Automatic cleaning equipment and cleaning method for semiconductor vacuum cavity pipeline

Abstract

The invention discloses automatic cleaning equipment and a cleaning method for a semiconductor vacuum cavity pipeline, and relates to the technical field of pipeline cleaning technologies, the automatic cleaning equipment comprises a soaking tank, a spraying cleaning mechanism and a high-pressure flushing mechanism, the spraying cleaning mechanism comprises a spraying tank capable of communicating with the soaking tank, and a spraying assembly is arranged in the spraying tank; the high-pressure flushing mechanism comprises a flushing tank capable of communicating with the spraying tank and a high-pressure flushing assembly arranged in the flushing tank, the high-pressure flushing assembly comprises a first high-pressure flushing part and a plurality of second high-pressure flushing parts, and the second high-pressure flushing parts are located on the peripheral side of the pipeline; the first high-pressure flushing part is used for being arranged in a pipeline in a penetrating mode, and the first high-pressure flushing part and the second high-pressure flushing part can spray out high-pressure water. The driving mechanism is used for driving the pipeline to move, and the first high-pressure flushing part and the pipeline can rotate relatively. The pipeline cleaning device has the effect of better cleaning the interior of the pipeline.

Description

Technical Field

[0001] The present application relates to the technical field of pipeline cleaning technology, and in particular to an automatic cleaning device and a cleaning method for semiconductor vacuum chamber pipelines. Background Art

[0002] In the production process of semiconductor devices, cleaning of vacuum chamber pipes is a key link to ensure production quality and equipment performance.

[0003] Conventional cleaning equipment usually includes a loading device, a soaking tank, a spray cleaning device, a high-pressure flushing device, a compressed air drying device and a unloading device. The loading device is used to load the pipe to be cleaned into the soaking tank. After soaking in the cleaning agent for a period of time, it is successively transferred to the spray cleaning device for spraying and the high-pressure flushing device for high-pressure cleaning. After cleaning, it is blown dry and unloaded.

[0004] Although the above-mentioned cleaning equipment adopts the method of immersion and flushing, the surface of the pipeline is mainly cleaned during the flushing process, and the cleaning ability of the inside of the pipeline is poor, which needs further improvement. Summary of the invention

[0005] In order to better clean the inside of a pipeline, the present application provides an automatic cleaning device and a cleaning method for a semiconductor vacuum chamber pipeline.

[0006] In a first aspect, the present application provides an automatic cleaning device for semiconductor vacuum chamber pipelines, which adopts the following technical solution: An automatic cleaning device for semiconductor vacuum chamber pipelines, comprising an immersion tank, a spray cleaning mechanism and a high-pressure flushing mechanism, wherein the spray cleaning mechanism comprises a spray tank that can be connected to the immersion tank, and a spray component is arranged in the spray tank; The high-pressure flushing mechanism includes a flushing tank that can be connected to the spray tank, and a high-pressure flushing assembly arranged in the flushing tank, the high-pressure flushing assembly includes a first high-pressure flushing member and a plurality of second high-pressure flushing members, the plurality of second high-pressure flushing members are located around the pipeline, the first high-pressure flushing member is used to penetrate the inside of the pipeline, and the first high-pressure flushing member and the second high-pressure flushing member can spray high-pressure water; The driving mechanism is used to drive the pipeline to move, and the first high-pressure flushing member and the pipeline can rotate relatively.

[0007] By adopting the above technical solution, the pipe is soaked in the soaking liquid in the soaking tank, so that impurities attached to the inner and outer walls of the pipe are separated from the pipe, loosened or even reacted with the soaking liquid; the soaked pipe enters the spray chamber, and the spray assembly sprays the spray liquid to remove the impurities and soaking liquid attached to the pipe; the pipe after spraying enters the flushing tank, at which time the second high-pressure flushing component can spray high-pressure water to flush the outer wall of the pipe, and the first high-pressure flushing component is located inside the pipe to flush the inner wall of the pipe; because the first high-pressure flushing component can rotate relative to the pipe, and the pipe can be moved by the driving mechanism, the first high-pressure flushing component and the second high-pressure flushing component can flush different positions of the pipe, thereby improving the cleaning efficiency.

[0008] Optionally, it includes a working tank, which is divided into the soaking tank, the spraying tank and the rinsing tank by a partition; A first movable opening is provided at the bottom of the side wall of the spray tank close to the soaking tank, and a first opening and closing door is provided which can be moved to open and close the first movable opening; A second movable opening is provided at the bottom of the side wall of the spray tank close to the flushing tank, and a second opening and closing door which can be moved to open and close the second movable opening is provided.

