Display module, display device and manufacturing method of display module

Abstract

The invention relates to a display module, a display device and a manufacturing method of the display module.The display module comprises an array substrate, a color film substrate and a cover plate, the array substrate and the color film substrate are oppositely arranged, the cover plate is located on the side, away from the array substrate, of the color film substrate, and in the first direction, the array substrate comprises a first area covered by the color film substrate, the second area is not covered by the color film substrate, and a protective adhesive layer is arranged on one surface, facing the cover plate, of the second area; in the second direction perpendicular to the first direction, the second area comprises a binding area and edge areas located on the two opposite sides of the binding area, a supporting adhesive layer is arranged between the part, located on the edge areas, of the protection adhesive layer and the cover plate, and an isolation layer is arranged between the supporting adhesive layer and the protection adhesive layer.

Description

Technical Field

[0001] The present disclosure relates to the technical field of display product manufacturing, and in particular to a display module, a display device, and a manufacturing method of a display module. Background Art

[0002] In recent years, with the intensified competition among major brands of mobile consumer electronics products, manufacturers are increasingly pursuing the ultimate compression of production costs. The global consumer electronics industry has gradually shifted to Southeast Asia, India and other regions with lower labor costs, causing domestically produced display module products to be shipped to foreign machine factories for assembly. Due to the lengthening of the industrial chain, the operation cycle of many display module products shipped to foreign machine factories has been extended, and in many cases, the products cannot be put on line for assembly in time in the warehouse of the machine factory, and need to be stored for a period of 1 to 3 months, or even longer, before being put on line for assembly; long-term storage also causes some new defects in display module products that have never been encountered in domestic assembly of whole machines before, resulting in batches of products being returned, and even facing the situation of being discontinued by customers. One of the typical problems is the greening defect at both ends of the DP (binding) side of the display module. The main reason is that the surface glue of the single-layer area of ​​the panel contains fluorescent agent, which will turn green under strong light in the dark environment of the workshop. Summary of the invention

[0003] In order to solve the above technical problems, the present disclosure provides a display module, a display device and a method for manufacturing the display module, which solve the problem of greening of the binding side of the display module.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted in the embodiment of the present disclosure is: a display module, comprising an array substrate and a color filter substrate arranged opposite to each other, and a cover plate located on a side of the color filter substrate away from the array substrate;

[0005] Along the first direction, the array substrate includes a first area covered by the color filter substrate and a second area not covered by the color filter substrate, and a protective adhesive layer is disposed on a surface of the second area facing the cover plate;

[0006] In a second direction perpendicular to the first direction, the second region includes a binding area and edge areas located on opposite sides of the binding area, a supporting adhesive layer is arranged between a portion of the protective adhesive layer located in the edge area and the cover plate, and an insulating layer is arranged between the supporting adhesive layer and the protective adhesive layer.

[0007] Optionally, the orthographic projection of the insulating layer on the array substrate covers the orthographic projection of the supporting adhesive layer on the array substrate.

[0008] Optionally, the insulating layer is an adhesive tape, and the insulating layer includes a base material layer and an adhesive layer disposed on the base material layer, and the adhesive layer is bonded to the protective adhesive layer.

[0009] Optionally, the material of the substrate layer is polyethylene terephthalate.

[0010] Optionally, a driver IC is disposed on the binding area;

[0011] The display module further comprises a flexible circuit board, one end of which is bound and connected to the binding area;

[0012] The display module further includes a conductive metal layer, and the conductive metal layer includes covering the driver IC and a portion of the flexible circuit board;

[0013] The conductive metal layer includes a first part and a second part, the orthographic projection of the first part on the array substrate is located in the second area, the second part covers part of the flexible circuit board, and in the second direction, the first part includes a first sub-part, a second sub-part and a third sub-part, the second sub-part is arranged in the binding area, the first sub-part and the third sub-part are arranged in the edge area, and are reused as the isolation layer.

[0014] Optionally, the insulating layer is an ink layer disposed on the protective adhesive layer.

[0015] The embodiment of the present disclosure further provides a display device, comprising the above-mentioned display module.

