Circuit board hole forming method and circuit board processing equipment

Abstract

The invention discloses a circuit board hole forming method and circuit board processing equipment. The circuit board hole forming method comprises the following steps: a milling step: carrying out milling operation on a bearing surface of a bakelite plate on a carrying table; a placing step: arranging the circuit board to be processed on the bearing surface; a measurement step: carrying out measurement at a plurality of preset measurement positions of a preset hole forming area of the circuit board to be processed so as to obtain a plurality of pieces of measurement information; a compensation calculation step: calculating a plurality of depth compensation values according to each piece of measurement information and a preset depth value; and a processing step: according to each piece of measurement information and the corresponding depth compensation value, controlling a hole forming device to form a blind hole of which the depth accords with a preset depth tolerance range in each preset segmentation region.

Description

Technical Field

[0001] The invention relates to a hole forming method and processing equipment, in particular to a circuit board hole forming method and circuit board processing equipment. Background Art

[0002] In the existing technology of forming holes in circuit boards, various factors often cause the holes in the circuit boards to have different depths at different locations. In worse cases, the depth of the holes in the circuit boards at some locations exceeds the preset depth tolerance range, which may cause problems in subsequent processing of the circuit boards. Summary of the invention

[0003] The present invention discloses a circuit board hole forming method and circuit board processing equipment, which are mainly used to improve the problem that the holes formed in the circuit board at different positions easily exceed the preset depth allowable range.

[0004] One embodiment of the present invention discloses a circuit board hole forming method, which can be executed by a processing device of a circuit board processing equipment. The circuit board hole forming method comprises: a milling step: performing a milling operation on a bearing surface of a bakelite board disposed on a carrier of the circuit board processing equipment; a placement step: placing a circuit board to be processed on the bearing surface of the bakelite board; a measurement step: enabling a measuring device of the circuit board processing equipment to measure at multiple preset measurement positions of a preset hole forming area of ​​the circuit board to be processed to obtain multiple measurement information; the preset hole forming area is divided into multiple preset segmented areas, each preset segmented area is set At least one preset measurement position is defined; each measurement information includes an X-axis coordinate value, a Y-axis coordinate value and a Z-axis coordinate value; a compensation calculation step: according to each measurement information and a preset depth value, a plurality of depth compensation values ​​are calculated; the sum of each depth compensation value and the corresponding Z-axis coordinate value, and the difference between the preset depth value and the preset depth value are within a preset depth tolerance range; a processing step: according to each measurement information and the corresponding depth compensation value, a hole forming device is controlled to form a blind hole with a depth that meets the preset depth tolerance range in each preset segmentation area; wherein the size of each preset segmentation area is larger than the size of the formed part of the hole forming device.

[0005] Optionally, in the milling step, the maximum height difference of the surface of the bakelite board is ±1000 microns; the preset depth tolerance range is ±50 microns.

[0006] Optionally, a protection step is included between the compensation calculation step and the processing step: a protection plate is set on the circuit board to be processed; and during the processing step, the protection plate located above the preset hole forming area is removed together.

[0007] Optionally, each preset segmentation area is set with at least three preset measurement positions; in the compensation calculation step, all measurement information obtained from all preset measurement positions located in the same preset segmentation area is used to first establish a fitting plane, and then the fitting plane and the preset depth value are used to calculate at least one depth compensation value corresponding to the preset segmentation area.

[0008] One embodiment of the present invention discloses a circuit board processing equipment, which includes: a carrier, which is provided with an electric board, the electric board has a bearing surface, and the bearing surface is used to bear a circuit board to be processed; a processing device, which is used to execute a circuit board hole forming method; a measuring device, which is electrically connected to the processing device; a hole forming device, which is electrically connected to the processing device, and the processing device can control the hole forming device to move relative to the circuit board to be processed in the X-axis, Y-axis and Z-axis; wherein the circuit board hole forming method executed by the processing device includes the following steps: a milling step: performing a milling operation on the bearing surface; a placement step: placing the circuit board to be processed on the bearing surface; a measuring step: making the measuring device at a plurality of preset measuring positions of a preset hole forming area of ​​the circuit board to be processed , to perform measurement to obtain a plurality of measurement information; the preset hole forming area is divided into a plurality of preset segmented areas, each preset segmented area is set with at least one preset measurement position; each measurement information includes an X-axis coordinate value, a Y-axis coordinate value and a Z-axis coordinate value; a compensation calculation step: according to each measurement information and a preset depth value, a plurality of depth compensation values ​​are calculated; the sum of each depth compensation value and the corresponding Z-axis coordinate value, and the difference between the preset depth value, is within a preset depth allowable range; a processing step: according to each measurement information and the corresponding depth compensation value, the hole forming device is controlled to form a blind hole with a depth that meets the preset depth allowable range in each preset segmented area; wherein the size of each preset segmented area is larger than the size of the formed part of the hole forming device.

