Mini-led matrix integrated packaging equipment for straight screen PCB substrate

Abstract

The application discloses a kind of straight screen PCB substrate Mini-led matrix integrated packaging equipment, belong to semiconductor technical field.Mainly including die bonder, die bonder includes die bonder structure, die bonder structure includes pick-up mechanism, crystal distribution mechanism and support, pick-up mechanism includes rotary wheel and multiple suction nozzle assemblies, rotary wheel is rotated and cooperates on support, suction nozzle assembly includes stem, pick-up suction nozzle, driver one, rotary table and driver two, stem is slidably connected on rotary table, pick-up suction nozzle is set to the first end of stem, driver one can drive stem swing, crystal distribution mechanism includes the stem that is vertically arranged, stem is located at the central position of multiple suction nozzle assemblies, stem can be linear reciprocating movement relative to support along the axial direction of stem, while stem can rotate around the axis of stem, the lower end of stem is provided with die bonder suction head, and multiple die bonder suction ports are arranged on die bonder suction head.The application can improve die bonder efficiency when packaging.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically to a mini-led matrix integrated packaging device for a straight-screen PCB substrate. Background Technology

[0002] Matrix Integrated Packaging (IMD) encapsulates two, four, or even more RGB chips into a small device unit. Typical IMD packages exist in 2x2 or quad-in-one form. Quad-in-one means that each IMD package includes 4 pixel groups, and each pixel group consists of RGB three-color chips. A common use case for IMD is a display module with a pixel pitch of P0.9.

[0003] In existing IMD packaging processes, if LED flip chips are used for packaging, since the LED flip chips are attached to the blue film with the P and N poles facing outwards, a pin-type die bonder is needed to transfer the LED chips to the die bond area of ​​the substrate to achieve die bonding. The principle is to invert the blue film that fixes the LED chips so that the side with the LED chips is facing down, so that the P and N poles of the LED chips are facing down. The LED chips on the blue film are pushed down one by one to the die bond area of ​​the substrate by moving the pins. However, this method requires moving and aligning the LED chips one by one to the corresponding die bond area. The efficiency can only be improved by increasing the movement speed, but the faster the speed, the higher the misalignment failure rate, which limits the speed improvement.

[0004] Therefore, it is necessary to provide a new type of mini-led matrix integrated packaging device for straight-screen PCB substrates. Summary of the Invention

[0005] Based on the aforementioned problems in the existing technology, the purpose of this invention is to provide a straight-screen PCB substrate Mini-led matrix integrated packaging device that can improve die bonding efficiency during packaging.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is: a straight-screen PCB substrate Mini-led matrix integrated packaging device, including a die bonder, the die bonder including a die bonding structure, the die bonding structure including a die picking mechanism, a die placement mechanism, and a support, the die picking mechanism including a rotary wheel and multiple nozzle assemblies, the rotary wheel being rotatably fitted onto the support, the nozzle assembly including a rod, a die picking nozzle, a driver one, a rotary table, and a driver two, the driver one being mounted on the rotary wheel and used to drive the rotary table to rotate around a horizontal axis, the rod being slidably connected to the rotary table, the driver two being mounted on the rotary table and used to drive the rod to slide in a direction perpendicular to the rotation axis of the rotary table, the die picking nozzle being disposed at the first end of the rod, the driver... The device can drive the rod to swing. When the rod is driven by the driver to flip to the first position, the crystal pickling nozzle on the rod is vertically downward. When the rod is driven by the driver to flip to the second position, the rod swings 180°, so that the crystal pickling nozzle on the rod is vertically upward. Multiple nozzle assemblies are arranged in a circumferential array. The crystal placement mechanism includes a vertically arranged core rod. The core rod is located at the center of multiple nozzle assemblies. The core rod can move linearly back and forth relative to the support along the axis of the core rod. At the same time, the core rod can rotate around the axis of the core rod. The lower end of the core rod is provided with a die bonding head. The die bonding head is provided with multiple die bonding ports. The multiple die bonding ports are arranged in a straight line along the radial direction of the core rod.

[0007] Furthermore, the first end of the rod is provided with a telescopic end, and the crystal-retrieving nozzle is connected to the telescopic end. The extension of the telescopic end can drive the crystal-retrieving nozzle to move linearly along the axial direction of the rod.

