Lens assembly and manufacturing method thereof, manufacturing method of light-emitting module and light-emitting module

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By using lens components that can be separated under target light in Mini COB products, batch transfer and setting of lenses are achieved, solving the problem of low production efficiency of Mini COB products, and improving the production efficiency and display contrast of the luminous module.

CN119521922APending Publication Date: 2025-02-25CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD

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Patent Information

Application Number: CN202311020563.2
Authority / Receiving Office: CN · China
Patent Type: Applications(China)
Current Assignee / Owner
Filing Date: 2023-08-14
Publication Date: 2025-02-25

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Abstract

The invention relates to a lens assembly and a manufacturing method thereof, a manufacturing method of a light-emitting module and the light-emitting module. The lens assembly comprises a substrate and a lens array formed on the substrate, the lens array comprises a plurality of mutually independent lenses, the lenses are used for being arranged corresponding to the light-emitting chips, and the sides, away from the substrate, of the lenses form inwards-concave surfaces; the lens can be separated from the substrate under irradiation of target light. When the lens assembly is used, the target light is adopted for irradiation, the corresponding lens can be separated from the lens substrate, therefore, lens transfer is achieved, simultaneous transfer of a large number of lenses can be achieved in some implementation processes, and the lens setting efficiency is greatly improved.

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Description

Technical Field

[0001] The present application relates to the field of light emitting technology, and in particular to a lens assembly and a manufacturing method thereof, a manufacturing method of a light emitting module, and a light emitting module. Background Art

[0002] Mini COB (Chips on Board) is a chip-level mounting solution that places higher technical requirements on key processes such as printing, die bonding, rework and packaging, as well as materials and equipment such as PCB (Printed Circuit Board), chips, packaging glue, jigs & equipment. In the future, as the technology maturity of each link in the industrial chain increases, its development prospects are great, and it is expected to be applied in all fields such as medical display, metaverse, and high-end atmosphere display decoration. In MiniCOB products, multiple light-emitting chips need to be operated. As the number of light-emitting chips increases, the production efficiency becomes lower and lower.

[0003] Therefore, how to improve the production efficiency of Mini COB products is an urgent problem to be solved. Summary of the invention

[0004] In view of the deficiencies of the above-mentioned related technologies, the purpose of the present application is to provide a lens assembly and a manufacturing method, a manufacturing method of a light-emitting module and a light-emitting module, aiming to solve the problem of low production efficiency of Mini COB products.

[0005] A lens assembly comprising:

[0006] substrate;

[0007] A lens array is formed on the substrate, the lens array includes a plurality of independent lenses, the lenses are used to be arranged corresponding to the light-emitting chips, and the side of the lenses away from the substrate forms a concave surface; the lenses can be separated from the substrate under the irradiation of target light.

[0008] By using the above lens assembly, a large number of lenses can be transferred simultaneously in some implementation processes, which greatly improves the efficiency of lens setting. In addition, the lenses on the lens assembly of this embodiment are independent of each other and can be selectively transferred, which can adapt to products of different specifications and has high compatibility.

[0009] Optionally, the lens includes a light shielding layer, and the light shielding layer is arranged in a region of the concave surface away from the substrate to block lateral light of the light-emitting chip.

[0010] When the lens is set above the light-emitting chip, the light from the side of the light-emitting chip is blocked, and the light is emitted at a smaller angle. In some implementation processes, it can alleviate the "halo" phenomenon of the light-emitting module and increase the display contrast when used for display.

[0011] Based on the same inventive concept, the present application also provides a method for manufacturing a lens assembly, comprising:

[0012] providing a substrate;

[0013] A lens array is formed on the substrate, the lens array includes a plurality of independent lenses, the lenses are used to be arranged corresponding to the light-emitting chips, and a side of the lenses away from the substrate forms a concave surface; the lenses can be separated from the substrate under the irradiation of target light.

[0014] The lens assembly manufactured by the above-mentioned lens assembly manufacturing method can realize the simultaneous transfer of a large number of lenses in some implementation processes, so that the efficiency of lens setting is greatly improved. In addition, the lenses on the lens assembly of this embodiment are independent of each other, and the lenses can be selectively transferred, which can adapt to products of different specifications and has high compatibility.

[0015] Optionally, the step of forming a lens array on the substrate includes:

[0016] A lens adhesive layer is arranged on the substrate, wherein the lens adhesive layer includes a colloid dispersed with a color conversion material, or a colloid arranged with a colloid dispersed with the color conversion material and a colloid without the color conversion material;

[0017] Providing a mold, wherein the mold is formed into a shape complementary to the lens array;

[0018] The lens adhesive layer is pressed together using the mold to form the lens array.

[0019] The lens array is formed by pressing the mold, which has a simple process and can directly form a large number of lenses.

[0020] Optionally, the step of forming a lens array on the substrate includes:

[0021] Disposing a lens adhesive layer on the substrate;

[0022] The transparent adhesive layer is etched by a gradient transparent photolithography plate to form a plurality of concave surfaces on a side of the lens adhesive layer away from the substrate;

[0023] Etching the lens adhesive layer between adjacent concave surfaces to form a plurality of independent lenses;

[0024] A color conversion material is disposed on the inner concave surface of the lens to form the lens array.

[0025] Through the photolithography process, higher processing precision can be achieved, the size of the lens can be made smaller, and the consistency of each lens formed is better. High-quality lenses can be formed in large quantities and transferred efficiently, thereby improving the overall efficiency and quality of manufacturing and setting lenses for light-emitting chips.

