Circuit board structure and method of manufacturing the same

Abstract

A manufacturing method of a circuit board structure includes the steps of providing a substrate, providing a first opening through the substrate, providing a first heat pipe in the first opening, the first heat pipe having a first end and a second end opposite to the first end, filling the first heat pipe with an insulating resin to form an insulating plug, providing a second opening in the insulating plug, providing a second heat pipe having a third end and a fourth end opposite to the third end, the third end being in thermal conduction with the first end and both ends being on the same side of the substrate, obtaining the circuit board structure, wherein the third end and the first end are used to contact a heat source, the fourth end and the second end are used to respectively communicate with a differential pressure measurement circuit, and the Seebeck coefficient of the first heat pipe is different from the Seebeck coefficient of the second heat pipe. The application further provides a circuit board structure.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of circuit board manufacturing, and particularly relates to a circuit board structure and a manufacturing method thereof. BACKGROUND

[0002] A thermoelectric device is an electronic device that uses the temperature difference of two different electrical conductors or semiconductors when heated to cause a voltage difference between the two materials. In order to constitute a thermoelectric device to realize the corresponding function, it is necessary to assemble and install the thermoelectric element on the circuit board. However, the existing thermoelectric device mostly adopts surface mounting technology (SMT), that is, the thermoelectric element is assembled on the circuit board, so that the thickness of the thermoelectric element and the circuit board is superimposed, increasing the thickness of the overall device. For example, the structure of assembling the antimony tellurium lead thermoelectric element on the circuit board has a total thickness obviously higher than the development trend required by the light, thin, short and small electronic products, which is not conducive to the miniaturization and portability of electronic products. SUMMARY

[0003] In order to solve the above problems of the prior art, the present application provides a circuit board structure.

[0004] In addition, the present application also provides a manufacturing method of the circuit board structure.

[0005] A manufacturing method of a circuit board structure, comprising the steps of: providing a substrate; providing a first opening through the substrate; providing a first heat-conducting pipe in the first opening, the first heat-conducting pipe having a first end and a second end opposite to the first end, and filling insulating resin in the first heat-conducting pipe to form an insulating plug body; providing a second opening in the insulating plug body; providing a second heat-conducting pipe in the second opening, the second heat-conducting pipe having a third end and a fourth end opposite to the third end, the third end being in thermal conduction with the first end and both being located on the same side of the substrate, thereby obtaining the circuit board structure, wherein the third end and the first end are used to contact a heat source, the fourth end and the second end are used to respectively communicate with a differential pressure measurement circuit, and the Seebeck coefficient of the first heat-conducting pipe is different from the Seebeck coefficient of the second heat-conducting pipe.

[0006] In some possible embodiments, the substrate includes a first inner side circuit board, a first outer side plate, a second outer side plate, a first adhesive layer, and a second adhesive layer, the first adhesive layer connects the first outer side plate and one side of the first inner side circuit board, the second adhesive layer connects the second outer side plate and another side of the first inner side circuit board, the first outer side plate includes a first copper foil layer facing away from the first inner side circuit board, the second outer side plate includes a second copper foil layer facing away from the first inner side circuit board, the manufacturing method further includes the steps of: disposing a first electroplated layer on the first copper foil layer, and disposing a second electroplated layer on the second copper foil layer, the first electroplated layer and / or the second electroplated layer fills the first opening to form the first heat pipe. Etching the first copper foil layer and the first electroplated layer to form a first outer side circuit layer, and etching the second copper foil layer and the second electroplated layer to form a second outer side circuit layer.

[0007] In some possible embodiments, the manufacturing method further includes the steps of: disposing a first anti-welding layer on the first outer side circuit layer, and disposing a second anti-welding layer on the second outer side circuit layer. Disposing two through holes through the substrate, and filling part of the first electroplated layer and / or the second electroplated layer in the through holes to form a hollow conducting body. Filling part of the first anti-welding layer and / or the second anti-welding layer in the hollow conducting body.

[0008] In some possible embodiments, the first outer side circuit layer includes a first cold pad, the second outer side circuit layer includes a first hot pad, the first cold pad is connected to the second end, the first hot pad is connected to the first end, the first cold pad is provided with a first slot, and the manufacturing method further includes the step of: disposing a first insulating pad in the first slot. Disposing a second cold pad on the first insulating pad, the second cold pad is connected to the fourth end and electrically isolated from the second end. Disposing a second hot pad on the first hot pad, the second hot pad is connected to the third end and thermally connected to the first hot pad.

[0009] A circuit board structure includes: a circuit substrate provided with a first opening. A first heat pipe is disposed in the first opening, the first heat pipe has a first end and a second end opposite to the first end. A second heat pipe is disposed in the first heat pipe, the second heat pipe includes a third end and a fourth end opposite to the third end, the first end and the third end are located on the same side of the circuit substrate, the first end and the third end are thermally connected for contacting a heat source, and the second end and the fourth end are electrically isolated for connecting a differential pressure measurement circuit.

[0010] In some possible implementations, the circuit board structure further includes a first cold pad, a first hot pad, a second cold pad, a second hot pad, and a first insulation pad, the first cold pad is disposed with a first slot, the first insulation pad is disposed in the first slot, the second cold pad is disposed on the first insulation pad, the second cold pad is connected to the fourth end, the second hot pad is disposed on the first hot pad, and the second hot pad is connected to the third end.

[0011] In some possible implementations, the circuit board structure further includes a first cold pad, a first hot pad, a second cold pad, a second hot pad, and a first insulation pad, the first cold pad is disposed with a first slot, the first insulation pad is disposed in the first slot, the second cold pad is disposed on the first insulation pad, the second cold pad is connected to the fourth end, the second hot pad is disposed on the first hot pad, and the second hot pad is connected to the third end.

