Chip selection mechanism in integrated circuit packaging process and driving assembly for chip selection mechanism

Abstract

The invention relates to the technical field of chip selection mechanisms, in particular to a chip selection mechanism in an integrated circuit packaging process, which comprises a detection screening table, supporting table columns are fixedly arranged at four corners below the detection screening table respectively, and a detection through hole is formed in the detection screening table; a detection through hole is formed in the detection screening table, supporting mounting plates are symmetrically and fixedly arranged on the portions, on the two sides of the detection through hole, of the detection screening table, movable mounting holes are formed in the supporting mounting plates, a moving channel is formed in the portion, on one side of the supporting mounting plates, of the detection screening table, and a supporting carrying rod is fixedly arranged in the moving channel. Comprising an electric telescopic rod, a driving carrier plate is fixedly installed on the electric telescopic rod, a detector is installed on the driving carrier plate, a positioning matching block is fixedly arranged on the driving carrier plate, the positioning matching block is inserted into a positioning matching hole, and matching channels are symmetrically formed in the driving carrier plate; and guide inserting rods are symmetrically and fixedly arranged below the driving carrier plate.

Description

Technical Field

[0001] The present invention relates to the technical field of chip selection mechanisms, and in particular to a chip selection mechanism in an integrated circuit packaging process and a driving component used for the mechanism. Background Art

[0002] Integrated circuit packaging is the process of wrapping an integrated circuit in a protective casing. Its purpose is to protect the chip from physical damage, environmental impact and electrostatic discharge, etc. During the integrated circuit packaging process, the wafer needs to be tested. This process is also called chip selection, that is, each chip on the wafer is electrically tested one by one, the electrical performance of the chip is checked, and the problematic chips are selected and marked so that the problematic chips can be removed during the subsequent cutting process to ensure the quality of the chip. However, the existing chip selection mechanism is not convenient to use, and manual operation of the fixture is required to fix the wafer to ensure its accurate position, ensure that the chip pins are aligned with the test contact points, and then ensure circuit connectivity, realize the connection between the wafer and the test equipment, and complete the chip test. Manual operation of the fixture not only makes the test efficiency relatively low, but also makes the work intensity of the staff greater. Summary of the invention

[0003] The purpose of the present invention is to provide a chip selection mechanism in the integrated circuit packaging process and a driving component used for the mechanism to solve the problems raised in the above background technology.

[0004] To achieve the above object, the present invention provides the following technical solutions: The chip selection mechanism in the integrated circuit packaging process includes a detection and screening platform, wherein support columns are fixedly arranged at the four lower corners of the detection and screening platform, and a detection through hole is opened on the detection and screening platform. Support mounting plates are symmetrically fixedly arranged on the detection and screening platform on both sides of the detection through hole, and a movable mounting hole is opened on the support mounting plate, and a moving channel is opened on the detection and screening platform next to the support mounting plate, a support carrier rod is fixedly arranged in the moving channel, and a matching through hole is opened on the detection and screening platform at one end of the moving channel, matching support plates are symmetrically fixedly arranged on the detection and screening platforms at both ends of the detection through hole, matching slides are symmetrically opened on both sides of the matching support plate, and a connecting through hole is opened on the detection and screening platform next to the matching support plate, a supporting table plate is fixedly arranged on the support column, guide matching holes are symmetrically opened on the support table plate, and a limited bottom plate is symmetrically fixedly arranged below the support table plate, and a convenient detection and screening component is arranged on the detection and screening platform.

[0005] Preferably, the portable detection and screening assembly includes a detector, a linkage carrier plate, a movable supporting rod, a movable mounting rod, a movable ring body and a supporting movable plate. A positioning matching hole is opened at the bottom of the detector, positioning columns are symmetrically fixedly arranged on both sides of the lower end of the detector, and a supporting plate is symmetrically fixedly arranged on both sides of the upper end of the detector, a rotating wheel is installed on the supporting plate, and a detection disk is fixedly installed on the upper end of the detector, a detection contact point is arranged on the detection disk, and the detection disk is electrically connected to the detector.

