Adapter board, CPU (Central Processing Unit) adapter method and computer equipment

Abstract

The invention provides an adapter plate, a CPU switching method and computer equipment, the adapter plate is used for connecting a desktop mainboard and a mobile CPU, the adapter plate is of a multi-layer structure, and the multi-layer structure comprises a top plate layer and a bottom plate layer which are arranged away from each other; the adapter plate is in plug-in fit with the desktop mainboard, and under the condition that the adapter plate is in plug-in connection with the desktop mainboard, the top plate layer is arranged on the side, away from the desktop mainboard, of the bottom plate layer, and the bottom plate layer is electrically connected with the desktop mainboard; wherein a welding part is arranged on one side, deviating from the bottom plate layer, of the top plate layer, and the welding part is used for welding a mobile CPU; according to the adapter plate, the mobile CPU can be switched to the desktop mainboard, and the flexibility and applicability of the mobile CPU can be improved.

Description

Technical Field

[0001] The present application belongs to the field of switching technology, and in particular, relates to a switching board, a CPU switching method and a computer device. Background Art

[0002] With the rapid development of information technology, the update and iteration of computer hardware is accelerating. The performance improvement of the central processing unit (CPU) as the core component of the computer system is directly related to the improvement of the overall computing power. In the current computer market, laptops and desktops each occupy an important position, serving different user groups and application scenarios. However, there are significant differences between the two in hardware configuration, especially in the compatibility and interchangeability of CPUs.

[0003] However, the CPU of a traditional notebook cannot be directly installed on the motherboard of a desktop computer, which results in low flexibility and applicability of the notebook CPU. Summary of the invention

[0004] The purpose of the present application is to provide an adapter board, a CPU adapter method and a computer device, aiming to solve the problem of low flexibility and applicability of notebook CPUs in traditional technologies.

[0005] A first aspect of an embodiment of the present application provides an adapter board, the adapter board is used to connect a desktop motherboard and a mobile CPU, the adapter board is a multi-layer structure, and the multi-layer structure includes a top plate layer and a bottom plate layer that are arranged away from each other; The adapter board is plugged and adapted to the desktop motherboard, and when the adapter board is plugged into the desktop motherboard, the top board layer is arranged on a side of the bottom board layer away from the desktop motherboard, and the bottom board layer is electrically connected to the desktop motherboard; Wherein, a welding portion is arranged on a side of the top plate layer away from the bottom plate layer, and the welding portion is used for welding the mobile CPU.

[0006] In some embodiments of the present application, the bottom board layer is used to form a contact array packaging structure with the desktop motherboard.

[0007] In some embodiments of the present application, a contact is provided on the side of the bottom plate layer facing away from the top plate layer, and an electroplating layer for electrically connecting to the desktop motherboard is provided on the contact, and the electroplating layer is a water-gold electroplating layer.

[0008] In some embodiments of the present application, the top plate layer is used to form a ball grid array packaging structure with the mobile CPU.

[0009] In some embodiments of the present application, the welding portion includes a welding pad, on which a soldering film layer for welding with the mobile CPU is provided, and the soldering film layer is an organic soldering film layer.

[0010] In some embodiments of the present application, the multi-layer structure includes a plurality of routing layers, and the plurality of routing layers are sequentially stacked between the top plate layer and the bottom plate layer; The top plate layer is provided with a first signal routing area and a first power supply routing area, the first signal routing area is used for data exchange with the mobile CPU, and the first power supply routing area is used for powering the mobile CPU; the first signal routing area and the first power supply routing area are routed through the routing layer to electrically connect the bottom plate layer.

[0011] In some embodiments of the present application, a second signal routing area and a second power supply routing area are provided on the bottom plate layer, the second signal routing area is used for data exchange with the desktop motherboard, and the second power supply routing area is used for obtaining a power supply signal of the desktop motherboard; The first signal routing region is electrically connected to the second signal routing region through the routing layer, and the first power supply routing region is electrically connected to the second power supply routing region through the routing layer.

[0012] In some embodiments of the present application, a plurality of signal routings are arranged in the routing layer, the signal routings are connected to the first signal routing area and the second signal routing area, and the signal routings include control signal routings, display signal routings, parameter configuration signal routings, and communication signal routings.

