Crystal grain transfer equipment

Abstract

The invention discloses crystal grain transfer equipment, which is suitable for transferring a plurality of crystal grains on at least one first carrier plate to at least one second carrier plate in turn, and comprises a machine table, a first carrier table, a second carrier table, a third carrier table and a laser module, the machine table comprises a rail and a frame body located above the rail. The track comprises a machining area, a first area and a second area, the first carrying table is connected with the frame body and is suitable for loading or unloading the first carrying plate. The second carrying table and the third carrying table are respectively connected with the track and are suitable for loading or unloading the first carrying plate and the second carrying plate, and the second carrying table is suitable for moving between the first area and the machining area. The third stage is adapted to move between the second region and the processing region. When one of the second carrying table and the third carrying table leaves from the processing area, the other one of the second carrying table and the third carrying table is suitable for moving into the processing area. The laser module is suitable for providing a processing light beam to a first carrying plate on the first carrying table.

Description

Technical Field

[0001] The invention relates to a crystal grain processing device, in particular to a crystal grain transfer device. Background Art

[0002] Micro LED Display is a display that uses micro LEDs as light sources. Micro LEDs are products that thin-film, miniaturize, and array light-emitting diodes (LEDs), and reduce the size of LEDs to micrometer levels.

[0003] The manufacturing process of micro-LED display includes forming an epitaxial layer including multiple micro-die on a wafer substrate, and then transferring the micro-die to a driving substrate by mass transfer. Even if the LEDs appear to have the same color to the naked eye, the LEDs produced on different substrates still have tiny and difficult to directly identify color differences, but they are actually different. These individual differences may be observed by the human eye as the number of LEDs on the product increases. In order to manufacture products with better color, the industry groups different LEDs by parameters such as lumen, voltage and color (this concept is called sorting, or Bin), and achieves color consistency by logically allocating LEDs with complementary color characteristics by position during mass transfer (this concept is also called Bin mixing).

[0004] In addition, the technologies currently used for mass transfer include pick and place technology (Pick & Place), fluid transfer and laser transfer. Among them, laser transfer technology has the potential for development because it has a higher transfer speed than pick and place technology, and has a higher transfer accuracy than fluid transfer and is relatively easy to repair. Summary of the invention

[0005] The invention provides a grain transfer device to improve Bin mixing grain transfer efficiency.

[0006] To achieve the above advantages, an embodiment of the present invention provides a die transfer device, which is suitable for transferring multiple die on multiple first carriers to at least one second carrier in turn, and the die transfer device includes: a machine, a first carrier, a second carrier, a third carrier and a laser module. The machine includes a track and a frame located above the track, and the track has a processing area located below the frame and a first area and a second area located on both sides of the processing area. The first carrier is connected to the frame, and the first carrier is suitable for loading or unloading the first carrier. The second carrier and the third carrier are each connected to the track, suitable for loading or unloading the first carrier, and are also suitable for loading or unloading the second carrier, and the second carrier is suitable for moving between the first area and the processing area of ​​the track. The third carrier is suitable for moving between the second area and the processing area of ​​the track, and when one of the second carrier and the third carrier leaves the processing area, the other of the second carrier and the third carrier is suitable for moving into the processing area. The laser module is suitable for providing a processing beam to the first carrier on the first carrier.

[0007] In one embodiment of the present invention, the machine further includes a base and a movable platform, the movable platform is connected to the base and is suitable for moving relative to the base along a first direction parallel to the track, the frame is connected to the movable platform and is suitable for moving with the movable platform in the first direction, the track is fixed on the movable platform, the second platform and the third platform are directly connected to the track, and are suitable for moving independently relative to the movable platform.

[0008] In one embodiment of the present invention, the second carrier and the third carrier include a base and a bearing seat, the base is suitable for driving the bearing seat to move along a first direction, the bearing seat is suitable for connecting to the first carrier plate or the second carrier plate, and driving the first carrier plate or the second carrier plate to move relative to the base along a second direction perpendicular to the first direction, and is also suitable for driving the second carrier plate to rotate with the second direction as the axial direction.

[0009] In one embodiment of the present invention, the machine further includes a base and a mobile platform, the mobile platform is connected to the base via a track, the frame is connected to the base and is suitable for moving along a first direction on the base, and the second platform and the third platform are fixed at both ends of the mobile platform.

[0010] In one embodiment of the present invention, the second carrier and the third carrier include a base and a bearing seat, the base is fixed on the movable platform, the bearing seat is suitable for connecting the first carrier plate or one of the second carrier plates, and driving the first carrier plate or one of the second carrier plates to move relative to the base along a second direction perpendicular to the first direction, and is also suitable for driving the second carrier plate to rotate with the second direction as the axial direction.

[0011] In one embodiment of the present invention, the second carrier and the third carrier include a base and a bearing seat, the base is suitable for driving the bearing seat to move along a first direction, the bearing seat is suitable for connecting to the first carrier plate or the second carrier plate, and driving the first carrier plate or the second carrier plate to move relative to the base along a second direction perpendicular to the first direction, and is also suitable for driving the second carrier plate to rotate with the second direction as the axial direction.

[0012] In one embodiment of the present invention, the laser module includes: a laser light source, a beam shaping element, a light mask, a reflector assembly and a projection lens along the optical path of the processing light beam. The laser light source is suitable for providing a laser light beam. The beam shaping element is suitable for adjusting the laser light beam into a processing light beam with a flat-top energy distribution. The light mask is suitable for changing the spot shape of the processing light beam. The reflector assembly is suitable for reflecting the processing light beam. The projection lens is suitable for focusing the processing light beam on the first carrier plate, and is also suitable for driving the processing light beam to move in a second direction perpendicular to the first direction.

