Semiconductor packaging structure and manufacturing method thereof, semiconductor module and inverter

Abstract

The invention provides a semiconductor packaging structure and a manufacturing method thereof, a semiconductor module and an inverter, and the semiconductor packaging structure is used for packaging a semiconductor bare chip, and comprises a housing or a frame main body. The bendable terminal is arranged on the shell or the frame main body, the bendable terminal comprises a plurality of raw materials, the plurality of raw materials are stacked, the first ends of the plurality of raw materials are combined to form a first combination end, the second ends of the plurality of raw materials are combined to form a second combination end, and the first combination end and the second combination end are respectively arranged in a bending manner. According to the invention, the bendable terminals on the housing or the frame main body can be electrically connected with an external circuit at any appropriate angle, thereby improving the installation flexibility, enabling each part to be more concentrated in spatial layout, enabling the size to be smaller, and achieving the compact design.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a semiconductor packaging structure and a manufacturing method thereof, a semiconductor module and an inverter. Background Art

[0002] In the packaging process of semiconductor modules (such as power modules), the shell or metal frame is an indispensable raw material. It mainly plays the role of protecting the internal devices of the semiconductor module. The chips and components are connected to the external circuit through the terminals injection molded in the shell or metal frame. It also has the functions of support, heat dissipation, protection and insulation.

[0003] In the related art, the connection points (terminals) on the outer casing or metal frame are electrically connected to the corresponding connection points of the external circuit in parallel on the same plane or approximately the same plane, resulting in the various parts being relatively dispersed in spatial layout, large in size, and difficult to achieve a compact design.

[0004] In view of the existence of the above technical problems, the present application provides a new semiconductor packaging structure and a manufacturing method thereof, a semiconductor module and an inverter to at least partially solve the above problems. Summary of the invention

[0005] A series of simplified concepts are introduced in the Summary of the Invention section, which will be further described in detail in the Detailed Description of the Invention section. The Summary of the Invention section of this application does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the scope of protection of the claimed technical solution.

[0006] In view of the existing problems, the present application provides a semiconductor packaging structure for packaging a semiconductor bare chip, wherein the semiconductor packaging structure comprises:

[0007] A housing or frame body;

[0008] A bendable terminal, arranged on the housing or the frame body;

[0009] Wherein, the bendable terminal includes a plurality of raw materials, the plurality of raw materials are stacked, the first ends of the plurality of raw materials are combined into a first combined end, the second ends are combined into a second combined end, and the first combined end and the second combined end are respectively bent.

[0010] In some embodiments of the present application, the bending directions of the first combining end and the second combining end are different.

[0011] In some embodiments of the present application, the raw material includes wire, sheet, or tube.

[0012] In some embodiments of the present application, the cross-section of the raw material is a regular shape or an irregular shape.

[0013] According to another aspect of the present application, a semiconductor module is provided. The semiconductor module includes a semiconductor bare die and any one of the semiconductor packaging structures described above, wherein the semiconductor bare die is packaged in the semiconductor packaging structure.

[0014] In some embodiments of the present application, the semiconductor die includes a power semiconductor die, and the semiconductor module includes a power module.

[0015] According to another aspect of the present application, an inverter is provided, and the inverter includes the semiconductor module.

[0016] According to another aspect of the present application, a method for manufacturing a semiconductor packaging structure is provided, wherein the semiconductor packaging structure is used to package a semiconductor bare chip, and the manufacturing method comprises:

[0017] Providing a shell or a frame body, and providing a plurality of raw materials;

[0018] Arrange the plurality of raw materials in a stacked manner;

[0019] The first ends of the plurality of raw materials arranged in a stack are combined into a first combined end, and the second ends are combined into a second combined end;

[0020] The first combined end and the second combined end are respectively bent to obtain a bendable terminal;

[0021] The bendable terminal is arranged on the housing or the frame body to obtain the semiconductor packaging structure.

[0022] In some embodiments of the present application, the first combining end and the second combining end are respectively bent through a stamping process.

[0023] In some embodiments of the present application, the bendable terminal is provided on the housing or the frame body by an injection molding process.

[0024] According to the semiconductor packaging structure and its manufacturing method, semiconductor module and inverter of the embodiments of the present application, by arranging a bendable terminal in a shell or a frame body with a first connecting end and a second connecting end respectively bent, the bendable terminal on the shell or the frame body can be electrically connected to the external circuit at any suitable angle, thereby improving the installation flexibility, making the various parts more concentrated in the spatial layout, with a smaller volume, and realizing a compact design. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The following drawings of the present application are used as a part of the present application for understanding the present application. The drawings show the embodiments of the present application and their descriptions, which are used to explain the principle of the present application.