[0013] A second aspect of the present application further provides a CPU switching method, the switching method comprising: Obtain a desktop motherboard, and read a BIOS file of the desktop motherboard; Reading the bottom layer of the BIOS file and disabling the inventory unit identification function in the management engine in the bottom layer; The adapter plate as described above is mounted on the desktop motherboard, and a mobile CPU is mounted on a side of the adapter plate away from the desktop motherboard.

[0014] The third aspect of the present application also provides a computer device, including a desktop motherboard, a mobile CPU and an adapter board as described above, wherein the adapter board is connected to the desktop motherboard and the mobile CPU respectively.

[0015] The beneficial effects of the present application are as follows: in the adapter board, CPU adapter method and computer device of the present application, the adapter board is used to connect a desktop motherboard and a mobile CPU, the adapter board is a multi-layer structure, and the multi-layer structure includes a top plate layer and a bottom plate layer that are arranged away from each other; the adapter board is plug-fitted to the desktop motherboard, and when the adapter board is plugged into the desktop motherboard, the top plate layer is arranged on a side of the bottom plate layer away from the desktop motherboard, and the bottom plate layer is electrically connected to the desktop motherboard; wherein a welding portion is arranged on a side of the top plate layer away from the bottom plate layer, and the welding portion is used to weld the mobile CPU; the adapter board in the present application can transfer the mobile CPU to the desktop motherboard, which is beneficial to improving the flexibility and applicability of the mobile CPU. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the application framework structure of an adapter board provided in one embodiment of the present application; Figure 2 A schematic diagram of the structure of an adapter board provided in one embodiment of the present application; Figure 3 Another structural schematic diagram of an adapter plate provided in one embodiment of the present application; Figure 4 A schematic diagram of the steps of a switching method provided in one embodiment of the present application.

[0017] Specific element symbol description: 100-desktop motherboard, 200-adapter board, 210-top board layer, 220-bottom board layer, 300-mobile CPU. DETAILED DESCRIPTION

[0018] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0019] It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0021] It is important to know that with the rapid development of information technology, the update and iteration of computer hardware is accelerating. The performance improvement of the central processing unit (CPU) as the core component of the computer system is directly related to the improvement of the overall computing power. In the current computer market, laptops and desktops each occupy an important position, serving different user groups and application scenarios. However, there are significant differences between the two in hardware configuration, especially in CPU compatibility and interchangeability.

[0022] Traditionally, in pursuit of portability and energy efficiency, laptop CPU designs often use low-power, highly integrated packaging, such as BGA (Ball Grid Array) packaging. This packaging method allows the CPU to be directly soldered to the motherboard, which not only helps to reduce size and weight, but also effectively manages heat dissipation and power consumption. In contrast, desktop CPUs focus more on high-performance computing and are usually installed in a slot-type manner, such as LGA (Land Grid Array) or PGA (Pin Grid Array), which is convenient for users to upgrade and replace according to their needs.

[0023] It is precisely because of this difference in packaging and design that the notebook CPUs currently on the market cannot be directly installed on the motherboard of a desktop computer. This limitation not only restricts the application of notebook CPUs in a wider range of scenarios, such as high-performance computing, graphics rendering, etc., but also restricts the ability of users to flexibly configure and upgrade computer hardware according to actual needs. In addition, with the continuous advancement of mobile computing technology, some high-performance, low-power notebook CPUs have gradually approached or even surpassed some desktop CPUs in terms of energy efficiency, but their application potential has not been fully tapped due to compatibility issues.

[0024] Based on this, the present application improves the traditional adapter board, CPU adapter method and computer equipment.