[0013] In one embodiment of the present invention, the grain transfer equipment further includes a first loading and unloading device and a second loading and unloading device, wherein the first area has a first loading and unloading position, and the second area has a second loading and unloading position, the first loading and unloading device is suitable for loading and unloading the first carrier plate or the second carrier plate on the second carrier plate positioned at the first loading and unloading position, and the second loading and unloading device is suitable for loading and unloading the first carrier plate or the second carrier plate on the third carrier plate positioned at the second loading and unloading position.

[0014] In one embodiment of the present invention, the die transfer device further comprises: a first photographing unit and a second photographing unit. The first photographing unit is adapted to photograph the first carrier or the second carrier on the second carrier at the first loading and unloading position. The second photographing unit is adapted to photograph the first carrier or the second carrier on the third carrier at the second loading and unloading position.

[0015] In one embodiment of the present invention, the die transfer equipment further comprises a photographing unit adapted to photograph the first carrier plate located on the first carrier stage.

[0016] In one embodiment of the present invention, the die transfer equipment further comprises a photographing unit adapted to photograph the first carrier or one of the second carriers located on the second carrier or the third carrier in the processing area.

[0017] In one embodiment of the present invention, the machine further includes a support beam, a support assembly and a flexible connection assembly. The support beam is movably disposed on the support assembly, and the support beam is indirectly connected to the support assembly through the flexible connection assembly. The laser module is disposed on the support beam and moves along the first direction or the second direction with the support beam.

[0018] In one embodiment of the present invention, the machine further includes a driving motor assembly, and the driving motor assembly is directly connected to the supporting beam and directly connected to the supporting assembly.

[0019] Through the above description, the die transfer equipment of the embodiment of the present invention has a second carrier and a third carrier that can carry the first carrier or the second carrier. Therefore, while one of the carriers (such as the second carrier) is performing a die transfer operation in the processing area on the machine, the carrier that is scheduled to perform a die transfer operation is loaded and unloaded on another carrier (the third carrier) in another area (such as the second area) and prepared, so that after completing one die transfer operation, the next die transfer operation can be quickly performed to improve efficiency. In addition to the preparation operation of preparing the carrier to be transferred, the preparation operation of providing a die carrier can also be performed.

[0020] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following specifically cites a preferred embodiment and describes it in detail with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A three-dimensional schematic diagram of a die transfer device according to an embodiment of the present invention;

[0022] Figure 2 for Figure 1 Schematic diagram of the relationship between the laser module and the machine platform of the die transfer equipment;

[0023] Figure 3 for Figure 1 A schematic diagram of the installation position of the camera unit of the machine;

[0024] Figure 4 for Figure 1 A simple schematic diagram of the middle machine;

[0025] Figure 5 for Figure 1 In the embodiment, a schematic diagram of a process of installing a first carrier board on a machine;

[0026] FIG. 6A to FIG. 6E for Figure 5 Schematic diagram of the machine's movements during the process;

[0027] Figure 7 for Figure 1 In the embodiment, a schematic diagram of a process of exchanging a first carrier plate on a machine to prepare for die transfer;

[0028] Figure 8 for Figure 1In the embodiment, a schematic diagram of a process of installing a second carrier on a machine to prepare for die transfer;

[0029] 9A to 9D for Figure 1 Schematic diagram of the operation of the machine when performing die transfer in the embodiment Fig.10 for Figure 1 In the embodiment, a schematic diagram of the process of exchanging the second carrier board by the machine;

[0030] FIG. 11A to FIG. 11D for Fig.10 Schematic diagram of the machine's movements during the process;

[0031] Fig.12 FIG. 4 is a simplified schematic diagram of a die transfer device according to another embodiment of the present invention. DETAILED DESCRIPTION

[0032] In the following articles, the terms used in the description of the embodiments of the present invention, such as the description of the directions or positional relationships indicated by "upper", "lower", etc., are described according to the directions or positional relationships shown in the drawings used. The above terms are only for the convenience of describing the present invention and are not intended to limit the present invention, i.e., they do not indicate or imply that the elements mentioned must have a specific direction or be constructed in a specific direction. In addition, the terms "first", "second", etc. mentioned in this specification or the scope of the patent application are only used to name the element or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

[0033] Figure 1 It is a three-dimensional schematic diagram of a die transfer device according to an embodiment of the present invention. Figure 2 for Figure 1 Schematic diagram of the relationship between the laser module and the machine platform of the die transfer equipment. Figure 3 for Figure 1 Schematic diagram of the installation position of the camera unit of the machine. Figure 4 for Figure 1 A simple schematic diagram of the medium machine.

[0034] Please refer to Figures 1 to 4 As shown, the die transfer device 1 in this embodiment is suitable for transferring a plurality of die P on a first carrier F1 to at least one second carrier F2 in turn. The type of transfer operation is not limited. It can be a transfer operation in which the relative positions of the die P do not change (such as an operation to flip the die P), or a transfer operation in which the relative positions of the die P change (such as a Bin Mixing operation), or a transfer operation used in a die repair operation. The transfer operation can be changed according to needs. The die transfer device 1 includes: a machine 10, a first carrier 2 (see Figure 4), the second stage 3, the third stage 4 and the laser module 5 (for the convenience of explanation, the projection lens 55 of the laser module 5 is used to indicate the installation position. And the grain P is drawn on Fig. 6A ). The machine 10 includes a track 11 and a frame 103 located above the track 11. The track 11 has a processing area S located below the frame 103 and a first area A1 and a second area A2 located on both sides of the processing area S. The first carrier 2 is connected to the frame 103, and the first carrier 2 is suitable for loading or unloading the first carrier F1; the second carrier 3 and the third carrier 4 are respectively connected to the track 11, suitable for loading or unloading the first carrier F1 and also suitable for loading or unloading the second carrier F2, the second carrier 3 is suitable for moving between the first area A1 of the track 11 and the processing area S, the third carrier 4 is suitable for moving between the second area A2 of the track 11 and the processing area S, and when one of the second carrier 3 and the third carrier 4 leaves the processing area S, the other of the second carrier 3 and the third carrier 4 is suitable for moving into the processing area S. The laser module 5 is suitable for providing a processing beam L to the first carrier F1 on the first carrier 2.

