and the support body 103 is located on at least one side of the first chip 102 ;

[0097] The packaging layer 104 covers the first chip 102 and the support body 103 .

[0098] In some embodiments of the present application, the substrate 101 may be a common carrier substrate or a substrate with a circuit structure. When the substrate 101 is a common carrier substrate, the carrier substrate needs to have a lead frame of an external device to electrically connect to the chip.

[0099] See also Figures 3 to 9In some embodiments of the present application, the support body 103 includes a first support member 1031 extending along a first direction Z1 and a second support member 1032 connected between the first support member 1031 and the substrate 101, and the first direction Z1 is parallel to the plane where the substrate 101 is located.

[0100] See also Figure 3 In some embodiments of the present application, a second support member 1032 is connected between the middle portion of a first support member 1031 and the substrate 101 .

[0101] See also Figures 4 to 9 In some embodiments of the present application, along the first direction Z1, a plurality of second support members 1032 are arranged between one first support member 1031 and the substrate 101, and in the first direction Z1, a distance between adjacent second support members 1032 is greater than zero.

[0102] In some embodiments of the present application, the direction from the substrate to the first support member is a third direction Y1. In the third direction Y1, one end of the second support member 1032 close to the first support member 1031 is directly connected to the first support member 1031, and one end of the second support member 1032 close to the substrate 101 is directly connected to the substrate 101 (not shown). In the third direction Y1, one end of the second support member 1032 close to the substrate 101 can be bonded and fixed to the substrate 101. When a second support member 1032 is connected between the middle part of a first support member 1031 and the substrate 101, the orthographic projection of the first support member 1031 on the substrate 101 covers the orthographic projection of the second support member 1032 on the substrate 101, and the orthographic projection of the support body 103 in the plane shared by the first direction Z1 and the third direction Y1 can be in a "T" shape, or the orthographic projection of the support body 103 in the plane shared by the first direction Z1 and the third direction Y1 can be in a rectangular, trapezoidal, etc.; or, the size of the orthographic projection of the second support member 1032 in the plane shared by the first direction Z1 and the third direction Y1 first decreases and then increases, or first increases and then decreases in the third direction Y1; preferably, the orthographic projection of the first support member 1031 on the substrate 101 is larger than the orthographic projection of the second support member 1032 on the substrate 101, thereby reducing the obstruction of the support body 103 to the flow of the packaging layer material when the packaging layer 104 is formed, thereby improving the packaging performance of the chip packaging structure 100. When multiple second support members 1032 are arranged between one first support member 1031 and the substrate 101 along the first direction Z1, and the spacing between adjacent second support members 1032 in the first direction Z1 is greater than zero, in the first direction Z1, the support body 103 has a hollow portion 1033 between adjacent second support members 1032, and the orthographic projection of the support body 103 in the plane shared by the first direction Z1 and the third direction Y1 can be at least two continuous "T" shapes. The provision of the hollow portion 1033 is conducive to reducing the obstruction of the support body 103 to the flow of the packaging layer material when the packaging layer 104 is formed, thereby improving the packaging performance of the chip packaging structure 100.

[0103] See also Figures 2 to 9In some embodiments of the present application, the support body 103 further includes a third support member 1034 extending along the first direction Z1, and the third support member 1034 is connected between the second support member 1032 and the substrate 101. When the third support member 1034 is provided, in the third direction Y1, one end of the second support member 1032 close to the substrate 101 is directly connected to the third support member 1034. In the third direction Y1, the third support member 1034 can be bonded and fixed to the substrate 101. When one of the second support members 1032 is connected between the middle of one of the first support members 1031 and the substrate 101, one of the second support members 1032 is connected to the middle of the third support member 1034, the orthographic projection of the first support member 1031 on the substrate 101 covers the orthographic projection of the second support member 1032 on the substrate 101, and the orthographic projection of the third support member 1034 on the substrate 101 covers the orthographic projection of the second support member 1032 on the substrate 101, and the orthographic projection of the support body 103 in the plane shared by the first direction Z1 and the third direction Y1 can be in the shape of an "I" (such as Figure 3 As shown), or, the orthographic projection of the support body 103 in the plane shared by the first direction Z1 and the third direction Y1 can be rectangular, trapezoidal, etc.; or, the size of the orthographic projection of the second support member 1032 in the plane shared by the first direction Z1 and the third direction Y1 first decreases and then increases, or first increases and then decreases in the third direction Y1. Preferably, the orthographic projection of the first support member 1031 on the substrate 101 is larger than the orthographic projection of the second support member 1032 on the substrate 101, and the orthographic projection of the third support member 1034 on the substrate 101 is larger than the orthographic projection of the second support member 1032 on the substrate 101, so as to reduce the obstruction of the support body 103 to the flow of the packaging layer material when the packaging layer 104 is formed, thereby improving the packaging performance of the chip packaging structure 100. When along the first direction Z1, a plurality of second support members 1032 are arranged between one first support member 1031 and the substrate 101, and in the first direction Z1, the spacing between adjacent second support members 1032 is greater than zero, a plurality of second support members 1032 are arranged between one first support member 1031 and one third support member 1034, and in the first direction Z1, the support body 103 has a hollow portion 1033 between adjacent second support members 1032, and the orthographic projection of the support body 103 in the plane shared by the first direction Z1 and the third direction Y1 can be at least two continuous "I" shapes (such as Figure 4 , Figure 5 , Figure 7 and Figure 8As shown), the provision of the hollow portion 1033 is beneficial to reducing the obstruction of the support body 103 to the flow of the packaging layer material when the packaging layer 104 is formed, thereby improving the packaging performance of the chip packaging structure 100.

