Optical engine based on CPO technology

Abstract

The invention discloses an optical engine based on a CPO technology, and relates to the technical field of optical communication, and the key points of the technical scheme are that the optical engine comprises a transmitting end module, a receiving end module, a PCB, an optical fiber connecting line assembly and a housing assembly; wherein the receiving end module comprises multiple groups of receiving end assemblies, the multiple groups of receiving end assemblies are arranged on the front surface of the PCB side by side in an array manner, and each group of receiving end assembly comprises a trans-impedance amplifier TIA chip, a receiving end PIC chip and a receiving end FA optical fiber array; the transmitting terminal module comprises a plurality of groups of transmitting terminal assemblies, and each group of transmitting terminal assembly comprises a driver chip, a transmitting terminal PIC chip, a first transmitting terminal FA optical fiber array and a second transmitting terminal FA optical fiber array; the Driver chip is electrically connected with the transmitting end PIC chip, and the transmitting end PIC chip is in optical coupling connection with the transmitting end FA optical fiber array; and the light engine is electrically connected with external electronic equipment through a Socket PAD on the back surface of the PCB. The device has the characteristics of small size, low performance loss, low power consumption and high reliability.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to a light engine based on CPO technology. Background Art

[0002] With the rapid development of artificial intelligence, large-model distributed cluster training has posed greater challenges to optical communication networks, especially strict requirements on the large bandwidth, low loss, low power consumption and high reliability of optical transceiver modules. Traditional pluggable optical modules are technologies that integrate optical transmitters (TOSA, including lasers), optical receivers (ROSA, including photodetectors), functional circuits and optical (electrical) interfaces in a single structural unit, and transmit data with switches in the form of pluggable connectors. Traditional pluggable optical modules have many limitations in design: when the transmission rate is required to be increased, signal integrity will decrease and link loss will increase; the pursuit of more transmission channels and smaller size will make the internal space of the module more crowded, which not only increases the difficulty of optoelectronic device layout design, but also brings serious heat dissipation problems; at the same time, high-density integration also increases the risk of device failure and reduces system reliability. Summary of the invention

[0003] In view of the problems existing in the prior art, the object of the present invention is to provide a light engine based on CPO technology, which is characterized by small size, low performance loss, low power consumption and high reliability.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a light engine based on CPO technology, including a transmitting end module, a receiving end module, a PCB board, an optical fiber connecting line assembly and a shell assembly; the optical fiber connecting line assembly is arranged on one side of the PCB board, and is used to lead out the optical signal of the light engine; the shell assembly is arranged outside the PCB board, and is used to wrap and protect the PCB board; the transmitting end module and the receiving end module are arranged on the front of the PCB board; wherein the receiving end module includes a plurality of groups of receiving end assemblies, and the plurality of groups of receiving end assemblies are arranged in an array side by side on the front of the PCB board, and each group of receiving end assemblies includes a transimpedance amplifier TIA chip, a receiving end PIC chip and a receiving end FA optical fiber array; the transimpedance amplifier The TIA chip is electrically connected to the receiving end PIC chip, and the receiving end PIC chip is optically coupled to the receiving end FA fiber array; the transmitting end module includes multiple groups of transmitting terminal components, and the multiple groups of transmitting terminal components are arranged in a side-by-side array on the front of the PCB board; each group of the transmitting terminal components includes a driver chip, a transmitting end PIC chip, a first transmitting end FA fiber array and a second transmitting end FA fiber array; the driver chip is electrically connected to the transmitting end PIC chip, and the first transmitting end FA fiber array and the second transmitting end FA fiber array are optically coupled to the transmitting end PIC chip respectively; the light engine is electrically connected to the external electronic device through the Socket PAD on the back of the PCB board.

[0005] Furthermore, the transimpedance amplifier TIA chip is electrically connected to the receiving-end PIC chip through wire bonding; and the driver chip is electrically connected to the transmitting-end PIC chip through wire bonding.

