Circuit board golden finger processing method

Abstract

A circuit board golden finger processing method relates to the technical field of circuit board production, and comprises the following steps: preprocessing a circuit board to obtain a circuit board with a golden finger; performing copper deposition and electroplating treatment on the circuit board in sequence; sequentially carrying out wet film printing, primary exposure, covering of a layer of dry film on the outer layer of the wet film and secondary exposure on the circuit board, exposing the golden finger and the plated copper on one side of the golden finger, and covering patterns at other positions on the circuit board; primary copper reduction: the circuit board is soaked in a copper reduction solution, plated copper beside a golden finger on the circuit board is removed, and a substrate of the circuit board is exposed; gold plating: the circuit board is soaked in electrolyte, and the surface of the golden finger is covered with a layer of metal film; removing the film: tearing off the wet film and the dry film covering the surface of the circuit board; and secondary copper reduction: the circuit board is soaked in a copper reduction solution, plated copper on the circuit board is removed, and a base material of the circuit board is exposed. The method can reduce the possibility of lead residue after the circuit board golden finger is processed.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board production, and in particular to a circuit board gold finger processing method. Background Art

[0002] In the current production and processing of circuit boards, the surface treatment of electric gold fingers is often involved. Gold fingers usually refer to a row of golden conductive contacts on the edge of the circuit board. Electric gold is to use electric current to make gold salt form a nickel-gold coating on the copper foil surface of the circuit board to enhance its conductivity and corrosion resistance. It is widely used in electronic products because of its high hardness, wear resistance and non-oxidation characteristics. The conventional electric gold finger process is to energize the lead wire to cover the surface of the gold finger with a layer of nickel-gold coating. After the electric gold finger, the lead wire is removed by milling or etching. However, after the processing, the lead wire residue often appears at the connection between the gold finger and the lead wire, affecting the appearance quality of the product. Summary of the invention

[0003] In view of the deficiencies of the above-mentioned related prior art, the present application provides a circuit board gold finger processing method, which reduces the possibility of lead residue after circuit board gold finger processing and has strong practicality.

[0004] In order to achieve the above object, the present invention adopts the following technologies: A method for processing gold fingers of a circuit board comprises the following steps: S01, pre-processing the circuit board to obtain a circuit board with gold fingers; S02, performing copper deposition and electroplating treatments on the circuit board in sequence; S03, printing a wet film on the circuit board, exposing once, covering the outer layer of the wet film with a layer of dry film, exposing twice, and exposing the gold finger and the copper plating on one side, while the patterns at other positions on the circuit board are covered; S04, primary copper reduction: immerse the circuit board in a copper reduction solution, the copper plating next to the gold finger on the circuit board is removed, and the circuit board substrate is exposed; S05, electroplating: immerse the circuit board in electrolyte to cover the surface of the gold finger with a layer of metal film; S06, film removal: tear off the wet film and dry film covering the surface of the circuit board; S07. Secondary copper reduction: The circuit board is immersed in a copper reduction solution, and the copper plating on the circuit board is removed, exposing the circuit board substrate.

[0005] Furthermore, the pretreatment of the circuit board in S01 includes the following steps: cutting the substrate to obtain the circuit board, drilling holes on the circuit board, copper deposition, electroplating, transferring the circuit board pattern onto the circuit board, and etching.

[0006] Furthermore, the thickness of the S02 electroplated copper layer is 2-3 μm.