[0026] Figure 1 A schematic structural diagram of a semiconductor packaging structure of a semiconductor bare die according to an embodiment of the present application is shown.

[0027] Figure 2 A flowchart of a method for manufacturing a semiconductor packaging structure of a semiconductor bare die according to an embodiment of the present application is shown.

[0028] FIG. 3A to FIG. 3D A flow chart of a method for manufacturing a semiconductor package structure of a semiconductor bare die according to an embodiment of the present application is shown.

[0029] Figure 4 A schematic structural diagram of a semiconductor packaging structure of a semiconductor bare die according to another embodiment of the present application is shown.

[0030] Figure 5 A flowchart of a method for manufacturing a semiconductor packaging structure of a semiconductor bare die according to another embodiment of the present application is shown.

[0031] FIG. 6A to FIG. 6D A flow chart showing a method for manufacturing a semiconductor package structure of a semiconductor bare die according to another embodiment of the present application.

[0032] In the attached figure:

[0033] 100 bendable terminals;

[0034] 101 raw materials;

[0035] 111 first binding end;

[0036] 112 second binding end;

[0037] 200 housing;

[0038] 300 bendable terminals;

[0039] 301 raw materials;

[0040] 311 first binding end;

[0041] 312 second binding end;

[0042] 400 frame body. DETAILED DESCRIPTION

[0043] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present application. However, it is apparent to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described.

[0044] It should be understood that the present application can be implemented in different forms and should not be construed as being limited to the embodiments presented herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and fully convey the scope of the present application to those skilled in the art. In the accompanying drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0045] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as a second element, component, region, layer or part.

[0046] Spatially relative terms such as "under," "below," "below," "under," "above," "above," etc., may be used herein for ease of description to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, the spatially relative terms are intended to include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, then the elements or features described as "under other elements" or "under" or "under" will be oriented as "on" the other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device may be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0047] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present application. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0048] In the related art, the connection points (terminals) on the power module housing or metal frame are electrically connected to the corresponding connection points of the external circuit in parallel on the same plane or approximately on the same plane, resulting in the various parts being relatively dispersed in spatial layout, large in volume, and difficult to achieve a compact design. Taking the inverter including the power module as an example, the entire inverter requires a larger volume to accommodate the related sub-components. The larger the inverter volume, the higher the cost.

[0049] Moreover, when the laser welding process is used to connect the semiconductor packaging structure to the external circuit, it is necessary to ensure that the terminals at the connection between the shell or metal frame and the external circuit busbar are tightly stacked. When there is a certain warping of the power module, the terminal and the external circuit busbar cannot fit tightly because the connection is a mechanical structure, which will cause the laser welding to fail.

[0050] In order to solve at least one of the above-mentioned technical problems, the present application provides a semiconductor packaging structure of a semiconductor bare chip, a semiconductor packaging structure for packaging a semiconductor bare chip, the semiconductor packaging structure comprising: a shell or a frame body; a bendable terminal, arranged on the shell or the frame body; wherein the bendable terminal comprises a plurality of raw materials, the plurality of raw materials are stacked, the first ends of the plurality of raw materials are combined into a first combining end, the second ends are combined into a second combining end, and the first combining end and the second combining end are respectively bent.

[0051] According to the semiconductor packaging structure of the semiconductor bare chip of the present application, by arranging bendable terminals with the first connecting end and the second connecting end being bent respectively in the shell or the frame body, the bendable terminals on the shell or the frame body can be electrically connected to the external circuit at any suitable angle, thereby improving the installation flexibility, making the various parts more concentrated in the spatial layout, with a smaller volume, and realizing a compact design.

[0052] Moreover, when the connection between the semiconductor packaging structure and the external circuit is made using a laser welding process, it is beneficial for the bendable terminal to be closely fitted with the external circuit busbar, thereby reducing the defective rate of laser welding.

[0053] In order to thoroughly understand the present application, detailed steps and structures will be presented in the following description to illustrate the technical solution proposed by the present application. The preferred embodiments of the present application are described in detail below, but in addition to these detailed descriptions, the present application may also have other implementation methods.

[0054] Embodiment 1

[0055] Reference below Figure 1 , FIG. 3A to FIG. 3D A semiconductor packaging structure of a semiconductor bare chip according to an embodiment of the present application is described. The semiconductor packaging structure is used to package a semiconductor bare chip, and the semiconductor packaging structure includes: a housing 200 and a bendable terminal 100 disposed on the housing 200; wherein the bendable terminal 100 includes a plurality of raw materials 101, the plurality of raw materials 101 are stacked, the first ends of the plurality of raw materials 101 are combined into a first combined end 111, and the second ends are combined into a second combined end 112, and the first combined end 111 and the second combined end 112 are respectively bent.