[0006] Furthermore, the receiving-side optical fiber is optically coupled to the receiving-end PIC chip by V-groove coupling.

[0007] Furthermore, the first transmitting side optical fiber is optically coupled to the transmitting end PIC chip through a V-groove coupling mode; and the second transmitting side optical fiber is optically coupled to the transmitting end PIC chip through a V-groove coupling mode.

[0008] Furthermore, the optical fiber connecting line assembly includes a first optical fiber connecting line, a second optical fiber connecting line and a third optical fiber connecting line; the receiving side optical fiber is led out through the first optical fiber connecting line, the first transmitting side optical fiber is led out through the second optical fiber connecting line, and the second transmitting side optical fiber is led out through the third optical fiber connecting line.

[0009] Furthermore, the optical engine is electrically connected to an external electronic device via a Socket PAD on the back of the PCB board. Specifically, a socket area is provided on the back of the PCB board, and a plurality of Socket PADs are provided in the socket area. The Socket PAD is used to be electrically connected to an external switch.

[0010] Furthermore, the Socket PAD includes a power supply type PAD, a high-speed signal type PAD, and a low-speed signal type PAD; wherein the high-speed signal input / output end of the transimpedance amplifier TIA chip or the driver chip is connected to the Socket high-speed signal type PAD after being isolated by an AC capacitor; when the soldering pad of the AC capacitor and the high-speed signal type PAD in the Socket PAD are overlapped in vertical arrangement, the electrical connection between the soldering pad of the AC capacitor and the high-speed signal type PAD is achieved through a PCB via.

[0011] Furthermore, the shell assembly includes at least a first shell, a second shell and a third shell, and the first shell, the second shell and the third shell are detachably connected to each other; the first shell is arranged above the PCB board, and can cover the front side of the PCB board and the devices and optical fibers located on the front side of the PCB board; the second shell is provided with at least a second PCB board cavity for accommodating the PCB board and a second optical fiber cavity for accommodating the optical fiber; the third shell at least wraps the outer periphery of the fitting body formed by the first shell and the second shell.

[0012] Furthermore, it also includes a fourth shell, which is arranged below the second shell and has a through hole for Socket connection.

[0013] Furthermore, a flange is provided on the optical fiber connecting line assembly, and the first shell and the second shell are respectively provided with an upper flange groove and a lower flange groove. When the first shell and the second shell are matched, the upper flange groove and the lower flange groove form a complete flange groove, and the flange of the optical fiber connecting line assembly is fixed between the first shell and the second shell through the flange groove.

[0014] The beneficial effects of the present invention are as follows: the CPO optical engine provided by the present invention, in comparison, becomes smaller, so that a larger number of CPO optical engines can be integrated on the host side, achieving a larger data throughput, ensuring the reliability of the CPO optical engine, allowing for flexible placement, having a shorter communication link, achieving lower losses, and reducing overall communication power consumption and insertion loss. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the light engine of the present invention;

[0016] Figure 2It is a structural exploded diagram of the light engine of the present invention;

[0017] Figure 3 A schematic diagram showing the structure of a PCB board and a housing assembly;

[0018] Figure 4 It is a structural schematic diagram of the front side of the PCB board of the present invention;

[0019] Figure 5 It is a schematic diagram for showing the structure of the receiving end PIC chip and the receiving end FA optical fiber array;

[0020] Figure 6 It is a schematic diagram showing the structure of the transmitting end PIC chip and the transmitting end FA optical fiber array.

[0021] Figure 7 It is a structural schematic diagram of the back side of the PCB board of the present invention.

[0022] Figure 8 is a schematic structural diagram of the first shell of the present invention;

[0023] Fig. 9 is a schematic structural diagram of the second shell of the present invention;

[0024] Fig.10 It is a schematic structural diagram of the third shell of the present invention.