[0104] See also Figure 2 and Fig.10 In some embodiments of the present application, in the second direction X1, the size of the first support member 1031 is greater than or equal to the size of the third support member 1034, and the second direction X1 is parallel to the plane where the substrate 101 is located and intersects with the first direction Z1, which is beneficial to improve the mechanical strength of the chip packaging structure 100 in the third direction Y1 while improving the impact resistance and other properties of the side of the chip packaging structure 100 away from the substrate 101.

[0105] In some embodiments of the present application, in the first direction Z1, the size of the first support member 1031 may be the same as the size of the third support member 1034 .

[0106] In some embodiments of the present application, the first direction Z1 is perpendicular to the second direction X1, and the third direction Y1 is perpendicular to the plane where the substrate 101 is located. It can be understood that the vertical in the present application refers to vertical within a certain angle error range, for example, 85° to 95° can be interpreted as vertical.

[0107] See also Fig.10 and Fig.11 , the working principle of the support body 103 during the three-point bending test is used to illustrate the role of the support body 103 in improving the mechanical strength of the chip packaging structure 100. The working principle of the support body 103 during the three-point bending test is as follows: during the three-point bending test, the support body 103 firstly provides the chip packaging structure 100 with a supporting force under the action of an external force through its own rigidity, thereby reducing the deformation of the packaging layer 104 caused by the external force; at the same time, the tension of the first support member 1031 and / or the third support member 1034 disperses and reduces the effect of the external force on the chip in the packaging layer 104 (such as the first chip 102, etc.), thereby reducing the risk of damage to the chip in the packaging layer 104; secondly, the second support member 1032 connected between the first support member 1031 and the third support member 1034 quickly conducts and disperses the pressure, further reducing the deformation of the packaging layer 104, thereby ultimately improving the mechanical strength of the chip packaging structure 100 as a whole.

[0108] See also Fig. 9In some embodiments of the present application, the support body 103 further includes a fourth support member 1035 extending along the first direction Z1, the fourth support member 1035 is connected between adjacent second support members 1032, and the fourth support member 1035 is located between two ends of the second support member 1032 in the direction from the first support member 1031 to the substrate 101. The provision of the fourth support member 1035 is conducive to increasing the external force conduction channel in the support body 103, improving the external force dispersion and conduction capabilities of the support body 103, and thus improving the mechanical strength of the chip packaging structure 100.

[0109] In some embodiments of the present application, in the first direction Z1, the size of the first support member 1031, the size of the third support member 1034, and the size of the fourth support member 1035 may be the same (not shown). Alternatively, in the first direction Z1, the size of the first support member 1031 is the same as the size of the third support member 1034, and the size of the first support member 1031 is larger than the size of the fourth support member 1035 (not shown).

[0110] In some embodiments of the present application, the components of the support body 103 can be integrally arranged or bonded to each other to form the support body 103. For example, the support body 103 can be composed of the first support member 1031 and the second support member 1032 (not shown), and the first support member 1031 and the second support member 1032 can be integrally arranged, or the first support member 1031 and the second support member 1032 can be bonded to each other; the support body 103 can be composed of the first support member 1031, the second support member 1032, and the third support member 1034, and the first support member 1031, the second support member 1032 and the third support member 1034 are integrally arranged (such as Figures 6 to 8 Alternatively, the first support member 1031 is bonded and fixed to the second support member 1032, and the third support member 1034 is bonded and fixed to the second support member 1032 (as shown in FIG. Figures 3 to 5 The support body 103 may be composed of the first support member 1031, the second support member 1032, the third support member 1034, and the fourth support member 1035, and the first support member 1031, the second support member 1032, the third support member 1034 and the fourth support member 1035 are integrally arranged (as shown in Fig. 9 Alternatively, the first support member 1031 is bonded and fixed to the second support member 1032, the third support member 1034 is bonded and fixed to the second support member 1032, and the fourth support member 1035 is bonded and fixed to the second support member 1032 (as shown in FIG. Fig.14 shown).