[0025] See also Figures 1 to 3 , Figure 1 A schematic diagram of the application framework structure of the adapter board 200 provided in this embodiment; Figure 2 A schematic diagram of the structure of the adapter board provided in this embodiment, Figure 3Another structural schematic diagram of the adapter board provided in the present embodiment; the adapter board 200 of the present embodiment is used to connect the desktop motherboard 100 and the mobile CPU 300, and the adapter board 200 is a multi-layer structure, and the multi-layer structure includes a top plate layer 210 and a bottom plate layer 220 that are arranged away from each other; the adapter board 200 is plugged and adapted with the desktop motherboard 100, and when the adapter board 200 is plugged with the desktop motherboard 100, the top plate layer 210 is arranged on a side of the bottom plate layer 220 away from the desktop motherboard 100, and the bottom plate layer 220 is electrically connected to the desktop motherboard 100; wherein, a welding portion is provided on a side of the top plate layer 210 away from the bottom plate layer 220, and the welding portion is used for welding the mobile CPU 300.

[0026] It should be explained that the multi-layer structure of the adapter board 200 is conducive to realizing complex electrical connections and signal transmission. The desktop motherboard 100 refers to the motherboard of a desktop computer, and the mobile CPU 300 refers to the CPU of a notebook. It can be understood that one side of the adapter board 200 (the bottom plate layer 220) is installed and adapted with the desktop motherboard 100, and the other side (the top plate layer 210) is installed and adapted with the mobile CPU 300. Therefore, the adapter board 200 in this application can transfer the mobile CPU 300 to the desktop motherboard 100, which is conducive to improving the flexibility and applicability of the mobile CPU 300.

[0027] Specifically, under normal circumstances, when a desktop CPU and a notebook CPU have the same process and performance, the desktop CPU is more expensive than the notebook CPU, but the notebook CPU is soldered to the motherboard and cannot be replaced. In this embodiment, the notebook CPU is soldered to the adapter board 200, and then the adapter board 200 is installed on the desktop, which is conducive to reducing the price of the CPU used in the desktop.

[0028] In this embodiment, an adapter board 200 is provided to connect the mobile CPU 300 to the desktop motherboard 100, and can transfer the power supply and signal routing of the mobile CPU 300 to the pins with the same functions on the bottom board layer 220, so as to realize the connection of circuits and electrical appliances of two different packaging forms. The adapter board 200 is mainly used to realize the use of mobile chips and convenient replacement of CPU on the desktop motherboard, and perfectly combines the low power consumption and low cost of the mobile CPU with the detachable advantages of the desktop CPU.

[0029] In some embodiments, the adapter board 200 has the same shape and size as a desktop CPU. A desktop CPU refers to a CPU of a desktop computer.

[0030] In some embodiments of the present application, the bottom plate layer 220 is used to form a contact array packaging structure with the desktop motherboard 100. It can be understood that the contact array packaging (Land Grid Array, LGA) is a packaging method in which flat electrode contacts in an array state are made on the bottom surface. These metal contacts are arranged in a grid shape at the bottom of the package and directly contact the corresponding pads on the desktop motherboard 100.

[0031] In some embodiments of the present application, a contact is provided on the side of the bottom plate layer 220 facing away from the top plate layer 210 , and an electroplating layer for electrically connecting to the desktop motherboard 100 is provided on the contact, and the electroplating layer is a water-gold electroplating layer.

[0032] It is understood that the electroplating layer is a metal film formed on the surface of the contact through the electroplating process. This film can not only improve the electrical conductivity of the contact, but also enhance its corrosion resistance, oxidation resistance and wear resistance. Specifically, the water-gold electroplating layer is a specific type of electroplating layer, which generally refers to the process of electroplating and depositing metallic gold in an aqueous solution. Gold has good conductivity, corrosion resistance and oxidation resistance, so the water-gold electroplating layer can significantly improve the electrical performance and long-term stability of the contact.

[0033] In some embodiments of the present application, the top plate layer 210 is used to form a ball grid array packaging structure with the mobile CPU 300 .

[0034] It is understood that the ball grid array (BGA) is a surface mounting technology used in integrated circuits. The BGA package provides a larger number of pins and a smaller pin pitch through a solder ball array, thereby achieving high-density interconnection. The pins of the BGA package are very short and the signal path is short, thereby reducing the lead inductance and capacitance. This helps to reduce signal transmission delay and distortion and improve signal integrity. In addition, the BGA package also has lower impedance and better matching characteristics, further enhancing the electrical performance. The top plate layer 210 is in direct contact with the mobile CPU 300, and conducts heat to the adapter board 200 through the packaging structure, which is conducive to improving the heat dissipation performance.

