Water-jet guided laser cutting equipment and system

Abstract

The invention discloses water-jet-guided laser cutting equipment and a water-jet-guided laser cutting system, and relates to the technical field of water-jet-guided lasers. The device comprises a dual-wavelength laser assembly, a reflection assembly, a liquid supply assembly and a coupling assembly. The dual-wavelength laser assembly can generate visible laser and invisible laser and coaxially output the visible laser and the invisible laser to the reflection assembly. The reflection assembly is used for refracting the visible laser and the invisible laser to the coupling assembly. The liquid supply assembly is used for supplying guiding liquid to the coupling assembly. The coupling assembly is provided with a nozzle and a coupling body which are connected with each other and used for coupling the guiding liquid, the visible laser and the invisible laser and outputting the laser through the nozzle. Visibly, the visible laser and the invisible laser with the power far greater than that of the visible laser are simultaneously utilized in the water-guided laser, so that the laser power is improved while the visibility of the liquid jet is ensured, the processing efficiency is further improved, and the cost is reduced.

Description

Technical Field

[0001] The present invention relates to the field of water-guided laser technology, and in particular to a water-guided laser cutting device and system. Background Art

[0002] Water-guided laser technology is a precision machining method that couples a laser beam into a micro-water jet. The laser is totally reflected at the interface between water and air and guided to the surface of the material being machined. The water jet not only guides and constrains the laser, but also cools the machining area, reduces the heat-affected zone, and removes debris generated during machining. This technology can achieve high-precision cutting and micro-machining, and is suitable for machining hard and brittle materials and precision parts.

[0003] In existing water-guided laser technology, infrared lasers with a wavelength of more than 1000 mm are usually used for processing, and infrared cameras are used to observe the trajectory of the laser.

[0004] However, this method is cumbersome to operate and has high cost. Summary of the invention

[0005] This specification provides a water-guided laser cutting device and system to at least partially solve the above-mentioned problems existing in the prior art.

[0006] This manual adopts the following technical solutions: On the one hand, this specification provides a water-guided laser cutting device, including a dual-wavelength laser component, a reflection component, a liquid supply component, and a coupling component: The dual-wavelength laser component is used to generate a coaxially output visible laser and an invisible laser, and coaxially output the visible laser and the invisible laser to the reflective component; the power of the visible laser is less than that of the invisible laser; The reflective component includes a reflective mirror and a fine-tuning structure connected to each other; the reflective mirror is used to refract the visible laser and the invisible laser to the coupling component; the fine-tuning structure is used to adjust the attitude angle of the reflective mirror to adjust the direction of the visible laser and the invisible laser; The liquid supply component is connected to the coupling component and is used to supply the guide liquid to the coupling component; The coupling component is configured with a nozzle and a coupling body that are connected to each other; the coupling body is used to couple the guide liquid, the visible laser and the invisible laser, and output them through the nozzle.

[0007] Preferably, both the visible laser and the invisible laser are pulsed lasers, and the pulse widths are both in the femtosecond level or the picosecond level.

[0008] Preferably, the wavelength range of the visible laser is 495-570 nm.

[0009] Preferably, the dual-wavelength laser assembly includes a pump laser source and a frequency doubler; The pump laser source is capable of generating the invisible laser and outputting the visible laser to the frequency doubler; The temperature of the frequency doubler is in a preset low frequency doubler efficiency range, and the frequency doubler is used to double the photons in a preset proportion range in the non-visible laser to generate visible laser; the frequency doubler is also used to output the visible laser and the non-visible laser that has not been doubled to the reflective component; the low frequency doubler efficiency range corresponds to the preset proportion range.

[0010] Preferably, the water-guided laser cutting equipment further includes a beam expander and a focusing lens; The beam expander is located between the dual-wavelength laser component and the reflective component, and is used to expand and collimate the visible laser and the invisible laser; The focusing mirror is located between the reflection component and the coupling component, and is used to focus the visible laser and the invisible laser so that the beam diameters of the visible laser and the invisible laser are smaller than the diameter of the guide liquid output by the nozzle.