[0026] Based on the same inventive concept, the present application also provides a method for manufacturing a light-emitting module, comprising:

[0027] Providing the above-mentioned lens assembly;

[0028] Providing a circuit substrate provided with a light-emitting chip;

[0029] Placing the lens assembly opposite to the circuit substrate, and aligning the lens in the lens assembly with the corresponding light-emitting chip;

[0030] The lens to be transferred is separated from the substrate using target light to transfer the lens to the circuit substrate. The concave surface of the lens cooperates with the circuit substrate to form a receiving space, and the corresponding light-emitting chip is received in the receiving space.

[0031] The manufacturing method of the light-emitting module can realize the simultaneous transfer of a large number of lenses by utilizing the lens assembly, thereby providing high efficiency in lens arrangement and ensuring the production efficiency of the light-emitting module.

[0032] Based on the same inventive concept, the present application also provides a light-emitting module, a lens assembly and a circuit substrate provided with a light-emitting chip, wherein the light-emitting module is manufactured by the above-mentioned method for manufacturing the light-emitting module.

[0033] The light-emitting module has high manufacturing efficiency and high yield rate. The setting of the lens improves the light extraction efficiency of the light-emitting chip, so that the light-emitting module has higher brightness. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 The structure of the lens assembly provided in the embodiment of the present application is schematically shown in FIG. Figure 1 ;

[0035] Figure 2 The structure of the lens assembly provided in the embodiment of the present application is schematically shown in FIG. Figure 2 ;

[0036] Figure 3 The structure of the lens assembly provided in the embodiment of the present application is schematically shown in FIG. Figure 3 ;

[0037] Figure 4The structure of the lens assembly provided in the embodiment of the present application is schematically shown in FIG. Figure 4 ;

[0038] Figure 5 The structure of the lens assembly provided in the embodiment of the present application is schematically shown in FIG. Figure 5 ;

[0039] Figure 6 The structure of the lens assembly provided in the embodiment of the present application is schematically shown in FIG. Figure 6 ;

[0040] Figure 7 The structure of the lens assembly provided in the embodiment of the present application is schematically shown in FIG. Figure 7 ;

[0041] Figure 8 A schematic diagram of a process for manufacturing a lens assembly according to an embodiment of the present application;

[0042] Fig. 9 A schematic diagram of a process for forming a lens array provided in an embodiment of the present application;

[0043] Fig.10 A schematic diagram of setting a lens material layer provided in an embodiment of the present application;

[0044] Fig.11 Another schematic diagram of setting a lens material layer provided in an embodiment of the present application;

[0045] Fig.12 A schematic diagram of the structure of a mold provided in an embodiment of the present application;

[0046] Fig.13 A schematic diagram of mold pressing provided in an embodiment of the present application;

[0047] Fig.14 A schematic diagram of the process of photolithography lens material layer provided in an embodiment of the present application;

[0048] Fig.15 A schematic diagram of a process for photolithography of a lens material layer provided in an embodiment of the present application;

[0049] Fig.16 A schematic diagram of a color conversion material disposed on the surface of a lens material layer provided in an embodiment of the present application;

[0050] Fig.17 A schematic diagram of a process for forming a color conversion layer provided in an embodiment of the present application;

[0051] Fig.18 A schematic diagram of a process for forming a light shielding layer provided in an embodiment of the present application;

[0052] Fig.19A schematic diagram of a process for manufacturing a light-emitting module provided in an embodiment of the present application;

[0053] Fig. 20 A schematic diagram of a manufacturing process of a light-emitting module according to Example 1 provided in an embodiment of the present application;

[0054] Fig.21 A schematic diagram of a manufacturing process of a light-emitting module according to Example 2 provided in an embodiment of the present application;

[0055] Fig. 22 A schematic diagram of a manufacturing process of a light-emitting module according to Example 3 provided in an embodiment of the present application;

[0056] Fig.23 A schematic diagram of the manufacturing process of the light-emitting module of Example 4 provided in the embodiment of the present application; Description of the accompanying drawings:

[0057] 1-substrate; 2-lens; 21-colloid without color conversion material; 22-colloid with dispersed color conversion material; 3-color conversion layer; 31-green conversion layer; 32-red conversion layer; 4-shading layer; 41-shading material; 5-mold substrate; 6-mold; 7-circuit substrate; 71-metal wiring pattern; 72-adhesive layer; 81-blue light-emitting chip; 82-green light-emitting chip; 83-red light-emitting chip; 9-photoresist. DETAILED DESCRIPTION

[0058] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0059] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0060] The Mini COB products of the related art need to operate on multiple light-emitting chips during production. As the number of light-emitting chips increases, the production efficiency becomes lower and lower.

[0061] Based on this, the present application hopes to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in the subsequent embodiments.

[0062] This embodiment provides a lens assembly. Figure 1As shown, the lens assembly of this embodiment includes a substrate 1 and a lens array formed on the substrate 1. It should be noted that the substrate 1 is light-transmitting. The substrate 1 can be a transparent substrate, such as a glass substrate, or a translucent substrate, as long as it can allow the target light to be emitted. The target light can be a laser, etc.

[0063] Among them, the lens array includes multiple independent lenses 2, that is, these lenses 2 can be transferred and used individually. These lenses are used to be set corresponding to the light-emitting chip, which can improve the light extraction efficiency of the light-emitting chip. The lenses 2 in the lens assembly of this embodiment are not integrated into one to facilitate transfer as needed.