[0008] Furthermore, the crystal arrangement mechanism also includes a base, a central wheel, a planetary carrier, planetary gears, a gear ring, a rotating sleeve, a third driver, and a fourth driver. The base is rotatably engaged with the support, the rotating sleeve is rotatably engaged with the base, the rotating sleeve is sleeved on the core rod, and the rotating sleeve and the core rod are threaded together. The core rod is also axially slidably engaged with the base, and simultaneously the core rod is circumferentially limited on the base. The third driver is used to drive the rotating sleeve to rotate. The central wheel is mounted on the base and coaxially arranged with the core rod. The planetary carrier is rotatably engaged with the base, and the planetary gears are rotatably engaged with the planetary carrier. There are multiple planetary gears, which are arranged around the axis of the central wheel. The gear ring is sleeved on the multiple planetary gears and is fixedly connected to the support. The planetary gears mesh with the gear ring and simultaneously mesh with the central wheel. The fourth driver is used to drive the planetary carrier to rotate.

[0009] Furthermore, the crystal-taking mechanism also includes a pneumatic rotary joint disposed between the support and the rotary wheel.

[0010] Furthermore, the planetary carrier is provided with a meshing structure one, and the output end of the driver four meshes with the meshing structure one on the planetary carrier.

[0011] Furthermore, the rotating sleeve and the output end of the driver three are connected by inter-tooth meshing for transmission.

[0012] Furthermore, the first driver is a rotary cylinder, the second driver is a linear cylinder, and the crystal-taking mechanism also includes a pneumatic rotary joint disposed between the support and the rotary wheel.

[0013] Furthermore, the outer peripheral wall of the core rod is provided with a sliding groove extending along the axial direction of the core rod, and a guide collar is fixedly provided on the base. The guide collar is provided with a sliding protrusion extending along the axial direction of the guide collar. The guide collar is sleeved on the core rod, and the sliding protrusion is slidably inserted into the sliding groove.

[0014] Furthermore, the first end of the rod is provided with a sliding hole, the telescopic end is slidably installed in the sliding hole, a piston is provided on the telescopic end, and the rod is provided with piston chamber one and piston chamber two located at the two ends of the piston respectively.

[0015] Furthermore, the die-bonding nozzle has three ports, and the nozzle assembly has three nozzles.

[0016] Compared with the prior art, the above-described technical solutions in the embodiments of the present invention have at least one of the following beneficial effects:

[0017] This invention provides a flat-screen PCB substrate mini-i-led matrix integrated packaging device, including a die bonder. The die bonder includes a die bonding structure, which includes a die picking mechanism, a die placement mechanism, and a support. The die picking mechanism includes a rotary wheel and multiple nozzle assemblies. The rotary wheel is rotatably mounted on the support. The nozzle assembly includes a rod, a die picking nozzle, a first driver, a rotary table, and a second driver. The first driver is mounted on the rotary wheel and drives the rotary table to rotate around a horizontal axis. The rod is slidably connected to the rotary table. The second driver is mounted on the rotary table and drives the rod to slide in a direction perpendicular to the rotation axis of the rotary table. The die picking nozzle is disposed at the first end of the rod. The first driver can... The drive rod swings as shown in the figure. When the rod is driven by the first driver to flip to the first position, the crystal pick-up nozzle on the rod is vertically downward. When the rod is driven by the first driver to flip to the second position, the rod swings 180°, making the crystal pick-up nozzle on the rod vertically upward. Multiple nozzle assemblies are arranged in a circumferential array. The crystal placement mechanism includes a vertically arranged core rod, which is located at the center of multiple nozzle assemblies. The core rod can reciprocate linearly relative to the support along its axial direction. At the same time, the core rod can rotate around its axis. A die-bonding head is provided at the lower end of the core rod, as shown in the figure. The die-bonding head has multiple die-bonding ports, which are located along the core rod. The rods are arranged in a straight line radially. When the actuator 1 drives the rod to swing to the first position, the rotation of the rotary wheel causes the chip-grabbing nozzles on the multiple rods to rotate one by one above the blue film. The chip-grabbing nozzles pick up the LED chips one by one. Then, the core rod rotates, and the actuator 2 drives the chip-grabbing nozzles to move in a straight line. When the rod swings to the second position, the chip-grabbing nozzles are aligned with the multiple die-bonding ports on the die-bonding head. The die-bonding port then picks up the LED chip from the chip-grabbing nozzle. Since the P and N terminals of the LED chip are facing upwards and close to the chip-grabbing nozzle when it is picked up by the chip-grabbing nozzle, after the LED chip is rotated 180° with the chip-grabbing nozzle... The LED chip picked up by the pick-up nozzle has its P and N poles facing downwards. Then, when the LED chip is picked up from the pick-up nozzle by the die-bonding port, the LED chip picked up by the die-bonding port has its P and N poles facing downwards, away from the die-bonding port. Multiple LED chips are transferred from the pick-up nozzle to multiple die-bonding ports on the die-bonding head. Then, the core rod descends, causing the die-bonding head to move downwards, thus transferring multiple LED chips together to multiple corresponding die-bonding areas on the substrate. Multiple LED chips are in a state where their P and N poles face downwards towards the substrate, adapting to LED flip-chip packaging. Compared to existing technologies, the straight-screen PCB substrate Mini-LED matrix integrated packaging equipment provided in this embodiment can simultaneously transfer and bond multiple LED chips to multiple die-bonding areas, reducing the number of displacements between the die-bonding area and the blue film storing the LED chips, shortening the displacement path, and promoting improved die-bonding efficiency. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] Figure 1 This is a three-dimensional structural diagram of a Mini-led matrix integrated packaging device for a straight-screen PCB substrate provided in an embodiment of the present invention.

