Display module and electronic equipment

Abstract

The embodiment of the invention provides a display module and electronic equipment, and the display module comprises a cover plate, a panel, a back plate, a display chip and a touch chip. The panel comprises a main body part and a protruding part which are connected, the main body part is stacked between the cover plate and the back plate, the protruding part comprises a bending sub-part and a device setting sub-part which are connected, the device setting sub-part is arranged on the side, away from the cover plate, of the back plate, the bending sub-part extends out relative to the peripheral edge of the back plate, and the bending sub-part is connected with the main body part and the device setting sub-part. The display chip and the touch control chip are both fixed and electrically connected with the device setting sub-part.

Description

Technical Field

[0001] The present application relates to the technical field of display module design, and in particular to a display module and an electronic device. Background Art

[0002] With the advancement of technology, consumers are increasingly fond of using thin and light electronic devices. Taking a mobile phone as an example, the convex part of the panel of the mobile phone display module is bent so as to be attached to the back of the display module. The convex part of the panel is provided with a display chip. In addition, the display module also includes a flexible printed circuit board (FPC), which is electrically connected to the end of the convex part of the panel through an anisotropic conductive film (ACF), and the flexible circuit board is also provided on the back of the display module, and extends from the end of the convex part in a direction away from the end of the convex part. Furthermore, a touch chip is provided on the flexible circuit board. This makes the thickness of the area of ​​the display module corresponding to the convex part of the panel and the flexible circuit board larger, which is not conducive to the thinness of the device. Summary of the invention

[0003] The embodiments of the present application provide a display module and an electronic device to solve the problem of how to improve the lightness and thinness of the electronic device equipped with the display module.

[0004] In order to solve the above technical problems, this application is implemented as follows: In a first aspect, an embodiment of the present application provides a display module.

[0005] The display module provided in the embodiment of the present application includes: a cover plate, a panel, a back plate, a display chip and a touch chip; the panel includes a main body portion and a protruding portion connected to each other, the main body portion is stacked between the cover plate and the back plate, the protruding portion includes a connected bending sub-portion and a device setting sub-portion, the device setting sub-portion is arranged on the side of the back plate away from the cover plate, the bending sub-portion extends relative to the outer peripheral edge of the back plate, the bending sub-portion is respectively connected to the main body portion and the device setting sub-portion, the display chip and the touch chip are both fixed and electrically connected to the device setting sub-portion.

[0006] Optionally, the display module further includes an electrical connector, the protruding portion further includes a side extension sub-portion, and the device setting sub-portion is electrically connected to the electrical connector via the side extension sub-portion.

[0007] Optionally, the display chip and the touch chip are both arranged on a side of the device setting sub-section away from the back panel, and the display chip is electrically connected to the electrical connector via the device setting sub-section and the side extension sub-section in sequence, and the touch chip is electrically connected to the electrical connector via the device setting sub-section and the side extension sub-section in sequence.

[0008] Optionally, the display module further includes an electronic component, and the electronic component includes at least one of an inductor, a capacitor, a resistor and a diode; and the electronic component is electrically connected to the device setting sub-section.

[0009] Optionally, the display chip includes a first electrical connection portion, the device setting sub-portion is provided with a second electrical connection portion, and the first electrical connection portion is electrically connected to the second electrical connection portion; and the electronic component is fixedly connected to the display chip.

[0010] Optionally, an insulating member is provided on the periphery of the display chip, one side of the insulating member is connected to the side wall of the display chip, and the other side is connected to the device setting sub-portion, so as to insulate and seal the gap between the side wall of the display chip and the device setting sub-portion; a conductive member is provided on the side of the insulating member facing away from the gap, the electronic component is provided with a third electrical connection portion, and the device setting sub-portion is provided with a fourth electrical connection portion, and the conductive member is electrically connected to the third electrical connection portion and the fourth electrical connection portion, respectively.

[0011] Optionally, the electronic component is arranged on a side of the display chip away from the device setting sub-portion, and the third electrical connection portion is arranged on a side of the electronic component away from the device setting sub-portion.

[0012] Optionally, a pit is provided on a side of the display chip away from the device setting sub-portion, and the third electrical connection portion is provided on a bottom wall of the pit.

[0013] Optionally, the touch chip is integrated into the display chip.

[0014] In a second aspect, an embodiment of the present application provides an electronic device.

[0015] An electronic device provided in an embodiment of the present application, or any display module provided in an embodiment of the present application.

[0016] Optionally, the electronic device further includes a mounting frame, and the display module is connected to the mounting frame.

