Electrical connection device

Abstract

The invention provides an electric connection device which comprises a mother board and a daughter board. The mother board comprises a first board body with at least one groove and a first electrical contact printed on the first board body. The daughter board comprises a second board body and a second electrical contact printed on the second board body. At least one of the daughter board and the mother board comprises at least one contour feature integrally formed with at least one of the first board body and the second board body. When the second board body is inserted into the at least one groove of the first board body, the second electrical contact is electrically connected to the first electrical contact, and the daughter board is positioned in the mother board through the at least one contour feature. The electric connection device can effectively reduce the cost and improve the assembly efficiency, and has better reliability.

Description

Technical Field

[0001] The present invention relates to an electrical connection device, in particular to an electrical connection device for transmitting electrical signals. Background Art

[0002] In order to cope with the trend of thinner and lighter electronic products, the assembly mechanisms, parts and electrical connectors of the products must be miniaturized, which makes assembly difficult and easily causes problems such as poor reliability of electrical properties and fixation. In the prior art, when the integrated molded modules and components are to be integrated and / or connected to other components, the large size and weight of the pin connectors cause cracks in the soft and hard interfaces during the plug-in process of the flat cable, making the signal connection ineffective. Furthermore, after the integrated molded modules and components are thermoplastically molded, the pitch of the signal wires may be deformed after molding, causing line deviation, making it difficult to align the signal connection pins between different components. Therefore, how to effectively reduce costs and improve assembly efficiency is an important consideration in the development of integrated technology, and it is also one of the important topics for relevant technical personnel in this field. Summary of the invention

[0003] The present invention is directed to an electrical connection device, which can effectively reduce costs and improve assembly efficiency, and has better reliability.

[0004] According to an embodiment of the present invention, an electrical connection device includes a motherboard and a daughterboard. The motherboard includes a first board body having at least one groove and a first electrical contact printed on the first board body. The daughterboard includes a second board body and a second electrical contact printed on the second board body. At least one of the daughterboard and the motherboard includes at least one contour feature. The at least one contour feature is integrally formed with at least one of the first board body and the second board body. When the second board body is plugged into at least one groove of the first board body, the second electrical contact is electrically connected to the first electrical contact, and the daughterboard is positioned in the motherboard through the at least one contour feature.

[0005] Based on the above, in the design of the electrical connection device of the embodiment of the present invention, at least one of the daughter board and the mother board includes at least one contour feature, and the at least one contour feature is integrally formed with at least one of the first board and the second board, which can reduce the use of materials and reduce the number of processes. Therefore, when the second board is plugged into at least one groove of the first board, the second electrical contact can be electrically connected to the first electrical contact, and the daughter board can be positioned in the mother board through at least one contour feature, which means that the positioning and circuit connection of the daughter board and the mother board can be completed at the same time, so that the electrical connection device of the present invention can not only save costs and improve assembly efficiency, but also has better reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1Ais a three-dimensional schematic diagram of an electrical connection device according to an embodiment of the present invention;

[0007] Figure 1B yes Figure 1A Schematic diagram of the cross section along line II;

[0008] Figures 2A to 2G are side views of contour features of various shapes;

[0009] Figures 3A to 3G For the corresponding Figures 2A to 2G A top view of the profile feature;

[0010] 4A to 4F It is a schematic diagram of contour features of various numbers and arrangements;

[0011] Figure 5 is a cross-sectional schematic diagram of an electrical connection device according to another embodiment of the present invention;

[0012] Figure 6 is a perspective exploded schematic diagram of an electrical connection device according to another embodiment of the present invention;

[0013] Fig. 7A is a cross-sectional schematic diagram of an electrical connection device according to another embodiment of the present invention;

[0014] Figure 7B for Fig. 7A A top perspective schematic diagram of an electrical connection device;

[0015] Fig. 8A is a top perspective schematic diagram of an electrical connection device according to another embodiment of the present invention;

[0016] Figure 8B yes Fig. 8A A cross-sectional schematic diagram of an electrical connection device;

[0017] Fig. 9A is a top perspective schematic diagram of an electrical connection device according to another embodiment of the present invention;

[0018] Fig. 9B yes Fig. 9A A cross-sectional schematic diagram of an electrical connection device;

[0019] Fig.10 It is a cross-sectional schematic diagram of an electrical connection device according to another embodiment of the present invention.