[0009] By adopting the above technical solution, the soaking tank, the spraying tank and the rinsing tank are arranged adjacent to each other in sequence, which can facilitate the transfer of the pipeline while greatly reducing the space occupied, reducing the possibility of liquid leakage and reducing transportation costs. The pipeline located at the bottom of the soaking tank with the longest soaking time can be transferred through the opened first movable port, and the pipeline that has been sprayed can be transferred through the opened second movable port. When the first movable port is closed through the first opening and closing door, the leakage of the liquid in the soaking tank can be reduced. When the second movable port is closed through the second opening and closing door, the influence of the spray liquid sprayed by the spray assembly on the pipelines in other chambers can also be reduced.

[0010] Optionally, the working pool includes a top plate, and a liquid inlet pipe located at the top of the immersion tank is provided on the top plate; A plurality of partition chambers for accommodating pipes are formed in the soaking tank along the vertical direction by partition members. The partition members abut against the pipes and can move so that the pipes can move into the partition chambers at the bottom.

[0011] By adopting the above technical solution, when the first opening and closing door is opened, so that the first moving port is opened, part of the soaking liquid and impurities precipitated at the bottom of the soaking tank will enter the spray tank through the first moving port, and the soaking liquid can be added to the soaking tank through the liquid inlet pipe. The soaking tank is divided into multiple partition chambers by setting partitions, and different partition chambers can be used to place a pipeline to be cleaned, so that adjacent pipelines are not easy to contact and collide with each other, reducing damage to the pipeline. When in use, the partitions are moved from bottom to top in sequence, thereby realizing the movement of each pipeline, keeping the soaking time and soaking environment of each pipeline the same or similar.

[0012] Optionally, the partition includes a first partition for separating the soaking tank and the spraying tank, the first partition is slidably connected to the bottom of the working pool and can be locked after movement, and the first moving opening is opened at the bottom of the side wall of the first partition.

[0013] By adopting the above technical solution, the first partition separates the soaking tank and the spray tank, and the first partition can be moved and locked, so that the overall width of the separation chamber can be adjusted to adapt to the use of pipes of different diameters, thereby greatly improving the applicability of the automatic cleaning equipment.

[0014] Optionally, the partition includes a second partition for separating the spray tank and the rinse tank, the second movable port is opened at the bottom of the side wall of the second partition, and the spray assembly includes a rotating spray head arranged on the second partition.

[0015] By adopting the above technical solution, the second partition separates the flushing tank and the spray tank, and the spray assembly is arranged at the bottom of the side wall of the second partition to maintain a specific spraying position and reduce the impact on other structures. The spray assembly includes a rotatable rotating nozzle, so that the spray assembly can spray different positions of the pipeline and even spray the inside of the pipeline through the end of the pipeline to reduce the adhesion of the soaking liquid and impurities.

[0016] Optionally, the second high-pressure flushing component is arranged in the flushing tank, and two relative mounting frames are arranged in the flushing tank. Internal flushing pipes are arranged on the facing surfaces of the two mounting frames, and the axes of the two internal flushing pipes coincide or are parallel. The first high-pressure flushing component is arranged at one end of the internal flushing pipe away from the mounting frame, and the internal flushing pipe is vertically slidably connected to the mounting frame.

[0017] By adopting the above technical solution, when the pipeline enters the spray tank, one of the inner flushing pipes can be slid so that the two inner flushing pipes are offset, and the pipeline can be coaxial with one of the inner flushing pipes. At this time, after the driving component drives the pipeline to move partially outside one inner flushing pipe, the other inner flushing pipe can be reset. The driving component can drive the pipeline to be simultaneously mounted on the outside of the two inner flushing pipes and keep moving. The two first high-pressure flushing parts can flush different positions of the inner wall of the pipeline at the same time, basically achieving full coverage flushing of the inner and outer walls of the pipeline.

[0018] Optionally, a long groove is formed on the bottom wall of the flushing tank, and the driving mechanism includes a telescopic rod located in the long groove and capable of being extended and retracted, and the telescopic direction of the telescopic rod is a vertical direction; The driving mechanism also includes a slide rail located at the bottom of the telescopic rod. The telescopic rod can move along the length direction of the slide rail through a moving block. A clamping assembly for clamping the pipe is provided at the top of the telescopic rod. The length direction of the slide rail is parallel to the axis of the inner flushing pipe.