[0009] Optionally, in the milling step, the maximum height difference of the surface of the bakelite board is ±1000 microns; the preset depth tolerance range is ±50 microns.

[0010] Optionally, a protection step is included between the compensation calculation step and the processing step: a protection plate is set on the circuit board to be processed; and during the processing step, the protection plate located above the preset hole forming area is removed together.

[0011] Optionally, each preset segmentation area is set with at least three preset measurement positions; in the compensation calculation step, all measurement information obtained from all preset measurement positions located in the same preset segmentation area is used to first establish a fitting plane, and then the fitting plane and the preset depth value are used to calculate at least one depth compensation value corresponding to the preset segmentation area.

[0012] In summary, the circuit board processing equipment and the circuit board hole forming method of the present invention can form holes in the circuit board to be processed, and the depths at different positions thereof fall within a preset depth tolerance range through the design of the milling step, the placement step, the measurement step, the compensation calculation step and the processing step.

[0013] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a block diagram of the circuit board processing equipment of the present invention.

[0015] Figure 2 It is a schematic diagram of the process of the circuit board hole forming method of the present invention.

[0016] Figure 3 It is a schematic diagram of the milling step of the circuit board hole forming method of the present invention.

[0017] Figure 4 It is a schematic diagram of the measuring step of the circuit board hole forming method of the present invention.

[0018] Figure 5 It is a schematic diagram of the protection step of the circuit board hole forming method of the present invention.

[0019] Figure 6 It is a schematic diagram of the processing steps of the circuit board hole forming method of the present invention.

[0020] Figure 7 It is a partial top view schematic diagram of the circuit board to be processed in the circuit board hole forming method of the present invention.

[0021] Figure 8 FIG. 2 is another schematic diagram of another process of the circuit board hole forming method of the present invention.

[0022] Fig. 9 It is another partial top view schematic diagram of the circuit board to be processed in the circuit board hole forming method of the present invention. DETAILED DESCRIPTION

[0023] In the following description, if it is indicated to refer to a specific figure or as shown in a specific figure, it is only used to emphasize that most of the related contents described in the subsequent description appear in the specific figure, but it does not limit the subsequent description to only refer to the specific figure.

[0024] Please also read Figures 1 to 7 , Figure 1 is a block diagram of a circuit board processing device of the present invention, Figure 2 Schematic diagram of the process of forming a circuit board hole of the present invention. Figures 3 to 6 They are schematic diagrams of the milling step, the measuring step, the protecting step, and the processing step of the circuit board hole forming method of the present invention, respectively. Figure 7 It is a partial top view schematic diagram of the circuit board to be processed in the circuit board hole forming method of the present invention.

[0025] The circuit board processing equipment 100 of the present invention comprises: a carrier 1, a processing device 2, a measuring device 3 and a hole forming device 4. The carrier 1 is provided with a bakelite board 11, and the bakelite board 11 has a bearing surface 111, and the bearing surface 111 is used to bear a circuit board A to be processed. The bakelite board 11 can be fixed to the carrier 1 by means of screws, for example.

[0026] The processing device 2 is, for example, disposed on the stage 1 or beside the stage 1. The processing device 2 is electrically connected to the measuring device 3 and the hole forming device 4. The processing device 2 can control the measuring device 3 so that the measuring device 3 measures the circuit board A to be processed disposed on the bakelite board 11. The processing device 2 can control the hole forming device 4 so that the hole forming device 4 forms holes on the circuit board A to be processed disposed on the bakelite board 11.

[0027] The measuring device 3, for example, includes a contact probe and a multi-axis connecting arm, and the processing device 2 can control the multi-axis connecting arm so that the contact probe moves relative to the circuit board A to be processed in the X-axis, Y-axis and Z-axis. The processing device 2 can control the multi-axis connecting arm so that the contact probe moves to above a specific position of the circuit board A to be processed, and the processing device 2 can control the multi-axis connecting arm so that the contact probe contacts the circuit board A to be processed downward, thereby obtaining a measurement information 31. The measurement information 31 includes an X-axis coordinate value, a Y-axis coordinate value and a Z-axis coordinate value. It should be noted that in special applications, the measuring device 3 can also measure the surface of the circuit board A to be processed in a non-contact manner to generate the measurement information 31.