[0017] At least one of the above technical solutions adopted in the embodiments of the present application can achieve the following beneficial effects: In the embodiments of the present application, the display chip and the touch chip are both arranged in the device setting sub-portion of the panel. Thus, compared with the solutions in the related art, the anisotropic conductive adhesive film and the flexible circuit board are omitted, and by arranging the display chip and the touch chip in the device setting sub-portion, the density of the devices arranged on the protruding portion of the panel is improved, thereby achieving the effect of reducing the area of ​​the local protruding region on the back of the display module, thereby making the electronic device equipped with the display module lighter and thinner.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0020] Figure 1 A top view of a display module provided in an embodiment of the present application; Figure 2 for Figure 1 A bottom view of the display module shown in FIG. Figure 3 for Figure 1 A partial cross-sectional view of the display module along section AA shown in FIG. Figure 4 for Figure 2 A partial schematic diagram of a display module shown in FIG. Figure 5 for Figure 4 A partial cross-sectional view of the display module along section BB shown in FIG. Figure 6 A bottom view of another display module provided in an embodiment of the present application; Figure 7 for Figure 6 A partial schematic diagram of a display module shown in FIG. Figure 8 for Figure 7 A partial cross-sectional view of the display module along the CC section is shown in FIG.

[0021] Description of reference numerals: 100-display module; 110-cover plate; 120-panel; 121-main body; 122-protruding portion; 1221-bending sub-portion; 1222-device setting sub-portion; 12221-second electrical connection portion; 12222-fourth electrical connection portion; 1223-lateral extension sub-portion; 130- back plate; 140 - display chip; 141 - first electrical connection portion; 142 - pit; 1421 - bottom wall; 150-touch chip; 161-electrical connector; 162-electronic component; 1621-third electrical connection portion; 163-insulating member; 164-conductive member; 165-conducting wire; 171 - adhesive portion; 172 - shielding film. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0023] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0024] In addition, although the terms used in this application are selected from well-known and commonly used terms, some terms mentioned in the specification of this application may be selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant parts of the description of this article.

[0025] Furthermore, it is required that the present application be understood not only by the actual terms used but also by the meanings connoted by each term.

[0026] The technical solutions provided by various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.

[0027] The present application embodiment provides a display module. Figures 1 to 8The display module 100 provided in the embodiment of the present application includes: a cover plate 110, a panel 120, a back plate 130, a display chip 140 and a touch chip 150. Exemplarily, the cover plate 110 may be a transparent glass cover plate. The panel may include a flexible substrate, a thin film transistor array, an organic light-emitting layer, a thin film encapsulation layer and a touch layer. The back plate (BP for short) is used to support the panel. The display chip is also called a display IC (Integrated circuit). The touch chip is also called a touch IC.

[0028] Further, in an embodiment of the present application, the panel 120 includes a main body portion 121 and a protruding portion 122 connected to each other. The main body portion 121 is stacked between the cover plate 110 and the back plate 130. The protruding portion 122 includes a bending sub-portion 1221 and a device setting sub-portion 1222 connected to each other. The device setting sub-portion 1222 is arranged on the side of the back plate 130 away from the cover plate 110. The bending sub-portion 1221 extends relative to the outer peripheral edge of the back plate 130, and the bending sub-portion 1221 is respectively connected to the main body portion 121 and the device setting sub-portion 1222. The display chip 140 and the touch chip 150 are both fixed to and electrically connected to the device setting sub-portion 1222.

[0029] In this way, in an embodiment of the present application, the display chip 140 and the touch chip 150 are both arranged in the device setting sub-portion 1222 of the panel 120. In this way, compared with the solutions in the related art, the anisotropic conductive adhesive film and the flexible circuit board are omitted, and by arranging the display chip 140 and the touch chip 150 in the device setting sub-portion 1222, the density of the devices arranged on the protruding portion 122 of the panel 120 is improved, thereby achieving the effect of reducing the area of ​​the local protruding area on the back of the display module, and thus the electronic device equipped with the display module 100 can be relatively light and thin.

[0030] It should be noted that in the prior art, due to the limitation of the touch screen chip packaging structure, the touch screen chip is set on the flexible circuit board using surface mount technology (SMT). With the development of chip technology, the integration of touch screen chips is getting higher and higher, making it possible to set the touch screen chip on the panel. In order to improve the density of devices set on the panel, the inventor of this application proposed a solution to set the touch screen chip on the panel.

