Coil electronic component

Abstract

The invention provides a coil electronic component. The coil electronic component includes: a first coil and a second coil; a main body surrounding the first coil and the second coil and exposing both ends of the first coil and both ends of the second coil to the outside thereof, and including a magnetic material; and an external electrode connected to the exposed end of the first coil and the exposed end of the second coil. At least one of the external electrodes includes an intermetallic compound disposed on a respective one of the exposed ends of the first coil and the exposed ends of the second coil.

Description

Technical Field

[0001] The present disclosure relates to a coil electronic assembly. Background Art

[0002] As power consumption has increased as mobile devices have recently provided various functions, coil electronic components with low loss and excellent efficiency have been used around power management integrated circuits (PMICs) to extend battery life of the mobile devices.

[0003] A coil electronic component having a coupled inductor structure in which a first coil and a second coil are stacked may use a four-terminal structure in which four external electrodes are connected to the first coil and the second coil. The external electrode having the four-terminal structure may be smaller than the external electrode having the two-terminal structure, and thus has a weak adhesive strength. Therefore, a method for increasing the adhesive strength of the external electrode having the four-terminal structure is needed. Summary of the invention

[0004] The present disclosure seeks to provide a coil electronic component having a coupled inductor structure capable of increasing the bonding strength of an external electrode and a body.

[0005] However, the problems to be solved by the embodiments of the present disclosure are not limited to the above-mentioned problems, and can be variously extended within the scope of the spirit of the present disclosure included in the embodiments.

[0006] According to an embodiment, a coil electronic component may include: a first coil and a second coil; a body that surrounds the first coil and the second coil and exposes both ends of the first coil and both ends of the second coil to the outside of the body, and includes a magnetic material; and external electrodes connected to the exposed ends of the first coil and the second coil. At least one of the external electrodes may include an intermetallic compound disposed on a corresponding exposed end of the exposed end of the first coil and the exposed end of the second coil.

[0007] The at least one of the external electrodes may further include: a conductive resin layer in contact with the intermetallic compound; and an electrode layer connected to the conductive resin layer.

[0008] The conductive resin layer may include: a base resin; a plurality of metal particles disposed in the base resin; and a conductive connection portion surrounding the plurality of metal particles and contacting the intermetallic compound.

[0009] The electrode layer may be disposed on the conductive resin layer and in contact with the conductive connection portion.

[0010] The intermetallic compound may be in the form of a plurality of islands.

[0011] The intermetallic compound may include silver (Ag)-tin (Sn).

[0012] The plurality of metal particles may have one of a spherical shape, a flake shape, and a mixture of the spherical shape and the flake shape.

[0013] The first coil may include at least one turn of a first conductive wire, and the second coil may include at least one turn of a second conductive wire.

[0014] The first coil may include first and second lead-out portions exposed to the outside of the body, and the second coil may include third and fourth lead-out portions exposed to the outside of the body.

[0015] The intermetallic compound may be disposed on an exposed surface of the first lead-out portion, an exposed surface of the second lead-out portion, an exposed surface of the third lead-out portion, and an exposed surface of the fourth lead-out portion, respectively.

[0016] The external electrode may include a first external electrode connected to the first lead-out portion, a second external electrode connected to the second lead-out portion, a third external electrode connected to the third lead-out portion, and a fourth external electrode connected to the fourth lead-out portion.

[0017] According to another embodiment, a coil electronic component may include: a first coil and a second coil; a body that surrounds the first coil and the second coil and exposes both ends of the first coil and both ends of the second coil to the outside of the body, and includes a magnetic material; a metal layer that is disposed outside the body and contacts the exposed end of the first coil and the exposed end of the second coil, respectively; and an external electrode connected to the metal layer. At least one of the external electrodes may include an intermetallic compound that is disposed on the corresponding metal layer.

[0018] The metal layer may include copper (Cu).

[0019] The at least one of the external electrodes may further include: a conductive resin layer in contact with the intermetallic compound; and an electrode layer connected to the conductive resin layer.

[0020] The conductive resin layer may include: a base resin; a plurality of metal particles disposed in the base resin; and a conductive connection portion surrounding the plurality of metal particles and contacting the intermetallic compound.

[0021] The electrode layer may be disposed on the conductive resin layer and in contact with the conductive connection portion.

[0022] The intermetallic compound may include silver (Ag)-tin (Sn).

[0023] The first coil may include first and second lead-out portions exposed to the outside of the body, and the second coil may include third and fourth lead-out portions exposed to the outside of the body.

[0024] The intermetallic compound may be disposed on an exposed surface of the first lead-out portion, an exposed surface of the second lead-out portion, an exposed surface of the third lead-out portion, and an exposed surface of the fourth lead-out portion, respectively.

[0025] The external electrode may include a first external electrode connected to the first lead-out portion, a second external electrode connected to the second lead-out portion, a third external electrode connected to the third lead-out portion, and a fourth external electrode connected to the fourth lead-out portion.

[0026] According to another embodiment, a coil electronic component may include: a body including a magnetic material; a first coil disposed in the body and including a first lead-out portion and a second lead-out portion extending to one surface of the body; a second coil stacked above or below the first coil inside the body and including a third lead-out portion and a fourth lead-out portion extending to the one surface of the body; a first external electrode, a second external electrode, a third external electrode, and a fourth external electrode disposed on the one surface of the body to be connected to the first lead-out portion, the second lead-out portion, the third lead-out portion, and the fourth lead-out portion, respectively; and a metal layer disposed between at least one of the first external electrode, the second external electrode, the third external electrode, and the fourth external electrode and a corresponding lead-out portion of the first lead-out portion, the second lead-out portion, the third lead-out portion, and the fourth lead-out portion. The area of ​​the metal layer may be larger than the area of ​​the exposed surface of the corresponding lead-out portion of the first lead-out portion, the second lead-out portion, the third lead-out portion, and the fourth lead-out portion exposed from the one surface of the body.

[0027] At least one of the first, second, third, and fourth external electrodes may include an intermetallic compound disposed on the metal layer; a conductive resin layer contacting the intermetallic compound; and an electrode layer connected to the conductive resin layer.

[0028] The coil electronic component according to the embodiment may include a coupled inductor structure capable of increasing an adhesive strength of an external electrode having a four-terminal structure and a body. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a perspective view schematically showing a coil electronic component according to an embodiment.