[0056] In this embodiment, by arranging a bendable terminal 100 with a first coupling end 111 and a second coupling end 112 in a bent state in the shell 200, the bendable terminal 100 on the shell 200 can be electrically connected to an external circuit at any suitable angle, and is not limited to being electrically connected to an external circuit in a parallel manner, thereby improving the installation flexibility, making the various parts more concentrated in spatial layout, with a smaller volume, and realizing a compact design.

[0057] Furthermore, when the laser welding process is used to connect the semiconductor package structure to the external circuit, it is beneficial for the bendable terminal 100 to be closely fitted to the external circuit busbar, thereby reducing the defective rate of laser welding.

[0058] It should be noted that Figure 1 and Figure 3D What is shown in the figure is an integrated structure including three semiconductor package structures. In actual production, a single semiconductor package structure or an integrated structure including two or more semiconductor package structures can be produced according to actual needs.

[0059] In some embodiments, the semiconductor packaging structure is a packaging shell for packaging a semiconductor bare chip, and the packaging shell can package the semiconductor bare chip through a glue potting process.

[0060] In some embodiments, the semiconductor die may include a power semiconductor die, a logic semiconductor die, or any other suitable type of semiconductor die, without limitation.

[0061] In some embodiments, the material of the housing 200 can be plastic, ceramic, glass, metal or any other suitable material, which is not limited. Taking plastic as an example, it has a series of advantages such as low cost, good insulation performance, light weight, strong plasticity, easy processing and mass production.

[0062] In some embodiments, the raw material 101 can be made of metal or any other suitable conductive material, which is not limited.

[0063] In some embodiments, the raw material 101 may include a wire, a sheet, or a tube. Taking a sheet as an example, the sheet may have a certain thickness and be stacked together to form a bendable terminal 100. By stacking a plurality of raw materials 101 to form a bendable terminal 100, each raw material 101 in the bendable terminal 100 can withstand stress individually. Compared with an integrated terminal, the bendable terminal 100 in this embodiment can withstand greater stress.

[0064] In addition, when the bendable terminal 100 is subjected to an external force, each raw material 101 stacked in the bendable terminal 100 can share the external force, reducing the stress borne by a single raw material 101, thereby reducing the risk of the bendable terminal 100 breaking. Even if some raw materials 101 are damaged, other raw materials 101 can still continue to function, thereby extending the service life of the bendable terminal 100.

[0065] In some embodiments, the cross section of the raw material 101 may be a regular shape or an irregular shape, which is not limited. A regular raw material refers to a raw material 101 having a regular cross section, such as a circle, a triangle, a rectangle, a regular polygon, etc., and an irregular raw material refers to a raw material 101 having an irregular cross section. For each of the multiple raw materials 101, a raw material 101 having the same cross section may be provided, or raw materials 101 having different cross sections may be provided according to the functional requirements of different raw materials 101. It is not necessary to be limited to a raw material 101 having a single cross section to meet the performance requirements of the semiconductor packaging structure of the entire semiconductor die.

[0066] In some embodiments, any suitable method may be adopted to combine the first ends of the plurality of raw materials 101 arranged in a stack into a first combined end 111, such as welding, adhesive connection, cold extrusion connection, etc., which are not limited. Among them, the welding method may include laser welding, ultrasonic welding, arc welding, etc., which are not limited. Similarly, any suitable welding method mentioned above may be adopted to combine the second ends of the plurality of raw materials 101 arranged in a stack into a second combined end 112, which are not limited.

[0067] In some embodiments, the first bonding end 111 and the second bonding end 112 have different bending directions. Bending in different directions can further optimize space utilization, achieve a reasonable layout, avoid interference between the bendable terminal 100 and other parts, and improve the compactness of the design; moreover, bending in different directions can make the position of the bendable terminal 100 in the semiconductor package structure more stable. When connected to an external circuit, bending in different directions can provide support forces in multiple directions, effectively resist external pulling or vibration, and prevent the bendable terminal 100 from coming out of or loosening from the semiconductor package structure.

[0068] In some embodiments, the bendable terminal 100 can be disposed in the housing 200 in any suitable manner, such as injection molding, glue potting, etc., which is not limited.

[0069] Embodiment 2

[0070] Reference below Figure 4 , FIG. 6A to FIG. 6D A semiconductor packaging structure of a semiconductor bare chip according to an embodiment of the present application is described. The semiconductor packaging structure is used to package a semiconductor bare chip, and the semiconductor packaging structure includes: a frame body 400 and a bendable terminal 300 disposed on the frame body 400; wherein the bendable terminal 300 includes a plurality of raw materials 301, the plurality of raw materials 301 are stacked, the first ends of the plurality of raw materials 301 are combined into a first combined end 311, and the second ends are combined into a second combined end 312, and the first combined end 311 and the second combined end 312 are respectively bent.