[0020] Description of Reference Numerals

[0021] 100a, 100e, 100f, 100g, 100h, 100i, 100j: electrical connection devices;

[0022] 110a, 110e, 110f, 110g, 110h, 110i, 110j: motherboard;

[0023] 112a, 112e, 112f, 112g, 112h, 112i, 112j: a first plate;

[0024] 113h, 113i, 113j: first magnetic attraction member;

[0025] 114a, 114e, 114g, 114h, 114i, 114j: first electrical contacts;

[0026] 115a, 115e, 115f, 115g, 115h, 115i, 115j: grooves;

[0027] 117a, 117h, 117i, 117j: contour features / convex point structures;

[0028] 117b1, 117b2, 117b3, 117b4, 117b5, 117b6, 117b7, 117c1, 117c2, 117c3, 117c4, 117c5, 117c6: contour features;

[0029] 117e: first contour feature;

[0030] 117f: first profile feature / strip groove;

[0031] 117g1: first contour feature / bump structure;

[0032] 117g2: first profile feature / strip groove;

[0033] 119j: first heat conducting contact;

[0034] 120a, 120e, 120f, 120h, 120i, 120j: daughter boards;

[0035] 122a, 122e, 122f, 122h, 122i, 122j: second plate body;

[0036] 123h, 123i, 123j: second magnetic attraction member;

[0037] 124a, 124e, 124f, 124h, 124i, 124j: second electrical contacts;

[0038] 127e: second contour feature;

[0039] 127f: second contour feature / bending structure;

[0040] 129j: second thermal contact;

[0041] B: bottom surface;

[0042] d: height;

[0043] D: depth;

[0044] D1, D2: distance;

[0045] S1, S5: first inner surface;

[0046] S2, S6: second inner surface;

[0047] S3: first side;

[0048] S4: second side;

[0049] t, t1, t2: thickness;

[0050] U: upper surface;

[0051] W, W': width. DETAILED DESCRIPTION

[0052] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0053] Figure 1A It is a three-dimensional schematic diagram of an electrical connection device according to an embodiment of the present invention. Figure 1B yes Figure 1A Schematic diagram of the cross section along Route II. Please also refer to Figure 1A as well as Figure 1BIn this embodiment, the electrical connection device 100a includes a motherboard 110a and a daughterboard 120a. The motherboard 110a includes a first board 112a having at least one groove (schematically showing a groove 115a) and a first electrical contact 114a printed on the first board 112a. The daughterboard 120a includes a second board 122a and a second electrical contact 124a printed on the second board 122a. At least one of the daughterboard 120a and the motherboard 110a includes at least one contour feature, and the at least one contour feature is integrally formed with at least one of the first board 112a and the second board 122a. Here, the motherboard 110a includes at least one contour feature (schematically showing a contour feature 117a), and the contour feature 117a is embodied as a bump structure, but is not limited thereto. When the second board 122a is inserted into the groove 115a of the first board 112a, the second electrical contact 124a is electrically connected to the first electrical contact 114a, and the daughter board 120a is positioned in the mother board 110a through the contour feature 117a, which means that the daughter board 120a and the mother board 110a are positioned and connected to the circuits at the same time.

[0054] In detail, the electrical connection device 100a of this embodiment can be applied to various electronic products, such as being widely used in the internal connection of electronic products in the fields of automotive electronics, consumer electronics, white appliances, medical electronics, and information and communication technology (ICT). In one embodiment, the motherboard 110a can be, for example, a central console or a home appliance control panel, and the daughterboard 120a can be, for example, a USB or remote control device, but is not limited thereto. The groove 115a of the motherboard 110a has an upper surface U and a bottom surface B opposite to each other, and a first inner surface S1 and a second inner surface S2 connecting the upper surface U and the bottom surface B and opposite to each other. The convex structure 117a is located on the first inner surface S1, and the first electrical contact 114a extends from the upper surface U and is configured on the second inner surface S2. In other words, the convex structure 117a and the first electrical contact 114a are located on the inner surfaces of different sides, but is not limited thereto.