[0030] Figure 2 It is schematically shown Figure 1 A plan view of the coil electronics assembly.

[0031] Figure 3 It is schematically shown Figure 1 Bottom perspective view of the coil electronics assembly.

[0032] Figure 4 is along Figure 1 Schematic cross-sectional view taken along line IV-IV' in FIG.

[0033] Figure 5 It is schematically shown Figure 1 A partially enlarged cross-sectional view of a lead-out portion and an external electrode of a coil electronic component is a diagram showing that the conductive resin layer includes spherical metal particles.

[0034] Figure 6 It is schematically shown Figure 1 A partially enlarged cross-sectional view of a lead-out portion and an external electrode of a coil electronic component is a diagram showing that the conductive resin layer includes flaky metal particles.

[0035] Figure 7 It is schematically shown Figure 1 1 is a partially enlarged cross-sectional view of a lead-out portion and an external electrode of a coil electronic component, and is a view showing that the conductive resin layer includes both spherical metal particles and flaky metal particles.

[0036] Figure 8 is a perspective view schematically showing a coil electronic component according to another embodiment.

[0037] Fig. 9 is a perspective view schematically showing a coil electronic component according to still another embodiment.

[0038] Fig.10 is a perspective view schematically showing a coil electronic component according to still another embodiment.

[0039] Fig.11 It is schematically shown Fig.10 A partially enlarged cross-sectional view of the lead-out portion and external electrodes of a coil electronic component. DETAILED DESCRIPTION

[0040] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present disclosure belongs can easily practice the present disclosure. Parts irrelevant to the description are omitted to clearly describe the present disclosure, and throughout the specification, the same or similar components are represented by the same reference numerals. In addition, it will be noted that some components shown in the drawings are exaggerated, omitted or schematically shown, and the size of each component does not accurately reflect its actual size.

[0041] It should be understood that the drawings are provided only to facilitate understanding of the embodiments of the present disclosure, and the spirit of the present disclosure is not limited to the drawings, and the present disclosure includes all modifications, equivalents, and replacements included in the spirit and scope of the present disclosure.

[0042] Terms including ordinal numbers such as "first", "second", etc. may be used to describe various components. However, these components are not limited by these terms. These terms are used only to distinguish one component from another.

[0043] Furthermore, when an element such as a layer, film, region, or plate is referred to as being “on” or “over” another element, the element may be “directly on” the other element or may have a third element interposed therebetween. Conversely, when an element is referred to as being “directly on” another element, there is no third element interposed therebetween. Furthermore, when an element is referred to as being “on” or “over” a reference element, the element may be located above or below the reference element, and is not necessarily “on” or “over” the reference element in a direction opposite to the direction of gravity.

[0044] It should be understood that the terms "include" and "comprises" used in this specification indicate the presence of features, numbers, steps, operations, components, parts, or combinations thereof mentioned in this specification, and do not exclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. Unless explicitly described to the contrary, "include" any component will be understood to imply the inclusion of other components, but not the exclusion of other components.

[0045] Furthermore, throughout the specification, the expression “on a plane” may refer to observing a target portion from the top, and the expression “on a cross section” may refer to observing a cross section formed by cutting the target portion in a vertical direction from a side thereof.

[0046] Furthermore, when it is mentioned that any component is “connected” to another component, it may mean not only that two or more components are directly connected to each other but also that two or more components are indirectly connected to each other through another component, not only that two or more components are physically connected to each other but also that two or more components are electrically connected to each other, or that two or more components are a single entity but are referred to by different names according to their positions or functions.

[0047] Figure 1 is a perspective view schematically showing a coil electronic component according to an embodiment, Figure 2 It is schematically shown Figure 1 A plan view of the coil electronics assembly, Figure 3 It is schematically shown Figure 1 Bottom perspective view of the coil electronics assembly. Figure 4 is along Figure 1A schematic cross-sectional view taken along line IV-IV' in FIG. Figure 5 , Figure 6 and Figure 7 It is schematically shown Figure 1 A partially enlarged cross-sectional view of the lead-out portion and the outer electrode of the coil electronic component, Figure 5 is a diagram showing that the conductive resin layer includes spherical metal particles, Figure 6 is a diagram showing that the conductive resin layer includes flaky metal particles, Figure 7 is a diagram showing that the conductive resin layer includes both spherical metal particles and flaky metal particles.

[0048] Reference Figures 1 to 7 , the coil electronic component 1000 according to the embodiment may include a body 100 , a first coil 200 , a second coil 300 , a first external electrode 500 , a second external electrode 600 , a third external electrode 700 , and a fourth external electrode 800 .

[0049] The body 100 may have a substantially straight parallelepiped shape, but the present embodiment is not limited thereto. Since the magnetic powder and the like shrink during sintering, the body 100 may have a substantially straight parallelepiped shape, but not a completely straight parallelepiped shape. For example, the body 100 may have a substantially straight parallelepiped shape, but portions corresponding to corners or vertices may have rounded shapes.

[0050] In this embodiment, for the sake of convenience of explanation, the two relative surfaces of the main body 100 in the length direction (or L-axis direction) are respectively defined as the first surface S1 and the second surface S2, the two relative surfaces of the main body 100 in the width direction (or W-axis direction) are respectively defined as the third surface S3 and the fourth surface S4, and the two relative surfaces of the main body 100 in the thickness direction (or T-axis direction) are respectively defined as the fifth surface S5 and the sixth surface S6.

[0051] The length of the coil electronic component 1000 may refer to the maximum value among the lengths of a plurality of line segments parallel to the length direction (or L-axis direction) and each connecting the two outermost boundary lines of the coil electronic component 1000 that are opposite to each other in the length direction (or L-axis direction) as shown in an optical microscope photograph or a scanning electron microscope (SEM) photograph of a cross section taken along the length direction (or L-axis direction) and the thickness direction (or T-axis direction) at the center of the coil electronic component 1000 in the width direction (or W-axis direction). Alternatively, the length of the coil electronic component 1000 may refer to the minimum value among the lengths of a plurality of line segments parallel to the length direction (or L-axis direction) and each connecting the two outermost boundary lines of the coil electronic component 1000 that are opposite to each other in the length direction (or L-axis direction) as shown in the photograph of the above cross section. Optionally, the length of the coil electronic component 1000 may refer to the arithmetic mean of the lengths of at least two line segments among the multiple line segments shown in the above-mentioned cross-sectional photograph, which are parallel to the length direction (or L-axis direction) and each connects the two outermost boundary lines of the coil electronic component 1000 that are opposite to each other in the length direction (or L-axis direction).

