Heat dissipation assembly, electronic equipment and electronic equipment accessory
By designing a heat dissipation component connected by a telescopic connector, the heat dissipation needs of folding electronic devices in different states are solved, the area occupied in the folded state is reduced and the area of heat dissipation in the flipped state is expanded, and the applicability of the heat dissipation component is improved.
Patent Information
- Application Number
- CN202311091177.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-28
- Publication Date
- 2025-02-28
AI Technical Summary
The prior art is difficult to meet the heat dissipation needs of folding electronic devices in different states, especially in folding and flipped states, where conventional heat dissipation back clips cannot effectively cover the heating surface.
A heat dissipation assembly is designed, through the movable connector connection between the first heat dissipation member and the second heat dissipation member, the connectors can extend and contract, so as to achieve the mutual proximity and distance between the heat dissipation members, thereby adapting to the heat dissipation needs in the folded and flipped state.
Through the design of the heat dissipation component, the area occupied in the folded state can be reduced, and the heat dissipation area can be expanded in the flipped state, meeting the heat dissipation needs in different states, and improving the applicability of the heat dissipation components.
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Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of heat dissipation of electronic equipment, and in particular to a heat dissipation component, an electronic equipment, and an electronic equipment accessory. Background Art
[0002] With the popularization of 5G electronic devices, the increase in charging power of electronic devices, the improvement in screen resolution, the increase in game load, and the development of thinner and lighter electronic devices, the heat dissipation capacity of electronic devices themselves is increasingly unable to meet the heat dissipation needs of electronic devices. Therefore, in high-load scenarios such as games, some external heat dissipation measures of electronic devices, such as heat dissipation back clips, are used to meet the heat dissipation needs. Summary of the invention
[0003] In order to overcome the problems existing in the related art, the present disclosure provides a heat dissipation component, an electronic device and an electronic device accessory.
[0004] According to a first aspect of an embodiment of the present disclosure, a heat dissipation assembly is provided, comprising: a first heat dissipation member and a second heat dissipation member; a connecting member, wherein the connecting member comprises a first connecting portion and a second connecting portion that can be movably connected, the first connecting portion is arranged on the first heat dissipation member, the second connecting portion is arranged on the second heat dissipation member, and the first heat dissipation member and the second heat dissipation member are connected via the first connecting portion and the second connecting portion; wherein the connecting member comprises an extended state and a contracted state; when the connecting member is in the contracted state, the first heat dissipation member and the second heat dissipation member are close to each other; when the connecting member is in the extended state, the first heat dissipation member and the second heat dissipation member are away from each other.
[0005] In some embodiments, the first connection portion and the second connection portion move toward each other to change the connection member into the contracted state; the first connection portion and the second connection portion move away from each other to change the connection member into the extended state, wherein the length of the connection member in the extended state is greater than the length of the connection member in the contracted state.
[0006] In some embodiments, the heat dissipation assembly includes a combined state and an expanded state; the first heat dissipation member and the second heat dissipation member are close to each other so that the heat dissipation assembly changes to the combined state, and the connecting member changes to the contracted state; the first heat dissipation member and the second heat dissipation member move away from each other so that the heat dissipation assembly changes to the expanded state, and the connecting member changes to the extended state.
[0007] In some embodiments, when the connecting member is in the contracted state, the heat dissipation assembly is in the merged state, and the first heat dissipation member and the second heat dissipation member are close to each other in the length direction of the connecting member.
[0008] In some embodiments, the unfolded state includes a flat state; when the heat dissipation assembly is in the flat state, the first heat dissipation element and the second heat dissipation element are away from each other in the length direction of the connecting element.
[0009] In some embodiments, the connector includes a bending state, and at least a portion of the connector is a bending portion, wherein when the connector is in the bending state, the bending portion is bent, the first heat sink and the second heat sink overlap in the thickness direction of the first heat sink, and the heat dissipation assembly is in the merged state or the unfolded state.
[0010] In some embodiments, the second end of the first connecting part is slidably connected to the second end of the second connecting part; the second end of the first connecting part is provided with a first snapping part, and the second end of the second connecting part is provided with a second snapping part, wherein, when the connecting member is in the contracted state, the first snapping part and the second snapping part abut against each other to prevent the first connecting part and the second connecting part from separating.
[0011] In some embodiments, the first connecting part has a first cavity, the second end of the second connecting part is inserted into the first cavity of the first connecting part, and the second end of the second connecting part is slidably disposed in the first cavity, or the second connecting part has a second cavity, the second end of the first connecting part is inserted into the second cavity of the second connecting part, and the second end of the first connecting part is slidably disposed in the second cavity.
[0012] In some embodiments, the first heat dissipation member is provided with a track, the second connection portion is provided with a sliding portion, and the second connection portion is slidably connected to the track through the sliding portion, and / or the second heat dissipation member is provided with a track, the first connection portion is provided with a sliding portion, and the first connection portion is slidably connected to the track through the sliding portion.
[0013] In some embodiments, the heat dissipation member includes: a receiving portion, and when the connecting member is in the contracted state, the receiving portion receives at least a portion of the connecting member.
[0014] In some embodiments, the heat sink includes a heat sink and a base, and the accommodation portion passes through at least a portion of the heat sink; and / or the accommodation portion passes through at least a portion of the base.
[0015] In some embodiments, the heat sink includes a heat sink base and heat sink fins disposed on the heat sink base in a thickness direction of the heat sink, and the accommodation portion passes through the heat sink base and the heat sink fins.