[0016] The present disclosure also provides a method for manufacturing a display module, which is used to manufacture the above-mentioned display module. The manufacturing method includes:

[0017] Aligning cell array substrate and color film substrate;

[0018] forming a protective adhesive layer on a second region of the array substrate, wherein the second region includes a binding region and edge regions located on two opposite sides of the binding region in a second direction perpendicular to the first direction;

[0019] forming an insulating layer on the portion of the protective adhesive layer located in the edge area;

[0020] forming a supporting adhesive layer on the insulating layer;

[0021] Laminating a polarizer on the light-emitting side of the color filter substrate;

[0022] A cover plate is attached to a side of the polarizer away from the color filter substrate.

[0023] Optionally, the insulating layer is an adhesive tape, and the insulating layer includes a substrate layer and an adhesive layer disposed on the substrate layer;

[0024] Forming an insulating layer on the portion of the protective adhesive layer located in the edge area specifically includes:

[0025] Providing a positioning film, and setting a tape of a preset shape at a preset position on the positioning film;

[0026] Positioning the positioning film by a laminating jig so that the tape on the positioning film is aligned with the position to be laminated on the array substrate;

[0027] The adhesive tape is applied, and the positioning film is removed.

[0028] Optionally, a driver IC is disposed on the binding area;

[0029] The display module further comprises a flexible circuit board, one end of which is bound and connected to the binding area;

[0030] The display module further includes a conductive metal layer, and the conductive metal layer includes covering the driver IC and a portion of the flexible circuit board;

[0031] The conductive metal layer includes a first portion, an orthographic projection of the first portion on the array substrate is located in the second region, and the isolation layer is formed by the first portion extending toward opposite sides of the driver IC in the second direction;

[0032] Forming an insulating layer on the portion of the protective adhesive layer located in the edge area specifically includes:

[0033] The conductive metal layer is formed on the protective adhesive layer to complete the setting of the isolation layer.

[0034] Optionally, the insulating layer is an ink layer formed by printing ink on the protective adhesive layer;

[0035] Forming an insulating layer on the portion of the protective adhesive layer located in the edge area specifically includes:

[0036] Laminating a silk screen printing plate to the edge area of ​​the second region, and filling the silk screen printing plate with ink;

[0037] The ink layer is formed in the edge area by coating and printing.

[0038] The beneficial effect of the present disclosure is: the display module provided by the present embodiment includes an array substrate and a color filter substrate arranged relatively to each other, the light-emitting side of the color filter substrate is bonded with a cover plate through an optical adhesive layer, the array substrate includes a first area covered by the color filter substrate, and a second area not covered by the color filter substrate, the second area is coated with a protective adhesive layer, the second area includes a binding area and edge areas arranged on two opposite sides of the binding area, in the edge area, an insulating layer and a supporting adhesive layer are stacked between the protective adhesive layer and the cover plate, and an insulating adhesive layer is arranged between the protective adhesive layer and the supporting adhesive layer to isolate the protective adhesive layer and the supporting adhesive layer, thereby preventing the fluorescent agent in the protective adhesive layer from diffusing into the supporting adhesive layer, and further preventing the fluorescent agent from continuing to diffuse into the optical adhesive layer via the supporting adhesive layer, thereby solving the problem of poor green emission on the binding side of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 A schematic diagram showing the structure of a display module in an embodiment of the present disclosure;

[0040] Figure 2 A schematic diagram showing a binding side of a display module in an embodiment of the present disclosure;

[0041] Figure 3 A schematic diagram showing a positioning film attached with a single-sided tape in an embodiment of the present disclosure;

[0042] Figure 4 A schematic diagram showing a conductive copper foil in conventional technology;

[0043] Figure 5 A schematic diagram showing a binding side of a display module in an embodiment of the present disclosure;

[0044] Figure 6 A schematic diagram showing a conductive copper foil in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0046] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0047] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present disclosure include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances associated with the measurement of specific quantities (e.g., the limitations of the measurement system), and represent the acceptable deviation range for a specific value determined by ordinary technicians in the field. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0048] In addition, in this document, unless otherwise defined, the terms "substantially", "substantially", "approximately" and "about" are used to describe and explain small changes. When used with an event or situation, these terms can cover situations where the event or situation occurs exactly, and can also cover situations where the event or situation occurs approximately. For example, when used with a numerical value, these terms can include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces being arranged along the same plane in the micrometer range, for example, arranged along the same plane within 40μm, 30μm, 20μm, 10μm or 1μm.