[0020] Figure 2 This is a front view of a Mini-led matrix integrated packaging device for a straight-screen PCB substrate provided in an embodiment of the present invention.

[0021] Figure 3 For along Figure 2 A cross-sectional view along the EE direction, showing one positional state of the rod.

[0022] Figure 4 This is a three-dimensional structural diagram of the suction nozzle assembly provided in an embodiment of the present invention.

[0023] Figure 5 This is a cross-sectional view of the rod provided in an embodiment of the present invention.

[0024] Figure 6 for Figure 3 An enlarged schematic diagram of region A in the middle.

[0025] Figure 7 for Figure 3 Enlarged schematic diagram of region B in the middle.

[0026] Figure 8 This is a three-dimensional structural diagram of the crystal-laying mechanism provided in an embodiment of the present invention.

[0027] Figure 9 This is an exploded view of the crystal arrangement mechanism provided in an embodiment of the present invention.

[0028] Figure 10 for Figure 3 The cross-sectional view of the Mini-led matrix integrated packaging device on the flat PCB substrate shown illustrates another positional state of the rod.

[0029] Figure 11 For along Figure 10 A magnified view of region C in the middle.

[0030] Figure 12 for Figure 3 The cross-sectional view of the Mini-led matrix integrated packaging device on the straight-screen PCB substrate shows another positional state of the rod.

[0031] Figure 13 for Figure 12 A magnified diagram of region D in the middle.

[0032] In the figures, the following reference numerals are used: 100, die-bonding structure; 1, die-taking mechanism; 11, rotary wheel; 12, suction nozzle assembly; 121, rod; 1211, sliding hole; 1212, piston chamber one; 1213, piston chamber two; 122, telescopic end; 1221, piston; 123, die-taking suction nozzle; 124, reset elastic element; 125, actuator one; 126, rotary table; 1261, sliding rod; 127, actuator two; 128, pneumatic rotary joint; 1281, fixing part; 12 82. Rotating part; 13. Die pick-up port; 2. Die placement mechanism; 21. Core rod; 211. External thread; 212. Die bond pick-up head; 213. Slide groove; 22. Base; 221. Connecting plate; 222. Guide collar; 2221. Sliding convexity; 23. Center wheel; 24. Planetary carrier; 241. Meshing structure one; 25. Planetary gear; 26. Gear ring; 27. Rotating sleeve; 28. Driver three; 29. ​​Driver four; 3. Support; 31. Receiving cavity; 4. Converter head; 41. Die bond pick-up port. Detailed Implementation

[0033] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0034] It should be noted that when a component is referred to as "connected to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0035] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0036] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0037] Throughout this specification, reference to "an embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this application. Therefore, the phrases "in one embodiment," "in some embodiments," or "in some of these embodiments" appear in various places throughout the specification, and not all refer to the same embodiment. Furthermore, in one or more embodiments, a particular feature, structure, or characteristic may be combined in any suitable manner.

