Edge ring assembly, semiconductor device and replacement method of edge ring assembly

Abstract

The invention relates to a semiconductor device and an edge ring assembly, the device comprising a process processing chamber capable of generating a plasma; the supporting table is positioned in the process treatment cavity; the edge ring assembly is restrained on the outer edge of the supporting table and comprises an inner edge ring and an outer edge ring which are nested with each other, and the inner edge ring and the outer edge ring have an overlapping area in the overlook direction; in the overlapping area, the inner edge ring is located above the outer edge ring, and the outer edge ring is provided with a plurality of through holes in the overlapping area; the lifting device comprises a plurality of pins, the plurality of pins can be switched between a first position and a second position, can penetrate through the through hole at the first position to jack the inner edge ring, and can be staggered with the through hole at the second position to jack the outer edge ring; and the conveying device is used for conveying the inner edge ring or the outer edge ring jacked up by the pin. According to the semiconductor device provided by the invention, the edge ring assembly is simple in structure and can be quickly replaced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and in particular to an edge ring assembly, semiconductor equipment and a method for replacing the edge ring assembly. Background Art

[0002] In the etching step of the semiconductor manufacturing process, an edge ring is often placed on the electrostatic chuck 102 to surround the etched substrate 101 to change the shape of the edge sheath of the substrate 101, thereby improving the edge effect of the substrate 101. Figure 1 As shown in FIG. 1 , a structure of an existing edge ring is shown. The edge ring 100a has only one single ring. If it is to be replaced, the entire ring needs to be replaced. However, it is found during use that the inner edge of the edge ring is more strongly corroded by plasma, while the outer edge is slightly corroded. Therefore, in order to reduce costs, Figure 2 The nested edge ring 100b shown is used to replace the existing integrated edge ring 100a. The nested edge ring 100b can replace the inner and outer edge rings separately.

[0003] However, since the structure of the nested edge ring 100b is more complicated, the current replacement method is relatively cumbersome, requiring special steps and replacement devices, and the replacement process is not simple. Therefore, it is urgent to provide an edge ring that is easy to replace and has a simple structure. Summary of the invention

[0004] In order to achieve the above objectives, the present invention provides an edge ring assembly that is simple and quick to replace, so as to improve production efficiency and simplify replacement steps.

[0005] The present invention can be implemented by the following edge ring assembly, wherein the edge ring assembly comprises:

[0006] The inner edge ring and the outer edge ring are nested with each other, and the inner edge ring and the outer edge ring have an overlapping area in a top view direction; and in the overlapping area, the inner edge ring is located above the outer edge ring, and the outer edge ring is provided with a plurality of through holes in the overlapping area;

[0007] The through hole is used for a pin of the lifting device to pass through.

[0008] Optionally, the multiple through holes are located on the same circumference.

[0009] Optionally, the number of the through holes is at least 3.

[0010] Optionally, a lower surface of the inner edge ring and / or the outer edge ring is provided with a groove matching with a distal end of the pin.

[0011] Optionally, the groove is located in the overlapping area and is located on the same circumference as the through hole.

[0012] In addition, the present invention also provides a semiconductor device, comprising:

[0013] a process chamber capable of generating plasma;

[0014] A support platform, which is located in the process chamber;

[0015] An edge ring assembly is constrained at the outer edge of the support platform, comprising an inner edge ring and an outer edge ring nested with each other, wherein the inner edge ring and the outer edge ring have an overlapping area in a top view direction; and in the overlapping area, the inner edge ring is located above the outer edge ring, and the outer edge ring has a plurality of through holes in the overlapping area;

[0016] A lifting device, comprising a plurality of pins, wherein the plurality of pins can be switched between a first position and a second position, wherein the first position is a position directly opposite to the through hole, and the second position is a position offset from the through hole;

[0017] A conveying device is used to carry the inner edge ring or the outer edge ring lifted by the pin.

[0018] Optionally, the lifting device includes a rotating component; the pin is connected to the rotating component and is driven by the rotating component to switch between the first position and the second position.

[0019] Optionally, the number of the pins is at least 3 and they are evenly spaced.