[0071] In this embodiment, by arranging the bendable terminal 300 with the first combining end 311 and the second combining end 312 being bent in the frame body 400, the bendable terminal 300 on the frame body 400 can be electrically connected to the external circuit at any suitable angle, and is not limited to being electrically connected to the external circuit in a parallel manner, thereby improving the installation flexibility, making the various parts more concentrated in the spatial layout, with a smaller volume, and realizing a compact design.

[0072] Furthermore, when the laser welding process is used to connect the semiconductor package structure to the external circuit, it is beneficial for the bendable terminal 300 to be closely fitted to the external circuit busbar, thereby reducing the defective rate of laser welding.

[0073] It should be noted that Figure 4 and Fig.6D What is shown in the figure is an integrated structure including three semiconductor package structures. In actual production, a single semiconductor package structure or an integrated structure including two or more semiconductor package structures can be produced according to actual needs.

[0074] In some embodiments, the semiconductor packaging structure is a conductive metal frame for packaging semiconductor bare chips, and the conductive metal frame can package the semiconductor bare chips through a plastic packaging process. The conductive metal frame plays a mechanical support role in the packaging process, reduces the complexity of the production process, and is responsible for realizing the electrical performance connection of the power module.

[0075] In some embodiments, the semiconductor die may include a power semiconductor die, a logic semiconductor die, or any other suitable type of semiconductor die, without limitation.

[0076] In some embodiments, the material of the frame body 400 may be metal or any other suitable material, which is not limited.

[0077] In some embodiments, the raw material 301 can be made of metal or any other suitable conductive material, which is not limited.

[0078] In some embodiments, the raw material 301 may include a wire, a sheet, or a tube. Taking the sheet as an example, the sheet may have a certain thickness and be stacked together to form the bendable terminal 300. By stacking a plurality of raw materials 301 to form the bendable terminal 300, each raw material 301 in the bendable terminal 300 can withstand stress individually. Compared with the integrated terminal, the bendable terminal 300 in this embodiment can withstand greater stress.

[0079] In addition, when the bendable terminal 300 is subjected to an external force, each raw material 301 stacked in the bendable terminal 300 can share the external force, reducing the stress borne by a single raw material 301, thereby reducing the risk of breakage of the bendable terminal 300. Even if some raw materials 301 are damaged, other raw materials 301 can still continue to function, thereby extending the service life of the bendable terminal 300.

[0080] In some embodiments, the cross section of the raw material 301 may be a regular shape or an irregular shape, which is not limited. A regular raw material 301 refers to a raw material 301 having a regular cross section, such as a circle, a triangle, a rectangle, a regular polygon, etc., and an irregular raw material 301 refers to a raw material 301 having an irregular cross section. For each of the multiple raw materials 301, a raw material 301 having the same cross section may be provided, or raw materials 301 having different cross sections may be provided according to the functional requirements of different raw materials 301. It is not necessary to be limited to a raw material 301 having a single cross section to meet the performance requirements of the semiconductor packaging structure of the entire semiconductor die.

[0081] In some embodiments, any suitable method may be adopted to combine the first ends of the plurality of raw materials 301 arranged in a stack into a first combined end 311, such as welding, adhesive connection, cold extrusion connection, etc., which are not limited. Among them, the welding method may include laser welding, ultrasonic welding, arc welding, etc., which are not limited. Similarly, any suitable welding method mentioned above may be adopted to combine the second ends of the plurality of raw materials 301 arranged in a stack into a second combined end 312, which are not limited.

[0082] In some embodiments, the first bonding end 311 and the second bonding end 312 have different bending directions. Bending in different directions can further optimize space utilization, achieve a reasonable layout, avoid interference between the bendable terminal 300 and other parts, and improve the compactness of the design; moreover, bending in different directions can make the position of the bendable terminal 300 in the semiconductor package structure more stable. When connected to an external circuit, bending in different directions can provide support forces in multiple directions, effectively resist external pulling or vibration, and prevent the bendable terminal 300 from coming out of or loosening from the semiconductor package structure.

[0083] In some embodiments, the bendable terminal 300 can be disposed in the frame body 400 in any suitable manner, such as injection molding, glue potting, etc., which is not limited.

[0084] Embodiment 3

[0085] According to another aspect of the present application, a semiconductor module is provided. The semiconductor module includes a semiconductor bare chip and a semiconductor packaging structure. The semiconductor bare chip is packaged in the semiconductor packaging structure.

[0086] The semiconductor packaging structure may be the semiconductor packaging structure in the first embodiment or the second embodiment, etc., and reference may be made to the above description without limitation thereto.