[0016] In some embodiments, there are multiple connecting members, one end of the multiple connecting members is disposed on the first heat dissipation member, and the other end of the multiple connecting members is disposed on the second heat dissipation member.
[0017] In some embodiments, the heat dissipation assembly includes a third heat dissipation element, a portion of the plurality of connecting elements connects the first heat dissipation element and the second heat dissipation element, and another portion of the plurality of connecting elements connects the second heat dissipation element and the third heat dissipation element.
[0018] In some embodiments, the bending portion is a flexible component.
[0019] According to a second aspect of an embodiment of the present disclosure, an electronic device is provided, comprising: a housing; and a heat dissipation assembly as described in any one of the first aspects, wherein the heat dissipation assembly is disposed in the housing.
[0020] According to a third aspect of an embodiment of the present disclosure, there is provided an electronic device accessory, the electronic device accessory comprising: a housing; and the heat dissipation assembly as described in any one of the first aspects.
[0021] The technical solution provided by the embodiments of the present disclosure may include the following beneficial effects: the present disclosure connects the first heat sink and the second heat sink through a connecting member, so that the heat sink assembly can switch the distance between them to be far away from or close to each other to meet the heat dissipation needs of the foldable electronic device in different states, thereby improving the applicability of the heat sink assembly.
[0022] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.
[0024] Figure 1 The diagram is a schematic structural diagram of a heat dissipation assembly installed in a folded electronic device and in a merged state according to an exemplary embodiment.
[0025] Figure 2 The diagram is a schematic structural diagram of a heat dissipation assembly installed on an electronic device in an unfolded state and in an expanded state according to an exemplary embodiment.
[0026] Figure 3 It is a schematic structural diagram of a connector in a contracted state according to an exemplary embodiment.
[0027] Figure 4 It is a schematic structural diagram of a connector in a contracted state according to an exemplary embodiment.
[0028] Figure 5 A heat dissipation component with a connecting piece in a bent state is shown according to an exemplary embodiment.
[0029] Figure 6 Another heat dissipation component with a connecting member in a bent state is shown according to an exemplary embodiment.
[0030] Figure 7 The figure is a schematic structural diagram of a first heat sink and a connecting member according to an exemplary embodiment.
[0031] Figure 8 The figure is a schematic structural diagram of a first heat sink and a connecting member according to an exemplary embodiment.
[0032] Fig. 9 The figure is a schematic structural diagram of a first heat sink and a connecting member according to an exemplary embodiment.
[0033] Fig.10 It is a schematic structural diagram of another first heat sink and a connecting member according to an exemplary embodiment.
[0034] Fig.11 is a schematic structural diagram of another connecting member in a contracted state according to an exemplary embodiment. DETAILED DESCRIPTION
[0035] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.
[0036] In the relevant technology, there is currently a lack of design and application of heat dissipation back clips for foldable electronic devices. After the foldable electronic device is unfolded, the area that requires heat dissipation doubles. Conventional heat dissipation back clips cannot cover the heating surface of the folding machine, making it difficult to meet the heat dissipation needs of the folding machine in the unfolded form.
[0037] In order to solve the above technical problems, according to an embodiment of the present disclosure, a heat dissipation component is provided, which includes: a first heat dissipation member and a second heat dissipation member; a connecting member, wherein the connecting member includes a first connecting portion and a second connecting portion that can be movably connected, the first connecting portion is arranged on the first heat dissipation member, the second connecting portion is arranged on the second heat dissipation member, and the first heat dissipation member and the second heat dissipation member are connected via the first connecting portion and the second connecting portion; wherein the connecting member includes an extended state and a contracted state; when the connecting member is in the contracted state, the first heat dissipation member and the second heat dissipation member are close to each other; when the connecting member is in the extended state, the first heat dissipation member and the second heat dissipation member are far away from each other.
[0038] The present invention connects the first heat sink and the second heat sink through a connecting member, so that the heat sink assembly can meet the heat dissipation requirements of the foldable electronic device in different states by switching the distance between them to be far away from or close to each other, thereby improving the applicability of the heat sink assembly.
[0039] It can be understood that the heat dissipation assembly involved in the present disclosure can be applicable to any electronic device listed below.
[0040] It is understandable that the electronic device may be a laptop computer, a desktop computer, a mobile phone, a digital broadcast terminal, a message transceiver device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, a translation machine, and a wearable device such as a watch or a bracelet, and may be any electronic device that requires heat dissipation. In the following description, a mobile phone is used as an example, but the present disclosure is not limited thereto.
[0041] It should be understood that the embodiments of the present disclosure do not limit the specific technology and specific device form adopted by the electronic device.
[0042] Figure 1 The diagram is a schematic structural diagram of a heat dissipation assembly installed in a folded electronic device and in a merged state according to an exemplary embodiment. Figure 2 The diagram is a schematic structural diagram of a heat dissipation assembly installed on an electronic device in an unfolded state and in an expanded state according to an exemplary embodiment.
[0043] In some embodiments, Figure 1 and Figure 2 As shown, the heat dissipation assembly includes: a heat dissipation member 1 and a connecting member 2. The heat dissipation member 1 may include a first heat dissipation member 11 and a second heat dissipation member 12. The connecting member 2 may include a first connecting portion 21 and a second connecting portion 22. The first connecting portion 21 may be movably connected to the second connecting portion 22.
