A chip detection and sorting device and method

Abstract

The present invention relates to the field of semiconductor detection, and discloses a chip detection and sorting device and method. A frame is provided with a loading and unloading gripper module, a detection module, a transfer module and a taping module; the transfer module includes a first conveyor line, a second conveyor line, a third conveyor line and a tray transfer mechanism; the detection module includes a first detection device and a second detection device. The first detection device is used to detect the side and bottom surfaces of the chip, and the second detection device is used to detect the front surface of the chip; the taping module includes a taping mechanism for taping and encapsulating the chip; the loading and unloading gripper module includes a loading mechanism and an unloading mechanism. The loading mechanism is used to transfer the chip between the first conveyor line and the first detection device; the unloading mechanism is used to transfer the chip between the second conveyor line, the third conveyor line and the taping mechanism. In the present invention, the chip is transferred by the loading mechanism and the unloading mechanism, avoiding damage to the chip when manually moving the chip, and the chip sorting and detection efficiency is higher.

Description

Technical Field

[0001] The present invention relates to the field of chip detection and sorting, and particularly to a chip detection and sorting device and method. Background Art

[0002] At the end of the chip production process, it is necessary to perform optical detection on the packaged chips and sort the chips according to the detection results, and divide the detected good chips and bad chips into different trays.

[0003] The current detection methods mainly rely on the combination of manual and electron microscope detection, vision camera detection, etc. The working efficiency of single-function devices is relatively low. Different detection items may require different personnel or different devices to be detected multiple times, making it difficult to ensure the production efficiency and detection quality of products. Moreover, for the processes of multiple stations, multiple devices, multiple repeated detections, sorting, transfer, and transportation of chip products, it is easy to cause damage and additional risks to the chips, resulting in a relatively low final yield of chip products. Summary of the Invention

[0004] The technical problem to be solved by the present invention is: how to improve the efficiency of chip detection and sorting. To solve the above technical problem, the present invention provides a chip detection and sorting device, including a frame, and the frame is provided with a loading and unloading gripper module, a detection module, a transfer module, and a taping module;

[0005] The transfer module includes a first conveyor line, a second conveyor line, a third conveyor line, and a tray transfer mechanism arranged side by side. The first conveyor line, the second conveyor line, and the third conveyor line all extend along the Y direction, and the tray transfer mechanism is arranged along the X direction. The tray transfer mechanism is used to transfer chip trays between the first conveyor line, the second conveyor line, and the third conveyor line;

[0006] The detection module includes a first detection device and a second detection device. The first detection device is used to detect the side and bottom surfaces of the chip, and the first detection device is arranged on the side of the first conveyor line away from the second conveyor line; the second detection device is used to detect the front surface of the chip, and the second detection device is arranged along the Y direction on one side of the first detection device, and the second detection device is arranged directly above the first conveyor line or the second conveyor line;

[0007] The taping module includes a taping mechanism, and the taping mechanism is arranged on the side of the third conveyor line away from the second conveyor line. The taping mechanism is used to tape and package the chips;

[0008] The loading and unloading gripper module includes a loading mechanism and an unloading mechanism. The loading mechanism is used to transfer chips between the first conveyor line and the first detection device; the unloading mechanism is used to transfer chips between the second conveyor line, the third conveyor line and the taping mechanism.

[0009] Preferably, one end of the first conveyor line is provided with a loading station, and the first conveyor line is used to convey the chip tray to be tested along the Y direction to the tray transfer mechanism; one end of the second conveyor line far from the tray transfer mechanism is provided with a first unloading station; on one side of the third conveyor line far from the tray transfer mechanism, there are provided a second unloading station and the taping mechanism.

[0010] Preferably, the loading and unloading gripper module includes a first gantry arranged along the X direction. The first gantry is provided with a first linear module which extends along the X direction. The loading mechanism includes a first module slider and a loading gripper, and the unloading mechanism includes a second module slider and an unloading gripper. The first module slider and the second module slider respectively drive the loading gripper and the unloading gripper to reciprocate along the X direction on the first linear module.

[0011] Preferably, the first linear module is also slidably connected with a re-inspection mechanism. The re-inspection mechanism includes a third module slider, a re-inspection camera and a re-inspection light source. The third module slider is slidably connected with the first linear module to drive the re-inspection camera and the re-inspection light source to reciprocate along the X direction. The re-inspection camera and the re-inspection light source are coaxially arranged along the vertical direction.

[0012] Preferably, the first detection device includes a multi-camera structure and a 3D line scan structure;

[0013] The multi-camera structure includes a first mounting bracket fixed to the frame and a first camera, a second camera, a third camera and a multi-camera light source arranged in the first mounting bracket. The first camera and the multi-camera light source are arranged along the vertical direction. The first camera is used to photograph the bottom surface of the chip. The second camera and the third camera are respectively arranged on both sides of the first camera along the X direction. The second camera and the third camera respectively photograph the chip at an angle of 45 degrees obliquely upward.

[0014] The 3D line scan structure includes a second mounting bracket fixed to the frame. A slide table extending along the Y direction is arranged in the second mounting bracket, and a 3D line scan camera is arranged on the slide table.