[0087] In some embodiments, the semiconductor die may include a power semiconductor die, a logic semiconductor die, or any other suitable type of semiconductor die, which is not limited thereto. Accordingly, after the semiconductor die is packaged in a semiconductor packaging structure, a power module, a logic module, or any other suitable type of semiconductor module may be obtained, which is not limited thereto either.

[0088] According to the semiconductor module of the present application, the semiconductor bare chip is packaged by adopting the semiconductor packaging structure in Example 1, so that the bendable terminals on the shell or frame body can be electrically connected to the external circuit at any suitable angle, thereby improving the installation flexibility, making the various parts more concentrated in the spatial layout, with a smaller volume, and realizing a compact design.

[0089] Moreover, when the connection between the semiconductor packaging structure and the external circuit is made by laser welding, it is beneficial for the bendable terminal to be closely fitted with the external circuit busbar, thereby reducing the defective rate of laser welding.

[0090] Embodiment 4

[0091] According to yet another aspect of the present application, an inverter is provided. The inverter includes a semiconductor module.

[0092] The semiconductor module may be the power module in the second embodiment, etc. The power module, etc. may refer to the above description and is not limited thereto.

[0093] The inverter in this embodiment can reduce the volume of the entire inverter and reduce the cost of the inverter by disposing the power module in the second embodiment inside the inverter.

[0094] In addition, during the process of installing the power module into the inverter, the bendable terminals arranged on the shell or frame body enable the semiconductor packaging structure to be a multi-angle variable shell or a multi-angle variable conductive metal frame, which can effectively solve the non-coplanarity problem of the capacitor and the output busbar mounting terminals and reduce the stress problem caused by the installation.

[0095] Embodiment 5

[0096] Reference below Figure 2 A method for manufacturing a semiconductor package structure of a semiconductor die according to an embodiment of the present application may include the following steps:

[0097] Step S11, providing a housing 200 and a plurality of raw materials 101;

[0098] Step S12, stacking a plurality of raw materials 101;

[0099] Step S13, combining the first ends of the plurality of raw materials 101 arranged in a stack into a first combined end 111, and combining the second ends into a second combined end 112;

[0100] In step S14 , the first combining end 111 and the second combining end 112 are bent respectively to obtain a bendable terminal 100 .

[0101] In step S15 , the bendable terminal 100 is disposed on the housing 200 to obtain a semiconductor package structure.

[0102] In this embodiment, by arranging a bendable terminal 100 with a first coupling end 111 and a second coupling end 112 in a bent state in the shell 200, the bendable terminal 100 on the shell 200 can be electrically connected to an external circuit at any suitable angle, and is not limited to being electrically connected to an external circuit in a parallel manner, thereby improving the installation flexibility, making the various parts more concentrated in spatial layout, with a smaller volume, and realizing a compact design.

[0103] Furthermore, when the laser welding process is used to connect the semiconductor package structure to the external circuit, it is beneficial for the bendable terminal 100 to be closely fitted to the external circuit busbar, thereby reducing the defective rate of laser welding.

[0104] In some embodiments, the semiconductor packaging structure is a packaging shell for packaging a semiconductor bare chip, and the packaging shell can package the semiconductor bare chip through a glue potting process.

[0105] In some embodiments, the semiconductor die may include a power semiconductor die, a logic semiconductor die, or any other suitable type of semiconductor die, without limitation.

[0106] In some embodiments, the material of the housing 200 is also plastic, ceramic, glass, metal or any other suitable material, which is not limited. Taking plastic as an example, it has a series of advantages such as low cost, good insulation performance, light weight, strong plasticity, easy processing and mass production.

[0107] In some embodiments, the raw material 101 can be made of metal or any other suitable conductive material, which is not limited.

[0108] In some embodiments, the raw material 101 may include wire, sheet, or tube. Figure 3A and Figure 3B As shown, taking a sheet as an example, the sheet can have a certain thickness and be stacked together to form a bendable terminal 100. By stacking a plurality of raw materials 101 to form the bendable terminal 100, each raw material 101 in the bendable terminal 100 can withstand stress individually, and compared with an integrated terminal, the bendable terminal 100 in this embodiment can withstand greater stress.

[0109] In addition, when the bendable terminal 100 is subjected to an external force, each raw material 101 stacked in the bendable terminal 100 can share the external force, reducing the stress borne by a single raw material 101, thereby reducing the risk of the bendable terminal 100 breaking. Even if some raw materials 101 are damaged, other raw materials 101 can still continue to function, thereby extending the service life of the bendable terminal 100.