[0044] The first connection portion 21 may be disposed on the first heat sink 11, the second connection portion 22 may be disposed on the second heat sink 12, and the first heat sink 11 and the second heat sink 12 may be connected via the first connection portion 21 and the second connection portion 22;
[0045] The connecting member 2 may include an extended state and a contracted state. When the connecting member 2 is in the contracted state, the first heat sink 11 and the second heat sink 12 may be close to each other; when the connecting member 2 is in the extended state, the first heat sink 11 and the second heat sink 12 may be away from each other.
[0046] The heat sink 1 may be any component that has the function of helping electronic equipment to dissipate heat. Exemplarily, the heat sink 1 may be an air-cooled heat sink or a semiconductor heat sink.
[0047] By setting the first heat sink 11 and the second heat sink 12, on the one hand, the first heat sink 11 and the second heat sink 12 can be respectively set on different surfaces of the foldable electronic device to meet the heat dissipation requirements of different rotating parts. On the other hand, by adding the heat sink 1, the heat dissipation requirements of the foldable electronic device with a larger heat dissipation area can be met.
[0048] The connecting member 2 may include an extended state and a contracted state. When the connecting member 2 is in the contracted state, the first heat sink 11 and the second heat sink 12 are close to each other;
[0049] When the connecting member 2 is in the extended state, the first heat sink 11 and the second heat sink 12 are away from each other.
[0050] like Figure 1 As shown, when the connector 2 is in a retracted state, the first heat sink 11 and the second heat sink 12 can be close to each other, thereby meeting the heat dissipation requirements of the electronic device in a folded state and reducing their own occupied area, thereby adapting to the available area of the electronic device in a folded state.
[0051] like Figure 2 As shown, when the connector 2 is in an extended state, the first heat sink 11 and the second heat sink 12 can be separated from each other, so that a plurality of heat sinks 1 can be respectively arranged at different rotating parts of the electronic device, thereby adapting to the heat dissipation area of the foldable electronic device and meeting the heat dissipation requirements of the electronic device in the unfolded state.
[0052] When the electronic device is in a folded state, the area of the electronic device available for the heat dissipation component to adsorb is small. By making the connector 2 in a contracted state, the first heat dissipation component 11 and the second heat dissipation component 12 are close to each other, thereby reducing the occupied area of the heat dissipation component.
[0053] The electronic device can be folded into an unfolded state, by making the connecting member 2 in an extended state, so that the first heat sink 11 and the second heat sink 12 are separated from each other, and by respectively arranging the first heat sink 11 and the second heat sink 12 at different rotating parts of the electronic device, the heat dissipation assembly can meet the heat dissipation needs of the electronic device in the unfolded state.
[0054] In some embodiments, the first connection portion 21 and the second connection portion 22 can move toward each other to make the connector 2 enter a contracted state, and the first connection portion 21 and the second connection portion 22 can move away from each other to make the connector 2 enter an extended state, wherein the length of the connector 2 in the extended state is greater than the length of the connector 2 in the contracted state. Therefore, when the connector 2 is in the extended state, the distance between the first heat sink 11 and the second heat sink 12 is larger, and when the connector 2 is in the contracted state, the distance between the first heat sink 11 and the second heat sink 12 is smaller, so that the heat dissipation assembly can meet the heat dissipation requirements of the electronic device in the unfolded state.
[0055] In some embodiments, the heat dissipation assembly may include a folded state suitable for dissipating heat for the electronic device in a folded state and an unfolded state suitable for dissipating heat for the electronic device in an unfolded state.
[0056] like Figure 1 As shown, when the heat dissipation assembly is in a merged state, the connector 2 can be in a contracted state, and the first heat dissipation member 11 and the second heat dissipation member 12 can be close to each other, thereby meeting the heat dissipation requirements of the electronic device in a folded state and reducing its own occupied area, thereby adapting to the available area of the electronic device in a folded state.
[0057] like Figure 2 As shown, when the heat dissipation assembly is in the unfolded state, the connector 2 can be in the extended state, and the first heat dissipation member 11 and the second heat dissipation member 12 can be separated from each other, so that a plurality of heat dissipation members 1 can be respectively arranged at different rotating parts of the electronic device, thereby adapting to the heat dissipation area of the foldable electronic device and meeting the heat dissipation requirements of the electronic device in the unfolded state.
[0058] When the electronic device is in a folded state, the area of the electronic device available for the heat dissipation component to be adsorbed is small. By bringing the first heat dissipation element 11 and the second heat dissipation element 12 closer to each other, the heat dissipation component is merged to reduce its own occupied area.
[0059] The electronic device can be folded into an unfolded state, and the heat dissipation assembly is changed into an unfolded state by moving the first heat dissipation member 11 and the second heat dissipation member 12 away from each other, and the first heat dissipation member 11 and the second heat dissipation member 12 are respectively arranged at different rotating parts of the electronic device, so that the heat dissipation assembly can meet the heat dissipation needs of the electronic device in the unfolded state.
[0060] Figure 3 It is a schematic structural diagram of a connector in a contracted state according to an exemplary embodiment. Figure 4 It is a schematic structural diagram of a connector in a contracted state according to an exemplary embodiment.
[0061] In some embodiments, Figure 3 and Figure 4 As shown, the connector 2 may include an extended state extending the total length of the connector 2 and a contracted state shortening the total length of the connector 2, wherein the length of the connector 2 in the extended state is greater than the length of the connector 2 in the contracted state.
[0062] like Figure 3 As shown, when the heat dissipation assembly is in the merged state, the connector 2 can be in a retracted state, and the total length of the connector 2 in the retracted state is shorter, so that the connector 2 will not hinder the first heat dissipation member 11 and the second heat dissipation member 12 from approaching each other, thereby meeting the heat dissipation needs of the electronic device in the folded state and reducing its own occupied area, thereby adapting to the available area of the electronic device in the folded state.
