Wafer cutting method
By using an inert material with a melting point between 50 and 100°C as the wafer adhesion material, the problems of high cost and non-reusable adhesive films in the prior art are solved, and the recycling of resources and the reduction of production costs are achieved.
Patent Information
- Application Number
- CN202411609116.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-12
- Publication Date
- 2025-02-28
AI Technical Summary
The viscous films used in existing wafer cutting technologies are costly and cannot be reused, resulting in waste of resources and environmental protection issues.
An inert material with a melting point between 50 and 100°C is used as the wafer adhesion material, and the wafer is fixed during the cutting process by heating and cooling, and is recycled and reused after the cutting is completed.
It reduces production costs, reduces resource consumption, realizes recycling of materials, conforms to the concept of circular economy, and improves cutting accuracy and stability.
Smart Images
Figure CN119542255A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of wafer cutting, and in particular to a wafer cutting method. Background Art
[0002] In the existing wafer cutting technology process, the common practice is to first stick the wafer to the sticky film. Then, use a tape cutter to accurately cut the wafer. In this process, the sticky film will also be partially cut because it is connected to the wafer. After the cutting is completed, in order to further separate the sticky film from the cut single package unit, UV light will be used to irradiate the wafer. Finally, after the above steps, the cut single package unit is picked out and prepared for subsequent production or testing.
[0003] But the use of sticky film has limitations. First, the cost of sticky film is very high. Each roll of sticky film costs between 20,000 and 50,000 RMB, and one roll of sticky film can usually produce 220 wafers. This means that the cost of sticky film for each wafer is at least 90.9 RMB. Such a cost is a considerable burden for large-scale production. Secondly, sticky film cannot be reused after use. This leads to a waste of resources, and from an environmental protection perspective, this disposable feature does not conform to the current concept of sustainable development. Summary of the invention
[0004] In order to overcome the above-mentioned deficiencies in the prior art, the present application provides a wafer cutting method, the method comprising:
[0005] A wafer cutting jig is provided, wherein the wafer cutting jig comprises a receiving groove, and a wafer adhesive material is contained in the receiving groove;
[0006] The wafer adhesive material is heated for the first time by the wafer cutting jig to melt the wafer adhesive material into a liquid state;
[0007] Placing the wafer to be cut into the containing groove;
[0008] Stop heating the wafer adhesive material, so that the wafer adhesive material cools to a solid state and adheres to the wafer to be cut;
[0009] Cutting the wafer to be cut to obtain a plurality of packaging units;
[0010] heating the wafer adhesive material for a second time by the wafer cutting jig to melt the wafer adhesive material into a liquid state;
[0011] Taking out the plurality of packaging units from the containing tank.
[0012] In some possible implementations, the wafer attach material includes an inert material having a melting point between 50°C and 100°C.
[0013] In some possible implementations, the wafer attach material includes paraffin wax.
[0014] In some possible implementations, the method of heating the wafer adhesive material for the first time by the wafer cutting jig to melt the wafer adhesive material into a liquid state includes:
[0015] Placing the wafer cutting jig in a platform, wherein the platform has heating and cooling functions;
[0016] The wafer cutting jig is heated by the platform to melt the wafer adhesive material in the receiving groove into a liquid state.
[0017] In some possible implementations, the method of placing the wafer to be cut into the receiving groove includes:
[0018] The wafer to be cut is placed in the receiving groove, and the wafer to be cut is exposed to the wafer adhesive material in the receiving groove.
[0019] In some possible implementations, the method of stopping heating the wafer adhesive material, cooling the wafer adhesive material to a solid state, and adhering the wafer to be cut includes:
[0020] The wafer adhesive material in the receiving groove is cooled by the platform so that the wafer adhesive material is solidified into a solid state.
[0021] In some possible implementations, the method of cutting the wafer to be cut to obtain a plurality of packaging units includes:
[0022] The wafer to be cut is cut using a band saw to obtain a plurality of the packaging units.
[0023] In some possible implementations, the method of heating the wafer adhesive material for a second time by the wafer cutting jig to melt the wafer adhesive material into a liquid state includes:
[0024] The wafer adhesive material in the receiving groove is heated for a second time by the platform.
[0025] In some possible implementations, after taking out the plurality of packaging units from the containing grooves, the method further includes:
[0026] The plurality of packaging units are heated for a third time by the platform, so that the wafer adhesion material is melted or evaporated from the surfaces of the plurality of packaging units.