[0110] In some embodiments, the cross section of the raw material 101 may be a regular shape or an irregular shape, which is not limited. A regular raw material refers to a raw material 101 having a regular cross section, such as a circle, a triangle, a rectangle, a regular polygon, etc., and an irregular raw material refers to a raw material 101 having an irregular cross section. For each of the multiple raw materials 101, a raw material 101 having the same cross section may be provided, or raw materials 101 having different cross sections may be provided according to the functional requirements of different raw materials 101. It is not necessary to be limited to a raw material 101 having a single cross section to meet the performance requirements of the semiconductor packaging structure of the entire semiconductor die.

[0111] In some embodiments, any suitable method can be adopted to combine the first ends of the plurality of raw materials 101 arranged in a stack into a first combined end 111, such as welding, adhesive connection, cold extrusion connection, etc., which are not limited. Among them, the welding method can include laser welding, ultrasonic welding, arc welding, etc., which are not limited. Similarly, any suitable welding method mentioned above can also be adopted to combine the second ends of the plurality of raw materials 101 arranged in a stack into a second combined end 112, which are not limited. For example, Figure 3C A schematic diagram is shown in which the first ends of a plurality of raw materials 101 arranged in a stack are combined into a first combined end 111 , and the second ends are combined into a second combined end 112 .

[0112] It should be noted that when the first ends and the second ends of the plurality of raw materials 101 arranged in a stack are combined, the order of combining is not limited. For example, the first ends of the plurality of raw materials 101 arranged in a stack may be combined first, and then the second ends of the plurality of raw materials 101 arranged in a stack may be combined, or the second ends of the plurality of raw materials 101 arranged in a stack may be combined first, and then the first ends of the plurality of raw materials 101 arranged in a stack may be combined, or the first ends and the second ends of the plurality of raw materials 101 arranged in a stack may be combined at the same time.

[0113] In some embodiments, any suitable method can be adopted to make the first combining end 111 and the second combining end 112 be bent respectively, such as a stamping process, a bending process, etc., which is not limited. Taking the example of making the first combining end 111 and the second combining end 112 be bent respectively by a stamping process, the stamping process is a highly automated production method that can quickly and continuously process the first combining end 111 and the second combining end 112. Moreover, through the design of the mold, the bending of the first combining end 111 and the second combining end 112 can be completed simultaneously in one stamping operation, which greatly improves the production efficiency and reduces the production cost. In addition, the stamping mold can accurately control the bending angle of the first combining end 111 and the second combining end 112 to ensure that the bending angle meets the design requirements. The precise bending angle can improve the connection performance of the bendable terminal 100 with the external circuit and reduce the problem of poor connection caused by angle deviation. By way of example, Figure 3C A schematic diagram showing that the first combining end 111 and the second combining end 112 are bent respectively is shown.

[0114] It should be noted that when the first and second connecting ends 111, 112 are bent respectively, the order of bending is not limited. For example, the first connecting end 111 may be bent first, and then the second connecting end 112 may be bent, or the second connecting end 112 may be bent first, and then the first connecting end 111 may be bent, or the first and second connecting ends 111, 112 may be bent at the same time.

[0115] In some embodiments, the first bonding end 111 and the second bonding end 112 have different bending directions. Bending in different directions can further optimize space utilization, achieve a reasonable layout, avoid interference between the bendable terminal 100 and other parts, and improve the compactness of the design; moreover, bending in different directions can make the position of the bendable terminal 100 in the semiconductor package structure more stable. When connected to an external circuit, bending in different directions can provide support forces in multiple directions, effectively resist external pulling or vibration, and prevent the bendable terminal 100 from coming out of or loosening from the semiconductor package structure.

[0116] In some embodiments, the bendable terminal 100 is disposed on the housing 200 in any suitable manner, such as injection molding, glue potting, etc., which is not limited. Figure 3D A schematic diagram showing a bendable terminal 100 disposed in a housing 200 is shown.

[0117] Embodiment 6

[0118] Reference below Figure 5A method for manufacturing a semiconductor package structure of a semiconductor die according to an embodiment of the present application may include the following steps:

[0119] Step S21, providing a frame body 400 and a plurality of raw materials 301;

[0120] Step S22, stacking the plurality of raw materials 301;

[0121] Step S23, combining the first ends of the plurality of raw materials 301 arranged in a stack into a first combined end 311, and combining the second ends into a second combined end 312;

[0122] In step S24 , the first combining end 311 and the second combining end 312 are bent respectively to obtain a bendable terminal 300 .

[0123] In step S25 , the bendable terminal 300 is disposed on the frame body 400 to obtain a semiconductor package structure.

[0124] In this embodiment, by arranging a bendable terminal 100 with a first coupling end 111 and a second coupling end 112 in a bent state in the frame body 400, the bendable terminal 100 on the frame body 400 can be electrically connected to an external circuit at any suitable angle, and is not limited to being electrically connected to an external circuit in a parallel manner, thereby improving the installation flexibility, making the various parts more concentrated in spatial layout, with a smaller volume, and realizing a compact design.