[0011] Preferably, the coupling assembly further includes a fluid circuit connector; The outer surface of the coupling body is provided with a liquid inlet hole and a liquid outlet hole, and the inside is provided with a liquid channel connecting the liquid inlet hole and the liquid outlet hole, and at least a part of the structure of the coupling body is composed of a light-transmitting material, so that the visible laser and the invisible laser can pass through the light-transmitting material and irradiate the liquid outlet hole after irradiating the coupling component; The liquid circuit connector is connected to the liquid inlet hole; The nozzle is connected to the liquid outlet, and the nozzle is provided with a liquid spraying channel; the diameter of the liquid spraying channel is micron level.

[0012] Preferably, the water-guided laser cutting equipment further comprises a high-precision camera; The high-precision camera is adjacent to the reflector, and the direction of the high-precision camera is consistent with the direction of the visible laser and the invisible laser reflected by the reflector, so as to collect images; the image includes the optical paths of the visible laser and the invisible laser and the position of the liquid injection channel.

[0013] Preferably, the liquid supply assembly includes a water pump, a pressure stabilizing device, and a connecting pipeline; The water pump is used to supply the guide liquid to the coupling assembly through the pressure stabilizing device and the connecting pipeline; The pressure stabilizing device is used to stabilize the pressure of the guide liquid.

[0014] Preferably, the coupling assembly further comprises a cooling member, which is disposed inside the coupling body and adjacent to the nozzle, and is used for cooling the cooling body and the nozzle.

[0015] On the other hand, the present specification provides a water-guided laser cutting system, comprising the water-guided laser cutting device provided by any of the above aspects.

[0016] At least one of the above technical solutions adopted in this specification can achieve the following beneficial effects: According to the above content, the water-guided laser cutting equipment includes a dual-wavelength laser component, a reflection component, a liquid supply component and a coupling component. The dual-wavelength laser component can generate visible laser and invisible laser, and coaxially output the visible laser and the invisible laser to the reflection component. The reflection component includes a reflector and a fine-tuning structure connected to each other, and the reflector is used to refract the visible laser and the invisible laser to the coupling component. The fine-tuning structure is used to adjust the attitude angle of the reflector to adjust the direction of the visible laser and the invisible laser. The liquid supply component is connected to the coupling component and is used to supply the guide liquid to the coupling component. The coupling component is configured with a nozzle and a coupling body connected to each other. The coupling body is used to couple the guide liquid, the visible laser and the invisible laser, and output through the nozzle.

[0017] It can be seen that the water-guided laser utilizes both visible laser and invisible laser whose power is much greater than that of the visible laser, which ensures the visibility of the liquid jet while increasing the power of the laser, thereby improving the processing efficiency and reducing the cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide a further understanding of this specification and constitute a part of this specification. The illustrative embodiments and descriptions of this specification are used to explain this specification and do not constitute an improper limitation on this specification. In the drawings: Figure 1 This is a schematic diagram of the structure of a water-guided laser cutting device in this specification; Figure 2 A partial structural schematic diagram of a water-guided laser cutting device provided in one embodiment of this specification; Figure 3 A partial structural schematic diagram of a water-guided laser cutting device provided in one embodiment of this specification; Figure 4 A schematic diagram of the structure of a water-guided laser cutting device provided in one embodiment of this specification; Figure 5 A schematic diagram of the structure of a coupling component provided for one embodiment of this specification; Figure 6 A schematic diagram of the optical path of light reflected inside a guide liquid provided for one embodiment of the present specification; Figure 7 A schematic diagram of the structure of a water-guided laser cutting device provided in one embodiment of this specification.

[0019] Description of reference numerals: Dual-wavelength laser component 1; reflection component 2; liquid supply component 3; coupling component 4; pump laser source 11; beam splitter 12; frequency multiplier 13; beam combiner 14; temperature control component 15; coupling body 41; liquid path connector 42; nozzle 43; light-transmitting material 44; guide liquid 51; visible laser and the invisible laser 52; high-precision camera 6. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of this specification more clear, the technical solutions of this specification will be clearly and completely described below in combination with the specific embodiments of this specification and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0021] In the description of the present invention, it should be noted that the term "or" is generally used in a meaning including "and / or", unless the content clearly indicates otherwise.