[0006] Preferably, there are two linkage carriers, which are symmetrically installed on both sides of the detection and screening platform, and a bevel matching strip is fixedly provided at the lower end of the linkage carrier, and a movable plug hole is opened on the linkage carrier on the upper side of the bevel matching strip, and a supporting carrier rod is plugged into the movable plug hole, and a first spring is sleeved on the supporting carrier rod.

[0007] Preferably, a bearing bending plate is symmetrically fixedly provided on the upper end of the linkage carrier plate, a pull-down frame is fixedly provided on the bearing bending plate, and the pull-down frame is connected to a movable bearing rod.

[0008] Preferably, the movable bearing rod is inserted in the matching through hole, and a supporting connecting plate is fixedly provided on the upper end of the movable bearing rod, a connecting plate is symmetrically fixedly provided on the supporting connecting plate, a matching connecting column is fixedly provided on the connecting plate, the matching connecting column is inserted in the pull-down frame, and a first connecting rod is hinged on the supporting connecting plate.

[0009] Preferably, a movable mounting rod is hinged at the lower end of the first connecting rod, the movable mounting rod is inserted into the movable mounting hole, and an arc clamping plate is fixedly provided on the movable mounting rod.

[0010] Preferably, a movable ring body is installed under the detection and screening platform, and a protruding supporting plate is symmetrically fixed on the movable ring body, a matching plug rod is fixed on the protruding supporting plate, the matching plug rod is inserted in the connecting through hole, and a second spring is sleeved on the matching plug rod, a connecting top plate is fixed on the upper end of the matching plug rod, a limiting vertical plate is fixed on the connecting top plate, and a second connecting rod is hinged on the connecting top plate.

[0011] Preferably, a bearing movable plate is hinged at the lower end of the second connecting rod, movable carrying bars are symmetrically fixedly provided on the bearing movable plate, matching slide bars are fixedly provided on the matching slide bars, and the matching slide bars are inserted in matching slideways.

[0012] A driving assembly comprises an electric telescopic rod, on which a driving carrier is fixedly mounted, on which a detector is mounted, and on which a positioning matching block is fixedly arranged, the positioning matching block is inserted in a positioning matching hole, matching channels are symmetrically provided on the driving carrier, and guide plug-in rods are symmetrically fixedly provided below the driving carrier, the guide plug-in rods are inserted in the guide matching holes, and a supporting bottom block is fixedly provided at the lower end of the guide plug-in rod, and the supporting bottom block is provided with a movable socket and a matching socket.

[0013] Preferably, a counterweight movable block is sleeved on the guide plug-in rod, a sliding through hole is opened on the counterweight movable block, a guide plug-in rod is inserted in the sliding through hole, and a matching contact rod is symmetrically fixed on the counterweight movable block, the matching contact rod is inserted in the matching socket, a third connecting rod is hinged on the counterweight movable block, a movable slat is hinged at the lower end of the third connecting rod, a matching limit rod is fixedly provided on the movable slat, the matching limit rod is inserted in the movable socket, and a positioning top plate is fixedly provided on the upper end of the movable slat, and a positioning sleeve is fixedly provided on the positioning top plate.

[0014] Compared with the prior art, the invention has the following advantages: 1. When testing the wafer, place it on the carrying movable plate, and then start the electric telescopic rod to drive the detector to move upward. As the detector moves upward, the carrying plate will push the linkage carrier to move. In this way, the arc clamping plate will be driven to move under the action of the first connecting rod to clamp and support the wafer, so as to realize automatic positioning and fixation of the wafer, so that the pins of the chip and the detection contact points can be aligned up and down, without manual operation, which is very convenient.

[0015] 2. As the detector continues to move upward, the carrier plate will contact the movable ring body, so the movable ring body will be pushed upward under the action of the carrier plate. As the movable ring body moves upward, the second connecting rod will drive the bearing movable plate to move so that it is no longer supported under the wafer. In this way, when the detection plate moves upward, it can ensure that the detection contact point contacts the chip pins smoothly, thereby completing the chip detection.