[0049] The liquid crystal display panel in the related art generally includes a color filter substrate and an array substrate arranged in sequence from the display side of the liquid crystal display panel to its back side, and a liquid crystal layer is sandwiched between the color filter substrate and the array substrate. The array substrate includes a first area covered by the color filter substrate and a second area not covered by the color filter substrate. A binding area is provided on the second area for binding an integrated circuit chip (IC) and a flexible printed circuit (FPC). Since the second area is suspended relative to the edge of the color filter substrate, in order to prevent the circuit arranged in the second area from being corroded by water vapor and causing poor functionality, a protective adhesive layer is coated on the second area. Since the second area is suspended relative to the edge of the color filter substrate, there is a certain gap between the second area and the glass cover plate located on the display side of the liquid crystal display panel. After binding the IC and FPC in the binding area, a supporting adhesive layer is used to fill the gap. The purpose of the supporting adhesive layer is to support the second area to enhance the strength of the second area and prevent the single-layer area from breaking during the fall of mobile phones and other products. The lower surface of the supporting adhesive layer is in close contact with the protective adhesive layer, and the upper surface of the supporting adhesive layer is in direct contact with the cover glass CG.

[0050] When a support adhesive layer is formed by coating a curable adhesive material such as silicone adhesive (taking the use of silicone adhesive to form a support adhesive layer as an example), the cover plate needs to be fully bonded before the silicone adhesive is cured, and the silicone adhesive is squeezed through the cover plate to achieve a full contact effect. During the squeezing process, the silicone adhesive will overflow to the outside; at the same time, during the full bonding of the cover plate, the optically transparent adhesive OCA used for bonding the cover plate has a certain fluidity, and the optically transparent adhesive will also overflow to the outside; during the full bonding process, since both the optically transparent adhesive and the silicone adhesive have a certain overflow area, the optically transparent adhesive and the silicone adhesive will eventually be in full contact. In this way, the support adhesive layer connects the optically transparent adhesive and the protective adhesive layer at the same time.

[0051] By adding fluorescent agent to the protective adhesive layer, the appearance color of the panel single layer area (i.e., the second area) appears light yellow after coating, which is convenient for operators to check whether there is any leakage of the protective adhesive layer in the second area. It is convenient for operators to observe with the naked eye and avoid corrosion of the circuit on the display panel by water vapor and air due to leakage of the protective adhesive layer in the second area, resulting in poor functionality. However, the inventors found that the fluorescent agent molecules in the protective adhesive layer are relatively active. Over a long period of time, the fluorescent agent will penetrate into the interior of the supporting adhesive layer in direct contact with it. In addition, after the narrow frame project is fully bonded, the supporting adhesive layer (made of silicone adhesive) and the OCA optical transparent adhesive (the cover plate is bonded by the OCA optical transparent adhesive) are both soft adhesives with a certain fluidity. Under full bonding, they will contact each other due to overflow deformation, and the fluorescent agent transferred to the interior of the supporting adhesive layer will further diffuse into the interior of the optical transparent adhesive. As time goes by, the fluorescent agent further penetrates into the interior of the optical transparent adhesive to the edge of the display area. At this time, under the dark environment of the factory workshop, under the illumination of 3000Lux, the edge of the display area of ​​the display panel will appear green, causing the whole machine factory to strongly complain about the serious defects of the product and carry out batch return processing; however, the green defect cannot be observed under normal external environment, but the whole machine assembly workshops of each client are equipped with fluorescent lamps and snake lights in a dark environment for operation, so that the defect is stimulated and manifested under a specific environment (long storage time + dark environment of the whole machine workshop + strong light).