[0022] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. In addition, in the description of the present application, the terms "first", "second" and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0023] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] The technical solutions provided by the embodiments of this specification are described in detail below in conjunction with the accompanying drawings.

[0025] Figure 1 This is a schematic diagram of the structure of a water-guided laser cutting device in this specification. Figure 1 As shown, the water-guided laser cutting device includes a dual-wavelength laser component 1, a reflection component 2, a liquid supply component 3 and a coupling component 4.

[0026] Preferably, the dual-wavelength laser assembly 1 is used to generate visible laser and invisible laser, and coaxially output the visible laser and the invisible laser to the reflective assembly 2. The power of the visible laser is lower than that of the invisible laser.

[0027] Preferably, the power of the visible laser is much smaller than that of the invisible laser.

[0028] Preferably, both the visible laser and the invisible laser 52 are pulsed lasers, and the pulse widths are both in the picosecond level or the femtosecond level.

[0029] Those skilled in the art will appreciate that the development of dual-wavelength lasers has been relatively mature, and this specification only provides an exemplary description of the structure of the dual-wavelength laser.

[0030] In one or more preferred embodiments provided in this specification, the dual-wavelength laser includes a pump laser source 11, a beam splitter 12, a frequency doubler 13 and a beam combiner 14. The pump laser source 11 can generate the non-visible laser and output the visible laser to the beam splitter 12. The beam splitter 12 can divide the visible laser into a first component and a second component, and transmit the first component to the beam combiner 14, and transmit the second component to the frequency doubler 13. The frequency doubler 13 can perform frequency doubling on the second component to generate visible laser, and transmit the invisible laser to the beam combiner 14. The beam combiner 14 can combine the first component with the visible laser and coaxially output them to the reflective component 2. The first component is a non-visible laser.

[0031] Figure 2 A partial structural diagram of a water-guided laser cutting device provided in one embodiment of this specification is shown in FIG. Figure 2 As shown, the dual-wavelength laser is composed of a pump laser source 11 , a beam splitter 12 , a frequency doubler 13 and a beam combiner 14 .

[0032] It should be noted that the wavelength of the visible laser is between 400nm and 700nm, and the parameters of the frequency doubler 13 are adapted to the wavelength of the non-visible laser. For example, if the frequency doubler 13 is doubled, the wavelength of the non-visible laser is between 800nm ​​and 1400nm. The beam splitter 12 is a polarization-independent beam splitter 12, and the beam splitting ratio can be set based on needs, but it is necessary to ensure that the average power of the second component is in the microjoule level or millijoule level. For example, the beam splitting ratio can be 1:19, or 1:9, or 3:19, etc., among which the second component accounts for a smaller proportion.

[0033] In one or more preferred embodiments provided in this specification, the dual-wavelength laser includes a pump laser source 11 and a frequency doubler 13. The pump laser source 11 is capable of generating the non-visible laser and outputting the visible laser to the frequency doubler 13. The temperature of the frequency doubler 13 is in a preset low frequency doubler efficiency range, and the frequency doubler 13 is used to double the photons in a preset proportional range in the non-visible laser to generate a visible laser. The frequency doubler 13 is also used to output the visible laser and the non-visible laser that has not been doubled to the reflective component 2. The low frequency doubler efficiency range corresponds to the preset proportional range. Further, the dual-wavelength laser component 1 also includes a temperature control component 15, which is adjacent to the frequency doubler 13 and is used to control the temperature of the frequency doubler 13.

[0034] Figure 3 A partial structural diagram of a water-guided laser cutting device provided in one embodiment of this specification is shown in FIG. Figure 3 As shown, the dual-wavelength laser is composed of a pump laser source 11 , a temperature control component 15 and a frequency multiplier 13 .

[0035] It is understood by those skilled in the art that the frequency doubling efficiency is the proportion of the input signal energy that is successfully converted into the target frequency doubling signal energy. Generally, the frequency doubling efficiency is related to the temperature of the frequency doubling crystal in the frequency multiplier 13, so the frequency doubling efficiency can be adjusted by adjusting the temperature of the frequency multiplier 13. Preferably, the preset ratio is 5%-15%.

[0036] The above content is only an exemplary structure of a dual-wavelength laser provided in this specification. The dual-wavelength laser may also adopt other structures, which are not limited in this specification.