[0055] More specifically, the height by which the bump structure 117a of the present embodiment protrudes relative to the first inner surface S1 is d, and the width of the groove 115a is W, where 0 < d < (W / 2). That is to say, the height d of the bump structure 117a needs to be less than 1 / 2 of the width W of the groove 115a, which can provide an appropriate pressure to be applied to the daughter board 120a, so that the second electrical contact 124a on the daughter board 120a can indeed contact the first electrical contact 114a on the mother board 110a, and thus the electrical connection device 100a of the present embodiment can have better electrical reliability. In one embodiment, the width W of the groove 115a is, for example, between 0.1 millimeters (mm) and 10 millimeters. In other words, the contour feature (i.e., the bump structure 117a) located within the groove 115a can provide an appropriate lateral force (i.e., component adhesion force), which can avoid problems such as poor flatness of the electrical contacts and unstable signal connection.

[0056] Furthermore, the orthographic projection area of the bump structure 117a on the second inner surface S2 is at least 20% larger than the contact area between the second electrical contact 124a and the first electrical contact 114a, which can ensure the transmission of electrical signals. In one embodiment, the thickness t1 of the first electrical contact 114a and the thickness t2 of the second electrical contact 124a are, for example, in the ranges of 0.002 millimeters to 0.5 millimeters respectively. In one embodiment, the thickness t of the groove 115a is, for example, 0.1 millimeters to 3 millimeters. In one embodiment, the depth D of the groove 115a (i.e., the distance from the upper surface U to the bottom surface B) is, for example, greater than 3 millimeters. In one embodiment, the width W' of the daughter board 120a is, for example, between 0.1 millimeters and 10 millimeters.

[0057] In addition, the length, width, depth, material thickness of different grooves 115a, the height d of the bump structure 117a, position, shape, quantity, and the thickness of different daughter boards 120a will all affect the lateral force (i.e., component adhesion force), and will affect different stress distributions generated on the first inner surface S1 and the second inner surface S2 of the groove 115a. Generally speaking, the height d of the bump structure 117a is proportional to the lateral pressure. In a simulation experiment, the bump structure 117a is located at the center of the first inner surface S1 of the groove 115a, and the material of the first plate body 112a is, for example, polycarbonate (PC), with a Young's modulus E = 1.5 GPa. The maximum stress value applied by the bump structure 117a to the daughter board 120a is, for example, less than the yield strength of the material of the mother board 110a (such as 30 MPa), and the average contact force between the second electrical contact 124a and the first electrical contact 114a is, for example, greater than 100 gram-force (gf).

[0058] In addition, in one embodiment, the material of the first electrical contact 114a and the material of the second electrical contact 124a are respectively metal materials, such as copper. In one embodiment, the first plate 112a and the second plate 122a can be respectively flexible printed circuit boards (FPCs) or flexible flat cables (FFCs). In one embodiment, the material of the first plate 112a and the material of the second plate 122a can be respectively polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), cycloolefin polymer (COP), polyolefin (PO), cast polypropylene film (CPP), oriented stretched polypropylene film (OPP), silicone film, thermoplastic polyurethane (TPU), polyurethane or acrylonitrile-butadiene-styrene copolymer (ABS), but are not limited thereto. In one embodiment, the material of the first plate 112a and the material of the second plate 122a can be the same or different.

[0059] In the manufacturing process, the first electrical contact 114a is first printed on the substrate of the mother component. Printed electronics is a process of making graphic materials on a thin film layer by printing technology for electronic or electrical purposes. Printing technology manufacturing processes include but are not limited to inkjet printing, screen printing, gravure printing, relief printing or aerosol jet printing. Then, the contour features (i.e., the bump structure 117a) are integrally formed on the substrate of the mother component by, for example, thermoplastic molding, to form a motherboard 110a having a first plate body 112a with a groove 115a and a contour feature (i.e., the bump structure 117a) and a first electrical contact 114a printed on the first plate body 112a. Similarly, the second electrical contact 124a is printed on the substrate of the daughter component to form a daughter board 120a having a second plate body 122a and a second electrical contact 124a printed on the second plate body 122a. Afterwards, the daughter board 120a is assembled with the mother board 110a, that is, the second board body 122a is inserted into the groove 115a of the first board body 112a, so that the second electrical contact 124a is electrically connected to the first electrical contact 114a, and the daughter board 120a is positioned in the mother board 110a through the contour feature 117a. Afterwards, a signal connection test is performed, and if the test is normal, it can be produced.