[0038] Please refer to Figures 1 to 13 As shown, the present invention will now describe a Mini-LED matrix integrated packaging device for a straight-screen PCB substrate. This device includes a die bonder, which comprises a die bonder structure 100. The die bonder structure 100 is used to pick up LED chips from the blue film of a die supply platform (not shown) and place them onto the die bonder area of ​​the substrate (not shown). The die bonder structure 100 includes a die picking mechanism 1, a die placement mechanism 2, and a support 3. The die picking mechanism 1 includes a rotating wheel 11 and multiple suction nozzle assemblies 12. The rotating wheel 11 is rotatably fitted onto the support 3. Figure 4 As shown, the suction nozzle assembly 12 includes a rod 121, a crystal-retrieving suction nozzle 123, a first driver 125, a rotary table 126, and a second driver 127. The first driver 125 is mounted on the rotary wheel 11 and drives the rotary table 126 to rotate around a horizontal axis. The rod 121 is slidably connected to the rotary table 126. The second driver 127 is mounted on the rotary table 126 and drives the rod 121 to slide in a direction perpendicular to the rotation axis of the rotary table 126. The crystal-retrieving suction nozzle 123 is located at the first end of the rod 121. The first driver 125 can drive the rod 121 to swing, such as... Figure 3 As shown, when the rod 121 is driven by the driver 125 to flip to the first position, that is, the crystal pick-up nozzle 123 on the rod 121 is vertically downward, as... Figure 10As shown, when the rod 121 is driven by the driver 125 to flip to the second position, that is, the rod 121 swings 180°, so that the crystal pick-up nozzle 123 on the rod 121 is vertically upward, and multiple nozzle assemblies 12 are arranged in a circumferential array. The crystal placement mechanism 2 includes a vertically arranged core rod 21, which is located at the center of the multiple nozzle assemblies 12. The core rod 21 can move linearly back and forth relative to the support 3 along the axis of the core rod 21, and at the same time, the core rod 21 can rotate around the axis of the core rod 21. The lower end of the core rod 21 is provided with a die-bonding head 212, such as Figure 7 As shown, the die-bonding head 212 is provided with multiple die-bonding ports 41, which are arranged in a straight line along the radial direction of the core rod 21. When the driver 125 drives the rod 121 to swing to the first position, the rotation of the rotary wheel 11 causes the die-taking nozzles 123 on the multiple rods 121 to rotate one by one above the blue film. The multiple die-taking nozzles 123 pick up the LED chips one by one. Then, the core rod 21 rotates, and the driver 21 drives the die-taking nozzles 123 to move in a straight line. The linear motion causes the rod 121 to swing to the second position, where the chip picker 123 aligns selectively with one of the multiple die-bonding ports 41 on the die-bonding head 212. The die-bonding port 41 then picks up the LED chip from the chip picker 123. Since the P and N terminals of the LED chip were initially close to the chip picker 123 when it was picked up, after the LED chip is rotated 180° with the chip picker 123, the LED chip picked up by the chip picker 123... With the P and N poles of the chip facing downwards, when the LED chip is picked up from the die-attach nozzle 123 by the die-attach nozzle 41, the LED chip picked up by the die-attach nozzle 41 is in a state where the P and N poles face downwards and away from the die-attach nozzle 41. Multiple LED chips are transferred to multiple die-attach nozzles 41 on the die-attach head 212 by the die-attach nozzle 123. Then, the core rod 21 descends, driving the die-attach head 212 to move downwards, thereby transferring multiple LED chips together to multiple corresponding die-attach areas on the substrate. Multiple LED chips are in a state where the P and N poles face downwards and towards the substrate, which is suitable for LED flip chip packaging. Compared with the prior art, since the Mini-led matrix integrated packaging equipment for straight screen PCB substrate provided by the present invention can transfer multiple LED chips to multiple die-attach areas at the same time, it reduces the number of displacements between the die-attach area and the blue film storing the LED chips, shortens the displacement path, and promotes the improvement of die-attach efficiency.

