Display panel and electronic equipment

Abstract

The invention discloses a display panel and electronic equipment. The display panel comprises a panel part and a binding part, and the binding part is arranged on the side edge of the panel part; the binding part comprises a first bonding pad and a second bonding pad, and the second bonding pad is arranged on the side, away from the panel part, of the first bonding pad; the supporting columns are arranged between the first bonding pad and the second bonding pad, and when the film layer between the first bonding pad and the second bonding pad is subjected to upward arching force, the supporting columns can generate downward pressure and downward counter-acting force, upward arching of the film layer between the first bonding pad and the second bonding pad is slowed down, and signal transmission of the first bonding pad and the second bonding pad is kept. And the good display performance of the display panel can be maintained.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and an electronic device. Background Art

[0002] With the development of display technology, more and more display panels and display devices are used in people's daily life and work. However, with the popularization of display devices, people are no longer only pursuing display functions, but also putting forward more stringent requirements on appearance, such as requiring narrow borders.

[0003] In the process of narrow frame design, it is inevitable to compress the spacing between some structures. For example, the spacing between the input pad (input PAD) and the output pad (output PAD) of the lower frame is reduced. When the binding part is crimped with the driver chip (IC), the film layer between the input pad and the output pad is under pressure, which is easy to bulge and deform, and even cause the screen to break, affecting the signal transmission of the input pad and the output pad, and causing problems such as poor screen brightness. Summary of the invention

[0004] The display panel and electronic device provided in the present application improve the arching deformation of the film layer between the input pad and the output pad.

[0005] In order to solve the above technical problems, the first technical solution provided by the present application is: providing a display panel, comprising a panel part and a binding part; the binding part is arranged on the side of the panel part; the binding part comprises a first soldering pad and a second soldering pad, and the second soldering pad is arranged on the side of the first soldering pad away from the panel part; wherein a support column is arranged between the first soldering pad and the second soldering pad.

[0006] In one embodiment, the material of the support column includes metal; preferably, the material of the support column is the same as the material of the first pad, or the material of the support column is the same as the material of the second pad; preferably, the materials of the first pad, the second pad and the support column are the same.

[0007] In one embodiment, the distance between the support column and the first pad is recorded as L1, the distance between the support column and the second pad is recorded as L2, L1=L2; the distance between the first pad and the second pad is recorded as L0; the dimension of the support column along the direction from the first pad to the second pad is recorded as L3; L3≥(2 / 3)L0, 0<L1≤(1 / 6)L0.

[0008] In one embodiment, the distance between the support column and the first pad is recorded as L1, the distance between the support column and the second pad is recorded as L2, L1≠L2; the distance between the first pad and the second pad is recorded as L0; the dimension of the support column along the direction from the first pad to the second pad is recorded as L3; L3≤(1 / 6)L0; L1>L2, L2≤(1 / 4)L0; or, L2>L1, L1≤(1 / 4)L0.

[0009] In one embodiment, an insulating layer is provided on the surface of the support column, and the material of the insulating layer includes an inorganic material; preferably, the material of the insulating layer includes silicon nitride.

[0010] In one embodiment, an angle formed between the side surface of the support column and the bottom surface of the support column is less than 50 degrees.

[0011] In one embodiment, the sum of the thickness of the support column and the thickness of the insulating layer is less than or equal to half the thickness of the first pad; and / or the sum of the thickness of the support column and the thickness of the insulating layer is less than or equal to half the thickness of the second pad.

[0012] In one embodiment, the display panel also includes a driving chip, which is arranged opposite to the binding portion; the driving chip is electrically connected to the first pad and the second pad through a connecting portion; the spacing between the insulating layer and the driving chip is greater than the height of the connecting portion; preferably, the spacing between the insulating layer and the driving chip is greater than or equal to 15μm.

[0013] In one embodiment, a distance between the first pad and the second pad is less than 200 μm.

[0014] In order to solve the above technical problem, the second technical solution provided in the present application is: to provide an electronic device, comprising the display panel described in any one of the above items.