[0035] like Figure 1 As shown, in this embodiment, the die transfer device 1 is, for example, an electrically connected control unit (not shown), and the control unit drives each component in the die transfer device 1 to operate. The machine 10, for example, also includes a base 101 and a mobile platform 102. The mobile platform 102 is, for example, a substantially rectangular platform, and is movably disposed on the base 101 through a slide rail 101a disposed on the base 101. The track 11 is fixed on the mobile platform 102, and the extension direction of the track 11 is, for example, the same as the long axis direction of the mobile platform 102. The second carrier 3 and the third carrier 4 are, for example, directly connected to the track 11, and are suitable for independently moving relative to the mobile platform 102 in the first direction D1 in the extension direction of the track 11. In other words, in this embodiment, the second carrier 3 and the third carrier 4 can move relative to the base 101 in the first direction D1 along with the movement of the mobile platform 102, and can also move relative to the base 101 in the first direction D1 independently of the movement of the mobile platform 102. The extending direction of the slide rail 101 a is, for example, the same as the first direction D1 , but is not limited thereto.

[0036] In this embodiment, the frame 103 is, for example, fixed at the center of the mobile platform 102. In other embodiments, the frame 103 may be a component that can move with the mobile platform 102, so the processing area S located below the frame 103 may refer to the sum of the areas located below the frame 103 in the movable range of the frame 103, but is not limited thereto. In addition, in order to clarify the relative position relationship between the frame 103 and the mobile platform 102, Figure 4In the figure, a base of a frame 103 is shown below the mobile platform 102, and is connected to the frame 103 by lines.

[0037] like Figure 1 and Figure 4 As shown, in this embodiment, the first carrier 2 can also move, for example, relative to the frame 103 in a third direction D3 that is perpendicular to the first direction D1 and the second direction D2 (the second direction D2 is perpendicular to the first direction D1 and is located on the same horizontal plane) (the third direction D3 is in the Figure 4 The third direction D3 is a direction perpendicular to the plane of the moving platform 102 ), so that the first carrier F1 carried on the first carrier 2 can move along the third direction D3 , but the present invention is not limited thereto.

[0038] like Figure 1 As shown, in this embodiment, the machine 10 further includes a support frame 104 movably connected to the base 101 along the first direction D1 and the second direction D2. The support frame 104 is suitable for supporting the laser module 5 on the base 101 and located above the movable platform 102. Although there is no special restriction on whether the support frame 104 itself is movable, in this embodiment, the laser module 5 can move along the first direction D1 and the second direction D2 relative to the movable platform 102 with the movement of the support frame 104, and change the irradiation position of the processing light beam L, but the movement of the laser module 5 is not limited to this.

[0039] The support components 1041 are located on both sides of the mobile platform 102, and the support beams 1042 are arranged across the tops of the two support components 104. The specific shape of the support component 1041 is, for example, two plates extending along the first direction D1 and facing each other, and the mobile platform 102 is located between the two plates, but the specific shape is not limited to this. The laser module 5 is mounted on the support beams 1042. Among them, the support frame 104 is provided with guide rails 1043 extending along the first direction D1 at the tops of the support components 1041 (the tops of the two plates), for example, respectively, and the support beams 1042 are connected to the support components 1041 through these guide rails 1043.

[0040] In order to enable the support beam 1042 to move on the guide rail 1043, in this embodiment, the support frame 104 has, for example, two positioning rails 1044 and a drive motor assembly 1045. The two positioning rails 1044 are respectively arranged on the side of each guide rail 1043, for example, between the two plates of the support assembly 1041. These positioning rails 1044 are, for example, opposite to each other and each extends along the first direction D1. The drive motor assembly 1045 includes, for example, two drive motors. The drive motor assembly 1045 is connected to the support beam 1042 and these drive motors (see Figure 1The two drive motor assemblies 1045 (marked at the middle drive motor assembly 1045) are respectively arranged at both ends of the support beam 1042, and are directly connected to the positioning rails 1044 respectively. Through this structure, when the drive motor assembly 1045 is actuated, the support beam 1042 will be pulled by the two drive motors and the two positioning rails 1044 to move on the two guide rails 1043, and drive the laser module 5 on the support beam 1042 to move. It is worth noting that the load applied by the support beam 1042 and the laser module 5 to the support assembly 1041 is mainly supported by the guide rails 1043. The positioning rails 1044 are mainly only to assist in positioning the support beam 1042 on the guide rails 1043, so the specific shape and type of the positioning rails 1044 are not limited, for example, it can be a known component such as a positioning groove or a rack.

[0041] Please refer to Figure 1 As shown, in this embodiment, the support beam 1042 includes, for example, a first beam member 1042a and two second beam members 1042b. The flexible connection assembly 1046 includes, for example, two flexible connection members (see Figure 1 ), the two second beam components 1042b are directly connected to the two guide rails 1043 respectively, the first beam component 1042a is connected between the two second beam components 1042b through two flexible connectors, and the laser module 5 is installed on the first beam component 1042a. The aforementioned drive motor component 1045 is directly connected to the first beam component 1042a, and is not directly connected to the second beam component 1042b. In other words, the first beam component 1042a is simultaneously and separately connected to the support component 1041 through two combinations of a combination of a drive motor component 1045 with a positioning rail 1044 and a combination of a flexible connection component 1046 with a second beam component 1042b and a guide rail 1043.

[0042] There is no restriction on the specific structure of the flexible connection component 1046, as long as it is a component that deforms preferentially when the support beam 1042 is deformed by external force. Specifically, the flexible connection component 1046 can be a component constructed of elements such as metal plates, metal blocks or springs, but is not limited to this.