[0037] Preferably, the reflective assembly 2 includes reflective mirrors and a fine-tuning structure that are connected to each other.

[0038] Preferably, the reflector is used to refract the visible laser and the invisible laser to the coupling component 4 .

[0039] Preferably, the fine-tuning structure is used to adjust the attitude angle of the reflector to adjust the directions of the visible laser and the invisible laser.

[0040] Those skilled in the art can understand that, usually, in water-guided laser technology, the diameter of the guide liquid 51 used to guide the laser is only tens or hundreds of microns. Therefore, when the visible laser and the invisible laser are reflected to the coupling component 4 through the reflection component 2, it is necessary to adjust the attitude angle of the reflector through the fine-tuning structure so that the visible laser and the invisible laser are irradiated to the surface of the guide liquid 51.

[0041] Preferably, the liquid supply component 3 is connected to the coupling component 4 for supplying the guide liquid 51 to the coupling component 4 .

[0042] Preferably, the coupling assembly 4 is configured with a nozzle 43 and a coupling body 41 which are connected to each other.

[0043] Preferably, the coupling body 41 is used to couple the guide liquid 51 , the visible laser and the invisible laser 52 , and output them through the nozzle 43 .

[0044] Specifically, the coupling body 41 is used to spray the guide liquid 51 through the nozzle 43 , and is also used to allow the visible laser and the invisible laser 52 to irradiate the guide liquid 51 at the nozzle 43 .

[0045] According to the above embodiment, the water-guided laser cutting equipment includes a dual-wavelength laser component 1, a reflection component 2, a liquid supply component 3 and a coupling component 4. The dual-wavelength laser component 1 can generate visible laser and invisible laser, and coaxially output the visible laser and the invisible laser to the reflection component 2. The reflection component 2 includes a reflector and a fine-tuning structure connected to each other, and the reflector is used to refract the visible laser and the invisible laser to the coupling component 4. The fine-tuning structure is used to adjust the attitude angle of the reflector to adjust the direction of the visible laser and the invisible laser. The liquid supply component 3 is connected to the coupling component 4 to supply the guide liquid 51 to the coupling component 4. The coupling component 4 is configured with a nozzle 43 and a coupling body 41 connected to each other. The coupling body 41 is used to couple the guide liquid 51, the visible laser and the invisible laser 52, and output them through the nozzle 43.

[0046] According to the above content, it can be seen that the water-guided laser uses both visible laser and invisible laser whose power is much greater than that of visible laser, which ensures the visibility of liquid jet while increasing the power of laser, thereby improving processing efficiency and reducing costs.

[0047] Preferably, the wavelength range of the visible laser is 495-570 nm.

[0048] Preferably, the color of the visible laser is green.

[0049] Preferably, the wavelength of the visible laser is 530 nm.

[0050] Preferably, the water-guided laser cutting equipment also includes a beam expander and a focusing lens.

[0051] Preferably, the beam expander is located between the dual-wavelength laser component 1 and the reflective component 2, and is used for expanding and collimating the visible laser and the invisible laser.

[0052] Preferably, the focusing mirror is located between the reflective component 2 and the coupling component 4 and is used to focus the visible laser and the invisible laser so that the beam diameters of the visible laser and the invisible laser are smaller than the diameter of the guide liquid 51 output by the nozzle 43 .

[0053] Figure 4 A schematic diagram of the structure of a water-guided laser cutting device provided in one embodiment of this specification is shown in FIG. Figure 4 As shown, the focusing mirror is located between the reflective component 2 and the coupling component 4 , and the beam expander is located between the dual-wavelength laser component 1 and the reflective component 2 .

[0054] Preferably, the coupling assembly 4 further includes a fluid circuit connector 42 .

[0055] Preferably, the outer surface of the coupling body 41 is provided with a liquid inlet hole and a liquid outlet hole, and the interior is provided with a liquid channel connecting the liquid inlet hole and the liquid outlet hole, and at least part of the structure of the coupling body 41 is composed of a light-transmitting material 44, so that the visible laser and the invisible laser can pass through the light-transmitting material 44 and irradiate the liquid outlet hole after being irradiated to the coupling component 4.