[0052] refer to Figure 1-Figure 6 In view of the above problems, an embodiment of the present disclosure provides a display module, comprising an array substrate 1 and a color filter substrate 2 arranged opposite to each other, and a cover plate 3 located on a side of the color filter substrate 2 away from the array substrate 1;

[0053] Along the first direction (reference Figure 1 The array substrate 1 includes a first area 11 covered by the color filter substrate 2 and a second area 12 not covered by the color filter substrate 2. A protective adhesive layer 4 is disposed on a surface of the second area 12 facing the cover plate 3.

[0054] In a second direction perpendicular to the first direction (reference Figure 2 In the Y direction), the second area 12 includes a binding area 101 and edge areas 102 located on opposite sides of the binding area 101, a supporting adhesive layer 5 is arranged between the portion of the protective adhesive layer 4 located in the edge area 102 and the cover plate 3, and an insulating layer 6 is arranged between the supporting adhesive layer 5 and the protective adhesive layer 4.

[0055] Since the coating of the protective adhesive layer 4 is to protect the effective circuits on the array substrate 1 to avoid corrosion by water vapor and air, a special process must be used to check the coating of the protective adhesive layer 4. Therefore, the protective adhesive layer 4 must be colored to facilitate the operator to check whether there is a risk of missing coating of the protective adhesive layer 4. The supporting adhesive layer 5 can effectively support the strength of the single-layer area (i.e., the second area 12 not covered by the color film substrate 2) of the array substrate 1 to avoid the risk of falling and breaking the screen. Therefore, the supporting adhesive layer 5 and the supporting adhesive layer 5 are both indispensable structures. Therefore, in order to solve the problem of poor greening of the edge of the display module caused by the diffusion of the fluorescent agent in the protective adhesive layer 4 into the supporting adhesive layer 5, in the embodiment of the present disclosure, an insulating layer 6 is added between the protective adhesive layer 4 and the supporting adhesive layer 5 to isolate the fluorescent agent in the protective adhesive layer 4 from diffusing and transferring to the supporting adhesive layer 5, thereby preventing the fluorescent agent from transferring to the inside of the OCA (optical adhesive layer) used for bonding the cover plate 3, resulting in the poor greening phenomenon at the edge of the CG VA area (non-display area of ​​the cover plate 3) under light above 3000LUX in the dark environment of the workshop.

[0056] The protective adhesive layer 4 is coated on the entire second area 12, and has a relatively thin thickness, generally less than or equal to 20um, while the supporting adhesive layer 5 is only formed on a part of the second area 12, specifically, on two edge areas 102 on opposite sides of the binding area 101. In order to play an effective supporting role, the supporting adhesive layer 5 is relatively thick, generally around 300 to 400um (the thickness of the supporting adhesive layer 5 is determined according to the spacing between the cover plate 3 and the single-layer area of ​​the array substrate 1 during product design), and the curable adhesive material such as silicone adhesive used to make the supporting adhesive layer 5 has good fluidity. In order to avoid direct contact between the supporting adhesive layer 5 and the protective adhesive layer 4, an insulating layer 6 is arranged between the supporting adhesive layer 5 and the protective adhesive layer 4 to achieve physical isolation, and the orthographic projection of the insulating layer 6 on the array substrate 1 covers the orthographic projection of the supporting adhesive layer 5 on the array substrate 1.

[0057] Exemplarily, the supporting adhesive layer 5 may be formed by silicone adhesive or other curable adhesive materials.

[0058] It should be noted that a polarizer is also provided on the light-emitting side of the color filter substrate 2 (see Figure 1 The upper polarizer U-POL in the image is laminated to the cover plate 3 on the side of the polarizer away from the color filter substrate 2 through the optical adhesive layer OCA. Since the protective adhesive layer 4 on the second area 12 is coated on the entire surface, and the supporting adhesive layer 5 is only on the edge area 102 of the second area 12, in the area outside the second area 12 where the supporting adhesive layer 5 is set, although there is a protective adhesive layer 4, since the thickness of the protective adhesive layer 4 is less than or equal to 20um, and the optical adhesive layer is located between the polarizer and the cover plate 3, the sum of the thickness of the polarizer and the thickness of the color filter substrate 2 is usually above 200um, in the direction perpendicular to the color filter substrate 2 (refer to Figure 1In the Z direction), the protective adhesive layer 4 cannot directly contact the optical adhesive layer, and the fluorescent agent in the protective adhesive layer 4 has no direct path to diffuse and transfer to the optical adhesive layer. Therefore, it is only necessary to add an insulating layer 6 in the area where the supporting adhesive layer 5 is set (i.e., the edge area 102) to physically isolate the protective adhesive layer 4 and the supporting adhesive layer 5.