[0043] With this structure, since the laser module 5 is indirectly connected to the guide rail 1043 mainly through the two flexible connection components 1046, and the position of the laser module 5 is indirectly moved on the guide rail 1043 by the drive motor component 1045, when the laser module 5 moves to a local specific position during the movement process, if the position deviation is caused by the processing accuracy or installation accuracy of the components such as the guide rail 1043, the displacement can be corrected by the two drive motors of the drive motor component 1045, and the precise position of the laser module 5 at that location can be corrected by the deformation of the two flexible connection parts of the flexible connection component 1046. Specifically, according to the direction of the correction value of the two drive motors, for example, when the two drive motors are corrected in the same direction, the laser module 5 can be corrected for displacement, and when the two motors are corrected in different directions, the laser module 5 can be corrected for rotation.

[0044] It should be understood that the specific shape of the support frame 104 or the form and quantity of each component can be set according to the needs. The above description of how to make corrections in the first direction D1 is only an example. In actual use, similar component groups can be set according to needs and make corrections in other directions, such as the second direction D2. Please refer to Figure 2 As shown, in this embodiment. The laser module 5 includes, for example, a laser light source 51, a beam shaping element 52, a light mask 53, a reflector assembly 54 and a projection lens 55 on the optical path of the processing light beam L, and a photographing device 56 facing the light mask 53 may also be provided on one side of the light mask 53, but the invention is not limited thereto. The laser light source 51 is suitable for providing a laser light beam. In this embodiment, the laser light beam provided by the laser light source 51 is, for example, a Gaussian beam, but the invention is not limited thereto. The beam shaping element 52 is, for example, suitable for shaping the laser light beam into a flat-top beam with a flat-top energy distribution, but the type of the processing light beam L is not limited thereto. The light mask 53 is, for example, suitable for changing the spot shape of the processing light beam L. In this embodiment, for example, the light mask 53 is replaced by a mechanical arm (not shown) in cooperation with a receiving device (not shown) that receives different types of light masks 53, but the invention is not limited thereto. The reflector assembly 54 is suitable for reflecting the processing light beam L so that the processing light beam L can be directed toward the projection lens 55 in an appropriate light path. The photographing device 56 is suitable for locating the position of the mask 53 through images.

[0045] In the present embodiment, the projection lens 55 is, for example, suitable for focusing the processing light beam L and projecting it toward the first carrier F1, and is also, for example, a component suitable for moving along the first direction D1 and the second direction D2 with the movement of the support frame 104, but is not limited thereto. The projection lens 55, for example, includes a reflector (not shown) and a focusing lens (not shown). The reflector and the focusing lens are, for example, components assembled together and movable together in the second direction D2 and the third direction D3, but are not limited thereto. Thereby, the processing light beam L can change its focal position in the third direction D3 by the movement of the projection lens 55 in the third direction D3. From the above description, it can be seen that in the present embodiment, the processing light beam L irradiated on the first carrier F1 is irradiated at different positions on the first carrier F1 by the movement of the laser module 5 and the projection lens 5555 in the first direction D1 and the second direction D2 driven by the support frame 104. In addition, the mechanism for relative movement between the processing light beam L and the first carrier F1 is not limited in this manner. For example, in one embodiment, the laser module 5 may include a scanning galvanometer module suitable for driving the processing light beam L to move in the first direction D1 and the second direction D2.

[0046] like Figure 1 and Figure 4 As shown, in this embodiment, the first carrier 2 includes, for example, a bearing seat 202, and the bearing seat 202 is suitable for driving the first carrier F1 to rotate with the third direction D3 as the axis direction. The second carrier 3 includes, for example, a base 301 and a bearing seat 302, and the base 301 is suitable for driving the bearing seat 302 to move along the first direction D1, and the bearing seat 302 is suitable for connecting the first carrier F1 or the second carrier F2, and includes a first component 302a and a second component 302b. The first component 302a is connected to the base 301, and is suitable for driving the first carrier F1 or the second carrier F2 to move relative to the base 301 along the second direction D2 perpendicular to the first direction D1. The second component 302b is connected to the first component 302a, and is suitable for driving the second carrier F2 to rotate with the third direction D3 as the axis direction, but the detailed driving method is not limited thereto, and the design can be changed according to needs. The third stage 4 has a structure corresponding to the second stage 3 and includes a corresponding base 401, a supporting seat 402, a first component 402a and a second component 402b. The functions thereof can be referred to the description of the second stage 3 and will not be described in detail.

[0047] like Figure 1 and Figure 3As shown, in this embodiment, the second stage 3 is provided with a second through hole 31 penetrating the base 301 and the support seat 302 along the third direction D3, the third stage 4 is provided with a third through hole 41 penetrating the base 401 and the support seat 402 along the third direction D3, and the first stage 2 is also provided with a first through hole 21 penetrating the components of the first stage 2 along the third direction D3, and the frame 103 is also provided with a through hole 1031 corresponding to the first through hole 21. The first through hole 21, the second through hole 31, and the third through hole 41 are suitable for use with the photographing units 8a, 8b, 8c, and 8d described later, so the arrangement is not limited to this. Among them, the first stage 2, the second stage 3, and the third stage 4 can be carried by the first carrier F1 and the second carrier F2 by, for example, an existing tape, an adsorption module, or by setting a clamp module in the first through hole 21, the second through hole 31, and the third through hole 41, but the present invention is not limited to this.