[0016] 3. In addition, as the driving carrier plate moves upward, the matching movable block remains stationary under the action of gravity, thereby reducing the distance between the supporting bottom block and the matching movable block until the matching contact rod is separated from the limiting bottom plate. In this way, the movable slat will be driven to move under the action of the third connecting rod so that the positioning sleeve on the movable slat is sleeved on the positioning column, thereby fixing the detector, ensuring the stability of the detector during movement, and also ensuring its stability during work. When the detector is in a non-working state, it is in an unlocked state, which is convenient for its installation and disassembly, and then convenient for its inspection or maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the first view of the assembly for the inspection screening station.

[0018] Figure 2 for Figure 1 A magnified schematic diagram of center A.

[0019] Figure 3 A second view of the screening station assembly for testing.

[0020] Figure 4 Schematic diagram of the third person view of the assembly for the inspection screening station.

[0021] Figure 5 for Figure 4 A magnified schematic diagram of point B in the middle.

[0022] Figure 6 for Figure 4 Enlarged schematic diagram of point C in the middle.

[0023] Figure 7 It is a schematic diagram of the structure of the detection and screening station.

[0024] Figure 8 This is a schematic diagram of the detector's first-person perspective structure.

[0025] Fig. 9 Schematic diagram of the second viewing angle structure of the detector.

[0026] Fig.10 It is an assembly diagram of the linkage carrier plate, movable load-bearing rod and movable mounting rod.

[0027] Fig.11 It is a structural schematic diagram of the movable load-bearing rod.

[0028] Fig.12 It is a structural schematic diagram of the movable ring body.

[0029] In the figure: 1. detection and screening table; 10. support column; 11. detection through hole; 12. support mounting plate; 121. movable mounting hole; 122. movable channel; 123. support carrier rod; 124. matching through hole; 13. matching support plate; 131. matching slideway; 132. connecting through hole; 14. support table; 141. electric telescopic rod; 142. guide matching hole; 143. drive carrier plate; 144. positioning matching block; 145. matching channel; 146. guide plug-in rod; 147. support bottom block; 148. movable socket; 149. matching socket; 15. limit bottom plate; 2. detector; 20. positioning matching hole; 21. positioning column; 22. carrier plate; 23. rotating wheel; 24. detection disk; 25. detection contact point; 3. Linkage carrier plate; 31. Inclined matching strip; 32. Movable plug-in hole; 33. First spring; 34. Load-bearing bending plate; 35. Pull-down frame; 4. Movable load-bearing rod; 41. Support connecting plate; 42. Connecting carrier plate; 43. Matching connecting column; 44. First connecting rod; 5. Movable mounting rod; 51. Arc clamp; 6. Movable ring body; 61. Protruding carrier plate; 62. Matching plug-in rod; 621. Second spring; 63. Connecting top plate; 64. Limiting vertical plate; 65. Second connecting rod; 7. Load-bearing movable plate; 71. Movable carrier strip; 72. Matching slide bar; 8. Counterweight movable block; 81. Sliding through hole; 82. Matching contact rod; 83. Third connecting rod; 84. Movable plate strip; 85. Matching limiting rod; 86. Positioning top plate; 87. Positioning sleeve. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] See also Figures 1 to 12 , the present invention provides a technical solution: The chip selection mechanism in the integrated circuit packaging process includes a detection and screening platform 1, wherein support columns 10 are fixedly arranged at the four corners below the detection and screening platform 1, and a detection through hole 11 is opened on the detection and screening platform 1, and support mounting plates 12 are symmetrically fixedly arranged on the detection and screening platform 1 on both sides of the detection through hole 11, and a movable mounting hole 121 is opened on the support mounting plate 12, and a moving channel 122 is opened on the detection and screening platform 1 beside the support mounting plate 12, and a support carrier rod 123 is fixedly arranged in the moving channel 122, and a detection through hole 112 is opened on the detection and screening platform 1 at one end of the moving channel 122. A matching through hole 124 is provided on the screening platform 1, matching support plates 13 are symmetrically fixedly arranged on the screening platform 1 at both ends of the detection through hole 11, matching slideways 131 are symmetrically provided on both sides of the matching support plate 13, and a connecting through hole 132 is provided on the screening platform 1 next to the matching support plate 13, a supporting platform plate 14 is fixedly arranged on the supporting platform column 10, guide matching holes 142 are symmetrically provided on the supporting platform plate 14, and a limiting bottom plate 15 is symmetrically fixedly arranged below the supporting platform plate 14, and a convenient detection and screening component is provided on the screening platform 1.