[0031] refer to Figure 2 or Figure 6In some embodiments, the display module 100 further includes an electrical connector 161. The protruding portion 122 further includes a side extension sub-portion 1223, and the device setting sub-portion 1222 is electrically connected to the electrical connector 161 via the side extension sub-portion 1223. Exemplarily, the electrical connector 161 may be a board-to-board (BTB) connector. For example, an electronic device equipped with the display module 100 includes a mainboard, and the mainboard is provided with a first board-to-board connector. The panel 120 is connected to the first board-to-board connector on the mainboard via a second board-to-board connector connected to the protruding portion 122, so that the panel 120 is electrically connected to the mainboard.

[0032] In some embodiments, the display chip 140 and the touch chip 150 are both arranged on the side of the device setting sub-section 1222 away from the back plate 130, and the display chip 140 is electrically connected to the electrical connector 161 through the device setting sub-section 1222 and the side extension sub-section 1223 in sequence. The touch chip 150 is also electrically connected to the electrical connector 161 through the device setting sub-section 1222 and the side extension sub-section 1223 in sequence. In this way, the display chip 140 and the touch chip 150 can be electrically connected to the mainboard through the electrical connector 161 respectively; thereby, the display chip 140, the touch chip 150 and the processor on the mainboard can exchange information.

[0033] refer to Figure 6 In some embodiments, the touch chip 150 is integrated with the display chip 140. In other words, a chip having the functions of a touch chip and a display chip can be designed, and the chip is set in the device setting sub-section 1222. In this way, the touch chip 150 and the display chip 140 can be integrated into one chip to improve the integration of the touch chip 150 and the display chip 140. Therefore, by improving the integration of the touch chip 150 and the display chip 140, the area of ​​the area that needs to be reserved on the device setting sub-section 1222 for installing the display chip 140 and the touch chip 150 can be reduced. In this way, the effect of further reducing the area of ​​the local raised area on the back of the display module can be achieved.

[0034] Of course, reference Figure 2 In other embodiments, the display chip 140 and the touch chip 150 may also be two separate chips. In this way, by separately arranging the display chip 140 and the touch chip 150 , the production costs of the display chip 140 and the touch chip 150 can be reduced.

[0035] It should also be noted that with the advancement of technology, chips with the functions of touch chips and display chips may be widely popularized in the future. Therefore, when the costs of chips with the functions of touch chips and display chips decrease, the display module 100 can be directly configured with chips with the functions of touch chips and display chips.

[0036] refer to Figure 4 and Figure 5 , or refer to Figure 7 and Figure 8 In some embodiments, the display module 100 further includes an electronic component 162. The electronic component 162 includes at least one of an inductor, a capacitor, a resistor, and a diode. The electronic component 162 is electrically connected to the device setting sub-section 1222.

[0037] It should be noted that, exemplarily, the control circuit of the display module 100 may need to have functions such as rectification and filtering. The realization of these functions sometimes requires the use of electronic components such as inductors, capacitors, resistors and diodes. Therefore, in some embodiments, it is necessary to set electronic components such as inductors, capacitors and resistors electrically connected to the device setting subsection 1222. Electronic components such as inductors, capacitors and resistors can be flexibly set according to actual needs. Therefore, the specific type of electronic component 162 electrically connected to the device setting subsection 1222 is not described in detail here. In addition, it should be noted that the embodiment of the present application does not limit the number of inductors, capacitors or resistors.

[0038] refer to Figure 4 and Figure 5 , or refer to Figure 7 and Figure 8 In some embodiments, the display chip 140 includes a first electrical connection portion 141. The device setting sub-portion 1222 is provided with a second electrical connection portion 12221, and the first electrical connection portion 141 is electrically connected to the second electrical connection portion 12221.

[0039] Exemplarily, the first electrical connection part 141 of the display chip 140 can be a welding pin, and the second electrical connection part 12221 of the device setting sub-part 1222 can be a soldering pad. The soldering pin can be soldered to the soldering pad, so that the first electrical connection part 141 of the display chip 140 can be fixedly connected and electrically connected to the second electrical connection part 12221 of the device setting sub-part 1222.

[0040] In some embodiments, the electronic component 162 is fixedly connected to the display chip 140. For example, the electronic component 162 can be connected to the display chip 140 during the packaging of the display chip 140. Alternatively, the electronic component 162 can be welded or bonded to the display chip 140. In this way, the integration of the display chip 140 and the electronic component 162 can be improved.

