Circuit board structure and manufacturing method thereof

Abstract

The invention discloses a manufacturing method of a circuit board structure. The manufacturing method comprises the following steps: providing a substrate; a first opening is formed in the substrate in a penetrating manner; a first heat conduction pipe is arranged in the first hole, the first heat conduction pipe is provided with a first end and a second end opposite to the first end, and the first heat conduction pipe is filled with insulating resin to form an insulating plug body. The second heat conduction pipe is provided with a third end and a fourth end opposite to the third end, the third end and the first end are in thermal conduction, the third end and the first end are located on the same side of the substrate, a circuit board structure is obtained, the third end and the first end are used for making contact with a heat source, and the fourth end and the second end are used for being communicated with a differential pressure measuring circuit. The Seebeck coefficient of the first heat conduction pipe is different from the Seebeck coefficient of the second heat conduction pipe. In addition, the invention also provides a circuit board structure.

Description

Technical Field

[0001] The invention belongs to the field of circuit board manufacturing, and in particular relates to a circuit board structure and a manufacturing method thereof. Background Art

[0002] A thermoelectric device is an electronic device that uses the temperature difference between two different electrical conductors or semiconductors when heated to cause a voltage difference between the two materials. In order to form a thermoelectric device and realize the corresponding function, the thermoelectric element needs to be assembled and installed on a circuit board. However, existing thermoelectric devices mostly use surface mount technology (SMT), that is, the thermoelectric element is assembled on the circuit board, which leads to the superposition of the thickness of the thermoelectric element and the circuit board, increasing the thickness of the overall device. For example, the structure of using antimony lead telluride thermoelectric elements assembled on the circuit board has a total thickness that is significantly higher than the direction required by the development trend of electronic products that are thin and short, which is not conducive to the miniaturization and portability of electronic products. Summary of the invention

[0003] In order to solve the above deficiencies of the prior art, the present application provides a circuit board structure.

[0004] In addition, the present application also provides a method for manufacturing a circuit board structure.

[0005] A method for manufacturing a circuit board structure, comprising the steps of: providing a substrate. Setting a first opening through the substrate. Setting a first heat-conducting tube in the first opening, the first heat-conducting tube having a first end and a second end opposite to the first end, and filling the first heat-conducting tube with insulating resin to form an insulating plug. Setting a second opening in the insulating plug. Setting a second heat-conducting tube in the second opening, the second heat-conducting tube having a third end and a fourth end opposite to the third end, the third end being thermally connected to the first end and both being located on the same side of the substrate, to obtain the circuit board structure, wherein the third end and the first end are used to contact a heat source, the fourth end and the second end are used to respectively connect to a pressure difference measurement circuit, and the Seebeck coefficient of the first heat-conducting tube is different from the Seebeck coefficient of the second heat-conducting tube.

[0006] In some possible implementations, the substrate includes a first inner circuit board, a first outer board, a second outer board, a first adhesive layer and a second adhesive layer, the first adhesive layer connects the first outer board and one side of the first inner circuit board, the second adhesive layer connects the second outer board and the other side of the first inner circuit board, the first outer board includes a first copper foil layer facing away from the first inner circuit board, the second outer board includes a second copper foil layer facing away from the first inner circuit board, and the manufacturing method further includes the steps of: providing a first electroplating layer on the first copper foil layer, providing a second electroplating layer on the second copper foil layer, and filling the first opening with the first electroplating layer and / or the second electroplating layer to form the first heat pipe. Etching the first copper foil layer and the first electroplating layer to form a first outer circuit layer, and etching the second copper foil layer and the second electroplating layer to form a second outer circuit layer.

[0007] In some possible implementations, the method further includes the steps of: providing a first solder mask layer on the first outer circuit layer, and providing a second solder mask layer on the second outer circuit layer. Two through holes are provided through the substrate, and a portion of the first electroplating layer and / or the second electroplating layer is filled in the through holes to form a hollow conductive body. A portion of the first solder mask layer and / or the second solder mask layer is filled in the hollow conductive body.

[0008] In some possible embodiments, the first outer circuit layer includes a first cold pad, the second outer circuit layer includes a first hot pad, the first cold pad is connected to the second end, the first hot pad is connected to the first end, the first cold pad is provided with a first slot, and the manufacturing method further includes the steps of: providing a first insulating pad in the first slot. A second cold pad is provided on the first insulating pad, the second cold pad is connected to the fourth end and is electrically isolated from the second end. A second hot pad is provided on the first hot pad, the second hot pad is connected to the third end and is thermally conductive with the first hot pad.

[0009] A circuit board structure comprises: a circuit substrate provided with a first opening; a first heat-conducting pipe provided in the first opening, the first heat-conducting pipe having a first end and a second end opposite to the first end; a second heat-conducting pipe provided in the first heat-conducting pipe, the second heat-conducting pipe comprising a third end and a fourth end opposite to the third end, the first end and the third end being located on the same side of the circuit substrate, the first end and the third end being thermally connected for contacting a heat source, and the second end and the fourth end being electrically isolated for connecting to a pressure difference measurement circuit.

[0010] In some possible embodiments, the circuit substrate includes a first outer circuit board and a second outer circuit board, the first outer circuit board includes a first outer circuit layer, the first outer circuit board includes a first cold pad, the second outer circuit board includes a first hot pad, the first cold pad is connected to the second end, and the first hot pad is connected to the first end.