[0032] The portable detection and screening component includes a detector 2, a linkage carrier plate 3, a movable supporting rod 4, a movable mounting rod 5, a movable ring body 6 and a supporting movable plate 7. A positioning matching hole 20 is opened at the bottom of the detector 2, positioning columns 21 are symmetrically fixedly arranged on both sides of the lower end of the detector 2, and a supporting plate 22 is symmetrically fixedly arranged on both sides of the upper end of the detector 2, a rotating wheel 23 is installed on the supporting plate 22, a detection disk 24 is fixedly installed on the upper end of the detector 2, a detection contact point 25 is arranged on the detection disk 24, and the detection disk 24 is electrically connected to the detector 2.

[0033] There are two linkage carrier plates 3, which are symmetrically installed on both sides of the detection and screening platform 1, and a bevel matching strip 31 is fixedly provided at the lower end of the linkage carrier plate 3, and a movable plug hole 32 is opened on the linkage carrier plate 3 on the upper side of the bevel matching strip 31, and a supporting carrier rod 123 is plugged into the movable plug hole 32. A first spring 33 is sleeved on the supporting carrier rod 123, and the two ends of the first spring 33 are respectively fixed on the linkage carrier plate 3 and the inner wall of the movable channel 122.

[0034] A bearing bending plate 34 is symmetrically fixedly disposed on the upper end of the linkage carrier plate 3 , a pull-down frame 35 is fixedly disposed on the bearing bending plate 34 , and the pull-down frame 35 is connected to a movable bearing rod 4 .

[0035] The movable bearing rod 4 is inserted in the matching through hole 124, and a supporting connecting plate 41 is fixedly provided on the upper end of the movable bearing rod 4, a connecting plate 42 is symmetrically fixedly provided on the supporting connecting plate 41, a matching connecting column 43 is fixedly provided on the connecting plate 42, the matching connecting column 43 is inserted in the pull-down frame 35, and the matching connecting column 43 is in contact with the inner wall of the pull-down frame 35, and a first connecting rod 44 is hinged on the supporting connecting plate 41.

[0036] A movable mounting rod 5 is hinged at the lower end of the first connecting rod 44 . The movable mounting rod 5 is inserted into the movable mounting hole 121 , and an arc clamping plate 51 is fixedly provided on the movable mounting rod 5 .

[0037] A movable ring body 6 is installed below the detection and screening platform 1, and a protruding supporting plate 61 is symmetrically fixed on the movable ring body 6, and a matching plug rod 62 is fixed on the protruding supporting plate 61, and the matching plug rod 62 is inserted in the connecting through hole 132, and a second spring 621 is sleeved on the matching plug rod 62, and the two ends of the second spring 621 are respectively fixed on the connecting top plate 63 and the detection and screening platform 1, and a connecting top plate 63 is fixed on the upper end of the matching plug rod 62, and a limiting vertical plate 64 is fixed on the connecting top plate 63, and a second connecting rod 65 is hinged on the connecting top plate 63. In addition, the limiting vertical plate 64 is in contact with the upper end surface of the detection and screening platform 1 before moving up.

[0038] The lower end of the second connecting rod 65 is hinged with a bearing movable plate 7 , on which movable carrying bars 71 are symmetrically fixedly provided, and on which matching slide bars 72 are fixedly provided. The matching slide bars 72 are inserted into the matching slideways 131 .