[0063] like Figure 4 As shown, when the heat dissipation assembly is in the unfolded state, the connector 2 can be in the extended state. The total length of the connector 2 in the extended state is longer, so that the connector 2 can connect multiple heat dissipation members 1 that are far away from each other, so that the first heat dissipation member 11 and the second heat dissipation member 12 can be respectively arranged on different rotating parts of the electronic device, thereby adapting to the heat dissipation area of the foldable electronic device and meeting the heat dissipation requirements of the electronic device in the unfolded state.
[0064] When the electronic device is in a folded state, the area of the electronic device available for the heat dissipation component to be adsorbed is small. By changing the connecting member 2 to a contracted state and by bringing the first heat dissipation component 11 and the second heat dissipation component 12 closer to each other, the heat dissipation component can be in a merged state to reduce its own occupied area.
[0065] The electronic device can be folded into an unfolded state, and the heat dissipation components can be changed into an unfolded state by moving multiple heat dissipation components away from each other and extending the connector 2 accordingly and changing it into an extended state, and the heat dissipation components can be changed into an unfolded state, and by respectively arranging the first heat dissipation component 11 and the second heat dissipation component 12 at different rotating parts of the electronic device, the heat dissipation components can meet the heat dissipation needs of the electronic device in the unfolded state.
[0066] In some embodiments, Figure 3 and Figure 4As shown, the first heat sink 11 and the second heat sink 12 can be connected via the first connection portion 21 and the second connection portion 22, and the connection member 2 can be changed into a contracted state or an extended state through the mutual movement between the first connection portion 21 and the second connection portion 22.
[0067] like Figure 3 As shown, when the heat dissipation assembly is in the merged state, the first connection portion 21 and the second connection portion 22 can move toward each other, thereby reducing the total length of the connection member 2, so that the connection member 2 is in a contracted state, preventing the first heat dissipation member 11 and the second heat dissipation member 12 from being blocked from approaching each other, thereby meeting the heat dissipation requirements of the electronic device in the folded state, and reducing its own occupied area, thereby adapting to the available area of the electronic device in the folded state.
[0068] like Figure 4 As shown, when the heat dissipation assembly is in the unfolded state, the first connection part 21 and the second connection part 22 can move back and forth, thereby increasing the total length of the connector 2, so that the connector 2 is in an extended state, so that the connector 2 can connect the first connection part 21 and the second connection part 22, so that the first heat dissipation member 11 and the second heat dissipation member 12 can be respectively arranged on different rotating parts of the electronic device, thereby adapting to the heat dissipation area of the foldable electronic device and meeting the heat dissipation requirements of the electronic device in the unfolded state.
[0069] When the electronic device is in a folded state, the area of the electronic device available for the heat dissipation component to be adsorbed is small. By making the first connecting part 21 and the second connecting part 22 move toward each other, the connecting part 2 is changed into a contracted state, and by bringing the first heat dissipation component 11 and the second heat dissipation component 12 closer to each other, the heat dissipation component can be in a merged state to reduce its own occupied area.
[0070] The electronic device can be folded into an unfolded state, by moving the first connecting part 21 and the second connecting part 22 away from each other, so that the connecting member 2 is changed into an extended state, and the first heat sink 11 and the second heat sink 12 are moved away from each other, and the connecting member 2 is extended and changed into an extended state, so that the heat dissipation assembly can be changed into an unfolded state, and by respectively arranging the first heat sink 11 and the second heat sink 12 at different rotating parts of the electronic device, the heat dissipation assembly can meet the heat dissipation needs of the electronic device in the unfolded state.
[0071] In some embodiments, Figure 1 As shown, when the heat dissipation assembly is in a combined state, the first heat dissipation member 11 and the second heat dissipation member 12 are close to each other in the length direction of the connector 2, that is, when the heat dissipation assembly is in a combined state, the first heat dissipation member 11 and the second heat dissipation member 12 can be close to each other in the plane where the length direction of the connector 2 is located.
[0072] Exemplarily, the heat dissipation surface of the electronic device in the folded state can be a plane. Therefore, by constraining the movement direction of the heat sink 1, when the heat dissipation assembly is in the combined state, the first heat sink 11 and the second heat sink 12 can be close to each other on the plane where the length direction of the connecting member 2 is located, so that the combined state of the heat dissipation assembly can directly adapt to the heat dissipation surface of the foldable electronic device in the folded state without the need for additional adjustment operations, thereby simplifying the user's usage process.
[0073] However, the present disclosure is not limited thereto, and when the heat dissipation assembly is in a combined state, the first heat dissipation member 11 and the second heat dissipation member 12 may also be stacked in the thickness direction of the heat dissipation member 1 , thereby completing the storage of the heat dissipation assembly.
[0074] Figure 5 A heat dissipation component with a connecting piece in a bent state is shown according to an exemplary embodiment.
[0075] In some embodiments, Figure 5 As shown, at least a portion of the connector 2 may be a bending portion 3, and the bending portion 3 may be a portion of the connector 2 having a bending function. The connector 2 may drive the heat sink 1 to bend together with the bending portion 3.
[0076] For example, Figure 5 As shown, at least a portion of the connecting member 2 may be made of a flexible material, so that the connecting member 2 may be bent.
[0077] The connector 2 may include a bending state. When the connector 2 is in the bending state, the bending portion 3 may bend so that the connector 2 bends. The first heat sink 11 and the second heat sink 12 connected by the connector 2 may overlap and merge in the thickness direction of the first heat sink 11 .