[0060] In short, in the design of the electrical connection device 100a of the present embodiment, the motherboard 110a includes a contour feature 117a integrally formed with the first board 112a, which can effectively reduce the use of materials and reduce the number of processes. Furthermore, when the second board 122a is plugged into the groove 115a of the first board 112a, the second electrical contact 124a can be electrically connected to the first electrical contact 114a, and the daughter board 120a can be positioned in the motherboard 120a through the contour feature 117a, which means that the positioning and circuit connection of the daughter board 120a and the motherboard 110a can be completed at the same time. Therefore, in addition to saving production costs and improving assembly efficiency, the electrical connection device 100a of the present embodiment can also have better reliability.

[0061] It should be noted that the present embodiment does not limit the shape, number and arrangement of the contour features 117 a , and different embodiments will be described below.

[0062] Figures 2A to 2G Side views of profile features of various shapes. Figures 3A to 3G For the corresponding Figures 2A to 2G A top view of the profile feature. 4A to 4F Schematic diagram of contour features with different numbers and arrangements.

[0063] Please also refer to Figure 2A and Figure 3A In one embodiment, when viewed from the side, the shape of the contour feature 117b1 may be, for example, a semicircle, and when viewed from the top, the shape of the contour feature 117b1 may be, for example, a rectangle.

[0064] Please also refer to Figure 2B and Figure 3B In one embodiment, when viewed from the side, the shape of the contour feature 117b2 may be, for example, a triangle, and when viewed from the top, the shape of the contour feature 117b2 may be, for example, a rectangle.

[0065] Please also refer to Figure 2C and Figure 3C In one embodiment, when viewed from the side, the shape of the contour feature 117b3 may be, for example, a trapezoid, and when viewed from the top, the shape of the contour feature 117b3 may be, for example, a rectangle.

[0066] Please also refer to Figure 2D and Figure 3D In one embodiment, when viewed from the side, the shape of the contour feature 117b4 may be, for example, a right triangle, and when viewed from the top, the shape of the contour feature 117b4 may be, for example, a rectangle.

[0067] Please also refer to Figure 2E and Figure 3EIn one embodiment, when viewed from the side, the shape of the contour feature 117b5 may be, for example, a semicircular shape, and when viewed from the top, the shape of the contour feature 117b5 may be, for example, a circular shape.

[0068] Please also refer to Figure 2F and Figure 3F In one embodiment, when viewed from the side, the shape of the contour feature 117b6 may be, for example, a triangle, and when viewed from the top, the shape of the contour feature 117b6 may be, for example, a circle.

[0069] Please also refer to Figure 2G and Figure 3G In one embodiment, when viewed from the side, the shape of the contour feature 117b7 may be, for example, a trapezoid, and when viewed from the top, the shape of the contour feature 117b7 may be, for example, a circle.

[0070] Next, please refer to Figure 4A In one embodiment, there is one contour feature 117c1, which is rectangular in shape and arranged in a horizontal direction.

[0071] Please refer to Figure 4B In one embodiment, the contour feature 117c2 is one, has a rectangular shape, and is arranged vertically.

[0072] Please refer to Figure 4C In one embodiment, there are three contour features 117c3, which are rectangular in shape and arranged at intervals in the horizontal direction.

[0073] Please refer to Figure 4D In one embodiment, there are three contour features 117c4, which are rectangular in shape and arranged vertically at intervals.

[0074] Please refer to Figure 4E In one embodiment, there are nine contour features 117c5, which are circular in shape and arranged in a matrix.

[0075] Please refer to Figure 4F In one embodiment, there are eight contour features 117c6, which are circular in shape and arranged in a circular shape.

[0076] Other embodiments will be listed below for illustration. It must be noted that the following embodiments use the component numbers and some contents of the previous embodiments, wherein the same numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the previous embodiments, and the following embodiments will not be repeated.