[0035] In some embodiments of the present application, the welding portion includes a welding pad, on which a soldering film layer for welding with the mobile CPU 300 is provided, and the soldering film layer is an organic soldering film layer.

[0036] It is understandable that the solder film layer is a thin film coated on the surface of the pad, and its main function is to protect the pad from oxidation, pollution and mechanical damage during the welding process, thereby ensuring the reliability and quality of welding. The solder film layer can also provide the necessary wettability and fluidity during welding, which helps to evenly distribute and contact the solder. In this embodiment, the solder film layer is an organic solder film layer. The organic solder film layer is usually made of organic compounds (such as resins, polymers, etc.), which have good insulation, heat resistance and chemical stability. Compared with inorganic solder film layers (such as tin plating, nickel plating, etc.), organic solder film layers have lower costs and better processing performance, so they are more advantageous in certain applications.

[0037] In some embodiments of the present application, the multi-layer structure includes multiple routing layers, and the multiple routing layers are stacked in sequence between the top plate layer 210 and the bottom plate layer 220; a first signal routing area and a first power supply routing area are provided on the top plate layer 210, the first signal routing area is used for data interaction with the mobile CPU 300, and the first power supply routing area is used for powering the mobile CPU 300; the first signal routing area and the first power supply routing area are routed through the routing layer to electrically connect to the bottom plate layer 220.

[0038] It should be explained that the multilayer structure is a highly integrated packaging design, which realizes high-density, high-performance electrical connection by stacking multiple routing layers in sequence between the top plate layer 210 and the bottom plate layer 220. This design not only improves the pin density of the package, but also optimizes the signal transmission path and reduces signal delay and distortion. The first signal routing area is used for data interaction with the mobile CPU 300. It contains the signal lines required for communication with the mobile CPU 300. These signal lines are connected to the bottom plate layer 220 or other components through the routing layer to realize data transmission and exchange.

[0039] The first power supply wiring area is used to supply power to the mobile CPU 300. It includes power lines, which are connected to the power management module or the external power supply through the wiring layer to provide stable voltage and current for the mobile CPU 300. Between the first signal wiring area and the first power supply wiring area, wiring is performed through the wiring layer to achieve electrical connection between them and the bottom plate layer 220 or other components. This design enables the signal line and the power line to be transmitted along a predetermined path, avoiding mutual interference and signal loss.

[0040] In some embodiments of the present application, a second signal routing area and a second power supply routing area are provided on the bottom board layer 220, the second signal routing area is used for data exchange with the desktop motherboard 100, and the second power supply routing area is used for obtaining the power supply signal of the desktop motherboard 100; wherein, the first signal routing area is electrically connected to the second signal routing area through a routing layer, and the first power supply routing area is electrically connected to the second power supply routing area through a routing layer.

[0041] It is understandable that the second signal routing area is used for data exchange with the desktop motherboard 100. It includes signal lines required for communication with the desktop motherboard 100, and these signal lines are connected to the top board layer 210 or other routing layers through the routing layer to achieve data transmission and exchange. The second power supply routing area is used to obtain the power supply signal of the desktop motherboard 100. It includes power lines, which are connected to the power management module of the desktop motherboard 100 or the external power supply through the routing layer to provide stable voltage and current for the mobile device.

[0042] In some embodiments, the number of routing layers is 8 layers.

[0043] In some embodiments of the present application, multiple signal routings are arranged in the routing layer, the signal routings are connected to the first signal routing area and the second signal routing area, and the signal routings include control signal routings, display signal routings, parameter configuration signal routings and communication signal routings.

[0044] In some embodiments, the routing layer includes DDR (Double Data Rate) signal routing, PCIE (Peripheral Component Interconnect Express) signal routing, Control signal routing, Misc (miscellaneous or auxiliary) signal routing, CFG (parameter configuration) signal routing, and Audio signal routing.

[0045] Specifically, DDR signal is an important channel for data transmission between CPU and memory. It includes address bus, data bus and control bus, etc., which are used to implement CPU to read and write memory data. During the connection process, it is necessary to ensure the integrity and timing accuracy of DDR signal to ensure the stability and speed of data transmission.