[0052] The thickness of the coil electronic component 1000 may refer to the maximum value among the lengths of a plurality of line segments parallel to the thickness direction (or T-axis direction) and each connecting the two outermost boundary lines of the coil electronic component 1000 that are opposite to each other in the thickness direction (or T-axis direction) as shown in an optical microscope photograph or a scanning electron microscope (SEM) photograph of a cross section taken along the length direction (or L-axis direction) and the thickness direction (or T-axis direction) at the center of the coil electronic component 1000 in the width direction (or W-axis direction). Alternatively, the thickness of the coil electronic component 1000 may refer to the minimum value among the lengths of a plurality of line segments parallel to the thickness direction (or T-axis direction) and each connecting the two outermost boundary lines of the coil electronic component 1000 that are opposite to each other in the thickness direction (or T-axis direction) as shown in the photograph of the above cross section. Optionally, the thickness of the coil electronic component 1000 may refer to the arithmetic mean of the lengths of at least two line segments among a plurality of line segments shown in the above-mentioned cross-sectional photograph, which are parallel to the thickness direction (or T-axis direction) and respectively connect the two outermost boundary lines of the coil electronic component 1000 that are opposite to each other in the thickness direction (or T-axis direction).

[0053] The width of the coil electronic component 1000 may refer to the maximum value among the lengths of a plurality of line segments parallel to the width direction (or W-axis direction) and each connecting the two outermost boundary lines of the coil electronic component 1000 opposite to each other in the width direction (or W-axis direction) as shown in an optical microscope photograph or a scanning electron microscope (SEM) photograph of a cross section taken along the length direction (or L-axis direction) and the width direction (or W-axis direction) at the center of the coil electronic component 1000 in the thickness direction (or T-axis direction). Alternatively, the width of the coil electronic component 1000 may refer to the minimum value among the lengths of a plurality of line segments parallel to the width direction (or W-axis direction) and each connecting the two outermost boundary lines of the coil electronic component 1000 opposite to each other in the width direction (or W-axis direction) as shown in the photograph of the above cross section. Optionally, the width of the coil electronic component 1000 may refer to the arithmetic mean of the lengths of at least two line segments among multiple line segments shown in the above-mentioned cross-sectional photograph, which are parallel to the width direction (or W-axis direction) and each connects the two outermost boundary lines of the coil electronic component 1000 that are opposite to each other in the width direction (or W-axis direction).

[0054] In addition, each of the length, width, and thickness of the coil electronic component 1000 can be measured using a micrometer measurement method. In the micrometer measurement method, a zero point is set with a micrometer that provides metrological repeatability and reproducibility (Gage R&R), the coil electronic component 1000 according to the present embodiment is inserted between the tips of the micrometer, and the measuring rod of the micrometer is rotated for measurement. In addition, when the length of the coil electronic component 1000 is measured by the micrometer measurement method, the length of the coil electronic component 1000 can represent a value measured once or an arithmetic mean of values ​​measured multiple times. This method can also be applied to measuring the width and thickness of the coil electronic component 1000.

[0055] The main body 100 constitutes the outside of the coil electronic component 1000 and is a space in which a magnetic circuit is formed when current is applied to the first coil 200 through the first external electrode 500 and the second external electrode 600 and current is applied to the second coil 300 through the third external electrode 700 and the fourth external electrode 800, and the magnetic circuit is a path through which the magnetic flux induced by the first coil 200 and the magnetic flux induced by the second coil 300 pass.

[0056] The body 100 surrounds and encloses the first coil 200 and the second coil 300, and includes a magnetic material. The body 100 may include magnetic particles and an insulating material, and the magnetic particles are dispersed in the insulating material.

[0057] The magnetic particles may include first metal magnetic particles, second metal magnetic particles having a larger particle size than the first metal magnetic particles, and third metal magnetic particles having a larger particle size than the second metal magnetic particles.50 The average particle size D of the second metal magnetic particles may be greater than or equal to 0.1 μm and less than or equal to 0.2 μm. 50 The average particle size D of the third metal magnetic particles may be greater than or equal to 1 μm and less than or equal to 2 μm. 50 It may be greater than or equal to 25 μm and less than or equal to 30 μm.

[0058] The magnetic particles may be ferrite particles or metal magnetic particles exhibiting magnetic properties.

[0059] The ferrite particles may include, for example, at least one of spinel ferrite particles (such as Mg-Zn-based ferrite particles, Mn-Zn-based ferrite particles, Mn-Mg-based ferrite particles, Cu-Zn-based ferrite particles, Mg-Mn-Sr-based ferrite particles and Ni-Zn-based ferrite particles), hexagonal ferrite particles (such as Ba-Zn-based ferrite particles, Ba-Mg-based ferrite particles, Ba-Ni-based ferrite particles, Ba-Co-based ferrite particles and Ba-Ni-Co-based ferrite particles), garnet-type ferrite particles (such as Y-based ferrite particles) and Li-based ferrite particles.

[0060] The metal magnetic particles may include two or more types of particles having different compositions, and may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metal magnetic particles may include at least one of pure iron, Fe-Si-based alloys, Fe-Si-Al-based alloys, Fe-Ni-based alloys, Fe-Ni-Mo-based alloys, Fe-Ni-Mo-Cu-based alloys, Fe-Co-based alloys, Fe-Ni-Co-based alloys, Fe-Cr-based alloys, Fe-Cr-Si-based alloys, Fe-Si-Cu-Nb-based alloys, Fe-Ni-Cr-based alloys, and Fe-Cr-Al-based alloys. Here, different compositions of the metal magnetic particles may mean different contents.

[0061] The metal magnetic particles may be amorphous or crystalline. For example, the metal magnetic particles may be Fe-Si-B-Cr based amorphous alloys, but the present disclosure is not limited thereto. The metal magnetic particles may have an average particle size of about 0.1 μm to about 30 μm, but are not limited thereto. In this specification, the average particle size may be referred to as D 90 or D 50 The particle size distribution is a parameter indicating the proportion of particles of a certain size (or particle diameter) contained in a particle group to be measured. The particle size distribution is well known to those skilled in the art. 90 or D 50 (The particle size corresponding to 90% or 50% of the cumulative volume of the particle size distribution) refers to the average particle size.