[0111] In some embodiments of the present application, the material of the support body 103 may be selected from at least one of silicon, quartz, and glass.

[0112] See also Figure 1 to Figure 2 In some embodiments of the present application, the chip packaging structure 100 also includes a second chip 105, and the second chip 105 and the first chip 102 are located on the same side of the substrate 101, and in the direction from the second chip 105 to the first chip 102, at least one of the support bodies 103 is located between the first chip 102 and the second chip 105.

[0113] In some embodiments of the present application, one or more support bodies 103 are located between the first chip 102 and the second chip 105. When multiple support bodies 103 are located between the first chip 102 and the second chip 105, the support bodies 103 may be arranged along the first direction Z1 (not shown).

[0114] See also Figure 1 to Figure 2 In some embodiments of the present application, along the third direction Y1, the height of the support body 103 is greater than or equal to the height of the first chip 102, and the height of the support body 103 is greater than or equal to the height of the second chip 105, so that the first support member 1031 and / or the third support member 1034 can timely disperse and reduce the external force on the first chip 102 and the second chip 105, thereby reducing the risk of damage to the first chip 102 and the second chip 105.

[0115] See also Figure 2 In some embodiments of the present application, the orthographic projection of the first support member 1031 on the substrate 101 at least partially overlaps with the orthographic projection of the first chip 102 on the substrate 101, which is beneficial for the first support member 1031 to increase the contact area with the packaging layer 104, so that the first support member 1031 can disperse external force in time, reduce the deformation of the packaging layer 104 under the action of external force, and improve the mechanical strength of the chip packaging structure 100.

[0116] In some embodiments of the present application, in the direction from the second chip 105 to the first chip 102, the orthographic projection of the first support member 1031 of the support body 103 located between the first chip 102 and the second chip 105 on the substrate 101 at least partially overlaps with the orthographic projection of the first chip 102 on the substrate 101 and the orthographic projection of the second chip 105 on the substrate 101, which is beneficial for the first support member 1031 of the support body 103 located between the first chip 102 and the second chip 105 to further increase the contact area with the packaging layer 104 within a limited space, so that the first support member 1031 can disperse external force in time, reduce the deformation of the packaging layer 104 under the action of external force, and improve the mechanical strength of the chip packaging structure 100.

[0117] In some embodiments of the present application, the first chip 102 includes a memory chip (for example, a 3D NAND chip), and the second chip 105 includes a controller chip.

[0118] See also Figure 1 to Figure 2 In some embodiments of the present application, the encapsulation layer 104 includes a first encapsulation sublayer 104a and a second encapsulation sublayer 104b, wherein the first encapsulation sublayer 104a covers the second encapsulation sublayer 104b and the support body 103, and the second encapsulation sublayer 104b covers the first chip 102 and the second chip 105. The elastic modulus of the first encapsulation sublayer 104a is smaller than the elastic modulus of the second encapsulation sublayer 104b. The smaller elastic modulus of the first encapsulation sublayer 104a is conducive to buffering the external force from the outside of the first encapsulation sublayer 104a, slowing down the transmission of the external force to the inside of the chip encapsulation structure 100, and facilitating the timely dispersion of the external force by the support body 103, thereby improving the mechanical strength of the chip encapsulation structure 100.

[0119] The chip packaging structure 100 provided in the present application enhances the mechanical strength of the chip packaging structure 100 and improves the product performance of the chip packaging structure 100 by setting a support body 103 in the chip packaging structure 100 .

[0120] See also Fig.12 The present application also provides a method for preparing a chip packaging structure, including:

[0121] Step S100 : disposing a first chip 102 on a first side of a substrate 101 .

[0122] Step S200 : disposing a support body 103 on at least one side of the first chip 102 on the first side of the substrate 101 .

[0123] Step S300 : forming a packaging layer 104 on a side of the support body 103 away from the substrate 101 , wherein the packaging layer 104 covers the support body 103 and the first chip 102 .

[0124] In some embodiments of the present application, the support body 103 can be formed by splicing various components. For details, please refer to Fig.14 , step S200 includes:

[0125] Step S201: Provide a first support member 1031 and a second support member 1032 .

[0126] Step S202: Connect one end of the second support member 1032 to the first support member 1031, and connect the end of the second support member 1032 away from the first support member 1031 to Fig. 13B The first side of the substrate 101 shown forms the support body 103 .