[0019] By adopting the above technical solution, the slide rail and the clamping assembly can move into the long groove when the telescopic rod is retracted, so that the pipeline can enter the clamping assembly and be clamped and fixed by the clamping assembly. When the clamping assembly moves along the slide rail through the moving block, it can drive the pipeline to move, thereby realizing the flushing of the pipeline by the first high-pressure flushing part and the second high-pressure flushing part.

[0020] Optionally, the working pool further comprises a feed chute located at a side of the flushing chute away from the spraying chute, the spraying chute and the feed chute are separated by a third partition, and a third movable opening for a pipeline to pass through is provided on the third partition; The working pool also includes a recovery tank at the bottom, and the recovery tank is connected to the flushing tank, the spray tank, and the material discharge tank.

[0021] By adopting the above technical solution, the flushed pipeline can enter the discharge trough through the opened third movable port for unloading or transfer to the subsequent process; since a recovery trough is set up and connected with the flushing trough, spray trough and discharge trough, various liquids can be recovered for continuous operation.

[0022] In the second aspect, the present application discloses a semiconductor vacuum chamber pipeline cleaning method, which adopts the following technical solution A method for cleaning semiconductor vacuum chamber pipelines, using any one of the above-mentioned automatic cleaning devices, is characterized by comprising the following steps: S1. Put the pipes into the soaking tank in turn and separate them into different compartments through partitions for soaking; S2, the bottommost pipe enters the spray tank through the opened first moving port, and the pipe is sprayed and flushed by the rotating nozzle; S3, the pipe enters the flushing tank through the opened second moving port and enters the clamping assembly, is clamped and fixed by the clamping assembly and can move back and forth, and is flushed by the second high-pressure flushing member arranged on the side of the pipe and the first high-pressure flushing member penetrating the pipe; S4, the clamping assembly releases the cleaned pipe and moves it into the feed chute through the opened third moving port.

[0023] By adopting the above technical solution, the pipe is first soaked in the soaking liquid in the soaking tank, so that the impurities attached to the inner and outer walls of the pipe are separated from the pipe, loosened or even reacted with the soaking liquid; the soaked pipe enters the spray chamber, and the spray assembly sprays the spray liquid to remove the impurities and soaking liquid attached to the pipe; the pipe after spraying enters the flushing tank, at which time the second high-pressure flushing part can spray high-pressure water to high-pressure flush the outer wall of the pipe, and the first high-pressure flushing part is located inside the pipe to flush the inner wall of the pipe; because the first high-pressure flushing part can rotate relative to the pipe, and the pipe can be driven to move by the driving mechanism, the first high-pressure flushing part and the second high-pressure flushing part can flush different positions of the pipe, thereby improving the cleaning efficiency. The flushed pipe can be moved to the discharge tank for transfer or subsequent operations.

[0024] In summary, the present application includes at least one of the following beneficial effects: 1. The first high-pressure flushing component is located inside the pipeline to flush the inner wall of the pipeline, and the first high-pressure flushing component can rotate relative to the pipeline, and the pipeline can be driven to move by the driving mechanism. The first high-pressure flushing component can flush different positions inside the pipeline, thereby improving the cleaning efficiency; 2. The immersion tank, spray tank and flushing tank are arranged adjacent to each other, which can facilitate the transfer of pipelines, greatly reduce the space occupied, reduce the possibility of liquid leakage and reduce transportation costs; 3. The first movable port, the second movable port and the third movable port that can be opened and closed are provided, which can facilitate the transfer of the pipeline and reduce the leakage of the corresponding liquid and reduce the impact on the adjacent working area; 4. When the pipeline enters the spray tank, one of the inner flushing pipes can be slid so that the two inner flushing pipes are misaligned, and the pipeline can be coaxial with one of the inner flushing pipes. At this time, after the driving component drives the pipeline to move to partially sleeve the outside of one inner flushing pipe, the other inner flushing pipe can be reset. The driving component can drive the pipeline to sleeve the outside of the two inner flushing pipes at the same time and keep moving. The two first high-pressure flushing parts can flush different positions of the inner wall of the pipeline at the same time, basically achieving full coverage flushing of the inner and outer walls of the pipeline; 5. The slide rail and the clamping assembly can be moved into the long groove, so that the pipe can enter the slide rail and be clamped and fixed by the clamping assembly. When the clamping assembly moves along the slide rail, it can drive the pipe to move, so that the first high-pressure flushing part and the second high-pressure flushing part can flush the pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the structure of the working pool of an embodiment of the present application; Figure 2 is along Figure 1 Schematic diagram of the section along the AA direction; Figure 3 It is a schematic diagram of a partial cross-section structure showing the structure of the soaking tank and the spray tank in the embodiment of the present application; Figure 4 It is a schematic diagram of a partial cross-section structure showing the structure of the flushing tank and the material discharge tank in the embodiment of the present application; Figure 5 is along Figure 1 Schematic diagram of the cross section along the BB direction.