[0062] The metal magnetic particles may be two or more types of different metal magnetic particles. Here, different types of metal magnetic particles means that the metal magnetic particles are distinguished from each other in at least one of average particle size, composition, composition ratio, crystallinity and shape.

[0063] The insulating material may include epoxy, polyimide, liquid crystal polymer (LCP), etc., alone or in combination, but is not limited thereto.

[0064] There is no particular limitation on the method of forming the body 100. For example, the body 100 may be formed by placing a sheet made of a magnetic material on the upper and lower portions of the first and second coils 200 and 300, and then pressing and curing the sheet.

[0065] The first coil 200 and the second coil 300 may be disposed inside the body 100, exhibiting characteristics of the coil electronic component 1000. For example, when the coil electronic component 1000 according to the embodiment is used as a power inductor, when current is applied to the first coil 200 and the second coil 300, the coil electronic component 1000 may be used to stabilize power of an electronic device by storing energy in the form of a magnetic field and maintaining an output voltage.

[0066] The first coil 200 and the second coil 300 may be magnetically coupled to each other, thereby forming a coupled inductor structure.

[0067] The first coil 200 and the second coil 300 may be in the form of a spirally wound metal (e.g., copper (Cu) or silver (Ag)) wire with an insulating material coated on the surface. That is, the first coil 200 and the second coil 300 may be wound coils. Each of the first coil 200 and the second coil 300 is not limited to a single wire, but may include a twisted wire or two or more wires.

[0068] The first coil 200 and the second coil 300 may be circular coils, but are not limited thereto. For example, the first coil 200 and the second coil 300 may be various known coils such as rectangular coils.

[0069] A cross section of a single wire of each of the first coil 200 and the second coil 300 may have various known shapes such as a rectangular shape, a circular shape, or an elliptical shape.

[0070] The first coil 200 and the second coil 300 may have a plurality of turns and may be edgewise coils.

[0071] For example, the first coil 200 may have an outermost coil C1 and an innermost coil C2 in the direction from the fifth surface S5 to the sixth surface S6 of the body 100. In addition, although not shown in the drawings, at least one intermediate coil may be provided between the outermost coil C1 and the innermost coil C2.

[0072] Similarly, the second coil 300 may have an outermost coil C1' and an innermost coil C2' in the direction from the sixth surface S6 to the fifth surface S5 of the body 100. In addition, although not shown in the drawings, at least one intermediate coil may be provided between the outermost coil C1' and the innermost coil C2'.

[0073] The insulating film IF may be disposed along the surface of each of the plurality of turns of the first coil 200 and the second coil 300. The insulating film IF is used to protect the plurality of turns of the first coil 200 and the second coil 300 and insulate the plurality of turns of the first coil 200 and the second coil 300, and the insulating film IF may include a known insulating material such as polyparaxylene. The insulating material included in the insulating film IF is not particularly limited and may be any insulating material. For example, the insulating film IF may be a polyurethane resin, a polyester resin, an epoxy resin, or a polyamide-imide resin. The insulating film IF may be formed by a method such as vapor deposition, but is not limited thereto.

[0074] In addition, the shapes of the first coil 200 and the second coil 300 are not limited to the above shapes, and may have various known shapes. For example, the first coil 200 may have an outermost coil, one or more intermediate coils, and an innermost coil in sequence in the direction from the outer surface of the body 100 to the inside. Similarly, the second coil 300 may have an outermost coil, one or more intermediate coils, and an innermost coil in sequence in the direction from the outer surface of the body 100 to the inside.

[0075] The first coil 200 may include a winding portion 210 and a lead-out portion 220 .

[0076] The winding portion 210 may be a portion of the metal wire including at least one turn.

[0077] The lead-out portions 220 may extend from both ends of the winding portion 210, respectively, and each of the lead-out portions 220 is exposed from the sixth surface S6 of the body 100. The lead-out portion 220 may include a first lead-out portion 223 and a second lead-out portion 225. The first lead-out portion 223 extends from one end of the winding portion 210 and is exposed from the sixth surface S6 of the body 100, and the second lead-out portion 225 extends from the other end of the winding portion 210 and is exposed from the sixth surface S6 of the body 100. The positions where the first lead-out portion 223 and the second lead-out portion 225 are exposed from the sixth surface S6 of the body 100 may be spaced apart from each other in the length direction (or L-axis direction), but are not limited thereto.

[0078] The second coil 300 may include a winding portion 310 and a lead-out portion 320 .

[0079] The winding portion 310 may be a portion of the metal wire including at least one turn.

[0080] The lead-out portions 320 may extend from both ends of the winding portion 310, respectively, and each of the lead-out portions 320 is exposed from the sixth surface S6 of the body 100. The lead-out portion 320 may include a first lead-out portion 323 and a second lead-out portion 325. The first lead-out portion 323 extends from one end of the winding portion 310 and is exposed from the sixth surface S6 of the body 100, and the second lead-out portion 325 extends from the other end of the winding portion 310 and is exposed from the sixth surface S6 of the body 100. The positions where the first lead-out portion 323 and the second lead-out portion 325 are exposed from the sixth surface S6 of the body 100 may be spaced apart from each other in the length direction (or L-axis direction), but are not limited thereto.

[0081] Although it has been described above that both the lead-out portion 220 of the first coil 200 and the lead-out portion 320 of the second coil 300 are exposed from the sixth surface S6 of the body 100, the present embodiment is not limited thereto. For example, the lead-out portion 220 of the first coil 200 may be exposed from the third surface S3 of the body 100, and the lead-out portion 320 of the second coil 300 may be exposed from the fourth surface S4 of the body 100.

[0082] The first and second external electrodes 500 and 600 are disposed outside the body 100 and are electrically connected to the first coil 200 .

[0083] The first external electrode 500 is disposed on the sixth surface S6 of the body 100 , and the first lead-out portion 223 of the first coil 200 is exposed from the sixth surface S6 of the body 100 and connected to the first external electrode 500 .

[0084] The second external electrode 600 is disposed on the sixth surface S6 of the body 100 , and the second lead-out portion 225 of the first coil 200 is exposed from the sixth surface S6 of the body 100 and connected to the second external electrode 600 .