[0007] Furthermore, in S02, S04, S05, and S06, a circuit board immersion device is used to process the circuit board, and the circuit board immersion device includes: a immersion tank, a carrying mechanism, and a transfer mechanism; The carrying mechanism includes a carrying frame which is arranged in the immersion tank and is movable along the length direction and the vertical direction thereof, the carrying frame is provided with cross bars which are respectively located at both ends of the length direction thereof and move toward each other and are used to carry the end sides of the circuit board, a plurality of carrying plates which are parallel to the length direction thereof are arranged between the cross bars, a plurality of clamping blocks which are arranged in groups of two and move toward each other along the length direction thereof and are used to clamp one side of the circuit board; a movable frame which is movable along the vertical direction is arranged above the carrying frame, a plurality of first clamping plates which are arranged in groups of two and move toward each other are arranged below the movable frame, the length direction of the first clamping plates being perpendicular to the length direction of the carrying plates and being used to clamp the other side of the circuit board; the transfer mechanism includes four support plates which are respectively arranged on both sides of the length direction of the immersion tank and are movable along the width direction thereof, a plurality of second clamping plates which are arranged in groups of two and move toward each other along the length direction of the immersion tank are arranged on the support plates, an end of the second clamping plate which faces the center of the immersion tank extends beyond the support plate, and when in use, the circuit board is placed between the two second clamping plates which are arranged in groups of two.

[0008] Further, copper deposition and electroplating are performed in S02, gold electroplating is performed in S05, and copper reduction operations are performed in S04 and S07, all of which include the following steps: S1, placing a plurality of circuit boards on a support plate, and placing the circuit boards between two second clamping plates in a group of two; S2, moving the support plate toward the carrier frame, so that the end surface of the support plate contacts the side surface of the cross bar, and the second clamping plate is located above the cross bar; S3, pushing the circuit board on the support plate onto the carrier, with the lower side of the circuit board located between the clamping blocks arranged in groups of two, and the upper side of the circuit board located between the first clamping plates arranged in groups of two; S4, resetting the support plate; S5, moving the support frame downward and moving it along the length direction of the soaking tank; S6, after the carrier moves to one end of the immersion tank, the carrier is lifted up, and the two support plates at the same end are moved toward the carrier, the end faces of the support plates are in contact with the side faces of the crossbar, and the second clamping plate is located above the crossbar; S7, pushing the circuit board from the carrier to one of the support plates, and pushing the circuit board on the other support plate to the carrier.

[0009] The beneficial effects of the present invention are as follows: the entire etched circuit board is subjected to copper plating, a thin layer of copper is plated on the substrate to achieve the purpose of electrification, and the thin copper next to the gold finger is subsequently removed by copper reduction, so that after the gold finger is completed, the gold finger is guaranteed to be intact and there is no lead residue problem; when copper plating, copper reduction, and gold plating are performed on the circuit board, the circuit board is transferred to the carrying mechanism in batches through the transfer mechanism, and then the batch operation of the circuit board is realized through the carrying mechanism, which greatly improves the efficiency compared with manually placing the circuit boards in the immersion tank one by one; and the cooperation of the clamping plate, the clamping block and the baffle can also adapt to circuit boards of different sizes, and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.

[0011] Figure 1 This is a flow chart of the gold finger processing method according to an embodiment of the present application.

[0012] Figure 2 It is a three-dimensional schematic diagram of a circuit board immersion device according to an embodiment of the present application.

[0013] Figure 3 It is a three-dimensional schematic diagram of the carrying mechanism of an embodiment of the present application.

[0014] Figure 4 This is a schematic diagram of the cross-sectional structure of the carrier frame according to an embodiment of the present application.

[0015] Figure 5 This is a schematic diagram of the baffle installation of an embodiment of the present application.

[0016] Figure 6 This is a schematic diagram of the installation of the first clamping plate of an embodiment of the present application.

[0017] Figure 7 This is a schematic diagram of the installation of the second clamping plate of an embodiment of the present application.

[0018] Figure 8 This is a three-dimensional schematic diagram from the bottom view of the support plate of an embodiment of the present application.