[0064] On the side of the lens 2 away from the substrate 1, an inner concave surface is formed, that is, the thickness of the lens 2 is thinner near its own center and thicker at a position away from its own center (that is, Figure 1 In this embodiment, the lens 2 forms an inner concave surface, so that the lens 2 can cooperate with the surface on which it is set to form an accommodation space. In actual use, the accommodation space can be used to accommodate the light-emitting chip, so that the light-emitting chip is covered by the lens 2. This allows the lens 2 to be manufactured independently of the light-emitting chip and then set on the light-emitting chip after the manufacturing is completed. In some implementation processes, the lens 2 can be set on the same plane as the light-emitting chip to reduce the overall thickness of the light-emitting module.

[0065] The concave surface can be a curved surface or other shapes. For example, in some embodiments, it can match the shape of the light emitting chip. In practical applications, the size of the lens 2 can be set according to the light emitting chip in the actual product to accommodate the light emitting chip between the lens 2 and the circuit substrate 7.

[0066] It is also worth noting that the lens 2 in this embodiment can be separated from the substrate 1 under the irradiation of the target light. The target light can be laser or ordinary light of a predetermined wavelength, etc. The target light can be to decompose the interface between the lens 2 and the substrate 1 so that the lens 2 at the corresponding position is separated from the substrate 1; in some examples, an adhesive material can also be provided between the lens 2 and the substrate 1, and the target light can also be to decompose or debond the adhesive material between the lens 2 and the substrate 1. When the adhesive material is irradiated by the target light, the lens 2 at the corresponding position can be separated from the substrate 1. When using the lens assembly, the target light is used to irradiate through the substrate 1, so that the corresponding lens 2 can be detached from the substrate, thereby realizing the transfer of the lens 2. In practical applications, the target light can irradiate multiple lenses 2, so that batches of lenses 2 can be transferred. Compared with the traditional method of forming the lens 2 by dispensing or placing the finished lenses 2 one by one, the lens assembly of this embodiment can realize the simultaneous transfer of a large number of lenses 2 in some implementation processes, so that the efficiency of setting the lens 2 is greatly improved. In addition, the lenses 2 on the lens assembly of this embodiment are independent of each other, and the lenses 2 can also be selectively transferred, which can adapt to products of different specifications and has high compatibility.

[0067] The material of lens 2 includes but is not limited to lens glue or other materials that can be made into lens 2. Lens 2 can be a single material or a mixture of multiple materials. As an example, lens 2 can be a colloid without optical material, and in some embodiments, lens 2 can also include optical material to achieve the desired optical design. Exemplarily, the optical material can include color conversion material, and the color conversion material can include but is not limited to phosphor and quantum dot materials, etc. The color conversion material can be directly mixed with the material forming lens 2 such as lens glue, so as to be evenly dispersed in lens 2, or it can be set as an independent layer in lens 2 or on the surface of lens 2. The color conversion material is used to convert the light of the light-emitting chip into other colors. For example, a blue light-emitting chip 81 can be used, and white light can be formed by color conversion material as a white backlight source. For example, the light of part of the blue light-emitting chip 81 in the pixel can be replaced by red light and green light by color conversion material to achieve full-color display. The light-emitting chip whose color is converted is not limited to the blue light-emitting chip 81, and light-emitting chips of other colors, such as green light-emitting chip 82 or red light-emitting chip 83, etc. are also possible. It can be understood that the optical material or optical material layer provided in the lens assembly may include more than one type to achieve multiple functions.

[0068] like Figure 2As shown, in some embodiments, the lens 2 may include a multilayer structure, which may include colloids 21 without color conversion materials and colloids 22 with dispersed color conversion materials that are alternately arranged. In this example, the colloid 21 without color conversion materials may be arranged on a side away from the substrate 1, and the colloid 22 with dispersed color conversion materials may be arranged on a side close to the substrate 1. When the lens 2 is arranged above the light-emitting chip, the colloid 21 without color conversion materials is closer to the light-emitting chip, and the colloid 22 with dispersed color conversion materials is relatively far away from the light-emitting chip. This can reduce the possible influence of the heat of the light-emitting chip when it is working on the performance of the color conversion material in some embodiments.

[0069] In other examples, the order of the colloid 21 without color conversion material and the colloid 22 with dispersed color conversion material can also be interchanged, and the number of layers of the colloid 21 without color conversion material and the colloid 22 with dispersed color conversion material can be greater, and the lens 2 is configured as an alternation of multiple layers of colloid. Figure 3 As shown, the lens 2 is opened from the substrate 1 and includes a colloid 21 without a color conversion material, a colloid 22 with dispersed color conversion material, and a colloid 21 without a color conversion material. Both sides of the colloid 22 with dispersed color conversion material are covered by the colloid 21 without a color conversion material, which can provide better protection for the layer.

[0070] In some embodiments, the color conversion material may be disposed on the surface of the lens 2. For example, see Figure 4 As shown, the color conversion material can be formed on the concave surface as an independent color conversion layer 3. After the structure of the lens 2 is manufactured, the color conversion material can be separately arranged to form the color conversion layer 3. The concave surface is formed into a concave shape, and its surface is usually more in line with the light emitting light type of the light emitting chip, and the distribution of light intensity is relatively uniform. Therefore, in some implementation processes, when the color conversion layer 3 is arranged on the concave surface or along the surface shape of the concave surface, a relatively uniform color conversion effect can be obtained, reducing the halo problem caused by uneven conversion.

