LED packaging body and light-emitting device

Abstract

The invention provides an LED packaging body and a light-emitting device, and the LED packaging body comprises a bowl cup substrate, an LED chip, a first wire arc, and a packaging glue layer. The bowl cup base plate comprises a base, a fence and a strip-shaped boss, the fence surrounds the edge of the base, and the fence and the base jointly form a bowl cup structure; the upper surface of the substrate is provided with a plurality of spaced die bonding areas, and the strip-shaped bosses are arranged on the upper surface of the substrate, are located between the adjacent die bonding areas and protrude out of the upper surface of the substrate. And the LED chip is arranged on the surface of the die bonding area. The first wire arc stretches across the strip-shaped boss and is connected with the adjacent chip electrodes of the adjacent LED chips, and the packaging glue layer is arranged in the bowl-cup structure of the bowl-cup substrate in a filling mode. According to the technical scheme of the LED packaging body, at least the deformation and fracture risk of the wire arc connecting the adjacent chip electrodes can be reduced, the service life of the LED packaging body is prolonged, and the reliability of the LED packaging body is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to an LED package and a light-emitting device. Background Art

[0002] With the rapid development of LED technology, LED devices have been widely used in lighting, display, backlight and other fields due to their advantages such as high brightness, low power consumption and long life. Especially in the field of side backlight, ultra-thin design and high reliability of LED devices have become the goal of the industry. However, the arc design of LED devices has an important impact on their service life and reliability. How to ensure extremely high reliability while pursuing ultra-thin design has become a challenge in LED packaging technology.

[0003] At present, the commonly used wire bonding form in the field of LED packaging side backlight is the triangular wire arc. The triangular wire arc design is easily affected by external factors such as the machine and environment during the process and use, causing the wire arc to deform or break, thereby affecting the reliability and service life of the LED device.

[0004] Specifically, for example, when the chip is subjected to tensile tension, it may cause the triangular arc welding wire to break or peel off from the glue, affecting the service life of the LED. For another example, during temperature changes, the thermal expansion and contraction of the packaging glue will produce stress on the welding wire, which can easily cause fatigue fracture of the welding wire under long-term action, reducing the reliability of the LED. For another example, in the hot and cold shock test of LED devices, due to the different thermal expansion coefficients between the packaging materials, the bonding wire will be subjected to periodic shearing and stretching, resulting in stress concentration, which is prone to fatigue fracture and affects the reliability of the LED. In summary, LED devices in the prior art face risks such as arc deformation and fracture in the side backlight field, and these risks seriously affect the service life and reliability of LED devices. Summary of the invention

[0005] The purpose of the present application is to provide an LED package and a light-emitting device, which can at least reduce the risk of deformation and breakage of the wire arc connecting adjacent chip electrodes and improve its service life and reliability.

[0006] In a first aspect, the present application provides an LED package, including a bowl-cup substrate, an LED chip, a first line arc and a packaging adhesive layer. The bowl-cup substrate includes a base, a fence and a strip-shaped boss, the fence surrounds the edge of the base, and together with the base forms a bowl-cup structure; a plurality of spaced solid crystal areas are arranged on the upper surface of the base, and the strip-shaped boss is arranged on the upper surface of the base, located between adjacent solid crystal areas, and protruding from the upper surface of the base. The LED chip is arranged on the surface of the solid crystal area. The first line arc spans over the strip-shaped boss and connects adjacent chip electrodes of adjacent LED chips, and the packaging adhesive layer is filled in the bowl-cup structure of the bowl-cup substrate.

[0007] In a second aspect, the present application provides another LED package, including a bowl-cup substrate, an LED chip, a substrate electrode, a second arc and a packaging adhesive layer. The bowl-cup substrate includes a base and a baffle, the baffle surrounds the edge of the base and forms a bowl-cup structure together with the base; a solid crystal area is provided on the upper surface of the base. The LED chip and the substrate electrode are provided on the surface of the solid crystal area, and the second arc connects the chip electrode of the LED chip and the substrate electrode. The packaging adhesive layer is filled in the bowl-cup structure of the bowl-cup substrate.

[0008] Wherein, the two ends of the second arc are respectively the M end and the N end, the M end is welded to the chip electrode of the LED chip, and the N end is welded to the substrate electrode. The E bending point, F bending point, and G bending point are sequentially arranged between the M end and the N end of the second arc. The concave side at the E bending point faces downward, and the E bending point is located above the chip electrode welded to the M end. The concave side at the F bending point faces downward, and the F bending point is located outside the edge of the LED chip, and the portion from the E bending point to the F bending point is higher than the upper surface of the LED chip. The concave side of the G bending point faces upward, and the portion from the G bending point to the N end is close to the upper surface of the substrate electrode. The length from the G bending point to the N end of the second arc is L6, and the total length of the second arc is W, where L6 = (15% to 25%) * W.

[0009] In a third aspect, the present application provides a light-emitting device, comprising at least one of the aforementioned LED packages, and also comprising a circuit substrate, wherein the LED package is disposed on the circuit substrate.

[0010] Compared with the prior art, the beneficial effects of this application include at least:

[0011] In the LED package of the present application, the first wire arc connects the electrodes of adjacent LED chips. After the strip-shaped boss is added between the adjacent LED chips, the space below the first wire arc is reduced, and thus the thickness of the packaging glue layer on the lower side of the first wire arc is reduced, that is, the amount of glue on the lower side of the first wire arc is reduced. As a result, the stress generated by the thermal expansion and contraction of the glue on the lower side of the first wire arc on the first wire arc is reduced, thereby reducing the risk of fatigue fracture and deformation of the first wire arc and improving the service life and reliability of the wire arc connecting adjacent chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0013] Figure 1 A top view of an LED package having two LED chips according to an embodiment of the present application;

[0014] Figure 2 along Figure 1 Sectional view of AA in the middle;

[0015] Figure 3 for Figure 2 A schematic diagram of the structure of the connecting wire arcs between the LED chips;

[0016] Figure 4 for Figure 2 A schematic diagram of the structure of the connecting wire arc between the LED chip and the substrate electrode;

[0017] Figure 5 This is a structural diagram of a bowl or cup substrate according to an embodiment of the present application;

[0018] Figure 6 For along Figure 1 Middle BB pair Figure 5 A cross-sectional view of the base plate of the middle bowl;

[0019] Figure 7 It is a structural diagram of another bowl and cup substrate according to an embodiment of the present application;

[0020] Figure 8 For along Figure 1 Middle BB pair Figure 7 A cross-sectional view of the base plate of the middle bowl;

[0021] Fig. 9 is a schematic diagram of a three-dimensional structure of an LED package in which LED chips are arranged in a straight line according to an embodiment of the present application;

[0022] Fig.10 It is a schematic diagram of the three-dimensional structure of an LED package in which LED chips are arranged in a matrix according to an embodiment of the present application;

[0023] Fig.11 A top view of an LED package having a single LED chip according to an embodiment of the present application;

[0024] Fig.12 For along Fig.11 Cross-sectional view of CC;

[0025] Fig.13 is a schematic structural diagram of a light emitting device according to an embodiment of the present application;

[0026] Fig.14 It is a schematic diagram of the line arc structure of an LED package in the prior art.