[0012] In some possible implementations, the circuit board structure further includes a hollow conducting body, a first anti-weld layer, and a second anti-weld layer, the conducting body is in communication with the first outer circuit board and the second outer circuit board, and the first anti-weld layer and / or the second anti-weld layer fill the hollow conducting body.

[0013] A manufacturing method of a circuit board structure, comprising the steps of: providing a substrate; disposing a third through hole and a fourth through hole in the substrate, the third through hole and the fourth through hole being spaced apart; disposing a third thermally conductive pipe in the third through hole, the third thermally conductive pipe comprising a fifth end and a sixth end opposite to the fifth end; disposing a fourth thermally conductive pipe in the fourth through hole, the fourth thermally conductive pipe comprising a seventh end and an eighth end opposite to the seventh end, the seventh end being in thermal conduction with the fifth end and both ends being located on the same side of the substrate, obtaining the circuit board structure, wherein the fifth end and the seventh end are used to contact a heat source, the eighth end and the sixth end are used to communicate with a differential pressure measurement circuit respectively, and the Seebeck coefficient of the third thermally conductive pipe is different from the Seebeck coefficient of the fourth thermally conductive pipe.

[0014] In some possible embodiments, the method further comprises the steps of: etching the substrate to form a circuit board, the circuit board comprising a third outer circuit layer and a fourth outer circuit layer, wherein the third outer circuit layer comprises a third cold pad and a fourth cold pad, the third cold pad being electrically isolated from the fourth cold pad, the third cold pad being connected to the fifth end of the third heat pipe, the fourth cold pad being connected to the seventh end of the fourth heat pipe, the third cold pad and the fourth cold pad being used for connecting the differential pressure measurement circuit respectively. The fourth outer circuit layer comprises a third hot pad and a fourth hot pad, the third hot pad being electrically connected to the fourth hot pad, the third hot pad being connected to the sixth end of the third heat pipe, the fourth hot pad being connected to the eighth end of the fourth heat pipe, the third hot pad and the fourth hot pad being used for contacting the heat source.

[0015] In some possible embodiments, the method further comprises the steps of: removing part of the third heat pipe, part of the fourth heat pipe, and part of the circuit board structure between the third heat pipe and the fourth heat pipe to form a receiving space, the receiving space being used for accommodating other elements.

[0016] A circuit board structure, comprising: a circuit board provided with a third opening and a fourth opening, the third opening and the fourth opening being arranged at intervals; a third heat pipe arranged in the third opening, the third heat pipe having a fifth end and a sixth end opposite to the fifth end; and a fourth heat pipe arranged in the fourth opening, the fourth heat pipe having a seventh end and an eighth end opposite to the seventh end, the fifth end and the seventh end being in thermal conduction and being used for contacting a heat source, the sixth end and the eighth end being electrically isolated and being used for connecting a differential pressure measurement circuit respectively.

[0017] In some possible embodiments, the circuit board comprises a third outer circuit layer and a fourth outer circuit layer, the third outer circuit layer comprises a third cold pad and a fourth cold pad, the third cold pad being electrically isolated from the fourth cold pad, the third cold pad being connected to the fifth end of the third heat pipe, the fourth cold pad being connected to the seventh end of the fourth heat pipe, the third cold pad and the fourth cold pad being used for connecting the differential pressure measurement circuit respectively. The fourth outer circuit layer comprises a third hot pad and a fourth hot pad, the third hot pad being electrically connected to the fourth hot pad, the third hot pad being connected to the sixth end of the third heat pipe, the fourth hot pad being connected to the eighth end of the fourth heat pipe, the third hot pad and the fourth hot pad being used for contacting the heat source.

[0018] In some possible implementation manners, the circuit board structure further comprises a third anti-soldering layer and a fourth anti-soldering layer, the third anti-soldering layer is arranged on the third outer side circuit layer, the third anti-soldering layer is provided with a third window, the third cold pad and the fourth cold pad are exposed to the third window, the fourth anti-soldering layer is arranged on the fourth outer side circuit layer, the fourth anti-soldering layer is provided with a fourth window, and the third hot pad and the fourth hot pad are exposed to the fourth window.

[0019] In some possible implementation manners, the circuit board structure further comprises a third anti-soldering layer and a fourth anti-soldering layer, the third anti-soldering layer is arranged on the third outer side circuit layer, the third anti-soldering layer is provided with a third window, the third cold pad and the fourth cold pad are exposed to the third window, the fourth anti-soldering layer is arranged on the fourth outer side circuit layer, the fourth anti-soldering layer is provided with a fourth window, and the third hot pad and the fourth hot pad are exposed to the fourth window.

[0020] Compared with the prior art, the circuit board structure manufacturing method provided in the application sets a first heat conduction pipe and a second heat conduction pipe in the first opening in sequence, one end of the first heat conduction pipe and the second heat conduction pipe is connected, and the other end is connected to a differential pressure measurement circuit respectively, so as to form a first thermoelectric element. That is, the first heat conduction pipe and the second heat conduction pipe are embedded in the first opening, thereby facilitating reduction of the overall thickness of the first circuit board structure. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 A cross-sectional view of the first inner side circuit board provided in the first embodiment of the application.

[0022] Figure 2 A cross-sectional view of the first inner side circuit board provided in the first embodiment of the application. Figure 1 A cross-sectional view of the first inner side circuit board provided in the first embodiment of the application.