[0127] In some embodiments of the present application, the components of the support body 103 (for example, the first support member 1031, the second support member 1032, etc.) can be obtained by etching, cutting processes (such as laser cutting, plasma cutting, water jet cutting, etc.), etc.

[0128] In some embodiments of the present application, the end of the support 103 close to the substrate 101 is bonded and fixed to the substrate 101 through a patch process. For example, the end of the second support 1032 away from the first support 1031 is bonded and fixed to the first side of the substrate 101.

[0129] In some embodiments of the present application, in the third direction Y1, the first support member 1031 and the second support member 1032 are bonded and fixed to one end of the first support member 1031, so that the first support member 1031 is connected to one end of the second support member 1032, and the third direction Y1 is the extension direction of the second support member 1032.

[0130] See also Fig.14 In some embodiments of the present application, along the first direction Z1, a plurality of the second support members 1032 are arranged continuously, and the spacing between adjacent second support members 1032 is greater than zero. The first direction Z1 is the extension direction of the first support member 1031. Fig.14 The hollow portion 1033 is formed between two adjacent second support members 1032 .

[0131] In some embodiments of the present application, in the first direction Z1, a second support member 1032 is connected to the middle portion of the first support member 1031 (not shown).

[0132] In some embodiments of the present application, please refer to Fig.15 and Fig.16 , step S200 may further include:

[0133] Step S211: Provide a first support member 1031 , a second support member 1032 and a third support member 1034 .

[0134] Step S212: Connect one end of the second support member 1032 to the first support member 1031, connect one end of the second support member 1032 away from the first support member 1031 to the third support member 1034, and connect one side of the third support member 1034 away from the second support member 1032 to the third support member 1034. Fig. 13B The first side of the substrate 101 shown forms the support body 103 .

[0135] In some embodiments of the present application, a side of the third support member 1034 away from the second support member 1032 is bonded and fixed to the first side of the substrate 101 , and an extending direction of the third support member 1034 is parallel to the first direction Z1 .

[0136] In some embodiments of the present application, in the third direction Y1, one end of the second support member 1032 close to the first support member 1031 is bonded and fixed to the first support member 1031, and one end of the second support member 1032 away from the first support member 1031 is bonded and fixed to the third support member 1034.

[0137] See also Fig.15 In some embodiments of the present application, along the first direction Z1, a plurality of second support members 1032 are arranged continuously, and the spacing between adjacent second support members 1032 is greater than zero. Fig.14 The hollow portion 1033 is shown.

[0138] See also Fig.16 In some embodiments of the present application, along the first direction Z1, a second support member 1032 is connected to the middle of the first support member 1031.

[0139] In some embodiments of the present application, the thickness direction of the first support member 1031 is parallel to the thickness direction of the third support member 1034. Along the second direction X1, the size of the first support member 1031 is greater than or equal to the size of the third support member 1034, and the second direction X1 is the thickness direction of the first support member 1031.

[0140] In some embodiments of the present application, please refer to Fig.17 , step S200 may further include:

[0141] Step S221 : providing a first support member 1031 , a second support member 1032 , a third support member 1034 and a fourth support member 1035 .

[0142] Step S222: Connect one end of the second support member 1032 to the first support member 1031, connect the end of the second support member 1032 away from the first support member 1031 to the third support member 1034, connect the fourth support member 1035 between adjacent second support members 1032, and connect the side of the third support member 1034 away from the second support member 1032 to the third support member 1034. Fig. 13B The first side of the substrate 101 shown forms the support body 103 .

[0143] In some embodiments of the present application, in the third direction Y1, the fourth support member 1035 is located between the first support member 1031 and the third support member 1034 .

[0144] In some embodiments of the present application, one end of the second support member 1032 close to the first support member 1031 is bonded and fixed to the first support member 1031 , one end of the second support member 1032 close to the third support member 1034 is bonded and fixed to the third support member 1034 , and the fourth support member 1035 is bonded and fixed to the second support member 1032 .

[0145] See also Fig.17 In some embodiments of the present application, along the first direction Z1, a plurality of second support members 1032 are arranged continuously, and the spacing between adjacent second support members 1032 is greater than zero. The hollow portion 1033 is formed between two adjacent second support members 1032 .

[0146] In some embodiments of the present application, along the first direction Z1, a second support member 1032 is connected to the middle portion of the first support member 1031 (not shown).

[0147] In some embodiments of the present application, the support body 103 can be formed by integrally forming various components. For details, please refer to Figures 18 to 22 , step S200 includes:

[0148] Step S231: Provide a Fig.18 A first layer of supporting material 106 is shown.