[0077] Figure 5 is a cross-sectional schematic diagram of an electrical connection device according to another embodiment of the present invention. Figure 1B and Figure 5The electrical connection device 100e of this embodiment is similar to the electrical connection device 100a described above, but the main difference between the two is that in this embodiment, the at least one profile feature includes at least one first profile feature and at least one second profile feature. The motherboard 110e includes at least one first profile feature (two first profile features 117e are schematically shown), and the daughterboard 120e includes at least one second profile feature (two second profile features 127e are schematically shown). One of the first profile feature 117e and the second profile feature 127e is a convex point structure, and the other of the first profile feature 117e and the second profile feature 127e is a concave point structure.

[0078] Here, the first contour feature 117e is, for example, a convex structure, and the second contour feature 127e is, for example, a concave structure, but the invention is not limited thereto. In one embodiment, the two first contour features 117e may be of the same or different shapes, without limitation thereto. In one embodiment, the two second contour features 127e may be of the same or different shapes, without limitation thereto. As long as the two corresponding first contour features 117e and second contour features 127e can cooperate with each other in shape, they all belong to the scope of protection of the present invention. When the second board 122e is plugged into the groove 115e of the first board 112e, the second electrical contact 124e is electrically connected to the first electrical contact 114e, and the daughter board 120e is positioned in the mother board 110e by the cooperation of the first contour feature 117e and the second contour feature 127e, which means that the positioning and circuit connection of the daughter board 120e and the mother board 110e can be completed at the same time. That is, by forming the first contour feature 117e and the second contour feature 127e on the motherboard 110e and the daughterboard 120e into a concave-convex corresponding structure, the daughterboard 120e can be easily aligned with the motherboard 110e, the alignment accuracy can be improved, and it is also suitable for fast repeated plug-in and pull-out operations.

[0079] Figure 6 is a perspective exploded schematic diagram of an electrical connection device according to another embodiment of the present invention. Figure 1A and Figure 6, the electrical connection device 100f of this embodiment is similar to the electrical connection device 100a described above, but the main difference between the two is that: in this embodiment, at least one contour feature includes at least one first contour feature and at least one second contour feature. The motherboard 110f includes at least one first contour feature (schematically showing a first contour feature 117f), and the daughterboard 120f includes at least one second contour feature (schematically showing a second contour feature 127f). The first contour feature 117f is a strip groove, and the second contour feature 127f is a bending structure. Here, the extension direction of the strip groove 117f is parallel to the plug-in direction of the daughterboard 120f. Therefore, when the second board body 122f is plugged into the groove 115f of the first board body 112f, the bending structure 127f can be set corresponding to the strip groove 117f.

[0080] In the present embodiment, the daughter board 120f may be, for example, a flexible printed wiring board (FPC), a flexible flat cable (FFC), or a single film, wherein the thickness of the daughter board 120f may be, for example, less than 2 mm, and its stiffness is less than 20 g·cm. Since the daughter board 120f of the present embodiment has a bending structure 127f integrally formed with the second board body 122f, the stiffness can be enhanced, and the daughter board 120f can be prevented from being deformed when inserted into the mother board 110f. Furthermore, the mother board 110f has a strip groove 117f integrally formed with the first board body 112f, and the strip groove 117f is arranged corresponding to the bending structure 127f, which can effectively increase the alignment accuracy between the daughter board 120f and the mother board 110f.

[0081] Further, the daughter board 120f has a first side S3 and a second side S4 that are opposite to each other. Preferably, the distance D1 from the bending structure 127f to the first side S3 is 51% to 70% of the width W' of the daughter board 120f. The distance D2 from the bending structure 127f to the second side S4 is 30% to 49% of the width W' of the daughter board 120f. In other words, the bending structure 127f is not located at the center of the daughter board 120f, but is asymmetrically designed with respect to the first side S3 and the second side S4. Preferably, when the daughter board 120f is plugged into the mother board 110f, the contact area between the second electrical contact 124f and the first electrical contact (not shown) is at least greater than 50% of the full contact area to ensure that the electrical signal is correctly transmitted. That is, when the daughter board 120f is plugged into the mother board 110f, the overlap area / contact area of ​​the second electrical contact 124f of the daughter board 120f and the first electrical contact of the mother board 110f must overlap by at least half of the width to ensure the quality of electrical conduction. In addition, the bending structure 127f can be composed of a single straight strip or a plurality of strips, which is not limited here.