[0027] In the figure: 01, chip; 02, wire arc; 03, packaging glue; 100, LED package; 10, bowl-shaped substrate; 11, base; 12, enclosure; 13, strip boss; 131, first strip boss; 132, second strip boss; 133, slope surface; 134, vertical surface; 135, notch; 14, solid crystal area; 15, substrate electrode; 16, circuit layer; 20, LED chip; 30, first wire arc; 40, packaging glue layer; 50, second wire arc; 200, circuit substrate. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0030] like Fig.14 As shown, in the prior art, in the field of LED package side backlight, the line arc 02 connecting the chip 01 and the chip 01, and the line arc 02 connecting the chip 01 and the substrate electrode, are generally in the form of a triangular line arc.

[0031] However, in combination with actual production, manufacturing and application, the inventors found that the design of the triangular arc is easily affected by external factors such as the machine and environment during the process and use, causing the arc to deform or break, thereby affecting the reliability and service life of the LED device.

[0032] In order to solve the above-mentioned technical problems, the present application provides an LED package and a light-emitting device to reduce the risks of arc deformation and breakage, and improve service life and reliability.

[0033] Specifically, Figure 1 and Figure 2 As shown, the present application first provides an LED package, including a bowl-cup substrate 10 , an LED chip 20 , a first line arc 30 and a packaging adhesive layer 40 .

[0034] The bowl-cup substrate 10 includes a base 11, a baffle 12 and a strip-shaped boss 13. The baffle 12 surrounds the edge of the base 11 and forms a bowl-cup structure together with the base 11. A plurality of spaced solid crystal areas 14 are arranged on the upper surface of the base 11. The strip-shaped boss 13 is arranged on the upper surface of the base 11, located between adjacent solid crystal areas 14, and protrudes from the upper surface of the base 11. The LED chip 20 is arranged on the surface of the solid crystal area 14. The first arc 30 spans over the strip-shaped boss 13 and connects adjacent chip electrodes of adjacent LED chips 20. The encapsulation glue layer 40 is filled in the bowl-cup structure of the bowl-cup substrate 10.

[0035] It should be noted that in this solution, there are at least two LED chips 20, and at least there is a situation where the chip electrodes of adjacent LED chips 20 need to be connected to each other. Adjacent LED chips 20 are generally connected in a negative-to-positive manner, that is, the positive electrode of one LED chip 20 is connected to the negative electrode of the adjacent LED chip 20 through the first wire arc 30.

[0036] In the aforementioned LED package, the first wire arc 30 connects the electrodes of adjacent LED chips 20. After the strip boss 13 is added between the adjacent LED chips 20, the space below the first wire arc 30 is reduced, and thus the thickness of the packaging glue layer 40 on the lower side of the first wire arc 30 is reduced, that is, the amount of glue on the lower side of the first wire arc 30 is reduced. As a result, the stress generated by the thermal expansion and contraction of the glue on the lower side of the first wire arc 30 on the first wire arc 30 is reduced, thereby reducing the risk of fatigue fracture and deformation of the first wire arc 30, and improving the service life and reliability of the wire arc connecting adjacent chips.

[0037] In one approach, if Figure 3 As shown, the two ends of the first arc 30 are end A and end D, respectively, and the ends A and D are respectively welded to the adjacent chip electrodes of the adjacent LED chip 20. A C bending point is arranged between the end A and the end D, the concave side of the C bending point faces upward, and the C bending point is located above the strip-shaped boss 13.

[0038] Among them, after the first line arc 30 is set with a C-bend point, the length of the first line arc 30 is increased to a certain extent, so that the expansion space of the first line arc 30 is larger, and it can withstand periodic shearing and stretching, thereby reducing the risk of breakage. At the same time, the C-bend point is set above the strip boss 13, and the concave side of the C-bend point is upward, forming an arc close to the surface of the strip boss 13. On the one hand, the space below the position near the middle of the first line arc 30 is reduced, the thickness of the packaging glue layer 40 is reduced, and the amount of glue is reduced. On the other hand, the overall impact of the packaging glue on the C-bend point is reduced, thereby improving reliability and life.

[0039] In one solution, in a direction perpendicular to the upper surface of the LED chip 20, the projection of the C-bending point onto the upper surface of the strip boss 13 is located on the inner side of the edge of the upper surface of the strip boss 13, so that the C-bending point of the first line arc 30 is completely located on the upper side of the upper surface of the strip boss 13, that is, the lowest point near the middle of the first line arc 30 is located above the upper surface of the strip boss 13, thereby further reducing the influence of the packaging glue on the C-bending point, so as to further reduce the stress influence on the C-bending point.

[0040] In one approach, if Figure 3 As shown, the height of the strip boss 13 is lower than the upper surface of the LED chip 20, and the height difference between the upper surface of the strip boss 13 and the upper surface of the LED chip 20 is H1. The minimum distance between the portion of the first arc 30 located on the upper side of the strip boss 13 and the upper surface of the strip boss 13 is H2, wherein the absolute value of the difference between H1 and H2 is not greater than 100 μm.

[0041] Among them, controlling the absolute value of the difference between H1 and H2 to be no greater than 100 μm can ensure that the distance between the lowest point of the first arc 30 and the upper surface of the strip boss 13 is not too large, thereby ensuring that the amount of glue on the lower side of the first arc 30 is not too thick, thereby minimizing the influence of the packaging glue layer 40 on the lowest point in the middle of the first arc 30.

[0042] In one solution, the height difference H1 between the upper surface of the strip boss 13 and the upper surface of the LED chip 20 is no more than two-thirds of the thickness of the LED chip 20, thereby ensuring that the height of the strip boss 13 is large enough to reduce the space below the middle of the first line arc 30, thereby reducing the thickness of the glue on the lower side of the first line arc 30.

[0043] In one embodiment, the height difference H between the center of the D end of the first arc 30 and the center of the C bending point is d The absolute value of is not greater than 100 μm, which can also ensure that the amount of glue on the lower side of the first arc 30 is not too thick, thereby reducing the influence of the packaging glue layer 40 on the lower side of the first arc 30 on the lowest point in the middle of the first arc 30 .