[0015] Preferably, the tray transfer mechanism includes a second gantry arranged along the X direction. The second gantry is provided with a second linear module and a tray gripper. The second linear module extends along the X direction, and the second linear module is used to drive the tray gripper to reciprocate along the X direction;

[0016] The tray gripper includes a first mounting plate, a lifting motor, and a tray jaw. The first mounting plate is slidably connected to the second linear module. The lifting motor is fixed to the first mounting plate and is used to drive the tray jaw to reciprocate vertically.

[0017] Preferably, the second detection device includes a third linear module and a front camera structure disposed on the second gantry. The third linear module extends along the X direction and is disposed on the side of the second gantry away from the second linear module. The third linear module is used to drive the front camera structure to reciprocate along the X direction;

[0018] The front camera structure includes a second mounting plate. The second mounting plate is slidably connected to the third linear module. The second mounting plate is provided with a front camera lens and a front camera light source coaxially mounted in the vertical direction.

[0019] Preferably, the taping mechanism includes a conveying track, a heat sealing assembly, a winding assembly, and a taping detection assembly. The conveying track is used to input a carrier tape loaded with qualified chips to the heat sealing assembly. The heat sealing assembly is used to heat-seal and package the cover tape and the carrier tape. The winding assembly is used to wind the packaged qualified chips. The taping detection assembly is used to detect the state of the chips to be taped and packaged.

[0020] The present invention also provides a method for detecting and sorting chips, including the following sorting steps:

[0021] S1. After power-on self-check, start the running program. At the same time, manually place the test tray loaded with the chips to be detected on the loading station of the first conveyor line, and place the empty tray on the first unloading station of the second conveyor line;

[0022] S2. The first conveyor line conveys the test tray along the Y direction to the first detection station, and the second conveyor line conveys the empty tray along the Y direction to the first sorting station;

[0023] S3. The loading mechanism grabs the chips from the test tray to the first detection device. The first detection device detects the bottom and side surfaces of the chips and transmits the detection result to the unloading mechanism; after the chip detection is completed, the loading mechanism transfers the chips back to the test tray;

[0024] S4. The first conveyor line conveys the test tray to the second detection station. The second detection device detects the front surface of the chips and transmits the detection result to the unloading mechanism; then the tray transfer mechanism transfers the test tray after detection to the third conveyor line;

[0025] S5. The third conveyor line conveys the trays to be sorted to the second sorting station, and the blanking mechanism sorts the defective chips in the trays to be sorted into the empty trays located at the first sorting station according to the detection results in step S3 and step S4;

[0026] S6. The second conveyor line conveys the trays carrying defective chips to the first blanking station; meanwhile, the third conveyor line conveys the trays carrying good chips to the second blanking station or the blanking mechanism transfers the good chips in the trays to the tape cells of the taping mechanism;

[0027] S7. When the good chips are transferred to the tape cells of the taping mechanism, the taping mechanism packages the good chips.

[0028] Preferably, the second detection stations are provided above the first conveyor line, the second conveyor line and the third conveyor line. In step S4: after the first conveyor line conveys the tray to be inspected below the tray transfer mechanism, the tray gripper in the tray transfer mechanism grabs the tray to be inspected and transfers the tray to be inspected to the second detection station of the third conveyor line. The front camera structure in the second detection device detects the front of the chip at the second detection station and conveys the detection result to the blanking mechanism.

[0029] Compared with the prior art, the chip detection and sorting device provided in the embodiment of the present invention has the following beneficial effects:

[0030] In the present invention, a total of three conveyor lines are provided. The first conveyor line is used for loading, the first blanking station of the second conveyor line is used for blanking defective products, and the end of the third conveyor line is provided with a second blanking station and a taping module. The second blanking station and the taping module are respectively used for blanking and packaging good chips, and the detection module is also respectively provided with a first detection device and a second detection device. The first detection device is used to detect the bottom and side of the chip, and the second detection device can detect the front of the chip. The feeding mechanism can transfer the chip to the first detection device for detection work, reducing the problem of chip damage caused by manual chip movement, and can also grab multiple chips for detection at the same time, improving the detection efficiency of the chip; while the blanking mechanism can quickly sort the chips according to the detection results of the detection module, eliminating the inefficiency of manual sorting and possible chip damage, making the sorting efficiency of the chips higher. In the whole process of chip detection and sorting, the participation of manual labor is reduced, the efficiency is higher, and the chip damage rate is lower. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a top view of the present invention;

[0032] Figure 2 is a three-dimensional view of the present invention;

[0033] Figure 3 is a schematic structural diagram of the loading and unloading gripper module of the present invention;

[0034] Figure 4 is a schematic structural diagram of the multi-camera structure of the present invention;

[0035] Figure 5 is a schematic structural diagram of the 3D line scan structure of the present invention;

[0036] Figure 6 is a schematic structural diagram of the second detection device of the present invention;

[0037] Figure 7 is a schematic process diagram of the present invention.