[0048] like Figure 1 and Figure 4 As shown, in this embodiment, the die transfer equipment 1 includes, for example, a first loading and unloading device 6a and a second loading and unloading device 6b disposed next to the machine 10, and a first storage box 7a, a second storage box 7b, a third storage box 7c, and a fourth storage box 7d disposed in accordance with the positions of the first loading and unloading device 6a and the second loading and unloading device 6b. The first loading and unloading device 6a and the second loading and unloading device 6b are, for example, robotic arms in this embodiment, but are not limited thereto. The first area A1 has a first loading and unloading position L1, and the second area A2 has a second loading and unloading position L2. The first loading and unloading device 6a is suitable for loading and unloading the first carrier F1 or the second carrier F2 on the second carrier 3 located at the first loading and unloading position L1, and the second loading and unloading device 6b is suitable for loading and unloading the first carrier F1 or the second carrier F2 on the third carrier 4 located at the second loading and unloading position L2. In the present embodiment, the first loading and unloading position L1 can be used as a standby position when the second carrier 3 is on standby, and the second loading and unloading position L2 can be used as a standby position when the third carrier 4 is on standby, but the present invention is not limited thereto.

[0049] In this embodiment, the first storage box 7a and the second storage box 7b are arranged corresponding to the setting position of the first loading and unloading device 6a, and the third storage box 7c and the fourth storage box 7d are arranged corresponding to the setting position of the second loading and unloading device 6b, but the present invention is not limited thereto. The first storage box 7a is suitable for being a storage box for providing the first carrier F1, the second storage box 7b and the third storage box 7c are suitable for being a storage box for providing the second carrier F2, and the fourth storage box 7d is suitable for being a storage box for storing the first carrier F1 after use. However, the types and functions of the storage boxes 7a, 7b, 7c, and 7d are not limited thereto, and existing known storage boxes may be used, or they may be arranged according to actual needs.

[0050] like Figure 3 and Figure 4 As shown, in this embodiment, the die transfer device 1 further includes: a first photographing unit 8a, a second photographing unit 8b, a third photographing unit 8c and a fourth photographing unit 8d ( Figure 3 The fourth imaging unit 8d is omitted. Figure 4 The first imaging unit 8a, the second imaging unit 8b, the third imaging unit 8c and the fourth imaging unit 8d are installed on the machine platform 10, for example. Figure 4 For the convenience of representation, the positions of each photographic unit 8a, 8b, 8c, and 8d are moved).

[0051] The first camera unit 8a is, for example, adapted to photograph the first carrier F1 or the second carrier F2 on the second stage 3 at the first loading and unloading position L1. The second camera unit 8b is, for example, adapted to photograph the first carrier F1 or the second carrier F2 on the third stage 4 at the second loading and unloading position L2. The third camera unit 8c is, for example, adapted to photograph the first carrier F1 on the first stage 2, and the fourth camera unit 8d is, for example, adapted to photograph the first carrier F1 or the second carrier F2 on the second stage 3 or the third stage 4 in the processing area S.

[0052] The control unit, for example, controls the operation of the above-mentioned platforms 2, 3, and 4 through vision and memory using the image data sent back by the above-mentioned photographic units 8a, 8b, 8c, and 8d to determine whether the positions and angles of the first carrier plate F1 and the second carrier plate F2 meet the processing requirements and determine the action position of the processing light beam L.

[0053] like Figure 3 As shown, in the detailed installation method of each photographic unit, for example, a first groove (not shown) and a second groove (not shown) each with an opening facing upward can be opened on the mobile platform 102 at the positions corresponding to the first loading and unloading position L1 and the second loading and unloading position L2, and the first photographic unit 8a and the second photographic unit 8b are respectively arranged in the corresponding grooves, so that the first photographic unit 8a and the second photographic unit 8b can shoot from bottom to top toward the corresponding through-openings ((second through-opening 31, third through-opening 41)). In this embodiment, the first photographic unit 8a and the second photographic unit 8b can, for example, move with the mobile platform 102 in the first direction D1, but this is not limited to this. The third photographic unit 8c is, for example, arranged on the support frame 104 and shoots toward the first carrier 2 (see Figure 4), and the fourth camera unit 8d is, for example, disposed on the base 101, and photographs upward (the first stage 2) through the through slot 1021 provided on the mobile platform 102 corresponding to the processing area S. However, the detailed arrangement of each camera unit is not limited thereto and can be arranged according to requirements. For example, in another embodiment of the present case, the first camera unit 8a and the second camera unit 8b can be arranged above the second stage 3 or the third stage 4 instead. In this case, even if the second through hole 31 and the third through hole 41 are not provided on the second stage 3 and the third stage 4, the first camera unit 8a and the second camera unit 8b can still perform their functions.

[0054] The following will describe various processes and actions of the machine 10 in the embodiment during the die transfer operation. Figure 5 for Figure 1 In the embodiment, a schematic diagram of a process of installing a first carrier board on a machine is shown. FIG. 6A to FIG. 6E for Figure 5 Schematic diagram of the machine's movements during the process. Figure 7 for Figure 1 A schematic diagram of a process of exchanging a first carrier plate in a machine to prepare for die transfer in an embodiment. Figure 8 for Figure 1 In an embodiment, a schematic diagram of a process of installing a second carrier on a machine to prepare for die transfer is shown. 9A to 9D for Figure 1 In the embodiment, a schematic diagram of the operation of the machine when performing die transfer is shown. Fig.10 for Figure 1 A schematic diagram of a process of exchanging a second carrier board for a machine in an embodiment.

[0055] FIG. 11A to FIG. 11D for Fig.10 Schematic diagram of the machine's movements during the process. 9A to 9D The die transfer operation shown is a type of transfer operation that changes the relative positions of the die P. After the transfer, the relative positions of different die on the first carrier F1 will be different from the relative positions of different die on the second carrier F2a, but the type of transfer operation is not limited to this.