[0025] Figure numerals: 1, receiving end module; 11, receiving end component; 111, transimpedance amplifier TIA chip; 112, receiving end PIC chip; 1121, fourth V-shaped groove; 113, receiving end FA fiber array; 1131, first substrate; 1132, first cover plate; 1133, receiving side optical fiber; 114, first cover; 2, transmitting end module; 21, transmitting terminal component; 211, driver chip; 212, transmitting end PIC chip; 2121, fifth V-shaped groove; 2122, sixth V-shaped groove; 213, first transmitting end FA fiber array; 2131, second substrate; 2132, second cover plate; 2133, first transmitting side optical fiber; 214, second transmitting end FA fiber array; 2142 , the third cover plate; 2143, the second transmitting side optical fiber; 215, the second cover; 216, the third cover; 3, PCB board; 31, the positioning groove; 32, SocketPAD; 4, the optical fiber connecting line assembly; 41, the first optical fiber connecting line; 42, the second optical fiber connecting line; 43, the third optical fiber connecting line; 5, the shell assembly; 51, the first shell; 511, the first PCB board cavity; 512, the first device cavity; 513, the first optical fiber cavity; 52, the second shell; 522, the second PCB board cavity; 523, the second optical fiber cavity; 53, the third shell; 531, the flange; 54, the fourth shell; 542, the second device cavity; 7, the waveguide glue; 8, the UV glue; 9, the flange; 101, the upper flange groove, 102, the lower flange groove. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the drawings, and the words "bottom" and "top", "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0029] Existing optical engine technology refers to the technology that integrates optical transmitters (TOSA, including lasers), optical receivers (ROSA, including photodetectors), functional circuits and optical (electrical) interfaces into a structural unit. The optical engine transmits data with the switch in the form of a pluggable connector. However, with the rapid development of artificial intelligence, large-model distributed cluster training has posed greater challenges to optical communication networks, especially large bandwidth, low loss, low power consumption and high reliability. In disguised form, the traditional pluggable optical modules are required to have higher and higher transmission rates, more and more transmission channels, smaller and smaller sizes, and more and more transmission link losses; this leads to crowded internal layout space for the optical module, and prominent heat dissipation and reliability issues.

[0030] In view of the problems existing in the prior art, the present invention provides a light engine based on CPO technology, comprising: a transmitting end module, a receiving end module, a PCB board, an optical fiber connecting line assembly and a shell assembly; the optical fiber connecting line assembly is arranged on one side of the PCB board for leading out the optical signal of the light engine; the shell assembly is arranged outside the PCB board for wrapping and protecting the PCB board.

[0031] like Figure 1-Figure 3 As shown, the transmitter module 2 and the receiver module 1 are arranged on the front side of the PCB board 3, the transmitter module 2 is located on the side close to the optical fiber connecting line assembly 4, and the receiver module 1 is located on the side away from the optical fiber connecting line assembly 4.

[0032] like Figure 3 , Figure 4 As shown, the receiving end module 1 includes a plurality of groups of receiving end components 11, and the plurality of groups of receiving end components 11 are arranged in a side-by-side array on the front of the PCB board 3. Each group of receiving end components 11 includes a transimpedance amplifier TIA chip 111, a receiving end PIC chip 112 and a receiving end FA optical fiber array 113. The transimpedance amplifier TIA chip 111 is electrically connected to the receiving end PIC chip 112, and the receiving end PIC chip 112 is optically coupled to the receiving end FA optical fiber array 113. The transimpedance amplifier TIA chip 111 is arranged at a position on the PCB board 3 away from the optical fiber connecting line component 4 relative to the receiving end PIC chip 112.

[0033] Specifically, the transimpedance amplifier TIA chip and the receiving end PIC chip are electrically connected through wire bonding. Wire bonding is a common method of connecting chips using gold wires, and the pins of the chips are connected by gold wires to achieve electrical connection between the chips. In the present invention, the electrical connection between the transimpedance amplifier TIA chip and the receiving end PIC chip is achieved through wirebonding. The wire bonding method is simple and low-cost, and is suitable for chips with small-pitch pins. In the process of wirebonding, in order to protect the gold wire, an insulating glue with a low dielectric constant can be used to protect the gold wire, which is convenient for optical fiber arrangement and top heat dissipation of the chip in the form of Wire Bonding.