[0071] In the lens assembly, a color conversion material may be provided, such as Figure 4 In some embodiments, the lenses 2 in a single lens assembly may also be formed into different structures, for example, different color conversion materials may be provided, or some may be provided with color conversion materials and some may not be provided with color conversion materials. As an example, see Figure 5In the example of, the lenses 2 on the lens assembly are circulated in groups of three, which are respectively lenses 2 without color conversion materials, lenses 2 with a first color conversion layer 3, and lenses 2 with a second color conversion layer 3, wherein the first color conversion layer 3 can convert the color of the light of the light emitting chip into a first color, and the second color conversion layer 3 can convert the color of the light of the light emitting chip into a second color, and the first color is different from the second color and is different from the color of the light of the light emitting chip itself. Each group of lenses 2 on the lens assembly can make the light emitting module emit three different colors to achieve a colorful display. Exemplarily, the light emitting chip can be a blue light emitting chip 81, and the first color conversion layer 3 and the second color conversion layer 3 can be a green conversion layer 31 and a red conversion layer 32, respectively, to convert blue light into green light and red light, respectively. Then the above-mentioned lens assembly can cooperate with the blue light emitting chip 81 to achieve full-color display, and in practical applications, the arrangement of the lens array on the lens assembly can match the arrangement of the light emitting chip, so that a large number of lenses 2 and the corresponding color conversion layers 3 can be set up in a single transfer to achieve full-color display.

[0072] The optical material on the lens 2 may also be a material that blocks or reflects light. In some embodiments, the lens 2 includes a light shielding layer 4, which shields part of the light from the light emitting chip, so that the light from the light emitting chip only emits from the unshielded area after passing through the lens 2, thereby changing the light emission of the light emitting chip. Figure 6 As shown, the shading layer 4 can be arranged on the concave surface away from the substrate 1 to block the lateral light of the light-emitting chip. When the lens 2 is arranged above the light-emitting chip, the light on the side of the light-emitting chip is blocked, and the light is emitted at a smaller angle. In some implementation processes, the "halo" phenomenon of the light-emitting module can be alleviated, and the display contrast can be increased when used for display. The shading layer 4 is arranged on the concave surface, and can be manufactured separately after the main body shape of the lens 2 is manufactured, and transferred to the circuit substrate 7 together with the lens 2. The manufacturing process is simple and easy to set up. As another example, more than one light material layer can be provided on the concave surface of the lens 2, for example Figure 7 As shown, the inner concave surface of the lens 2 may be provided with a light shielding layer 4 and a color conversion layer 3 at the same time, and the color conversion layer 3 may be provided in the area not covered by the light shielding layer 4 .

[0073] In the lens assembly, the shading layer 4 formed by each lens 2 may be the same. In some embodiments, the lenses 2 in a single lens assembly may also be formed with shading layers 4 of different forms, which can enable different light emitting chips to be configured with different light emission ranges and angles, and can meet some specific needs.

[0074] This embodiment also provides a method for manufacturing a lens assembly, see Figure 8As shown, including but not limited to the following steps:

[0075] S101, providing a substrate;

[0076] S102, forming a lens array on a substrate;

[0077] The formed lens array includes a plurality of independent lenses 2, the side of the lens 2 away from the substrate 1 forms an inner concave surface, and a color conversion material is arranged in the lens 2, and the color conversion material is used to convert the light of the light emitting chip into the light of the target color; the lens 2 can be separated from the substrate 1 under the irradiation of the target light. It should be noted that the lens assembly manufactured by the manufacturing method of the lens assembly of this embodiment can be the lens assembly exemplified in the above embodiment, and its specific structure, materials, etc. can refer to the above example of this embodiment.

[0078] In some embodiments, see Fig. 9 , forming a lens array on the substrate 1 comprises:

[0079] S201, providing a lens adhesive layer on the substrate;

[0080] The material of the lens 2 may be a glue material, that is, a lens glue; the lens glue layer may be disposed on the substrate 1 by processes including but not limited to coating, and the disposed lens glue layer may be a whole layer structure. When the lens 2 includes an optical material, some optical materials such as a color conversion material may be pre-mixed into the glue material, and the formed lens 2 is dispersed with the optical material as a whole; for example Fig.10 As shown, the lens adhesive layer can be made of a colloid 22 dispersed with a colored conversion material. It is also possible to alternately set more than one adhesive material when designing the lens adhesive layer, for example Fig.11 As shown, a layer of colloid 22 with dispersed color conversion material is firstly arranged on the substrate 1, and then a layer of colloid 21 without color conversion material is arranged on the substrate 1. After being pressed by the mold 6, for example, Figure 2 The structure of the lens 2 shown as an example or a similar structure.

[0081] S202, providing a mold, wherein the mold is formed into a shape complementary to the lens array;

[0082] As an example, Fig.12 As shown, the mold 6 can be made on the mold substrate 5. The mold 6 material is set on the mold substrate 5 and patterned into a desired structure. It can be made by methods including but not limited to photolithography, and the present application does not limit this.

[0083] S203, using a mold to press the lens adhesive layer to form a lens array;

[0084] like Fig.13The mold 6 presses the lens adhesive layer until it contacts the substrate 1 , and can squeeze the colloid on the lens adhesive layer into the cavity formed by the mold 6 and the substrate. Each cavity is isolated from each other to form an independent lens 2 .

[0085] The lens array is formed by pressing the mold 6. The process is simple and can directly form a large number of lenses. It is applicable to the case of using plastic or other plastic materials. For materials that cannot change shape freely, the lens array can also be formed by other graphical means such as etching.