[0015] Beneficial effects of the present application: Different from the prior art, the present application discloses a display panel and an electronic device; the display panel includes a panel portion and a binding portion, and the binding portion is arranged on the side of the panel portion; the binding portion includes a first solder pad and a second solder pad, and the second solder pad is arranged on a side of the first solder pad away from the panel portion; a support column is provided between the first solder pad and the second solder pad, and when the film layer between the first solder pad and the second solder pad is subjected to an upward arching force, the support column will generate a downward pressure and a downward reaction force, slowing down the upward arching of the film layer between the first solder pad and the second solder pad, maintaining signal transmission between the first solder pad and the second solder pad, and facilitating maintaining good display performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 1. It is a schematic diagram of the forces acting on the input PAD and the output PAD in one embodiment;

[0018] Figure 2 It is a force diagram of the input PAD and the output PAD under another implementation mode;

[0019] Figure 3 is a schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0020] Figure 4 is a structural schematic diagram of a binding portion of a display panel provided in an embodiment of the present application;

[0021] Figure 5 yes Figure 3 A schematic diagram of the forces between the first pad, the second pad and the support column shown;

[0022] Figure 6 yes Figure 3 A schematic diagram of the positional relationship structure of an embodiment of the first pad, the second pad, and the support column shown;

[0023] Figure 7 yes Figure 3 A schematic diagram of the positional relationship structure of another embodiment of the first pad, the second pad, and the support column shown;

[0024] Figure 8 yes Figure 3 A schematic diagram of the local structure between the binding part and the driving chip is shown. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0026] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0027] The terms "first", "second", and "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", and "third" can explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. All directional indications in the embodiments of this application (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. The terms "including" and "having" in the embodiments of this application and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products, or devices.

[0028] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0029] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0030] In the process of narrow bezel design, it is inevitable to compress the spacing between some structures to achieve a narrow bezel, which includes the COP area of ​​the lower bezel. This area is mainly used to connect the PAD signal of the driver chip (IC), and the area is designed with circuit-connected input signal area and output signal area, called input PAD and output PAD. The input PAD and output PAD are connected to the IC to transmit the signal between the screen and the IC.

[0031] When the distance between the input PAD and the output PAD is large, during the IC bonding process, the COP is under pressure. Due to the large distance between the input PAD and the output PAD, the film layer between the input PAD and the output PAD is relatively small in force, deforms slowly, or even almost does not deform, and no adverse events occur (such as Figure 1 As shown, Figure 1Figure 1 is a schematic diagram of the forces acting on the input PAD and output PAD in an implementation method). In order to ensure the design of a narrow frame, the distance between the output PAD and the output PAD is reduced. As a result, the COP area is subjected to pressure when it is crimped with the IC, and the film layer between the input PAD and the output PAD is subjected to pressure at both ends, causing the middle of the film layer between the input PAD and the output PAD to bulge and deform. When the deformation reaches a certain degree, the film layer between the input PAD and the output PAD will break, causing the metal traces between the film layers to break, and the metal wires connecting the screen to fail, resulting in poor screen bright lines; water and oxygen will invade the cracks, affecting signal transmission and impedance testing (such as Figure 2 As shown, Figure 2 2 is a schematic diagram of the forces acting on the input PAD and the output PAD under another implementation mode).

[0032] In view of this, the present application provides a display panel and an electronic device to improve the arching deformation of the film layer between the input pad and the output pad, and maintain good display performance of the display panel.

[0033] See also Figure 3-Figure 8 , Figure 3 is a schematic diagram of the structure of a display panel provided in an embodiment of the present application, Figure 4 is a schematic diagram of the structure of the binding portion of the display panel provided in an embodiment of the present application, Figure 5 yes Figure 3 The force diagram between the first pad, the second pad and the support column is shown in FIG. Figure 6 yes Figure 3 The schematic diagram of the positional relationship of the first pad, the second pad, and the support column in one embodiment is shown. Figure 7 yes Figure 3 The schematic diagram of the positional relationship structure of another embodiment of the first pad, the second pad and the support column is shown, Figure 8 yes Figure 3 A schematic diagram of the local structure between the binding part and the driving chip is shown.

[0034] The display panel includes a panel portion 11, a binding portion 12 and a driving chip 13. The panel portion 11 is used to display images. The binding portion 12 is arranged at the side of the panel portion 11; illustratively, the binding portion 12 is arranged at the bottom of the panel portion 11. The driving chip 13 is arranged opposite to the binding portion 12 and is electrically connected.