[0082] Fig. 7Ais a cross-sectional schematic diagram of an electrical connection device according to another embodiment of the present invention. Figure 7B for Fig. 7A Please also refer to Figure 6 , Fig. 7A as well as Figure 7B The electrical connection device 100g of this embodiment is similar to the electrical connection device 100f described above, but the main difference between the two is that: in this embodiment, the motherboard 110g includes two first contour features 117g1 and one first contour feature 117g2. The first contour feature 117g1 is a convex structure 117g1, and the first contour feature 117g2 is a strip groove 117g2. The groove 115g has a first inner side surface S5 and a second inner side surface S6 opposite to each other. The convex structure 117g1 is located on the first inner side surface S5, and the strip groove 117g2 is recessed from the second inner side surface S6 and extends in the direction of the first inner side surface S5. When the second board 122f is plugged into the groove 115g of the first board 112g, the bending structure 127f of the second board 122f is arranged corresponding to the strip groove 117g2, and the sub-board 120f is positioned in the motherboard 110g through the cooperation of the convex structure 117g1, the strip groove 117g2 and the bending structure 127f.

[0083] Since the groove 115g corresponding to the thin daughter board 120f is easily uneven in thickness or deformed in different regions due to the larger aspect ratio during molding, when the mother board 110g is molded, a strip groove 117g2 in the plugging direction of the daughter board 120f and a bump structure 117g1 on the opposite side of the strip groove 117g2 are formed, which can effectively provide a firm pressure to stabilize the first electrical contact 114g and the second electrical contact 124f.

[0084] Fig. 8A is a top perspective schematic diagram of an electrical connection device according to another embodiment of the present invention. Figure 8B yes Fig. 8A Please also refer to Figure 1B , Fig. 8A as well as Figure 8B, the electrical connection device 100h of this embodiment is similar to the electrical connection device 100a described above, but the main difference between the two is that: in this embodiment, the motherboard 110h also includes at least one first magnetic member (schematically depicting a first magnetic member 113h), and the daughterboard 120h also includes at least one second magnetic member (schematically depicting a second magnetic member 123h). The magnetic pole of one of the first magnetic member 113h and the second magnetic member 123h is an S pole, and the magnetic pole of the other of the first magnetic member 113h and the second magnetic member 123h is an N pole. Here, the magnetic pole of the first magnetic member 113h is, for example, an S pole, and the magnetic pole of the second magnetic member 123h is, for example, an N pole, but it is not limited thereto.

[0085] When the second plate body 122h is inserted into a groove 115h of the first plate body 112h, the second magnetic member 123h is magnetically attracted to the first magnetic member 113h, the second electrical contact 124h is electrically connected to the first electrical contact 114h, and the daughter board 120h is positioned in the mother board 110h through the contour feature 117h (such as a bump structure), which means that the positioning and line connection of the daughter board 120h and the mother board 110h can be completed at the same time. In other words, the electrical connection device 100h with a single groove 115h can not only increase the self-alignment function during assembly, but also improve the adhesion of the electrical connection device 100h and enhance the reliability test and shock resistance of mobile device products through a set of magnetic attraction mechanism components.

[0086] Fig. 9A is a top perspective schematic diagram of an electrical connection device according to another embodiment of the present invention. Fig. 9B yes Fig. 9A Please also refer to Figure 1B , Fig. 9A as well as Fig. 9B , the electrical connection device 100i of this embodiment is similar to the electrical connection device 100a described above, but the main difference between the two is that: in this embodiment, the motherboard 110i has two grooves 115i, and each groove 115i has a contour feature 117i (for example, a bump structure) integrally formed with the first plate body 112i. The motherboard 110i also includes at least one first magnetic member (two first magnetic members 113i are schematically shown), and the daughterboard 120i also includes at least one second magnetic member (two second magnetic members 123i are schematically shown). The magnetic pole of one of the first magnetic member 113i and the second magnetic member 123i is an S pole, and the magnetic pole of the other of the first magnetic member 113i and the second magnetic member 123i is an N pole. Here, the magnetic poles of the two first magnetic elements 113i are, for example, an S pole and an N pole, respectively, and the magnetic poles of the two second magnetic elements 123i corresponding to the two first magnetic elements 113i are, for example, an N pole and an S pole, respectively, but the present invention is not limited thereto.