[0078] Among them, when the connecting member 2 is in a bent state, the heat dissipation assembly can be in a combined state, and the first heat dissipation member 11 and the second heat dissipation member 12 can be close to each other, so that the first heat dissipation member 11 and the second heat dissipation member 12 form a stacked state to facilitate the storage of the heat dissipation assembly.
[0079] When the connector 2 is in a bent state, the heat dissipation assembly can be in an unfolded state, and the first heat dissipation member 11 and the second heat dissipation member 12 can be separated from each other. By placing the connector 2 in a bent state, the first heat dissipation member 11 and the second heat dissipation member 12 separated from each other can be adapted to the electronic device in a folded state, and the first heat dissipation member 11 and the second heat dissipation member 12 can be respectively arranged on different rotating parts. Exemplarily, when the electronic device is in a folded state, the first heat dissipation member 11 can be arranged on the outer surface of one rotating part, and the second heat dissipation member 12 can be arranged on the outer surface of another rotating part, so that the heat dissipation assembly can dissipate heat for multiple rotating parts of the electronic device in a folded state or a semi-folded state, thereby improving the applicability of the heat dissipation assembly to foldable electronic devices.
[0080] Figure 6 Another heat dissipation component with a connecting member in a bent state is shown according to an exemplary embodiment.
[0081] In some embodiments, Figure 6 As shown, the bending portion 3 can also be a hinged structure, by hingedly connecting the first connection portion 21 and the second connection portion 22, the first connection portion 21 and the second connection portion 22 can rotate around the bending portion 3, and the first connection portion 21 and the second connection portion 22 can rotate together with the connected first heat sink 11 and the second heat sink 12, so that the first heat sink 11 and the second heat sink 12 that are far away from each other can be adapted to the electronic device in the folded state, and the first heat sink 11 and the second heat sink 12 are respectively arranged in different rotating parts, thereby improving the applicability of the heat dissipation assembly to foldable electronic devices.
[0082] In some embodiments, the unfolded state may include a flat state. When the heat dissipation assembly is in the flat state, the first heat dissipation member 11 and the second heat dissipation member 12 may be separated from each other in the length direction of the connector 2, that is, when the heat dissipation assembly is in the merged state, the first heat dissipation member 11 and the second heat dissipation member 12 may be separated from each other in the plane where the length direction of the connector 2 is located.
[0083] Exemplarily, the heat dissipation surface of the electronic device in the unfolded state can be a plane formed by rotating and splicing multiple rotating parts. Therefore, by constraining the movement direction of the heat sink 1, when the heat dissipation assembly is in the flat state, the first heat sink 11 and the second heat sink 12 can be separated from each other on the plane where the length direction of the connecting member 2 is located, so that the extended state of the heat dissipation assembly can directly adapt to the heat dissipation surface of the foldable electronic device in the unfolded state without the need for additional adjustment operations, thereby simplifying the user's usage process.
[0084] Figure 7 The figure is a schematic structural diagram of a first heat sink and a connecting member according to an exemplary embodiment. Figure 8 The figure is a schematic structural diagram of a first heat sink and a connecting member according to an exemplary embodiment. Fig. 9 The figure is a schematic structural diagram of a first heat sink and a connecting member according to an exemplary embodiment. Fig.10 It is a schematic structural diagram of another first heat sink and a connecting member according to an exemplary embodiment.
[0085] In some embodiments, Figure 3 , Figure 4 , Figure 7 , Figure 8 , Fig. 9 and Fig.10 As shown, the heat sink 1 may include: a receiving portion 61 , which may be a groove structure provided on the heat sink 1 . Exemplarily, the receiving portion 61 may be a groove structure formed by a depression of the housing 6 of the heat sink 1 .
[0086] When the heat dissipation assembly is in the combined state, the accommodation portion 61 can accommodate at least a portion of the connector 2 .
[0087] Exemplarily, when the heat dissipation assembly is in a combined state, the first connection portion 21 and the second connection portion 22 can move toward each other, and the connector 2 can move toward the inside of the accommodating portion 61, thereby reducing the total length of the connector 2, so that the connector 2 is in a contracted state, preventing the first heat dissipation member 11 and the second heat dissipation member 12 from being blocked from approaching each other, thereby meeting the heat dissipation requirements of the electronic device in the folded state, and reducing its own occupied area, thereby adapting to the available area of the electronic device in the folded state.
[0088] Exemplarily, when the heat dissipation assembly is in the unfolded state, the first connection portion 21 and the second connection portion 22 can move forward and backward, and the connector 2 can move outward from the accommodating portion 61, thereby extending the total length of the connector 2 so that the connector 2 is in an extended state, so that the connector 2 can connect the first heat dissipation member 11 and the second heat dissipation member 12, so that the first heat dissipation member 11 and the second heat dissipation member 12 can be respectively arranged on different rotating parts of the electronic device, thereby adapting to the heat dissipation area of the foldable electronic device and meeting the heat dissipation requirements of the electronic device in the unfolded state.
[0089] Through the mating connection between the connector 2 and the accommodating portion 61, when the heat dissipation assembly is in the combined state, the accommodating portion 61 can accommodate at least a portion of the connector 2, thereby reducing the total length of the connector 2 exposed from the heat dissipation assembly 1, so that the first heat dissipation assembly 11 and the second heat dissipation assembly 12 can be as close as possible, thereby reducing the occupied area of the heat dissipation assembly in the combined state, thereby adapting to the available area of the electronic device in the folded state.