[0044] In one approach, if Figure 3 As shown, the distance between the center of the welding point between the A end of the first arc 30 and the chip electrode and the edge of the current LED chip 20 is L1, and the distance between the center of the welding point between the D end and the chip electrode and the edge of the current LED chip 20 is L2, where L1>L2. A bending point B is set between the A end of the first arc 30 and the C bending point, with the concave side of the B bending point facing downward, and the B bending point is located above the chip electrode welded to the A end.

[0045] The A end of the first wire arc 30 is generally welded to the positive electrode of the LED chip 20, that is, the B bending point is generally set above the positive electrode of the LED chip 20. Since the distance between the positive electrode pad of the LED chip 20 and the edge of the chip is greater, the B bending point of the first wire arc 30 is set above the positive electrode, which can reduce the force under the neck of the wire arc, reduce the risk of breakage at the B bending point, and protect the wire arc.

[0046] In one approach, if Figure 3 As shown, the distance between the C bending point and the edge of the LED chip 20 close to the A end is L3, and the distance between the C bending point and the edge of the LED chip 20 close to the D end is L4, wherein L3<L4, i.e., the C bending point is relatively closer to the A end, thereby reducing the amount of glue under the arc segment of the line from the B bending point to the C bending point, thereby reducing the force under the BC line arc segment.

[0047] In one approach, if Figure 3 As shown, the height H from the bending point B to the surface of the LED chip 20 is b Not more than 150 μm is conducive to controlling the height of the B bending point, and can also reduce the overall colloid below the BC line arc segment and reduce the force below the BC line arc segment.

[0048] like Figure 2 As shown, the die-bonding area 14 of the LED package of the present application includes a substrate electrode 15 arranged on the surface, and the LED package includes a second arc 50. The second arc 50 connects the chip electrode of the LED chip 20 at the edge of the bowl substrate 10 and the substrate electrode 15.

[0049] It should be noted that the bowl and cup substrate 10 includes a circuit layer 16 , which is disposed in the base 11 and led out from the bottom surface or the side surface, and the circuit layer 16 is electrically connected to the substrate electrode 15 .

[0050] In one approach, if Figure 4 As shown, the two ends of the second arc 50 are respectively M and N, the M end is welded to the chip electrode of the LED chip 20, and the N end is welded to the substrate electrode 15. Between the M end and the N end of the second arc 50, the E bending point, the F bending point, and the G bending point are sequentially arranged.

[0051] The concave side of the E bending point faces downward, and the E bending point is located above the chip electrode welded at the M end.

[0052] Moreover, the concave side at the F bending point faces downward, the F bending point is located outside the edge of the LED chip 20, and the portion from the E bending point to the F bending point is higher than the upper surface of the LED chip 20, that is, the horizontal height of the F bending point is between the E bending point and the upper surface of the LED chip 20.

[0053] In addition, the concave side of the G bending point faces upward, and the portion from the G bending point to the N end is close to the upper surface of the substrate electrode 15. In one embodiment, the vertical distance from the G bending point to the surface of the substrate electrode 15 is less than 10 μm.

[0054] and Fig.12 Compared with the arc 02 connecting the chip 01 electrode and the substrate electrode, the second arc 50 of the present application is not a triangular arc, and the part from the M end to the G bending point presents an arc structure that is approximately "trapezoidal", which increases the strength of the arc structure, reduces the stress of the glue on the E bending point and the G bending point, and reduces the risk of breakage, that is, reduces the risk of disconnection between the second arc 50 and the LED chip 20, reduces the risk of disconnection with the substrate electrode 15, and increases the reliability and life of the second arc 50.

[0055] At the same time, the G bending point to the N end of the second arc 50 is close to the upper surface of the substrate electrode 15. This arrangement allows the portion of the second arc 50 close to the N end to form a "ground-attached" structure, which can not only ensure the connection reliability, but also basically eliminate the force from below on the G bending point.

[0056] In one approach, if Figure 4 As shown, the distance from the F bending point of the second arc 50 to the edge of the LED chip 20 is L5, where the value range of L5 is 10-100 μm. On the one hand, the length of the second arc 50 is increased to a certain extent, and the retractable space of the second arc 50 is increased to ensure that it can withstand periodic shearing and stretching, thereby reducing the risk of breakage; on the other hand, controlling the distance from the F bending point to the edge of the LED chip 20 can also control the overall colloid amount below the EF arc segment and reduce the force below the EF arc segment.

[0057] In one approach, if Figure 4 As shown, the length from the G bending point to the N end of the second arc 50 is L6, and the total length of the second arc 50 is W, where L6 = 5% to 50% * W. This arrangement ensures that the arc portion of the second arc 50 close to the N end forms a relatively long "ground-closed" structure, ensuring connection reliability and substantially eliminating the force from below the G bending point.

[0058] In one approach, if Figure 4 As shown, the height H from the bending point E to the surface of the LED chip 20 is e Not more than 150μm is conducive to controlling the height of the E bending point, and also ensures that the overall colloid under the EF line arc segment is not excessive, reducing the influence of glue on the line arc.

[0059] In one approach, if Figures 5 to 8 As shown, both ends of the strip-shaped boss 13 extend toward the inner wall of the enclosure 12 , and the end of the strip-shaped boss 13 is spaced apart from the inner wall of the enclosure 12 .

[0060] In the LED package of the present application, since the end of the strip boss 13 is spaced apart from the inner wall of the enclosure 12 , excessive stress will not be applied to the inner wall of the enclosure 12 when the strip boss 13 is formed, thereby reducing the risk of deformation of the enclosure 12 .

[0061] At the same time, when the packaging glue is filled into the bowl-cup substrate 10 and baked, since the end of the strip boss 13 is spaced from the inner wall of the enclosure 12, that is, the end of the strip boss 13 is not connected to the inner wall of the enclosure 12, the cup mouth of the bowl-cup structure (that is, the enclosure 12) is not easily deformed, and thus a gap is not easily formed between the inner wall of the enclosure 12 and the packaging glue layer 40, thereby ensuring that the packaging glue layer 40 and the inner wall of the enclosure 12 maintain a good sealing contact effect, thereby reducing the probability of water vapor and air entering the bowl-cup structure, and reducing the probability of moisture and oxygen absorption by the packaging glue layer 40 and the LED chip 20 inside the bowl-cup structure during use, thereby improving the airtightness and structural reliability of the LED package, thereby increasing the service life of the LED chip 20.

[0062] In addition, the bowl-cup structure formed by the enclosure 12 and the base 11 itself has a focusing effect. After the strip-shaped boss 13 is set, its surface can also reflect the light emitted from the side of the LED chip 20, thereby further improving the luminous intensity and brightness, and cooperating with the bowl-cup structure to further improve the light gathering.