[0149] Step S232: patterning the first support material layer 106 to form a plurality of Fig. 22 The first support member 1031 shown in FIG. Fig. 22 The second support member 1032 is shown extending along the third direction Y1 , and the first direction Z1 intersects with the third direction Y1 .

[0150] Step S233: Connect the end of the second support member 1032 away from the first support member 1031 to Fig. 13B The first side of the substrate 101 shown forms the support body 103 .

[0151] In some embodiments of the present application, the material of the first supporting material layer 106 may be selected from at least one of silicon, quartz, and glass.

[0152] In some embodiments of this application, please refer to Fig.19 , step S232 includes:

[0153] Step S232a: Cut the first supporting material layer 106 to a preset depth to form a pre-support member 107 with a preset thickness, wherein the pre-support member 107 includes a first pre-support member 1071 extending along the first direction Z1 and a second pre-support member 1072 extending along the third direction Y1, and the preset thickness is less than or equal to the thickness of the first supporting material layer 106.

[0154] Step S232b: separating the pre-support member 107 from the first support material layer 106 to form the first support member 1031 and the second support member 1032 .

[0155] In some embodiments of the present application, the step of cutting the first supporting material layer 106 to a preset depth to form a pre-support member 107 having a preset thickness may include:

[0156] The first pre-supporting member 1071 and a second pre-supporting member 1072 (not shown) having one end connected to the middle of the first pre-supporting member 1071 are formed in the first supporting material layer 106 .

[0157] In some embodiments of this application, please refer to Fig.19 The step of cutting the first supporting material layer 106 to a preset depth to form a pre-support member 107 having a preset thickness may include:

[0158] The first pre-supporting member 1071 and a plurality of second pre-supporting members 1072 arranged along the first direction Z1 are formed in the first supporting material layer 106 . In the first direction Z1 , the interval between adjacent second pre-supporting members 1072 is greater than zero.

[0159] In some embodiments of the present application, the pre-support member 107 can be formed by etching, cutting (such as laser cutting, plasma cutting, water jet cutting), etc.

[0160] In some embodiments of the present application, when the preset thickness is less than the thickness of the first supporting material layer 106, it is beneficial to form and transfer each supporting member in large quantities. When the preset thickness is less than the thickness of the first supporting material layer 106, the pre-support member 107 can be separated from the first supporting material layer 106 by removing the other parts of the first supporting material layer 106 except the pre-support member 107. For example: please refer to Fig. 20 and Fig.21 The first supporting material layer 106 includes a first portion 109 and a second portion 110 other than the first portion 109 in the second direction X1, and the pre-support member 107 is located in the first portion 109; the first supporting material layer 106 is disposed on a supporting layer 108 (such as Fig.21 The first part 109 is located on one side of the first supporting material layer 106 close to the supporting layer 108 in the second direction X1, the second part 110 is removed in the second direction X1, and the pre-support member 107 is separated from the first part 109, and the second direction X1 is the thickness direction of the first supporting material layer 106. The thickness of the pre-support member 107 in the second direction X1 is equal to the thickness of the first part 109 in the second direction X.

[0161] In some embodiments of the present application, one end of the second support member 1032 away from the first support member 1031 is bonded and fixed to the first side of the substrate 101 .

[0162] In some embodiments of the present application, please refer to Fig.18 and Figure 23 to Figure 26 , step S200 further includes:

[0163] Step S241: Provide a Fig.18 A first layer of supporting material 106 is shown.

[0164] Step S242: patterning the first supporting material layer 106 to form a first supporting member 1031 and a third supporting member 1034 extending along a first direction Z1, and a second supporting member 1032 located between the first supporting member 1031 and the third supporting member 1034 and extending along a third direction Y1, wherein the first direction Z1 intersects the third direction Y1.

[0165] Step S243: Connect the third support member 1034 to a side away from the second support member 1032 in the third direction Y1. Fig. 13B The first side of the substrate 101 shown forms the support body 103 .

[0166] In some embodiments of this application, please refer to Figure 23 to Figure 26 , step S242 includes:

[0167] Step S242a: Fig.18 The first support material layer 106 is cut to a preset depth to form a Fig.23 or Fig.25 The pre-support member 107 with a preset thickness is shown, and the pre-support member 107 includes a first pre-support member 1071 and a third pre-support member 1073 extending along the first direction Z1, and a second pre-support member 1072 located between the first pre-support member 1071 and the third pre-support member 1073 and extending along the third direction Y1.

[0168] Step S242b: Separating the pre-support member 107 from the first support material layer 106 to form Fig.24 or Fig.26 The first support member 1031 , the second support member 1032 and the third support member 1034 are shown.