[0090] In some embodiments, the contracted state of the connector 2 may also refer to a state in which the connector 2 is accommodated in the accommodation portion 61 .
[0091] In some embodiments, Figure 7 As shown, the heat sink 1 may include a heat sink 5, which may be a heat-conducting component in the heat sink 1 that helps the heat sink 1 to dissipate heat faster. Figure 7 As shown, the heat sink 1 may include a fan 7 , a cooling element 8 , an adsorption layer 9 and a heat sink 5 .
[0092] The adsorption layer 9 may have an adsorption function, and the heat sink 1 may be connected to the electronic device through the adsorption layer 9; the refrigeration component 8 may be a component with a semiconductor refrigeration function, and when the refrigeration component 8 is working, the temperature of one end of the refrigeration component 8 close to the electronic device may be reduced; the heat sink 5 may be a component with excellent thermal conductivity and a large heat dissipation area; the fan 7 may be a component that helps the heat sink 1 to dissipate heat by accelerating air flow.
[0093] Among them, the accommodating portion 61 can pass through at least a part of the heat sink 5, and the heat sink 5 can avoid the accommodating portion 61 by reducing its own volume, thereby providing an installation space for the accommodating portion 61, and reducing the volume of the heat sink 5 has a lower impact on the heat dissipation function of the heat sink 1, thereby ensuring that the heat dissipation function of the heat sink 1 can meet the heat dissipation requirements of the electronic equipment.
[0094] In some embodiments, Fig. 9 and Fig.10 As shown, the heat sink 5 may include a heat sink base 51 and heat sink fins 52 arranged on the heat sink base 51 in the thickness direction of the heat sink 1 . The heat sink fins 52 may expand the surface area of the heat sink 5 , thereby increasing the heat dissipation area of the heat sink 5 .
[0095] The accommodating portion 61 can pass through at least a portion of the heat dissipation base 51, and the heat dissipation base 51 can avoid the accommodating portion 61 by reducing its own volume, thereby providing an installation space for the accommodating portion 61, and reducing the volume of the heat dissipation base 51 has a lower impact on the heat dissipation function of the heat sink 1, thereby ensuring that the heat dissipation function of the heat sink 1 can meet the heat dissipation requirements of the electronic equipment.
[0096] The accommodating portion 61 can pass through at least a portion of the heat dissipating fins 52, and the heat dissipating fins 52 can avoid the accommodating portion 61 by changing the setting position of the heat dissipating fins 52 or reducing the number of the heat dissipating fins 52, thereby providing an installation space for the accommodating portion 61, and reducing the number of heat dissipating fins 52 has a lower impact on the heat dissipation function of the heat sink 1, thereby ensuring that the heat dissipation function of the heat sink 1 can meet the heat dissipation requirements of the electronic equipment.
[0097] In some embodiments, Figure 8As shown, the heat sink 1 may include a base 4 , which may be a shell portion connected to the adsorption layer 9 , and the accommodating portion 61 may pass through at least a portion of the base 4 .
[0098] The accommodating portion 61 can pass through at least a portion of the base 4, and the base 4 can avoid the accommodating portion 61 by reducing its own volume, thereby providing an installation space for the accommodating portion 61, and reducing the volume of the base 4 has a lower impact on the heat dissipation function of the heat sink 1, thereby ensuring that the heat dissipation function of the heat sink 1 can meet the heat dissipation requirements of the electronic equipment.
[0099] Fig.11 It is a schematic structural diagram of another connecting member in a merged state according to an exemplary embodiment.
[0100] In some embodiments, Fig.11 As shown, at least one heat sink 1 may be provided with a track, and the track may be provided inside the receiving portion 61. The connector 2 may be provided with a sliding portion, and exemplarily, when the first heat sink 1 is provided with a track, the second connector 22 may be provided with a sliding portion. The connector 2 may be slidably connected to the track through the sliding portion, so that the connector 2 may slide into or out of the receiving portion 61, so that the receiving portion 61 may accommodate the connector 2 in the receiving portion 61 when the heat sink assembly is in a merged state, thereby reducing the total length of the connector 2, so that the connector 2 is in a contracted state, and preventing the first heat sink 11 and the second heat sink 12 from being blocked from approaching each other, thereby meeting the heat dissipation requirements of the electronic device in the folded state, and reducing its own occupied area, thereby adapting to the available area of the electronic device in the folded state.
[0101] In some embodiments, Figure 3 and Figure 4 As shown, the first end of the first connection part 21 can be connected to the first heat sink 12 , and the first end of the second connection part 22 can be connected to the second heat sink 12 , wherein the second end of the first connection part 21 is slidably connected to the second end of the second connection part 22 .
[0102] When the heat dissipation assembly is in a merged state, the first connection portion 21 and the second connection portion 22 can move toward each other, and thereby reduce the total length of the first connection portion 21 and the second connection portion 22, so that the first connection portion 21 and the second connection portion 22 are in a contracted state, preventing the first heat dissipation member 11 and the second heat dissipation member 12 from being blocked from approaching each other, thereby meeting the heat dissipation needs of the electronic device in a folded state, and reducing its own occupied area, thereby adapting to the available area of the electronic device in the folded state.
[0103] When the heat dissipation assembly is in the unfolded state, the first connection portion 21 and the second connection portion 22 can move forward and backward, thereby extending the total length of the first connection portion 21 and the second connection portion 22, so that the first connection portion 21 and the second connection portion 22 are in an extended state, so that the connector 2 can connect the first heat dissipation member 11 and the second heat dissipation member 12, so that the first heat dissipation member 11 and the second heat dissipation member 12 can be respectively arranged on different rotating parts of the electronic device, thereby adapting to the heat dissipation area of the foldable electronic device and meeting the heat dissipation requirements of the electronic device in the unfolded state.