[0046] PCIE signal is a high-speed serial computer expansion bus standard used to connect CPU and external devices (such as graphics cards, network cards, etc.). It supports hot plugging, high data rate and point-to-point transmission. During the connection process, it is necessary to ensure the synchronization and transmission rate of PCIE signal to meet the data transmission requirements of external devices.

[0047] The Control signal is a signal used by the CPU to control external devices and internal components. It includes various control instructions and status signals, which are used to achieve precise control of external devices and internal components by the CPU. During the connection process, it is necessary to ensure the accuracy and reliability of the Control signal to ensure the normal operation and stability of the system.

[0048] Misc signals usually refer to some miscellaneous or auxiliary signals, which may include clock signals, reset signals, interrupt signals, etc. These signals play an important role in the operation of the CPU and are used to implement system synchronization, reset, and interrupt processing functions. During the connection process, it is necessary to ensure the integrity and timing accuracy of the Misc signals to ensure the stability and reliability of the system. CFG signals usually refer to configuration signals, which are used to set the operating modes and parameters of the CPU and other components. These signals may include various configuration registers, control bits, and status bits. During the connection process, it is necessary to ensure the accuracy and consistency of the CFG signals to ensure the correct configuration and stable operation of the system.

[0049] Audio signals are signals used by the CPU to process audio data. They may include audio input / output signals, audio control signals, etc. During the connection process, it is necessary to ensure the clarity and fidelity of the Audio signal to meet the needs of audio processing. The power signal and the ground signal are the basis for the normal operation of the CPU. The power signal provides the required electrical energy to the CPU, while the ground signal serves as a reference point for the current. During the connection process, it is necessary to ensure the stability of the power signal and the reliability of the ground signal to ensure the normal operation and stability of the CPU.

[0050] Further, in order to better implement the adapter plate 200 in any of the above embodiments, based on the adapter plate 200 in the above embodiments, please refer to Figure 2 , Figure 2 The schematic diagram of the steps of the switching method provided by this embodiment is shown. The present application also provides a CPU switching method, the switching method comprising: S100: Obtain a desktop motherboard 100 and read the BIOS file of the desktop motherboard 100; specifically, for the target desktop motherboard 100 to be transferred, read the BIOS (Basic Input Output System) file of the target desktop motherboard 100, the BIOS file usually contains important data such as the motherboard's hardware configuration information, boot sequence, hardware self-test program, etc. The purpose of reading the BIOS file is to modify or configure it later.

[0051] S200: Read the bottom layer of the BIOS file and turn off the stock keeping unit identification function in the management engine in the bottom layer; specifically, read the bottom layer of the BIOS file and find the stock keeping unit (SKU) identification function in the management engine (ME). The management engine is a technology on the Intel platform that is responsible for handling some low-level hardware management and security-related tasks. Turning off the SKU identification function may be to avoid conflicts between the mobile CPU 300 and certain specific configurations or security mechanisms of the desktop motherboard 100 after the mobile CPU 300 is installed on the adapter board 200.

[0052] S300: Install the adapter plate 200 as described above onto the desktop motherboard 100, and install the mobile CPU 300 on the side of the adapter plate 200 facing away from the desktop motherboard 100. Specifically, the adapter plate 200 mentioned above needs to be installed on the desktop motherboard 100. The design of the adapter plate 200 is to allow the mobile CPU 300 to adapt to the desktop motherboard 100. After the adapter plate 200 is installed, the mobile CPU 300 needs to be installed on the side of the adapter plate 200 facing away from the desktop motherboard 100 (that is, the other side of the adapter plate 200). In this way, through the adapter plate 200, the mobile CPU 300 can communicate and interact with the desktop motherboard 100.

[0053] In some embodiments, after step S200, the process further includes: replacing the management engine with a specified COR special version management engine, and adding the missing microcode of the desktop motherboard 100. Specifically, the microcode is a small piece of program code inside the processor for implementing a specific instruction set and operation, and it is usually embedded in the firmware of the processor. In some cases, the desktop motherboard 100 may lack some necessary microcodes due to some reasons. These missing microcodes may cause the processor to fail to correctly execute certain instructions or operations, thereby affecting the stability and performance of the system.