[0059] In an exemplary embodiment, the insulating layer 6 is an adhesive tape, and the insulating layer 6 includes a base material layer and an adhesive layer disposed on the base material layer, and the adhesive layer is bonded to the protective adhesive layer 4 .

[0060] Exemplarily, the material of the substrate layer is polyethylene terephthalate (PET).

[0061] Exemplarily, the thickness of the insulating layer 6 is 10 um to 30 um.

[0062] PET material is a crystalline saturated polyester with highly crystalline polymer characteristics and no fluidity, so it can completely block the diffusion and transfer of the fluorescent agent in the protective adhesive layer 4 to the inside of the supporting adhesive layer 5. Exemplarily, the insulating layer 6 uses a single-sided tape. The adhesive layer is effectively adhered to the protective adhesive layer 4 to prevent it from falling off. The supporting adhesive layer 5 is formed on the side of the substrate layer where the adhesive layer is not provided by coating. The curable adhesive material (such as silicone adhesive) that forms the supporting adhesive layer 5 has its own viscosity to achieve adhesion with the insulating adhesive layer, thereby isolating the path of the fluorescent agent in the protective adhesive layer 4 to the optical adhesive layer, thereby fundamentally improving the problem of poor greening at the edge of the display module.

[0063] In an exemplary embodiment, a driver IC is disposed on the binding area 101;

[0064] The display module further includes a flexible circuit board 30, one end of which is bound and connected to the binding area 101. Figure 5 ;

[0065] The display module further includes a conductive metal layer 20, which covers the driver IC and part of the flexible circuit board;

[0066] The conductive metal layer 20 includes a first portion 2001 and a second portion 2002, wherein the orthographic projection of the first portion 2001 on the array substrate 1 is located in the second region 12, and the second portion 2002 covers a portion of the flexible circuit board 30. In the second direction, the first portion 2001 includes a first sub-portion 20011, a second sub-portion 20012, and a third sub-portion 20013, wherein the second sub-portion 20012 is disposed in the binding region, and the first sub-portion 20011 and the third sub-portion 20013 are disposed in the edge region and reused as the insulating layer 6, with reference to Figure 6 ( Figure 6In order to indicate the positional relationship among the first sub-portion 20011, the second sub-portion 20012 and the third sub-portion 20013, a dotted line is used for distinction, but it should be understood that, in practice, the dotted line does not exist). That is, the insulating layer 6 is formed by the first portion 2001 extending toward the opposite sides of the driver IC in the second direction.

[0067] Exemplarily, the conductive metal layer 20 is a conductive copper foil, and the thickness of the conductive metal layer 20 is 20-30 um.

[0068] A grounded copper exposed area is provided on the flexible circuit board 30 for electrical contact with the conductive metal layer 20 , so as to be used for static electricity conduction of the driver IC, and the conductive metal layer 20 can play a role of electromagnetic shielding.

[0069] contrast Figure 4 and Figure 6 In this embodiment, the structure of the conductive metal layer 20 originally existing in the display module is improved so that the first part 2001 of the conductive metal layer 20 extends toward the opposite sides of the driver IC in the second direction to form the insulating layer 6. The insulating layer 6 and the conductive metal layer 20 are integrated into an integral structure. When the conductive metal layer 20 is provided, the insulating layer 6 is provided at the same time, which saves steps and simplifies the manufacturing process of the display module.

[0070] In an exemplary embodiment, the insulating layer 6 is an ink layer formed by printing ink on the protective adhesive layer 4 .

[0071] Exemplarily, the thickness of the ink layer is 15-30 um.