[0026] Explanation of reference numerals: 1, working pool; 11, top plate; 111, liquid inlet pipe; 12, pipe inlet; 13, bottom plate; 131, first inclined surface; 132, second inclined surface; 133, long groove; 134, ejector; 135, water permeable hole; 136, first bottom plate; 137, second bottom plate; 14, first partition; 141, first moving opening; 142, first opening and closing door; 15, second partition; 151, second moving opening; 152, second opening and closing door; 16, third partition; 161, third moving opening; 162, third Opening and closing door; 17. Partition piece; 18. Opening and closing door; 19. External partition; 100. Pumping pipe; 2. Soaking tank; 21. Partition chamber; 3. Spraying tank; 31. Rotating nozzle; 4. Flushing tank; 41. Telescopic rod; 42. Slide rail; 421. Moving block; 43. Clamping assembly; 431. Clamping plate; 44. Mounting frame; 441. Sliding block; 45. Internal flushing pipe; 451. First high-pressure flushing part; 46. External flushing pipe; 461. Second high-pressure flushing part; 5. Discharge trough; 6. Recovery trough; 7. Protection trough; 8. Pipeline. DETAILED DESCRIPTION

[0027] The following is combined with Figure 1 -Attached Figure 5 This application is described in further detail.

[0028] In the production process of semiconductor devices, the cleaning of the vacuum chamber pipeline 8 is a key link to ensure the production quality and equipment performance. Therefore, an automatic cleaning device for a semiconductor vacuum chamber pipeline 8 (hereinafter referred to as "pipeline 8") disclosed in an embodiment of the present application can fully clean the inner and outer walls of the semiconductor vacuum pipeline 8, thereby greatly improving the work efficiency and cleaning effect.

[0029] The automatic cleaning device includes a feeding device, a working pool 1, a compressed air drying device and a feeding device arranged in sequence. This application mainly improves the working pool 1, so the feeding device, the compressed air drying device and the feeding device are not described in detail. You can refer to the prior art and realize the corresponding functions. The working pool 1 is provided with a soaking tank 2, a spray cleaning mechanism and a high-pressure flushing mechanism, which can soak, spray and flush the pipeline with high-pressure water.

[0030] Reference Figure 1 and Figure 2 The working pool 1 includes a bottom plate 13, a top plate 11 and multiple side plates. There are multiple partitions in the working pool 1, which divide the working pool 1 into multiple chambers. The specific partitions include a first partition 14, a second partition 15, a third partition 16 and an outer partition 19. The above-mentioned soaking tank 2 is formed between the first partition 14 and the outer partition 19, a spray tank 3 is formed between the first partition 14 and the second partition 15, a flushing tank 4 is formed between the second partition 15 and the third partition 16, and a discharge tank 5 is formed between the third partition 16 and the side plate, that is, the soaking tank 2, the spray tank 3, the flushing tank 4 and the discharge tank 5 are arranged adjacent to each other in sequence. The working pool 1 also includes a recovery tank 6 located at the bottom of the bottom plate 13. A water-permeable hole 135 is provided on the bottom plate 13 located at the bottom of the spray tank 3, the rinse tank 4 and the feed tank 5. The water-permeable hole 135 realizes the connection between the recovery tank 6 and the spray tank 3, the rinse tank 4 and the feed tank 5, so as to facilitate the liquid to be guided to the recovery tank 6 for recovery. A water extraction pipe 100 is connected to the side wall or the bottom wall of the recovery tank 6, so as to extract or guide out the liquid and impurities in the recovery tank 6. The pipe 8 entering the working pool 1 can be soaked in the soaking tank 2, sprayed in the spray tank 3, rinsed in the rinse tank 4, and after the cleaning is completed, it can enter the feed tank 5 for collection. The soaking tank 2, the spray tank 3 and the rinse tank 4 are arranged adjacent to each other in sequence, which can facilitate the transfer of the pipe 8 while greatly reducing the space occupied, and also reduce the possibility of liquid leakage and reduce transportation costs.

[0031] The working pool 1 also includes a protection tank 7 located on the side of the soaking tank 2 away from the spraying tank 3. The protection tank 7 is located between the side plate and the outer partition 19 and is connected to the recovery tank 6, thereby reducing the impact caused by leakage of the soaking liquid in the soaking tank 2.