[0020] In addition, the present invention also provides a method for replacing an edge ring assembly based on the above semiconductor device, comprising the following steps:

[0021] S1, controlling the plurality of pins of the lifting device to a first position;

[0022] S2, raising the plurality of pins at the first position and passing them through the through holes on the outer edge ring to lift the inner edge ring to a certain height;

[0023] S3, controlling the conveying device to take away the lifted inner edge ring;

[0024] S4, controlling the conveying device to place the replaced inner edge ring on the raised plurality of pins;

[0025] S5. Lower the raised pins together with the replaced inner edge ring.

[0026] Furthermore, the following steps are included between step S3 and step S4:

[0027] S3.1, lowering the raised multiple pins and controlling the multiple pins to the second position;

[0028] S3.2, raising the plurality of pins at the second position and lifting the outer edge ring to a certain height;

[0029] S3.3, controlling the conveying device to take the outer edge ring from the raised plurality of pins;

[0030] S3.4, controlling the conveying device to place the replaced outer edge ring on the raised plurality of pins;

[0031] S3.5. Lower the raised pins together with the replaced outer edge ring back onto the support platform.

[0032] Furthermore, after step S3.5, the method further includes:

[0033] S3.6, controlling the plurality of pins of the lifting device to a first position;

[0034] S3.7. Raise the plurality of pins in the first position and pass them through the through holes to a height capable of supporting the inner edge ring.

[0035] Furthermore, a rotating component is used to control the rotation of the plurality of pins between the first position and the second position, so as to achieve the switching of the plurality of pins between the first position and the second position.

[0036] The present invention has the following beneficial effects:

[0037] The edge ring assembly provided by the present invention has a simple structure and can be quickly replaced by cooperating with a lifting device and a conveying device in semiconductor equipment.

[0038] The internal complexity of semiconductor equipment is reduced, thereby reducing maintenance costs and improving production efficiency.

[0039] The replacement method of the present invention uses a rotating component to control multiple pins to switch between a first position and a second position, so that the inner and outer edge rings can be quickly replaced through the lifting and rotating functions of a lifting device, simplifying the replacement process. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a schematic diagram of the structure of the integrated edge ring and the support platform in the prior art;

[0041] Figure 2 It is a structural schematic diagram of a split edge ring combined with a support platform in the prior art;

[0042] Figure 3 It is a schematic structural diagram of the semiconductor device of the present invention;

[0043] Figure 4 A top view of the edge ring assembly of the present invention combined with the support platform;

[0044] Figure 5 A partial flow chart of a method for replacing an edge ring assembly of the present invention;

[0045] Figure 6Another partial flow chart of the method for replacing the edge ring assembly of the present invention. DETAILED DESCRIPTION

[0046] The edge ring assembly, semiconductor device and edge ring assembly replacement method proposed in the present invention are further described in detail below in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In order to make the purposes, features and advantages of the present invention more obvious and easy to understand, please refer to the drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects that can be produced by the present invention and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the present invention.

[0047] In the plasma processing of semiconductor devices, in order to ensure that the center and edge areas of the substrate can obtain uniform processing effects, an edge ring is usually placed around the substrate. The edge ring is adsorbed on the support table by electrostatic action. The support table is provided with holes for pins to pass through, and these holes are used for pins to pass through to lift the edge ring.

[0048] In order to realize the rapid replacement of the edge ring, the present invention provides an edge ring assembly and a semiconductor device, wherein the edge ring assembly is placed on a support table of the semiconductor device. Figure 3, is a schematic diagram of the structure of a semiconductor device including the edge ring assembly according to an embodiment of the present invention. The semiconductor device includes a process chamber 105, a support table 102, an edge ring assembly 100c, a lifting device and a conveying device 104. The process chamber 105 can generate plasma for processing a substrate on the support table 102. The substrate can be a silicon wafer or other materials. In this embodiment, the etching process of a wafer is used as an example. The support table 102 is located in the process chamber 105, and its outer edge is sunken and the middle part is convex. The sunken outer edge part is used to fix the edge ring assembly 100c, and the middle part is convex for placing the wafer. A lower electrode part 103 is arranged below the support table 102. The edge ring assembly 100c includes an inner edge ring 111 and an outer edge ring 112 nested with each other. The lifting device includes a plurality of pins 109, and the plurality of pins 109 can be switched between a first position and a second position, and can lift the inner edge ring 111 in the first position, and can lift the outer edge ring 112 in the second position. The conveying device 104 is used to carry the inner edge ring 111 or the outer edge ring 112 lifted by the pin 109. Optionally, the conveying device 104 is a robot.