[0104] In some embodiments, Figure 3 and Figure 4 The second end of the first connecting portion 21 may be provided with a first buckle portion 211, and the second end of the second connecting portion 22 may be provided with a second buckle portion 221. For example, Figure 4 As shown, the first locking portion 211 may be a protrusion extending in the radial direction of the first connecting portion 21 , and the second locking portion 221 may be a protrusion extending in the radial direction of the second connecting portion 22 .
[0105] Among them, Figure 4 As shown, when the heat dissipation assembly is in a combined state, the first snap-fit portion 211 and the second snap-fit portion 221 can be connected to each other to prevent the first connection portion 21 and the second connection portion 22 from separating, so that the first heat dissipation element 11 and the second heat dissipation element 12 will not be separated from each other, thereby maintaining the connectivity of the first heat dissipation element 11 and the second heat dissipation element 12.
[0106] In some embodiments, Figure 4 As shown, the second connection part 22 may have a second cavity 222, the second end of the first connection part 21 may be inserted into the second cavity 222 of the second connection part 22, and the second end of the first connection part 21 may be slidably disposed in the second cavity 222. The second connection part 22 may be sleeved on the first connection part 21 through the second cavity 222, so that the total volume of the first connection part 21 and the second connection part 22 is reduced, thereby helping to reduce the occupied volume of the connection member 2, reducing the total volume of the heat sink 1, and helping to miniaturize the heat sink assembly.
[0107] In other embodiments, the first connection part 21 may have a first cavity, the second end of the second connection part 22 may be inserted into the first cavity of the first connection part 21, and the second end of the second connection part 22 may be slidably disposed in the first cavity. The first connection part 21 may be sleeved on the second connection part 22 through the first cavity, so that the total volume of the first connection part 21 and the second connection part 22 is reduced, thereby helping to reduce the occupied volume of the connector 2, reducing the total volume of the heat sink 1, and helping to miniaturize the heat sink assembly.
[0108] In some embodiments, there can be multiple connectors 2, one end of the multiple connectors 2 can be set on the first heat sink 11, and the other end of the multiple connectors 2 can be set on the second heat sink 12. By arranging multiple connectors 2 between the first heat sink 1 and the second heat sink 12, the connection between the first heat sink 1 and the second heat sink 12 can be made stronger, and the structural state change of the heat sink assembly can be smoother.
[0109] In some embodiments, the heat dissipation assembly may include multiple heat dissipation members 1, and the connecting members 2 may connect the multiple heat dissipation members 1. Exemplarily, the heat dissipation member 1 may include a third heat dissipation member, some connecting members 2 may connect the first heat dissipation member 11 and the second heat dissipation member 12, and other connecting members 2 may connect the second heat dissipation member 12 and the third heat dissipation member.
[0110] The present disclosure is not limited thereto, and the number of heat sinks 1 and the connection relationship of the plurality of heat sinks 1 can be designed according to the heat dissipation requirements of the electronic device.
[0111] By providing a plurality of heat sinks 1, the plurality of heat sinks 1 can be respectively arranged on different surfaces of the foldable electronic device to meet the heat dissipation requirements of different rotating parts. On the other hand, additional heat sinks 1 can be provided to meet the heat dissipation requirements of the foldable electronic device with a heat dissipation area.
[0112] In some embodiments, Figure 5 As shown, the bending portion 3 is a flexible component, so that the connecting member 2 can be bent, so that the heat sink 1 can be changed into a bent state, thereby adapting to different foldable electronic devices.
[0113] Based on the same concept, an embodiment of the present disclosure further provides a housing assembly, wherein the housing assembly can be applied to any of the following electronic devices.
[0114] The electronic device may be a laptop computer, a desktop computer, a mobile phone, a digital broadcast terminal, a message transceiver, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, a translator, and a wearable device such as a watch or a bracelet, and may be any electronic device with a speaker. In the following description, a mobile phone is used as an example, but the present disclosure is not limited thereto.
[0115] In some embodiments, the housing assembly includes: a housing; and any heat dissipation assembly of the first aspect, the heat dissipation assembly being disposed in the housing. The housing may be a base part in the housing assembly, and may provide an installation position for the heat dissipation element 1 assembly.
[0116] Optionally, an embodiment of the present disclosure provides an electronic device, wherein the electronic device comprises: a housing; and a heat dissipation component is disposed in the housing.
[0117] The housing assembly may be a protective shell of an electronic device, but the present disclosure is not limited thereto.
[0118] Optionally, an embodiment of the present disclosure provides an electronic device accessory, the electronic device accessory comprising: the aforementioned heat dissipation component.
[0119] The disclosed embodiment connects a plurality of heat sinks 1 via a connector 2, so that the heat sink assembly can switch between a combined state and an unfolded state to meet the heat dissipation requirements of foldable electronic devices in different states, thereby improving the applicability of the heat sink assembly.
[0120] It is to be understood that in the present disclosure, "plurality" refers to two or more than two, and other quantifiers are similar. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship. The singular forms "a", "the" and "the" are also intended to include plural forms, unless the context clearly indicates other meanings.
[0121] It is further understood that the terms "second", "secondary", etc. are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other and do not indicate a specific order or degree of importance. In fact, the expressions "secondary", "secondary", etc. can be used interchangeably. For example, without departing from the scope of the present disclosure, the second information may also be referred to as the second information, and similarly, the second information may also be referred to as the second information.