[0034] Specifically, Figure 5 As shown, the receiving end FA fiber array 113 includes a first substrate 1131, a first cover plate 1132 and a receiving side optical fiber 1133. A first V-shaped groove is provided on the first substrate 1131 or the first cover plate 1132, and the receiving side optical fiber 1133 is fixed between the first substrate 1131 and the first cover plate 1132 through the first V-shaped groove. The receiving side optical fiber 1133 is optically coupled to the receiving end PIC chip 112.

[0035] Preferably, the receiving side optical fiber is optically coupled to the receiving end PIC chip through a V-groove coupling method. Figure 5 As shown, a first optical coupling region for optical coupling with a receiving side optical fiber is provided on the receiving end PIC chip 112, and fourth V-shaped grooves 1121 are arranged in an array in the first optical coupling region. The receiving side optical fiber 1133 is arranged in the fourth V-shaped groove 1121, and the core of the receiving side optical fiber 1133 contacts the inner wall of the fourth V-shaped groove 1121. A first cover 114 is provided above the first optical coupling region, and the first cover 114 covers the fourth V-shaped groove 1121. The bottom surface of the first cover 114 and the receiving end PIC chip 112 are bonded and connected by UV glue 8, and a waveguide glue 7 is also provided between the bottom surface of the first cover 114 and the receiving end PIC chip 112. The waveguide glue 7 is provided at the end of the receiving side optical fiber 1131 and is at least used to fill the gap between the end surface of the receiving side optical fiber 1131 and the receiving end PIC chip 112. The waveguide glue 7 can fix the relative position of the receiving side optical fiber 1131 and the receiving end PIC chip 112, prevent the relative position between the receiving side optical fiber 1131 and the receiving end PIC chip 112 from changing, and ensure the coupling quality between the optical fiber end face and the PIC chip end face. In a specific embodiment, the waveguide glue can be made of a conventional optical adhesive with high light transmittance. The first cover is made of silica.

[0036] In a specific embodiment, in order to make the height difference between the portion of the receiving side optical fiber in the fourth V-groove and the portion between the first substrate and the first cover plate within a preset range, a pad is provided on the first substrate. The pad is provided between the first substrate and the PCB board. The height and inclination angle of the pad are set to appropriate values ​​to ensure that the receiving side optical fiber can fan out within its bending radius. The material of the pad is a material with good mechanical strength and wear resistance, such as a metal material or an engineering plastic material.

[0037] like Figure 3 , 4 As shown, the transmitting end module 2 includes a plurality of transmitting terminal components 21, and the plurality of transmitting terminal components 21 are arranged in a side-by-side array on the front of the PCB board 3. Each transmitting terminal component 21 includes a driver chip 211, a transmitting end PIC chip 212, a first transmitting end FA fiber array 213 and a second transmitting end FA fiber array 214. The driver chip 211 is electrically connected to the transmitting end PIC chip 212, and the first transmitting end FA fiber array 213 and the second transmitting end FA fiber array 214 are optically coupled to the transmitting end PIC chip 212, respectively.

[0038] Preferably, a suitable distance is reserved between adjacent transmitting end FA fiber arrays to accommodate the receiving side optical fiber, facilitate the optical coupling connection between the receiving side optical fiber and the receiving end PIC chip, and ensure that the receiving side optical fiber can fan out within its bending radius. It can be understood by those skilled in the art that the distance between the transmitting end FA fiber arrays can be adjusted according to actual conditions to meet the design requirements of different optical engines. Similarly, on the receiving side

[0039] Specifically, the driver chip is electrically connected to the transmitter PIC chip through wire bonding. Similarly, in the process of wire bonding, in order to protect the gold wire, an insulating glue with a low dielectric constant can be used to protect the gold wire.