[0038] In the figure: 1, frame;

[0039] 2, loading and unloading gripper module; 21, loading mechanism; 211, first module mover; 212, loading gripper; 22, unloading mechanism; 221, second module mover; 222, unloading gripper; 23, first gantry; 231, first linear module; 24, re-inspection mechanism; 241, third module mover; 242, re-inspection camera; 243, re-inspection light source;

[0040] 3, detection module; 31, first detection device; 311, multi-camera structure; 3111, first mounting frame; 3112, first camera; 3113, second camera; 3114, third camera; 3115, multi-camera light source; 312, 3D line scan structure; 3121, second mounting frame; 3122, slide table; 3123, 3D line scan camera; 32, second detection device; 321, third linear module; 322, front camera structure; 3221, second mounting plate; 3222, front camera lens; 3223, front camera light source;

[0041] 4, transfer module; 41, first conveyor line; 411, loading station; 42, second conveyor line; 421, first unloading station; 43, third conveyor line; 431, second unloading station; 44, tray transfer mechanism; 441, second gantry; 442, second linear module; 443, tray gripper; 4431, first mounting plate; 4432, tray jaw;

[0042] 5, taping module; 51, taping mechanism; 511, conveying track; 512, heat sealing component; 513, winding component; 514, taping detection component. Detailed implementation manners

[0043] The following combines the accompanying drawings and embodiments to further describe in detail the specific implementation manners of the present invention. The following embodiments are used to illustrate the present invention, but are not used to limit the scope of the present invention.

[0044] As Figure 1 and Figure 2 shown, a preferred embodiment of the present invention provides a chip detection and sorting device, which has a vertically intersecting Y direction and X direction, and includes a frame 1. The frame 1 is provided with a loading and unloading gripper module 2, a detection module 3, a transfer module 4, and a taping module 5;

[0045] The transfer module 4 includes a first conveyor line 41, a second conveyor line 42, a third conveyor line 43, and a tray transfer mechanism 44 arranged side by side. The first conveyor line 41, the second conveyor line 42, and the third conveyor line 43 all extend along the Y direction. The tray transfer mechanism 44 is arranged along the X direction, and the tray transfer mechanism 44 is used to transfer chip trays between the first conveyor line 41, the second conveyor line 42, and the third conveyor line 43;

[0046] The detection module 3 includes a first detection device 31 and a second detection device 32. The first detection device 31 is used to detect the side and bottom surfaces of the chip, and the first detection device 31 is arranged on one side of the first conveyor line 41 away from the second conveyor line 42; The second detection device 32 is used to detect the front surface of the chip, and the second detection device 32 is arranged along the Y direction on one side of the first detection device 31, and the second detection device 32 is arranged directly above the first conveyor line 41 or the second conveyor line 42;

[0047] The taping module 5 includes a taping mechanism 51, and the taping mechanism 51 is arranged on one side of the third conveyor line 43 away from the second conveyor line 42, and the taping mechanism 51 is used to tape and package the chips;

[0048] The loading and unloading gripper module 2 includes a loading mechanism 21 and an unloading mechanism 22. The loading mechanism 21 is used to transfer chips between the first conveyor line 41 and the first detection device 31; The unloading mechanism 22 is used to transfer chips between the second conveyor line 42, the third conveyor line 43, and the taping mechanism 51.

[0049] Specifically, in the traditional solution, the detection and sorting of finished chips include multiple processes. Between each process, manual transfer is often relied upon, and the detection of chips also often depends on manual labor. This not only has low efficiency, but also the chips are prone to irreversible damage during multiple transfers and detections, resulting in a low chip yield. In the present invention, the chips to be detected are placed in a tray and conveyed along the Y direction by the first conveyor line 41, passing through the first detection device 31 and the second detection device 32 in sequence. When the tray is near the first detection device 31, the first conveyor line 41 will stop, so that the feeding mechanism 21 can transfer the chips in the tray to the first detection device 31 for detection. After the detection is completed, the first conveyor line 41 will continue to move the tray until the tray is directly below the second detection device 32. At this time, the second detection device 32 can detect the front side of the chip. When all the detection processes of the chip are completed, the tray transfer mechanism 44 will transfer the tray to the third conveyor line 43. The tray is conveyed by the third conveyor line 43 in the reverse Y direction to directly below the discharging mechanism 22. Subsequently, the discharging mechanism 22 will sort the chips according to the detection results of the first detection device 31 and the second detection device 32, sorting the defective chips into the empty trays on the second conveyor line 42, and only the good chips are left in the original tray. Then the original tray is conveyed to the second discharging station, or is transferred by the discharging mechanism 22 to the taping module 5 for taping and packaging. In this entire detection and sorting process, it is fully automated without manual contact, which not only improves the detection efficiency and sorting efficiency of the chips, but also reduces the chip damage problem caused by manual transfer of chips, and improves the overall yield of the chips.

[0050] In some embodiments, one end of the first conveyor line 41 is provided with a feeding station 411. The first conveyor line 41 is used to convey the tray of chips to be detected along the Y direction to the tray transfer mechanism 44; one end of the second conveyor line 42 far from the tray transfer mechanism 44 is provided with a first discharging station 421; on one side of the third conveyor line 43 far from the tray transfer mechanism 44, there are provided a second discharging station 431 and a taping mechanism 51.