[0049] Specifically, see Figure 4 , is a top view of an edge ring assembly 100c provided in an embodiment of the present invention combined with a support platform 102. The edge ring assembly 100c includes an inner edge ring 111 and an outer edge ring 112 that are nested with each other, and the inner edge ring 111 and the outer edge ring 112 have an overlapping area 121 in a top view; and in the overlapping area 121, the inner edge ring 111 is located above the outer edge ring 112, and the outer edge ring 112 is provided with a plurality of through holes 122 in the overlapping area 121. It should be noted that the first position 131 is a position directly opposite to the through hole 122, and the second position 132 is a position misaligned with the through hole 122. In this embodiment, the first position and the second position are both located on the same circumference, and the first position 131 and the second position 132 differ by 60° in the circumferential direction.

[0050] In this embodiment, the lifting device further includes a support member, a rotating member 106 and a lifting member 107, the pin 109 is connected to the rotating member 106, and is driven by the rotating member 106 to switch between the first position 131 and the second position 132. Optionally, the pin 109 extends vertically, the number of the pins is at least 3, and they are evenly spaced in the circumferential direction. In order to simplify the structure of the lifting device, the number of the pins 109 can be set to 3, and the adjacent pins 109 form an angle of 120° in the circumferential direction. More preferably, the support member is connected to the rotating member 106, the support member is a C-shaped ring extending laterally, the lower end of the pin is arranged on the C-shaped ring, and the upper end is used to lift the edge ring assembly 100c; the rotating member 106 can be optionally a rotating motor, and the lifting member is a lifting motor 107, the lower part of the rotating member 106 is connected to the lifting motor 107 to realize the lifting function, which is used to drive the pin to move up and down, and is coupled with the rotating motor 106.

[0051] Furthermore, a second lifting device for lifting the wafer is also provided in the process chamber 105 of the semiconductor device, and the second lifting device includes a second pin 110 and a second lifting motor 108. The second pin 110 can pass through the middle protrusion of the support platform 102 and lift the wafer. This structure is a conventional setting and will not be described in detail here.

[0052] Combination Figure 3 It can be seen that the side surface of the outer edge ring 112 is L-shaped, and the side surface of the inner edge ring 111 is Z-shaped. The inner upper surface of the outer edge ring 112 is lower than the outer upper surface thereof, and the inner and outer upper surfaces thereof form a step shape. The outer lower surface of the inner edge ring 111 is higher than the inner lower surface thereof, and the inner and outer lower surfaces thereof form an anti-step shape matching the step shape of the outer edge ring 112, and the inner edge ring 111 is engaged with the step shape of the outer edge ring 112 through the anti-step shape. Moreover, the inner upper surface of the inner edge ring 111 is lower than the outer upper surface thereof, forming a sinking structure. When the edge ring assembly 100c is placed on the support table 102, the sinking structure on the inner side of the inner edge ring 111 is lower than the middle protrusion of the support table 102, and the diameter of the wafer placed on the support table 102 is larger than the middle protrusion, so that the outer edge of the wafer protrudes toward the edge ring assembly 100c and extends above the sinking structure of the inner edge ring 111. The edge ring assembly 100c can change the edge sheath shape of the wafer to optimize the plasma treatment effect and uniformity of the wafer surface. The position relationship can be referred to Figure 1 and Figure 2 .

[0053] In the structure of the outer edge ring 112 matching the pins 109, the multiple through holes 122 on the outer edge ring 112 are located on the same circumference, and the number of the through holes 122 is at least 3. Optionally, the number of the through holes 122 matching the three pins 109 is 3, and the adjacent through holes 122 form an angle of 120° on the circumference. When the three pins 109 are located at the first position 131, they can simultaneously pass through the through holes 122 and abut against the lower surface of the inner edge ring 111 to lift the inner edge ring 111; when the three pins 109 are located at the second position 132, each pin 109 is misaligned with each through hole 122 and can abut against the lower surface of the outer edge ring 112 to lift the outer edge ring 112.