[0011] In some possible embodiments, the circuit board structure also includes a second cold pad, a second hot pad and a first insulating pad, the first cold pad is provided with a first groove, the first insulating pad is arranged in the first groove, the second cold pad is arranged on the first insulating pad, the second cold pad is connected to the fourth end, the second hot pad is arranged on the first hot pad, and the second hot pad is connected to the third end.

[0012] In some possible embodiments, the circuit board structure also includes a hollow conductive body, a first solder resist layer and a second solder resist layer, the conductive body connects the first outer circuit board and the second outer circuit board, and the first solder resist layer and / or the second solder resist layer fills the hollow conductive body.

[0013] A method for manufacturing a circuit board structure, characterized in that it includes the steps of: providing a substrate. A third opening and a fourth opening are set through the substrate, and the third opening and the fourth opening are set at intervals. A third heat pipe is set in the third opening, and the third heat pipe includes a fifth end and a sixth end opposite to the fifth end. A fourth heat pipe is set in the fourth opening, and the fourth heat pipe includes a seventh end and an eighth end opposite to the seventh end. The seventh end is thermally connected with the fifth end and the two are located on the same side of the substrate, and the circuit board structure is obtained, wherein the fifth end and the seventh end are used to contact a heat source, the eighth end and the sixth end are used to connect to a pressure difference measurement circuit respectively, and the Seebeck coefficient of the third heat pipe is different from the Seebeck coefficient of the fourth heat pipe.

[0014] In some possible implementations, the method further includes the steps of: etching the substrate to form a circuit substrate, the circuit substrate including a third outer circuit layer and a fourth outer circuit layer, wherein the third outer circuit layer includes a third cold pad and a fourth cold pad, the third cold pad is electrically isolated from the fourth cold pad, the third cold pad is connected to the fifth end of the third heat pipe, the fourth cold pad is connected to the seventh end of the fourth heat pipe, and the third cold pad and the fourth cold pad are respectively used to connect the pressure difference measurement circuit. The fourth outer circuit layer includes a third thermal pad and a fourth thermal pad, the third thermal pad is electrically connected to the fourth thermal pad, the third thermal pad is connected to the sixth end of the third heat pipe, the fourth thermal pad is connected to the eighth end of the fourth heat pipe, and the third thermal pad and the fourth thermal pad are used to contact the heat source.

[0015] In some possible implementations, the method further includes removing a portion of the third heat pipe, a portion of the fourth heat pipe, and a portion of the circuit board structure between the third heat pipe and the fourth heat pipe to form a housing space for accommodating other components.

[0016] A circuit board structure comprises: a circuit substrate, provided with a third opening and a fourth opening, wherein the third opening and the fourth opening are arranged at intervals; a third heat pipe, arranged in the third opening, wherein the third heat pipe has a fifth end and a sixth end opposite to the fifth end; a fourth heat pipe, arranged in the fourth opening, wherein the fourth heat pipe has a seventh end and an eighth end opposite to the seventh end, wherein the fifth end and the seventh end are thermally connected and are used to contact a heat source, and the sixth end and the eighth end are electrically isolated and are used to connect to a pressure difference measurement circuit respectively.

[0017] In some possible implementations, the circuit substrate includes a third outer circuit layer and a fourth outer circuit layer, the third outer circuit layer includes a third cold pad and a fourth cold pad, the third cold pad is electrically isolated from the fourth cold pad, the third cold pad is connected to the fifth end of the third heat pipe, the fourth cold pad is connected to the seventh end of the fourth heat pipe, and the third cold pad and the fourth cold pad are respectively used to connect the pressure difference measurement circuit. The fourth outer circuit layer includes a third thermal pad and a fourth thermal pad, the third thermal pad is electrically connected to the fourth thermal pad, the third thermal pad is connected to the sixth end of the third heat pipe, the fourth thermal pad is connected to the eighth end of the fourth heat pipe, and the third thermal pad and the fourth thermal pad are used to contact the heat source.

[0018] In some possible embodiments, the circuit board structure further includes a third solder resist layer and a fourth solder resist layer, the third solder resist layer is arranged on the third outer circuit layer, the third solder resist layer is provided with a third window, the third cold pad and the fourth cold pad are exposed from the third window, the fourth solder resist layer is arranged on the fourth outer circuit layer, the fourth solder resist layer is provided with a fourth window, and the third heat pad and the fourth heat pad are exposed from the fourth window.

[0019] In some possible implementations, the circuit board structure is further provided with an accommodation space, and the accommodation space runs through a portion of the third heat pipe, a portion of the fourth heat pipe, and a portion of the circuit board structure between the third heat pipe and the fourth heat pipe.

[0020] Compared with the prior art, the circuit board structure manufacturing method provided in the present application forms a first thermoelectric element by sequentially arranging a first heat conducting pipe and a second heat conducting pipe in a first opening, wherein one end of the first heat conducting pipe and the second heat conducting pipe are connected, and the other ends are respectively connected to a pressure difference measuring circuit. That is, the first heat conducting pipe and the second heat conducting pipe are buried in the first opening, thereby facilitating reducing the overall thickness of the first circuit board structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic cross-sectional view of the first inner circuit board provided in the first embodiment of the present application.

[0022] Figure 2 for Figure 1 This is a schematic cross-sectional view of a substrate formed by configuring the first inner circuit board to provide the first outer board and the second outer board.

[0023] Figure 3 for Figure 2 The cross-sectional schematic diagram shown is a substrate after a first opening is arranged and a first heat conducting pipe is arranged in the first opening.