[0040] Specifically, Figure 6As shown, the first transmitting end FA fiber array 213 includes a second substrate 2131, a second cover plate 2132 and a first transmitting side optical fiber 2133; a second V-shaped groove is provided on the second substrate 2131 or the second cover plate 2132, and the first transmitting side optical fiber 2133 is fixed between the second substrate 2131 and the second cover plate 2132 through the second V-shaped groove. The second transmitting end FA fiber array 214 includes a third substrate, a third cover plate 2142 and a second transmitting side optical fiber 2143; a third V-shaped groove is provided on the third substrate or the third cover plate 2143, and the second transmitting side optical fiber 2143 is fixed between the third substrate and the third cover plate through the third V-shaped groove. The first transmitting side optical fiber 2133 and the second transmitting side optical fiber 2143 are optically coupled and connected to the transmitting end PIC chip 212.

[0041] Specifically, the first transmitting side optical fiber is optically coupled to the transmitting end PIC chip through a V-groove coupling method. Figure 6 As shown, a second optical coupling region for optical coupling with the first emitting side optical fiber is provided on the emitting side PIC chip 212, and a fifth V-groove 2121 is arranged in an array in the second optical coupling region. The first emitting side optical fiber 2133 is arranged in the fifth V-groove 2121, and the core of the first emitting side optical fiber 2133 contacts the inner wall of the fifth V-groove 2121. A second cover 215 is arranged above the second optical coupling region, and the second cover 215 covers the fifth V-groove 2121. The bottom surface of the second cover 215 and the emitting side PIC chip 212 are bonded and connected by UV glue 8, and a waveguide glue 7 is also arranged between the bottom surface of the second cover 215 and the emitting side PIC chip 212. The waveguide glue 7 is arranged at the end of the first emitting side optical fiber 2133 and is at least used to fill the gap between the end surface of the first emitting side optical fiber 2133 and the emitting side PIC chip 212. The arrangement of the waveguide glue and the second cover here is similar to the arrangement of the waveguide glue and the first cover on the above-mentioned receiving end PIC chip, and will not be described in detail.

[0042] In a specific embodiment, similarly, in order to make the height difference between the portion of the first emitting side optical fiber in the fifth V-groove and the portion thereof between the second substrate and the second cover plate within a preset range, a pad is provided under the second substrate. The arrangement of the pad under the second substrate is similar to that of the pad under the first substrate, and will not be described in detail.

[0043] Specifically, the second transmitting side optical fiber is also optically coupled to the transmitting end PIC chip through a V-groove coupling method. Figure 6As shown, a third optical coupling region for optical coupling with the second transmitting side optical fiber 2143 is provided on the transmitting end PIC chip 212, and a sixth V-groove 2122 is arranged in an array in the third optical coupling region, and the second transmitting side optical fiber 2143 is arranged in the sixth V-groove 2122, and the core of the second transmitting side optical fiber 2143 contacts the inner wall of the sixth V-groove 2122. A third cover is arranged above the third optical coupling region, and the third cover covers the sixth V-groove 2122. The bottom surface of the third cover is bonded to the transmitting end PIC chip 212 by UV glue 8, and a waveguide glue 7 is also arranged between the bottom surface of the third cover and the transmitting end PIC chip 212, and the waveguide glue 7 is arranged at the end of the second transmitting side optical fiber 2143, and is at least used to fill the gap between the end face of the second transmitting side optical fiber 2143 and the transmitting end PIC chip 212. The arrangement of the waveguide glue and the third cover here is similar to the arrangement of the waveguide glue and the first cover on the receiving end PIC chip, and will not be repeated.