[0039] A driving assembly includes an electric telescopic rod 141, on which a driving carrier plate 143 is fixedly mounted, on which a detector 2 is mounted, and on which a positioning matching block 144 is fixedly arranged, the positioning matching block 144 is inserted into a positioning matching hole 20, matching channels 145 are symmetrically provided on the driving carrier plate 143, and guide plug-in rods 146 are symmetrically fixedly arranged below the driving carrier plate 143, the guide plug-in rods 146 are inserted into guide matching holes 142, and a supporting bottom block 147 is fixedly arranged at the lower end of the guide plug-in rod 146, and the supporting bottom block 147 is provided with a movable socket 148 and a matching socket 149.

[0040] The guide plug-in rod 146 is sleeved with a counterweight movable block 8, a sliding through hole 81 is provided on the counterweight movable block 8, the guide plug-in rod 146 is inserted in the sliding through hole 81, and the counterweight movable block 8 is symmetrically fixed with a matching contact rod 82, the matching contact rod 82 is inserted in the matching plug hole 149, the counterweight movable block 8 is hinged with a third connecting rod 83, the lower end of the third connecting rod 83 is hinged with a movable slat 84, the movable slat 84 is fixedly provided with a matching limit rod 85, and the matching limit rod 85 is inserted into the movable socket 148, and a positioning top plate 86 is fixedly provided on the upper end of the movable slat 84, and a positioning sleeve 87 is fixedly provided on the positioning top plate 86. Before the detector 2 moves upward, the matching contact rod 82 is in contact with the limiting bottom plate 15. When the detector 2 moves upward, the matching movable block 82 remains stationary under the action of gravity, thereby reducing the distance between the supporting bottom block 147 and the matching movable block 82 until the matching contact rod 82 is separated from the limiting bottom plate 15.

[0041] When the wafer is inspected, it is placed on the carrying movable plate 7, and then the electric telescopic rod 141 is started to drive the driving carrier 143 to move upward. As the driving carrier 143 moves upward, the matching movable block 82 remains stationary under the action of gravity, thereby reducing the distance between the supporting bottom block 147 and the matching movable block 82 until the matching contact rod 82 is separated from the limiting bottom plate 15. Under the action of the third connecting rod 83, the movable plate 84 is pushed to move. As the movable plate 84 moves, the positioning sleeve 87 is driven to move, so that the positioning sleeve 87 is sleeved on the positioning column 21 on the detector 2, thereby realizing the fixation of the detector 2, ensuring its stability during the movement, and also ensuring the stability of the detector 2 during the operation. When the detector 2 is in a non-working state, the positioning sleeve 87 is not sleeved on the positioning column 21, so that the detector 2 is in an unlocked state, which is convenient for its installation and removal, and further convenient for the inspection and maintenance of the detector 2. In addition, as the electric telescopic rod 141 is extended, the rotating wheel 23 on the detector 2 will contact the inclined matching strip 31, so that the linkage carrier 3 will be pushed to move under the action of the rotating wheel 23. As the linkage carrier 3 moves, the matching connecting column 43 will be pulled downward under the action of the pull-down frame 35, thereby driving the movable bearing rod 4 to move downward. As the movable bearing rod 4 moves downward, the movable installation rod 5 will be driven to move under the action of the first connecting rod 44, so that the arc clamping plate 51 will contact the side of the wafer, pushing The movable wafer is moved in a small range to clamp and position the wafer, so that the pins on the chip are aligned with the detection contact points 25 on the detector 2 up and down. After the arc clamp 51 clamps the wafer, as the detector 2 continues to move upward, the supporting plate 22 will contact the lower end surface of the movable ring body 6, so that the movable ring body 6 will be pushed upward by the action of the supporting plate 22, and the upward movement of the movable ring body 6 will drive the connecting top plate 63 to move upward, so that under the action of the second connecting rod 65, the supporting movable plate 7 will be pulled to move, so that it will move away from the bottom of the wafer and no longer contact the wafer. In this way, as the detector 2 moves upward, the detection contact point 25 will contact the pins of the chip, thereby realizing the detection of the wafer and screening out the problematic chip marks. After the detection is completed, the electric telescopic rod 141 is started to retract downward, driving the detector 2 to move downward. As the detector 2 moves downward, the movable ring body 6 will move downward under the action of its own gravity and the second spring 621. In this way, under the action of the second connecting rod 65, the supporting movable plate 7 will be driven to move in the opposite direction and reset, so that it is supported under the wafer again. As the detector 2 moves further downward, the linkage carrier plate 3 will be reset under the action of the first spring 33. In this way, the movable bearing rod 4 can be driven to move upward under the action of the pull-down frame 35. As the movable bearing rod 4 moves upward, the movable mounting rod 5 will be driven to move in the opposite direction and reset under the action of the first connecting rod 44. In this way, the circular arc clamp 51 can release the wafer, making it convenient to remove the wafer.In the next step, in addition, when the driving carrier 143 moves downward, the contact rod 82 contacts the limit bottom plate 15, so that the counterweight movable block 8 no longer moves downward under the restriction of the limit bottom plate 15. As the support bottom block 147 moves downward, the distance between the counterweight movable block 8 and the support bottom block 147 increases. In this way, the movable plate 84 moves under the action of the third connecting rod 83, so that the positioning sleeve 87 is no longer sleeved on the positioning column 21, and the detector 2 is unlocked. The operation is simple, convenient and fast.