[0024] Figure 4 for Figure 3 The schematic cross-sectional view shows a first heat-conducting tube filled with insulating resin to form an insulating plug body.

[0025] Figure 5 for Figure 4 The schematic cross-sectional view of the insulating plug body after the second opening is provided is shown.

[0026] Figure 6 For etching Figure 5 The substrate shown is a schematic cross-sectional view after being formed into a circuit substrate.

[0027] Figure 7 for Figure 6 The cross-sectional schematic diagram shows a second opening after a second heat conducting pipe is arranged in the second opening.

[0028] Figure 8 for Figure 7 The solder mask layers are respectively disposed on opposite sides of the circuit substrate to obtain a cross-sectional schematic diagram of a first circuit board structure.

[0029] Fig. 9 This is a cross-sectional schematic diagram of a substrate provided in the second embodiment of the present application after a third opening is provided and a third heat pipe is provided in the third opening.

[0030] Fig.10 for Fig. 9 The cross-sectional schematic diagram is shown after the substrate is provided with a fourth opening and a fourth heat conducting pipe is provided in the fourth opening.

[0031] Fig.11 For etching Fig.10 The substrate shown is a schematic cross-sectional view after forming a second circuit substrate.

[0032] Fig.12 for Fig.11 The cross-sectional schematic diagram of the second circuit board structure is shown in which solder resist layers are respectively arranged on both sides of the second circuit substrate to obtain the second circuit board structure.

[0033] Fig.13 for Fig.12 The cross-sectional view of the second circuit board structure after the accommodation space is set is shown.

[0034] Main component symbols

[0035] First circuit board structure 100

[0036] First adhesive layer 101

[0037] Second adhesive layer 102

[0038] Substrate 10

[0039] First inner circuit board 11

[0040] The first inner insulating layer 111

[0041] The first inner circuit layer 112

[0042] The second inner circuit layer 113

[0043] First outer plate 12

[0044] The first outer insulating layer 121

[0045] The first outer copper foil layer 122

[0046] Second outer plate 13

[0047] The second outer insulating layer 131

[0048] The second outer copper foil layer 132

[0049] The first opening 14

[0050] Through hole 15

[0051] First electroplating layer 20

[0052] Second electroplating layer 21

[0053] The first heat pipe 22

[0054] First End 221

[0055] Second end 222

[0056] Conductor 23

[0057] Head end 231

[0058] Tail end 232

[0059] Insulation plug 24

[0060] The second opening 241

[0061] First outer wiring layer 25

[0062] First outer circuit board 251

[0063] First cold pad 252

[0064] First Line 253

[0065] The second outer wiring layer 26

[0066] The second outer circuit board 261

[0067] First heat pad 262

[0068] Second Line 263

[0069] First slot 27

[0070] Insulation pad 271

[0071] Circuit board 28

[0072] The second heat pipe 30

[0073] The third end 31

[0074] The second cold pad 311

[0075] The second heat pad 321

[0076] Fourth end 32

[0077] First solder resist layer 33

[0078] First window 331

[0079] Second solder resist layer 34

[0080] Second window 341

[0081] The third outer wiring layer 35

[0082] The third cold pad 351

[0083] Fourth cold pad 352

[0084] Fourth outer wiring layer 36

[0085] The third heat pad 361

[0086] Fourth heat pad 362

[0087] Second circuit board structure 200

[0088] The third opening 16

[0089] The third heat pipe 161

[0090] Sixth end 161a

[0091] Seventh end 161b

[0092] Fourth opening 17

[0093] Fourth heat pipe 171

[0094] Seventh end 171a

[0095] Eighth end 171b

[0096] The third plating layer 20a

[0097] Fourth plating layer 20b

[0098] First cover film 40

[0099] The third window 401

[0100] Second cover film 41

[0101] Second window 411

[0102] Symmetrical axis A, C

[0103] Thickness direction B

[0104] Accommodation space S

[0105] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0106] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0107] See also Figures 1 to 8 The first embodiment of the present application provides a method for manufacturing a first circuit board structure 100, which is used to realize a temperature measurement function. The manufacturing method specifically includes the following steps:

[0108] S100: See Figure 2 , providing a substrate 10, the substrate 10 includes a first inner circuit board 11, a first outer board 12, a second outer board 13, a first adhesive layer 101 and a second adhesive layer 102. The first adhesive layer 101 connects the first outer board 12 and one side of the first inner circuit board 11. The second adhesive layer 102 connects the second outer board 13 and the other side of the first inner circuit board 11.

[0109] See also Figure 1 to Figure 2 In this embodiment, the method for manufacturing the substrate 10 in step S100 includes:

[0110] S101: See Figure 1 The first inner circuit board 11 is provided, and the first inner circuit board 11 includes a first inner insulating layer 111, a first inner circuit layer 112, and a second inner circuit layer 113. The first inner circuit layer 112 and the second inner circuit layer 113 are respectively arranged on two opposite sides of the first inner insulating layer 111.

[0111] S102: See Figure 2 , a first outer plate 12 and a second outer plate 13 are respectively pressed on opposite sides of the first inner circuit board 11. The first outer plate 12 includes a first outer insulating layer 121 and a first outer copper foil layer 122. The first adhesive layer 101 is disposed between the first outer insulating layer 121 and the first inner circuit layer 112. The second outer plate 13 includes a second outer insulating layer 131 and a second outer copper foil layer 132. The second adhesive layer 102 is disposed between the second outer insulating layer 131 and the second inner circuit layer 113.