[0019] Description of reference numerals: 100 - immersion tank, 200 - bearing mechanism, 300 - transfer mechanism, 201 - bearing frame, 202 - cross bar, 203 - bearing plate, 204 - clamping block, 205 - moving frame, 206 - first clamping plate, 207 - through groove, 208 - bottom plate, 209 - first guide rod, 210 - first protrusion, 211 - side plate, 212 - first spring, 213 - baffle, 214 - connecting plate, 215 - groove, 216 - top Rod, 217—second spring, 218—moving block, 219—first screw, 220—first horizontal plate, 221—slider, 222—second guide rod, 223—second protrusion, 224—third spring, 301—support plate, 302—second clamping plate, 303—long hole, 304—mounting plate, 305—moving plate, 306—second screw, 307—third clamping plate, 308—second horizontal plate, 309—support plate, 310—third screw. DETAILED DESCRIPTION

[0020] To make the objectives, technical solutions and advantages of the embodiments of the present invention more clear, the implementation modes of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.

[0021] like Figure 1 As shown, one aspect of the embodiments of the present application provides a circuit board gold finger processing method, comprising the following steps: S01, pre-processing the circuit board to obtain a circuit board with gold fingers; S02, performing copper deposition and electroplating treatments on the circuit board in sequence, so that a layer of copper plating is covered on the surface of the circuit board; S03, printing a wet film on the circuit board, exposing once, covering the outer layer of the wet film with a layer of dry film, exposing twice, and exposing the gold finger and the copper plating on one side, while the patterns at other positions on the circuit board are covered; S04, primary copper reduction: immerse the circuit board in a copper reduction solution, the copper plating next to the gold finger on the circuit board is removed, and the circuit board substrate is exposed; S05, electroplating: immerse the circuit board in electrolyte to cover the surface of the gold finger with a layer of metal film; S06, film stripping: tear off the wet film and dry film covering the surface of the circuit board to expose all the copper plating on the circuit board; S07. Secondary copper reduction: The circuit board is immersed in a copper reduction solution, and the copper plating on the circuit board is removed, exposing the circuit board substrate.

[0022] Specifically, the pretreatment of the circuit board in S01 includes the following steps: cutting the substrate to obtain the circuit board, drilling holes on the circuit board, copper deposition, electroplating, transferring the circuit board pattern onto the circuit board, and etching.

[0023] Specifically, the thickness of the copper layer electroplated by S02 is 2-3 μm.

[0024] Another aspect of the embodiments of the present application provides a circuit board soaking device, wherein S02, S04, S05, and S07 all use the circuit board soaking device to process the circuit board, such as Figure 2-Figure 8 As shown, the circuit board immersion device includes: a immersion tank 100, a carrying mechanism 200, and a transfer mechanism 300; The carrying mechanism 200 includes a carrying frame 201 disposed in the immersion tank 100 and movable along the length direction and the vertical direction thereof. The carrying frame 201 is provided with cross bars 202 respectively located at both ends of the length direction thereof and movable toward each other, for carrying the end side of the circuit board. A plurality of carrying plates 203 parallel to the length direction thereof are disposed between the cross bars 202. A plurality of clamping blocks 204 arranged in pairs along the length direction thereof and movable toward each other are disposed on the carrying plates 203, for clamping one side of the circuit board. A mobile frame 205 movable along the vertical direction is disposed above the carrying frame 201, and a plurality of clamping blocks arranged in pairs below the mobile frame 205 are disposed. A group of first clamping plates 206 that move toward each other, the length direction of the first clamping plate 206 is perpendicular to the length direction of the supporting plate 203, and is used to clamp the other side of the circuit board; the transfer mechanism 300 includes four support plates 301 that are respectively arranged on both sides of the length direction of the immersion pool 100 and are movable along its width direction, and a plurality of second clamping plates 302 that are arranged in groups of two and move toward each other are arranged on the support plate 301 along the length direction of the immersion pool 100, and one end of the second clamping plate 302 toward the center of the immersion pool 100 exceeds the support plate 301, and when in use, the circuit board is placed between the two second clamping plates 302 that are arranged in groups of two.