[0054] As described above, the pin 109 is lifted on the lower surface of the inner edge ring 111 and / or the outer edge ring 112 . In order to ensure the stability of the lifting process, grooves are provided on the lower surface of the inner edge ring 111 and / or the outer edge ring 112 .

[0055] The groove is located in the overlapping area 121 and is located on the same circumference as the through hole 122. The position of the groove on the outer edge ring 112 is staggered with the position of the through hole 122 on the circumference, that is, it is located at the second position 132. The position of the groove on the inner edge ring 111 is directly opposite to the position of the through hole 122, that is, it is located at the first position 131. In some embodiments, the grooves can also be arranged to be distributed along a circle on the circumference where the through hole 122 is located, so as to simplify the orientation of the inner edge ring 111 and / or the outer edge ring 112 when they are placed.

[0056] In addition, the present invention also provides a method for replacing the edge ring assembly 100c, such as Figure 5 As shown, the replacement method comprises the following steps:

[0057] S1, controlling the plurality of pins 109 of the lifting device to the first position 131. According to the above embodiment, the pins 109 can be controlled to the first position 131 by rotating the rotary motor 106;

[0058] S2, raising the plurality of pins 109 at the first position 131 and passing through the through holes 122 on the outer edge ring 112 to lift the inner edge ring 111 to a certain height; specifically, raising the pins by the lifting motor 107.

[0059] S3, controlling the conveying device 104 to take away the lifted inner edge ring 111;

[0060] S4, controlling the conveying device 104 to place the replaced inner edge ring 111 on the raised plurality of pins 109;

[0061] S5. Lower the raised plurality of pins 109 together with the replaced inner edge ring 111.

[0062] According to the above steps S1 to S5 and in cooperation with the lifting motor 107 and the rotating motor 106 , the lifting and rotating of the pin can be realized, thereby completing the rapid replacement of the inner edge ring 111 .

[0063] Further, when the outer edge ring 112 needs to be replaced, as Figure 6 As shown, the following steps may also be performed between step S3 and step S4:

[0064] S3.1, lowering the raised plurality of pins 109 and controlling the plurality of pins 109 to the second position 132. Similarly, the position switching can be achieved by rotating the rotary motor 106;

[0065] S3.2, raising the plurality of pins 109 at the second position 132 and lifting the outer edge ring 112 to a certain height;

[0066] S3.3, controlling the conveying device 104 to take away the outer edge ring 112 from the raised plurality of pins 109;

[0067] S3.4, controlling the conveying device 104 to place the replaced outer edge ring 112 on the raised plurality of pins 109;

[0068] S3.5. Lower the raised plurality of pins 109 together with the replaced outer edge ring 112 back onto the support platform 102 .

[0069] Furthermore, after step S3.5, the process further includes the step of installing the inner edge ring 111 to the outer edge ring 112, and the process is as follows:

[0070] S3.6, controlling the plurality of pins 109 of the lifting device to the first position 131;

[0071] S3.7, the plurality of pins 109 at the first position 131 are raised and passed through the through holes 122 to a height capable of supporting the inner edge ring 111. Then, step S4 and step S5 are performed.

[0072] Of course, the pin can replace the outer edge ring 112 and the inner edge ring 111 at one time, for example:

[0073] Controlling the plurality of pins 109 of the lifting device to the second position. According to the above embodiment, the pins 109 can be controlled to the second position by rotating the rotary motor 106;

[0074] Raise the plurality of pins 109 at the second position 131; specifically, the pins are raised by the lifting motor 107, and the outer edge ring 112 and the inner edge ring 111 are lifted up together by the lifting of the pins. At this time, the conveying device 104 is controlled to take out the outer edge ring 112 and the inner edge ring 111 together, and then the conveying device 104 is controlled to send in new outer edge ring 112 and inner edge ring 111 and place them on the pins. The pins are driven by the lifting motor 107 to descend, driving the outer edge ring 112 and the inner edge ring 111 to fall onto the support platform 102.