[0085] The first external electrode 500 may include an intermetallic compound 510 , a conductive resin layer 520 , and an electrode layer 530 .

[0086] An intermetallic compound (IMC) 510 is disposed on both exposed ends of the first coil 200. That is, the intermetallic compound 510 is disposed on each of the exposed surface of the first lead-out portion 223 and the exposed surface of the second lead-out portion 225. The intermetallic compound 510 may be in the form of a plurality of islands and may include silver (Ag)-tin (Sn). In addition, the plurality of islands may be layered. For example, the intermetallic compound 510 in the form of a plurality of islands may mean that the plurality of intermetallic compounds 510 are discontinuous with each other or the intermetallic compound 510 includes a plurality of portions spaced apart from each other.

[0087] The conductive resin layer 520 may make contact with the exposed portion of the first lead-out portion 223 of the first coil 200 and the intermetallic compound 510. In addition, the conductive resin layer 520 may cover a portion of the sixth surface S6 of the body 100.

[0088] The conductive resin layer 520 may include a base resin 521 , a plurality of metal particles 523 , and a conductive connection part 525 .

[0089] The conductive resin layer 520 may be formed by applying a conductive paste in which a base resin and metal powder are dispersed to the sixth surface S6 of the body 100, and then drying and curing it. That is, the base resin of the conductive paste may become the base resin 521 of the conductive resin layer 520, and the metal powder of the conductive paste may become the conductive connection portion 525 of the conductive resin layer 520.

[0090] The conductive paste may include a first metal powder and a second metal powder.

[0091] The first metal included in the first metal powder may be a low melting point metal. That is, the first metal may be a metal having a melting point lower than the curing temperature of the matrix resin. The first metal may be, for example, tin (Sn) or an alloy including tin (Sn) (such as tin (Sn)-bismuth (Bi) alloy, tin (Sn)-lead (Pb) alloy, tin (Sn)-copper (Cu) alloy, tin (Sn)-silver (Ag) alloy, and tin (Sn)-silver (Ag)-copper (Cu) alloy).

[0092] The second metal included in the second metal powder may be a high melting point metal. That is, the second metal may be a metal having a melting point higher than the melting point of the first metal and the curing temperature of the matrix resin. The second metal may be, for example, copper (Cu), silver (Ag), nickel (Ni), etc.

[0093] In the above drying and curing process, pressure and heat may cause particles of the first metal powder (hereinafter referred to as “first metal particles”) to melt and react with particles of the second metal powder (hereinafter referred to as “second metal particles”) to form conductive connection portions 525 .

[0094] Some of the second metal particles in the conductive paste may not fully react with the first metal particles and remain. In this case, the remaining second metal particles may exist in the conductive resin layer and be covered by the melted first metal particles. In addition, all of the second metal particles in the conductive paste may react with the first metal particles. In this case, the metal particles may not exist in the conductive resin layer. However, for ease of explanation, the present embodiment will be described below on the premise that the metal particles (i.e., the second metal particles) exist in the conductive resin layer.

[0095] The matrix resin 521 may include a thermosetting resin having electrical insulation properties. For example, the thermosetting resin may include an epoxy resin. However, the present embodiment is not limited thereto, and the thermosetting resin may be a resin having a small molecular weight and being liquid at room temperature among bisphenol A resin, ethylene glycol epoxy resin, novolac epoxy resin, or derivatives thereof.

[0096] The matrix resin 521 may couple the first lead-out portion 223 of the first coil 200 to the electrode layer 530 .

[0097] The plurality of metal particles 523 may be disposed within the matrix resin 521. For example, the plurality of metal particles 523 may be dispersed in the matrix resin 521.

[0098] The metal particles 523 may include at least one of nickel (Ni), silver (Ag), copper (Cu) coated with silver, copper coated with tin (Sn), and copper.

[0099] The metal particles 523 included in the conductive resin layer 520 are shown as spherical, but are not limited thereto and may have other shapes. Figure 6 As shown in , the flake-shaped metal particles 523' may be dispersed in the conductive resin layer 520. In another example, as shown in Figure 7 As shown in FIG. 5 , spherical metal particles 523 and flaky metal particles 523 ′ may be dispersed together in the conductive resin layer 520 .

[0100] The conductive connection part 525 surrounds the plurality of metal particles 523 and contacts the intermetallic compound 510. The conductive connection part 525 may surround the plurality of metal particles 523 and connect the metal particles 523 to each other, thereby minimizing stress within the body 100 and improving high temperature load characteristics and moisture load characteristics.

[0101] The conductive connection part 525 may serve to reduce the resistance of the conductive resin layer 520 by increasing the conductivity of the conductive resin layer 520 .

[0102] The electrode layer 530 contacts the conductive resin layer 520 and may be a plated layer. For example, the electrode layer 530 may have a structure in which a nickel (Ni) plated layer 531 and a tin (Sn) plated layer 533 are sequentially stacked. The nickel plated layer 531 contacts the conductive resin layer 520. That is, the nickel plated layer 531 contacts the base resin 521 and the conductive connection portion 525. The tin plated layer 533 may cover the nickel plated layer 531.

[0103] The intermetallic compound 510 may be disposed only at an interface between the conductive resin layer 520 and an exposed surface of the first lead-out portion 223 exposed from the sixth surface S6 of the body 100. That is, the intermetallic compound 510 may not be formed in a region of the sixth surface S6 of the body 100 where the first lead-out portion 223 is not exposed, and the conductive resin layer 520 may be disposed in a portion of the region to contact the sixth surface S6 of the body 100.

[0104] The intermetallic compound 510 may be formed by a reaction of a metal component of the first lead portion 223 with a metal component of low-melting-point metal particles (first metal particles) included in the above-mentioned conductive paste. The low-melting-point metal particles included in the conductive paste melt during the solidification of the conductive paste, and react with the metal component of the first lead portion 223 to form the intermetallic compound 510. As a result, the intermetallic compound 510 exists only at the interface between the conductive resin layer 520 and the exposed surface of the first lead portion 223 exposed from the sixth surface S6 of the body 100.