[0039] Furthermore, the Mini-led matrix integrated packaging equipment for a straight-screen PCB substrate provided in this embodiment of the invention features a swingable pick-up nozzle 123 in the pick-up structure 100's nozzle assembly 12. This allows the rod 121 of the nozzle assembly 12 to remain in the first position, with the pick-up nozzle 123 on the rod 121 facing vertically downwards. The pick-up structure 100 is also suitable for die bonding operations on LED upright chips. Specifically, the rotation of the rotary wheel 11 drives multiple nozzle assemblies 12 to approach the blue film of the die supply platform one by one, thereby picking up multiple LED chips through multiple pick-up nozzles 123 and transferring the multiple LED chips to the die bonding area of ​​the substrate. This eliminates the need for multiple displacements between the die bonding area on the substrate and the blue film storing the LED chips. Therefore, the Mini-led matrix integrated packaging equipment for a straight-screen PCB substrate provided in this embodiment of the invention can perform die bonding operations on both LED upright chips and LED flip chips, making it widely applicable and helping to reduce the procurement cost of multiple sets of equipment.

[0040] Understandably, to ensure high efficiency, after one of the suction nozzle assemblies 12 grabs an LED chip at the first position, the rotating wheel 11 rotates to drive the next suction nozzle assembly 12 to grab an LED chip. At the same time, the suction nozzle assembly 12 that previously grabbed the LED chip at the first position swings the rod 121 to the second position to transfer the LED chip to the die bonding head 212. That is, while the suction nozzle assembly 12 is grabbing the LED chip, the suction nozzle assembly 12 that previously completed the LED chip grabbing drives the rod 121 to flip through the driver 125 and transfers the LED chip to the die bonding head 212.

[0041] like Figure 10 , Figure 11 , Figure 12 as well as Figure 13As shown, as the second actuator 127 drives the rod 121 to slide, it causes the crystal picker 123 to slide linearly. When the rod 121 is driven by the first actuator 125 to flip to the second position, the distance between the crystal picker 123 and the center of the core rod 21 changes. Since the multiple die-bonding ports 41 are arranged in a straight line along the radial direction of the core rod 21, the second actuator 127 drives the position of the crystal picker 123 to change. When the crystal picker 123 is flipped to the second position with the rod 121, the crystal picker 123 can interact with the multiple die-bonding ports 41. One of the die-bonding nozzles 41 is aligned until the multiple die-bonding nozzles 41 are filled with LED chips. In addition, since the multiple nozzle assemblies 12 are arranged in a circumferential array around the core rod 21, when the nozzle assembly 12 needs to transfer the picked-up LED chip to the die-bonding head 212, the core rod 21 rotates so that the arrangement direction of the multiple die-bonding nozzles 41 coincides with the direction of the linear movement of the die-taking nozzle 123 driven by the driver 2 127 of the corresponding nozzle assembly 12, so that the die-taking nozzle 123 can stop at the position aligned with any one of the die-bonding nozzles 41.

[0042] In some embodiments, the support 3 is hollow inside to form a receiving cavity 31 for supporting the component structure.

[0043] like Figure 3 As shown, in some embodiments, the first driver 125 is a rotary cylinder and the second driver 127 is a linear cylinder. This design of the pneumatic structure of the first driver 125 and the second driver 127 can reduce the weight of the suction nozzle assembly 12, which helps to reduce the moment of inertia and reduce the vibration generated when the suction nozzle assembly 12 moves. The crystal taking mechanism 1 also includes a pneumatic rotary joint 128 disposed between the bracket 3 and the rotary wheel 11, which allows the rotary wheel 11 to rotate flexibly. Specifically, the pneumatic rotary joint 128 includes a fixed part 1281 and a rotating part 1282 that rotates with the fixed part 1281. An air passage is provided between the fixed part 1281 and the rotating part 1282. The fixed part 1281 is mounted on the bracket 3 and the rotating part 1282 is connected to the rotary wheel 11. The pneumatic rotary joint 128 is a mature existing technology, so it will not be described in detail here.

[0044] In some embodiments, the crystal-taking mechanism 1 further includes a rotary driver (not shown) mounted on the support 3, the output of which is connected to the rotary wheel 11 for driving the rotary wheel 11 to rotate.

[0045] like Figure 4 As shown, in some embodiments, a slide rod 1261 is slidably disposed on the rotary table 126, the slide rod 1261 is perpendicular to the rotation axis of the rotary table 126, and the slide rod 1261 is connected to the rod body 121.