[0028] The hole forming device 4 includes, for example, a forming member (such as a drill, a milling cutter, etc.) and a multi-axis connecting arm. The processing device 2 can control the multi-axis connecting arm to move the forming member relative to the circuit board A to be processed in the X-axis, Y-axis and Z-axis. The processing device 2 can control the multi-axis connecting arm to move the forming member to a specific position above the circuit board A to be processed, and the processing device 2 can control the multi-axis connecting arm to move the forming member downward to form a hole in the circuit board A to be processed.

[0029] The processing device 2 is used to execute the circuit board hole forming method of the present invention. The circuit board hole forming method of the present invention comprises the following steps:

[0030] A milling step S1: Perform a milling operation on the bearing surface 111 (such as Figure 3shown);

[0031] A placing step S2: placing the circuit board A to be processed on the carrying surface 111 of the bakelite board 11;

[0032] A measuring step S3: The measuring device 3 is used to measure a plurality of preset measuring positions P1-10 of a preset hole forming area A1 of the circuit board A to be processed, so as to obtain a plurality of measurement information 31 (such as Figure 1 , 4 The preset hole forming area A1 is divided into a plurality of preset segmented areas A11, each of which includes at least one preset measurement position P1; each pen of measurement information 31 includes an X-axis coordinate value, a Y-axis coordinate value, and a Z-axis coordinate value; wherein the size of each preset segmented area A11 is larger than the size of the formed part;

[0033] A protection step S4: a protection plate 5 is provided on the circuit board A to be processed (eg Figure 5 shown);

[0034] A compensation calculation step S5: Calculate multiple depth compensation values ​​21 according to each measurement information 31 and a preset depth value; the difference between the sum of each depth compensation value 21 and the corresponding Z-axis coordinate value and the preset depth value is within a preset depth tolerance range;

[0035] A processing step S6: Based on each measurement information 31 and the corresponding depth compensation value 21, the hole forming device is controlled to form a blind hole with a depth that meets the preset depth tolerance range in each preset segmentation area A11. In the processing step S6, the protection plate 5 located above the preset hole forming area A1 is also removed.

[0036] In one embodiment, in the milling step S1, the maximum height difference of the surface of the bakelite board 11 can be ±1000 microns (um), and the preset depth tolerance range can be ±50 microns (um). Through the above design, the height difference of the surface of the bakelite board 11 can be effectively reduced, thereby allowing the hole forming device 4 to more accurately form holes that meet the preset depth tolerance range on the circuit board A to be processed, and the depths of the holes in the circuit board A to be processed at different positions can all meet the preset depth tolerance range.

[0037] In the prior art, there is no process for milling the bakelite board 11. Therefore, in the prior art, when the hole forming device forms holes on the circuit board to be processed, it is easy for the height difference of the bakelite board 11 at different positions to cause the holes in the circuit board to be processed to have different depths at different positions.

[0038] In practical applications, the circuit board processing equipment 100 may further include a robotic arm, which is used to transfer the circuit board A to be processed so as to place the circuit board A to be processed on the carrying surface 111; or, to move the processed circuit board set on the carrying surface 111 to other locations.

[0039] like Figure 7 As shown in one example, the preset hole forming area A1 is, for example, rectangular, and the preset hole forming area A1 is, for example, divided into 10 preset segmented areas A11, and each preset segmented area A11 is, for example, set with a preset measurement position P1. In this example, in the measurement step S3, the processing device 2 will control the measurement device 3 to measure the Figure 7 The processing device 2 will obtain 10 pieces of measurement information 31 according to the 10 pieces of measurement information 31. In the compensation calculation step S5, the processing device 2 will calculate 10 pieces of depth compensation values ​​21 according to the 10 pieces of measurement information 31. In the processing step S6, the processing device 2 will control the formed part to form holes in the 10 preset segmented areas A11 in sequence according to each piece of depth compensation value 21 and the preset depth value. Finally, the holes formed in the 10 preset segmented areas A11 will be interconnected to form blind holes with substantially the same depth.

[0040] It should be noted that the size of each preset segmented area A11 is larger than the outer diameter of the forming part (e.g., milling cutter) of the hole forming device 4. The number of preset segmented areas A11 included in the preset hole forming area A1 can be designed according to the size of the actual forming part, the size of the preset hole forming area, etc., and is not limited here. In the example where the measuring device 3 includes a contact probe, the size of each preset segmented area A11 is larger than the needle size of the contact probe, and the contact probe can measure multiple positions in the preset segmented area A11.