[0056] Preferably, the liquid circuit connector 42 is connected to the liquid inlet.

[0057] Preferably, the nozzle 43 is connected to the liquid outlet, and the nozzle 43 is provided with a liquid spraying channel.

[0058] Preferably, the diameter of the liquid spraying channel is in micrometer order.

[0059] Figure 5 A schematic diagram of the structure of a coupling component 4 provided in one embodiment of this specification is shown in FIG. Figure 5 As shown, the coupling assembly 4 includes a coupling body 41 , a fluid path connector 42 , and a nozzle 43 , and at least a portion of the coupling body 41 is made of a light-transmitting material 44 .

[0060] Those skilled in the art will appreciate that the technology related to the coupling component 4 has been relatively mature, and this specification does not limit the structure of the coupling component 4 .

[0061] Preferably, the visible laser and the invisible laser 52 can be reflected inside the guide liquid 51 .

[0062] Figure 6 A schematic diagram of the optical path of light reflected inside the guide liquid 51 provided for one embodiment of this specification, such as Figure 6 shown.

[0063] Preferably, the water-guided laser cutting equipment also includes a high-precision camera 6 .

[0064] Preferably, the high-precision camera 6 is adjacent to the reflector, and the orientation of the high-precision camera 6 is consistent with the orientation of the visible laser and the invisible laser 52 reflected by the reflector, so as to collect images.

[0065] Preferably, the image includes the optical paths of the visible laser and the invisible laser 52 and the position of the liquid injection channel.

[0066] Figure 7 A schematic diagram of the structure of a water-guided laser cutting device provided in one embodiment of this specification is shown in FIG. Figure 7 As shown, the high-precision camera 6 is adjacent to the reflective component 2 and faces the output direction of the visible laser and the invisible laser 52 reflected by the reflective component 2 .

[0067] Preferably, the liquid supply assembly 3 includes a water pump, a pressure stabilizing device, and a connecting pipeline.

[0068] Preferably, the water pump is used to supply the guide liquid 51 to the coupling assembly 4 through the pressure stabilizing device and the connecting pipeline.

[0069] Preferably, the pressure stabilizing device is used to stabilize the pressure of the guiding liquid 51 .

[0070] It is understood by those skilled in the art that the bubbles in the guide liquid 51 of the water-guided laser need to be as few as possible, while the external water source may lack stability, so the pressure stabilizing device is provided to ensure that the guide liquid 51 meets the requirements.

[0071] Preferably, the liquid supply component 3 is also connected to a water source or a water storage structure.

[0072] Preferably, the coupling assembly 4 further includes a cooling member, which is disposed inside the coupling body 41 and adjacent to the nozzle 43 , and is used for cooling the cooling body and the nozzle 43 .

[0073] Preferably, the non-visible laser is 1064 nm infrared light, and the visible laser is 532 nm green light.

[0074] With the above structure, during the use of the water-guided laser cutting equipment, the user can determine the spray direction of the guide liquid 51 by direct observation so as to adjust the optical path, thereby improving the efficiency and convenience of operation, and eliminating the need to use an infrared camera to observe the laser, thereby reducing costs.

[0075] Furthermore, the use of picosecond or femtosecond lasers further reduces the beam diameters of the visible laser and the invisible laser, so that the visible laser and the invisible laser can adapt to the smaller nozzle 43 and the diameter of the guide liquid 51, thereby improving the processing accuracy. Furthermore, at the same energy, the picosecond or femtosecond laser has a higher peak power, which enhances the laser's ability to penetrate the material and improves the processing efficiency. At the same time, the action time of the picosecond or femtosecond laser is shorter, which reduces the energy attenuation during the transfer process.

[0076] Furthermore, due to its extremely low thermal impact, the action time of picosecond or femtosecond lasers is much shorter than the heat transfer time in the lattice, and almost no heat accumulation will be generated at the nozzle 43, thereby reducing the risk of damage to the nozzle 43. At the same time, the reduction in the thermal effect of the material can also reduce the flow rate of the water column and the difficulty of controlling the water pressure, thereby improving efficiency and reducing costs.

[0077] Preferably, the guide liquid 51 is water, an organic solvent or the like, which is not limited in this specification.