[0105] The intermetallic compound 510 may include a metal component of the low melting point metal particles and a metal component of the first lead-out portion 223. For example, the intermetallic compound 510 may include an alloy of two or more elements selected from tin (Sn), lead (Pb), indium (In), copper (Cu), silver (Ag), nickel (Ni), and bismuth (Bi). When the first lead-out portion 223 includes copper (Cu), the intermetallic compound 510 may include a copper (Cu)-tin (Sn)-based alloy. In addition, when it is said that the intermetallic compound 510 includes a copper (Cu)-tin (Sn)-based alloy, it may mean that the alloy is an alloy including copper (Cu) and tin (Sn), or an alloy mainly including copper (Cu) and tin (Sn) and including other metal elements or non-metal elements.

[0106] In addition, the intermetallic compound 510 can be confirmed by analyzing the boundary area between the first lead-out portion 223 and the conductive resin layer 520 of the coil electronic component 1000 shown in an optical microscope photograph or a scanning electron microscope (SEM) photograph of a cross section taken at the center of the coil electronic component 1000 in the width direction (or W-axis direction) along the length direction (or L-axis direction) and the thickness direction (or T-axis direction). That is, in the above-mentioned cross-sectional photograph, since the first lead-out portion 223, the intermetallic compound 510 and the conductive resin layer 520 show a difference in contrast according to the type of metal element, the content of a specific metal element, and whether a polymer material is included, they can be distinguished from each other. Therefore, the area existing between the first lead-out portion 223 and the conductive resin layer 520 can be determined as the intermetallic compound 510. In addition, based on the difference in contrast shown in the above-mentioned cross-sectional photograph, the first lead-out portion 223 and the intermetallic compound 510 not including the polymer material and the conductive resin layer 520 including the polymer material can be distinguished from each other, and by performing energy dispersive spectroscopy (EDS) analysis on the area not including the polymer material (the first lead-out portion 223 and the intermetallic compound 510), the area in which the content of the metal component (e.g., tin (Sn)) of the above-mentioned low-melting point metal particles is at least 10wt% can be determined as the intermetallic compound 510.

[0107] The second external electrode 600 has the same structure and composition as the first external electrode 500, and only its position is different from the first external electrode 500. Therefore, a redundant description of the structure and composition of the second external electrode 600 will be omitted.

[0108] The third and fourth external electrodes 700 and 800 are disposed outside the body 100 and are electrically connected to the second coil 300 .

[0109] The third external electrode 700 is disposed on the sixth surface S6 of the body 100 , and the first lead-out portion 323 of the second coil 300 is exposed from the sixth surface S6 of the body 100 and connected to the third external electrode 700 .

[0110] The fourth external electrode 800 is disposed on the sixth surface S6 of the body 100 , and the second lead-out portion 325 of the second coil 300 is exposed from the sixth surface S6 of the body 100 and connected to the fourth external electrode 800 .

[0111] The third and fourth external electrodes 700 and 800 have the same structure and composition as the first external electrode 500, and only their positions are different from the first external electrode 500. Therefore, redundant descriptions of the structure and composition of the third and fourth external electrodes 700 and 800 will be omitted.

[0112] In addition, the insulating layer 900 may be provided in a region of the body 100 of the coil electronic component 1000 according to the present embodiment except for the region where the first external electrode 500, the second external electrode 600, the third external electrode 700, and the fourth external electrode 800 are provided. On the other hand, the insulating layer 900 may exist in a region between a portion where the first lead-out portion 223 of the first coil 200 is exposed, a portion where the second lead-out portion 225 of the first coil 200 is exposed, a portion where the first lead-out portion 323 of the second coil 300 is exposed, and a portion where the second lead-out portion 325 of the second coil 300 is exposed on the sixth surface S6 of the body. In this case, the first external electrode 500, the second external electrode 600, the third external electrode 700, and the fourth external electrode 800 may cover a portion of the insulating layer 900.

[0113] As described above, the insulating layer 900 may be disposed on at least a portion of the first surface S1, the second surface S2, the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the body 100 to prevent electrical short circuits between other electronic components and the external electrodes 500, 600, 700, and 800.

[0114] The insulating layer 900 may serve as a plating resist when the external electrodes 500 , 600 , 700 , and 800 are formed by electroplating, but the present disclosure is not limited thereto.

[0115] Figure 8 is a perspective view schematically showing a coil electronic component according to another embodiment.

[0116] Reference Figure 8 , the first external electrode 2500 of the coil electronic component 2000 according to another embodiment may be connected to the first lead-out portion 223 of the first coil 200 and located on the sixth surface S6 of the body 100, and may extend to the second surface S2 of the body 100. In addition, the second external electrode 2600 may be connected to the second lead-out portion 225 of the first coil 200 and located on the sixth surface S6 of the body 100, and may extend to the first surface S1 of the body 100.

[0117] The third external electrode 2700 may be connected to the first lead-out portion 323 of the second coil 300 and located on the sixth surface S6 of the body 100, and may extend onto the first surface S1 of the body 100. In addition, the fourth external electrode 2800 may be connected to the second lead-out portion 325 of the second coil 300 and located on the sixth surface S6 of the body 100, and may extend onto the second surface S2 of the body 100.

[0118] In addition to the above, the remaining components are Figure 1 The components of the coil electronic assembly shown in are the same, so their redundant description will be omitted.

[0119] Fig. 9 is a perspective view schematically showing a coil electronic component according to still another embodiment.

[0120] Reference Fig. 9 According to yet another embodiment, the first external electrode 3500 of the coil electronic component 3000 may be connected to the first lead-out portion 223 of the first coil 200 and located on the sixth surface S6 of the body 100, and may extend to the second surface S2 and the fifth surface S5 of the body 100. In addition, the second external electrode 3600 may be connected to the second lead-out portion 225 of the first coil 200 and located on the sixth surface S6 of the body 100, and may extend to the first surface S1 and the fifth surface S5 of the body 100.

[0121] The third external electrode 3700 may be connected to the first lead-out portion 323 of the second coil 300 and located on the sixth surface S6 of the body 100, and may extend onto the first surface S1 and the fifth surface S5 of the body 100. In addition, the fourth external electrode 3800 may be connected to the second lead-out portion 325 of the second coil 300 and located on the sixth surface S6 of the body 100, and may extend onto the second surface S2 and the fifth surface S5 of the body 100.

[0122] In addition to the above, the remaining components are Figure 1 The components of the coil electronic assembly shown in are the same, so their redundant description will be omitted.