[0051] Specifically, multiple rows of chips are placed in a tray, and the tray is conveyed in the Y direction by the first conveyor line 41. When the tray is conveyed to the first detection station, the loading mechanism 21 grabs a row of chips and moves them in the X direction above the first detection device 31. Subsequently, the first detection device 31 detects the bottom and side surfaces of the chips. After a row of chips is detected, the loading mechanism 21 moves back in the X direction to the first detection station, places the detected chips back in their original positions on the tray, grabs the next row of chips, and repeats the above actions until all the chips in this tray are detected. Then, the first conveyor line 41 continues to convey the tray to be inspected to the second detection station. At this time, the front surface of the chips can be detected by the second detection device 32. Subsequently, the first conveyor line 41 continues to convey the tray and moves it below the tray gripper 443 for tray transfer; alternatively, after the tray transfer mechanism 44 transfers the entire tray to the third conveyor line 43, the front surface of the chips can be detected by the second detection device 32. During the detection of the front surface of the chips, the conveyor line drives the tray to move in the Y direction, and the second detection device 32 can reciprocate in the X direction to detect the front surfaces of all the chips in the tray. Its detection range is wider, and it can adapt to the detection requirements of more different sizes of chips. After the front surfaces of all the chips in the tray are detected, the third conveyor line 43 conveys the detected tray in the reverse Y direction to the second sorting station. At the second sorting station, the unloading mechanism 22 transfers the chips detected as defective products into an empty tray on the second conveyor line 42, while the qualified chips remain in the original tray. When the empty tray loaded with defective chips is full, the second conveyor line 42 conveys the tray to the first unloading station 421 for the staff to take away. After the defective chips in the original tray are sorted out, all the remaining chips are qualified chips. According to different shipping packaging requirements, such as shipping in tray packaging or tape packaging, etc., the original tray can be conveyed by the third conveyor line 43 to the second unloading station 431, or the unloading mechanism 22 can convey the qualified chips to the taping module 5 for packaging and shipping.

[0052] As Figure 3 shown, in some embodiments, the loading and unloading gripper module 2 includes a first gantry 23 arranged in the X direction. The first gantry 23 is provided with a first linear module 231, and the first linear module 231 extends in the X direction. The loading mechanism 21 includes a first module slider 211 and a loading gripper 212, and the unloading mechanism 22 includes a second module slider 221 and an unloading gripper 222. The first module slider 211 and the second module slider 221 respectively drive the loading gripper 212 and the unloading gripper 222 to reciprocate in the X direction on the first linear module 231.

[0053] Specifically, both the loading gripper 212 and the unloading gripper 222 suck and fix the chips to be detected and sorted through a pneumatic structure. Both the loading gripper 212 and the unloading gripper 222 are slidably arranged on the first linear module 231, which can improve the space utilization rate of the entire device, avoid excessive space occupation, and the operating ranges of the loading gripper 212 and the unloading gripper 222 are also different, and the movements between the two will not interfere with each other. Further, in this embodiment, the linear module can adopt a three-mover linear motor to drive the movement of the loading gripper 212 or the unloading gripper 222. In addition, in a specific embodiment, the unloading gripper 222 is provided with seven suction nozzles, which can complete the classified placement of good chips and defective chips, or move the good chips from the tray to the inner packaging of the tape, and can complete the picking and placing of single chips, or the simultaneous picking and placing of multiple chips.

[0054] In some embodiments, the first linear module 231 is also slidably connected with a re-inspection mechanism 24. The re-inspection mechanism 24 includes a third module mover 241, a re-inspection camera 242 and a re-inspection light source 243. The third module mover 241 is slidably connected with the first linear module 231 to drive the re-inspection camera 242 and the re-inspection light source 243 to reciprocate along the X direction. The re-inspection camera 242 and the re-inspection light source 243 are coaxially arranged in the vertical direction.

[0055] Specifically, the re-inspection mechanism 24 can perform a secondary re-inspection on the sorted chips. The re-inspection light source 243 provides the light required for detection. The re-inspection camera 242 is arranged above the re-inspection light source 243. The re-inspection camera 242 can detect the front of the chip again to ensure that there are no defective chips missed or undetected in the tray of the third conveyor line 43. At the same time, a sensor for stack detection is also installed beside the re-inspection camera 242 in the re-inspection mechanism 24, which can detect whether there are problems of chip stacking and shortage in the tray grid, and then timely remind the worker to confirm and replenish the materials, or take out the chips placed in excess in the grid.

[0056] As Figure 4 and Figure 5 shown, in some embodiments, the first detection device 31 includes a multi-camera structure 311 and a 3D line scan structure 312;

[0057] The multi-camera structure 311 includes a first mounting bracket 3111 fixed to the frame 1 and a first camera 3112, a second camera 3113, a third camera 3114 and a multi-camera light source 3115 arranged in the first mounting bracket 3111. The first camera 3112 and the multi-camera light source 3115 are arranged in the vertical direction. The first camera 3112 is used to photograph the bottom surface of the chip. The second camera 3113 and the third camera 3114 are arranged on both sides of the first camera 3112 along the X direction. The second camera 3113 and the third camera 3114 respectively photograph the chip at a 45-degree angle from the upper left.

[0058] The 3D line scan structure 312 includes a second mounting bracket 3121 fixed to the frame 1. A slide table 3122 extending in the Y direction is provided inside the second mounting bracket 3121, and a 3D line scan camera 3123 is provided on the slide table 3122.