[0075] In combination with the above embodiments, it can be seen that the replacement method of the present invention uses a rotating component to control the rotation of multiple pins between the first position and the second position to achieve the switching of multiple pins between the first position and the second position. Thus, through the lifting and rotating functions of a lifting device, the inner edge ring and the outer edge ring can be quickly replaced, which simplifies the replacement process and reduces the complexity inside the semiconductor device, thereby reducing maintenance costs and improving production efficiency.

[0076] The edge ring assembly provided by the present invention has a simple structure and can be quickly replaced by cooperating with a lifting device and a conveying device in semiconductor equipment.

[0077] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0078] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. An edge ring assembly, which is constrained to the outer edge of a support platform of a semiconductor device, characterized in that: include: The inner edge ring and the outer edge ring are nested with each other, and the inner edge ring and the outer edge ring have an overlapping area in a top view direction; and in the overlapping area, the inner edge ring is located above the outer edge ring, and the outer edge ring is provided with a plurality of through holes in the overlapping area; The through hole is used for a pin of the lifting device to pass through.

2. The edge ring assembly of claim 1, wherein: The plurality of through holes are located on the same circumference.

3. The edge ring assembly of claim 2, wherein: The number of the through holes is at least 3.

4. The edge ring assembly of claim 1, wherein: The lower surface of the inner edge ring and / or the outer edge ring is provided with a groove matching with the distal end of the pin.

5. The edge ring assembly of claim 4, wherein: The groove is located in the overlapping area and is located on the same circumference as the through hole.

6. A semiconductor device, characterized in that: include: a process chamber capable of generating plasma; A support platform, which is located in the process chamber; An edge ring assembly is constrained at the outer edge of the support platform, comprising an inner edge ring and an outer edge ring nested with each other, wherein the inner edge ring and the outer edge ring have an overlapping area in a top view direction; and in the overlapping area, the inner edge ring is located above the outer edge ring, and the outer edge ring has a plurality of through holes in the overlapping area; A lifting device, comprising a plurality of pins, wherein the plurality of pins can be switched between a first position and a second position, wherein the first position is a position directly opposite to the through hole, and the second position is a position offset from the through hole; A conveying device is used to carry the inner edge ring or the outer edge ring lifted by the pin.

7. The semiconductor device according to claim 6, wherein: The lifting device comprises a rotating component; the pin is connected to the rotating component and is driven by the rotating component to switch between a first position and a second position.

8. The semiconductor device according to claim 7, wherein: The number of the pins is at least 3 and they are evenly spaced.

9. A method for replacing an edge ring assembly, characterized in that: Applied to the semiconductor device according to any one of claims 6 to 8, comprising the following steps: S1, controlling the plurality of pins of the lifting device to a first position; S2, raising the plurality of pins at the first position and passing them through the through holes on the outer edge ring to lift the inner edge ring to a certain height; S3, controlling the conveying device to take away the lifted inner edge ring; S4, controlling the conveying device to place the replaced inner edge ring on the raised plurality of pins; S5. Lower the raised pins together with the replaced inner edge ring.

10. The replacement method according to claim 9, characterized in that: The following steps are also included between step S3 and step S4: S3.1, lowering the raised multiple pins and controlling the multiple pins to the second position; S3.2, raising the plurality of pins at the second position and lifting the outer edge ring to a certain height; S3.3, controlling the conveying device to take the outer edge ring from the raised plurality of pins; S3.4, controlling the conveying device to place the replaced outer edge ring on the raised plurality of pins; S3.

5. Lower the raised pins together with the replaced outer edge ring back onto the support platform.

11. The replacement method according to claim 10, characterized in that: After step S3.5, the method further includes: S3.6, controlling the plurality of pins of the lifting device to a first position; S3.

7. Raise the plurality of pins in the first position and pass them through the through holes to a height capable of supporting the inner edge ring.

12. The replacement method according to any one of claims 9 to 11, characterized in that: A rotating component is used to control the rotation of the plurality of pins between the first position and the second position, so as to realize the switching of the plurality of pins between the first position and the second position.

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