[0044] By adopting the above technical solution, the coupling method between the receiving end PIC chip, the transmitting end PIC chip and the corresponding optical fiber adopts the V-groove coupling method. Compared with the traditional end face coupling method, it avoids the hollowing of the PCB board, ensures the layout space of the PCB board, and is conducive to reducing the volume. At the same time, the V-groove coupling method can ensure the coupling quality between the optical fiber end face and the PIC chip end face, and improve the performance of the optical engine.

[0045] In a specific embodiment, similarly, in order to make the height difference between the portion of the second emitting side optical fiber in the sixth V-groove and the portion between the third substrate and the third cover plate within a preset range, a pad is provided on the third substrate. The setting of the pad under the third substrate is similar to the setting of the pad under the first substrate, and will not be repeated. The above height difference is within the preset range, which ensures that the optical fiber can fan out within its bending radius.

[0046] Specifically, Figure 3 As shown, the optical fiber connecting line assembly 4 includes a first optical fiber connecting line 41 , a second optical fiber connecting line 42 and a third optical fiber connecting line 43 .

[0047] The above-mentioned receiving side optical fiber is led out through the first optical fiber connecting line, the above-mentioned first transmitting side optical fiber is led out through the second optical fiber connecting line, and the above-mentioned second transmitting side optical fiber is led out through the third optical fiber connecting line. The above-mentioned leading out through the optical fiber connecting line specifically refers to assembling the optical fiber braids to form the corresponding optical fiber connecting line, and leading out the light engine through the corresponding optical fiber connecting line. The technicians can set the optical fiber connector on the optical fiber connecting line to connect with other external photon modules for optical communication. Specifically, the first optical fiber connecting line is used to connect the external photon module to realize multi-channel optical signal reception, one of the second optical fiber connecting line and the third optical fiber connecting line is used to connect the external finished laser module, and the other optical fiber connecting line is used to connect the external photon module to realize multi-channel optical signal transmission. It is easy for those skilled in the art to understand that the first optical fiber connecting line, the second optical fiber connecting line and the third optical fiber connecting line can select the appropriate type of optical fiber connector according to the actual switch application scenario to realize the connection with other modules.

[0048] In a specific embodiment, four four-channel 4x100G transimpedance amplifier TIA chips are used, and four four-channel 4x100G receiving-end PIC chips are used. At the same time, four four-channel 4x100G driver chips are used, and four four-channel 4x100G transmitting-end PIC chips are used.

[0049] By adopting the above technical solution, the present invention changes the built-in laser into an external finished laser, and can use the external finished laser module to provide the light source, which greatly reduces the heat dissipation pressure of the light engine and improves the reliability of the light engine. The light engine of the present invention does not have the DSP signal processing chip in the traditional light engine, so it can further reduce the size of the light engine, reduce costs, reduce signal noise, reduce power consumption, and improve the performance of the light engine. At the same time, because the transimpedance amplifier TIA chip has a certain balancing ability, it makes up for the performance degradation caused by removing the DSP.

[0050] The optical engine provided by the present invention is a CPO (Co-Packaged Optics) optical engine. Different from the traditional pluggable optical module, the technology and its application scenarios of first packaging the photon integrated chip (PIC) and the electric drive integrated chip (EIC) together and then connecting them with the host application-specific integrated circuit chip (host ASIC) on the same level substrate. The CPO optical engine transfers unnecessary functional circuits (such as power supply circuits, laser circuits, etc.) to the host side, thereby making the CPO optical engine smaller, so that the host side can integrate more CPO optical engines and achieve greater data throughput. The optical engine of the present invention also removes the laser and uses an external laser source, which greatly reduces the heat dissipation pressure of the CPO, thereby ensuring the reliability of the CPO optical engine. Compared with the traditional pluggable optical module, the traditional pluggable optical module connector can only be placed around the switch board; the CPO optical engine of the present invention is connected to the host application-specific integrated circuit chip on the same level substrate, which can be flexibly placed, thereby getting rid of the position limitation of the traditional pluggable optical module, so that the host application-specific integrated circuit chip and the CPO optical engine have a shorter communication link, achieve lower loss, and reduce the overall communication power consumption.