[0063] In one approach, if Figure 6 or Figure 8 As shown, the end surface of the end of the strip-shaped boss 13 facing the inner wall of the enclosure 12 can be set as a slope surface 133 or a vertical surface 134.

[0064] In addition, if Fig.11 and Fig.12 As shown, the present application also provides an LED package, including a bowl-cup substrate 10, an LED chip 20, a substrate electrode 15, a second arc 50 and a packaging glue layer 40. The bowl-cup substrate 10 includes a base 11 and a baffle 12, the baffle 12 surrounds the edge of the base 11, and forms a bowl-cup structure together with the base 11; a solid crystal area 14 is provided on the upper surface of the base 11. The LED chip 20 and the substrate electrode 15 are provided on the surface of the solid crystal area 14, the second arc 50 connects the chip electrode of the LED chip 20 and the substrate electrode 15, and the packaging glue layer 40 is filled in the bowl-cup structure of the bowl-cup substrate 10.

[0065] In the LED package of this solution, there can be only one or more LED chips 20. When there are multiple LED chips 20, the chip electrodes of each LED chip 20 are respectively connected to the corresponding substrate electrodes 15, and there is no situation where chip electrodes are connected to chip electrodes.

[0066] Among them, see Figure 4 , the two ends of the second arc 50 are respectively the M end and the N end, the M end is welded to the chip electrode of the LED chip 20, and the N end is welded to the substrate electrode 15. The E bending point, F bending point, and G bending point are sequentially arranged between the M end and the N end of the second arc 50. The concave side at the E bending point faces downward, and the E bending point is located above the chip electrode welded to the M end. The concave side at the F bending point faces downward, and the F bending point is located outside the edge of the LED chip 20, and the portion from the E bending point to the F bending point is higher than the upper surface of the LED chip 20. The concave side of the G bending point faces upward, and the portion from the G bending point to the N end is close to the upper surface of the substrate electrode 15. In addition, the length from the G bending point to the N end of the second arc 50 is L6, and the total length of the second arc 50 is W, where L6 = (15% to 25%) * W.

[0067] In one solution, the vertical distance from the G bending point to the surface of the substrate electrode 15 is less than 10 μm.

[0068] The G bending point to the N end of the second arc 50 is close to the upper surface of the substrate electrode 15. This arrangement can ensure that the part of the second arc 50 close to the N end forms a relatively long distance "ground-attached" structure, which can not only ensure the connection reliability, but also basically eliminate the force from below on the G bending point.

[0069] In one solution, the distance from the bending point F of the second arc 50 to the edge of the LED chip 20 is L5, wherein the value range of L5 is 10-100 um.

[0070] It should be noted that, in the description of the portion from the G bending point to the N end of the second arc 50 being close to the upper surface of the substrate electrode 15, since the arc is actually elastic, if the portion from the G bending point to the N end of the second arc 50 is completely attached to the substrate electrode 15, the substrate electrode 15 may scratch the arc. Therefore, the closeness described in this case is understood in a broad sense (that is, it is not a completely seamless attachment, etc.), for example, an error of less than 10μm can be allowed, for example, the distance from the portion from the G bending point to the N end to the surface of the substrate electrode is within 10μm, which also belongs to the portion from the G bending point to the N end being close to the upper surface of the substrate electrode 15 in this case.

[0071] like Fig.13 As shown, the present application further provides a light-emitting device, which includes at least one aforementioned LED package 100 and a circuit substrate 200 , on which the LED package 100 is disposed.

[0072] In order to explain the LED package of the present application in more detail, the following embodiments are provided for illustration. It should be noted that the technical features and technical solutions in the following embodiments can be used in combination with each other without conflict.

[0073] Embodiment 1

[0074] like Figure 1 and Figure 2 As shown, this embodiment provides an LED package, including a cup substrate 10 , an LED chip 20 , a first arc 30 and a packaging adhesive layer 40 .

[0075] The bowl-cup substrate 10 includes a base 11, a baffle 12 and a strip-shaped boss 13. The baffle 12 surrounds the edge of the base 11 and forms a bowl-cup structure together with the base 11. A plurality of spaced solid crystal areas 14 are arranged on the upper surface of the base 11. The strip-shaped boss 13 is arranged on the upper surface of the base 11, located between adjacent solid crystal areas 14, and protrudes from the upper surface of the base 11. The LED chip 20 is arranged on the surface of the solid crystal area 14. The first arc 30 spans over the strip-shaped boss 13 and connects adjacent chip electrodes of adjacent LED chips 20. The encapsulation glue layer 40 is filled in the bowl-cup structure of the bowl-cup substrate 10.

[0076] It should be noted that the cathode of adjacent LED chips 20 is generally connected to the anode, that is, the anode of one LED chip 20 is connected to the cathode of the adjacent LED chip 20 through the first wire arc 30 .

[0077] In the LED package of the present embodiment, the first wire arc 30 connects the electrodes of adjacent LED chips 20. After the strip boss 13 is added between the adjacent LED chips 20, the space below the first wire arc 30 is reduced, and thus the thickness of the packaging glue layer 40 on the lower side of the first wire arc 30 is reduced, that is, the amount of glue on the lower side of the first wire arc 30 is reduced. As a result, the stress generated by the thermal expansion and contraction of the glue on the lower side of the first wire arc 30 on the first wire arc 30 is reduced, thereby reducing the risk of fatigue fracture and deformation of the first wire arc 30, and improving the service life and reliability of the wire arc connecting adjacent chips.

[0078] In this embodiment, the structure of the first arc 30 connecting the electrodes of the adjacent LED chips 20 and the second arc 50 connecting the electrodes of the LED chip 20 and the electrodes of the substrate are not specifically limited in this embodiment.

[0079] In this embodiment, if Figures 5 to 8 As shown, both ends of the strip-shaped boss 13 extend toward the inner wall of the enclosure 12 , and the end of the strip-shaped boss 13 is spaced apart from the inner wall of the enclosure 12 .

[0080] Since the end of the strip-shaped boss 13 is spaced apart from the inner wall of the enclosure 12 , when the strip-shaped boss 13 is formed, no excessive stress is applied to the inner wall of the enclosure 12 , thereby reducing the risk of deformation of the enclosure 12 .

[0081] At the same time, when the packaging glue is filled into the bowl-cup substrate 10 and baked, since the end of the strip boss 13 is spaced from the inner wall of the enclosure 12, that is, the end of the strip boss 13 is not connected to the inner wall of the enclosure 12, the cup mouth of the bowl-cup structure (that is, the enclosure 12) is not easily deformed, and thus a gap is not easily formed between the inner wall of the enclosure 12 and the packaging glue layer 40, thereby ensuring that the packaging glue layer 40 and the inner wall of the enclosure 12 maintain a good sealing contact effect, thereby reducing the probability of water vapor and air entering the bowl-cup structure, and reducing the probability of moisture and oxygen absorption by the packaging glue layer 40 and the LED chip 20 inside the bowl-cup structure during use, thereby improving the airtightness and structural reliability of the LED package, thereby increasing the service life of the LED chip 20.