[0087] When the second plate body 122i is plugged into the two grooves 115i of the first plate body 112i, the second magnetic member 123i is magnetically attracted to the first magnetic member 113i, the second electrical contact 124i is electrically connected to the first electrical contact 114i, and the daughter board 120i is positioned in the mother board 110i through the contour feature 117i (such as a bump structure), which means that the positioning and line connection of the daughter board 120i and the mother board 110i can be completed at the same time. Compared with the prior art that requires a large amount of manpower for wiring and welding, the design of the electrical connection device 100i of this embodiment can have both assembly fool-proofing and enhanced adsorption functions, which can effectively save production costs and improve efficiency. In addition, the provision of a magnetic attraction component in the one-piece mother board 110i and the device that requires multiple plugging and unplugging can not only strengthen the structural design of the electrical connection device 100i, but also improve the reliability of the assembly quality of the components.

[0088] Fig.10 is a cross-sectional schematic diagram of an electrical connection device according to another embodiment of the present invention. Fig. 9B as well as Fig.10 The electrical connection device 100j of this embodiment is similar to the electrical connection device 100i described above, but the main difference between the two is that: in this embodiment, the motherboard 110j further includes at least one first heat-conducting contact (schematically showing one first heat-conducting contact 119j), and the daughterboard 120j further includes at least one second heat-conducting contact (schematically showing two second heat-conducting contacts 129j). In one embodiment, the material of the first heat-conducting contact 119j and the material of the second heat-conducting contact 129j can be the same as or different from the material of the first electrical contact 114j and the material of the second electrical contact 124j, and this is not limited here.

[0089] When the second plate 122j is inserted into the two grooves 115j of the first plate 112j, the second magnetic member 123j is magnetically attracted to the first magnetic member 113j, the second electrical contact 124j is electrically connected to the first electrical contact 114j, and the daughter board 120j is positioned in the mother board 110j through the contour feature 117j (such as a bump structure), and the second thermal conductive contact 123j is staggered with the first thermal conductive contact 113j. In other words, the electrical connection device 100j of this embodiment has not only the connection of the electrical contact, but also the thermal conductive contact, which can be used as a heat sink or heater.

[0090] It should be noted that at least one of the daughter board and the mother board includes at least one contour feature, and the at least one contour feature is integrally formed with at least one of the first board body and the second board body, and opposite-sex magnetic attraction parts are arranged on the daughter board and the mother board. The above-mentioned structural arrangements can exist separately or be used in combination according to usage requirements, and are not limited here.

[0091] In summary, in the design of the electrical connection device of the present invention, at least one of the daughter board and the mother board includes at least one contour feature, and the at least one contour feature is integrally formed with at least one of the first board and the second board, which can reduce the use of materials and reduce the number of processes. Therefore, when the second board is plugged into at least one groove of the first board, the second electrical contact can be electrically connected to the first electrical contact, and the daughter board can be positioned in the mother board through the at least one contour feature, which means that the positioning and circuit connection of the daughter board and the mother board can be completed at the same time, so that the electrical connection device of the present invention can not only save costs and improve assembly efficiency, but also has better reliability.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electrical connection device, characterized in that: include: A motherboard, comprising a first board having at least one groove and a first electrical contact printed on the first board; as well as A daughter board comprises a second board body and a second electrical contact printed on the second board body, wherein at least one of the daughter board and the mother board comprises at least one contour feature, and the at least one contour feature is integrally formed with at least one of the first board body and the second board body, when the second board body is inserted into the at least one groove of the first board body, the second electrical contact is electrically connected to the first electrical contact, and the daughter board is positioned in the mother board through the at least one contour feature.

