Method for directly replacing SIP device with lead in cavity

Abstract

The invention belongs to the technical field of lead welding, and particularly relates to a method for directly replacing an SIP device with a lead in a cavity, which comprises a drying oven, a heating stage and a hot air gun, and the hot air gun comprises a hot air gun nozzle. The problems that an SIP device with a lead cannot be directly replaced in a cavity, the device is prone to being damaged during repair and the efficiency is low are solved, and economic losses caused by product or device scrapping, new product re-production or production delivery delay due to device replacement are avoided; the SIP device with the lead is successfully and directly replaced in the cavity, the quality of the product and the SIP device is ensured not to be damaged, and the product is ensured to be delivered on time.

Description

Technical Field

[0001] The invention belongs to the technical field of lead welding, and in particular relates to a method for replacing a SIP device with leads in a cavity. Background Art

[0002] Due to its highly integrated characteristics, leaded SIP devices are widely used in many fields such as wireless communications, consumer electronics, automotive electronics, Internet of Things, military electronics, etc. It encapsulates multiple devices with different functions in the same package, and has the advantages of high performance, small volume packaging and low power consumption. Usually, leaded SIP devices are assembled on a printed circuit board, and the printed circuit board is then installed in a cavity to form a product. Leaded SIP devices generally include device leads and a ground pad on the bottom of the device.

[0003] The bottom of the leaded SIP device is grounded over a large area. Such devices can be directly replaced in the cavity. The existing technology uses a heating tool to heat such devices on the cavity, but the heat dissipation rate of the cavity is too fast, and heat cannot be accumulated on such devices. The direct consequence is that the leaded SIP device cannot be removed, and the printed circuit board is also damaged, eventually causing the product to be scrapped and delaying the production cycle. There are also equipment-type repair devices, but the operation steps are complicated and the efficiency is not high. Its integrated heat transfer method is very easy to damage the product and SIP devices.

[0004] Therefore, those skilled in the art provide a method for directly replacing a leaded SIP device in a cavity to solve the problems raised in the above background technology. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides a method for replacing a leaded SIP device directly and efficiently in a cavity while ensuring that the quality of the product and the device is not damaged.

[0006] The following steps are involved:

[0007] S1. Prepare equipment: the equipment includes an oven, a hot plate and a hot air gun, wherein the hot air gun includes a hot air gun nozzle;

[0008] S2, turn on the oven and adjust the temperature of the oven;

[0009] S3, turn on the heating stage and adjust the temperature of the heating stage;

[0010] S4, turn on the hot air gun and adjust the temperature and wind speed of the hot air gun;

[0011] S5. Put the product into the oven for 5 minutes, take it out, and then put it on the hot table to heat the reworked SIP device area for 3 to 8 minutes, and use a hot air gun to heat it simultaneously when the hot table is heating;

[0012] S6. When the solder on the leaded SIP device begins to melt, place the new device on a hot plate and heat it. After the solder is completely melted, remove the old device, add solder in the middle of the device ground pad and place the heated new device.

[0013] S7, completing the welding of the ground pad at the bottom of the device;

[0014] S8. After welding is completed, remove the product from the hot plate to dissipate the heat naturally, and replace the leaded SIP device directly in the cavity.

[0015] Preferably, the oven temperature is adjusted to 160°C ± 20°C.

[0016] Preferably, the temperature of the hot stage is adjusted to 250°C ± 30°C.

[0017] Preferably, the temperature of the hot air gun is adjusted to 350°C ± 10°C, and the wind speed is set to level 5 to 8.

[0018] Preferably, the product is placed inside the oven in an overall heating mode.

[0019] Preferably, the product is placed on a hot table to perform regional heating on the rework location.

[0020] Preferably, the hot air gun nozzle directly heats the SIP pin.

[0021] Technical effects and advantages of the present invention:

[0022] 1. Break through the limitations of the original technology, solve the problem that the leaded SIP device cannot be directly replaced in the cavity, the device is easily damaged during repair, and the efficiency is low, so as to avoid economic losses caused by the scrapping of products or devices due to device replacement, re-production of new products or delayed production and delivery.

[0023] 2. Successfully achieve direct replacement of leaded SIP devices in the cavity without damaging the quality of the product and SIP devices, ensuring on-time delivery of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a flow chart of a method for directly replacing a leaded SIP device in a cavity provided by an embodiment of the present application;

[0025] Figure 2 It is a diagram showing a replacement tool for a method of directly replacing a leaded SIP device in a cavity provided by an embodiment of the present application;

[0026] In the figure:

[0027] 1. Oven; 2. Hot plate; 3. Hot air gun; 4. Hot air gun nozzle. DETAILED DESCRIPTION

[0028] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

[0029] Example 1

[0030] See also Figure 1-2 In this embodiment, a method for directly replacing a leaded SIP device in a cavity is provided, comprising:

[0031] Replacement tools: using an oven 1, a hot stage 2, and a hot air gun 3, wherein the hot air gun 3 includes a hot air gun nozzle 4.