[0023] Figure 3 A cross-sectional view of the first inner side circuit board provided in the first embodiment of the application. Figure 2 A cross-sectional view of the first inner side circuit board provided in the first embodiment of the application.

[0024] Figure 4 A cross-sectional view of the first inner side circuit board provided in the first embodiment of the application. Figure 3 A cross-sectional view of the first inner side circuit board provided in the first embodiment of the application.

[0025] Figure 5 A cross-sectional view of the first inner side circuit board provided in the first embodiment of the application. Figure 4 A cross-sectional view of the first inner side circuit board provided in the first embodiment of the application.

[0026] Figure 6 A cross-sectional view of the first inner side circuit board provided in the first embodiment of the application. Figure 5 A cross-sectional view of the first inner side circuit board provided in the first embodiment of the application.

[0027] Figure 7 A cross-sectional view of the first inner side circuit board provided in the first embodiment of the application. Figure 6 A cross-sectional view of the first inner side circuit board provided in the first embodiment of the application.

[0028] Figure 8 A first circuit board structure is shown in cross section. Figure 7 A first circuit board structure is shown in cross section.

[0029] Figure 9 A third opening is provided in the substrate of the second embodiment and a third heat pipe is provided in the third opening.

[0030] Figure 10 A fourth opening is provided in the substrate of the second embodiment and a fourth heat pipe is provided in the fourth opening. Figure 9 A fourth opening is provided in the substrate of the second embodiment and a fourth heat pipe is provided in the fourth opening.

[0031] Figure 11 A second circuit board is formed by etching the substrate as shown. Figure 10 A second circuit board is formed by etching the substrate as shown.

[0032] Figure 12 A second circuit board structure is shown in cross section. Figure 11 A second circuit board structure is shown in cross section.

[0033] Figure 13 A second circuit board structure is shown in cross section. Figure 12 A second circuit board structure is shown in cross section.

[0034] Explanation of main component symbols

[0035] First circuit board structure: 100; first adhesive layer: 101; second adhesive layer: 102; substrate: 10; first inner side circuit board: 11; first inner side insulating layer: 111; first inner side circuit layer: 112; second inner side circuit layer: 113; first outer side board: 12; first outer side insulating layer: 121; first outer side copper foil layer: 122; second outer side board: 13; second outer side insulating layer: 131; second outer side copper foil layer: 132; first opening: 14; through hole: 15; first electroplated layer: 20; second electroplated layer: 21; first heat conduction pipe: 22; first end: 221; second end: 222; conductive body: 23; head end: 231; tail end: 232; insulating plug body: 24; second opening: 241; first outer side circuit layer: 25; first outer side circuit board: 251; first cold pad: 252; first circuit: 253; second outer side circuit layer: 26; second outer side circuit board: 261; first hot pad: 262; second circuit: 263; first slot: 27; insulating pad: 271; circuit substrate: 28; second heat conduction pipe: 30; third end: 31; second cold pad: 311; second hot pad: 321; fourth end: 32; first anti-soldering layer: 33; first window: 331; second anti-soldering layer: 34; second window: 341; third outer side circuit layer: 35; third cold pad: 351; fourth cold pad: 352; fourth outer side circuit layer: 36; third hot pad: 361; fourth hot pad: 362; second circuit board structure: 200; third opening: 16; third heat conduction pipe: 161; fifth end: 161a; sixth end: 161b; fourth opening: 17; fourth heat conduction pipe: 171; seventh end: 171a; eighth end: 171b; third electroplated layer: 20a; fourth electroplated layer: 20b; first cover film: 40; third window: 401; second cover film: 41; second window: 411; symmetry axis: A, C; thickness direction: B; accommodating space: S.

[0036] The following specific embodiments will further illustrate the present application in conjunction with the above-mentioned drawings. Specific embodiments

[0037] The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all.

[0038] See Figures 1 to 8 The first embodiment of the present application provides a manufacturing method of a first circuit board structure 100 for realizing temperature measurement function, which specifically comprises the following steps:

[0039] S100: See Figure 2The substrate 10 is provided, which includes a first inner side circuit board 11, a first outer side plate 12, a second outer side plate 13, a first adhesive layer 101 and a second adhesive layer 102. The first adhesive layer 101 connects the first outer side plate 12 and one side of the first inner side circuit board 11. The second adhesive layer 102 connects the second outer side plate 13 and the other side of the first inner side circuit board 11.

[0040] Referring to Figures 1 to 2 In this embodiment, the manufacturing method of the substrate 10 in step S100 includes:

[0041] S101: Referring to Figure 1 The first inner side circuit board 11 is provided, which includes a first inner side insulating layer 111, a first inner side circuit layer 112 and a second inner side circuit layer 113. The first inner side circuit layer 112 and the second inner side circuit layer 113 are respectively arranged on opposite sides of the first inner side insulating layer 111.

[0042] S102: Referring to Figure 2 The first outer side plate 12 and the second outer side plate 13 are respectively laminated on opposite sides of the first inner side circuit board 11. The first outer side plate 12 includes a first outer side insulating layer 121 and a first outer side copper foil layer 122. The first adhesive layer 101 is arranged between the first outer side insulating layer 121 and the first inner side circuit layer 112. The second outer side plate 13 includes a second outer side insulating layer 131 and a second outer side copper foil layer 132. The second adhesive layer 102 is arranged between the second outer side insulating layer 131 and the second inner side circuit layer 113.

[0043] S110: Referring to Figure 3 A first through hole 14 is arranged through the substrate 10. Specifically, the first through hole 14 is substantially cylindrical, and the first through hole 14 has an axis of symmetry A. The axis of symmetry A is substantially parallel to the thickness direction B of the substrate 10, that is, the first through hole 14 penetrates the first inner side circuit board 11, the first outer side plate 12 and the second outer side plate 13 along the thickness direction B of the substrate 10. The first through hole 14 is formed by mechanical drilling.