[0025] Specifically, copper deposition and electroplating are performed in S02, gold electroplating is performed in S05, and copper reduction operations are performed in S04 and S07, all of which include the following steps: S1, placing a plurality of circuit boards on the support plate 301, and placing the circuit boards between two second clamping plates 302 in a group of two; S2, move the support plate 301 toward the carrier 201, the end surface of the support plate 301 contacts the side surface of the cross bar 202, and the second clamping plate 302 is located above the cross bar 202; S3, push the circuit board on the support plate 301 onto the carrier 201, with the lower side of the circuit board located between the clamping blocks 204 arranged in groups of two, and the upper side of the circuit board located between the first clamping plates 206 arranged in groups of two; S4, resetting the support plate 301; S5, moving the carrier 201 downward and moving it along the length direction of the soaking tank 100; S6, after the carrier 201 moves to one end of the immersion tank 100, the carrier 201 is lifted up, and the two support plates 301 at the same end are moved toward the carrier 201, the end surfaces of the support plates 301 are in contact with the side surfaces of the crossbar 202, and the second clamping plate 302 is located above the crossbar 202; S7, pushing the circuit board from the carrier 201 onto one of the support plates 301 , and pushing the circuit board on the other support plate 301 onto the carrier 201 .

[0026] Specifically, Figure 2-Figure 4 As shown, the carrier plate 203 is provided with a plurality of vertically penetrating through grooves 207 along its length direction, and two clamping blocks 204 in a group of two are located in the same through groove 207. A bottom plate 208 is provided at the lower end of the clamping block 204, and the bottom plate 208 is sleeved on a first guide rod 209. The first guide rod 209 provides a guiding effect on the movement of the clamping block 204. Both ends of the first guide rod 209 are installed on a first protrusion 210, and the first protrusion 210 is installed at the bottom of the carrier 201. When the circuit boards are transferred to the carrier 201, the circuit boards are respectively located in the area of ​​a through groove 207. At this time, the circuit boards can be clamped by the clamping blocks 204 in a group of two to prevent them from slipping during the movement in the immersion tank 100.

[0027] Specifically, Figure 2-Figure 4 As shown, the bottom plates 208 with the same moving direction are all connected to the side plates 211, so that the clamping blocks 204 with the same moving direction can move synchronously to achieve simultaneous clamping of the circuit boards. Two first springs 212 are sleeved on the first guide rod 209, and the first springs 212 are respectively located at both ends of the first guide rod 209, and the first springs 212 are respectively located between the first protrusion 210 and the bottom plate 208 closest to the first protrusion 210. The two ends of the first spring 212 are respectively abutted against the first protrusion 210 and the bottom plate 208, and are always in a compressed state. Under the action of the first spring 212, the bottom plate 208 closest to the first protrusion 210 always has a tendency to move toward the center of the supporting plate 203, and driven by the side plates 211, all the clamping blocks 204 will move synchronously, thereby achieving synchronous clamping of multiple circuit boards.

[0028] More specifically, Figure 2 , Figure 4 As shown, both ends of the clamping block 204 are arranged to be arc-shaped, so that in the process of pushing the circuit board from the support plate 301 to the carrier 201, one end of the circuit board will contact the arc-shaped part of the clamping block 204, thereby forcing the clamping blocks 204 located in the same through groove 207 to move away from each other until the side of the clamping block 204 contacts the side of the circuit board, and at this time the first spring 212 is also further compressed, and under the action of the first spring 212, the circuit board is clamped.