[0169] In some embodiments of this application, please refer to Fig.25 The step of cutting the first supporting material layer 106 to a preset depth to form a pre-support member 107 having a preset thickness may include:

[0170] The first pre-support member 1071 , the second pre-support member 1072 and the third pre-support member 1073 are formed in the first supporting material layer 106 , and one end of the second pre-support member 1072 close to the first pre-support member 1071 in the third direction Y1 is connected to the middle of the first pre-support member 1071 .

[0171] See also Fig.25In some embodiments of the present application, one end of the second pre-support member 1072 close to the third pre-support member 1073 in the third direction Y1 is connected to the middle of the third pre-support member 1073.

[0172] See also Fig.23 In some embodiments of the present application, the step of cutting the first supporting material layer 106 to a preset depth to form a pre-support member 107 having a preset thickness may include:

[0173] The first pre-support member 1071, the second pre-support member 1072 and the third pre-support member 1073 are formed in the first supporting material layer 106, and a plurality of the second pre-support members 1072 are connected between the first pre-support member 1071 and the third pre-support member 1073 in the third direction Y1. The plurality of the second pre-support members 1072 are arranged along the first direction Z1, and in the first direction Z1, the spacing between adjacent second pre-support members 1072 is greater than zero.

[0174] In some embodiments of the present application, the third support member 1034 is bonded and fixed to a side of the third support member 1034 that is away from the second support member 1032 in the third direction Y1. Fig. 13B The first side of the substrate 101 is shown.

[0175] In some embodiments of the present application, please refer to Fig.18 and Figure 27 to Figure 28 , step S200 further includes:

[0176] Step S251: providing a first support material layer 106 .

[0177] Step S252: Patterning the first supporting material layer 106 to form a first supporting member 1031 extending along a first direction Z1, a second supporting member 1032 extending along a third direction Y1, and a fourth supporting member 1035 extending along the first direction Z1, wherein the fourth supporting member 1035 is located between the two ends of the second supporting member 1032 in the third direction Y1, and the first direction Z1 intersects with the third direction Y1.

[0178] Step S253: Connect the end of the second support member 1032 away from the first support member 1031 to Fig. 13B The first side of the substrate 101 shown forms the support body 103 .

[0179] In some embodiments of this application, please refer to Figure 27 to Figure 28 , step S252 includes:

[0180] Step S252a: Cut the first supporting material layer 106 to a preset depth to form a pre-support member 107 with a preset thickness, wherein the pre-support member 107 includes a first pre-support member 1071 extending along a first direction Z1, a second pre-support member 1072 extending along a third direction Y1, and a fourth pre-support member 1074 extending along the first direction Z1, wherein the fourth pre-support member 1074 is located between the two ends of the second pre-support member 1072 in the third direction Y1.

[0181] In some embodiments of the present application, the pre-supporting member 107 may further include a third pre-supporting member 1073 extending along the first direction Z1, and the third pre-supporting member 1073 is located at an end of the second pre-supporting member 1072 away from the first pre-supporting member 1071 in the third direction Y1. The fourth pre-supporting member 1074 is located between the first pre-supporting member 1071 and the third pre-supporting member 1073 in the third direction Y1.

[0182] Step S252 b : separating the pre-support member 107 from the first support material layer 106 to form the first support member 1031 , the second support member 1032 and the fourth support member 1035 .

[0183] In some embodiments of this application, please refer to Figure 27 to Figure 28 When the pre-support member 107 further includes the third pre-support member 1073 , the pre-support member 107 is separated from the first supporting material layer 106 , and while forming the first supporting member 1031 , the second supporting member 1032 and the fourth supporting member 1035 , the third supporting member 1034 is also formed.

[0184] In some embodiments of the present application, the step of cutting the first supporting material layer 106 to a preset depth to form a pre-support member 107 having a preset thickness may include:

[0185] The first pre-support member 1071, the second pre-support member 1072 and the fourth pre-support member 1074 are formed in the first supporting material layer 106, and the plurality of second pre-support members 1072 are arranged along the first direction Z1. In the first direction Z1, the spacing between adjacent second pre-support members 1072 is greater than zero. The fourth pre-support member 1074 is connected between adjacent second pre-support members 1072 in the first direction Z1, and the fourth pre-support member 1074 is located between the two ends of the second pre-support member 1072 in the third direction Y1.

[0186] In some embodiments of this application, please refer to Fig. 27When the pre-support member 107 also includes the third pre-support member 1073, the first pre-support member 1071, the second pre-support member 1072 and the fourth pre-support member 1074 are formed, and also include: the third pre-support member 1073 extending along the first direction Z1 is formed at one end of the second pre-support member 1072 away from the first pre-support member 1071 in the third direction Y1.