[0035] The binding portion 12 includes a first pad 121 and a second pad 122, and the second pad 122 is arranged on a side of the first pad 121 away from the panel portion 11. One of the first pad 121 and the second pad 122 is an input pad, and the other of the first pad 121 and the second pad 122 is an output pad. Exemplarily, the first pad 121 is an output pad, and the second pad 122 is an input pad. Exemplarily, the binding portion 12 includes a plurality of first pads 121 and a plurality of second pads 122, and the plurality of first pads 121 are arranged along a first direction, and the plurality of second pads 122 are arranged along the first direction, and the first direction intersects with the direction from the first pad 121 to the second pad 122.

[0036] A support column 123 is disposed between the first pad 121 and the second pad 122. Figure 5 As shown, during the binding process of the binding portion 12 with the driver chip 13, the first pad 121 and the second pad 122 are subjected to a downward extrusion force. When the extrusion causes the film layer between the first pad 121 and the second pad 122 to be subjected to an upward arching force, the support column 123 will generate a downward pressure and a downward reaction force, which will inhibit the upward arching force, thereby slowing down the upward arching of the film layer between the first pad 121 and the second pad 122, reducing the probability of film cracks, thereby reducing the possibility of metal routing between the film layers breaking, maintaining the signal transmission of the first pad 121 and the second pad 122, and at the same time weakening the intrusion of water and oxygen, which is conducive to maintaining good display performance of the display panel.

[0037] In one embodiment, the spacing between the first solder pad 121 and the second solder pad 122 is less than 200 μm, and the spacing between the first solder pad 121 and the second solder pad 122 is relatively small. By setting a support column 123 between the first solder pad 121 and the second solder pad 122, the binding portion 12 can significantly alleviate the deformation and arching of the film layer between the first solder pad 121 and the second solder pad 122 during the binding process, thereby avoiding cracks in the film layer between the first solder pad 121 and the second solder pad 122.

[0038] In one embodiment, the binding portion 12 is provided with a plurality of support columns 123 , which are arranged along the arrangement direction of the plurality of first pads 121 or the plurality of second pads 122 , and one support column 123 is correspondingly provided between one first pad 121 and one second pad 122 .

[0039] In one embodiment, the binding portion 12 is provided with a support column 123 , and the plurality of first pads 121 and the plurality of second pads 122 are respectively disposed on opposite sides of the support column 123 . In other words, the support column 123 is disposed between the plurality of first pads 121 and the plurality of second pads 122 .

[0040] In one embodiment, the material of the support column 123 includes metal, and the metal material has a certain hardness and a high modulus. When the film layer between the first pad 121 and the second pad 122 is arched upward under pressure, the support column 123 can better suppress the reaction force generated by the pressure and better suppress the deformation of the film layer between the first pad 121 and the second pad 122.

[0041] Optionally, the material of the support column 123 is the same as that of the first pad 121, so that the support column 123 and the first pad 121 can be completed in the same process, saving material and time costs without increasing the production schedule, and can better control the size and height of the support column 123.

[0042] Optionally, the material of the support column 123 is the same as that of the second solder pad 122, so that the support column 123 and the second solder pad 122 can be completed in the same process, saving material and time costs without increasing the production schedule, and can better control the size and height of the support column 123.

[0043] Optionally, the first solder pad 121, the second solder pad 122, and the support column 123 are made of the same material, so that the support column 123 can be completed in the same process as the first solder pad 121 and the second solder pad 122, saving material and time costs without increasing the production schedule, and can better control the size and height of the support column 123.

[0044] In one embodiment, if Figure 6 As shown, the support column 123 is disposed at the middle position between the first pad 121 and the second pad 122. Specifically, the distance between the support column 123 and the first pad 121 is recorded as L1, and the distance between the support column 123 and the second pad 122 is recorded as L2, L1 = L2; the distance between the first pad 121 and the second pad 122 is recorded as L0; the dimension of the support column 123 along the direction from the first pad 121 to the second pad 122 is recorded as L3; L3 ≥ (2 / 3) L0, 0 < L1 ≤ (1 / 6) L0.

[0045] When the support column 123 is arranged at the middle position between the first solder pad 121 and the second solder pad 122, 0<L1=L2 is designed to avoid short circuit between the support column 123 and the first solder pad 121 and the second solder pad 122; by designing L1=L2≤(1 / 6)L0, L3≥(2 / 3)L0, the support column 123 can achieve a better reaction effect, and the spacing between the support column 123 and the first solder pad 121 and the spacing between the support column 123 and the second solder pad 122 are small. The original binding and squeezing pressure of the first solder pad 121 and the second solder pad 122 will hardly deform the film layer between the support column 123 and the first solder pad 121 and the film layer between the support column 123 and the second solder pad 122, which significantly improves the arching deformation of the film layer between the first solder pad 121 and the second solder pad 122.