[0059] Specifically, in this embodiment, the multi-camera structure 311 and the 3D line scan structure 312 are arranged along the X direction on the side of the first conveyor line 41 away from the second conveyor line 42, and the projection of the connection line between the multi-camera structure 311 and the 3D line scan structure 312 coincides with the movement path of the loading mechanism 21; when the tray is moved to directly below the loading mechanism 21 on the first conveyor line 41, the loading mechanism 21 will grab the chip and move it to the multi-camera structure 311 for detection, or move it to the 3D line scan structure 312 for scanning detection. Among them, according to different chip packaging types and different chip detection items, the detection items on the bottom side of the chip can be photographed separately by a single camera in the multi-camera structure 311, or photographed and detected simultaneously by two or more cameras; that is, the four cameras, namely the first camera 3112, the second camera 3113, the third camera 3114, and the 3D line scan camera 3123, can work independently or cooperate in combination according to different detection items. Further, in the multi-camera structure 311, the multi-camera light source 3115 is arranged below the chip to provide light for the detection of the chip, and the first camera 3112, the second camera 3113, and the third camera 3114 are all photographed from bottom to top. The three cameras can focus on the same position on the focal plane, take pictures simultaneously, and acquire images from multiple angles, or a single camera can separately acquire images of different faces of the chip. It can complete the acquisition of images of the bottom and four sides of the chip, and judge the images from each angle through software algorithms, and can detect most of the appearance defects, as well as height, size, short circuit, disconnection and other defective features on each face of the chip. Even further, the 3D line scan camera 3123 is also photographed from bottom to top, and can scan the bottom surface of the chip to obtain the height data of the bottom surface of the chip. The software can perform height analysis on the bottom surface features of the chip through this height information; the 3D line scan camera 3123 can slide along the Y direction on the slide table 3122 to achieve full coverage of the bottom surfaces of chips of various sizes.

[0060] As Figure 6 shown, in some embodiments, the tray transfer mechanism 44 includes a second gantry 441 arranged along the X direction. The second gantry 441 is provided with a second linear module 442 and a tray gripper 443. The second linear module 442 extends along the X direction, and the second linear module 442 is used to drive the tray gripper 443 to reciprocate along the X direction;

[0061] The tray gripper 443 includes a first mounting plate 4431, a lifting motor, and a tray jaw 4432. The first mounting plate 4431 is slidably connected to the second linear module 442. The lifting motor is fixed to the first mounting plate 4431 and is used to drive the tray jaw 4432 to reciprocate vertically.

[0062] Specifically, the second gantry 441 is horizontally arranged above the three conveyor lines and is arranged on the side of the first conveyor line 41 away from the feeding station 411. When the chip is detected at the first detection station, the first conveyor line 41 will continue to convey the tray to directly below the second gantry 441. At this time, the second linear module 442 can drive the tray gripper 443 to move along the X direction to directly above the tray. Subsequently, the lifting motor starts to drive the tray jaw 4432 to move downward to the position of the tray. The tray jaw 4432 clamps the tray under the action of pneumatic drive. Then, the lifting motor drives the tray jaw 4432 and the tray to move upward vertically. The second linear module 442 drives the first mounting plate 4431 to move along the X direction until the tray is located above the third conveyor line 43. The lifting motor then cooperates with the tray jaw 4432 to place the tray on the third conveyor line 43.

[0063] In addition, the second linear module 442 can adopt a belt module or a linear motor, or other module structures that can drive the tray gripper 443 to reciprocate linearly along the X direction.

[0064] In some embodiments, the second detection device 32 includes a third linear module 321 and a front camera structure 322 provided on the second gantry 441. The third linear module 321 extends along the X direction and is arranged on the side of the second gantry 441 away from the second linear module 442. The third linear module 321 is used to drive the front camera structure 322 to reciprocate along the X direction;

[0065] The front camera structure 322 includes a second mounting plate 3221. The second mounting plate 3221 is slidably connected to the third linear module 321. The second mounting plate 3221 is vertically provided with a coaxially mounted front camera lens 3222 and a front camera light source 3223.

[0066] Specifically, second detection stations are provided on the first conveyor line 41, the second conveyor line 42, and the third conveyor line 43. The second detection device 32 can detect the front side of the chip at different second detection stations according to requirements. The detection of the front side of the chip can be carried out on the first conveyor line 41 or on the third conveyor line 43. The third linear module 321 drives the front camera structure 322 to reciprocate along the X direction, and the conveyor line drives the tray along the Y direction, so that the camera field of view of the front camera structure 322 can cover the fronts of the entire trays on the first conveyor line 41, the second conveyor line 42, and the third conveyor line 43, thereby meeting the detection requirements of different detection positions. For the detection of the front side of the chip, the entire tray is placed below the front camera light source 3223. The front camera light source 3223 emits light from the bottom downward. The front camera lens 3222 obtains the light reflected by the fronts of each chip, and uses this to obtain the status information of the front side of the chip, identify defective chips, and send the position information of the defective chips to the blanking mechanism 22. The blanking mechanism 22 can then combine this information to remove and transfer the defective products.

[0067] In some embodiments, the taping mechanism 51 includes a conveying track 511, a heat-sealing assembly 512, a winding assembly 513, and a taping detection assembly 514. The conveying track 511 is used to input the carrier tape filled with good chips to the heat-sealing assembly 512. The heat-sealing assembly 512 is used to heat-seal and package the cover tape and the carrier tape. The winding assembly 513 is used to wind the packaged good chips. The taping detection assembly 514 is used to detect the status of the chips to be taped and packaged and the status of the sealed area after taping and packaging.