[0029] Specifically, Figure 2 , Figure 3 , Figure 5 As shown, in order to further limit the position of the circuit board and avoid the situation that it moves along the length direction of the carrier 201, and prevent the circuit board from rubbing against the inner wall of the immersion tank 100, a baffle 213 is passed through the cross bar 202, and the side of the baffle 213 away from the carrier plate 203 is arc-shaped, and a connecting plate 214 is provided at the bottom of the baffle 213, a groove 215 is provided on the side of the cross bar 202, the connecting plate 214 is located in the groove 215, and a push rod 216 is provided at the bottom, the lower end of the push rod 216 passes through the cross bar 202, and is sleeved with a second spring 217, the two ends of the second spring 217 are respectively abutted against the bottom of the groove 215 and the connecting plate 214, and are always in a compressed state. Under the action of the second spring 217, the The baffle 213 always has a tendency to move upward. Before the circuit board is pushed from the support plate 301 to the carrier 201, the end of the second clamping plate 302 will contact the curved surface of the baffle 213. As the second clamping plate 302 continues to move, the baffles 213 will be forced to move toward each other until the upper end of the baffle 213 is no higher than the top surface of the cross bar 202. At this time, the second spring 217 is also further compressed to facilitate moving the circuit board between the two baffles 213 until the circuit board is pushed to a position where one end of the circuit board abuts against the vertical surface of the other baffle 213. After that, the second clamping plate 302 is moved back, and the baffle 213 will pop out under the action of the second spring 217, thereby achieving the limitation of both ends of the circuit board.

[0030] Specifically, Figure 4 , Figure 5 As shown, in order to facilitate the movement of the crossbar 202 to adapt to circuit boards of different lengths, moving blocks 218 are provided at both ends of the groove 215. The bottom of the carrier 201 is rotatably mounted with two first screws 219 with axes parallel to the length direction thereof. The first screw 219 is provided with two sections of threads rotating in opposite directions. The moving blocks 218 are respectively sleeved on the threads of the first screw 219. By rotating the first screw 219, the two crossbars 202 can be driven to move synchronously toward each other or in opposite directions, thereby adjusting the distance between the two baffles 213. The method further includes the following steps before S2: rotating the first screw rod 219 to make the two cross bars 202 move closer to or farther from each other synchronously, thereby adjusting the distance between the two baffles 213 .

[0031] Specifically, Figure 3 , Figure 6As shown, the tops of the first clamping plates 206 with the same moving direction are all connected to the first transverse plate 220, the top surface of the first transverse plate 220 is provided with a slider 221, the slider 221 is sleeved on the second guide rod 222, both ends of the second guide rod 222 are installed on the second protrusion 223, the second protrusion 223 is installed on the moving frame 205, and the second guide rod 222 is sleeved with a third spring 224, the two ends of the third spring 224 are respectively connected to the second protrusion 223 and the slider 221, and the elastic force direction is the same as the moving direction of the first clamping plates 206, so that under the elastic force of the third spring 224, the first clamping plates 206 in a group of two The two first clamps 206 can move toward each other, and when one of the first clamps 206 moves, the other first clamps 206 will also move synchronously to achieve synchronous clamping of the circuit board. In addition, in order to allow the circuit board to smoothly enter between the two first clamps 206, the two ends of the first clamps 206 are set to an arc shape. When the end of the circuit board abuts against the arc surface of the first clamp 206, the two first clamps 206 in a group of two will be forced to move away from each other, so that the elastic force of the third spring 224 becomes larger until the circuit board is completely located between the two first clamps 206. At this time, under the action of the third spring 224, the clamping of the upper side of the circuit board is completed.

[0032] Specifically, Figure 7-Figure 8 As shown, the support plate 301 is provided with two elongated holes 303 along its length direction, and the length direction of the elongated holes 303 is parallel to the width direction of the support plate 301, and a mounting plate 304 is slidably fitted in the elongated holes 303, and second clamping plates 302 with the same moving direction are both mounted on the same mounting plate 304, and the bottom surfaces of the two mounting plates 304 are provided with movable plates 305 perpendicular to their length direction, and a second screw rod 306 is rotatably mounted on the bottom of the support plate 301, and the second screw rod 306 is provided with two sections of threads with opposite rotation directions, and the two movable plates 305 are respectively sleeved on the two sections of threads of the second screw rod 306, so that when the second screw rod 306 is rotated, the two mounting plates 304 can be moved synchronously, thereby driving the second clamping plates 302 to move synchronously, so that the two second clamping plates 302 in a group of two can be close to each other or away from each other, so as to adapt to circuit boards of different thicknesses.