[0072] After coating the protective adhesive layer 4 in the semi-finished state of FOGA (product state before the cover plate 3 is attached) of the display module, a layer of ink with a thickness of 15um to 30um is printed on the edge area 102 of the second area 12 of the array substrate 1 (i.e., the position where the supporting adhesive layer 5 is set) by screen printing ink. The ink layer is directly printed on the surface of the protective adhesive layer 4, and then silicone glue is coated on the surface of the ink layer to form the supporting adhesive layer 5. The dense ink layer blocks the fluorescent agent in the protective adhesive layer 4 from transferring to the optical adhesive layer.

[0073] In an exemplary embodiment, an antistatic metal layer 7 is disposed on one side of the color filter substrate 2 close to the second area 12 . The antistatic metal layer 7 extends from the color filter substrate 2 to the second area 12 to be electrically connected to the ground circuit on the second area 12 .

[0074] The color filter substrate 2 includes an exposed area exposed to the polarizer, and the antistatic metal layer 7 extends to the exposed area to effectively conduct static electricity.

[0075] Exemplarily, the antistatic metal layer 7 may include metal Ag, such as conductive silver paste.

[0076] It should be noted that the antistatic metal layer 7 is dotted on the array substrate 1 by dripping. During production, the conductive silver glue is first dotted on the display panel, and then a protective glue layer 4 is set in the second area 12, and part of the protective glue layer 4 covers the antistatic metal layer 7.

[0077] It should be noted that, in the direction perpendicular to the array substrate 1, the height of the upper surface (the side away from the array substrate 1) of the position where the isolation layer 6 does not cover the antistatic metal layer 7 is less than the height of the upper surface (the side away from the array substrate 1) of the color film substrate 2, ensuring that there is sufficient supporting adhesive layer 5 to play a supporting and buffering role.

[0078] The embodiment of the present disclosure further provides a display device, comprising the above-mentioned display module.

[0079] refer to Figure 1 , the display module includes a backlight source and a display panel located at the light emitting side of the backlight source;

[0080] The display panel includes an array substrate 1 and a color filter substrate 2 which are arranged in a box, a polarizer (upper polarizer U-POL) is arranged on the light-emitting side of the color filter substrate 2, and the light-emitting side of the polarizer is bonded to a cover plate 3 via an optical adhesive layer;

[0081] The backlight source includes a back plate SUS, the back plate SUS includes a bottom plate and side plates located around the bottom plate, a light guide plate LGP is arranged in a space enclosed by the bottom plate and the side plates, a light source is arranged on the side of the light guide plate LGP, and the light source includes a light bar circuit board LED-FPC and an LED lamp arranged on the light bar circuit board;

[0082] An optical film material is disposed on the light-emitting side of the light guide plate LGP, and the optical film material includes a stacked diffuser and a prism sheet (including an upper prism sheet U-prism and a lower prism sheet D-prism);

[0083] A light-shielding tape is provided on the side of the light source away from the bottom plate;

[0084] A polarizer (lower polarizer D-POL) is disposed on the side of the optical film away from the light guide plate LGP.

[0085] The present disclosure also provides a method for manufacturing a display module, which is used to manufacture the above-mentioned display module. The manufacturing method includes:

[0086] Aligning cell array substrate and color film substrate;

[0087] forming a protective adhesive layer on a second region of the array substrate, wherein in a second direction perpendicular to the first direction, the second region includes a binding region and edge regions located on two opposite sides of the binding region;

[0088] forming an insulating layer on the portion of the protective adhesive layer located in the edge area;

[0089] forming a supporting adhesive layer on the insulating layer;

[0090] A polarizer is attached to the light-emitting side of the color film substrate;

[0091] A cover plate is attached to the side of the polarizer away from the color film substrate.

[0092] In an exemplary embodiment, the insulating layer is an adhesive tape, and the insulating layer includes a substrate layer and an adhesive layer disposed on the substrate layer;

[0093] Forming an insulating layer on the portion of the protective adhesive layer located in the edge area specifically includes:

[0094] Providing a positioning film, and setting a tape of a preset shape at a preset position on the positioning film;

[0095] The positioning film is positioned by a laminating jig so that the tape on the positioning film is aligned with the position to be laminated on the array substrate;

[0096] Apply the tape and remove the positioning film.