[0027] In some possible implementations, after taking out the plurality of packaging units from the wafer adhesive material, the method further includes:
[0028] The wafer adhesion material in the receiving groove of the wafer cutting jig is collected.
[0029] Compared with the prior art, this application has the following beneficial effects:
[0030] In this application, an inert material with a melting point between 50 and 100°C is used to replace the traditional sticky film, which not only reduces production costs but is also environmentally friendly. This inert material can effectively fix the wafer during the cutting process, ensuring the accuracy and stability of the cutting, while avoiding the extra consumption and waste of the sticky film during cutting. At the same time, the used inert material is not a disposable product, but can be recycled and reused, reducing resource consumption, bringing economic benefits to the enterprise, and conforming to the concept of circular economy. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0032] Figure 1 One of the flow charts of the wafer cutting method provided in this embodiment;
[0033] Figure 2 A schematic diagram of the state corresponding to step S12 provided in this embodiment;
[0034] Figure 3 A state diagram corresponding to step S14 provided in this embodiment;
[0035] Figure 4 A schematic diagram of the state corresponding to step S15 provided in this embodiment;
[0036] Figure 5 A schematic diagram of the state corresponding to step S16 provided in this embodiment;
[0037] Figure 6 A schematic diagram of the process of step S12 provided in this embodiment;
[0038] Figure 7 A second schematic flow chart of the wafer cutting method provided in this embodiment;
[0039] Figure 8 The third flowchart of the wafer cutting method provided in this embodiment.
[0040] Icons: 10-wafer cutting jig; 20-wafer adhesive material; 30-wafer to be cut; 31-multiple packaging units; 50-heating tool. DETAILED DESCRIPTION
[0041] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0042] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0043] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0044] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0045] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0046] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0047] The specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings.
[0048] The inventors have found that in the existing wafer cutting technology process, a common practice is to stick the wafer to the sticky film and then use a tape cutter to cut the wafer. However, the use of sticky film has limitations. The cost of sticky film is very high. The price of each roll of sticky film is between 20,000 and 50,000 yuan, and one roll of sticky film can usually produce 220 wafers. This means that the cost of each wafer on the sticky film is at least 90.9 yuan. Such a cost is a considerable burden for large-scale production. At the same time, the sticky film cannot be reused after use. This leads to a waste of resources, and from an environmental protection point of view, this disposable feature does not conform to the current concept of sustainable development.
[0049] This application provides a wafer cutting method, please refer to Figure 1 , the method comprising:
[0050] Step S11 , providing a wafer cutting jig 10 , wherein the wafer cutting jig 10 comprises a receiving groove, wherein the receiving groove has a wafer adhesive material 20 . For example, paraffin wax is selected as the wafer adhesive material 20 , and a proper amount of paraffin wax is put into the wafer cutting jig 10 .
[0051] Step S12, please refer to Figure 2 The wafer adhesive material 20 is heated for the first time by the wafer cutting jig 10, so that the wafer adhesive material 20 is melted into a liquid state. For example, the paraffin is heated for the first time by the wafer cutting jig 10 using the heating device 50, and the paraffin changes from a solid state to a liquid state.
[0052] Step S13, placing the wafer 30 to be cut in the receiving tank, for example, placing the wafer in liquid paraffin.
[0053] Step S14, please refer to Figure 3 , stop heating the wafer adhesive material 20, allow the wafer adhesive material 20 to cool to a solid state, and adhere the wafer to be cut 30. For example, stop heating the paraffin, wait for it to cool, and then fix the wafer to be cut 30.
[0054] Step S15, please refer to Figure 4 , the wafer to be cut 30 is cut to obtain a plurality of packaging units 31. For example, a mechanical cutting tool is used to cut the wafer to obtain a plurality of packaging units 31, and at this time, the packaging units 31 are still provided with paraffin.
[0055] Step S16, please refer to Figure 5 The wafer adhesive material 20 is heated for a second time by the wafer cutting jig 10 to melt the wafer adhesive material 20 into a liquid state. For example, the wax is heated for a second time by the wafer cutting jig 10 using the heating device 50, and the wax on the plurality of packaging units 31 changes from a solid state to a liquid state.
[0056] Step S17, taking out the plurality of packaging units 31 from the containing tank, for example, taking out the plurality of packaging units 31 from liquid paraffin.
[0057] In some possible implementations, the wafer attach material 20 includes an inert material having a melting point between 50° C. and 100° C.