[0056] like Figure 1 , Figure 5 and even FIG. 6A to FIG. 6E As shown, before the actual transfer operation of the die P is performed, the first carrier F1, which is the carrier of the die P to be transferred, must first be installed on the first carrier 2 (or referred to as the loading process P1). In this embodiment, for example, the first carrier F1 is first taken out from the first storage box 7a by a robot arm serving as the first loading and unloading device 6a. Then, the first carrier F1 is placed on the second carrier 3 located at the first loading and unloading position L1 ( Fig. 6A). Then, the first camera unit 8a takes the image of the first carrier F1 and transmits it back, and the base 301 and the support seat 302 are moved and rotated relative to the mobile platform 102 to perform position correction and angle rotation correction (hereinafter referred to as angle correction) on the first carrier F1 on the second stage 3. In this embodiment, in order to make the die P on the first carrier F1 face downward when it is carried on the first stage 2, when carrying the first carrier F1, the second stage 3 may also be provided with an auxiliary component F10, for example, but not limited thereto.

[0057] like Figure 6B As shown, the second carrier 3 then drives the first carrier F1 into the processing area S and is positioned directly below the first carrier 2. FIG. 6C to FIG. 6D As shown, the first stage 2 moves toward the second stage 3 along the third direction D3 and obtains the first carrier F1 on the second stage 3, and then drives the first carrier F1 away from the second stage 3 along the third direction D3 to a predetermined height (the first stage 2 returns to its original position). Next, the third camera unit 8c takes a picture of the first carrier F1 supported by the first stage 2 from top to bottom, and the image transmitted back is used to calibrate the position and correct the angle of the first carrier F1 through the frame 103 and the first stage 2, and the projection lens 55 of the laser module 5 is moved to the desired position along the second direction D2 (due to the angle relationship, FIG. 6A to FIG. 6E The movement of the projection lens 55 in the second direction D2 is not shown), thereby locating the position and angle of each grain P on the first carrier F1 and locating the relative position relationship between the processing light beam L and the grain P on the first carrier F1. The detailed steps of when and how each camera unit 8a, 8b, 8c, 8d takes pictures of the first carrier F1, performs position memory and calibration, and are not limited to the above sequence. Afterwards, the first carrier 2 returns to its original position and completes the loading of the first carrier F1 (completing the loading process P1), so that the grain P transfer operation can be performed in accordance with the instructions of the control unit in the future.

[0058] like Fig. 6E As shown, after the first carrier F1 is separated from the second carrier 3, the second carrier 3 leaves the processing area S and returns to the first loading and unloading position L1. The auxiliary component F10 originally retained on the second carrier 3 is, for example, removed by the first loading and unloading device 6a so as to load and unload the second carrier F2 in the subsequent steps, but this is not limited to this. In addition, the movement of the second carrier 3, the removal of the auxiliary component F10, and the aforementioned position correction and angle rotation of the first carrier F1 can be performed simultaneously, but this is not limited to this.

[0059] Please refer to Figure 1 , Fig. 6E and Figure 7As shown. Not all the dies P on the first carrier F1 need to be transferred to the same second carrier F2 (details will be described later). When the dies P on the first carrier F1 are used up after multiple transfer operations, for example, it is necessary to remove the used first carrier F1 on the first carrier 2 and install a new first carrier F1. (Hereinafter referred to as the first exchange process P2, because the following description will mention multiple first carriers F1, the first carriers F1a and F1b are used to distinguish the names, but the two are not drawn in the figure). Figure 7 As shown, in this process, the method of placing the new first carrier plate F1b on the first carrier 2 is the same as that described above. Figure 5 The processes are roughly the same, with the main difference being that before the second carrier 3 receives the new first carrier plate F1b and enters the processing area S, the third carrier plate 4 will first enter the processing area S and move directly under the first carrier plate 2 to obtain the used first carrier plate F1a from the first carrier plate 2, and then while (or before) the second carrier plate 3 carries the new first carrier plate F1b and enters the processing area S, the third carrier plate 4 drives the used first carrier plate F1a to the second loading and unloading position L2 of the second area A2, and removes the used first carrier plate F1a through the robotic arm as the second loading and unloading device 6b, so as to move the first carrier plate F1a to the fourth storage box 7d (completing the first sheet exchange process P2). The aforementioned process of storing the first carrier plate F1a moved to the second area A2 can be performed simultaneously with the sheet loading process P1 of the first carrier plate F1b carried by the first carrier plate 2.

[0060] In addition, in one embodiment, the die transfer device 1 can be equipped with a temporary storage box suitable for temporarily storing the first carrier F1a and the first carrier F1b (not shown, but the first storage box 7a and the fourth storage box 7d can also have the function of temporarily storing the first carrier, or a new storage box can be set), and its setting position is, for example, corresponding to the setting position of the first loading and unloading device 6a or / and the second loading and unloading device 6b. In this embodiment, for example, after the second carrier F2 on the second carrier 3 receives a part of the die P on the first carrier F1a, the second carrier 3 can first drive the second carrier F2 to leave the processing area S. Then, the third carrier 4 (with the auxiliary component F10) moves to the processing area S and receives the first carrier F1a from the first carrier 2, and then drives the first carrier F1a to move to the second area A2, and then stores the first carrier F1a in the temporary storage box through the robot arm, and then sets the first carrier F1b in the temporary storage box to the third carrier 4 through the robot arm. After the first carrier F1b is arranged on the first stage 2 in the aforementioned manner, the die transfer between the first carrier F1b and the second carrier F2 is performed. Similarly, after the die P on the required first carrier F1b is transferred, the first carrier F1b can be returned to the temporary storage box through a process similar to the aforementioned process, and the first carrier F1a is arranged on the first stage 2 so as to transfer the die P from the first carrier F1a and the first carrier F1b to the second carrier F2 in a mixed manner. In other words, in one embodiment of the present invention, in the case where a storage box for temporarily storing the first carriers (F1a, F1b, etc.) is provided, the die transfer device 1 can not only perform the one-to-many (transferring the die P from a first carrier F1 to a plurality of different second carriers, proceed to the next paragraph) die transfer operation described in the aforementioned paragraph, but can also perform the many-to-one die transfer operation described in this paragraph.