[0042] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip selection mechanism in an integrated circuit packaging process, comprising a detection and screening station (1), characterized in that: The detection and screening platform (1) is fixedly provided with support columns (10) at the four lower corners, the detection and screening platform (1) is provided with a detection through hole (11), support mounting plates (12) are symmetrically fixedly provided on the detection and screening platform (1) on both sides of the detection through hole (11), the support mounting plates (12) are provided with movable mounting holes (121), and the detection and screening platform (1) beside the support mounting plates (12) is provided with a movable channel (122), a support carrier rod (123) is fixedly provided in the movable channel (122), and a matching through hole (121) is provided on the detection and screening platform (1) at one end of the movable channel (122). 124), matching support plates (13) are symmetrically fixedly arranged on the detection and screening platform (1) at both ends of the detection through hole (11), matching slideways (131) are symmetrically opened on both sides of the matching support plate (13), and a connecting through hole (132) is opened on the detection and screening platform (1) next to the matching support plate (13), a supporting platform (14) is fixedly arranged on the support platform column (10), guide matching holes (142) are symmetrically opened on the supporting platform (14), and a limiting bottom plate (15) is symmetrically fixedly arranged below the supporting platform (14), and a convenient detection and screening component is arranged on the detection and screening platform (1).

2. The chip selection mechanism in the integrated circuit packaging process according to claim 1, characterized in that: The portable detection and screening assembly comprises a detector (2), a linkage carrier plate (3), a movable bearing rod (4), a movable mounting rod (5), a movable ring body (6) and a bearing movable plate (7); a positioning matching hole (20) is provided at the bottom of the detector (2); positioning columns (21) are symmetrically fixedly arranged on both sides of the lower end of the detector (2); and a bearing plate (22) is symmetrically fixedly arranged on both sides of the upper end of the detector (2); a rotating wheel (23) is mounted on the bearing plate (22); a detection disk (24) is fixedly mounted on the upper end of the detector (2); a detection contact point (25) is arranged on the detection disk (24), and the detection disk (24) is electrically connected to the detector (2).

3. The chip selection mechanism in the integrated circuit packaging process according to claim 2, characterized in that: There are two linkage carrier plates (3) symmetrically mounted on both sides of the detection and screening platform (1), and a bevel matching strip (31) is fixedly provided at the lower end of the linkage carrier plate (3), and a movable plug hole (32) is provided on the linkage carrier plate (3) above the bevel matching strip (31), and a supporting carrier rod (123) is plugged into the movable plug hole (32), and a first spring (33) is sleeved on the supporting carrier rod (123).