[0078] Preferably, the water-conducting laser cutting device is used to process a target material whose absorption rate to green light with a wavelength of 400-700 nm is lower than a preset processing threshold, that is, the visible laser has little effect on the processing of the target material.

[0079] The above is the water-conducting laser cutting equipment provided in one or more embodiments of this specification. Based on the same idea, this specification also provides a corresponding water-conducting laser cutting system.

[0080] Preferably, the water-conducting laser cutting system includes the water-conducting laser cutting equipment provided by any one of the embodiments.

[0081] In the 1990s, it was very clear whether the improvement of a technology was hardware improvement (for example, improvement of the circuit structure of diodes, transistors, switches, etc.) or software improvement (improvement of the method flow). However, with the development of technology, many improvements of the method flow today can be regarded as direct improvements of the hardware circuit structure. Designers almost always obtain the corresponding hardware circuit structure by programming the improved method flow into the hardware circuit. Therefore, it cannot be said that the improvement of a method flow cannot be implemented with hardware entity modules. For example, a programmable logic device (PLD) (such as a field programmable gate array (FPGA)) is such an integrated circuit whose logical function is determined by the user's programming of the device. Designers can "integrate" a digital system on a PLD by programming it themselves, without having to ask chip manufacturers to design and make dedicated integrated circuit chips. Moreover, nowadays, instead of manually making integrated circuit chips, this kind of programming is mostly implemented by "logic compiler" software, which is similar to the software compiler used when developing and writing programs, and the original code before compilation must also be written in a specific programming language, which is called hardware description language (HDL). There is not only one kind of HDL, but many kinds, such as ABEL (Advanced Boolean Expression Language), AHDL (Altera Hardware Description Language), Confluence, CUPL (Cornell University Programming Language), HDCal, JHDL (Java Hardware Description Language), Lava, Lola, MyHDL, PALASM, RHDL (Ruby Hardware Description Language), etc. The most commonly used ones are VHDL (Very-High-Speed ​​Integrated Circuit Hardware Description Language) and Verilog. Those skilled in the art should also know that it is only necessary to program the method flow slightly in the above-mentioned hardware description languages ​​and program it into the integrated circuit, and then it is easy to obtain the hardware circuit that implements the logic method flow.

[0082] The controller may be implemented in any suitable manner, for example, the controller may take the form of a microprocessor or processor and a computer-readable medium storing a computer-readable program code (e.g., software or firmware) executable by the (micro)processor, a logic gate, a switch, an application-specific integrated circuit (ASIC), a programmable logic controller, and an embedded microcontroller, examples of which include but are not limited to the following microcontrollers: ARC 625D, Atmel AT91SAM, Microchip PIC18F26K20, and Silicone Labs C8051F320, and the memory controller may also be implemented as part of the control logic of the memory. It is also known to those skilled in the art that, in addition to implementing the controller in a purely computer-readable program code manner, the controller may be implemented in the form of a logic gate, a switch, an application-specific integrated circuit, a programmable logic controller, and an embedded microcontroller by logically programming the method steps. Therefore, such a controller may be considered as a hardware component, and the devices for implementing various functions included therein may also be considered as structures within the hardware component. Or even, the devices for implementing various functions may be considered as both software modules for implementing the method and structures within the hardware component.

[0083] The systems, devices, modules or units described in the above embodiments may be implemented by computer chips or entities, or by products with certain functions. A typical implementation device is a computer. Specifically, the computer may be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.

[0084] For the convenience of description, the above device is described in various units according to their functions. Of course, when implementing this specification, the functions of each unit can be implemented in the same or multiple software and / or hardware.

[0085] It will be appreciated by those skilled in the art that embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0086] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0087] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0088] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0089] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0090] The memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0091] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0092] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0093] It should be understood by those skilled in the art that the embodiments of this specification may be provided as methods, systems or computer program products. Therefore, this specification may take the form of a complete hardware embodiment, a complete software embodiment or an embodiment combining software and hardware. Moreover, this specification may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0094] This specification may be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. This specification may also be practiced in distributed computing environments where tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules may be located in local and remote computer storage media, including storage devices.