[0033] Specifically, Figure 7-Figure 8In order to further limit the upper side of the circuit board and prevent the circuit board from tilting when placed on the support plate 301, a plurality of third clamping plates 307 are provided above the support plate 301, and the projection of the third clamping plate 307 in the vertical direction is completely located inside the support plate 301 to prevent it from interfering with the movable frame 205. The third clamping plates 307 are arranged in groups of two, and the two third clamping plates 307 in a group of two are moved towards each other. The third clamping plates 307 with the same moving direction are all connected to the second cross plate 308, thereby ensuring that the third clamping plates 307 with the same moving direction can move synchronously, and two support plates 309 are further provided on the outer side of the third clamping plate 307 farthest from the center of the support plate 301, and the support plate 309 is sleeved on the third screw 310 and locked with a nut, and the lower end of the third screw 310 is installed on the second clamping plate 302 farthest from the center of the support plate 301, so that the third clamping plate 307 can move synchronously with the second clamping plate 302 to achieve limiting the upper and lower sides of the circuit board.

[0034] Then S1 also includes the following steps: S11, rotating the second screw rod 306 to make two second clamping plates 302 in a group approach or move away from each other, and the third clamping plate 307 moves synchronously with the second clamping plates 302; S12, placing the circuit boards in sequence between two second clamping plates 302 in a group of two; S13, rotating the nut on the third screw rod 310 to move the third clamping plate 307 downward until the bottom surface of the second horizontal plate 308 abuts against the upper side of the circuit board, and the upper end of the circuit board is located between two third clamping plates 307 in a group of two.

[0035] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A method for processing gold fingers of a circuit board, characterized in that: The following steps are involved: S01, pre-processing the circuit board to obtain a circuit board with gold fingers; S02, performing copper deposition and electroplating treatments on the circuit board in sequence; S03, printing a wet film on the circuit board, exposing once, covering the outer layer of the wet film with a layer of dry film, exposing twice, and exposing the gold finger and the copper plating on one side, while the patterns at other positions on the circuit board are covered; S04, primary copper reduction: immerse the circuit board in a copper reduction solution, the copper plating next to the gold finger on the circuit board is removed, and the circuit board substrate is exposed; S05, electroplating: immerse the circuit board in electrolyte to cover the surface of the gold finger with a layer of metal film; S06, film removal: tear off the wet film and dry film covering the surface of the circuit board; S07. Secondary copper reduction: The circuit board is immersed in a copper reduction solution, and the copper plating on the circuit board is removed, exposing the circuit board substrate.

2. The circuit board gold finger processing method according to claim 1, characterized in that: The pretreatment of the circuit board in S01 includes the following steps: cutting the substrate to obtain the circuit board, drilling holes on the circuit board, copper deposition, electroplating, transferring the circuit board pattern to the circuit board, and etching.

3. The circuit board gold finger processing method according to claim 1, characterized in that: The thickness of the copper layer of S02 electroplating is 2-3μm.

4. The method for processing circuit board gold fingers according to any one of claims 1 to 3, characterized in that: Wherein, in S02, S04, S05, and S07, a circuit board soaking device is used to process the circuit board, and the circuit board soaking device includes: Soaking Pool (100); The bearing mechanism (200) comprises a bearing frame (201) disposed in the immersion pool (100) and movable along the length direction and the vertical direction thereof, the bearing frame (201) being provided with cross bars (202) respectively located at both ends of the length direction thereof and movable towards each other, for supporting the end side of the circuit board, a plurality of bearing plates (203) parallel to the length direction thereof being disposed between the cross bars (202), and a plurality of clamping blocks (204) arranged in groups of two along the length direction thereof and movable towards each other, for clamping one side of the circuit board; A movable frame (205) movable in a vertical direction is provided above the carrier frame (201), and a plurality of first clamping plates (206) arranged in groups of two and movable towards each other are provided below the movable frame (205), wherein the length direction of the first clamping plates (206) is perpendicular to the length direction of the carrier plate (203) and is used to clamp the other side of the circuit board; The transfer mechanism (300) comprises four support plates (301) respectively arranged on both sides of the soaking pool (100) in the length direction and movable along the width direction thereof; a plurality of second clamping plates (302) arranged in groups of two and movable towards each other are arranged on the support plates (301) along the length direction of the soaking pool (100); one end of the second clamping plate (302) facing the center of the soaking pool (100) extends beyond the support plate (301); when in use, the circuit board is placed between two second clamping plates (302) arranged in groups of two.