[0032] The replacement steps are as follows:

[0033] S1. Turn on oven 1 and adjust the temperature to 160°C ± 20°C. The product is placed in oven 1 in overall heating mode. This temperature range allows for adequate preheating. If the temperature is lower than this range, the preheating effect is poor. If the temperature is higher than this range, the internal components of the product may be damaged.

[0034] S2. Turn on the hot plate 2 and adjust the temperature to 250℃±30℃. Place the product on the hot plate 2 to heat the repair position. Because the heat transfer efficiency of the product cavity structure is low, this temperature can ensure that the heat is fully transferred to the SIP device. If the temperature is too low, the preheating is insufficient. If the temperature is too high, the solder joints in the cavity will melt again and damage the product.

[0035] S3, turn on the hot air gun 3 and adjust the temperature to 350℃±10℃, set the wind speed to level 5-8, and heat the SIP pin directly with the hot air gun nozzle 4. This temperature range can melt the solder joint at the right time to facilitate the removal of the device. Improper temperature may damage the device or surrounding devices.

[0036] S4, put the product into the oven for 1 to 5 minutes, then take it out and put it on the hot stage 2 to heat the reworked SIP device area for 3 to 8 minutes, and use the hot air gun 3 to heat it while the hot stage 2 is heating;

[0037] S5. When the solder on the leaded SIP device begins to melt, place the new device on the hot plate 2 for heating. After the solder is completely melted, remove the old device, add solder in the middle of the device ground pad and place the heated new device.

[0038] S6, completing the welding of the ground pad at the bottom of the device;

[0039] S7. After welding is completed, remove the product from the hot stage 2 to dissipate heat naturally, thereby directly replacing the leaded SIP device in the cavity.

[0040] The electrical components appearing in this article are all connected to an external main controller and 220V AC power, and the main controller can be a conventional known device that controls a computer, etc. The specific implementation method of the present disclosure omits the detailed description of known functions and known components. To ensure the compatibility of the equipment, the operating methods used are consistent with the parameters of marketed equipment.

[0041] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A method for directly replacing a leaded SIP device in a cavity, characterized in that: The following steps are involved: S1. Prepare equipment: the equipment includes an oven (1), a hot plate (2) and a hot air gun (3), wherein the hot air gun (3) includes a hot air gun nozzle (4); S2, turning on the oven (1), and adjusting the temperature of the oven (1); S3, turning on the heating platform (2) and adjusting the temperature of the heating platform (2); S4, turning on the hot air gun (3), and adjusting the temperature and wind speed of the hot air gun (3); S5, placing the product in the oven (1) for 5 minutes, taking it out, and then placing it on the hot table (2) to heat the reworked SIP device area for 3 to 8 minutes, and using the hot air gun (3) to heat while the hot table (2) is heating; S6. When the solder on the leaded SIP device begins to melt, place the new device on the hot plate (2) and heat it. After the solder is completely melted, remove the old device, add solder in the middle of the device ground pad and place the heated new device. S7, completing the welding of the ground pad at the bottom of the device; S8. After the welding is completed, the product is removed from the hot plate (2) to allow natural heat dissipation, and the leaded SIP device is directly replaced in the cavity.

2. A method for directly replacing a leaded SIP device in a cavity according to claim 1, characterized in that: The temperature of the oven (1) is adjusted to 160°C ± 20°C.

3. The method for directly replacing a leaded SIP device in a cavity according to claim 1, characterized in that: The temperature of the heating stage (2) is adjusted to 250°C ± 30°C.

4. The method for directly replacing a leaded SIP device in a cavity according to claim 1, characterized in that: The temperature of the hot air gun (3) is adjusted to 350°C ± 10°C, and the wind speed is set to level 5 to 8.

5. The method for directly replacing a leaded SIP device in a cavity according to claim 1, characterized in that: The product is placed inside an oven (1) in a bulk heating mode.

6. The method for directly replacing a leaded SIP device in a cavity according to claim 1, characterized in that: The product is placed on a hot table (2) to perform regional heating on the repair position.

7. The method for directly replacing a leaded SIP device in a cavity according to claim 1, characterized in that: The hot air gun nozzle (4) directly heats the SIP pin.

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