[0041] By dividing the preset hole forming area A1 into a plurality of preset segmented areas A11 and using the measuring device 3 to measure the preset segmented areas A11 one by one to obtain the measurement information 31 corresponding to the plurality of preset segmented areas A11, and thereby calculating the design of a plurality of depth compensation values ​​21, the holes finally formed in the preset hole forming area A1 have substantially the same depth at different positions of the holes.

[0042] In the example where a preset measurement position P is set in each preset segmented area A11, the preset measurement position P can be set at the center of the preset segmented area A11, but is not limited thereto. In different embodiments, two or more preset measurement positions can also be set in each preset segmented area A11, and in the compensation calculation step S5, the processing device 2 can, for example, average the Z-axis coordinate values ​​in two or more measurement information 31 to calculate an average Z-axis coordinate value, and then use the average Z-axis coordinate value and the preset depth value to calculate the depth compensation value.

[0043] It should be noted that in practice, the processing device 2 will obtain the coordinates and preset depth of the hole forming area of ​​the circuit board A to be processed before the compensation calculation step S5. For example, before the compensation calculation step S5, the processing device 2 will know to control the forming part of the hole forming device 4 to move to the position of the coordinate (X1, Y1), and after contacting the circuit board A to be processed (at this time, the processing device 2 will determine the Z-axis coordinate of this position as the zero point), move downward by the preset depth to form a hole with a depth of the preset depth. After the compensation calculation step S5, the processing device 2 will obtain the preset segmentation area A11 belonging to the coordinate (X1, Y1) and the corresponding measurement information 31. Assuming that the Z-axis coordinate value of the measurement information 31 obtained by the processing device 2 is 15, it means that the preset segmentation area A11 is 15 microns higher than expected. In this way, the processing device 2 will calculate the depth compensation value 21 of the preset segmentation area A11 as 15 microns. Then, in the processing step S6, the processing device 2 will control the hole forming device 4 to form a hole with a depth of the preset depth plus 15 microns downward at the coordinate (X1, Y1).

[0044] By designing the protection step S4 , it is possible to prevent the area of ​​the circuit board A to be processed other than the preset hole forming area A1 from being damaged when the hole forming device 4 processes the circuit board A to be processed.

[0045] Please also read Figure 8 and Fig. 9 , Figure 8 is another schematic diagram of the process of forming a circuit board hole according to the present invention, Fig. 9 It is another partial top view schematic diagram of the circuit board to be processed in the circuit board hole forming method of the present invention.

[0046] The biggest difference between this embodiment and the above-mentioned embodiment is that three preset measurement positions P1, P2, and P3 are set in each preset segmented area A11, and in the measurement step S3, three pieces of measurement information 31 will be generated in each preset segmented area A11.

[0047] In the compensation calculation step S5A, the processing device 2 can use all the measurement information 31 obtained from all the preset measurement positions in the same preset segmentation area A11 to first establish a fitting plane, and then use the fitting plane and the preset depth value to calculate at least one depth compensation value 21 corresponding to the preset segmentation area A11. In practice, the processing device 2 can, for example, use three pieces of measurement information 31 in the same preset segmentation area A11 to calculate the fitting plane using the least square method.

[0048] In the processing step S6A, the processing device 2 controls the hole forming device 4 to process each preset segmentation area A11 of the circuit board A to be processed according to the fitting plane corresponding to each preset segmentation area A11, so as to form a blind hole with a depth within a preset depth range in each preset segmentation area.

[0049] For example, assuming that the fitting plane in each preset segmented area A11 can be represented by the equation: Z=aX+bY+c, then in the compensation calculation step S5, the processing device 2 will use the three measurement information 31 to calculate the coefficients a, b, and c in the equation. After the processing device 2 calculates the coefficients a, b, and c, in the processing step S6A, the processing device 2 controls the formed part to move to the coordinate (X1, Y1), and the processing device 2 inputs the coordinate (X1, Y1) into the equation, and the corresponding Z-axis coordinate can be calculated. In this way, the processing device 2 can accurately calculate the depth of the hole that needs to be formed downward at the coordinate position of the circuit board A to be processed by the preset depth.

[0050] In summary, the circuit board processing equipment and the circuit board hole forming method of the present invention can form holes in the circuit board to be processed, and the depths at different positions thereof fall within a preset depth tolerance range through the design of the milling step, the placement step, the measurement step, the compensation calculation step and the processing step.

[0051] The above description is only a preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the present invention.