[0044] In this embodiment, step S110 further includes:

[0045] S111: Referring to Figure 3Two through holes 15 are formed through the substrate 10. The two through holes 15 are spaced apart, and the first opening 14 is disposed between the two through holes 15. Specifically, the two through holes 15 pass through the first inner side circuit board 11, the first outer side plate 12, and the second outer side plate 13 along the thickness direction B of the substrate 10. The two through holes 15 are formed by mechanical drilling.

[0046] S120: Please refer to Figure 3 A first electroplated layer 20 is disposed on the side of the first outer side plate 12 facing away from the first inner side circuit board 11, and a second electroplated layer 21 is disposed on the side of the second outer side plate 13 facing away from the first inner side circuit board 11. Part of the first electroplated layer 20 and part of the second electroplated layer 21 fill the first opening 14 to form a first heat pipe 22, and part of the first electroplated layer 20 and part of the second electroplated layer 21 fill the through holes 15 to form a conductive body 23.

[0047] In this embodiment, the first heat pipe 22 electrically connects the first inner side circuit board 11, the first outer side plate 12, and the second outer side plate 13. Specifically, the first heat pipe 22 includes a first end 221 and a second end 222 opposite the first end 221. The first end 221 is connected to the second outer side copper foil layer 132, and the second end 222 is connected to the first outer side copper foil layer 122. The conductive body 23 electrically connects the first inner side circuit board 11, the first outer side plate 12, and the second outer side plate 13. Specifically, the conductive body 23 is a hollow structure, and the conductive body 23 includes a head end 231 and a tail end 232 opposite the head end 231. The head end 231 is connected to the first outer side copper foil layer 122, and the tail end 232 is connected to the second outer side copper foil layer 132. The first heat pipe 22 is a material that can generate the Seebeck Effect, specifically including at least one of a metal conductor, a metal oxide semiconductor, a III-V compound semiconductor, a carbon-based material, and an organic semiconductor material. The metal conductor includes copper, silver, gold, aluminum, and the like; the metal oxide semiconductor includes zinc oxide, barium titanate, nickel oxide, and the like; the III-V compound semiconductor includes gallium arsenide, gallium phosphide, indium phosphide, and the like; the carbon-based material includes graphite, carbon nanotubes, and graphene, and the like; and the organic semiconductor material includes conductive polymers such as polythiophene and polyaniline. Preferably, the material of the first heat pipe 22 is copper.

[0048] S130: Please refer to Figure 4The first heat conducting pipe 22 is filled with an insulating resin to form an insulating plug 24. Specifically, the insulating plug 24 is formed in the first heat conducting pipe 22 by one of injection molding, roll plug, compressed air injection, vacuum suction, wave soldering, and double-sided spraying. The insulating plug 24 includes an insulating resin such as epoxy resin, polyurethane resin, phenolic resin, silicone resin, and acrylic resin.

[0049] S140: Please refer to Figure 5 A second opening 241 is provided in the insulating plug 24, the second opening 241 penetrating the insulating plug 24 along the thickness direction B to form a first insulating pipe 242. Specifically, the second opening 241 is formed by mechanical drilling.

[0050] In this embodiment, the second opening 241 is substantially cylindrical, and the second opening 241 has an axis of symmetry C, which coincides with the axis of symmetry A of the first opening 14.

[0051] S150: Please refer to Figure 6 The first outer copper foil layer 122 and the first electroplated layer 20 are etched to form a first outer circuit layer 25, and the first outer circuit layer 25 and the first outer insulating layer 121 constitute a first outer circuit board 251. The second outer copper foil layer 132 and the second electroplated layer 21 are etched to form a second outer circuit layer 26, and the second outer circuit layer 26 and the second outer insulating layer 131 constitute a second outer circuit board 261. Meanwhile, the first outer circuit layer 25, the second outer circuit layer 26, the first inner circuit board 11, the first adhesive layer 101, and the second adhesive layer 102 constitute a circuit substrate 28. The first outer circuit layer 25 includes a first cold pad 252 and a first circuit 253 electrically insulated from the first cold pad 252. The first cold pad 252 is connected to the second end 222. The second outer circuit layer 26 includes a first hot pad 262 and a second circuit 263 electrically insulated from the first hot pad 262. The first hot pad 262 is connected to the first end 221.

[0052] In this embodiment, step S150 further includes:

[0053] S151: Please refer to Figure 6A first slot 27 is formed in the first outer copper foil layer 122 and the tube wall of the first insulating tube 242, the first slot 27 extends substantially along the thickness direction B, and one end of the first slot 27 is communicated with the second opening 241. Part of the first outer copper foil layer 122 is exposed at the bottom of the first slot 27. Specifically, the first slot 27 penetrates the first cold junction pad 252 along the thickness direction B.

[0054] S152: Please refer to Figure 6 An insulating pad 271 is filled in the first slot 27, which can be used for electrically isolating the second end 222 and other components (see below).