[0112] S110: See Figure 3, a first opening 14 is provided through the substrate 10. Specifically, the first opening 14 is substantially cylindrical, and the first opening 14 has a symmetry axis A. The symmetry axis A is substantially parallel to the thickness direction B of the substrate 10, that is, the first opening 14 passes through the first inner circuit board 11, the first outer board 12 and the second outer board 13 along the thickness direction B of the substrate 10. The first opening 14 is formed by mechanical drilling.

[0113] In this embodiment, step S110 further includes:

[0114] S111: Please see again Figure 3 , two through holes 15 are set through the substrate 10. The two through holes 15 are set at intervals, and the first opening 14 is set between the two through holes 15. Specifically, the two through holes 15 pass through the first inner circuit board 11, the first outer board 12 and the second outer board 13 along the thickness direction B of the substrate 10. The two through holes 15 are formed by mechanical drilling.

[0115] S120: Please see again Figure 3 A first electroplating layer 20 is provided on the side of the first outer plate 12 away from the first inner circuit board 11, and a second electroplating layer 21 is provided on the side of the second outer plate 13 away from the first inner circuit board 11. Part of the first electroplating layer 20 and part of the second electroplating layer 21 are filled into the first opening 14 to form a first heat pipe 22, and part of the first electroplating layer 20 and part of the second electroplating layer 21 are filled into the through hole 15 to form a conductive body 23.

[0116] In this embodiment, the first heat pipe 22 is electrically connected to the first inner circuit board 11, the first outer board 12 and the second outer board 13. Specifically, the first heat pipe 22 includes a first end 221 and a second end 222 opposite to the first end 221. The first end 221 is connected to the second outer copper foil layer 132, and the second end 222 is connected to the first outer copper foil layer 122. The conductive body 23 is electrically connected to the first inner circuit board 11, the first outer board 12 and the second outer board 13. Specifically, the conductive body 23 is a hollow structure, and the conductive body 23 includes a head end 231 and a tail end 232 opposite to the head end 231. The head end 231 is connected to the first outer copper foil layer 122, and the tail end 232 is connected to the second outer copper foil layer 132. The first heat pipe 22 is a material that can produce the Seebeck effect, specifically including at least one of a metal conductor, a metal oxide semiconductor, a III-V compound semiconductor, a carbon-based material, and an organic semiconductor material. Among them, metal conductors include copper, silver, gold, aluminum and other metals; metal oxide semiconductors include zinc oxide, barium titanate, nickel oxide and the like; III-V compound semiconductors include gallium arsenide, gallium phosphide, indium phosphide and the like; carbon-based materials include graphite, carbon nanotubes and graphene and the like; organic semiconductor materials include conductive polymers such as polythiophene and polyaniline. Preferably, the material of the first heat pipe 22 is copper.

[0117] S130: See Figure 4 , an insulating resin is filled in the first heat pipe 22 to form an insulating plug 24. Specifically, the insulating plug 24 is formed in the first heat pipe 22 by one of injection molding, rolling plug method, compressed air injection method, vacuum suction method, wave soldering method and double-sided spraying method. The insulating plug 24 includes insulating resins such as epoxy resin, polyurethane resin, phenolic resin, silicone resin, and acrylic resin.

[0118] S140: See Figure 5 The insulating plug body 24 is provided with a second opening 241, and the second opening 241 penetrates the insulating plug body 24 along the thickness direction B to form a first insulating tube 242. Specifically, the second opening 241 is formed by mechanical drilling.

[0119] In this embodiment, the second opening 241 is substantially cylindrical, and the second opening 241 has a symmetry axis C, which coincides with the symmetry axis A of the first opening 14 .

[0120] S150: See Figure 6 , the first outer copper foil layer 122 and the first electroplating layer 20 are etched to form a first outer circuit layer 25, and the first outer circuit layer 25 and the first outer insulating layer 121 constitute a first outer circuit board 251. The second outer copper foil layer 132 and the second electroplating layer 21 are etched to form a second outer circuit layer 26, and the second outer circuit layer 26 and the second outer insulating layer 131 constitute a second outer circuit board 261. At the same time, the first outer circuit layer 25, the second outer circuit layer 26, the first inner circuit board 11, the first adhesive layer 101 and the second adhesive layer 102 constitute a circuit substrate 28. Among them, the first outer circuit layer 25 includes a first cold pad 252 and a first circuit 253 electrically isolated from the first cold pad 252. The first cold pad 252 is connected to the second end 222. The second outer circuit layer 26 includes a first heat pad 262 and a second circuit 263 electrically isolated from the first heat pad 262. The first heat pad 262 is connected to the first end 221.

[0121] In this embodiment, step S150 further includes:

[0122] S151: Please see again Figure 6 A first slot 27 is provided on the tube wall of the first outer circuit layer 25 and the first insulating tube 424. The first slot 27 extends substantially perpendicular to the thickness direction B, and one end of the first slot 27 is connected to the second opening 241. A portion of the first outer insulating layer 121 is exposed at the bottom of the first slot 27. Specifically, the first slot 27 penetrates the first cold pad 252 along the thickness direction B.

[0123] S152: Please see again Figure 6 , an insulating pad 271 is filled in the first slot 27 , and the insulating pad 271 can be used to electrically isolate the first end 221 and other components (see below).