[0097] Specifically, two independent single-sided tapes 1002 are attached to a positioning film 100, referring to Figure 3 , the required shape of the single-sided tape 1002 is processed by die cutting, and the two single-sided tapes 1002 are kept in the relative position required for the display module to be attached. Through the cooperation of the attachment jig, when attaching, the semi-finished product of the display module in the FOGA state is placed in the jig groove, and the two positioning holes 1001 of the positioning film 100 with the single-sided tape 1002 are inserted for the positioning column of the jig for positioning. At this time, the two single-sided tapes 1002 are just at the position where the display module needs to be attached. After the two independent single-sided tapes 1002 are attached to the second area 12 of the array substrate, the positioning film is removed. After verifying that the sample constitutes the TLCM finished product, after being stored for 3 months, there is no green defect under the strong light of 5000Lux of the snake lamp in the dark environment of the workshop, and the effect is good.

[0098] In an exemplary embodiment, a driver IC is disposed on the binding area;

[0099] The display module also includes a flexible circuit board, one end of which is bound and connected to the binding area;

[0100] The display module also includes a conductive metal layer, which includes a covering driver IC and a portion of the flexible circuit board;

[0101] The conductive metal layer includes a first portion, an orthographic projection of the first portion on the array substrate is located in the second area, and the insulating layer is formed by the first portion extending toward opposite sides of the driver IC in the second direction;

[0102] Forming an insulating layer on the portion of the protective adhesive layer located in the edge area specifically includes:

[0103] A conductive metal layer is formed on the protective adhesive layer to complete the setting of the isolation layer.

[0104] Specifically, Figure 5 The schematic diagram of the conductive copper foil attachment state shown in the figure shows that the conductive metal layer is the conductive copper foil 20. The structure of the traditional conductive copper foil is optimized by extending the conductive copper foil 20 with a thickness of 20um & 30um to both sides, and designing the shape of the conductive copper foil extended on both sides according to the shape of the second area, so that when the conductive copper foil is applied, the extended parts on both sides are directly applied to the protective adhesive layer of the second area to be reused as the isolation layer 6. The conductive copper foil 20 in this embodiment, on the basis of realizing the original function of the conductive copper foil (anti-static, etc.), the parts extending from both sides can also serve as an isolation layer, so that one structural part has two uses at the same time, and in actual operation, a film-sticking process can be saved; this structure can still achieve the purpose of physically isolating the contact between the supporting adhesive layer and the protective adhesive layer. After verifying that the sample constitutes the TLCM finished product, after being stored for 3 months, under the strong light of 5000Lux of a snake lamp in the dark environment of the workshop, there is no greening defect, and the effect is good.

[0105] In an exemplary embodiment, the insulating layer is an ink layer formed by printing ink on the protective rubber layer;

[0106] Forming an insulating layer on the portion of the protective adhesive layer located in the edge area specifically includes:

[0107] Laminating a silk screen printing plate to the edge area of ​​the second region, and filling the silk screen printing plate with ink;

[0108] Printing is performed to form an ink layer in the edge area.

[0109] Specifically, the process of forming the ink layer is as follows:

[0110] The display module in the FOGA state is placed in the fixture groove through a special fixture, and the screen printing screen is attached to the support adhesive layer to be set in the edge area of ​​the second area, and then the screen printing screen is filled with ink. A screen frame is set around the screen printing screen to prevent the ink from overflowing and contaminating the product.

[0111] Wait for the ink to be filled and then start the scraper;

[0112] The scraper starts to move to scrape the ink. The scraper applies pressure to the ink so that the ink is squeezed out of the mesh holes of the screen printing plate, so that a pattern consistent with the screen printing plate is formed on the second area. After completing one action, the scraper is lifted up and the ink return knife is pressed down. Without applying pressure, the ink is brought back to the starting position in the return direction for the next printing;

[0113] The process of ink penetrating into the mesh holes of the screen printing screen will gradually form a dense ink layer on the protective rubber layer in the second area. The thickness of the ink layer can be controlled by controlling the number of scraping times.

[0114] After the ink layer is coated, a surface drying process is performed to achieve the curing and solidification of the ink layer.