[0125] Furthermore, when the laser welding process is used to connect the semiconductor package structure to the external circuit, it is beneficial for the bendable terminal 100 to be closely fitted to the external circuit busbar, thereby reducing the defective rate of laser welding.

[0126] In some embodiments, the semiconductor packaging structure is a conductive metal frame for packaging semiconductor bare chips, and the conductive metal frame can package the semiconductor bare chips through a plastic packaging process. The conductive metal frame plays a mechanical support role in the packaging process, reduces the complexity of the production process, and is responsible for realizing the electrical performance connection of the power module.

[0127] In some embodiments, the semiconductor die may include a power semiconductor die, a logic semiconductor die, or any other suitable type of semiconductor die, without limitation.

[0128] In some embodiments, the material of the frame body 400 may be metal or any other suitable material, which is not limited.

[0129] In some embodiments, the raw material 301 can be made of metal or any other suitable conductive material, which is not limited.

[0130] In some embodiments, the raw material 301 may include wire, sheet, or tube. Fig. 6A and Figure 6B As shown, taking a sheet as an example, the sheet can have a certain thickness and be stacked together to form a bendable terminal 300. By stacking a plurality of raw materials 301 to form the bendable terminal 300, each raw material 301 in the bendable terminal 300 can withstand stress individually, and compared with an integrated terminal, the bendable terminal 300 in this embodiment can withstand greater stress.

[0131] In addition, when the bendable terminal 300 is subjected to an external force, each raw material 301 stacked in the bendable terminal 300 can share the external force, reducing the stress borne by a single raw material 301, thereby reducing the risk of breakage of the bendable terminal 300. Even if some raw materials 301 are damaged, other raw materials 301 can still continue to function, thereby extending the service life of the bendable terminal 300.

[0132] In some embodiments, the cross section of the raw material 301 may be a regular shape or an irregular shape, which is not limited. A regular raw material 301 refers to a raw material 301 having a regular cross section, such as a circle, a triangle, a rectangle, a regular polygon, etc., and an irregular raw material 301 refers to a raw material 301 having an irregular cross section. For each of the multiple raw materials 301, a raw material 301 having the same cross section may be provided, or raw materials 301 having different cross sections may be provided according to the functional requirements of different raw materials 301. It is not necessary to be limited to a raw material 301 having a single cross section to meet the performance requirements of the semiconductor packaging structure of the entire semiconductor die.

[0133] In some embodiments, any suitable method can be adopted to combine the first ends of the plurality of raw materials 301 arranged in a stack into a first combined end 311, such as welding, adhesive connection, cold extrusion connection, etc., which are not limited. Among them, the welding method can include laser welding, ultrasonic welding, arc welding, etc., which are not limited. Similarly, any suitable welding method mentioned above can be adopted to combine the second ends of the plurality of raw materials 301 arranged in a stack into a second combined end 312, which are not limited. For example, Figure 6C A schematic diagram is shown in which the first ends of a plurality of raw materials 301 arranged in a stack are combined into a first combined end 311 , and the second ends are combined into a second combined end 312 .

[0134] It should be noted that when the first ends and the second ends of the plurality of raw materials 301 arranged in a stack are combined, the order of combining is not limited. For example, the first ends of the plurality of raw materials 301 arranged in a stack may be combined first, and then the second ends of the plurality of raw materials 301 arranged in a stack may be combined, or the second ends of the plurality of raw materials 301 arranged in a stack may be combined first, and then the first ends of the plurality of raw materials 301 arranged in a stack may be combined, or the first ends and the second ends of the plurality of raw materials 301 arranged in a stack may be combined at the same time.

[0135] In some embodiments, any suitable method can be adopted to make the first combining end 311 and the second combining end 312 be bent respectively, such as a stamping process, a bending process, etc., which is not limited. Taking the example of making the first combining end 311 and the second combining end 312 be bent respectively by a stamping process, the stamping process is a highly automated production method that can quickly and continuously process the first combining end 311 and the second combining end 312. Moreover, through the design of the mold, the bending of the first combining end 311 and the second combining end 312 can be completed simultaneously in one stamping operation, which greatly improves production efficiency and reduces production costs. In addition, the stamping mold can accurately control the bending angle of the first combining end 311 and the second combining end 312 to ensure that the bending angle meets the design requirements. The precise bending angle can improve the connection performance of the bendable terminal 300 with the external circuit and reduce the problem of poor connection caused by angle deviation. By way of example, Figure 6C The schematic diagram shows that the first combining end 311 and the second combining end 312 are bent respectively.