[0032] Reference Figure 1 and Figure 2, a first moving opening 141 is provided at the bottom position of the side wall of the first partition 14, and a first opening and closing door 142 for opening and closing the first moving opening 141 is slidably connected to the first partition 14, and the first opening and closing door 142 can be driven to move by a first driving source, and the first driving source can specifically be a cylinder, an electric push rod, a motor screw structure, an electromagnetic driving structure, etc., which can realize the movement of the first opening and closing door 142, and is provided with or has a waterproof function. Similarly, a second moving opening 151 is provided at the bottom position of the side wall of the second partition 15, and a second opening and closing door 152 for opening and closing the second moving opening 151 is slidably connected to the second partition 15, and a third moving opening 161 is provided at the bottom position of the side wall of the third partition 16, and a third opening and closing door 162 for opening and closing the third moving opening 161 is slidably connected to the third partition 16. The second opening and closing door 152 can also be driven to move by a first driving source disposed on the second partition 15, and the third opening and closing door 162 can also be driven to move by a first driving source disposed on the third partition 16, and the specific design method will not be described in detail.

[0033] Reference Figure 2 and Figure 3 , a liquid inlet pipe 111 located at the top of the soaking tank 2 is fixed on the top plate 11 of the working pool 1, and the soaking liquid can be added to the soaking tank 2 through the liquid inlet pipe 111. A pipe inlet 12 is provided on the top of a side wall of the working pool 1 close to the soaking tank 2, and the pipe 8 to be cleaned can enter the soaking tank 2 through the pipe inlet 12. The pipe inlet 12 can be opened and closed by a cylinder or a hydraulic rod to drive the opening and closing door 18 to rotate, or driven by a feeding device to rotate and open and close, so as to reduce the liquid in the liquid inlet pipe 111 from splashing out of the working pool 1. The first partition 14 and the side wall of the working pool 1 opposite to the first partition 14 are slidably connected to multiple rows of partitions 17, and each row of partitions 17 is driven by a second driving source arranged on the first partition 14 or the side wall of the working pool 1, specifically the second driving source, and the first driving source can be specifically a cylinder, an electric push rod, a motor screw structure, an electromagnetic drive structure, etc., which can realize the movement of driving the first opening and closing door 142, and is provided with or has a waterproof function.

[0034] The soaking tank 2 is divided into a plurality of partition chambers 21 by multiple rows of partitions 17. The plurality of partition chambers 21 can be used to place a pipe 8 respectively. The partitions 17 provide support and separation to reduce the mutual collision and contact between adjacent pipes 8. When in use, the partitions 17 move in sequence from bottom to top, so as to realize the movement of each pipe 8 downward, keep the soaking time and soaking environment of each pipe 8 the same or similar, and the pipe 8 at the bottom can enter the spray tank 3 through the opened first moving port 141 for spraying. The bottom plate 13 includes a first bottom plate 136 as the bottom wall of the soaking tank 2, the spray tank 3, the flushing tank 4 and the feeding tank 5, and a second bottom plate 137 as the bottom wall of the recovery tank 6 and the protection tank 7. A first inclined surface 131 is provided on the first bottom plate 136 at the bottom of the soaking tank 2. When the pipe 8 falls to the first inclined surface 131 and the first moving port 141 is opened, the first inclined surface 131 can guide the pipe 8 to move.

[0035] Reference Figure 2 and Figure 3 , the first partition 14 is slidably connected to the first bottom plate 136 and the side plate, and can be driven by a third driving source arranged in the working pool 1. The specific third driving source can be a cylinder, an electric push rod, a motor screw structure, etc., which can realize the movement of the first partition 14, and is provided with or has a waterproof function (the specific structure is not shown in the figure). The first partition 14 separates the soaking tank 2 and the spray tank 3, and the first partition 14 can be moved and locked, so that the overall width of the separation chamber 21 can be adjusted, thereby adapting to the use of pipes 8 of different diameters, greatly improving the applicability of the automatic cleaning equipment. In some preferred embodiments of the present application, a plurality of vertical fixed grooves can also be opened on the side wall of the working pool 1, and the first partition 14 can be detachably installed in different fixed grooves, so as to adjust the width of the separation chamber 21 and improve applicability.