[0082] In addition, the bowl-cup structure formed by the enclosure 12 and the base 11 itself has a focusing effect. After the strip-shaped boss 13 is set, its surface can also reflect the light emitted from the side of the LED chip 20, thereby further improving the luminous intensity and brightness, and cooperating with the bowl-cup structure to further improve the light gathering.

[0083] In this embodiment, if Figure 6 and Figure 8 As shown, the spacing distance between the end of the strip boss 13 and the inner wall of the enclosure 12 is d, which can satisfy 0μm<d≤100μm, for example, it can be 5μm, 15μm, 25μm, 35μm, 45μm, 55μm, 65μm, 75μm, 85μm, 95μm, etc.

[0084] In this embodiment, if Figure 6 As shown, the end surface of the end of the strip boss 13 facing the inner side wall of the enclosure 12 can be set as a slope surface 133, and the slope surface 133 and the inner side wall of the enclosure 12 form a V-shaped notch 135. The V-shaped notch 135 can not only space the end of the strip boss 13 and the inner side wall of the enclosure 12, but also make the root of the end of the strip boss 13 have a certain contact with the root of the inner side wall of the enclosure 12 to ensure structural strength. The size of the widest part of the V-shaped notch 135 can be used as an indicator to measure the distance between the end of the strip boss 13 and the inner side wall of the enclosure 12.

[0085] Or, in this embodiment, if Figure 8 As shown, the end surface of the end of the strip boss 13 facing the inner wall of the enclosure 12 can be set as a vertical surface 134, and the vertical surface 134 and the inner wall of the enclosure 12 form a notch 135 that is approximately rectangular or inverted trapezoidal. The size of the widest part of the notch 135 that is approximately rectangular or inverted trapezoidal can be used as an indicator to measure the distance between the end of the strip boss 13 and the inner wall of the enclosure 12.

[0086] In this embodiment, if Fig. 9As shown, in the LED package of the present application, the strip-shaped boss 13 may include a plurality of first strip-shaped bosses 131, and the plurality of first strip-shaped bosses 131 are arranged in parallel. For a long strip-shaped LED package, by arranging a plurality of parallel first strip-shaped bosses 131 spaced at a predetermined distance, the stability of the structure can be increased, and the plurality of crystal-bonding regions 14 can be spaced apart.

[0087] In this embodiment, if Fig.10 As shown, in the LED package of the present application, the strip boss 13 may include a first strip boss 131 and a second strip boss 132, the first strip boss 131 extends along a first direction, the second strip boss 132 extends along a second direction, and the first direction is perpendicular to the second direction. For an LED package whose size extends along both the first direction and the second direction, the first strip boss 131 and the second strip boss 132 are arranged vertically and crosswise to form a grid structure, which can increase the stability of the bowl-cup substrate 10 structure and can also separate multiple solid crystal areas 14.

[0088] In addition, if Fig.11 As shown, this embodiment further provides a light emitting device, which includes at least one aforementioned LED package 100 and a circuit substrate 200 , on which the LED package 100 is disposed.

[0089] Embodiment 2

[0090] like Figure 3 As shown, this embodiment also provides an LED package, which is different from the first embodiment in that, in addition to the strip-shaped boss 13, this embodiment also has a first arc 30 with a specific structural design.

[0091] Specifically, Figure 3 As shown, the two ends of the first arc 30 are end A and end D, respectively, and the ends A and D are respectively welded to the adjacent chip electrodes of the adjacent LED chip 20. A C bending point is arranged between the end A and the end D, the concave side of the C bending point faces upward, and the C bending point is located above the strip-shaped boss 13.

[0092] Among them, after the first line arc 30 is set with a C-bend point, the length of the first line arc 30 is increased to a certain extent, so that the expansion space of the first line arc 30 is larger, and it can withstand periodic shearing and stretching, thereby reducing the risk of breakage. At the same time, the C-bend point is set above the strip boss 13, and the concave side of the C-bend point is upward, forming an arc close to the surface of the strip boss 13. On the one hand, the space below the position near the middle of the first line arc 30 is reduced, the thickness of the packaging glue layer 40 is reduced, and the amount of glue is reduced. On the other hand, the overall impact of the packaging glue on the C-bend point of the first line arc 30 is reduced, thereby improving reliability and life. In this embodiment, in the direction perpendicular to the upper surface of the LED chip 20, the projection of the C-bending point onto the upper surface of the strip boss 13 can be on the inner side of the upper surface edge of the strip boss 13, so that the C-bending point of the first line arc 30 is completely located on the upper side of the upper surface of the strip boss 13, that is, the lowest point near the middle of the first line arc 30 is located above the upper surface of the strip boss 13, thereby further reducing the influence of the packaging glue on the C-bending point, so as to further reduce the stress influence on the C-bending point.

[0093] In this embodiment, the height of the strip boss 13 is lower than the upper surface of the LED chip 20, and the height difference between the upper surface of the strip boss 13 and the upper surface of the LED chip 20 is H1. The minimum distance between the portion of the first arc 30 located on the upper side of the strip boss 13 and the upper surface of the strip boss 13 is H2, wherein the absolute value of the difference between H1 and H2 is set to be no greater than 100 μm.

[0094] Among them, controlling the absolute value of the difference between H1 and H2 to be no greater than 100 μm can ensure that the distance between the lowest point of the first arc 30 and the upper surface of the strip boss 13 is not too large, thereby ensuring that the amount of glue on the lower side of the first arc 30 is not too thick, thereby minimizing the influence of the packaging glue layer 40 on the lowest point in the middle of the first arc 30.

[0095] In this embodiment, H2≤H1 can be preferably selected, and the absolute value of the difference between H1 and H2 can be controlled to be no greater than 100 μm. This can ensure that the amount of glue on the lower side of the first arc 30 is not too thick, and can ensure that the portion from the C bending point to the D end of the first arc 30 does not touch the edge of the chip on the D end side.

[0096] In this embodiment, the absolute value of the difference between H1 and H2 may preferably be no greater than 70 μm. In a further alternative, the absolute value of the difference between H1 and H2 may preferably be no greater than 50 μm.

[0097] In this embodiment, the height difference H1 between the upper surface of the strip boss 13 and the upper surface of the LED chip 20 is no more than two-thirds of the thickness of the LED chip 20, thereby ensuring that the height of the strip boss 13 is large enough so that the space below the middle of the first line arc 30 is reduced, thereby reducing the thickness of the glue on the lower side of the first line arc 30.