[0054] It should be explained that not all motherboards need to use the above-mentioned CPU switching method to disable SKU identification. Some motherboards can be switched directly without modification.

[0055] Furthermore, in order to better implement the adapter board 200 in any of the above-mentioned embodiments, based on the adapter board 200 in the above-mentioned embodiments, the present application also provides a computer device, including a desktop motherboard 100, a mobile CPU 300 and the adapter board 200 as described above, and the adapter board 200 is respectively connected to the desktop motherboard 100 and the mobile CPU 300.

[0056] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0057] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements and amendments to the present application. Such modifications, improvements and amendments are suggested in the present application, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of the present application.

[0058] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0059] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus help understand one or more embodiments of the invention, in the above description of the embodiments of this application, multiple features are sometimes combined into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

[0060] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A transfer plate, characterized in that: The adapter board is used to connect the desktop motherboard and the mobile CPU, and the adapter board is a multi-layer structure, and the multi-layer structure includes a top plate layer and a bottom plate layer that are arranged away from each other; The adapter board is plugged and adapted to the desktop motherboard, and when the adapter board is plugged into the desktop motherboard, the top board layer is arranged on a side of the bottom board layer away from the desktop motherboard, and the bottom board layer is electrically connected to the desktop motherboard; Wherein, a welding portion is arranged on a side of the top plate layer away from the bottom plate layer, and the welding portion is used for welding the mobile CPU.

2. The adapter plate according to claim 1, characterized in that: The bottom plate layer is used to form a contact array packaging structure with the desktop mainboard.

3. The adapter plate according to claim 2, characterized in that: A contact is arranged on the side of the bottom plate layer facing away from the top plate layer, and an electroplating layer for electrically connecting to the desktop mainboard is arranged on the contact, and the electroplating layer is a water-gold electroplating layer.

4. The adapter plate according to claim 1, characterized in that: The top plate layer is used to form a ball grid array packaging structure with the mobile CPU.

5. The adapter plate according to claim 4, characterized in that: The welding portion comprises a welding pad, on which a soldering film layer for welding with the mobile CPU is arranged, and the soldering film layer is an organic soldering film layer.

6. The adapter plate according to claim 1, characterized in that: The multi-layer structure comprises a plurality of routing layers, and the plurality of routing layers are sequentially stacked between the top plate layer and the bottom plate layer; The top plate layer is provided with a first signal routing area and a first power supply routing area, the first signal routing area is used for data exchange with the mobile CPU, and the first power supply routing area is used for powering the mobile CPU; the first signal routing area and the first power supply routing area are routed through the routing layer to electrically connect the bottom plate layer.

7. The adapter plate according to claim 6, characterized in that: The bottom plate layer is provided with a second signal wiring area and a second power supply wiring area, the second signal wiring area is used for data exchange with the desktop motherboard, and the second power supply wiring area is used for obtaining the power supply signal of the desktop motherboard; The first signal routing region is electrically connected to the second signal routing region through the routing layer, and the first power supply routing region is electrically connected to the second power supply routing region through the routing layer.

8. The adapter plate according to claim 7, characterized in that: A plurality of signal routings are arranged in the routing layer, the signal routings are connected to the first signal routing area and the second signal routing area, and the signal routings include control signal routings, display signal routings, parameter configuration signal routings, and communication signal routings.

9. A CPU switching method, characterized in that: The transfer method comprises: Obtain a desktop motherboard, and read a BIOS file of the desktop motherboard; Reading the bottom layer of the BIOS file and disabling the inventory unit identification function in the management engine in the bottom layer; The adapter plate as claimed in any one of claims 1 to 8 is mounted on the desktop motherboard, and a mobile CPU is mounted on a side of the adapter plate away from the desktop motherboard.

10. A computer device, characterized in that: It comprises a desktop motherboard, a mobile CPU and an adapter board as claimed in any one of claims 1 to 8, wherein the adapter board is connected to the desktop motherboard and the mobile CPU respectively.

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