[0055] S160: Please refer to Figure 7 A second heat conduction tube 30 is arranged on the inner wall of the second opening 241, the second heat conduction tube 30 includes a third end 31 and a fourth end 32 opposite to the third end 31. The third end 31 extends substantially along the thickness direction B to form a second cold junction pad 311, and the fourth end 32 extends substantially along the thickness direction B to form a second hot junction pad 321. The second hot junction pad 321 is arranged on the first hot junction pad 262 to realize the connection of the two. The second cold junction pad 311 is arranged on the insulating pad 271 to realize the electrical isolation with the first cold junction pad 252. The material of the second heat conduction tube 30 is different from that of the first heat conduction tube 22. That is, the Seebeck coefficient of the first heat conduction tube 22 is different from that of the second heat conduction tube 30, so that the first heat conduction tube 22 and the second heat conduction tube 30 can have Seebeck effect. Specifically, the material of the second heat conduction tube 30 includes at least one of metal conductor, metal oxide semiconductor, III-V compound semiconductor, carbon-based material, and organic semiconductor material. The metal conductor includes copper, silver, gold, aluminum and other metals; the metal oxide semiconductor includes zinc oxide, barium titanate, nickel oxide and the like; the III-V compound semiconductor includes gallium arsenide, gallium phosphide, indium phosphide and the like; the carbon-based material includes graphite, carbon nanotube and graphene and the like; the organic semiconductor material includes conductive polymers such as polythiophene and polyaniline. Preferably, the material of the second heat conduction tube 30 is constantan.

[0056] In the embodiment, the first cold junction pad 252 and the second cold junction pad 311 can be used to connect a differential pressure measurement circuit (not shown), and the first hot junction pad 262 and the second hot junction pad 321 can be used to contact a heat source (not shown). When measuring temperature, the first thermal conductor 22 and the second thermal conductor 30 are respectively in thermal communication with a heat generating element (e.g., a chip) through the first hot junction pad 262 and the second hot junction pad 321, and the first thermal conductor 22 and the second thermal conductor 30 are respectively connected to the differential pressure measurement circuit through the first cold junction pad 252 and the second cold junction pad 311, thereby forming a first thermoelectric element (not shown). In an electric circuit including two different Seebeck coefficients, carriers flow from the hot end (i.e., the first hot junction pad 262 and the second hot junction pad 321) to the cold end (i.e., the first cold junction pad 252 and the second cold junction pad 311) and accumulate at the cold end by the Seebeck effect, thereby generating a potential difference between the first cold junction pad 252 and the second cold junction pad 311, which can be measured by the differential pressure measurement circuit. After temperature-potential difference correction by the differential pressure measurement circuit, the temperature of the hot end can be measured.

[0057] S170: Please refer to Figure 8 A first anti-soldering layer 33 is arranged on the first outer circuit layer 25, and a second anti-soldering layer 34 is arranged on the second outer circuit layer 26. Part of the first anti-soldering layer 33 and / or part of the second anti-soldering layer 34 fill the two hollow conductive bodies 23, thereby obtaining the first circuit board structure 100.

[0058] In the embodiment, the first anti-soldering layer 33 is provided with a first window 331, and the first cold junction pad and the second cold junction pad are exposed at the bottom of the first window 331, thereby facilitating connection of the two to the differential pressure measurement circuit. The second anti-soldering layer 34 is provided with a second window 341, and the first hot junction pad and the second hot junction pad are exposed at the bottom of the second window 341, thereby facilitating contact of the two to the heat source.

[0059] Compared with the prior art, the manufacturing method of the first circuit board structure 100 provided by the first embodiment of the present application arranges the first thermal conductor 22 and the second thermal conductor 30 in the first opening 14 in sequence, one end of the first thermal conductor 22 and the second thermal conductor 30 is connected, and the other end is respectively connected to a differential pressure measurement circuit, thereby forming a first thermoelectric element. That is, the first thermal conductor 22 and the second thermal conductor 30 are embedded in the first opening 14, thereby facilitating reduction of the overall thickness of the first circuit board structure 100.

[0060] Please refer to Figure 8The first circuit board structure 100 includes a circuit substrate 28, a first heat pipe 22, and a second heat pipe 30. The circuit substrate 28 is provided with a first opening 14, the first heat pipe 22 is arranged in the first opening 14, and the second heat pipe 30 is arranged in the first heat pipe 22. One end of the first heat pipe 22 is connected to one end of the second heat pipe 30, and the other end of the first heat pipe 22 and the other end of the second heat pipe 30 are respectively connected to the differential pressure measurement circuit, thereby forming a first thermoelectric element. The Seebeck coefficient of the first heat pipe 22 is different from the Seebeck coefficient of the second heat pipe 30.

[0061] Referring to Figure 3 and Figure 8 In this embodiment, the circuit substrate 28 includes a first inner circuit board 11, a first outer circuit board 251, a second outer circuit board 261, a first adhesive layer 101, and a second adhesive layer 102. The first outer circuit board 251 and the second outer circuit board 261 are respectively arranged on opposite sides of the first inner circuit board 11. The first adhesive layer 101 is arranged between one side of the first inner circuit board 11 and the first outer circuit board 251. The second adhesive layer 102 is arranged between the other side of the first inner circuit board 11 and the second outer circuit board 261.

[0062] Referring to Figure 7 and Figure 8 In this embodiment, the first outer circuit board 251 includes a first cold pad 252 connected to the first end 221 of the first heat pipe 22. The second outer circuit board 261 includes a first hot pad 262 connected to the second end 222 of the first heat pipe 22. The first cold pad 252 is used for electrically connecting the differential pressure measurement circuit, and the first hot pad 262 is used for contacting the heat source.

[0063] Referring to Figure 7 and Figure 8 In this embodiment, the first outer circuit board 251 is provided with a first slot 27, and an insulating pad 271 is arranged in the first slot 27. The second heat pipe 30 includes a third end 31 and a fourth end 32 opposite to the third end 31. The third end 31 extends on the insulating pad 271 to form a second cold pad 311. The fourth end 32 extends on the first hot pad 262 to form a second hot pad 321. The second hot pad 321 is used for contacting the heat source.