[0098] In this embodiment, the height difference H1 between the upper surface of the strip boss 13 and the upper surface of the LED chip 20 can be set to be no greater than 150 μm, preferably no greater than 130 μm, for example, 80 μm, 100 μm, 120 μm, etc.

[0099] In this embodiment, the height difference H between the center of the D end of the first arc 30 and the center of the bending point C is d The absolute value of is not greater than 100 μm. For example, in a further embodiment, H d The absolute value of may be no greater than 70 μm, more preferably no greater than 50 μm. This can also ensure that the glue amount at the lower side of the first arc 30 is not too thick, thereby reducing the influence of the packaging glue layer 40 at the lower side of the first arc 30 on the lowest point in the middle of the first arc 30 .

[0100] The height difference H between the center of the D end of the first arc 30 and the center of the C bending point d On the premise that the absolute value of is not greater than 100μm, in one solution, the center of the C bending point may also be higher than the midpoint of the D end. However, in order to reduce the amount of glue on the lower side of the first arc 30, it is preferred that the center of the C bending point is lower than the midpoint of the D end or the heights of the two are the same.

[0101] In this embodiment, if Figure 3 As shown, the distance between the center of the welding point between the A end of the first arc 30 and the chip electrode and the edge of the current LED chip 20 is L1, and the distance between the center of the welding point between the D end and the chip electrode and the edge of the current LED chip 20 is L2, where L1>L2. A bending point B is set between the A end of the first arc 30 and the C bending point, with the concave side of the B bending point facing downward, and the B bending point is located above the chip electrode welded to the A end.

[0102] The A end of the first wire arc 30 is generally welded to the positive electrode of the LED chip 20, that is, the B bending point is generally set above the positive electrode of the LED chip 20. Since the distance between the positive electrode pad of the LED chip 20 and the edge of the chip is greater, the B bending point of the first wire arc 30 is set above the positive electrode, which can reduce the force under the neck of the wire arc, reduce the risk of breakage at the B bending point, and protect the wire arc.

[0103] In this embodiment, if Figure 3As shown, the distance between the C bending point and the edge of the LED chip 20 close to the A end is L3, and the distance between the C bending point and the edge of the LED chip 20 close to the D end is L4, wherein L3<L4, i.e., the C bending point is relatively closer to the A end, thereby reducing the amount of glue under the arc segment of the line from the B bending point to the C bending point, thereby reducing the force under the BC line arc segment.

[0104] In this embodiment, if Figure 3 As shown, the height H from the bending point B to the surface of the LED chip 20 is b For example, considering that the LED package needs a packaging lens, H b The value of can be 110-130 μm. For example, in order to reduce the difficulty of making the arc, H is preferably b The value range is 70-100μm. At the same time, the height of the B bending point can be reduced as much as possible, so that the overall colloid below the BC line arc segment is reduced, reducing the force below the BC line arc segment.

[0105] In this embodiment, the overlapping area between the solder ball of the first arc 30 and the chip electrode can be between 50% and 120% of the chip electrode area, preferably between 80% and 100%, which can ensure a firm soldering and a stable connection and prevent the solder ball from excessively blocking light. Figure 3 As shown, the distance L1 between the center of the welding point between the A end of the first arc 30 and the chip electrode and the edge of the current LED chip 20 can range from 20 to 500 μm, that is, the distance between the center of the solder ball between the first arc 30 and the positive electrode of the chip and the edge of the chip is 20 to 500 μm, preferably 70 to 200 μm.

[0106] Embodiment 3

[0107] This embodiment also provides an LED package, which is different from the first embodiment or the second embodiment in that, in addition to the first arc 30 connecting the chip electrodes of adjacent LED chips 20, this embodiment also provides a second arc 50 with a specific structural design.

[0108] Specifically, Figure 2 As shown, the die-bonding area 14 of the LED package of the present application includes a substrate electrode 15 arranged on the surface, and the LED package includes a second arc 50. The second arc 50 connects the chip electrode of the LED chip 20 at the edge of the bowl substrate 10 and the substrate electrode 15.

[0109] It should be noted that the bowl and cup substrate 10 includes a circuit layer 16 , which is disposed in the base 11 and led out from the bottom surface or the side surface, and the circuit layer 16 is electrically connected to the substrate electrode 15 .

[0110] In this embodiment, if Figure 4As shown, the two ends of the second arc 50 are respectively M and N, the M end is welded to the chip electrode of the LED chip 20, and the N end is welded to the substrate electrode 15. Between the M end and the N end of the second arc 50, the E bending point, the F bending point, and the G bending point are sequentially arranged.

[0111] The concave side of the E bending point faces downward, and the E bending point is located above the chip electrode welded at the M end.

[0112] Moreover, the concave side at the F bending point faces downward, the F bending point is located outside the edge of the LED chip 20, and the portion from the E bending point to the F bending point is higher than the upper surface of the LED chip 20, that is, the horizontal height of the F bending point is between the E bending point and the upper surface of the LED chip 20.

[0113] In addition, the concave side of the G bending point faces upward, and the portion from the G bending point to the N end is close to the upper surface of the substrate electrode 15 .

[0114] and Fig.12 Compared with the arc 02 connecting the chip 01 electrode and the substrate electrode, the second arc 50 of the present application is not a triangular arc, but presents an arc structure that is approximately "trapezoidal", which increases the strength of the arc structure, reduces the stress of the glue on the E bending point and the G bending point, and reduces the risk of breakage, that is, reduces the risk of disconnection between the second arc 50 and the LED chip 20, reduces the risk of disconnection with the substrate electrode 15, and increases the reliability and life of the second arc 50.

[0115] In this embodiment, if Figure 4 As shown, the distance from the F bending point of the second arc 50 to the edge of the LED chip 20 is L5, where the value range of L5 is 10-100 μm, preferably 40-60 μm. On the one hand, the length of the second arc 50 is increased to a certain extent, and the retractable space of the second arc 50 is increased to ensure that it can withstand periodic shearing and stretching, thereby reducing the risk of breakage; on the other hand, controlling the distance from the F bending point to the edge of the LED chip 20 can also control the overall colloid amount below the EF arc segment and reduce the force below the EF arc segment.

[0116] In this embodiment, if Figure 4 As shown, the length from the G bending point to the N end of the second arc 50 is L6, and the total length of the second arc 50 is W, where L6 = 5% to 50% * W, and preferably can be set to L6 = 10% to 30% * W. Such a setting can ensure that the part of the arc of the second arc 50 close to the N end forms a "ground-attached" structure, which can not only ensure the connection reliability, but also basically eliminate the force from the bottom of the G bending point. In addition, in this embodiment, the vertical distance from the G bending point to the surface of the substrate electrode 15 can be set to be less than 10μm. And in a further scheme, from the G bending point to the N end, the vertical distance to the surface of the substrate electrode 15 gradually decreases.