[0046] like Figure 4 and Figure 5 As shown, in some embodiments, the first end of the rod 121 is provided with a telescopic end 122, and the chip picker 123 is connected to the telescopic end 122. The extension of the telescopic end 122 can drive the chip picker 123 to move linearly along the axial direction of the rod 121. On the one hand, when the rod 121 is in the first position, the extension of the telescopic end 122 drives the chip picker 123 to extend, facilitating downward contact of the chip picker 123 with the LED chip to be picked up. On the other hand, when the rod 121 is flipped to the second position, the extension of the telescopic end 122 drives the chip picker 123 to extend, bringing the chip picker 123 closer to the die-bonding head 212. This facilitates the linear movement of the LED chip on the chip picker 123 to abut against the die-bonding head 212, preventing the chip picker 123 from flipping and directly contacting the LED chip with the die-bonding head 212, thus avoiding lateral displacement. Figure 5 As shown, specifically, the first end of the rod 121 is provided with a sliding hole 1211, and the telescopic end 122 is slidably installed in the sliding hole 1211. A piston 1221 is provided on the telescopic end 122. The rod 121 is provided with piston chamber one 1212 and piston chamber two 1213 located at both ends of the piston 1221. By adjusting the pressure difference between piston chamber one 1212 and piston chamber two 1213, the piston 1221 can be driven to move the telescopic end 122 along the axial direction of the sliding hole 1211. The flow of gas in piston chamber one 1212 and piston chamber two 1213 is connected to the external air passage through the pneumatic rotary joint 128.

[0047] like Figure 5 As shown, a reset elastic element 124 is provided at one end of the piston 1221 near the telescopic end 122. The reset elastic element 124 is used to always apply elastic force to the piston 1221 and the telescopic end 122 to drive the piston 1221 and the telescopic end 122 to slide and contract, so as to accelerate the retraction speed of the telescopic end 122 by setting the reset elastic element 124.

[0048] like Figure 5 As shown, in some embodiments, the end of the chip picker 123 is provided with a chip picker port 13 that can generate negative pressure. The negative pressure generated at the chip picker port 13 locks the LED chip at the end of the chip picker 123. Specifically, the chip picker port 13 of the chip picker 123 is connected to an external air passage. The negative pressure is generated at the chip picker port 13 by drawing a vacuum in the air passage. More precisely, the chip picker port 13 of the chip picker 123 is connected to the external air passage through a pneumatic rotary joint 128.

[0049] like Figure 6 , Figure 8 as well as Figure 9As shown, in some embodiments, the crystal-laying mechanism 2 further includes a base 22, a central wheel 23, a planetary carrier 24, planetary gears 25, a gear ring 26, a rotating sleeve 27, a third driver 28, and a fourth driver 29. The base 22 is rotatably engaged with the support 3. The rotating sleeve 27 is rotatably engaged with the base 22 and is sleeved on the core rod 21. The rotating sleeve 27 and the core rod 21 are threaded together. The core rod 21 is also axially slidably engaged with the base 22 and circumferentially limited to the base 22. The third driver 28 is used to drive the rotating sleeve 27 to rotate. The central wheel 23 is mounted on the base 22 and coaxially arranged with the core rod 21. The planetary carrier 24 is rotatably engaged with the base 22. The planetary gears 25 are rotatably engaged with the planetary carrier 24. There are multiple planetary gears 25, which are arranged around the axis of the central wheel 23. The gear ring 26 is sleeved on the multiple planetary gears 25 and is fixed to the support 3. The planetary gear 25 is connected to the ring gear 26 and simultaneously meshes with the central gear 23. The actuator 29 drives the planetary carrier 24 to rotate. When the core rod 21 needs to rotate relative to the support 3, the actuator 29 drives the planetary carrier 24 to rotate. The rotation of the planetary carrier 24 causes the planetary gear 25 to rotate around the central gear 23. At the same time, the planetary gear 25 meshes with the ring gear 26 and rotates around the axis of the planetary gear 25, thereby driving the central gear 23 to rotate. The rotation of the central gear 23 drives the base 22 to rotate. Since the core rod 21 is circumferentially confined on the base 22, the core rod 21 rotates in a circular motion relative to the support 3 along with the base 22. When the core rod 21 needs to move linearly back and forth relative to the support 3 along its axial direction, the actuator 28 drives the rotating sleeve 27 to rotate. The rotation of the rotating sleeve 27 applies an axial thrust to the core rod 21, causing the core rod 21 to slide linearly on the base 22.

[0050] The structure in the crystal arrangement mechanism 2 that drives the core rod 21 to rotate through the planetary structure is a speed-increasing structure, which can accelerate the rotation of the core rod 21 and improve operating efficiency.