[0095] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0096] The above description is only an embodiment of this specification and is not intended to limit this specification. For those skilled in the art, this specification may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this specification should be included in the scope of the claims of this application.

Claims

1. A water-guided laser cutting device, characterized in that: Including dual-wavelength laser components, reflection components, liquid supply components and coupling components: The dual-wavelength laser component is used to generate a coaxially output visible laser and an invisible laser, and coaxially output the visible laser and the invisible laser to the reflective component; the power of the visible laser is less than that of the invisible laser; The reflective component includes a reflective mirror and a fine-tuning structure connected to each other; the reflective mirror is used to refract the visible laser and the invisible laser to the coupling component; the fine-tuning structure is used to adjust the attitude angle of the reflective mirror to adjust the direction of the visible laser and the invisible laser; The liquid supply component is connected to the coupling component and is used to supply the guide liquid to the coupling component; The coupling component is configured with a nozzle and a coupling body that are connected to each other; the coupling body is used to couple the guide liquid, the visible laser and the invisible laser, and output them through the nozzle.

2. The water-guided laser cutting equipment according to claim 1, characterized in that: Both the visible laser and the invisible laser are pulse lasers, and the pulse widths are both in the femtosecond level or the picosecond level.

3. The water-guided laser cutting equipment according to claim 2, characterized in that: The wavelength range of the visible laser is 495-570nm.

4. The water-conducting laser cutting equipment according to claim 1, characterized in that: The dual-wavelength laser assembly includes a pump laser source and a frequency doubler; The pump laser source is capable of generating the invisible laser and outputting the visible laser to the frequency doubler; The temperature of the frequency doubler is in a preset low frequency doubler efficiency range, and the frequency doubler is used to double the photons in a preset proportion range in the non-visible laser to generate visible laser; the frequency doubler is also used to output the visible laser and the non-visible laser that has not been doubled to the reflective component; the low frequency doubler efficiency range corresponds to the preset proportion range.

5. The water-conducting laser cutting equipment according to claim 1, characterized in that: The water-guided laser cutting equipment also includes a beam expander and a focusing lens; The beam expander is located between the dual-wavelength laser component and the reflective component, and is used to expand and collimate the visible laser and the invisible laser; The focusing mirror is located between the reflection component and the coupling component, and is used to focus the visible laser and the invisible laser so that the beam diameters of the visible laser and the invisible laser are smaller than the diameter of the guide liquid output by the nozzle.

6. The water-conducting laser cutting device according to any one of claims 1 to 5, characterized in that: The coupling assembly also includes a fluid path connector; The outer surface of the coupling body is provided with a liquid inlet hole and a liquid outlet hole, and the inside is provided with a liquid channel connecting the liquid inlet hole and the liquid outlet hole, and at least a part of the structure of the coupling body is composed of a light-transmitting material, so that the visible laser and the invisible laser can pass through the light-transmitting material and irradiate the liquid outlet hole after irradiating the coupling component; The liquid circuit connector is connected to the liquid inlet hole; The nozzle is connected to the liquid outlet, and the nozzle is provided with a liquid spraying channel; the diameter of the liquid spraying channel is micron level.

7. The water-guided laser cutting equipment according to claim 6, characterized in that: The water-guided laser cutting equipment also includes a high-precision camera; The high-precision camera is adjacent to the reflector, and the direction of the high-precision camera is consistent with the direction of the visible laser and the invisible laser reflected by the reflector, so as to collect images; the image includes the optical paths of the visible laser and the invisible laser and the position of the liquid injection channel.

8. The water-conducting laser cutting device according to any one of claims 1 to 5, characterized in that: The liquid supply assembly includes a water pump, a pressure stabilizing device, and a connecting pipeline; The water pump is used to supply the guide liquid to the coupling assembly through the pressure stabilizing device and the connecting pipeline; The pressure stabilizing device is used to stabilize the pressure of the guide liquid.

9. The water-conducting laser cutting device according to any one of claims 1 to 5, characterized in that: The coupling assembly further includes a cooling member, which is disposed inside the coupling body and adjacent to the nozzle and is used for cooling the cooling body and the nozzle.

10. A water-guided laser cutting system, characterized in that: The invention comprises the water-conducting laser cutting equipment as described in any one of claims 1 to 9.

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