[0122] It will be further understood that the terms “center”, “longitudinal”, “lateral”, “front”, “back”, “up”, “down”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation.
[0123] It can be further understood that, unless otherwise specified, “connection” includes a direct connection without other components between the two, and also includes an indirect connection with other components between the two.
[0124] It is further understood that, although the operations are described in a specific order in the drawings in the embodiments of the present disclosure, it should not be understood as requiring the operations to be performed in the specific order shown or in a serial order, or requiring the execution of all the operations shown to obtain the desired results. In certain environments, multitasking and parallel processing may be advantageous.
[0125] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the following scope of rights.
[0126] It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the scope of the appended claims.
Claims
1. A heat dissipation component, characterized in that: The heat dissipation component comprises: a first heat sink and a second heat sink; A connecting member, the connecting member comprising a first connecting portion and a second connecting portion that are movably connected, the first connecting portion being arranged on the first heat sink, the second connecting portion being arranged on the second heat sink, and the first heat sink and the second heat sink being connected via the first connecting portion and the second connecting portion; Wherein, the connecting member includes an extended state and a contracted state; When the connecting member is in the contracted state, the first heat dissipation member and the second heat dissipation member are close to each other; When the connecting member is in the extended state, the first heat dissipation member and the second heat dissipation member are away from each other.
2. The heat dissipation assembly according to claim 1, characterized in that: The first connecting portion and the second connecting portion move toward each other so that the connecting member changes into the contracted state; The first connecting portion and the second connecting portion move away from each other to make the connecting member change to the extended state. Wherein, the length of the connecting member in the extended state is greater than the length of the connecting member in the contracted state.
3. The heat dissipation assembly according to claim 1, characterized in that: The heat dissipation assembly includes a combined state and an expanded state; The first heat sink and the second heat sink are brought closer to each other so that the heat sink assembly is in the merged state, and the connecting member is in the contracted state; The first heat sink and the second heat sink move away from each other so that the heat sink assembly changes to the unfolded state, and the connecting member changes to the extended state.
4. The heat dissipation assembly according to claim 3, characterized in that: When the connecting member is in the contracted state, the heat dissipation assembly is in the combined state, and the first heat dissipation member and the second heat dissipation member are close to each other in the length direction of the connecting member.
5. The heat dissipation assembly according to claim 3, characterized in that The unfolded state includes a flattened state; When the heat dissipation assembly is in the flat state, the first heat dissipation member and the second heat dissipation member are away from each other in the length direction of the connecting member.
6. The heat dissipation assembly according to claim 3, characterized in that: The connecting member includes a bent state, and at least a portion of the connecting member is a bent portion, Wherein, when the connecting member is in the bending state, the bending portion is bent, the first heat sink and the second heat sink overlap in the thickness direction of the first heat sink, and the heat sink assembly is in the combined state or the unfolded state.
7. The heat dissipation assembly according to claim 1, characterized in that: The second end of the first connecting portion is slidably connected to the second end of the second connecting portion; The second end of the first connecting portion is provided with a first buckle portion, and the second end of the second connecting portion is provided with a second buckle portion. Wherein, when the connecting member is in the contracted state, the first buckle portion abuts against the second buckle portion to prevent the first connecting portion and the second connecting portion from separating.
8. The heat dissipation assembly according to claim 1, characterized in that: The first connecting part has a first cavity, the second end of the second connecting part is inserted into the first cavity of the first connecting part, and the second end of the second connecting part is slidably disposed in the first cavity, or The second connection part has a second cavity, the second end of the first connection part is inserted into the second cavity of the second connection part, and the second end of the first connection part is slidably disposed in the second cavity.
9. The heat dissipation assembly according to claim 1, characterized in that: The first heat sink is provided with a track, the second connection portion is provided with a sliding portion, the second connection portion is slidably connected to the track via the sliding portion, and / or The second heat sink is provided with a track, the first connection portion is provided with a sliding portion, and the first connection portion is slidably connected to the track via the sliding portion.
10. The heat dissipation assembly according to claim 1, characterized in that: The heat sink comprises: The accommodating portion accommodates at least a portion of the connecting member when the connecting member is in the contracted state.
11. The heat dissipation assembly according to claim 10, characterized in that: The heat sink comprises a heat sink and a base, and the accommodation portion passes through at least a portion of the heat sink; and / or The receiving portion passes through at least a portion of the base.
12. The heat dissipation assembly according to claim 11, characterized in that: The heat sink includes a heat sink base and heat sink fins arranged on the heat sink base in a thickness direction of the heat sink, and the accommodation portion passes through the heat sink base and the heat sink fins.
13. The heat dissipation assembly according to claim 1, characterized in that: There are a plurality of connecting members, one end of each of the connecting members is disposed on the first heat sink, and the other end of each of the connecting members is disposed on the second heat sink.
14. The heat dissipation assembly according to claim 13, characterized in that: The heat dissipation assembly includes a third heat dissipation element, a portion of the plurality of connecting elements connects the first heat dissipation element and the second heat dissipation element, and another portion of the plurality of connecting elements connects the second heat dissipation element and the third heat dissipation element.
15. The heat dissipation assembly according to claim 6, characterized in that: The bending portion is a flexible component.
16. An electronic device, characterized in that: include: case; The heat dissipation assembly according to any one of claims 1 to 15, wherein the heat dissipation assembly is arranged on the housing.
17. An electronic device accessory, characterized in that: Comprising a heat dissipation assembly as described in any one of claims 1-15.