[0061] For details on carrying the second carrier F2 and transferring the die P, please refer to Figure 1 , Figures 8 to 9D First, the robot arm as the first loading and unloading device 6a takes out the second carrier F2a from the second storage box 7b (because the following description will draw multiple second carriers F2, the second carriers F2a and F2b are used for separation). The robot arm as the first loading and unloading device 6a places the second carrier F2a on the second stage 3. Then, the first camera unit 8a locates the second carrier F2a and performs angle rotation (as shown in FIG. Fig. 9A As shown, the detailed actions can refer to the description of the second stage 3 carrying the first carrier F1). Then, the second stage 3 drives the second carrier F2a into the processing area S and is located directly below the first stage 2. After that, the image obtained by the fourth camera unit 8d taking the second carrier F2a controls the second stage 3 to position and rotate the second carrier F2a. (As shown in FIG. Fig. 9B) After the above processes are completed (after the preparatory process P3 is completed), the die transfer is performed according to the instructions of the control unit.

[0062] Among them, please refer to Figure 1 , Fig. 9C and Fig.9D In the process of transfer, in order to make the processing light beam L, the crystal grain P at a specific position on the first carrier F1, and the predetermined position of the crystal grain P on the second carrier F2a arranged in the same straight line, for example, in the present embodiment, when the first carrier F1 does not move, the support frame 104 drives the projection lens 55 to move relative to the movable platform 102, so that the processing light beam L moves relative to the base 101 and the first carrier F1 along the first direction D1 and the second direction D2, and the processing light beam L moves to the position above the crystal grain P to be transferred from the first carrier F1. The second carrier 3 drives the second carrier F2a to move relative to the movable platform 102 along the first direction D1 and the second direction D2, so that the second carrier F2a moves to the position below the crystal grain P to be transferred from the first carrier F1. In addition, when performing other transfer operations not shown in the figure, such as transfer operations that do not change the relative positions of the crystal grains P, the second carrier 3 may not move, and only the support frame 104 (including the projection lens 55 connected to the support frame 104) moves. By means of the above structure, the die P at a specific position on the first carrier F1, the predetermined position of the die P on the second carrier F2a, and the processing light beam L can be arranged on the same straight line. The die P is separated from the first carrier F1 and transferred to the second carrier F2a along the third direction D3 by the processing light beam L. However, in other embodiments, the detailed alignment method and action can be changed according to the machine design or the type of transfer.

[0063] From the above description, it can be seen that since the second carrier 3 and the third carrier 4 are independent of each other, in one embodiment, when the first carrier F1 is provided to the first carrier 2 and the first carrier F1 is set on the second carrier 3, the second carrier F2 can be set on the third carrier 4 at the same time, and then when the first carrier F1 passes through the second carrier 3 to perform the loading process P1, the second carrier F2 is first positioned and the angle is rotated on the third carrier 4, so that at the same time (or after) the second carrier 3 leaves the processing area S, the third carrier 4 is controlled to drive the second carrier F2 to perform the subsequent grain P transfer operation, but it is not limited to this.

[0064] Please refer to Figure 1 , FIG. 9B to FIG. 11D When the transfer of the die P is completed on a second carrier F2a and there are still die P on the first carrier F1 (such as Fig.11A ), or when the second carrier F2a is being positioned and angled by the fourth camera unit 8d (e.g. Fig. 9B), the robot arm as the second loading and unloading device 6b can take out a new second carrier F2b from the third storage box 7c and place it on the third carrier 4. Then, the second camera unit 8b locates the second carrier F2b and performs angle rotation (such as Fig.11A As shown, the detailed actions can refer to the above description). Then, the second stage 3 leaves the processing area S and enters the first area A1, and the third stage 4 drives the second carrier F2b into the processing area S and is located directly below the first stage 2. After that, the fourth camera unit 8d is used to photograph the second carrier F2b, and the second stage 3 is controlled to position and rotate the second carrier F2b. (As shown in FIG. Fig. 11B ) After the above process is completed (the second chip exchange process P4 is completed), the chip transfer operation is performed according to the instructions of the control unit.

[0065] like Figure 1 , Fig. 11B and Fig. 11C As shown, during the process of correcting the positioning of the second carrier F2b in the processing area S, the second carrier F2a that has been processed and is located at the first loading and unloading position L1 can, for example, be returned to the second storage box 7b by a robotic arm, and then a second carrier F2c to which the grains P have not yet been transferred is taken out of the second storage box 7b by the robotic arm and set on the second carrier 3, and then the positioning and rotation actions of the second carrier F2a as described above are performed again.

[0066] Based on the above description, the die transfer equipment of the embodiment of the present invention has a second carrier and a third carrier that can carry the first carrier or the second carrier. Therefore, while one of the carriers (for example, the second carrier) is performing a die transfer operation in the processing area on the machine, the carrier that is scheduled to perform a die transfer operation can be loaded and unloaded on another carrier (the third carrier) in other areas and prepared, so that after completing one die transfer operation, the next die transfer operation can be quickly performed to improve efficiency. In addition to performing the preparation operation of preparing the carrier to which the die is to be transferred, the preparation operation of preparing the carrier for providing the die can also be performed. In addition, in the embodiment with a storage box suitable for temporarily storing the carriers, the transfer operation of multiple first carriers to a single second carrier or multiple first carriers to multiple second carriers can also be performed.

[0067] Fig.12 This is a simplified schematic diagram of a die transfer device 10a according to another embodiment of the present invention. Figures 1 to 4 as well as Fig.12 As shown, in this embodiment, some components and their arrangement methods can be the same as those described above. Figure 1 The embodiments are the same and therefore will not be described in detail here. Only the differences are described in this paragraph. Fig.12As shown, in this embodiment, the machine 10a includes a base 101 and a mobile platform 102a. Although the mobile platform 102a is also connected to the base 101 through the slide rail 101a in this embodiment, the frame 103a is connected to the base 101 and is suitable for being installed on other slide rails (not shown) and can independently move relative to the mobile platform 102a on the base 101 along the first direction D1 and the second direction D2. The second carrier 3a and the third carrier 4a are fixed at both ends of the mobile platform 102a.