[0068] Specifically, the taping mechanism 51 includes a carrier tape and a cover tape. The carrier tape is provided with blank spaces for accommodating chips. The blanking mechanism 22 places the good chips in the tray into the blank spaces. The conveying track 511 then conveys the carrier tape towards the heat-sealing assembly 512. In the heat-sealing assembly 512, the cover tape covers the carrier tape and is heat-sealed together with the carrier tape, thereby sealing and packaging the chips in the blank spaces. The taping detection assembly 514 can perform a final inspection on the chips before packaging, detect the placement direction of the chips in the grid positions, whether there are too many or too few chips placed in the grid positions, and other defects on the front side of the chips. If there are abnormalities, the blanking manipulator can also replace the materials before heat-sealing the cover tape to avoid defective chips from being packaged. In addition, the taping detection assembly 514 can also detect the packaged tape, detect whether the status of the heat-pressed sealed area is intact, and avoid problems such as poor sealing, breakage, and empty packaging in the taping and packaging.

[0069] See Figure 7 , the present invention also provides a chip detection and sorting method, using the aforementioned chip detection and sorting equipment, including the following sorting steps:

[0070] S1. After the power-on self-test, start the running program. At the same time, manually place the tray to be inspected with the chips to be inspected on the loading station 411 of the first conveyor line 41, and place the empty tray on the first unloading station 421 of the second conveyor line 42;

[0071] S2. The first conveyor line 41 conveys the tray to be inspected along the Y direction to the first inspection station, and the second conveyor line 42 conveys the empty tray along the Y direction to the first sorting station;

[0072] S3. The loading mechanism 21 grabs the chips from the tray to be inspected to the first detection device 31. The multi-camera structure 311 and the 3D line scan structure 312 in the first detection device 31 detect the bottom and side surfaces of the chips; after the chip detection is completed, the loading mechanism 21 transfers the chips back to the tray to be inspected and conveys the detection results to the unloading mechanism 22;

[0073] S4. The first conveyor line 41 conveys the tray to be inspected after the first round of inspection to the second inspection station. The front camera structure 322 in the second detection device 32 detects the front of the chips at the second inspection station and conveys the detection results to the unloading mechanism 22; then the first conveyor line 41 conveys the tray after the front inspection to the tray grabbing position. The tray gripper 443 in the tray transfer mechanism 44 grabs the tray to be sorted after the inspection and transfers the tray to be sorted to the third conveyor line 43;

[0074] S5. The third conveyor line 43 conveys the tray to be sorted to the second sorting station. The unloading mechanism 22 sorts the defective chips in the tray to be sorted into the empty tray at the first sorting station according to the detection results in step S3 and step S4;

[0075] S6. The second conveyor line 42 conveys the tray with defective chips to the first unloading station 421; at the same time, the third conveyor line 43 conveys the tray with good chips to the second unloading station 431, or the unloading mechanism 22 transfers the good chips in the tray to the carrier tape grid of the taping mechanism 51;

[0076] S7. When the good chips are transferred to the carrier tape grid of the taping mechanism 51, the taping detection component 514 detects the chips in the carrier tape grid. When the taping detection component 514 detects defective chips, the unloading mechanism 22 sucks the defective chips into the empty tray at the first sorting station and sucks new good chips from the good chip tray into the carrier tape of the taping mechanism 51. Then the heat sealing component 512 completes the heat sealing connection between the carrier tape and the cover tape, and the winding component 513 winds and packs the packaged good chips.

[0077] Specifically, in this embodiment, for the detection and sorting of chips, the to-be-inspected tray can be conveyed to the first detection station by the first conveyor line 41. Then, the feeding gripper 212 sucks and fixes the chips, and transfers the chips to the multi-camera structure 311 and the 3D line-scan structure 312 in sequence for detection. According to the different numbers of chips in the to-be-inspected tray and the different numbers of chips sucked by the feeding gripper 212 at a time, the feeding gripper 212 needs to make multiple round trips to grab chips for detection until all the chips in the to-be-inspected tray are detected. During this process, the first detection device 31 cooperates with the feeding mechanism 21 to send the information of defective products to the sorting controller for processing; when the bottom and side surfaces of all chips are detected, the first conveyor line 41 continues to convey the to-be-inspected tray to the second detection station. Subsequently, the front camera structure 322 reciprocates along the X direction to complete the scanning detection of the front state of the chips. For the detected defective products, the blanking mechanism 22 is also controlled by the controller for processing; when the detection of the chips is all completed, the tray gripper 443 can start to transfer the to-be-sorted tray to the third conveyor line 43. The third conveyor line 43 conveys the to-be-sorted tray to the second sorting station. At this time, the sorting controller controls the blanking mechanism 22 to accurately grab the defective products and transfer the defective products to the empty tray on the second conveyor line 42. The sorting controller can be a device such as a chip computer. After the defective product chips are transferred, the blanking gripper 222 can transfer the non-defective product chips to the empty spaces in the tape for packaging, or the third conveyor line 43 conveys the tray full of non-defective product chips in the reverse Y direction to the second blanking station. In the above entire process, only at the beginning stage does a worker need to put in the to-be-inspected tray and the empty tray. The transfer and detection in the chip detection process and the sorting process do not require the participation of workers, and the efficiency of detection, sorting, and transportation is higher, and the detection process and the sorting process are also more stable and reliable.