[0051] like Figure 6 As shown, the base 22 is rotatably connected to the bracket 3 via the connecting plate 221.

[0052] like Figure 8As shown, in some embodiments, driver 3 28 is a drive device that outputs circumferential motion power. Driver 3 28 is mounted on bracket 3, and its output end is connected to the rotating sleeve 27. Driver 4 29 is a drive device that outputs circumferential motion power. Driver 4 29 is mounted on bracket 3, and its output end is connected to the planetary carrier 24. When driver 3 28 is running, the output end of driver 4 29 is locked, thereby locking the rotation of base 22. At this time, when driver 3 28 drives the rotating sleeve 27 to rotate, base 22 will not rotate with the rotating sleeve 27. At the same time, base 22 maintains circumferential limitation on core rod 21 to prevent core rod 21 from rotating. When driver 4 29 is running, the output end of driver 3 28 can rotate freely, thereby allowing the rotating sleeve 27 to rotate with core rod 21 to prevent core rod 21 from axially sliding.

[0053] In some other embodiments not shown in the figures, driver 3 28 is a drive device that outputs circumferential motion power. Driver 3 28 is mounted on base 22, and its output end is connected to the rotating sleeve 27. Driver 4 29 is a drive device that outputs circumferential motion power. Driver 4 29 is mounted on bracket 3, and its output end is connected to the planetary carrier 24. When driver 3 28 is running, the output end of driver 4 29 is locked, thereby locking the rotation of base 22. At this time, when driver 3 28 drives the rotating sleeve 27 to rotate, base 22 will not rotate with the rotating sleeve 27. At the same time, base 22 maintains circumferential limitation on core rod 21 to prevent core rod 21 from rotating. When driver 4 29 is running, the output end of driver 3 28 is locked, thereby locking the rotating sleeve 27 on base 22 so that it rotates with core rod 21, preventing core rod 21 from axially sliding.

[0054] like Figure 6 As shown, in some embodiments, the planet carrier 24 is provided with a meshing structure 241, and the output end of the driver 29 meshes with the meshing structure 241 on the planet carrier 24.

[0055] In some embodiments, the rotary sleeve 27 and the output end of the driver 28 are connected by inter-tooth meshing.

[0056] like Figure 6 As shown, in some embodiments, the outer peripheral wall of the core rod 21 is provided with an external thread 211, and the inner peripheral wall of the rotating sleeve 27 is provided with an internal thread, and the external thread 211 of the core rod 21 meshes with the internal thread of the rotating sleeve 27.

[0057] like Figure 9As shown, in some embodiments, the outer peripheral wall of the core rod 21 is provided with a sliding groove 213 extending axially along the core rod 21, and a guide collar 222 is fixedly provided on the base 22. The guide collar 222 is provided with a sliding protrusion 2221 extending axially along the guide collar 222. The guide collar 222 is sleeved on the core rod 21, and the sliding protrusion 2221 is slidably inserted into the sliding groove 213 to limit the core rod 21 circumferentially on the base 22.

[0058] like Figure 7 As shown, in some embodiments, the end of the die bond pick 212 is detachably mounted with a conversion head 4, and the die bond pick 41 is provided on the conversion head 4. By replacing the conversion head 4 with different specifications, it can be adapted to different working conditions. For example, if the spacing between adjacent die bond areas is different, the conversion head 4 with the corresponding spacing of the die bond pick 41 can be replaced.

[0059] In some embodiments, the die bonding nozzle 212 has three die bonding ports 41 and the nozzle assembly 12 has three to adapt to the four-in-one matrix integrated package. Because each pixel group in the four-in-one matrix integrated package structure consists of three three-color chips, that is, one pixel group has three die bonding areas. Each pixel group needs to install three LED chips in parallel. The Mini-led matrix integrated package device for straight screen PCB substrate provided by the present invention can perform die bonding on three LED chips on one pixel group at a time.