[0068] In other words, in this embodiment, the position of the light spot formed by the processing light beam L on the first carrier F1 is controlled by the movement of the projection lens 55 in the first direction D1 and the second direction D2 and the movement of the frame 103a in the first direction D1 and the second direction D2. The position of the light spot formed by the processing light beam L on the second carrier F2 is controlled by the movement of the moving platform 102a in the first direction D1 and the movement of the supporting seat 302 of the second carrier 3a and the supporting seat 402 of the third carrier 4a in the second direction D2, but the present invention is not limited thereto. In addition, in the aforementioned Figure 1 In the embodiment of the present invention, the function of the track 11 to guide the second carrier 3 and the third carrier 4 to move along the first direction D1 is Fig.12 In the embodiment shown, it is replaced by a slide rail 101 a (also a track, and can also define the processing area S, the first area A1 and the second area A2 ) that guides the mobile platform 102 a .

[0069] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the methods and technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A die transfer device, adapted to transfer a plurality of dies on at least one first carrier to at least one second carrier in turn, characterized in that: include: A machine platform includes a track and a frame located above the track, wherein the track has a processing area located below the frame and a first area and a second area located on both sides of the processing area; A first carrier connected to the frame, the first carrier being suitable for loading or unloading the at least one first carrier plate; a second carrier and a third carrier, each connected to the track, suitable for loading or unloading the at least one first carrier, and also suitable for loading or unloading the at least one second carrier, the second carrier being suitable for moving between the first area of ​​the track and the processing area, the third carrier being suitable for moving between the second area of ​​the track and the processing area, and when one of the second carrier and the third carrier leaves the processing area, the other of the second carrier and the third carrier is suitable for moving into the processing area; and A laser module is adapted to provide a processing beam to the at least one first carrier plate on the first carrier.

2. The die transfer device according to claim 1, characterized in that: The machine further includes a base and a movable platform, the movable platform is connected to the base and is suitable for moving relative to the base along a first direction parallel to the track, the frame is connected to the movable platform and is suitable for moving with the movable platform in the first direction, the track is fixed on the movable platform, the second platform and the third platform are directly connected to the track, and are suitable for moving independently relative to the movable platform.

3. The die transfer device according to claim 2, characterized in that: Each of the second carrier and the third carrier includes a base and a bearing seat, the base is suitable for driving the bearing seat to move along the first direction, the bearing seat is suitable for connecting the at least one first carrier plate or one of the at least one second carrier plates, and driving the at least one first carrier plate or one of the at least one second carrier plates to move relative to the base along a second direction perpendicular to the first direction, and is also suitable for driving the at least one second carrier plate to rotate with the second direction as the axial direction.

4. The die transfer device according to claim 1, characterized in that: The machine further includes a base and a moving platform, the moving platform is connected to the base via the track, the frame is connected to the base and is suitable for moving on the base along a first direction parallel to the track, and the second carrier and the third carrier are fixed at both ends of the moving platform.

5. The die transfer device according to claim 4, characterized in that: Each of the second carrier and the third carrier includes a base and a bearing seat, the base is fixed to the movable platform, the bearing seat is suitable for connecting the at least one first carrier plate or one of the at least one second carrier plates, and driving the at least one first carrier plate or one of the at least one second carrier plates to move relative to the base along a second direction perpendicular to the first direction, and is also suitable for driving the at least one second carrier plate to rotate with the second direction as the axial direction.

6. The die transfer device according to claim 1, characterized in that: The laser module includes the following along the optical path of the processing beam: A laser light source, adapted to provide a laser beam; a beam shaping element, adapted to adjust the laser beam into the processing beam having a flat-top energy distribution; A light mask, adapted to change a spot shape of the processing light beam; a reflector assembly adapted to reflect the processing beam; and A projection lens is suitable for focusing the processing light beam on the at least one first carrier plate, and is also suitable for driving the processing light beam to move in a second direction perpendicular to a first direction parallel to the track.

7. The die transfer device according to claim 1, characterized in that: The die transfer equipment further includes a first loading and unloading device and a second loading and unloading device, wherein the first area has a first loading and unloading position, and the second area has a second loading and unloading position, the first loading and unloading device is suitable for loading and unloading the at least one first carrier or one of the at least one second carrier on the second carrier positioned at the first loading and unloading position, and the second loading and unloading device is suitable for loading and unloading the first carrier or one of the at least one second carrier on the third carrier positioned at the second loading and unloading position.

8. The die transfer device according to claim 7, characterized in that: The die transfer device further comprises: a first camera unit, adapted to photograph the at least one first carrier plate or one of the at least one second carrier plates on the second carrier stage at the first loading and unloading position; and A second photographing unit is adapted to photograph the at least one first carrier plate or one of the at least one second carrier plates on the third carrier stage at the second loading and unloading position.

9. The die transfer device according to claim 1, characterized in that: The die transfer device further includes a photographing unit adapted to photograph the at least one first carrier plate located on the first carrier.

10. The die transfer device according to claim 1, characterized in that: The die transfer equipment further includes a photographing unit adapted to photograph the at least one first carrier plate or one of the at least one second carrier plates on the second carrier plate or the third carrier plate in the processing area.

11. The die transfer device according to claim 1, characterized in that: The machine further includes a support beam, a support component and a flexible connection component. The support beam is movably arranged on the support component, and the support beam is indirectly connected to the support component through the flexible connection component. The laser module is arranged on the support beam and moves along the first direction or the second direction with the support beam.

12. The die transfer device according to claim 11, characterized in that: The machine further includes a driving motor assembly, which is directly connected to the supporting beam and directly connected to the supporting assembly.

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