4. The chip selection mechanism in the integrated circuit packaging process according to claim 3, characterized in that: A bearing bending plate (34) is symmetrically fixedly provided on the upper end of the linkage carrier plate (3), a pull-down frame (35) is fixedly provided on the bearing bending plate (34), and the pull-down frame (35) is connected to a movable bearing rod (4).

5. The chip selection mechanism in the integrated circuit packaging process according to claim 4, characterized in that: The movable bearing rod (4) is inserted into the matching through hole (124), and a supporting connecting plate (41) is fixedly provided on the upper end of the movable bearing rod (4), a connecting support plate (42) is symmetrically fixedly provided on the supporting connecting plate (41), a matching connecting column (43) is fixedly provided on the connecting support plate (42), and the matching connecting column (43) is inserted into the pull-down frame (35), and a first connecting rod (44) is hinged on the supporting connecting plate (41).

6. The chip selection mechanism in the integrated circuit packaging process according to claim 5, characterized in that: A movable mounting rod (5) is hingedly connected to the lower end of the first connecting rod (44); the movable mounting rod (5) is inserted into the movable mounting hole (121); and an arc clamping plate (51) is fixedly provided on the movable mounting rod (5).

7. The chip selection mechanism in the integrated circuit packaging process according to claim 6, characterized in that: A movable ring body (6) is installed below the detection and screening platform (1), and a protruding support plate (61) is symmetrically fixedly arranged on the movable ring body (6), and a matching plug rod (62) is fixedly arranged on the protruding support plate (61), and the matching plug rod (62) is inserted into the connecting through hole (132), and a second spring (621) is sleeved on the matching plug rod (62), and a connecting top plate (63) is fixedly arranged on the upper end of the matching plug rod (62), and a limiting vertical plate (64) is fixedly arranged on the connecting top plate (63), and a second connecting rod (65) is hinged on the connecting top plate (63).

8. The chip selection mechanism in the integrated circuit packaging process according to claim 7, characterized in that: The lower end of the second connecting rod (65) is hingedly connected to a bearing movable plate (7), and movable carrying strips (71) are symmetrically fixedly arranged on the bearing movable plate (7), and matching slide strips (72) are fixedly arranged on the movable carrying strips (71), and the matching slide strips (72) are inserted into the matching slideways (131).

9. A drive assembly, characterized in that: The driving assembly is applicable to the film selection mechanism described in any one of claims 1 to 9, comprising an electric telescopic rod (141), a driving carrier plate (143) fixedly mounted on the electric telescopic rod (141), a detector (2) mounted on the driving carrier plate (143), and a positioning matching block (144) fixedly arranged on the driving carrier plate (143), the positioning matching block (144) being inserted into the positioning matching hole (20), matching channels (145) being symmetrically provided on the driving carrier plate (143), and a guide plug rod (146) being symmetrically fixedly provided below the driving carrier plate (143), the guide plug rod (146) being inserted into the guide matching hole (142), and a supporting bottom block (147) being fixedly provided at the lower end of the guide plug rod (146), and a movable plug hole (148) and a matching plug hole (149) being provided on the supporting bottom block (147).

10. A driving assembly according to claim 9, characterized in that: The guide plug-in rod (146) is sleeved with a counterweight movable block (8), a sliding through hole (81) is provided on the counterweight movable block (8), the guide plug-in rod (146) is inserted into the sliding through hole (81), and a matching contact rod (82) is symmetrically fixedly arranged on the counterweight movable block (8), the matching contact rod (82) is inserted into the matching plug hole (149), a third connecting rod (83) is hingedly connected to the counterweight movable block (8), a movable slat (84) is hingedly connected at the lower end of the third connecting rod (83), a matching limit rod (85) is fixedly arranged on the movable slat (84), the matching limit rod (85) is inserted into the movable plug hole (148), and a positioning top plate (86) is fixedly arranged on the upper end of the movable slat (84), and a positioning sleeve (87) is fixedly arranged on the positioning top plate (86).

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