[0086] As an example, the lens array can be formed by photolithography, and the photolithography process can be applicable to materials including but not limited to colloid, gallium nitride materials or other lens materials that can be etched. Fig.14 The process of photolithography to form a lens array includes but is not limited to:

[0087] S301, providing a lens adhesive layer on a substrate;

[0088] S302, etching the transparent adhesive layer by using a gradient transparent photomask to form a plurality of concave surfaces on a side of the lens adhesive layer away from the substrate;

[0089] See also Fig.15 As shown in (a), the colloid 22 with dispersed colored conversion material is still used as the lens material as an example. For other materials, the photolithography process is basically the same. First, a concave surface is formed on the lens adhesive layer by photolithography. At this time, the lens adhesive layer is still a whole, and array-arranged pits are formed on it.

[0090] In this step, the photoresist 9 may be a photoresist 9 with a relatively high silicon content, such as BCB (benzocyclobutene) glue.

[0091] S303, etching the lens adhesive layer between adjacent concave surfaces to form a plurality of independent lenses;

[0092] See also Fig.15 (b), the lens material between the pits is etched to the bottom, so that the pits are separated to form independent lenses 2. The photoresist 9 in this step can be selected to have a lower silicon content, so as to perform better etching.

[0093] Through the photolithography process, higher processing precision can be achieved, the size of the lens 2 can be made smaller, and the consistency of each lens 2 formed is better. High-quality lenses 2 can be formed in large quantities and transferred efficiently, thereby improving the overall efficiency and quality of manufacturing and setting lenses 2 for light-emitting chips.

[0094] The photolithography can be divided into two stages, respectively forming pits on the lens material layer and dividing each pit into an independent lens 2, and using photoresists 9 with different silicon contents in different stages can form more accurately and ensure the accuracy of the lens 2. S304, arranging a color conversion material on the inner concave surface of the lens to form a lens array;

[0095] After the concave surface is formed, the execution order of the above step S304 is not limited. For example, in some embodiments, between steps S302 and S303, a step of setting other structures on the concave surface may also be included. Fig.16 As shown, after forming a pit on the lens material layer, a color conversion material can be set on the surface, such as a colloid material or quantum dot material mixed with fluorescent powder, to form a color conversion layer 3 on the surface of the lens 2. In such an embodiment, the material of the lens 2 itself can be a colloid 21 without a color conversion material or a material such as gallium nitride that is not convenient to be pre-mixed with other optical materials, that is, optical materials such as color conversion materials can be unmixed. Similarly, the material of the light shielding layer 4 can also be set in the manner of this example and patterned in a subsequent process.

[0096] In some embodiments, after the outer shape of the lens is formed, other optical structures can be continuously fabricated on the inner concave surface. For example, in some embodiments, the color conversion material is not mixed into the main body of the lens 2, and the color conversion layer 3 can be fabricated separately on the surface of the lens 2. Fig.17 (a) and Fig.17 (b), after the lens 2 is formed, a first color conversion material is disposed on one side of the inner concave surface, and then the first color conversion material in the remaining area is removed by etching or the like, and the first color conversion material on part of the lens 2 is not removed and serves as the first color conversion layer 3. Fig.17 (c), in the same manner, a second color conversion material is provided on one side of the inner concave surface, and the second color conversion material in the remaining area is removed, and the second color conversion material on part of the lens 2 is not removed and serves as the second color conversion layer 3. This method can form a variety of different lenses 2 in a single lens assembly, and in some implementation processes can simultaneously meet the requirements of the light-emitting module for a variety of lenses 2.

[0097] In some embodiments, after the step of forming the lens array on the substrate 1, the method further includes providing a light shielding layer 4 on the concave surface of the lens 2 by a photolithography process, wherein the light shielding layer 4 is provided in a region of the concave surface away from the substrate 1. For example, see Fig.18 (a) and Fig.18(b), after the lens 2 is formed, a layer of shading material 41 is provided on the concave surface. The shading material 41 can be partially removed by photolithography or other processes. In this example, the shading material 41 in the central area of the concave surface (i.e., the area relatively close to the substrate 1) is removed, and the surrounding shading material 41 (i.e., the area relatively far from the substrate 1) is retained as the shading layer 4. The shading layer 4 of the desired pattern can be formed on an uneven surface by the photolithography process, and the patterning accuracy is high. A high-precision shading pattern can also be formed on a smaller lens 2, so that the light emission consistency of each light-emitting chip of the manufactured light-emitting product is better and the yield rate is higher.

[0098] The manufacturing method of the lens assembly of this embodiment can form a peelable lens array on the substrate 1. When the lenses 2 are arranged, the manufactured lenses 2 can be transferred in batches by irradiation with target light, thereby improving production efficiency.

[0099] In addition, this embodiment also provides a method for manufacturing a light emitting module, see Fig.19 As shown, the manufacturing method of the light-emitting module includes but is not limited to:

[0100] S401, providing a lens assembly;

[0101] It should be noted that the lens assembly provided in this step is the lens assembly exemplified above, that is, the provided lens assembly at least includes a substrate 1 and a lens array formed on the substrate 1, the lens array includes a plurality of independent lenses 2, the side of the lens 2 away from the substrate 1 forms an inner concave surface, and can be separated from the substrate 1 under the irradiation of the target light.