[0124] S160: See Figure 7, a second heat-conducting pipe 30 is disposed on the inner wall of the second opening 241, and the second heat-conducting pipe 30 includes a third end 31 and a fourth end 32 opposite to the third end 31. The third end 31 extends substantially perpendicular to the thickness direction B to form a second cold pad 311, and the fourth end 32 extends substantially perpendicular to the thickness direction B to form a second heat pad 321. The second heat pad 321 is disposed on the first heat pad 262 to achieve connection between the two. The second cold pad 311 is disposed on the insulating pad 271 to achieve electrical isolation from the first cold pad 252. The material of the second heat-conducting pipe 30 is different from that of the first heat-conducting pipe 22. That is, the Seebeck coefficient of the first heat-conducting pipe 22 is different from that of the second heat-conducting pipe 30, so that the Seebeck effect can be achieved between the first heat-conducting pipe 22 and the second heat-conducting pipe 30. Specifically, the material of the second heat pipe 30 includes at least one of a metal conductor, a metal oxide semiconductor, a III-V compound semiconductor, a carbon-based material, and an organic semiconductor material. Among them, the metal conductor includes metals such as copper, silver, gold, and aluminum; the metal oxide semiconductor includes zinc oxide, barium titanate, and nickel oxide; the III-V compound semiconductor includes gallium arsenide, gallium phosphide, and indium phosphide; the carbon-based material includes graphite, carbon nanotubes, and graphene; and the organic semiconductor material includes conductive polymers such as polythiophene and polyaniline. Preferably, the material of the second heat pipe 30 is constantan.

[0125] In this embodiment, the first cold pad 252 and the second cold pad 311 can be used to access a pressure difference measurement circuit (not marked), and the first heat pad 262 and the second heat pad 321 can be used to contact a heat source (not marked). When measuring temperature, the first heat pipe 22 and the second heat pipe 30 are thermally connected to a heating element (such as a chip) through the first heat pad 262 and the second heat pad 321, respectively, and the first heat pipe 22 and the second heat pipe 30 are connected to the pressure difference measurement circuit through the first cold pad 252 and the second cold pad 311, respectively, to form a first thermoelectric element (not marked). In an electrical circuit including two different Seebeck coefficients, carriers flow from the hot end (i.e., the first heat pad 262 and the second heat pad 321) to the cold end (i.e., the first cold pad 252 and the second cold pad 311) by utilizing the Seebeck effect, and accumulate at the cold end, thereby generating a potential difference between the first cold pad 252 and the second cold pad 311, which can be measured by the voltage difference measurement circuit. After the voltage difference measurement circuit is calibrated by temperature-potential difference, the function of measuring the temperature of the hot end can be realized.

[0126] S170: See Figure 8A first solder mask 33 is disposed on the first outer circuit layer 25, and a second solder mask 34 is disposed on the second outer circuit layer 26. Part of the first solder mask 33 and / or part of the second solder mask 34 are filled into the two hollow conductive bodies 23 to obtain the first circuit board structure 100.

[0127] In this embodiment, the first solder resist layer 33 is provided with a first window 331, and the first cold pad and the second cold pad are exposed at the bottom of the first window 331, so that the two are conveniently connected to the pressure difference measurement circuit. The second solder resist layer 34 is provided with a second window 341, and the first heat pad and the second heat pad are exposed at the bottom of the second window 341, so that the two are conveniently contacted with the heat source.

[0128] Compared with the prior art, the manufacturing method of the first circuit board structure 100 provided in the first embodiment of the present application is to successively arrange the first heat conducting pipe 22 and the second heat conducting pipe 30 in the first opening 14, and one end of the first heat conducting pipe 22 and the second heat conducting pipe 30 are connected, and the other ends are respectively connected to the pressure difference measurement circuit, so as to form a first thermoelectric element. That is, the first heat conducting pipe 22 and the second heat conducting pipe 30 are buried in the first opening 14, which is conducive to reducing the overall thickness of the first circuit board structure 100.

[0129] See also Figure 8 The first embodiment of the present application also provides a first circuit board structure 100, which includes a circuit substrate 28, a first heat pipe 22 and a second heat pipe 30. The circuit substrate 28 is provided with a first opening 14, the first heat pipe 22 is arranged in the first opening 14, and the second heat pipe 30 is arranged in the first heat pipe 22. One end of the first heat pipe 22 is connected to one end of the second heat pipe 30, and the other end of the first heat pipe 22 and the other end of the second heat pipe 30 are respectively connected to the pressure difference measurement circuit, thereby forming a first thermoelectric element. Wherein, the Seebeck coefficient of the first heat pipe 22 is different from the Seebeck coefficient of the second heat pipe 30.

[0130] Please also see Figure 3 and Figure 8In this embodiment, the circuit substrate 28 includes a first inner circuit board 11, a first outer circuit board 251, a second outer circuit board 261, a first adhesive layer 101, and a second adhesive layer 102. The first outer circuit board 251 and the second outer circuit board 261 are respectively disposed on opposite sides of the first inner circuit board 11. The first adhesive layer 101 is disposed between one side of the first inner circuit board 11 and the first outer circuit board 251. The second adhesive layer 102 is disposed between the other side of the first inner circuit board 11 and the second outer circuit board 261.