[0058] In this embodiment, the wafer adhesive material 20 uses an inert material with a melting point between 50°C and 100°C. The wafer cutting process requires that the wafer adhesive material 20 can adhere to the wafer under specific conditions and release the packaging unit 31 after the cutting is completed. Inert materials with a melting point between 50°C and 100°C can meet this requirement. When heating and cooling the wafer adhesive material 20, this temperature range is relatively moderate, neither too high to cause inconvenience in operation or safety risks, nor too low to make the heating and cooling process take too long. When it melts into a liquid state, it can evenly cover the surface of the accommodating groove to form a smooth adhesive layer, which is conducive to the stable placement and firm adhesion of the wafer. When the wafer adhesive material 20 cools to a solid state, its adhesion is sufficient to keep the position of the wafer stable during the cutting process and ensure cutting accuracy.
[0059] In addition, inert materials are chemically stable and are not prone to chemical reactions with wafers or other materials, thus avoiding possible contamination or damage.
[0060] In some possible implementations, the wafer attach material 20 includes paraffin wax.
[0061] In this embodiment, the wafer adhesion material 20 uses paraffin. The cost of paraffin is about 7075 yuan / ton, and its density reaches 0.9 grams / cubic centimeter. In production, each wafer will use 2822.4 grams of paraffin. If the paraffin recycling strategy is implemented, the paraffin cost of a single wafer can be significantly reduced to 19.96 yuan. The use of this solution can reduce the cost of this process by more than 95%. Even without considering the recycling of paraffin, the cost of a single wafer is estimated to be reduced by more than 80%. In addition, the paraffin used in this process is used as an indirect material. In this solution, the recycling of indirect materials is realized, which not only reflects the innovativeness of the process, but also can reduce costs in large-scale production, and at the same time contributes to sustainable development.
[0062] For some possible implementations, please refer to Figure 6 , the step S12 comprises:
[0063] The wafer cutting jig 10 is placed in a platform, and the platform has heating and cooling functions; the wafer cutting jig 10 is heated by the platform to melt the wafer adhesive material 20 in the receiving groove into a liquid state.
[0064] In this embodiment, a heatable and coolable platform is used to heat and cool the wafer attach material 20. Other tools that can melt and solidify the wafer attach material 20 can also be used to cool and heat the wafer attach material 20.
[0065] In some possible implementations, step S13 includes:
[0066] The wafer 30 to be cut is placed in the receiving groove, and the wafer 30 to be cut is exposed to the wafer adhesive material 20 in the receiving groove.
[0067] In this embodiment, in order to enable operators to accurately position the wafer during wafer cutting, the wafer needs to be exposed to the wafer adhesive material 20, so the immersion height of the liquid wafer adhesive material 20 in the receiving tank cannot be higher than the wafer.
[0068] In some possible implementations, step S14 includes:
[0069] The wafer adhesive material 20 in the receiving groove is cooled by the platform so that the wafer adhesive material 20 is solidified into a solid state.
[0070] In this embodiment, since the platform has a cooling function, the wafer adhesive material 20 is cooled by the platform. After cooling, the wafer 30 to be cut is tightly adhered to the wafer adhesive material 20. At this time, the wafer adhesive material 20 can stabilize the position of the wafer during the cutting process and ensure its cutting accuracy.
[0071] In some possible implementations, step S15 includes:
[0072] The wafer 30 to be cut is cut using a band saw to obtain a plurality of the packaging units 31 .
[0073] It is worth noting that, in addition to the method for implementing step S15 provided in this embodiment, other methods for cutting wafers may also be used, such as laser cutting, electric spark cutting, coupling cutting, etc. The operator may choose according to actual conditions.
[0074] In some possible implementations, step S16 includes:
[0075] The wafer adhesive material 20 in the receiving groove is heated for the second time by the platform.
[0076] In this embodiment, after the wafer 30 to be cut is cut, the wafer cutting jig 10 is put back on the platform for heating. After being heated to an appropriate temperature, the wafer adhesive material 20 melts again, and the plurality of packaging units 31 can be easily separated from the wafer adhesive material 20.
[0077] For some possible implementations, please refer to Figure 7 After implementing step S17, the method further includes:
[0078] Step S18 , heating the plurality of packaging units 31 for a third time by the platform, so that the wafer adhesive material 20 is melted or evaporated from the surfaces of the plurality of packaging units 31 .
[0079] After implementing step S17, it is necessary to process the residual wafer adhesive material 20 on the multiple packaging units 31. Specifically, the multiple packaging units 31 are placed on a pre-prepared platform, and the platform heats the multiple packaging units 31. Under the action of heating, the residual wax of the wafer adhesive material 20 flows out from the surface of the multiple packaging units 31 or gradually evaporates. This process can further remove the residual wax on the packaging units 31 to ensure the cleanliness and purity of the product.