[0036] Reference Figure 2 and Figure 3 The spray cleaning mechanism includes the above-mentioned spray tank 3, and a spray assembly arranged on the second partition 15 and the side plate. The specific spray assembly includes a rotating nozzle 31 arranged on the side wall of the second partition 15 and located near the bottom of the side plate of the working pool 1. The rotating nozzle 31 is formed in one row or multiple rows and can be surrounded by the pipe 8, so that the spray assembly can spray the spray liquid to spray different positions of the pipe 8, and even spray the inside of the pipe 8 through the end of the pipe 8, so as to reduce the adhesion of the soaking liquid and impurities. In addition, during spraying, the water inlet of the spray tank 3 is greater than the water outlet, so that the water level in the spray tank 3 rises, which can achieve a further cleaning effect. The first bottom plate 136 includes a second inclined surface 132 located at the bottom of the spray tank 3, the flushing tank 4 and the discharge tank 5. When the pipe 8 is located on the second inclined surface 132 and the pipe 8 is not blocked, it can move in a rolling form.

[0037] Reference Figure 4 and Figure 5 The high-pressure flushing mechanism includes the flushing tank 4, the overall length of the flushing tank 4 is greater than the length of other chambers, and the first bottom plate 136 is located at the bottom of the flushing tank 4. Two parallel and oppositely arranged mounting frames 44 are fixed, and multiple external flushing pipes 46 are fixed between the opposite side plates of the flushing tank 4. The external flushing pipes 46 are connected and fixedly connected with multiple second high-pressure flushing parts 461 along the length direction. The second high-pressure flushing parts 461 can be a rotary nozzle, and surround the peripheral side of the pipeline 8 in the flushing tank to achieve full coverage flushing of the outer wall of the pipeline 8. The two mounting frames 44 are slidably connected with a slider 441, and the slider 441 can be driven to move by a fourth driving source arranged in the flushing tank 4. The specific fourth driving source can be a cylinder, an electric push rod, a motor screw structure, an electromagnetic drive structure, etc., which can realize the movement of the driving slider 441 and is provided with or has a waterproof function.

[0038] The inner flushing pipe 45 is connected to the facing surfaces of the two sliders 441, and the inner flushing pipe 45 is provided with a first high-pressure flushing member 451. One or more first high-pressure flushing members 451 can be provided on the inner flushing pipe 45, and the first high-pressure flushing member 451 can be a rotating nozzle. A driving mechanism is provided in the spray tank 3. When the pipe 8 is sleeved outside the inner flushing pipe 45, the driving mechanism can drive the pipe 8 to move along the axial direction of the inner flushing pipe 45. At this time, the first high-pressure flushing member 451 is a rotating nozzle, which can rotate and move relative to the pipe 8, so as to better clean the inner wall of the pipe 8 in an all-round and full-coverage manner and reduce the retention of impurities inside the pipe 8.

[0039] Reference Figure 4 and Figure 5 A long groove 133 is provided on the bottom wall of the flushing tank 4, and the driving mechanism includes a telescopic rod 41 located in the long groove 133 and capable of extension and retraction. The telescopic direction of the telescopic rod 41 is the vertical direction. The telescopic rod 41 can specifically be a hydraulic rod, a cylinder, an electric push rod, a motor screw, etc., which can realize the telescopic function and has or is provided with a waterproof function.

[0040] The driving mechanism also includes a slide rail 42 located at the bottom of the telescopic rod 41. The length direction of the slide rail 42 is parallel to the axis of the inner flushing tube 45. The telescopic rod 41 is fixed on a moving block 421 sliding on the slide rail 42, thereby realizing the movement of the telescopic rod 41. A clamping assembly 43 for clamping the pipe 8 is provided at the top of the telescopic rod 41. The clamping assembly 43 specifically includes a clamping plate 431. One clamping plate 431 can move toward the other clamping plate 431. The two clamping plates 431 can clamp the pipe 8 and move along the length direction of the slide rail 42. Similarly, the movement of the clamping plate 431 and the overall movement of the moving block 421 can be achieved by using structures such as hydraulic rods, cylinders, electric push rods, motor screw structures, and electromagnetic drive structures, which will not be repeated here. When the pipe 8 enters the spray tank 3, one of the inner flushing pipes 45 can be slid, so that the two inner flushing pipes 45 are misaligned, and the pipe 8 can be coaxial with one of the inner flushing pipes 45. At this time, after the driving component drives the pipe 8 to move to partially sleeve outside one inner flushing pipe 45, the other inner flushing pipe 45 can be reset. The driving component can drive the pipe 8 to sleeve outside the two inner flushing pipes 45 at the same time and keep moving. The two first high-pressure flushing parts 451 can flush different positions of the inner wall of the pipe 8 at the same time, basically achieving full coverage flushing of the inner and outer walls of the pipe 8. An ejector 134 is also provided in the chute. The ejector 134 can be a movable push rod, and can also be moved in the form of a cylinder, a hydraulic cylinder, an electric push rod, etc. When the pipe 8 is cleaned and the telescopic rod 41 is lowered, the ejector 134 can push the pipe 8 out of the clamping component 43 and transfer it to the discharge chute 5 through the opened third moving port 161.