[0064] Referring to Figure 7 and Figure 8In the embodiment, the first circuit board structure 100 further comprises a first insulating tube 242, which is arranged between the first heat-conducting tube 22 and the second heat-conducting tube 30, thereby facilitating the fixation of the first heat-conducting tube 22 and the second heat-conducting tube 30.

[0065] Referring to Figure 3 , Figures 9 to 13 The second embodiment of the present application provides a manufacturing method of a second circuit board structure 200, which is different from the first embodiment in that the step S1 is followed by:

[0066] S180: Referring to Figure 3 and Figure 9 , the third aperture 16 and the fourth aperture 17 are arranged through the substrate 10.

[0067] S190: Referring to Figure 9 and Figure 10 , a third heat-conducting tube 161 is arranged in the third aperture 16, the third heat-conducting tube 161 comprising a fifth end 161a and a sixth end 161b opposite to the fifth end 161a. The material of the third heat-conducting tube 161 is substantially the same as that of the first heat-conducting tube 22.

[0068] In the embodiment, the step S190 specifically comprises:

[0069] S191: Referring to Figure 9 , the fourth aperture 17 is shielded, specifically, the fourth aperture 17 is covered by a dry film (not shown).

[0070] S192: Referring to Figure 9 , a third electroplated layer 20a is arranged on the side of the first outer side plate 12 away from the first inner side circuit board 11, and a fourth electroplated layer 20b is arranged on the side of the second outer side plate 13 away from the first inner side circuit board 11, part of the third electroplated layer 20a and / or the fourth electroplated layer 20b filling the third aperture 16 to form the third heat-conducting tube 161.

[0071] S193: Referring to Figure 9 , the dry film is removed to expose the fourth aperture 17 again.

[0072] S200: Referring to Figure 10 , a fourth heat-conducting tube 171 is arranged in the fourth aperture 17, the fourth heat-conducting tube 171 comprising a seventh end 171a and an eighth end 171b opposite to the seventh end 171a. Specifically, the fourth heat-conducting tube 171 is formed in the fourth aperture 17 by means of selective sputtering. The material of the fourth heat-conducting tube 171 is substantially the same as that of the second heat-conducting tube 30.

[0073] S210: Please refer to Figure 11 , etching the third plated layer 20a and the first outer copper foil layer 122 to form the third outer circuit layer 35. The third outer circuit layer 35 has a third cold pad 351 and a fourth cold pad 352. The third cold pad 351 is electrically isolated from the fourth cold pad 352. The third cold pad 351 is connected to the fifth end 161a of the third heat pipe 161, and the fourth cold pad 352 is connected to the seventh end 171a of the fourth heat pipe 171. The third cold pad 351 and the fourth cold pad 352 are used to connect the differential pressure measurement circuit.

[0074] S220: Please refer to Figure 11 , etching the second plated layer 21 and the second outer copper foil layer 132 to form the fourth outer circuit layer 36. The fourth outer circuit layer 36 has a third hot pad 361 and a fourth hot pad 362. The third hot pad 361 is electrically connected to the fourth hot pad 362. The third hot pad 361 is connected to the seventh end 161b of the third heat pipe 161, and the fourth hot pad 362 is connected to the eighth end 171b of the fourth heat pipe 171. The third hot pad 361 and the fourth hot pad 362 are used to contact the heat source.

[0075] S230: Please refer to Figure 12 , disposing a first cover film 40 on the third outer circuit layer 35 and a second cover film 41 on the fourth outer circuit layer 36 to obtain the second circuit board structure 200. The first cover film 40 is provided with a third window 401, and the third cold pad 351 and the fourth cold pad 352 are exposed in the third window 401, thereby facilitating the connection of the differential pressure measurement circuit. The second cover film 41 is provided with a second window 411, and the third hot pad 361 and the fourth hot pad 362 are exposed in the second window 411, thereby facilitating the connection of the heat source.

[0076] Please refer to Figure 13 , the second circuit board structure 200 of the second embodiment of the present application further comprises the following steps:

[0077] S240: removing part of the third heat pipe 161, part of the fourth heat pipe 171, and part of the second circuit board structure 200 between the third heat pipe 161 and the fourth heat pipe 171 to form a containing space S. The containing space S can be used to embed other elements (such as chips, etc.), thereby reducing the overall thickness of the second circuit board structure 200.

[0078] Compared with the first embodiment, the manufacturing method of the second circuit board structure 200 provided by the second embodiment of the present application, by arranging the third opening 16 and the fourth opening 17 in a spaced manner, and then arranging the third heat pipe 161 in the third opening 16 and the fourth heat pipe 171 in the fourth opening 17 in sequence, not only can facilitate the thickness reduction of the second circuit board structure 200, but also can facilitate the maintenance and repair of the third heat pipe 161 and the fourth heat pipe 171 due to the large spacing between the third heat pipe 161 and the fourth heat pipe 171.

[0079] Referring to Figure 12 The second embodiment of the present application further provides a second circuit board structure 200. The second circuit board structure 200 comprises a circuit substrate 28, a third heat pipe 161 and a fourth heat pipe 171. The circuit substrate 28 is arranged with a third opening 16 and a fourth opening 17 in a spaced manner. The third heat pipe 161 is arranged in the third opening 16. The fourth heat pipe 171 is arranged in the fourth opening 17. One end of the third heat pipe 161 is connected to one end of the fourth heat pipe 171, and the one end of the third heat pipe 161 and the one end of the fourth heat pipe 171 are used to contact the heat source. The other end of the third heat pipe 161 is electrically disconnected from the other end of the fourth heat pipe 171, and the other end of the third heat pipe 161 and the other end of the fourth heat pipe 171 are used to connect a differential pressure measurement circuit, thereby forming a second thermoelectric element 201. Wherein, the Seebeck coefficient of the third heat pipe 161 is different from the Seebeck coefficient of the fourth heat pipe 171.