[0060] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A Mini-led matrix integrated packaging device for a straight-screen PCB substrate, comprising a die bonder, the die bonder including a die bonder structure, characterized in that: The die-bonding structure includes a die-taking mechanism, a die-laying mechanism, and a support. The die-taking mechanism includes a rotary wheel and multiple suction nozzle assemblies. The rotary wheel is rotatably mounted on the support. Each suction nozzle assembly includes a rod, a die-taking nozzle, a driver one, a rotary table, and a driver two. Driver one is mounted on the rotary wheel and drives the rotary table to rotate around a horizontal axis. The rod is slidably connected to the rotary table. Driver two is mounted on the rotary table and drives the rod to slide in a direction perpendicular to the rotation axis of the rotary table. The die-taking nozzle is located at the first end of the rod. Driver one can drive the rod to swing. When the actuator flips the rod to the first position, the crystal pickling nozzle on the rod is vertically downward. When the rod is flipped to the second position by the actuator, the rod swings 180°, so that the crystal pickling nozzle on the rod is vertically upward. Multiple nozzle assemblies are arranged in a circumferential array. The crystal placement mechanism includes a vertically arranged core rod, which is located at the center of multiple nozzle assemblies. The core rod can move linearly back and forth relative to the support along the axis of the core rod. At the same time, the core rod can rotate around the axis of the core rod. A die bonding head is provided at the lower end of the core rod. The die bonding head is provided with multiple die bonding ports, which are arranged in a straight line along the radial direction of the core rod.

2. The Mini-led matrix integrated packaging equipment for a straight-screen PCB substrate according to claim 1, characterized in that: The first end of the rod is provided with a telescopic end, and the crystal-retrieving nozzle is connected to the telescopic end. When the telescopic end extends, it can drive the crystal-retrieving nozzle to move linearly along the axial direction of the rod.

3. The Mini-led matrix integrated packaging equipment for a straight-screen PCB substrate according to claim 1, characterized in that: The crystal-laying mechanism further includes a base, a central wheel, a planetary carrier, planetary gears, a gear ring, a rotating sleeve, a third driver, and a fourth driver. The base is rotatably engaged with the support, the rotating sleeve is rotatably engaged with the base, the rotating sleeve is sleeved on the core rod, and the rotating sleeve and the core rod are threaded together. The core rod is also axially slidably engaged with the base, and simultaneously circumferentially limited to the base. The third driver is used to drive the rotating sleeve to rotate. The central wheel is mounted on the base and coaxially arranged with the core rod. The planetary carrier is rotatably engaged with the base, and the planetary gears are rotatably engaged with the planetary carrier. There are multiple planetary gears, which are arranged around the axis of the central wheel. The gear ring is sleeved on the multiple planetary gears and is fixedly connected to the support. The planetary gears mesh with the gear ring and simultaneously mesh with the central wheel. The fourth driver is used to drive the planetary carrier to rotate.

4. The Mini-led matrix integrated packaging equipment for a straight-screen PCB substrate according to claim 1, characterized in that: The crystal-taking mechanism also includes a pneumatic rotary joint disposed between the support and the rotary wheel.

5. The Mini-led matrix integrated packaging equipment for a straight-screen PCB substrate according to claim 3, characterized in that: The planetary carrier is provided with a meshing structure one, and the output end of the driver four meshes with the meshing structure one on the planetary carrier.

6. The Mini-led matrix integrated packaging equipment for a straight-screen PCB substrate according to claim 3, characterized in that: The rotating sleeve and the output end of the driver three are connected by inter-tooth meshing.

7. The Mini-led matrix integrated packaging equipment for a straight-screen PCB substrate according to claim 1, characterized in that: The first driver is a rotary cylinder, the second driver is a linear cylinder, and the crystal-taking mechanism also includes a pneumatic rotary joint disposed between the support and the rotary wheel.

8. The Mini-led matrix integrated packaging equipment for a straight-screen PCB substrate according to claim 3, characterized in that: The outer peripheral wall of the core rod is provided with a sliding groove extending along the axial direction of the core rod. A guide collar is fixedly provided on the base. The guide collar is provided with a sliding protrusion extending along the axial direction of the guide collar. The guide collar is sleeved on the core rod, and the sliding protrusion is slidably inserted into the sliding groove.

9. A Mini-led matrix integrated packaging device for a straight-screen PCB substrate according to claim 2, characterized in that: The first end of the rod is provided with a sliding hole, the telescopic end is slidably installed in the sliding hole, a piston is provided on the telescopic end, and the rod is provided with piston chamber one and piston chamber two located at the two ends of the piston respectively.

10. The Mini-led matrix integrated packaging equipment for a straight-screen PCB substrate according to claim 1, characterized in that: The die-bonding nozzle has three ports, and the nozzle assembly has three nozzles.

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