[0041] The implementation principle of an automatic cleaning device for semiconductor vacuum chamber pipelines in an embodiment of the present application is as follows: after being soaked and sprayed in sequence, the pipeline 8 enters the flushing tank 4 and is driven to move by a driving mechanism. The first high-pressure flushing component 451 and the second high-pressure flushing component 461 are both rotary nozzles. For example, the first high-pressure flushing component 451 can rotate around the axis of the inner flushing pipe 45, and the second high-pressure flushing component 461 can swing its head to adjust the spray angle. The first high-pressure flushing component 451 and the second high-pressure flushing component 461 can respectively flush the inner and outer walls of the pipeline 8 to achieve efficient and deep cleaning.

[0042] The present application also discloses a semiconductor vacuum chamber pipeline cleaning method, comprising the following steps: S1, sequentially putting the pipes 8 into the soaking tank 2 through the pipe inlet 12, and dividing them into separate chambers 21 through the partitions 17 for soaking; S2, when the bottom pipe 8 reaches the soaking time, the first opening and closing door 142 is driven to move back and forth quickly, and the pipe 8 enters the spray tank 3 through the opened first moving port 141, and the pipe 8 is sprayed and rinsed by the rotating nozzle 31. At this time, the partitions 17 from bottom to top move in sequence, so that the multiple pipes 8 in the soaking tank 2 move down to the next partition chamber 21 in sequence. At this time, the soaking liquid can be replenished through the liquid inlet pipe 111, and new pipes 8 to be cleaned are added through the pipe inlet 12. Part of the soaking liquid and the precipitated impurities that enter the spray tank 3 together with the pipe 8 can be impacted and soaked by the spray liquid and enter the recovery tank 6 through the water permeable hole 135 for collection.

[0043] S3, before the pipe 8 after spraying enters the flushing tank 4 through the opened second moving port 151, one of the inner flushing pipes 45 can be slid, so that the two inner flushing pipes 45 are misaligned, and the pipe 8 rolls into the clamping assembly 43, and is clamped and fixed by the clamping assembly 43, and the pipe 8 can be coaxial with one of the inner flushing pipes 45. At this time, after the driving assembly drives the pipe 8 to move to partially sleeve the outside of one inner flushing pipe 45, the other inner flushing pipe 45 can be reset, and the driving assembly can drive the pipe 8 to sleeve the outside of the two inner flushing pipes 45 at the same time and keep moving, and flush through the second high-pressure flushing component 461 arranged on the side of the pipe 8 and the first high-pressure flushing component 451 penetrated in the pipe 8; S4, the clamping assembly 43 releases the cleaned pipe 8, and the ejector 134 lifts up the pipe 8 and separates it from the slide rail 42, and moves it into the discharge chute 5 through the opened third moving port 161.

[0044] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An automatic cleaning device for semiconductor vacuum chamber pipelines, comprising a soaking tank (2), a spray cleaning mechanism and a high-pressure flushing mechanism, characterized in that: The spray cleaning mechanism comprises a spray tank (3) capable of being communicated with the soaking tank (2), wherein a spray component is arranged in the spray tank (3); The high-pressure flushing mechanism comprises a flushing slot (4) capable of being communicated with the spraying slot (3), and a high-pressure flushing assembly arranged in the flushing slot (4), the high-pressure flushing assembly comprising a first high-pressure flushing member (451) and a plurality of second high-pressure flushing members (461), the plurality of second high-pressure flushing members (461) being located around the pipe (8), the first high-pressure flushing member (451) being used to penetrate the inside of the pipe (8), and the first high-pressure flushing member (451) and the second high-pressure flushing member (461) being capable of spraying high-pressure water; The driving mechanism is used to drive the pipeline (8) to move, and the first high-pressure flushing member (451) and the pipeline (8) are capable of relatively rotating.