[0080] Referring to Figure 12 In the present embodiment, the second circuit board structure 200 further comprises a third cold junction pad 351 and a fourth cold junction pad 352. The third cold junction pad 351 and the fourth cold junction pad 352 are electrically separated to form a second slot 255. The third cold junction pad 351 is connected to one end of the third heat pipe 161, and the fourth cold junction pad 352 is connected to one end of the fourth heat pipe 171. The third cold junction pad 351 and the fourth cold junction pad 352 are respectively used to connect the differential pressure measurement circuit. Part of the first outer insulating layer 121 is exposed at the bottom of the second slot 255 to achieve the electrical isolation of the third cold junction pad 351 and the fourth cold junction pad 352.

[0081] Referring to Figure 12In the embodiment, the second circuit board structure 200 further comprises a third heat sink pad 361 and a fourth heat sink pad 362. The third heat sink pad 361 is electrically connected with the fourth heat sink pad 362. The third heat sink pad 361 is connected with the other end of the third heat conduction pipe 161, and the fourth heat sink pad 362 is connected with the other end of the fourth heat conduction pipe 171. The third heat sink pad 361 and the fourth heat sink pad 362 are used to contact the heat source.

[0082] The above description is merely one specific implementation of the present application, but it cannot be limited to this implementation in practical application. Other modifications and changes made by those skilled in the art according to the technical concept of the present application should all belong to the protection scope of the present application.

Claims

1. A method of manufacturing a circuit board structure, characterized by, The method comprises the steps of: providing a substrate; providing a first opening through the substrate; providing a first heat pipe in the first opening, the first heat pipe having a first end and a second end opposite to the first end, the first end and the second end being arranged along the thickness direction of the circuit board structure; filling the first heat pipe with insulating resin to form an insulating plug; providing a second opening in the insulating plug; providing a second heat pipe in the second opening, the second heat pipe having a third end and a fourth end opposite to the third end, the third end and the fourth end being arranged along the thickness direction of the circuit board structure, the fourth end being in thermal conduction with the first end and located on the same side of the substrate, thereby obtaining the circuit board structure, wherein the fourth end and the first end are used to contact a heat source, the third end and the second end are used to respectively communicate with a differential pressure measurement circuit, the second end and the third end are electrically insulated, and the Seebeck coefficient of the first heat pipe is different from that of the second heat pipe.

2. The production method according to claim 1, wherein The substrate comprises a first inner side circuit board, a first outer side plate, a second outer side plate, a first adhesive layer, and a second adhesive layer, the first adhesive layer connects one side of the first inner side circuit board and the first outer side plate, the second adhesive layer connects the other side of the first inner side circuit board and the second outer side plate, the first outer side plate comprises a first copper foil layer facing away from the first inner side circuit board, the second outer side plate comprises a second copper foil layer facing away from the first inner side circuit board, and the manufacturing method further comprises the steps of: providing a first electroplated layer on the first copper foil layer, providing a second electroplated layer on the second copper foil layer, the first electroplated layer and / or the second electroplated layer filling the first opening to form the first heat pipe, etching the first copper foil layer and the first electroplated layer to form a first outer side circuit layer, and etching the second copper foil layer and the second electroplated layer to form a second outer side circuit layer.

3. The production method according to claim 2, wherein The method further comprises the steps of: providing a first anti-welding layer on the first outer side circuit layer, providing a second anti-welding layer on the second outer side circuit layer, providing two through holes through the substrate, and filling part of the first electroplated layer and / or the second electroplated layer into the through holes to form a hollow conduction body, filling part of the first anti-welding layer and / or the second anti-welding layer into the hollow conduction body.

4. The production method according to claim 3, wherein The first outer side circuit layer comprises a first cold pad, and the second outer side circuit layer comprises a first hot pad, the first cold pad is connected to the second end, the first hot pad is connected to the first end, the first cold pad is provided with a first slot, and the manufacturing method further comprises the steps of: providing a first insulating pad in the first slot, providing a second cold pad on the first insulating pad, the second cold pad being connected to the third end and electrically insulated from the second end, providing a second hot pad on the first hot pad, the second hot pad being connected to the fourth end and in thermal conduction with the first hot pad.

5. A circuit board structure, characterized by, The method comprises the steps of: providing a circuit board provided with a first opening, A first heat conduction pipe is arranged in the first opening, the first heat conduction pipe has a first end and a second end opposite to the first end, the first end and the second end are arranged along the thickness direction of the circuit board structure; A second heat conduction pipe is arranged in the first heat conduction pipe, the second heat conduction pipe includes a third end and a fourth end opposite to the third end, the third end and the fourth end are arranged along the thickness direction of the circuit board structure, the first end and the fourth end are located on the same side of the line substrate, the first end and the fourth end are in thermal conduction for contacting the heat source, the second end and the third end are electrically insulated for connecting the differential pressure measurement circuit, the Seebeck coefficient of the first heat conduction pipe is different from the Seebeck coefficient of the second heat conduction pipe.

6. The circuit board structure of claim 5, wherein, The line substrate includes a first outer line board and a second outer line board, the first outer line board includes a first outer line layer, the first outer line board includes a first cold pad, the second outer line board includes a first hot pad, the first cold pad is connected to the second end, and the first hot pad is connected to the first end.