[0131] Please also see Figure 7 and Figure 8 In this embodiment, the first outer circuit board 251 includes a first cold pad 252, and the first cold pad 252 is connected to the first end 221 of the first heat pipe 22. The second outer circuit board 261 includes a first heat pad 262, and the first heat pad 262 is connected to the second end 222 of the first heat pipe 22. The first cold pad 252 is used to electrically connect the pressure difference measurement circuit, and the first heat pad 262 is used to contact the heat source.

[0132] Please also see Figure 7 and Figure 8 In this embodiment, the first outer circuit board 251 is provided with a first slot 27, and an insulating pad 271 is provided in the first slot 27. The second heat pipe 30 includes a third end 31 and a fourth end 32 opposite to the third end 31. The third end 31 extends on the insulating pad 271 to form a second cold pad 311. The fourth end 32 extends on the first heat pad 262 to form a second heat pad 321. The second heat pad 321 is used to contact the heat source.

[0133] Please also see Figure 7 and Figure 8 In this embodiment, the first circuit board structure 100 further includes a first insulating tube 242 , which is disposed between the first heat conducting tube 22 and the second heat conducting tube 30 , thereby facilitating the fixing of the first heat conducting tube 22 and the second heat conducting tube 30 .

[0134] See also Figure 3 , Figures 9 to 13 The second embodiment of the present application provides a method for manufacturing a second circuit board structure 200, which is different from the first embodiment in that the method after step S1 includes:

[0135] S180: See Figure 3 and Fig. 9 A third opening 16 and a fourth opening 17 are formed through the substrate 10 .

[0136] S190: See Fig. 9 and Fig.10 A third heat conducting pipe 161 is disposed in the third opening 16 , and the third heat conducting pipe 161 includes a sixth end 161 a and a seventh end 161 b opposite to the sixth end 161 a . The material of the third heat conducting pipe 161 is substantially the same as that of the first heat conducting pipe 22 .

[0137] In this embodiment, step S190 specifically includes:

[0138] S191: See Fig. 9 , shielding the fourth opening 17. Specifically, the fourth opening 17 is covered by a dry film (not shown).

[0139] S192: See Fig. 9 A third electroplating layer 20a is provided on the side of the first outer plate 12 away from the first inner circuit board 11, and a fourth electroplating layer 20b is provided on the side of the second outer plate 13 away from the first inner circuit board 11, and part of the third electroplating layer 20a and / or the fourth electroplating layer 20b is filled into the third opening 16 to form the third heat pipe 161.

[0140] S193: See Fig. 9 , remove the dry film to reveal the fourth opening 17 again.

[0141] S200: See Fig.10 A fourth heat conducting pipe 171 is disposed in the fourth opening 17, and the fourth heat conducting pipe 171 includes a seventh end 171a and an eighth end 171b opposite to the seventh end 171a. Specifically, the fourth heat conducting pipe 171 is formed in the fourth opening 17 by selective sputtering. The material of the fourth heat conducting pipe 171 is substantially the same as that of the second heat conducting pipe 30.

[0142] S210: See Fig.11 , the third electroplating layer 20a and the first outer copper foil layer 122 are etched to form the third outer circuit layer 35, and the third outer circuit layer 35 has a third cooling pad 351 and a fourth cooling pad 352. The third cooling pad 351 is electrically isolated from the fourth cooling pad 352, and the third cooling pad 351 is connected to the sixth end 161a of the third heat pipe 161, and the fourth cooling pad 352 is connected to the seventh end 171a of the fourth heat pipe 171. The third cooling pad 351 and the fourth cooling pad 352 are respectively used to connect the pressure difference measurement circuit.

[0143] S220: See Fig.11, etching the second electroplating layer 21 and the second outer copper foil layer 132 to form a fourth outer circuit layer 36. The fourth outer circuit layer 36 has a third thermal pad 361 and a fourth thermal pad 362. The third thermal pad 361 is electrically connected to the fourth thermal pad 362, the third thermal pad 361 is connected to the seventh end 161b of the third heat pipe 161, and the fourth thermal pad 362 is connected to the eighth end 171b of the fourth heat pipe 171. The third thermal pad 361 and the fourth thermal pad 362 are used to contact the heat source.

[0144] S230: See Fig.12 , a first cover film 40 is provided on the third outer circuit layer 35 and a second cover film 41 is provided on the fourth outer circuit layer 36 to obtain the second circuit board structure 200. The first cover film 40 is provided with a third window 401, and the third cold pad 351 and the fourth cold pad 352 are exposed in the third window 401, so as to facilitate the connection of the differential pressure measurement circuit. The second cover film 41 is provided with a second window 411, and the third heat pad 361 and the fourth heat pad 362 are exposed in the second window 411, so as to facilitate contact with the heat source.

[0145] See also Fig.13 The second circuit board structure 200 provided in the second embodiment of the present application further includes the following steps:

[0146] S240: remove part of the third heat pipe 161, part of the fourth heat pipe 171, and part of the second circuit board structure 200 between the third heat pipe 161 and the fourth heat pipe 171, thereby forming an accommodation space S. The accommodation space S can be used to bury other components (e.g., chips, etc.), thereby reducing the overall thickness of the second circuit board structure 200.

[0147] Compared with the first embodiment, the manufacturing method of the second circuit board structure 200 provided in the second embodiment of the present application, by setting the third opening 16 and the fourth opening 17 at intervals, and then sequentially setting the third heat pipe 161 in the third opening 16 and the fourth heat pipe 171 in the fourth opening 17, can not only help reduce the thickness of the second circuit board structure 200, but also because the interval between the third heat pipe 161 and the fourth heat pipe 171 is large, it is beneficial to inspect and maintain the third heat pipe 161 and the fourth heat pipe 171.