[0117] In this embodiment, if Figure 4 As shown, the height H from the bending point E to the surface of the LED chip 20 is e For example, considering that the LED package needs a packaging lens, H e The value of can be 110-130 μm. For example, in order to reduce the difficulty of making the arc, H is preferably e The value range is 70-100μm. At the same time, the height of the E bending point can be reduced as much as possible, so that the overall colloid under the EF line arc segment will not be too much, reducing the influence of the glue on the line arc.

[0118] In this embodiment, the overlapping area between the solder ball of the second arc 50 and the chip electrode can be between 50% and 120% of the chip electrode area, preferably between 80% and 100%, which can ensure a firm soldering and a stable connection and prevent the solder ball from excessively blocking light. Figure 4 As shown, the distance between the center of the welding point between the M end of the second arc 50 and the chip electrode and the edge of the current LED chip 20 can range from 20 to 500 μm, that is, the distance between the center of the solder ball between the second arc 30 and the positive electrode of the chip and the edge of the chip is 20 to 500 μm, preferably 70 to 200 μm.

[0119] Embodiment 4

[0120] This embodiment also provides an LED package. Different from the first, second and third embodiments, this embodiment only has a second arc 50 connecting the chip electrode and the substrate electrode, and does not have a first arc 30 connecting the electrodes of adjacent LED chips.

[0121] Specifically, Fig.11 and Fig.12 As shown, this embodiment provides an LED package having only one LED chip 20, including a bowl-cup substrate 10, an LED chip 20, a substrate electrode 15, a second arc 50 and a packaging glue layer 40. The bowl-cup substrate 10 includes a base 11 and a baffle 12, the baffle 12 surrounds the edge of the base 11, and forms a bowl-cup structure together with the base 11; a solid crystal region 14 is provided on the upper surface of the base 11. The LED chip 20 and the substrate electrode 15 are provided on the surface of the solid crystal region 14, the second arc 50 connects the chip electrode of the LED chip 20 and the substrate electrode 15, and the packaging glue layer 40 is filled in the bowl-cup structure of the bowl-cup substrate 10.

[0122] Among them, see Figure 4, the two ends of the second arc 50 are respectively the M end and the N end, the M end is welded to the chip electrode of the LED chip 20, and the N end is welded to the substrate electrode 15. The E bending point, F bending point, and G bending point are sequentially arranged between the M end and the N end of the second arc 50. The concave side at the E bending point faces downward, and the E bending point is located above the chip electrode welded to the M end. The concave side at the F bending point faces downward, and the F bending point is located outside the edge of the LED chip 20, and the portion from the E bending point to the F bending point is higher than the upper surface of the LED chip 20. The concave side of the G bending point faces upward, and the portion from the G bending point to the N end is close to the surface of the substrate electrode 15. In addition, the length from the G bending point to the N end of the second arc 50 is L6, and the total length of the second arc 50 is W, where the value of L6 can satisfy L6=(15%~25%)*W. For example, the value of L6 can be 17%*W, 19%*W, 20%*W, 21%*W, 23%*W. In addition, the length from the E bending point to the F bending point of the second arc 50 can be (20%-25%)*W, and the length from the F bending point to the G bending point of the second arc 50 can be (40%-45%)*W.

[0123] The second arc 50 is close to the surface of the substrate electrode 15 from the G bending point to the N end. This arrangement ensures that the part of the arc near the N end of the second arc 50 forms a relatively long "ground-attached" structure, which can not only ensure the connection reliability, but also basically eliminate the force from the bottom of the G bending point. In addition, the distance from the E bending point to the F bending point and the distance from the F bending point to the G bending point can also be guaranteed, so that the expansion space of the EF segment and the FG segment is larger, and can withstand periodic shearing and stretching, thereby reducing the risk of breakage.

[0124] In addition, the portion from the M end to the G bending point of the second wire arc 50 also presents an approximately "trapezoidal" wire arc structure, which increases the strength of the wire arc structure, reduces the stress of the glue on the E bending point and the G bending point, and reduces the risk of breakage, that is, reduces the risk of disconnection between the second wire arc 50 and the LED chip 20, reduces the risk of disconnection with the substrate electrode 15, and increases the reliability and life of the second wire arc 50.

[0125] In this embodiment, the distance from the bending point F of the second arc 50 to the edge of the LED chip 20 is L5, wherein the value range of L5 can be 10 to 100 μm, preferably 40 to 60 μm.

[0126] In this embodiment, the height H from the bending point E to the surface of the LED chip 20 is e No more than 150 μm. Preferably, it can be set to 110 to 130 μm, and more preferably H e The value range is 70~100μm.

[0127] In this embodiment, the vertical distance from the G bending point to the surface of the substrate electrode 15 can be set to be less than 10 μm. In a further embodiment, the vertical distance from the G bending point to the N end gradually decreases.

[0128] It should be noted that, in this embodiment, there may be only one or more LED chips 20. When there are multiple LED chips 20, the chip electrodes of each LED chip 20 are respectively connected to the corresponding substrate electrodes 15, and there is no situation where chip electrodes are connected to chip electrodes.

[0129] In summary, in the LED package structure of the first embodiment, since the strip-shaped bosses 13 are disposed between adjacent LED chips 20 , the amount of glue below the first arc 30 is reduced, thereby reducing the risk of deformation and breakage of the first arc 30 .

[0130] In the LED package structure of the second embodiment, the first arc 30 connecting adjacent LED chips 20 has its middle position close to the upper surface of the strip boss 13, forming a ground arc shape, thereby further reducing the amount of glue under the first arc 30 and further reducing the risk of deformation and breakage of the first arc 30.

[0131] In the LED package structure in Example 3 and Example 4, the second wire arc 50 connecting the chip electrode of the LED chip 20 and the substrate electrode 15 forms a ground electrode on the welding side with the substrate electrode 15, thereby increasing the connection reliability; and the second wire arc 50 forms an approximately "trapezoidal" wire arc structure with the chip electrode connection side, thereby increasing the wire arc strength and reducing the risk of deformation and breakage of the second wire arc 50.