[0123] Fig.10 is a perspective view schematically showing a coil electronic component according to yet another embodiment, Fig.11 It is schematically shown Fig.10 A partially enlarged cross-sectional view of the lead-out portion and external electrodes of a coil electronic component.

[0124] Reference Fig.10 and Fig.11 The coil electronic component 4000 may include a body 100 , a first coil 200 , a second coil 300 , a metal layer 400 , a first external electrode 500 , a second external electrode 600 , a third external electrode 700 , and a fourth external electrode 800 .

[0125] The metal layer 400 may be disposed on both exposed ends of the first coil 200 and both exposed ends of the second coil 300. That is, the metal layer 400 may be disposed on each of the exposed surface of the first lead-out portion 223 and the exposed surface of the second lead-out portion 225 and the exposed surface of the first lead-out portion 323 and the exposed surface of the second lead-out portion 325. The metal layer 400 may include, for example, copper (Cu), and may be a plated layer.

[0126] The metal layer 400 contacts the exposed portion of the first lead-out portion 223 and may cover a portion of the sixth surface S6 of the body 100. That is, the area of ​​the metal layer 400 may be larger than the area of ​​the exposed surface of the first lead-out portion 223, and the metal layer 400 may cover the exposed surface of the first lead-out portion 223 (e.g., the entire exposed surface). When the first lead-out portion 223 of the first coil 200 and the metal layer 400 are made of the same material (e.g., copper (Cu)), the metal layer 400 may have the effect of expanding the exposed surface of the first lead-out portion 223. If it is structurally difficult to increase the exposed area of ​​the first lead-out portion 223 of the first coil 200, the metal layer 400 may be formed to cover the exposed surface of the first lead-out portion 223, and then the first external electrode 500 may be connected to the metal layer 400. Therefore, the first lead-out portion 223 and the first external electrode 500 may be firmly combined. The above description may also be applied to the second lead-out portion 225, so redundant descriptions thereof will be omitted.

[0127] The first external electrode 500 may include an intermetallic compound 511 , a conductive resin layer 520 , and an electrode layer 530 .

[0128] The intermetallic compound 511 is disposed on the metal layer 400. The intermetallic compound 511 may be in the form of a plurality of islands, and may include silver (Ag)-tin (Sn). In addition, the plurality of islands may be layered.

[0129] The conductive resin layer 520 may be in contact with the metal layer 400 and the intermetallic compound 511. In addition, the conductive resin layer 520 may cover a portion of the sixth surface S6 of the body 100.

[0130] The conductive resin layer 520 may include a base resin 521 , a plurality of metal particles 523 , and a conductive connection part 525 .

[0131] The matrix resin 521 may combine the metal layer 400 and the electrode layer 530 .

[0132] The plurality of metal particles 523 may be disposed within the matrix resin 521. For example, the plurality of metal particles 523 may be dispersed in the matrix resin 521.

[0133] The conductive connection part 525 surrounds the plurality of metal particles 523 and may be in contact with the intermetallic compound 511 .

[0134] The electrode layer 530 contacts the conductive resin layer 520 and may be a plated layer.

[0135] The intermetallic compound 511 may be disposed only at the interface between the metal layer 400 and the conductive resin layer 520. That is, the intermetallic compound 511 may not be formed in a region of the sixth surface S6 of the body 100 where the metal layer 400 is not disposed, and the conductive resin layer 520 may be disposed in a portion of the region to contact the sixth surface S6 of the body 100.

[0136] The intermetallic compound 511 may be formed by a reaction of a metal component of the metal layer 400 with a metal component of low-melting-point metal particles (first metal particles) included in the above-mentioned conductive paste. The low-melting-point metal particles included in the conductive paste melt during the curing of the conductive paste and react with the metal component of the metal layer 400 to form the intermetallic compound 511. As a result, the intermetallic compound 511 exists only at the interface between the metal layer 400 and the conductive resin layer 520.

[0137] The intermetallic compound 511 may include a metal component of the low melting point metal particles and a metal component of the metal layer 400. For example, the intermetallic compound 511 may include an alloy of two or more elements selected from tin (Sn), lead (Pb), indium (In), copper (Cu), silver (Ag), nickel (Ni), and bismuth (Bi). When the metal layer 400 includes copper (Cu), the intermetallic compound 511 may include a copper (Cu)-tin (Sn)-based alloy. In addition, when it is said that the intermetallic compound 511 includes a copper (Cu)-tin (Sn)-based alloy, it may mean that the alloy is an alloy including copper (Cu) and tin (Sn), or an alloy mainly including copper (Cu) and tin (Sn) and including other metal elements or non-metal elements.

[0138] In addition, the intermetallic compound 511 can be confirmed by analyzing the boundary area between the metal layer 400 and the conductive resin layer 520 of the coil electronic component 4000 shown in an optical microscope photograph or a scanning electron microscope (SEM) photograph of a cross section taken at the center of the coil electronic component 4000 in the width direction (or W-axis direction) along the length direction (or L-axis direction) and the thickness direction (or T-axis direction). That is, in the above-mentioned cross-sectional photograph, since the metal layer 400, the intermetallic compound 511 and the conductive resin layer 520 show a difference in contrast according to the type of metal element, the content of a specific metal element, and whether a polymer material is included, they can be distinguished from each other. Therefore, the area existing between the metal layer 400 and the conductive resin layer 520 can be determined as the intermetallic compound 511. In addition, based on the difference in contrast shown in the above-mentioned cross-sectional photograph, the metal layer 400 and the intermetallic compound 511 not including the polymer material and the conductive resin layer 520 including the polymer material can be distinguished from each other, and by performing energy dispersive spectroscopy (EDS) analysis on the area not including the polymer material (the metal layer 400 and the intermetallic compound 511), the area where the content of the metal component (e.g., tin (Sn)) of the above-mentioned low-melting point metal particles is at least 10wt% can be determined as the intermetallic compound 511.

[0139] The second external electrode 600 has the same structure and composition as the first external electrode 500, and only its position is different from the first external electrode 500. Therefore, a redundant description of the structure and composition of the second external electrode 600 will be omitted.

[0140] The third and fourth external electrodes 700 and 800 are disposed outside the body 100 and are electrically connected to the second coil 300 .