[0078] In addition, in some other embodiments, for the sorting of defective product chips and tray chips by the blanking gripper 222, all the defective product chips can be first taken out and placed into the empty tray on the second conveyor line 42, and then non-defective product chips are taken to supplement the empty spaces after sorting of the original tray. When the empty spaces on the original tray are supplemented, the blanking gripper 222 can grab multiple chips at one time and transfer them to the carrier tape spaces of the taping mechanism 51 for taping and packaging, which improves the efficiency of taping and packaging and reduces the complexity of the operation of the mechanism; and the empty trays on the second conveyor line 42 can be partitioned to store different types of defective product chips, thereby improving the efficiency of subsequent classification and detection of defective products.

[0079] Furthermore, during the actual detection and sorting process, when the empty tray on the second conveyor line 42 for placing defective chips is full, the tray is conveyed by the second conveyor line 42 to the first discharging station 421. At the same time, the empty tray after being tape-wound on the third conveyor line 43 will be moved under the tray gripper 4432 and transferred by the tray gripper 4432 to the second conveyor line 42 for loading new defective chips, reducing manual participation and improving the efficiency of the entire equipment in sorting chips.

[0080] In some embodiments, a second detection station is provided above each of the first conveyor line 41, the second conveyor line 42, and the third conveyor line 43. In step S4: after the first conveyor line 41 conveys the tray to be inspected under the tray transfer mechanism 44, the tray gripper 443 in the tray transfer mechanism 44 grabs the tray to be inspected and transfers the tray to be inspected to the second detection station on the third conveyor line 43. The front camera structure 322 in the second detection device 32 detects the front of the chip at the second detection station and transmits the detection result to the discharging mechanism 22. Specifically, in this embodiment, since there are multiple second detection stations, during the detection and sorting process of the chips, the tray transfer mechanism 44 can choose whether to transfer the tray first and then detect the front of the chip or to detect the front of the chip first and then transfer the tray according to the timing of other processes. For example, when there is no empty tray on the second conveyor line 42 and the discharging mechanism 22 is sorting defective products and requires the tray transfer mechanism 44 to transfer the empty tray on the third conveyor line 43 to the second conveyor line 42, at this time, the front of the chip is detected at the second detection station on the first conveyor line 41, and the front detection of the chip and the transfer of the tray are carried out simultaneously, and the overall working efficiency of the equipment is higher; when there is a tray on the second conveyor line 42 carrying defective chips and there are multiple trays that have completed one round of detection piled up on the first conveyor line 41, or when there is no tray to be sorted on the third conveyor line 43, the tray on the first conveyor line 41 can be preferentially transferred to the third conveyor line 43, and the second detection device 32 detects the front of the chip at the second detection station on the third conveyor line 43 to improve the efficiency of chip detection and transfer.

[0081] In summary, the embodiment of the present invention provides a chip detection and sorting device, which realizes the automatic transportation of the chip tray to be detected through three conveyor lines. The first detection device 31 is arranged beside the first conveyor line 41, and the taping mechanism 51 is arranged on one side of the third conveyor line 43. The chip is transferred between the conveyor line, the first detection device 31 and the taping mechanism 51 through the feeding mechanism 21 and the discharging mechanism 22, with higher efficiency and greater stability. The second detection device 32 is located directly above the conveyor line and can detect the front side of the chip on different conveyor lines, eliminating the trouble of chip transfer. Moreover, the first detection device 31 and the second detection device 32 are separately arranged, enabling two types of detections to be carried out simultaneously. The device can automatically complete various visual detections of multiple surfaces of the chip, classify and package them, and further improve the overall detection efficiency.

[0082] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art of this technology, without departing from the technical principle of the present invention, several improvements and substitutions can be made, and these improvements and substitutions should also be regarded as the protection scope of the present invention.

Claims

1. A chip detection and sorting device, having an X direction and a Y direction intersecting vertically, comprising a frame, characterized in that: The frame is provided with a loading and unloading gripper module, a detection module, a transfer module and a braiding module; The transfer module comprises a first conveyor line, a second conveyor line, a third conveyor line and a tray transfer mechanism arranged side by side, wherein the first conveyor line, the second conveyor line and the third conveyor line are all extended along the Y direction, and the tray transfer mechanism is arranged along the X direction, and the tray transfer mechanism is used to transfer the chip tray between the first conveyor line, the second conveyor line and the third conveyor line; The detection module includes a first detection device and a second detection device, wherein the first detection device is used to detect the side and bottom surfaces of the chip, and the first detection device is arranged on a side of the first conveyor line away from the second conveyor line; the second detection device is used to detect the front surface of the chip, and the second detection device is arranged on a side of the first detection device along the Y direction, and the second detection device is arranged directly above the first conveyor line or the second conveyor line; The taping module comprises a taping mechanism, which is arranged on a side of the third conveying line away from the second conveying line, and is used for taping and packaging the chip; The loading and unloading gripper module includes a loading mechanism and a unloading mechanism, wherein the loading mechanism is used to transfer chips between the first conveyor line and the first detection device; the unloading mechanism is used to transfer chips between the second conveyor line, the third conveyor line and the braiding mechanism; The loading and unloading gripper module comprises a first gantry arranged along the X direction, the first gantry is provided with a first linear module, the first linear module is extended along the X direction, the loading mechanism comprises a first module mover and a loading gripper, the unloading mechanism comprises a second module mover and a unloading gripper, the first module mover and the second module mover respectively drive the loading gripper and the unloading gripper to reciprocate along the X direction on the first linear module; The tray transfer mechanism includes a second gantry arranged along the X direction, the second gantry is provided with a second linear module and a tray gripper, the second linear module is extended along the X direction, and the second linear module is used to drive the tray gripper to reciprocate along the X direction; The second detection device includes a third linear module and a front camera structure arranged on the second gantry, the third linear module is extended along the X direction, and the third linear module is arranged on a side of the second gantry away from the second linear module, and the third linear module is used to drive the front camera structure to reciprocate along the X direction.