[0132] The above description is only a partial embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An LED package, characterized in that: include: A bowl-cup substrate (10) comprises a base (11), a baffle (12) and a strip-shaped boss (13); the baffle (12) surrounds the edge of the base (11) and forms a bowl-cup structure together with the base (11); a plurality of spaced crystal-fixing areas (14) are arranged on the upper surface of the base (11); the strip-shaped boss (13) is arranged on the upper surface of the base (11), is located between adjacent crystal-fixing areas (14), and protrudes from the upper surface of the base (11); An LED chip (20) is arranged on the surface of the crystal fixing area (14); A first line arc (30) spans over the strip-shaped boss (13) and connects adjacent chip electrodes of adjacent LED chips (20); The packaging adhesive layer (40) is filled in the bowl-cup structure of the bowl-cup substrate (10).

2. The LED package according to claim 1, characterized in that: The two ends of the first wire arc (30) are respectively an A end and a D end, and the A end and the D end are respectively welded to adjacent chip electrodes of adjacent LED chips (20); A C bending point is provided between the A end and the D end, the concave side of the C bending point faces upward, and the C bending point is located above the strip-shaped boss (13).

3. The LED package according to claim 2, characterized in that: In a direction perpendicular to the upper surface of the LED chip (20), the projection of the C-bending point onto the upper surface of the strip-shaped boss (13) is located on the inner side of the upper surface edge of the strip-shaped boss (13).

4. The LED package according to claim 2, characterized in that: The height of the strip-shaped boss (13) is lower than the upper surface of the LED chip (20), and the height difference between the upper surface of the strip-shaped boss (13) and the upper surface of the LED chip (20) is H1; The minimum distance between the portion of the first arc (30) located on the upper side of the strip-shaped boss (13) and the upper surface of the strip-shaped boss (13) is H2, wherein the absolute value of the difference between H1 and H2 is not greater than 100 μm.

5. The LED package according to claim 4, characterized in that: The value of the height difference H1 between the upper surface of the strip-shaped boss (13) and the upper surface of the LED chip (20) is not greater than two-thirds of the thickness of the LED chip (20).

6. The LED package according to claim 2, characterized in that: The height difference H between the center of the D end of the first arc (30) and the center of the C bending point d The absolute value is not greater than 100um.

7. The LED package according to claim 2, characterized in that: The distance between the center of the welding point between the A end and the chip electrode and the edge of the current LED chip (20) is L1, and the distance between the center of the welding point between the D end and the chip electrode and the edge of the current LED chip (20) is L2, wherein L1>L2; A bending point B is arranged between the A end of the first arc (30) and the C bending point, the concave side of the bending point B faces downward, and the bending point B is located above the chip electrode welded to the A end.

8. The LED package according to claim 7, characterized in that: The distance between the C bending point and the edge of the LED chip (20) close to the A end is L3, and the distance between the C bending point and the edge of the LED chip (20) close to the D end is L4, wherein L3<L4.

9. The LED package according to claim 7, characterized in that: The height H from the bending point B to the surface of the LED chip (20) b Not more than 150μm.

10. The LED package according to any one of claims 1 to 9, characterized in that: The crystal-fixing area (14) includes a substrate electrode (15) arranged on the surface, and the LED package includes a second arc (50); The second line arc (50) connects the chip electrode of the LED chip (20) and the substrate electrode (15) at the edge of the bowl substrate (10).

11. The LED package according to claim 10, characterized in that: The two ends of the second wire arc (50) are respectively an M end and an N end, the M end is welded to the chip electrode of the LED chip (20), and the N end is welded to the substrate electrode (15); An E bending point, an F bending point, and a G bending point are sequentially arranged between the M end and the N end of the second arc (50); The concave side of the E bending point faces downward, and the E bending point is located above the chip electrode welded at the M end; The concave side of the F bending point faces downward, the F bending point is located outside the edge of the LED chip (20), and the portion from the E bending point to the F bending point is higher than the upper surface of the LED chip (20); The concave side of the G bending point faces upward, and the portion from the G bending point to the N end is close to the upper surface of the substrate electrode (15).

12. The LED package according to claim 11, characterized in that: The distance from the F bending point of the second arc (50) to the edge of the LED chip (20) is L5, wherein the value range of L5 is 10 to 100 um.

13. The LED package according to claim 11, characterized in that: The length from the G bending point to the N end of the second line arc (50) is L6, and the total length of the second line arc (50) is W, wherein L6=(5% to 50%)*W.

14. The LED package according to claim 11, characterized in that: The height H from the E bending point to the surface of the LED chip (20) e Not more than 150μm.

15. The LED package according to any one of claims 1 to 9, characterized in that: Both ends of the strip-shaped boss (13) extend in a direction close to the inner wall of the enclosure (12), and the end of the strip-shaped boss (13) is spaced from the inner wall of the enclosure (12).

16. The LED package according to claim 15, characterized in that: The end surface of the strip-shaped boss (13) facing the inner wall of the enclosure (12) is arranged as a slope surface or a vertical surface.

17. The LED package according to claim 10, characterized in that: The bowl and cup substrate (10) comprises a circuit layer (16), wherein the circuit layer (16) is arranged in the base (11) and is led out from the bottom surface or the side surface, and the circuit layer (16) is electrically connected to the substrate electrode (15).

18. An LED package, characterized in that: include: A bowl-cup substrate (10) comprises a base (11) and a surround (12), wherein the surround (12) surrounds the edge of the base (11) and forms a bowl-cup structure together with the base (11); a crystal-fixing area (14) is provided on the upper surface of the base (11); An LED chip (20) and a substrate electrode (15) are arranged on the surface of the crystal fixing area (14); A second arc (50) connects a chip electrode of the LED chip (20) and the substrate electrode (15); A packaging adhesive layer (40) is filled in the bowl-cup structure of the bowl-cup substrate (10); Wherein, the two ends of the second wire arc (50) are respectively an M end and an N end, the M end is welded to the chip electrode of the LED chip (20), and the N end is welded to the substrate electrode (15); An E bending point, an F bending point, and a G bending point are sequentially arranged between the M end and the N end of the second arc (50); The concave side of the E bending point faces downward, and the E bending point is located above the chip electrode welded to the M end; The concave side of the F bending point faces downward, the F bending point is located outside the edge of the LED chip (20), and the portion from the E bending point to the F bending point is higher than the upper surface of the LED chip (20); The concave side of the G bending point faces upward, and the portion from the G bending point to the N end is close to the upper surface of the substrate electrode (15); The length of the second line arc (50) from the G bending point to the N end is L6, and the total length of the second line arc (50) is W, wherein L6=(15%-25%)*W.

19. The LED package according to claim 18, characterized in that: The vertical distance from the G bending point to the surface of the substrate electrode (15) is less than 10 μm.

20. A light emitting device, characterized in that: The LED package comprises at least one LED package according to any one of claims 1 to 19, and further comprises a circuit substrate (200), wherein the LED package is arranged on the circuit substrate (200).

Images