Claims

1. A method for forming a hole in a circuit board, characterized in that: The circuit board hole forming method can be performed by a processing device of a circuit board processing equipment, and the circuit board hole forming method comprises: A milling step: performing a milling operation on a bearing surface of a bakelite board disposed on a carrier of the circuit board processing equipment; A placing step: placing a circuit board to be processed on the carrying surface of the bakelite board; A measuring step: enabling a measuring device of the circuit board processing equipment to measure at a plurality of preset measuring positions of a preset hole forming area of ​​the circuit board to be processed to obtain a plurality of measurement information; the preset hole forming area is divided into a plurality of preset segmented areas, each of the preset segmented areas is set with at least one preset measuring position; each piece of the measurement information includes an X-axis coordinate value, a Y-axis coordinate value and a Z-axis coordinate value; A compensation calculation step: calculating a plurality of depth compensation values ​​according to the measurement information of each stroke and a preset depth value; the difference between the sum of the depth compensation value of each stroke and the corresponding Z-axis coordinate value and the preset depth value is within a preset depth tolerance range; A processing step: according to each piece of measurement information and the corresponding depth compensation value, control a hole forming device to form a blind hole with a depth that meets the preset depth tolerance range in each preset segmentation area; wherein the size of each preset segmentation area is larger than the size of the formed part of the hole forming device.

2. The circuit board hole forming method according to claim 1, characterized in that: In the milling step, the maximum height difference of the surface of the bakelite board is ±1000 microns; the preset depth tolerance range is ±50 microns.

3. The circuit board hole forming method according to claim 1, characterized in that: Between the compensation calculation step and the processing step, a protection step is also included: setting a protection plate on the circuit board to be processed; in the processing step, removing the protection plate located above the preset hole forming area.

4. The circuit board hole forming method according to claim 1, characterized in that: Each of the preset segmentation areas is set with at least three preset measurement positions; in the compensation calculation step, a fitting plane is first established using all the measurement information obtained from all the preset measurement positions located in the same preset segmentation area, and then the fitting plane and the preset depth value are used to calculate at least one depth compensation value corresponding to the preset segmentation area.

5. A circuit board processing equipment, characterized in that: The circuit board processing equipment comprises: A carrier, the carrier is provided with a bakelite board, the bakelite board has a bearing surface, and the bearing surface is used to bear a circuit board to be processed; A processing device, the processing device is used to perform a circuit board hole forming method; a measuring device, the measuring device being electrically connected to the processing device; a hole forming device, the hole forming device is electrically connected to the processing device, and the processing device can control the hole forming device to move relative to the circuit board to be processed in the X-axis, Y-axis and Z-axis; The circuit board hole forming method performed by the processing device includes the following steps: A milling step: performing a milling operation on the bearing surface; A placing step: placing the circuit board to be processed on the carrying surface; A measuring step: enabling the measuring device to perform measurement at a plurality of preset measuring positions of a preset hole forming area of ​​the circuit board to be processed to obtain a plurality of measurement information; the preset hole forming area is divided into a plurality of preset segmented areas, each of the preset segmented areas is set with at least one preset measuring position; each piece of the measurement information includes an X-axis coordinate value, a Y-axis coordinate value and a Z-axis coordinate value; A compensation calculation step: calculating a plurality of depth compensation values ​​according to the measurement information of each stroke and a preset depth value; the difference between the sum of the depth compensation value of each stroke and the corresponding Z-axis coordinate value and the preset depth value is within a preset depth tolerance range; A processing step: controlling the hole forming device according to each piece of measurement information and the corresponding depth compensation value to form a blind hole with a depth that meets the preset depth tolerance range in each preset segmentation area; wherein the size of each preset segmentation area is larger than the size of the formed part of the hole forming device.

6. The circuit board processing equipment according to claim 5, characterized in that: In the milling step, the maximum height difference of the surface of the bakelite board is ±1000 microns; the preset depth tolerance range is ±50 microns.

7. The circuit board processing equipment according to claim 5, characterized in that: Between the compensation calculation step and the processing step, a protection step is also included: setting a protection plate on the circuit board to be processed; in the processing step, removing the protection plate located above the preset hole forming area.

8. The circuit board processing equipment according to claim 5, characterized in that: Each of the preset segmentation areas is set with at least three preset measurement positions; in the compensation calculation step, a fitting plane is first established using all the measurement information obtained from all the preset measurement positions located in the same preset segmentation area, and then the fitting plane and the preset depth value are used to calculate at least one depth compensation value corresponding to the preset segmentation area.

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