7. The circuit board structure of claim 6, wherein, The circuit board structure further includes a second cold pad, a second hot pad and a first insulating pad, the first cold pad is provided with a first slot, the first insulating pad is arranged in the first slot, the second cold pad is arranged on the first insulating pad, the second cold pad is connected to the third end, the second hot pad is arranged on the first hot pad, and the second hot pad is connected to the fourth end.

8. The circuit board structure of claim 7, wherein, The circuit board structure further includes a hollow conducting body, a first anti-welding layer and a second anti-welding layer, the conducting body communicates the first outer line board and the second outer line board, and the first anti-welding layer and / or the second anti-welding layer fill the hollow conducting body.

9. A method of manufacturing a circuit board structure, characterized by, The method includes the steps of: providing a substrate; arranging a third opening and a fourth opening through the substrate, the third opening and the fourth opening are arranged at intervals; arranging a third heat conduction pipe in the third opening, the third heat conduction pipe includes a fifth end and a sixth end opposite to the fifth end, the fifth end and the sixth end are arranged along the thickness direction of the circuit board structure; arranging a fourth heat conduction pipe in the fourth opening, the fourth heat conduction pipe includes a seventh end and an eighth end opposite to the seventh end, the seventh end and the eighth end are arranged along the thickness direction of the circuit board structure, the seventh end is in thermal conduction with the fifth end and they are located on the same side of the substrate, obtaining the circuit board structure, the eighth end and the sixth end are electrically insulated, wherein the fifth end and the seventh end are used for contacting the heat source, the eighth end and the sixth end are used for connecting the differential pressure measurement circuit respectively, and the Seebeck coefficient of the third heat conduction pipe is different from the Seebeck coefficient of the fourth heat conduction pipe.

10. The production method according to claim 9, wherein The method further includes the steps of: etching the substrate to form a line substrate, the line substrate includes a third outer line layer and a fourth outer line layer, wherein The third outer circuit layer includes a third cold junction pad and a fourth cold junction pad, the third cold junction pad is electrically isolated from the fourth cold junction pad, the third cold junction pad is connected to the sixth end of the third heat conduction pipe, the fourth cold junction pad is connected to the eighth end of the fourth heat conduction pipe, and the third cold junction pad and the fourth cold junction pad are respectively used for connecting the differential pressure measurement circuit; The fourth outer circuit layer includes a third hot junction pad and a fourth hot junction pad, the third hot junction pad is electrically connected to the fourth hot junction pad, the third hot junction pad is connected to the fifth end of the third heat conduction pipe, and the fourth hot junction pad is connected to the seventh end of the fourth heat conduction pipe, and the third hot junction pad and the fourth hot junction pad are used for contacting the heat source.

11. The production method according to claim 10, wherein Further comprising steps of: Removing part of the third heat conduction pipe, part of the fourth heat conduction pipe, and part of the circuit board structure between the third heat conduction pipe and the fourth heat conduction pipe to form a receiving space for accommodating other elements.

12. A circuit board structure, characterized by Comprising: A circuit substrate is provided with a third opening and a fourth opening, and the third opening and the fourth opening are arranged at intervals; A third heat conduction pipe is arranged in the third opening, and the third heat conduction pipe has a fifth end and a sixth end opposite to the fifth end, and the fifth end and the sixth end are arranged along the thickness direction of the circuit board structure; A fourth heat conduction pipe is arranged in the fourth opening, and the fourth heat conduction pipe has a seventh end and an eighth end opposite to the seventh end, and the seventh end and the eighth end are arranged along the thickness direction of the circuit board structure, the fifth end and the seventh end are in thermal conduction, and the fifth end and the seventh end are used for contacting the heat source, the sixth end and the eighth end are electrically isolated, and the sixth end and the eighth end are respectively used for connecting the differential pressure measurement circuit, and the Seebeck coefficient of the third heat conduction pipe is different from the Seebeck coefficient of the fourth heat conduction pipe.

13. The circuit board structure of claim 12, wherein, The circuit substrate includes a third outer circuit layer and a fourth outer circuit layer, the third outer circuit layer includes a third cold junction pad and a fourth cold junction pad, the third cold junction pad is electrically isolated from the fourth cold junction pad, the third cold junction pad is connected to the sixth end of the third heat conduction pipe, the fourth cold junction pad is connected to the eighth end of the fourth heat conduction pipe, and the third cold junction pad and the fourth cold junction pad are respectively used for connecting the differential pressure measurement circuit; The fourth outer circuit layer includes a third hot junction pad and a fourth hot junction pad, the third hot junction pad is electrically connected to the fourth hot junction pad, the third hot junction pad is connected to the fifth end of the third heat conduction pipe, and the fourth hot junction pad is connected to the seventh end of the fourth heat conduction pipe, and the third hot junction pad and the fourth hot junction pad are used for contacting the heat source.

14. The circuit board structure of claim 13, wherein, The circuit board structure further includes a third anti-soldering layer and a fourth anti-soldering layer, the third anti-soldering layer is arranged on the third outer circuit layer, the third anti-soldering layer is provided with a third window, the third cold junction pad and the fourth cold junction pad are exposed to the third window, the fourth anti-soldering layer is arranged on the fourth outer circuit layer, the fourth anti-soldering layer is provided with a fourth window, and the third hot junction pad and the fourth hot junction pad are exposed to the fourth window.

15. The circuit board structure of claim 12, wherein, The circuit board structure is further provided with a containing space, which penetrates part of the third heat conduction pipe, part of the fourth heat conduction pipe and part of the circuit board structure between the third heat conduction pipe and the fourth heat conduction pipe.

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