2. The electrical connection device according to claim 1, characterized in that: The motherboard includes at least one contour feature, and the at least one contour feature includes a bump structure. The at least one groove has an upper surface and a bottom surface opposite to each other, and a first inner surface and a second inner surface connecting the upper surface and the bottom surface and opposite to each other. The bump structure is located on the first inner surface, and the first electrical contact extends from the upper surface and is configured on the second inner surface.

3. The electrical connection device according to claim 2, characterized in that: The height of the protruding point structure relative to the first inner surface is d, and the width of the at least one groove is W, then <d<(W / 2)。 4. The electrical connection device according to claim 3, characterized in that: The thickness of the first electrical contact and the thickness of the second electrical contact are respectively in the range of 0.002 mm to 0.5 mm.

5. The electrical connection device according to claim 2, characterized in that: The orthographic projection area of ​​the bump structure on the second inner surface is at least larger than 20% of the contact area between the second electrical contact and the first electrical contact.

6. The electrical connection device according to claim 2, characterized in that: The maximum stress value applied by the bump structure on the daughter board is less than the material yield strength of the mother board.

7. The electrical connection device according to claim 2, characterized in that: An average contact force between the second electrical contact and the first electrical contact is greater than 100 grams-force.

8. The electrical connection device according to claim 1, characterized in that: When viewed from the side, the shape of the protrusion structure includes a semicircle, a triangle or a trapezoid.

9. The electrical connection device according to claim 1, characterized in that: In a top view, the shape of the bump structure includes a rectangle or a circle.

10. The electrical connection device according to claim 1, characterized in that: The at least one contour feature includes a plurality of contour features, and the plurality of contour features are arranged in intervals, arrays or circles.

11. The electrical connection device according to claim 1, characterized in that: The at least one contour feature includes at least one first contour feature and at least one second contour feature, the motherboard includes the at least one first contour feature, and the daughterboard includes the at least one second contour feature, and one of the at least one first contour feature and the at least one second contour feature is at least one convex point structure, and the other of the at least one first contour feature and the at least one second contour feature is at least one concave point structure.

12. The electrical connection device according to claim 1, characterized in that: The at least one contour feature includes at least one first contour feature and at least one second contour feature. The motherboard includes the at least one first contour feature, and the daughterboard includes the at least one second contour feature. The at least one first contour feature includes a strip groove, and the at least one second contour feature includes a bending structure. When the second board body is inserted into the at least one groove of the first board body, the bending structure is arranged corresponding to the strip groove.

13. The electrical connection device according to claim 12, characterized in that: The sub-board has a first side and a second side opposite to each other, the distance from the bending structure to the first side is 51% to 70% of the width of the sub-board, and the distance from the bending structure to the second side is 30% to 49% of the width of the sub-board.

14. The electrical connection device according to claim 1, characterized in that: The at least one contour feature includes at least one first contour feature and at least one second contour feature. The motherboard includes the at least one first contour feature, and the daughterboard includes the at least one second contour feature. The at least one first contour feature includes at least one bump structure and a strip groove. The at least one groove has a first inner surface and a second inner surface opposite to each other. The bump structure is located on the first inner surface, and the strip groove extends from the second inner surface inwardly toward the first inner surface. The at least one second contour feature includes a bending structure. When the second board body is inserted into the at least one groove of the first board body, the bending structure is arranged corresponding to the strip groove, and the daughterboard is positioned in the motherboard through the at least one bump structure.

15. The electrical connection device according to claim 1, characterized in that: The motherboard further includes at least one first magnetic component, and the daughterboard further includes at least one second magnetic component. When the second board is plugged into the at least one groove of the first board, the at least one second magnetic component is magnetically attracted to the at least one first magnetic component.

16. The electrical connection device according to claim 15, characterized in that: The magnetic pole of one of the at least one first magnetic attraction component and the at least one second magnetic attraction component is an S pole, and the magnetic pole of the other of the at least one first magnetic attraction component and the at least one second magnetic attraction component is an N pole.

17. The electrical connection device according to claim 1, characterized in that: The motherboard also includes at least one first heat-conducting connection point, and the daughterboard also includes at least one second heat-conducting connection point. When the second board body is inserted into the at least one groove of the first board body, the at least one second heat-conducting connection point is staggered with the at least one first heat-conducting connection point.

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