[0102] S402, providing a circuit substrate provided with a light-emitting chip;

[0103] The circuit substrate 7 includes but is not limited to a PCB circuit board, or a glass substrate. A light-emitting chip is provided on the circuit substrate 7, and the light-emitting chip can be arranged in an array on the circuit substrate 7. In the present application, the light-emitting chip can be a Mini LED chip, a Micro LED (Micro Light Emitting Diode) chip or other light-emitting chip. The light-emitting chips arranged on the circuit substrate 7 can be of the same color or of different colors. For example, the light-emitting chips can all be blue light-emitting chips 81, and the blue light-emitting chip 81 emits blue light, which can be converted into white light through a color conversion material to achieve white backlight, or for lighting; green light and red light can also be obtained through a color conversion material, and a full-color display can be achieved in combination with unconverted blue light; for example, the light-emitting chip can include a blue light-emitting chip 81, a green light-emitting chip 82 and a red light-emitting chip 83, and a full-color display can be directly achieved without a color conversion layer 3. For applications requiring a color conversion material, the color conversion material can be arranged on the lens 2 of the lens assembly. When the lens 2 is transferred to the circuit substrate 7, the arrangement of the color conversion material is completed at the same time, and since the lens 2 on the lens assembly can be transferred in batches, the setting accuracy is high and the efficiency is fast.

[0104] S403, placing the lens assembly and the circuit substrate opposite to each other;

[0105] The lens assembly can be in contact with the circuit substrate 7, and in some implementations, it can be placed above the circuit substrate 7 without contact. When the lens 2 is separated from the lens assembly, the lens 2 can be fixed on the circuit substrate 7 or fall onto the circuit substrate 7. It should be understood that the lens 2 in the lens assembly is aligned with the light-emitting chip, that is, the lens 2 to be transferred is directly opposite to the light-emitting chip. In practical applications, the lenses 2 transferred at a single time can be all of the lens assembly, or a part of them can be selectively transferred. For example, the arrangement density of the lenses 2 on the lens assembly can be higher than the density of the light-emitting chip, or more than one lens 2 needs to be arranged on a single circuit substrate 7. In this case, when transferring, only some of the lenses 2 in the lens assembly need to be transferred at intervals.

[0106] S404, using target light to separate the lens to be transferred from the substrate, so as to transfer the lens to the circuit substrate;

[0107] The light-transmitting substrate 1 allows the target light to penetrate and illuminate the combined portion of the lens 2 and the substrate 1. The combined portion of the lens 2 and the substrate 1 may be a lens material or may be provided with a separate adhesive material. In practical applications, the target light may selectively illuminate different areas to achieve selective transfer of the lens 2, or may directly illuminate the entire area to transfer all the lenses 2 in the corresponding area. However, it is understandable that, whether it is selective irradiation or irradiation of the entire area, a large number of lenses 2 can be separated in a short time, achieving batch transfer of lenses 2, and greatly improving the production efficiency of the product.

[0108] For better understanding, the present embodiment will now describe the process of manufacturing the light emitting module in combination with specific examples:

[0109] Example 1:

[0110] See also Fig. 20 (a) Provide a circuit substrate 7, and form a metal wiring pattern 71 on the circuit substrate 7. The metal wiring pattern 71 can be formed by processes such as evaporation and photolithography, and the present application does not limit this. In this example, a glass substrate can be used as the circuit substrate 7, which can improve the flatness and has an advantage in substrate cost. In order to better fix the lens 2, an adhesive layer 72 can be provided on the circuit substrate 7, and the adhesive layer 72 can be a sticky material such as an adhesive glue; in some examples, the lens 2 itself may also have stickiness, so an additional adhesive layer 72 may not be provided, and the fixation of the lens 2 on the circuit substrate 7 is achieved by the stickiness of the lens 2 itself.

[0111] See also Fig. 20 (b) A blue light emitting chip 81 is arranged on the circuit substrate 7. The blue light emitting chip 81 may be a Mini LED chip or a Micro LED chip. If it is a Mini LED chip, it may be transferred to the circuit substrate 7 by laser welding or pick & place; if it is a Micro LED chip, it may be transferred to the circuit substrate 7 by mass transfer or other methods.

[0112] See also Fig. 20 (c) Provide the aforementioned lens assembly. The lens 2 of the lens assembly provided in this example is mixed with a phosphor material. The phosphor material can be excited by blue light to produce other light, and after mixing with the original blue light, it forms white light to achieve the conversion of blue light to white light. In addition, the lens 2 of this example is also provided with a light shielding layer 4 on its concave surface, which is used to block lateral light. The lens assembly can be directly placed on the circuit substrate 7 and fixed to the adhesive layer 72 on the circuit substrate 7; the lens 2 and the circuit substrate 7 form a accommodating space to accommodate the light-emitting chip, and the concave surface of the lens 2 faces the light-emitting chip and serves as the light incident surface for the light of the light-emitting chip to enter.

[0113] See also Fig. 20 (d), the substrate 1 is peeled off, and the lenses 2 are left on the circuit substrate 7. The light-emitting module obtained at this time has a higher light extraction efficiency due to the provision of the lenses 2, and the phosphor in the lenses 2 cooperates with the blue light-emitting chip 81 to realize white light; the light-shielding layer 4 in the lens 2 is on both sides of the light-emitting chip, close to the circuit substrate 7, which can reduce the light output around the light-emitting chip, reduce the "halo" phenomenon during display, and increase the contrast.

[0114] In this example, the lens 2 is formed on the substrate 1, and the side thereof close to the substrate 1 (that is, the side disposed on the circuit substrate 7 and away from the circuit substrate 7) is in a planar form. A layer of photoresist 9 may be disposed on the side of the lens 2 away from the circuit substrate 7, and the photoresist 9 between the lenses 2 may be separated by exposure. Fig. 20 (e) The photoresist 9 may be hard-baked to shrink it into a curved surface, such as a hemispherical shape.