[0148] See also Fig.12The second embodiment of the present application also provides a second circuit board structure 200. The second circuit board structure 200 includes a circuit substrate 28, a third heat pipe 161 and a fourth heat pipe 171. The circuit substrate 28 is provided with a third opening 16 and a fourth opening 17 at intervals. The third heat pipe 161 is provided at the third opening 16. The fourth heat pipe 171 is provided at the fourth opening 17. One end of the third heat pipe 161 is connected to one end of the fourth heat pipe 171, and one end of the third heat pipe 161 and one end of the fourth heat pipe 171 are used to contact the heat source. The other end of the third heat pipe 161 is electrically isolated from the other end of the fourth heat pipe 171, and the other end of the third heat pipe 161 and the other end of the fourth heat pipe 171 are used to connect the pressure difference measurement circuit, thereby forming a second thermoelectric element 201. Among them, the Seebeck coefficient of the third heat pipe 161 is different from the Seebeck coefficient of the fourth heat pipe 171.

[0149] See also Fig.12 In this embodiment, the second circuit board structure 200 further includes a third cold pad 351 and a fourth cold pad 352. The third cold pad 351 is electrically isolated from the fourth cold pad 352 to form a second slot 255. The third cold pad 351 is connected to one end of the third heat pipe 161, and the fourth cold pad 352 is connected to one end of the fourth heat pipe 171. The third cold pad 351 and the fourth cold pad 352 are respectively used to connect the pressure difference measurement circuit. A portion of the first outer insulating layer 121 is exposed at the bottom of the second slot 255 to achieve electrical isolation between the third cold pad 351 and the fourth cold pad 352.

[0150] See also Fig.12 In this embodiment, the second circuit board structure 200 further includes a third thermal pad 361 and a fourth thermal pad 362. The third thermal pad 361 is electrically connected to the fourth thermal pad 362, the third thermal pad 361 is connected to the other end of the third heat pipe 161, and the fourth thermal pad 362 is connected to the other end of the fourth heat pipe 171. The third thermal pad 361 and the fourth thermal pad 362 are used to contact the heat source.

[0151] The above description is only an optimized specific implementation of the present application, but it cannot be limited to this implementation in the actual application process. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present application should all fall within the protection scope of the present application.

Claims

1. A method for manufacturing a circuit board structure, characterized in that: Includes steps: providing a substrate; A first opening is provided through the substrate; A first heat conducting pipe is disposed in the first opening, wherein the first heat conducting pipe has a first end and a second end opposite to the first end. Filling the first heat-conducting pipe with insulating resin to form an insulating plug; A second opening is provided in the insulating plug body; A second heat-conducting pipe is arranged in the second opening, the second heat-conducting pipe has a third end and a fourth end opposite to the third end, the third end is thermally connected to the first end and the two are located on the same side of the substrate, so as to obtain the circuit board structure, wherein the third end and the first end are used to contact a heat source, the fourth end and the second end are used to be connected to a pressure difference measurement circuit respectively, and the Seebeck coefficient of the first heat-conducting pipe is different from the Seebeck coefficient of the second heat-conducting pipe.

2. The manufacturing method according to claim 1, characterized in that The substrate comprises a first inner circuit board, a first outer board, a second outer board, a first adhesive layer and a second adhesive layer, the first adhesive layer connects the first outer board and one side of the first inner circuit board, the second adhesive layer connects the second outer board and the other side of the first inner circuit board, the first outer board comprises a first copper foil layer facing away from the first inner circuit board, the second outer board comprises a second copper foil layer facing away from the first inner circuit board, and the manufacturing method further comprises the steps of: A first electroplating layer is provided on the first copper foil layer, Disposing a second electroplating layer on the second copper foil layer, and filling the first opening with the first electroplating layer and / or the second electroplating layer to form the first heat conducting pipe; etching the first copper foil layer and the first electroplating layer to form a first outer wiring layer, and The second copper foil layer and the second electroplating layer are etched to form a second outer wiring layer.

3. The manufacturing method according to claim 2, characterized in that: Also includes the steps: A first solder mask is provided on the first outer circuit layer. Disposing a second solder mask layer on the second outer circuit layer; Two through holes are provided through the substrate, and Filling a portion of the first electroplating layer and / or the second electroplating layer into the through hole to form a hollow conductive body; A portion of the first solder resist layer and / or the second solder resist layer is filled into the hollow conductive body.

4. The manufacturing method according to claim 3, characterized in that: The first outer circuit layer includes a first cold pad, the second outer circuit layer includes a first hot pad, the first cold pad is connected to the second end, the first hot pad is connected to the first end, the first cold pad is provided with a first slot, and the manufacturing method further includes the steps of: Disposing a first insulating pad in the first slot; A second cold pad is disposed on the first insulating pad, wherein the second cold pad is connected to the fourth end and is electrically isolated from the second end; A second thermal pad is disposed on the first thermal pad, wherein the second thermal pad is connected to the third end and is thermally connected to the first thermal pad.

5. A circuit board structure, characterized in that: include: The circuit substrate is provided with a first opening; A first heat-conducting pipe, disposed in the first opening, the first heat-conducting pipe having a first end and a second end opposite to the first end; The second heat-conducting tube is arranged in the first heat-conducting tube, the second heat-conducting tube includes a third end and a fourth end opposite to the third end, the first end and the third end are located on the same side of the circuit substrate, the first end and the third end are thermally connected to contact a heat source, and the second end and the fourth end are electrically isolated to be connected to a pressure difference measurement circuit.