[0136] It should be noted that when the first and second connecting ends 311, 312 are bent respectively, the order of bending is not limited. For example, the first connecting end 311 may be bent first, and then the second connecting end 312 may be bent, or the second connecting end 312 may be bent first, and then the first connecting end 311 may be bent, or the first and second connecting ends 311, 312 may be bent at the same time.

[0137] In some embodiments, the first bonding end 311 and the second bonding end 312 have different bending directions. Bending in different directions can further optimize space utilization, achieve a reasonable layout, avoid interference between the bendable terminal 300 and other parts, and improve the compactness of the design; moreover, bending in different directions can make the position of the bendable terminal 300 in the semiconductor package structure more stable. When connected to an external circuit, bending in different directions can provide support forces in multiple directions, effectively resist external pulling or vibration, and prevent the bendable terminal 300 from coming out of or loosening from the semiconductor package structure.

[0138] In some embodiments, the bendable terminal 300 is disposed on the frame body 400 in any suitable manner, such as injection molding, glue potting, etc., which is not limited. Fig.6D A schematic diagram showing a bendable terminal 300 disposed on a frame body 400 is shown.

[0139] In summary, according to the semiconductor packaging structure and its manufacturing method, semiconductor module and inverter of the embodiments of the present application, by arranging bendable terminals with the first and second joint ends respectively bent in the shell or frame body, the bendable terminals on the shell or frame body can be electrically connected to the external circuit at any suitable angle, thereby improving the installation flexibility, making the various parts more concentrated in the spatial layout, with a smaller volume, and realizing a compact design.

[0140] Moreover, when the connection between the semiconductor packaging structure and the external circuit is made using a laser welding process, it is beneficial for the bendable terminal to be closely fitted with the external circuit busbar, thereby reducing the defective rate of laser welding.

[0141] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely exemplary and are not intended to limit the scope of the present application to this. Those of ordinary skill in the art may make various changes and modifications therein without departing from the scope and spirit of the present application. All these changes and modifications are intended to be included within the scope of the present application as required by the appended claims.

[0142] Similarly, it should be understood that in order to streamline the present application and help understand one or more of the various application aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, the method of the present application should not be interpreted as reflecting the following intention: the claimed application requires more features than the features clearly stated in each claim. More specifically, as reflected in the corresponding claims, the application point is that the corresponding technical problem can be solved with less than all the features of a single disclosed embodiment. Therefore, the claims following the specific embodiment are hereby explicitly incorporated into the specific embodiment, wherein each claim itself serves as a separate embodiment of the present application.

[0143] In addition, those skilled in the art will appreciate that, although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0144] It should be noted that the above embodiments illustrate rather than limit the present application, and that those skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets should not be construed as a limitation to the claims. The use of the words first, second, and third, etc. does not indicate any order. These words may be interpreted as names.

Claims

1. A semiconductor packaging structure, characterized in that: Used for packaging a semiconductor bare chip, the semiconductor packaging structure comprises: A housing or frame body; A bendable terminal, arranged on the housing or the frame body; Wherein, the bendable terminal includes a plurality of raw materials, the plurality of raw materials are stacked, the first ends of the plurality of raw materials are combined into a first combined end, the second ends are combined into a second combined end, and the first combined end and the second combined end are respectively bent.

2. The semiconductor package structure according to claim 1, wherein: The first combined end and the second combined end have different bending directions.

3. The semiconductor package structure according to claim 1, wherein: The raw material includes wire, sheet, or tube.

4. The semiconductor package structure according to claim 1, wherein: The cross section of the raw material is regular or irregular.

5. A semiconductor module, characterized in that: The semiconductor module comprises a semiconductor bare die and a semiconductor package structure according to any one of claims 1 to 4, wherein the semiconductor bare die is packaged in the semiconductor package structure.

6. The semiconductor module according to claim 5, characterized in that: The semiconductor die comprises a power semiconductor die, and the semiconductor module comprises a power module.

7. An inverter, characterized in that: The inverter includes the semiconductor module according to claim 6.

8. A method for manufacturing a semiconductor packaging structure, characterized in that: The semiconductor packaging structure is used to package a semiconductor bare chip, and the manufacturing method includes: Providing a shell or a frame body, and providing a plurality of raw materials; Arrange the plurality of raw materials in a stacked manner; The first ends of the plurality of raw materials arranged in a stack are combined into a first combined end, and the second ends are combined into a second combined end; The first combined end and the second combined end are respectively bent to obtain a bendable terminal; The bendable terminal is arranged on the housing or the frame body to obtain the semiconductor packaging structure.

9. The manufacturing method according to claim 8, characterized in that: The first combining end and the second combining end are bent respectively through a stamping process.

10. The manufacturing method according to claim 8, characterized in that: The bendable terminal is arranged on the housing or the frame body through an injection molding process.

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