[0080] For some possible implementations, please refer to Figure 8 After implementing step S17, the method further includes:
[0081] Step S19, collecting the wafer adhesive material 20 in the receiving groove.
[0082] In this embodiment, after the wafer cutting is completed, the wafer adhesive material 20 in the receiving groove after the heating, cooling and cutting process is recovered and then reused in the wafer cutting process. This can improve the utilization rate of materials, reduce resource waste, and significantly reduce production costs through recycling.
[0083] In summary, the present application provides a wafer cutting method, the method comprising: providing a wafer cutting jig 10, the wafer cutting jig 10 comprising a receiving groove, the receiving groove having a wafer adhesive material 20; heating the wafer adhesive material 20 for the first time by the wafer cutting jig 10, so that the wafer adhesive material 20 melts to a liquid state; placing a wafer 30 to be cut in the receiving groove; stopping heating the wafer adhesive material 20, so that the wafer adhesive material 20 cools to a solid state, and adheres to the wafer 30 to be cut; cutting the wafer 30 to be cut to obtain a plurality of packaging units 31; heating the wafer adhesive material 20 for the second time by the wafer cutting jig 10, so that the wafer adhesive material 20 melts to a liquid state; taking out the plurality of packaging units 31 from the receiving groove. In this solution, an inert material with a melting point between 50 and 100°C is used to replace the traditional adhesive film, which not only reduces production costs and resource consumption, brings economic benefits to the enterprise, but also conforms to the concept of circular economy.
[0084] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A wafer cutting method, characterized in that: The method comprises: A wafer cutting jig is provided, wherein the wafer cutting jig comprises a receiving groove, and a wafer adhesive material is contained in the receiving groove; The wafer adhesive material is heated for the first time by the wafer cutting jig to melt the wafer adhesive material into a liquid state; Placing the wafer to be cut into the containing groove; Stop heating the wafer adhesive material, so that the wafer adhesive material cools to a solid state and adheres to the wafer to be cut; Cutting the wafer to be cut to obtain a plurality of packaging units; heating the wafer adhesive material for a second time by the wafer cutting jig to melt the wafer adhesive material into a liquid state; Taking out the plurality of packaging units from the containing tank.
2. The wafer cutting method according to claim 1, characterized in that: The wafer attach material includes an inert material having a melting point between 50°C and 100°C.
3. The wafer cutting method according to claim 2, characterized in that: The wafer attach material includes paraffin wax.
4. The wafer cutting method according to claim 1, characterized in that: The method of heating the wafer adhesive material for the first time by the wafer cutting jig to melt the wafer adhesive material into a liquid state comprises: Placing the wafer cutting jig in a platform, wherein the platform has heating and cooling functions; The wafer cutting jig is heated by the platform to melt the wafer adhesive material in the receiving groove into a liquid state.
5. The wafer cutting method according to claim 1, characterized in that: The method of placing the wafer to be cut in the receiving groove comprises: The wafer to be cut is placed in the receiving groove, and the wafer to be cut is exposed to the wafer adhesive material in the receiving groove.
6. The wafer cutting method according to claim 1, characterized in that: The method of stopping heating the wafer adhesive material, cooling the wafer adhesive material to a solid state, and adhering the wafer to be cut comprises: The wafer adhesive material in the receiving groove is cooled by the platform so that the wafer adhesive material is solidified into a solid state.
7. The wafer cutting method according to claim 1, characterized in that: The method of cutting the wafer to be cut to obtain a plurality of packaging units comprises: The wafer to be cut is cut using a band saw to obtain a plurality of the packaging units.
8. The wafer cutting method according to claim 1, characterized in that: The method of heating the wafer adhesive material for a second time by the wafer cutting jig to melt the wafer adhesive material into a liquid state comprises: The wafer adhesive material in the receiving groove is heated for a second time by the platform.
9. The wafer cutting method according to claim 1, characterized in that: After taking out the plurality of packaging units from the containing groove, the method further comprises: The plurality of packaging units are heated for a third time by the platform, so that the wafer adhesion material is melted or evaporated from the surfaces of the plurality of packaging units.
10. The wafer cutting method according to claim 1, characterized in that: After taking out the plurality of packaging units from the wafer adhesive material, the method further comprises: The wafer adhesion material in the receiving groove of the wafer cutting jig is collected.