[0046] In one embodiment, if Figure 7 As shown, the support column 123 is offset between the first pad 121 and the second pad 122. Specifically, the distance between the support column 123 and the first pad 121 is recorded as L1, and the distance between the support column 123 and the second pad 122 is recorded as L2, L1≠L2, L1>L2 or L2>L1; the distance between the first pad 121 and the second pad 122 is recorded as L0; the dimension of the support column 123 along the direction from the first pad 121 to the second pad 122 is recorded as L3; L3≤(1 / 6)L0; when L1>L2, 0<L2≤(1 / 4)L0; or, when L2>L1, 0<L1≤(1 / 4)L0.

[0047] When the support column 123 is offset between the first pad 121 and the second pad 122, 0<L1, 0<L2 are designed to avoid short circuit between the support column 123 and the first pad 121 and the second pad 122. The offset design of the support column 123 guides the center point to the bottom of the support column 123, forming two moments with unequal spacings, namely, the spacing L1 between the support column 123 and the first pad 121 and the spacing L2 between the support column 123 and the second pad 122. At this time, the main deformation position will occur on the side of the long moment. Affected by the position of the support column 123, the moment at the long moment becomes shorter, and a greater force is required to deform it. At this time, the original binding pressure for squeezing the first pad 121 and the second pad 122 will not change, and the maximum force required for deformation at this position will not be reached. Therefore, the film layer between the support column 123 and the first pad 121 and the film layer between the support column 123 and the second pad 122 will not produce obvious bulging, thereby reducing the probability of fracture. By designing L1>L2, L2≤(1 / 4)L0; or L2>L1, L1≤(1 / 4)L0, the doming deformation of the film layer between the first pad 121 and the second pad 122 is significantly improved.

[0048] It should be noted that, whether the support column 123 is disposed in the middle position between the first pad 121 and the second pad 122, or the support column 123 is offset between the first pad 121 and the second pad 122, the support column 123 will generate a downward pressure and a downward reaction force, which will inhibit the upward arching force and slow down the upward arching of the film layer between the first pad 121 and the second pad 122. Figure 5 The force trend is shown.

[0049] In one embodiment, if Figure 6 and Figure 7As shown, an insulating layer 124 is provided on the surface of the support column 123. The material of the insulating layer 124 includes an inorganic material. When the material of the support column 123 is metal, and the material of the insulating layer 124 includes an inorganic material, the bonding force between the metal and the inorganic material has no covalent bond, and a reliable attachment relationship can be generated, and it is not easy for the film layer to be detached, that is, it is not easy for the insulating layer 124 to separate from the support column 123. In addition to being provided on the surface of the support column 123, the insulating layer 124 is also provided on the surface of the film layer between the support column 123 and the first pad 121, and the surface of the film layer between the support column 123 and the second pad 122. The insulating layer 124 can inhibit the erosion of water and oxygen on the support column 123, the film layer between the support column 123 and the first pad 121, and the film layer between the support column 123 and the second pad 122, which is beneficial to improving the performance of the display panel.

[0050] In one embodiment, the material of the isolation layer 124 includes silicon nitride. The bonding force between silicon nitride and the support pillars 123 has no covalent bond, and a secure attachment relationship can be generated.

[0051] In one embodiment, the angle formed between the side surface of the support column 123 and the bottom surface of the support column 123 is less than 50 degrees, so that in the process of forming the insulating layer 124 on the surface of the support column 123, a continuous insulating layer 124 is also formed on the surface of the film layer between the support column 123 and the first pad 121, and on the surface of the film layer between the support column 123 and the second pad 122, thereby reducing the impact of water and oxygen erosion and improving the performance of the display panel.

[0052] In one embodiment, the sum of the thickness of the support column 123 and the thickness of the insulating layer 124 is less than or equal to half of the thickness of the first pad 121; and / or, the sum of the thickness of the support column 123 and the thickness of the insulating layer 124 is less than or equal to half of the thickness of the second pad 122, so that the depths of the grooves formed by the support column 123 and the first pad 121 and the grooves formed by the support column 123 and the second pad 122 are not too deep, and a continuous insulating layer 124 can be formed on the film layer between the support column 123 and the first pad 121 and on the film layer between the support column 123 and the second pad 122; in addition, the insulating layer 124 can be spaced apart from the driver chip 13, so that the end surface of the first pad 121 and the end surface of the second pad 122 are kept higher than the surface of the insulating layer 124 away from the support column 123, thereby achieving a stable electrical connection between the first pad 121, the second pad 122 and the driver chip 13.