[0115] There are a few points to note:

[0116] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0117] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0118] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0119] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and substance of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display module, comprising an array substrate and a color filter substrate arranged opposite to each other, and a cover plate located on a side of the color filter substrate away from the array substrate, characterized in that: Along the first direction, the array substrate includes a first area covered by the color filter substrate and a second area not covered by the color filter substrate, and a protective adhesive layer is disposed on a surface of the second area facing the cover plate; In a second direction perpendicular to the first direction, the second region includes a binding area and edge areas located on opposite sides of the binding area, a supporting adhesive layer is arranged between a portion of the protective adhesive layer located in the edge area and the cover plate, and an insulating layer is arranged between the supporting adhesive layer and the protective adhesive layer.

2. The display module according to claim 1, characterized in that: The orthographic projection of the insulating layer on the array substrate covers the orthographic projection of the supporting adhesive layer on the array substrate.

3. The display module according to claim 1, characterized in that: The insulating layer is made of adhesive tape, and the insulating layer includes a base material layer and an adhesive layer arranged on the base material layer, and the adhesive layer is bonded to the protective adhesive layer.

4. The display module according to claim 3, characterized in that: The material of the substrate layer is polyethylene terephthalate.

5. The display module according to claim 1, characterized in that: A driving IC is arranged on the binding area; The display module further comprises a flexible circuit board, one end of which is bound and connected to the binding area; The display module further includes a conductive metal layer, and the conductive metal layer includes covering the driver IC and a portion of the flexible circuit board; The conductive metal layer includes a first part and a second part, the orthographic projection of the first part on the array substrate is located in the second area, the second part covers part of the flexible circuit board, and in the second direction, the first part includes a first sub-part, a second sub-part and a third sub-part, the second sub-part is arranged in the binding area, the first sub-part and the third sub-part are arranged in the edge area, and are reused as the isolation layer.

6. The display module according to claim 1, characterized in that: The insulating layer is an ink layer arranged on the protective adhesive layer.

7. A display device, characterized in that: A display module comprising any one of claims 1-6.

8. A method for manufacturing a display module, characterized in that: Used to manufacture the display module according to any one of claims 1 to 6, the manufacturing method comprising: Aligning cell array substrate and color film substrate; forming a protective adhesive layer on a second region of the array substrate, wherein the second region includes a binding region and edge regions located on two opposite sides of the binding region in a second direction perpendicular to the first direction; forming an insulating layer on the portion of the protective adhesive layer located in the edge area; forming a supporting adhesive layer on the insulating layer; Laminating a polarizer on the light-emitting side of the color filter substrate; A cover plate is attached to a side of the polarizer away from the color filter substrate.

9. The method for manufacturing a display module according to claim 8, characterized in that: The insulating layer is an adhesive tape, and the insulating layer includes a substrate layer and an adhesive layer disposed on the substrate layer; Forming an insulating layer on the portion of the protective adhesive layer located in the edge area specifically includes: Providing a positioning film, and setting a tape of a preset shape at a preset position on the positioning film; Positioning the positioning film by a laminating jig so that the tape on the positioning film is aligned with the position to be laminated on the array substrate; The adhesive tape is applied, and the positioning film is removed.

10. The method for manufacturing a display module according to claim 8, characterized in that: A driving IC is arranged on the binding area; The display module further comprises a flexible circuit board, one end of which is bound and connected to the binding area; The display module further includes a conductive metal layer, and the conductive metal layer includes covering the driver IC and a portion of the flexible circuit board; The conductive metal layer includes a first portion, an orthographic projection of the first portion on the array substrate is located in the second region, and the isolation layer is formed by the first portion extending toward opposite sides of the driver IC in the second direction; Forming an insulating layer on the portion of the protective adhesive layer located in the edge area specifically includes: The conductive metal layer is formed on the protective adhesive layer to complete the setting of the isolation layer.

11. The method for manufacturing a display module according to claim 8, characterized in that: The insulating layer is an ink layer formed by printing ink on the protective rubber layer; Forming an insulating layer on the portion of the protective adhesive layer located in the edge area specifically includes: Laminating a silk screen printing plate to the edge area of ​​the second region, and filling the silk screen printing plate with ink; The ink layer is formed in the edge area by coating and printing.

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