[0187] In some embodiments of the present application, one end of the second support member 1032 away from the first support member 1031 is bonded and fixed to the first side of the substrate 101. Alternatively, when the support body 103 further includes the third support member 1034, the third support member 1034 is bonded and fixed to the first side of the substrate 101 at one end away from the second support member 1032 in the third direction Y1.

[0188] In some embodiments of this application, please refer to Fig.13A In step S100, in addition to disposing the first chip 102 on the first side of the substrate 101, the step further includes:

[0189] A second chip 105 is disposed on the first side of the substrate 101 .

[0190] The second chip 105 may be disposed on the first substrate 101 before the first chip 102 , or the second chip 105 may be disposed on the first substrate 101 after the first chip 102 , or the second chip 105 may be disposed on the first substrate 101 at the same time as the first chip 102 .

[0191] In some embodiments of the present application, the first chip 102 includes a memory chip (for example, a 3D NAND chip), and the second chip 105 includes a controller chip.

[0192] In some embodiments of this application, please refer to Fig. 13C , step S300 includes:

[0193] Step S310 : forming a second packaging sub-layer 104 b covering the first chip 102 and the second chip 105 on the first side of the substrate 101 .

[0194] Step S320: forming a first encapsulation sublayer 104a covering the second encapsulation sublayer 104b and the support body 103 on a side of the second encapsulation sublayer 104b away from the substrate 101, wherein the elastic modulus of the first encapsulation sublayer 104a is smaller than that of the second encapsulation sublayer 104b.

[0195] The preparation method of the chip packaging structure provided in the present application, by forming a support body 103 in the chip packaging structure, enhances the mechanical strength of the formed chip packaging structure and improves the product performance of the chip packaging structure.

[0196] See also Fig.29 An embodiment of the present application further provides an electronic device 10, which includes the chip packaging structure 100 in any of the above embodiments.

[0197] The electronic device 10 may be a mobile phone, a desktop computer, a laptop computer, a tablet computer, a vehicle computer, a game console, a printer, a positioning device, a wearable electronic device, a smart sensor, a virtual reality (VR) device, an augmented reality (AR) device, or any other suitable electronic device having a storage device therein.

[0198] The present application provides a chip packaging structure, a preparation method thereof, and an electronic device. The chip packaging structure includes a substrate, a first chip located on one side of the substrate, a support body located on the same side of the substrate as the first chip, a packaging layer covering the first chip and the support body, and the support body is located on at least one side of the first chip. The chip packaging structure, a preparation method thereof, and an electronic device provided by the present application enhance the mechanical strength of the chip packaging structure and improve the product performance of the chip packaging structure by setting a support body in the chip packaging structure.

[0199] The above is a detailed introduction to a chip packaging structure and a preparation method and an electronic device provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A chip packaging structure, characterized in that: include: substrate; A first chip, located on one side of the substrate; a support body, located on the same side of the substrate as the first chip, and the support body is located on at least one side of the first chip; The packaging layer covers the first chip and the support body.

2. The chip packaging structure according to claim 1, characterized in that: The support body includes a first support member extending along a first direction and a second support member connected between the first support member and the substrate, wherein the first direction is parallel to the plane where the substrate is located; Wherein, one of the second supporting members is connected between the middle portion of one of the first supporting members and the substrate; or, Along the first direction, a plurality of the second supporting members are arranged between one of the first supporting members and the substrate, and in the first direction, a distance between adjacent second supporting members is greater than zero.

3. The chip packaging structure according to claim 2, characterized in that: The support body further includes a third support member extending along the first direction, and the third support member is connected between the second support member and the substrate.

4. The chip packaging structure according to claim 3, characterized in that: The first support member, the second support member and the third support member are integrally provided; or, The first support member is bonded and fixed to the second support member, and the third support member is bonded and fixed to the second support member.

5. The chip packaging structure according to claim 3, characterized in that: In the second direction, the size of the first support member is greater than or equal to the size of the third support member, and the second direction is parallel to the plane where the substrate is located and intersects with the first direction.

6. The chip packaging structure according to claim 2, characterized in that: The support body further includes a fourth support member extending along the first direction, the fourth support member is connected between adjacent second support members, and the fourth support member is located between two ends of the second support member in a direction from the first support member to the substrate.

7. The chip packaging structure according to claim 1, characterized in that: The chip packaging structure further includes a second chip, wherein the second chip and the first chip are located on the same side of the substrate, and in a direction from the second chip to the first chip, at least one of the supporting bodies is located between the first chip and the second chip.

8. The chip packaging structure according to claim 7, characterized in that: The first chip includes a memory chip, and the second chip includes a controller chip.