6. The circuit board structure according to claim 5, characterized in that: The circuit substrate includes a first outer circuit board and a second outer circuit board, the first outer circuit board includes a first outer circuit layer, the first outer circuit board includes a first cold pad, the second outer circuit board includes a first hot pad, the first cold pad is connected to the second end, and the first hot pad is connected to the first end.

7. The circuit board structure according to claim 6, characterized in that: The circuit board structure also includes a second cold pad, a second hot pad and a first insulating pad, the first cold pad is provided with a first groove, the first insulating pad is arranged in the first groove, the second cold pad is arranged on the first insulating pad, the second cold pad is connected to the fourth end, the second hot pad is arranged on the first hot pad, and the second hot pad is connected to the third end.

8. The circuit board structure according to claim 7, characterized in that: The circuit board structure also includes a hollow conductive body, a first solder resist layer and a second solder resist layer. The conductive body connects the first outer circuit board and the second outer circuit board. The first solder resist layer and / or the second solder resist layer fills the hollow conductive body.

9. A method for manufacturing a circuit board structure, characterized in that: Includes steps: providing a substrate; A third opening and a fourth opening are provided through the substrate, and the third opening and the fourth opening are provided at intervals; A third heat conducting pipe is disposed in the third opening, wherein the third heat conducting pipe includes a fifth end and a sixth end opposite to the fifth end. A fourth heat pipe is arranged in the fourth opening, the fourth heat pipe includes a seventh end and an eighth end opposite to the seventh end, the seventh end is thermally connected to the fifth end and both are located on the same side of the substrate, so as to obtain the circuit board structure, wherein the fifth end and the seventh end are used to contact a heat source, the eighth end and the sixth end are used to connect to a pressure difference measurement circuit respectively, and the Seebeck coefficient of the third heat pipe is different from the Seebeck coefficient of the fourth heat pipe.

10. The manufacturing method according to claim 9, characterized in that: Also includes the steps: The substrate is etched to form a circuit substrate, wherein the circuit substrate includes a third outer circuit layer and a fourth outer circuit layer, wherein: The third outer circuit layer includes a third cold pad and a fourth cold pad, the third cold pad is electrically isolated from the fourth cold pad, the third cold pad is connected to the fifth end of the third heat pipe, the fourth cold pad is connected to the seventh end of the fourth heat pipe, and the third cold pad and the fourth cold pad are respectively used to connect the pressure difference measurement circuit; The fourth outer circuit layer includes a third thermal pad and a fourth thermal pad, the third thermal pad is electrically connected to the fourth thermal pad, the third thermal pad is connected to the sixth end of the third heat pipe, the fourth thermal pad is connected to the eighth end of the fourth heat pipe, and the third thermal pad and the fourth thermal pad are used to contact the heat source.

11. The manufacturing method according to claim 10, characterized in that: Also includes the steps: A portion of the third heat pipe, a portion of the fourth heat pipe, and a portion of the circuit board structure between the third heat pipe and the fourth heat pipe are removed to form an accommodation space, wherein the accommodation space is used to accommodate other components.

12. A circuit board structure, characterized in that: include: The circuit substrate is provided with a third opening and a fourth opening, wherein the third opening and the fourth opening are arranged at intervals; a third heat conducting pipe, disposed in the third opening, the third heat conducting pipe having a fifth end and a sixth end opposite to the fifth end; A fourth heat-conducting tube is arranged in the fourth opening, the fourth heat-conducting tube has a seventh end and an eighth end opposite to the seventh end, the fifth end and the seventh end are thermally connected and are used to contact a heat source, and the sixth end and the eighth end are electrically isolated and are used to connect to a pressure difference measurement circuit respectively.

13. The circuit board structure according to claim 12, characterized in that: The circuit substrate includes a third outer circuit layer and a fourth outer circuit layer, the third outer circuit layer includes a third cold pad and a fourth cold pad, the third cold pad is electrically isolated from the fourth cold pad, the third cold pad is connected to the fifth end of the third heat pipe, the fourth cold pad is connected to the seventh end of the fourth heat pipe, and the third cold pad and the fourth cold pad are respectively used to connect the pressure difference measurement circuit; The fourth outer circuit layer includes a third thermal pad and a fourth thermal pad, the third thermal pad is electrically connected to the fourth thermal pad, the third thermal pad is connected to the sixth end of the third heat pipe, the fourth thermal pad is connected to the eighth end of the fourth heat pipe, and the third thermal pad and the fourth thermal pad are used to contact the heat source.

14. The circuit board structure according to claim 13, characterized in that: The circuit board structure also includes a third solder resist layer and a fourth solder resist layer, the third solder resist layer is arranged on the third outer circuit layer, the third solder resist layer is provided with a third window, the third cold pad and the fourth cold pad are exposed from the third window, the fourth solder resist layer is arranged on the fourth outer circuit layer, the fourth solder resist layer is provided with a fourth window, and the third heat pad and the fourth heat pad are exposed from the fourth window.

15. The circuit board structure according to claim 12, wherein: The circuit board structure is further provided with an accommodation space, and the accommodation space runs through a portion of the third heat conducting pipe, a portion of the fourth heat conducting pipe, and a portion of the circuit board structure between the third heat conducting pipe and the fourth heat conducting pipe.

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