[0041] refer to Figure 5 or reference Figure 8In some embodiments, an insulating member 163 is disposed on the periphery of the display chip 140. One side of the insulating member 163 is connected to the side wall of the display chip 140, and the other side is connected to the device setting sub-portion 1222 to insulate and block the gap between the side wall of the display chip 140 and the device setting sub-portion 1222. Exemplarily, the insulating member 163 may be formed of solidified insulating glue.

[0042] Further, a conductive member 164 is provided on one side of the insulating member 163 away from the gap. The electronic component 162 is provided with a third electrical connection portion 1621. Exemplarily, the third electrical connection portion 1621 is a solder foot or an electrical connection pin of the electronic component 162. The device setting sub-portion 1222 is provided with a fourth electrical connection portion 12222. The conductive member 164 is electrically connected to the third electrical connection portion 1621 and the fourth electrical connection portion 12222, respectively. Exemplarily, the conductive member 164 can be formed by applying silver paste outside the insulating member 163. Alternatively, the conductive member 164 can be formed by soldering.

[0043] It should be noted that the insulating member 163 is mainly used to isolate the conductive member 164 and the first electrical connection portion 141 and the second electrical connection portion 12221 under the display chip 140 to prevent the silver paste or solder liquid from flowing to the area where the first electrical connection portion 141 and the second electrical connection portion 12221 are located during the formation of the conductive member 164, thereby preventing a short circuit from occurring.

[0044] refer to Figure 5 In some embodiments, the electronic component 162 is disposed on a side of the display chip 140 away from the device setting sub-section 1222, and the third electrical connection portion 1621 is disposed on a side of the electronic component 162 away from the device setting sub-section 1222. Exemplarily, when the solder pins of the display chip 140 face downward, the electronic component 162 is disposed on the top of the display chip 140, and the third electrical connection portion 1621 of the electronic component 162 faces upward. In this way, it is convenient to electrically connect the third electrical connection portion 1621 of the electronic component 162 with the fourth electrical connection portion 12222 of the device setting sub-section 1222 by using silver paste or soldering liquid.

[0045] refer to Figure 8 In some embodiments, a side of the display chip 140 away from the device setting sub-portion 1222 is provided with a pit 142, and the third electrical connection portion 1621 is provided on the bottom wall 1421 of the pit 142. In other words, the third electrical connection portion 1621 is provided toward the bottom wall 1421 of the pit 142 and is fixedly connected to the bottom wall 1421 of the pit 142.

[0046] Exemplarily, a pad is disposed on the bottom wall 1421 of the recess 142 of the display chip 140 , and the third electrical connection portion 1621 is welded to the pad, so that the electronic component 162 is fixed and electrically connected to the recess 142 .

[0047] Exemplarily, when the soldering pins of the display chip 140 face downward, a recess 142 is provided on the top of the display chip 140, the electronic component 162 is provided in the recess 142 on the top of the display chip 140, and the third electrical connection portion 1621 (e.g., soldering pin) of the electronic component 162 is soldered to the pad of the bottom wall 1421 of the recess 142 to fix the electronic component 162 at the recess 142 on the top of the display chip 140. It can be understood that by fixing the electronic component 162 at the recess 142 on the top of the display chip 140, the integration of the electronic component 162 and the display chip 140 can be improved.

[0048] For example, when customizing the display chip 140, the production unit of the display chip 140 can be asked to directly integrate the electronic component 162 on the top of the display chip 140. Furthermore, after the production unit provides the display chip 140 with the integrated electronic component 162, the display chip 140 with the integrated electronic component 162 can be soldered to the fourth electrical connection portion 12222 of the device setting sub-section 1222. Further, an insulating member 163 can be provided at the periphery of the soldering foot of the display chip 140. Further, the third electrical connection portion 1621 of the electronic component 162 and the fourth electrical connection portion 12222 of the device setting sub-section 1222 can be electrically connected outside the insulating member 163 by using silver paste or soldering liquid.

[0049] In some embodiments, sometimes it is necessary to electrically connect the electronic components 162. For example, the electronic components 162 include resistors and capacitors, and sometimes it is necessary to electrically connect the resistors and capacitors. Figure 4 or reference Figure 7 In some embodiments, the resistor and the capacitor can be electrically connected by a wire 165. In other words, when the electronic components 162 need to be electrically connected, the electronic components 162 to be connected can be electrically connected by a wire 165. For example, the wire 165 can be a metal wire.