2. The automatic cleaning device for semiconductor vacuum chamber pipeline according to claim 1, characterized in that: It comprises a working pool (1), wherein the working pool (1) is divided into a soaking tank (2), a spraying tank (3) and a flushing tank (4) by a partition; A first movable opening (141) is provided at the bottom of the side wall of the spray tank (3) close to the soaking tank (2), and a first opening and closing door (142) is provided which can be moved to open and close the first movable opening (141); A second movable opening (151) is provided at the bottom of the side wall of the spraying tank (3) close to the flushing tank (4), and a second opening and closing door (152) is provided which can be moved to open and close the second movable opening (151).

3. The automatic cleaning device for semiconductor vacuum chamber pipeline according to claim 1, characterized in that: The working pool (1) comprises a top plate (11), and a liquid inlet pipe (111) located at the top of the soaking tank (2) is provided on the top plate (11); A plurality of partition chambers (21) for accommodating pipes (8) are formed in the soaking tank (2) along the vertical direction through partition members (17); the partition members (17) and pipes (8) are in contact with each other and are movable so that the pipes (8) can move into the partition chambers (21) at the bottom.

4. The automatic cleaning device for semiconductor vacuum chamber pipeline according to claim 2, characterized in that: The partition comprises a first partition (14) for separating the soaking tank (2) and the spray tank (3); the first partition (14) is slidably connected to the bottom of the working pool (1) and can be locked after being moved; and the first moving opening (141) is opened at the bottom of the side wall of the first partition (14).

5. The automatic cleaning device and cleaning method for semiconductor vacuum chamber pipeline according to claim 2, characterized in that: The partition comprises a second partition (15) for separating a spraying tank (3) and a flushing tank (4); the second movable port (151) is provided at the bottom of a side wall of the second partition (15); and the spray assembly comprises a rotating spray head (31) arranged on the second partition (15).

6. The automatic cleaning device for semiconductor vacuum chamber pipeline according to claim 2, characterized in that: The second high-pressure flushing component (461) is arranged inside the flushing tank (4), and two opposing mounting frames (44) are arranged inside the flushing tank (4). Internal flushing pipes (45) are arranged on the facing surfaces of the two mounting frames (44), and the axes of the two internal flushing pipes (45) are coincident or parallel. The first high-pressure flushing component (451) is arranged at one end of the internal flushing pipe (45) away from the mounting frame (44), and the internal flushing pipe (45) is vertically slidably connected to the mounting frame (44).

7. The automatic cleaning device for semiconductor vacuum chamber pipeline according to claim 6, characterized in that: The bottom wall of the flushing tank (4) is provided with a long slot (133), and the driving mechanism comprises a telescopic rod (41) located in the long slot (133) and capable of being telescoped, wherein the telescopic direction of the telescopic rod (41) is a vertical direction; The driving mechanism further comprises a slide rail (42) located at the bottom of the telescopic rod (41); the telescopic rod (41) is movable along the length direction of the slide rail (42) via a moving block (421); a clamping assembly (43) for clamping a pipe (8) is disposed at the top of the telescopic rod (41); and the length direction of the slide rail (42) is parallel to the axis of the inner flushing pipe (45).

8. The automatic cleaning device for semiconductor vacuum chamber pipeline according to claim 2, characterized in that: The working pool (1) further comprises a material discharge chute (5) located on a side of the flushing chute (4) away from the spraying chute (3), the spraying chute (3) and the material discharge chute (5) being separated by a third partition plate (16), and a third movable opening (161) for the pipeline (8) to pass through is provided on the third partition plate (16); The working pool (1) further comprises a recovery tank (6) at the bottom, wherein the recovery tank (6) is connected to the flushing tank (4), the spray tank (3), and the material discharge tank (5).

9. A method for cleaning semiconductor vacuum chamber pipelines, characterized in that: Use of the automatic cleaning device according to any one of claims 1 to 8, characterized in that it comprises the following steps: S1, placing the pipes (8) into the soaking tank (2) in sequence, and dividing them into separate chambers (21) through partitions (17) for soaking; S2, the pipeline (8) at the bottom enters the spray tank (3) through the opened first movable port (141), and the pipeline (8) is sprayed and flushed by the rotating spray head (31); S3, the pipe (8) enters the flushing tank (4) through the opened second moving port (151), and enters the clamping assembly (43), is clamped and fixed by the clamping assembly (43) and is able to move back and forth, and is flushed by the second high-pressure flushing member (461) arranged on the side of the pipe (8) and the first high-pressure flushing member (451) penetrating the pipe (8); S4. The clamping assembly (43) releases the cleaned pipe (8), and the pipe (8) moves into the material discharge chute (5) through the opened third moving opening (161).

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