[0115] See also Fig. 20 (f), by dry etching the aforementioned structure (the selection ratio can be set between 0.9-1.1, such as 0.9, 0.95, 1, 1.05, etc.), the arc surface shape of the photoresist 9 is copied to the lens 2, so that the surface of the lens 2 away from the circuit substrate 7 is formed into an arc. It can be understood that in other examples, the surface shape of the lens 2 may not be adjusted, or the lens 2 may be formed into other shapes. By setting the surface shape of the lens 2, the light type of the emitted light can be adjusted in some implementation processes.

[0116] Example 2:

[0117] See also Fig.21 (a) A circuit substrate 7 is provided, and a metal wiring pattern 71 is formed on the circuit substrate 7. The metal wiring pattern 71 can be formed by evaporation, photolithography, etc., and the present application does not limit this. In this example, a glass substrate can be used as the circuit substrate 7, which can improve the flatness and has an advantage in substrate cost.

[0118] See also Fig.21 (b) A blue light emitting chip 81 is provided on the circuit substrate 7.

[0119] See also Fig.21 (c) An adhesive material is provided, which can cover the blue light-emitting chip 81 or be flush with the surface of the blue light-emitting chip 81 on the side away from the circuit substrate 7. The adhesive material is used to fix the lens 2. A thicker adhesive material can also provide better fixing ability.

[0120] See also Fig.21(d) A lens assembly is provided, wherein the lenses 2 on the lens assembly are circulated in groups of three, namely, a lens 2 without a color conversion material, a lens 2 with a first color conversion layer 3, and a lens 2 with a second color conversion layer 3. The first color conversion layer 3 and the second color conversion layer 3 can be a green conversion layer 31 and a red conversion layer 32, respectively, to convert blue light into green light and red light, respectively. The lens assembly can be directly placed on the circuit substrate 7 and fixed with the adhesive layer 72 on the circuit substrate 7. In this example, both sides of the lens 2 are adhered by the adhesive layer 72, and the fixing strength is higher; the lens 2 and the circuit substrate 7 form a accommodating space to accommodate the light-emitting chip, and the concave surface of the lens 2 faces the light-emitting chip and serves as the light-entering surface of the light-emitting chip. The arrangement of the upper lens array of the lens assembly in this example corresponds to the arrangement of the light-emitting chip, and each lens 2 can be transferred to the circuit substrate 7 at one time. The circuit substrate 7 can simultaneously form blue, green and red light-emitting units, and three adjacent light-emitting chips can form a pixel.

[0121] See also Fig.21 (e), the substrate 1 is peeled off, and the lenses 2 are left on the circuit substrate 7. The light-emitting module obtained at this time has a higher light extraction efficiency due to the lens 2, and the lens 2 and the color conversion layer 3 can be set by a single transfer, so that full-color display is achieved with high production efficiency.

[0122] Example 3:

[0123] See also Fig. 22 (a) A circuit substrate 7 is provided, and a metal wiring pattern 71 is formed on the circuit substrate 7. The metal wiring pattern 71 can be formed by evaporation, photolithography, etc., and the present application does not limit this. In this example, a glass substrate can be used as the circuit substrate 7, which can improve the flatness and has an advantage in substrate cost.

[0124] See also Fig. 22 (b) A blue light-emitting chip 81, a green light-emitting chip 82 and a red light-emitting chip 83 are arranged on the circuit substrate 7. Three adjacent light-emitting chips can be used as a pixel. The circuit substrate 7 can include multiple pixels to achieve full-color display.

[0125] See also Fig. 22 (c) A lens assembly is provided, wherein the lenses 2 on the lens assembly are not provided with color conversion materials. The lens assembly can be directly placed on the circuit substrate 7 and fixed to the adhesive layer 72 on the circuit substrate 7; the lens 2 and the circuit substrate 7 form a housing space to accommodate the light-emitting chip, and the inner concave surface of the lens 2 faces the light-emitting chip and serves as the light-entering surface for the light of the light-emitting chip. In this example, the lens 2 itself has a certain viscosity, so an additional adhesive layer 72 may not be provided, and the lens 2 and the circuit substrate 7 are fixed together by the viscosity of the lens 2 material itself.

[0126] See also Fig. 22 (d), the substrate 1 is peeled off, and the lenses 2 are left on the circuit substrate 7. The light-emitting module obtained at this time has a higher light extraction efficiency due to the lens 2, and the lens 2 and the color conversion layer 3 can be set by a single transfer, so that full-color display is achieved with high production efficiency.

[0127] Example 4:

[0128] A circuit substrate 7 is provided, and a metal wiring pattern 71 is formed on the circuit substrate 7. The metal wiring pattern 71 can be formed by processes such as evaporation and photolithography, and the present application does not limit this. In this example, a glass substrate can be used as the circuit substrate 7, which can improve the flatness and has an advantage in substrate cost. A blue light-emitting chip 81 is arranged on the circuit substrate 7.

[0129] See also Fig.23 (a) A first lens assembly is provided, wherein the lenses 2 on the lens assembly are not provided with color conversion materials. The first lens assembly can be placed above the circuit substrate 7 but not in contact with the circuit substrate 7. Of course, each lens 2 in the first lens assembly is still aligned with the light-emitting chip.

[0130] See also Fig.23 (b) Part of the lenses 2 on the first lens assembly are transferred to the circuit substrate 7. For example, by selectively irradiating the target light, the corresponding lenses 2 can be separated from the first lens assembly and dropped onto the circuit substrate 7. In this example, one lens 2 is transferred every two blue light-emitting chips 81.

[0131] See also Fig.23 (c) A second lens assembly is provided, wherein the lenses 2 on the lens assembly are all provided with a green conversion layer 31. The second lens assembly can be placed above the circuit substrate 7 but not in contact with the circuit substrate 7. Of course, each lens 2 in the second lens assembly is still aligned with the light-emitting chip.