[0050] refer to Figure 3 In some embodiments, the bending sub-portion 1221 and the device setting sub-portion 1222 in the region close to the bending sub-portion 1221 may be glued to form an adhesive portion 171 in the glued region, so as to improve the mechanical strength of the bending sub-portion 1221 by using the adhesive portion 171. Furthermore, a shielding film 172 may be provided on the side of the device setting sub-portion 1222 away from the cover plate 110, wherein the shielding film 172 covers the region where the display chip 140 and the touch chip 150 are located, so as to improve the anti-interference performance of the display chip 140 and the touch chip 150.

[0051] The embodiment of the present application provides an electronic device. The electronic device provided by the embodiment of the present application includes any one of the display modules 100 provided by the embodiment of the present application. In some embodiments, the electronic device further includes a mounting frame, and the display module 100 is connected to the mounting frame.

[0052] Exemplarily, the electronic device may be a mobile phone, a tablet computer, or a wearable device. For example, the wearable device includes a smart watch or a head-mounted display device.

[0053] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0054] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the embodiments of the present application, and the scope of the embodiments of the present application is defined by the appended claims and their equivalents.

Claims

1. A display module, characterized in that: include: A cover plate (110), a panel (120), a back plate (130), a display chip (140) and a touch chip (150); The panel (120) comprises a main body (121) and a protruding portion (122) connected to each other; the main body (121) is stacked between the cover plate (110) and the back plate (130); the protruding portion (122) comprises a bent sub-portion (1221) and a device setting sub-portion (1222) connected to each other; the device setting sub-portion (1222) is arranged on a side of the back plate (130) away from the cover plate (110); the bent sub-portion (1221) protrudes relative to the outer peripheral edge of the back plate (130); the bent sub-portion (1221) is respectively connected to the main body (121) and the device setting sub-portion (1222); and the display chip (140) and the touch chip (150) are both fixed to and electrically connected to the device setting sub-portion (1222).

2. The display module according to claim 1, characterized in that: The display module further comprises an electrical connector (161), the protruding portion (122) further comprises a side extension sub-portion (1223), and the device setting sub-portion (1222) is electrically connected to the electrical connector (161) via the side extension sub-portion (1223).

3. The display module according to claim 2, characterized in that: The display chip (140) and the touch chip (150) are both arranged on a side of the device setting sub-section (1222) away from the back plate (130); the display chip (140) is electrically connected to the electrical connector (161) via the device setting sub-section (1222) and the side extension sub-section (1223) in sequence; and the touch chip (150) is electrically connected to the electrical connector (161) via the device setting sub-section (1222) and the side extension sub-section (1223) in sequence.

4. The display module according to claim 1, characterized in that: The display module further comprises an electronic component (162), wherein the electronic component (162) comprises at least one of an inductor, a capacitor, a resistor and a diode; and the electronic component (162) is electrically connected to the device setting sub-section (1222).

5. The display module according to claim 4, characterized in that: The display chip (140) comprises a first electrical connection portion (141), the device setting sub-portion (1222) is provided with a second electrical connection portion (12221), and the first electrical connection portion (141) is electrically connected to the second electrical connection portion (12221); The electronic component (162) is fixedly connected to the display chip (140).

6. The display module according to claim 5, characterized in that: An insulating member (163) is provided on the periphery of the display chip (140); one side of the insulating member (163) is connected to the side wall of the display chip (140), and the other side is connected to the device setting sub-portion (1222), so as to insulate and seal the gap between the side wall of the display chip (140) and the device setting sub-portion (1222); A conductive member (164) is provided on a side of the insulating member (163) facing away from the gap, the electronic component (162) is provided with a third electrical connection portion (1621), the device setting sub-portion (1222) is provided with a fourth electrical connection portion (12222), and the conductive member (164) is electrically connected to the third electrical connection portion (1621) and the fourth electrical connection portion (12222), respectively.

7. The display module according to claim 6, characterized in that: The electronic component (162) is arranged on a side of the display chip (140) away from the device setting sub-section (1222), and the third electrical connection portion (1621) is arranged on a side of the electronic component (162) away from the device setting sub-section (1222).

8. The display module according to claim 6, characterized in that: A pit (142) is provided on a side of the display chip (140) that is away from the device setting sub-portion (1222), and the third electrical connection portion (1621) is provided on a bottom wall (1421) of the pit (142).

9. The display module according to claim 1, characterized in that: The touch control chip (150) is integrated with the display chip (140).

10. An electronic device, characterized in that: include: A mounting frame and a display module according to any one of claims 1 to 9, wherein the display module is connected to the mounting frame.

Images