9. The chip packaging structure according to any one of claims 1 to 8, characterized in that: Along the direction from the substrate to the first support member, the height of the support body is greater than or equal to the height of the first chip, and the height of the support body is greater than or equal to the height of the second chip.

10. The chip packaging structure according to claim 9, characterized in that: The encapsulation layer comprises a first encapsulation sublayer and a second encapsulation sublayer, the first encapsulation sublayer covers the second encapsulation sublayer and the support body, and the second encapsulation sublayer covers the first chip and the second chip; The elastic modulus of the first encapsulation sublayer is smaller than the elastic modulus of the second encapsulation sublayer.

11. A method for preparing a chip packaging structure, characterized in that: include: Disposing a first chip on a first side of the substrate; Disposing a support body on at least one side of the first chip on the first side of the substrate; A packaging layer is formed on a side of the support body away from the substrate, and the packaging layer covers the support body and the first chip.

12. The method for preparing a chip packaging structure according to claim 11, characterized in that: The step of providing a support body on at least one side of the first chip on the first side of the substrate comprises: providing a first support member and a second support member; One end of the second support member is connected to the first support member, and one end of the second support member away from the first support member is connected to the first side of the substrate to form the support body.

13. The method for preparing a chip packaging structure according to claim 11, characterized in that: The step of providing a support body on at least one side of the first chip on the first side of the substrate comprises: Providing a first support member, a second support member and a third support member; The support body is formed by connecting one end of the second support member to the first support member, connecting one end of the second support member away from the first support member to the third support member, and connecting one side of the third support member away from the second support member to the first side of the substrate.

14. The method for preparing a chip packaging structure according to claim 11, characterized in that: The step of providing a support body on at least one side of the first chip on the first side of the substrate comprises: providing a first support material layer; Patterning the first supporting material layer to form a first supporting member extending along a first direction and a second supporting member extending along a third direction, wherein the first direction intersects the third direction; The end of the second supporting member away from the first supporting member is connected to the first side of the substrate to form the supporting body.

15. The method for preparing a chip packaging structure according to claim 14, characterized in that: The step of patterning the first supporting material layer to form a first supporting member extending along a first direction and a second supporting member extending along a second direction comprises: Cutting the first supporting material layer to a preset depth to form a pre-support member with a preset thickness, the pre-support member comprising a first pre-support member extending along the first direction and a second pre-support member extending along the third direction, the preset thickness being less than or equal to the thickness of the first supporting material layer; The pre-support is separated from the first support material layer to form the first support and the second support.

16. The method for preparing a chip packaging structure according to claim 15, characterized in that: The step of cutting the first supporting material layer to a preset depth to form a pre-support member with a preset thickness comprises: forming the first pre-supporting member and the second pre-supporting member having one end connected to the middle of the first pre-supporting member in the first supporting material layer; or, The first pre-supporting member and a plurality of second pre-supporting members arranged along the first direction are formed in the first supporting material layer, and in the first direction, a distance between adjacent second pre-supporting members is greater than zero.

17. The method for preparing a chip packaging structure according to claim 11, characterized in that: The step of providing a support body on at least one side of the first chip on the first side of the substrate comprises: providing a first support material layer; Patterning the first support material layer to form a first support member and a third support member extending along a first direction, and a second support member located between the first support member and the third support member and extending along a third direction, wherein the first direction intersects the third direction; A side of the third support member that is away from the second support member in the third direction is connected to the first side of the substrate to form the support body.

18. The method for preparing a chip packaging structure according to claim 11, characterized in that: The step of providing a support body on at least one side of the first chip on the first side of the substrate comprises: providing a first support material layer; Patterning the first supporting material layer to form a first supporting member extending along a first direction, a second supporting member extending along a third direction, and a fourth supporting member extending along the first direction, wherein the fourth supporting member is located between two ends of the second supporting member in the third direction, and the first direction intersects the third direction; The end of the second supporting member away from the first supporting member is connected to the first side of the substrate to form the supporting body.

19. The method for preparing a chip packaging structure according to claim 11, characterized in that: The method for preparing the chip packaging structure further includes: A second chip is disposed on the first side of the substrate.

20. The method for preparing a chip packaging structure according to claim 19, characterized in that: The step of forming an encapsulation layer on a side of the support body away from the substrate comprises: forming a second packaging sublayer covering the first chip and the second chip on the first side of the substrate; A first encapsulation sublayer covering the second encapsulation sublayer and the support body is formed on a side of the second encapsulation sublayer away from the substrate, wherein the elastic modulus of the first encapsulation sublayer is smaller than the elastic modulus of the second encapsulation sublayer.

21. An electronic device, characterized in that: The electronic device comprises the chip packaging structure according to any one of claims 1 to 10.

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