5. The circuit board gold finger processing method according to claim 4, characterized in that: S02 performs copper deposition and electroplating, S05 performs gold electroplating, and S04 and S07 perform copper reduction operations, all of which include the following steps: S1, placing a plurality of circuit boards on a support plate (301), and placing the circuit boards between two second clamping plates (302) in a group of two; S2, moving the support plate (301) toward the carrier frame (201), so that the end surface of the support plate (301) contacts the side surface of the cross bar (202), and the second clamping plate (302) is located above the cross bar (202); S3, pushing the circuit board on the support plate (301) onto the carrier (201), with the lower side of the circuit board located between the clamping blocks (204) arranged in groups of two, and the upper side of the circuit board located between the first clamping plates (206) arranged in groups of two; S4, resetting the support plate (301); S5, moving the support frame (201) downward and moving it along the length direction of the soaking tank (100); S6, after the support frame (201) moves to one end of the soaking tank (100), the support frame (201) is lifted upward, and two support plates (301) at the same end as the support frame (201) are moved toward the support frame (201), so that the end surfaces of the support plates (301) are in contact with the side surfaces of the cross bar (202), and the second clamping plate (302) is located above the cross bar (202); S7, pushing the circuit board from the carrier (201) onto one of the support plates (301), and pushing the circuit board on the other support plate (301) onto the carrier (201).

6. The circuit board gold finger processing method according to claim 5, characterized in that: S1 also includes the following steps: S11, rotating the second screw rod (306) to move two second clamping plates (302) in a group of two closer to or farther from each other, and the third clamping plate (307) moves synchronously with the second clamping plates (302); S12, placing the circuit boards in sequence between two second clamping plates (302) in a group of two; S13, rotating the nut on the third screw rod (310) to move the third clamping plate (307) downward until the bottom surface of the second transverse plate (308) abuts against the upper side of the circuit board, and the upper end of the circuit board is located between two third clamping plates (307) arranged in groups of two.

7. The method for processing circuit board gold fingers according to claim 5, characterized in that: A baffle (213) is passed through the cross bar (202); the side of the baffle (213) away from the bearing plate (203) is arc-shaped, and a connecting plate (214) is provided at the bottom; a groove (215) is provided on the side of the cross bar (202); the connecting plate (214) is located in the groove (215), and a top rod (216) is provided at the bottom; the lower end of the top rod (216) passes through the cross bar (202) and is sleeved with a second spring (217); two ends of the second spring (217) respectively abut against the bottom of the groove (215) and the connecting plate (214), and are always in a compressed state; During the process of moving the support plate (301) toward the support frame (201) in S2 and S6, one end of the second clamping plate (302) abuts against the arc surface of the baffle plate (213) and forces the baffle plate (213) to move downward, and the second spring (217) is further compressed until the top of the baffle plate (213) is no higher than the top surface of the cross bar (202).

8. The circuit board gold finger processing method according to claim 7, characterized in that: Both ends of the groove (215) are provided with moving blocks (218); the bottom of the support frame (201) is rotatably mounted with two first screw rods (219) whose axes are parallel to the length direction thereof; the first screw rod (219) is provided with two sections of threads with opposite rotation directions; the moving blocks (218) are respectively sleeved on the threads of the first screw rod (219); and between S1 and S2, the step of rotating the first screw rod (219) so that the two cross bars (202) are synchronously moved closer to or farther from each other, thereby adjusting the distance between the two baffles (213).

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