[0141] The third external electrode 700 is disposed on the sixth surface S6 of the body 100 , and the first lead-out portion 323 of the second coil 300 is exposed from the sixth surface S6 of the body 100 and connected to the third external electrode 700 .

[0142] The fourth external electrode 800 is disposed on the sixth surface S6 of the body 100 , and the second lead-out portion 325 of the second coil 300 is exposed from the sixth surface S6 of the body 100 and connected to the fourth external electrode 800 .

[0143] The third and fourth external electrodes 700 and 800 have the same structure and composition as the first external electrode 500, and only their positions are different from the first external electrode 500. Therefore, redundant descriptions of the structure and composition of the third and fourth external electrodes 700 and 800 will be omitted.

[0144] In addition to the above, the remaining components are Figure 1The components of the coil electronic assembly shown in are the same, so their description will be omitted.

[0145] Although the embodiments of the present disclosure have been described, it will be understood that the present disclosure is not limited to the disclosed embodiments. Various modifications can be made within the scope of the claims, the description of the present disclosure and the drawings, and these modifications also fall within the scope of the present disclosure.

Claims

1. A coil electronic assembly, comprising: a first coil and a second coil; a body that surrounds the first coil and the second coil and exposes both ends of the first coil and both ends of the second coil to the outside of the body, and includes a magnetic material; and an external electrode connected to the exposed end of the first coil and the exposed end of the second coil, At least one of the external electrodes includes an intermetallic compound, and the intermetallic compound is disposed on a corresponding exposed end of the first coil and the exposed end of the second coil.

2. The coil electronic component according to claim 1, wherein: The at least one of the outer electrodes further comprises: a conductive resin layer in contact with the intermetallic compound; and An electrode layer is connected to the conductive resin layer.

3. The coil electronic component according to claim 2, wherein: The conductive resin layer comprises: Base resin; a plurality of metal particles disposed in the matrix resin; and A conductive connection portion surrounds the plurality of metal particles and contacts the intermetallic compound.

4. The coil electronic component according to claim 3, wherein: The electrode layer is provided on the conductive resin layer and is in contact with the conductive connection portion.

5. The coil electronic component according to claim 3, wherein: The plurality of metal particles have one of a spherical shape, a flake shape, and a mixture of the spherical shape and the flake shape.

6. The coil electronic component according to claim 1, wherein: The intermetallic compound is in the form of a plurality of islands.

7. The coil electronic component according to claim 1, wherein: The intermetallic compound includes Ag—Sn.

8. The coil electronic component according to claim 1, wherein: The first coil includes at least one turn of a first conductive wire, and The second coil includes at least one turn of a second conductive wire.

9. The coil electronic component according to claim 1, wherein: The first coil includes a first lead-out portion and a second lead-out portion exposed to the outside of the body, and The second coil includes a third lead-out portion and a fourth lead-out portion exposed to the outside of the body.

10. The coil electronic component according to claim 9, wherein: The intermetallic compound is disposed on an exposed surface of the first lead portion, an exposed surface of the second lead portion, an exposed surface of the third lead portion, and an exposed surface of the fourth lead portion, respectively, and The outer electrode comprises: a first external electrode connected to the first lead-out portion; a second external electrode connected to the second lead-out portion; a third external electrode connected to the third lead-out portion; and A fourth external electrode is connected to the fourth lead-out portion.

11. A coil electronic assembly comprising: a first coil and a second coil; a body that surrounds the first coil and the second coil and exposes both ends of the first coil and both ends of the second coil to the outside of the body, and includes a magnetic material; a metal layer disposed outside the body and contacting the exposed end of the first coil and the exposed end of the second coil respectively; as well as The external electrode, connected to the metal layer, At least one of the external electrodes includes an intermetallic compound, and the intermetallic compound is disposed on the corresponding metal layer.

12. The coil electronic component according to claim 11, wherein: The metal layer includes Cu.

13. The coil electronic component according to claim 11, wherein: The at least one of the outer electrodes further comprises: a conductive resin layer in contact with the intermetallic compound; and An electrode layer is connected to the conductive resin layer.

14. The coil electronic component according to claim 13, wherein: The conductive resin layer comprises: Base resin; a plurality of metal particles disposed in the matrix resin; and A conductive connection portion surrounds the plurality of metal particles and contacts the intermetallic compound.

15. The coil electronic component according to claim 14, wherein: The electrode layer is provided on the conductive resin layer and is in contact with the conductive connection portion.

16. The coil electronic component according to claim 11, wherein: The intermetallic compound includes Ag—Sn.

17. The coil electronic component according to claim 11, wherein: The first coil includes a first lead-out portion and a second lead-out portion exposed to the outside of the body, and The second coil includes a third lead-out portion and a fourth lead-out portion exposed to the outside of the body.

18. The coil electronic component according to claim 17, wherein: The intermetallic compound is disposed on an exposed surface of the first lead portion, an exposed surface of the second lead portion, an exposed surface of the third lead portion, and an exposed surface of the fourth lead portion, respectively, and The outer electrode comprises: a first external electrode connected to the first lead-out portion; a second external electrode connected to the second lead-out portion; a third external electrode connected to the third lead-out portion; and A fourth external electrode is connected to the fourth lead-out portion.

19. A coil electronic assembly comprising: a body, including a magnetic material; a first coil disposed in the body and including a first lead-out portion and a second lead-out portion extending to one surface of the body; a second coil stacked above or below the first coil inside the body and including a third lead-out portion and a fourth lead-out portion extending to the one surface of the body; first, second, third, and fourth external electrodes disposed on the one surface of the body to be connected to the first, second, third, and fourth lead portions, respectively; a metal layer disposed between at least one of the first external electrode, the second external electrode, the third external electrode, and the fourth external electrode and a corresponding lead portion of the first lead portion, the second lead portion, the third lead portion, and the fourth lead portion, The metal layer has an area larger than an area of ​​an exposed surface of the corresponding lead-out portion among the first lead-out portion, the second lead-out portion, the third lead-out portion, and the fourth lead-out portion that is exposed from the one surface of the body.

20. The coil electronics assembly according to claim 19, wherein: The at least one external electrode among the first external electrode, the second external electrode, the third external electrode and the fourth external electrode comprises: an intermetallic compound disposed on the metal layer; a conductive resin layer in contact with the intermetallic compound; and An electrode layer is connected to the conductive resin layer.

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