[0132] See also Fig.23 (d) transferring part of the lens 2 on the second lens assembly to the circuit substrate 7. For example, by selectively irradiating the target light, the corresponding lens 2 can be separated from the second lens assembly and dropped onto the circuit substrate 7. In this example, a lens 2 provided with a green conversion layer 31 is transferred every two blue light-emitting chips 81.

[0133] See also Fig.23 (e) A third lens assembly is provided, wherein the lenses 2 on the lens assembly are all provided with a red conversion layer 32. The third lens assembly can be placed above the circuit substrate 7 but not in contact with the circuit substrate 7. Of course, each lens 2 in the third lens assembly is still aligned with the light-emitting chip.

[0134] See also Fig.23 (e) Transfer some lenses 2 on the third lens assembly to the circuit substrate 7. Exemplarily, by selective irradiation of the target light, the corresponding lenses 2 can be separated from the third lens assembly and dropped onto the circuit substrate 7. In this example, a lens 2 provided with a red conversion layer 32 is transferred every two blue light-emitting chips 81. At this time, the positions of all blue light-emitting chips 81 on the circuit substrate 7 are transferred with corresponding lenses 2, and every three adjacent blue light-emitting chips 81 and their lenses 2 can provide a full-color display. In each lens assembly in this example, the lenses 2 formed thereon are all the same, and each lens assembly is more efficient and convenient to manufacture. By selectively transferring one by one, a full-color product with different lenses 2 on the circuit substrate 7 can still be manufactured.

[0135] The present embodiment also provides a light-emitting module, which includes a lens assembly and a circuit substrate 7 provided with a light-emitting chip, and the light-emitting module is made by the method for making the light-emitting module exemplified in the present embodiment. The lens 2 of the light-emitting module of the present embodiment can be set by batch transfer, and in some implementation processes, the production efficiency is high and the yield rate is high. The setting of the lens 2 improves the light extraction efficiency of the light-emitting chip, so that the light-emitting module has a higher brightness; in some embodiments, optical materials such as color conversion materials or shading materials 41 can also be set in the lens 2 at the same time, and are set on the circuit substrate 7 together with the lens 2 to provide better optical visual effects. The light-emitting module includes but is not limited to a display panel capable of displaying, and can also be a light source without a display function, such as a light-emitting backplane.

[0136] It should be understood that the application of the present application is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A lens assembly, characterized in that: include: a substrate, the substrate being light-transmissive; A lens array is formed on the substrate, the lens array includes a plurality of independent lenses, the lenses are used to be arranged corresponding to the light-emitting chips, and the side of the lenses away from the substrate forms a concave surface; the lenses can be separated from the substrate under the irradiation of target light.

2. The lens assembly according to claim 1, wherein: The lens comprises a light shielding layer, and the light shielding layer is arranged in a region of the inner concave surface away from the substrate to block the lateral light of the light emitting chip.

3. The lens assembly according to claim 1, wherein: The lens includes a color conversion material, and the color conversion material is arranged in the lens or on the inner concave surface to convert the light of the light emitting chip into other colors.

4. The lens assembly according to any one of claims 1 to 3, characterized in that: The inner concave surface is a curved surface or a shape matching the light emitting chip.

5. A method for manufacturing a lens assembly, characterized in that: include: providing a substrate; A lens array is formed on the substrate, the lens array includes a plurality of independent lenses, the lenses are used to be arranged corresponding to the light-emitting chips, and a side of the lenses away from the substrate forms a concave surface; the lenses can be separated from the substrate under the irradiation of target light.

6. The method for manufacturing a lens assembly according to claim 5, characterized in that: The step of forming a lens array on the substrate comprises: A lens adhesive layer is arranged on the substrate, wherein the lens adhesive layer includes a colloid dispersed with a color conversion material, or a colloid dispersed with the color conversion material and a colloid not provided with the color conversion material arranged alternately; Providing a mold, wherein the mold is formed into a shape complementary to the lens array; The lens adhesive layer is pressed together using the mold to form the lens array.

7. The method for manufacturing a lens assembly according to claim 5, wherein: The step of forming a lens array on the substrate comprises: Disposing a lens adhesive layer on the substrate; Etching the transparent adhesive layer by using a gradient transparent photolithography plate to form a plurality of concave surfaces on a side of the lens adhesive layer away from the substrate; Etching the lens adhesive layer between adjacent concave surfaces to form a plurality of independent lenses; A color conversion material is disposed on the inner concave surface of the lens to form the lens array.

8. The method for manufacturing a lens assembly according to any one of claims 5 to 7, characterized in that: After the step of forming a lens array on the substrate, the method further comprises: A light shielding layer is arranged on the inner concave surface of the lens by a photolithography process, and the light shielding layer is arranged in a region of the inner concave surface away from the substrate.

9. A method for manufacturing a light emitting module, characterized in that: include: Providing a lens assembly according to any one of claims 1 to 4; Providing a circuit substrate provided with a light-emitting chip; Placing the lens assembly opposite to the circuit substrate, and aligning the lens in the lens assembly with the corresponding light-emitting chip; The lens to be transferred is separated from the substrate using target light to transfer the lens to the circuit substrate. The concave surface of the lens cooperates with the circuit substrate to form a receiving space, and the corresponding light-emitting chip is received in the receiving space.

10. A light emitting module, characterized in that: The light-emitting module comprises a lens assembly and a circuit substrate provided with a light-emitting chip, and the light-emitting module is manufactured by the manufacturing method of the light-emitting module as claimed in claim 9.