[0053] In one embodiment, if Figure 8As shown, the driver chip 13 is electrically connected to the first pad 121 and the second pad 122 through the connecting portion 131. The distance between the insulating layer 124 and the driver chip 13 is greater than the height of the connecting portion 131, and the insulating layer 124 will not contact the driver chip 13. Since the thickness of the first pad 121 and / or the second pad 122 is greater than the sum of the thickness of the support column 123 and the thickness of the insulating layer 124, by making the insulating layer 124 not contact the driver chip 13, the distance between the insulating layer 124 and the driver chip 13 is greater than the height of the connecting portion 131, so that the distance between the first pad 121 and the second pad 122 and the driver chip 13 can accommodate the lower connecting portion 131, thereby realizing that the first pad 121 and the second pad 122 are electrically connected to the driver chip 13 through the connecting portion 131.

[0054] Optionally, the spacing between the insulating layer 124 and the driver chip 13 is greater than or equal to 15 μm. It is understood that, generally, the height of the connecting portion 131 is less than 15 μm, and the spacing between the insulating layer 124 and the driver chip 13 is greater than or equal to 15 μm, so that the spacing between the first pad 121 and the second pad 122 and the driver chip 13 can accommodate the lower connecting portion 131, so that the first pad 121 and the second pad 122 are electrically connected to the driver chip 13 through the connecting portion 131.

[0055] The present application also provides an electronic device, which includes a display panel provided by any of the above embodiments, which is beneficial to improving the quality of the electronic device. The electronic device can be a desktop computer, a laptop computer, a personal digital assistant (PDA), a mobile phone, a television, etc.

[0056] The above are only implementation methods of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, characterized in that: include: Panel Department; A binding portion is arranged at a side of the panel portion; the binding portion comprises a first pad and a second pad, and the second pad is arranged at a side of the first pad away from the panel portion; Wherein, a supporting column is provided between the first pad and the second pad.

2. The display panel according to claim 1, characterized in that: The material of the support column includes metal; Preferably, the material of the support column is the same as that of the first pad, or the material of the support column is the same as that of the second pad; Preferably, the first pad, the second pad and the support column are made of the same material.

3. The display panel according to claim 1, characterized in that: The distance between the support column and the first pad is recorded as L1, and the distance between the support column and the second pad is recorded as L2, L1=L2; The distance between the first pad and the second pad is recorded as L0; the dimension of the support column along the direction from the first pad to the second pad is recorded as L3; L3≥(2 / 3)L0, 0<L1≤(1 / 6)L0.

4. The display panel according to claim 1, characterized in that: The distance between the support column and the first pad is recorded as L1, and the distance between the support column and the second pad is recorded as L2, where L1≠L2; The distance between the first pad and the second pad is recorded as L0; the dimension of the support column along the direction from the first pad to the second pad is recorded as L3; L3≤(1 / 6)L0; L1>L2, L2≤(1 / 4)L0; or L2>L1, L1≤(1 / 4)L0.

5. The display panel according to any one of claims 1 to 4, characterized in that: The surface of the support column is provided with an insulating layer, and the material of the insulating layer includes an inorganic material; Preferably, the material of the isolation layer includes silicon nitride.

6. The display panel according to claim 5, characterized in that: The angle formed between the side surface of the support column and the bottom surface of the support column is less than 50 degrees.

7. The display panel according to claim 5, characterized in that: The sum of the thickness of the support column and the thickness of the insulating layer is less than or equal to half of the thickness of the first pad; and / or the sum of the thickness of the support column and the thickness of the insulating layer is less than or equal to half of the thickness of the second pad.

8. The display panel according to claim 5, characterized in that: The display panel further includes a driving chip, which is arranged opposite to the binding portion; the driving chip is electrically connected to the first pad and the second pad through the connecting portion; The distance between the insulating layer and the driving chip is greater than the height of the connecting portion; Preferably, the distance between the insulating layer and the driving chip is greater than or equal to 15 μm.

9. The display panel according to claim 1, characterized in that: The distance between the first pad and the second pad is less than 200 μm.

10. An electronic device, characterized in that: A display panel comprising any one of claims 1 to 9.

Images