2. The chip detection and sorting equipment according to claim 1, characterized in that: A loading station is provided at one end of the first conveyor line, and the first conveyor line is used to convey the chip tray to be tested to the tray transfer mechanism along the Y direction; a first unloading station is provided at one end of the second conveyor line away from the tray transfer mechanism; a second unloading station and the braiding mechanism are provided at one side of the third conveyor line away from the tray transfer mechanism.

3. The chip detection and sorting equipment according to claim 1, characterized in that: The first linear module is also slidably connected to a re-inspection mechanism, which includes a third module mover, a re-inspection camera and a re-inspection light source. The third module mover is slidably connected to the first linear module to drive the re-inspection camera and the re-inspection light source to reciprocate along the X direction. The re-inspection camera and the re-inspection light source are coaxially arranged in the vertical direction.

4. The chip detection and sorting equipment according to claim 2, characterized in that: The first detection device includes a multi-camera structure and a 3D line scanning structure; The multi-camera structure includes a first mounting frame fixed to a frame, and a first camera, a second camera, a third camera, and a multi-camera light source arranged in the first mounting frame, wherein the first camera and the multi-camera light source are arranged in a vertical direction, the first camera is used to photograph the bottom surface of the chip, the second camera and the third camera are arranged on both sides of the first camera along the X direction, and the second camera and the third camera respectively photograph the chip at a 45-degree upward angle; The 3D line scan structure includes a second mounting frame fixed to a frame, a slide extending along the Y direction is arranged in the second mounting frame, and a 3D line scan camera is arranged on the slide.

5. The chip detection and sorting equipment according to claim 2, characterized in that: The tray gripper includes a first mounting plate, a lifting motor and a tray clamp, the first mounting plate is slidably connected to the second linear module, the lifting motor is fixed to the first mounting plate, and the lifting motor is used to drive the tray clamp to reciprocate in the vertical direction.

6. The chip detection and sorting equipment according to claim 5, characterized in that: The front camera structure includes a second mounting plate, the second mounting plate is slidably connected to the third linear module, and the second mounting plate is provided with a coaxially mounted front camera lens and a front camera light source along the vertical direction.

7. The chip detection and sorting equipment according to claim 1, characterized in that: The taping mechanism includes a conveying track, a heat sealing component, a winding component and a taping detection component. The conveying track is used to input a carrier tape full of good chips to the heat sealing component. The heat sealing component is used to heat-seal and package the cover tape and the carrier tape. The winding component is used to wind up the packaged good chips. The taping detection component is used to detect the status of the chips to be taped and the status of the seal after taping.

8. A chip detection and sorting method, using the chip detection and sorting device according to any one of claims 1 to 7, characterized in that: The sorting steps include: S1. Start the running program after the power-on self-test, and manually place the tray with the chips to be tested on the loading station of the first conveyor line, and place the empty tray on the first unloading station of the second conveyor line; S2, the first conveyor line conveys the pallet to be inspected to the first inspection station along the Y direction, and the second conveyor line conveys the empty pallet to the first sorting station along the Y direction; S3, the loading mechanism grabs the chip from the tray to be inspected and puts it into the first inspection device, the first inspection device inspects the bottom and side surfaces of the chip and transmits the inspection results to the unloading mechanism; after the chip inspection is completed, the loading mechanism transfers the chip back to the tray to be inspected; S4, the first conveyor line conveys the tray to be inspected to the second inspection station, the second inspection device inspects the front of the chip and transmits the inspection result to the unloading mechanism; then the tray transfer mechanism transfers the tray to be sorted after the inspection to the third conveyor line; S5, the third conveyor line conveys the tray to be sorted to the second sorting station, and the unloading mechanism sorts the defective chips in the tray to be sorted into the empty tray at the first sorting station according to the detection results in step S3 and step S4; S6, the second conveyor line conveys the tray carrying defective chips to the first unloading station; at the same time, the third conveyor line conveys the tray carrying good chips to the second unloading station, or the unloading mechanism transfers the good chips in the tray to the tape carrier grid of the tape mechanism; S7. When the good chips are transferred to the carrier grid of the taping mechanism, the taping mechanism packages the good chips.

9. A chip detection and sorting method according to claim 8, characterized in that: The second inspection station is arranged above the first conveyor line, the second conveyor line and the third conveyor line. In step S4: after the first conveyor line conveys the tray to be inspected to the bottom of the tray transfer mechanism, the tray gripper in the tray transfer mechanism grabs the tray to be inspected and transfers the tray to be inspected to the second inspection station of the third conveyor line, and the front camera structure in the second inspection device inspects the front side of the chip at the second inspection station and transmits the inspection result to the unloading mechanism.

Images