[0051] Specifically, Figure 4 , 7 As shown, the PCB board 3 is rectangular, and positioning grooves 31 are provided on both sides to facilitate high-precision positioning with the housing assembly; a certain width is reserved at the edge of the PCB board 3, and components and wiring are prohibited, and it is only used for compression assembly with the housing assembly;

[0052] The PCB board is a multi-layer board structure, and the light engine is electrically connected to the external electronic device through the socket PAD on the back of the PCB board. Figure 7 As shown, a socket area is provided on the back of the PCB board 3, and a plurality of Socket PADs 32 are provided in the socket area for electrical connection with an external switch. Through the circuit inside the PCB board, the Socket PAD is electrically connected to the transmitting end PIC chip, the receiving end PIC chip, the driver chip, the transimpedance amplifier TIA chip and other components on the front of the PCB board. The above technical solution is adopted, and the Socket connection is used to greatly shorten the path of high-speed electrical signal transmission between the optical engine and the external electronic device, greatly reduce the insertion loss, and make it possible to remove the DSP signal processing chip, thereby further greatly reducing the cost, saving the volume, and reducing the power consumption.

[0053] Preferably, the above-mentioned Socket PAD includes a power supply type PAD, a high-speed signal type PAD, and a low-speed signal type PAD; wherein, the high-speed signal input / output end of the transimpedance amplifier TIA chip or the driver chip is connected to the high-speed signal type PAD in the Socket PAD after being isolated by an AC capacitor; when the pads of the AC capacitor overlap with the position of the Socket high-speed signal type PAD, the electrical connection between the pads of the AC capacitor and the high-speed signal type PAD is achieved through the PCB via. The pads of the high-speed signal type PAD and the AC capacitor in the above-mentioned Socket PAD overlap on both sides of the PCB board, that is, the projection of the pads of the AC capacitor located on the front of the PCB board on the back of the PCB board overlaps with the Socket PAD located on the back of the PCB board. By adopting the above-mentioned technical solution, the length of the high-speed signal routing is shortened, and the signal impedance discontinuity points are designed together to optimize the impedance, which can effectively reduce the return loss.

[0054] It is easy for those skilled in the art to understand that the location and number of the pads can be adjusted according to actual conditions to meet the design requirements of different light engines. However, it should be noted that the high-speed pads should be distributed under the corresponding high-speed chips as much as possible to reduce the high-speed electrical signal transmission path and reduce insertion loss.

[0055] It is easy for those skilled in the art to understand that, in addition to the receiving end components and the transmitting end components, the placement and wiring methods of other components on the PCB can be adjusted according to actual conditions to meet the design requirements of different light engines. However, it should be noted that the components can be placed on the front or on the back of the PCB; when placed on the back of the PCB, they need to be kept at a certain distance from the Socket area to prevent accidental short circuits when the Socket is connected.

[0056] By adopting the above technical solution, the optical engine of the present invention uses a socket connection to replace the traditional pluggable connection for electrical connection, shortening the path of high-speed electrical signal transmission between the optical engine and external electronic devices, reducing insertion loss, and at the same time, reducing the size of the optical engine.

[0057] like Figure 1-Figure 2 As shown, the housing assembly 5 is arranged on the outside of the PCB board 3, and the housing assembly 5 at least includes a first housing 51, a second housing 52 and a third housing 53, and the first housing 51, the second housing 52 and the third housing 53 are detachably connected.

[0058] like Figure 2 , Figure 8As shown, the first housing 51 is disposed above the PCB board 3, and can cover the front of the PCB board 3 and the devices and optical fibers located on the front of the PCB board 3. The first housing 51 is provided with at least a first PCB board cavity 511 for accommodating the PCB board, a first device cavity 512 for accommodating the devices on the front of the PCB board, and a first optical fiber cavity 513 for accommodating the optical fiber. The first PCB board cavity 511, the first device cavity 512, and the first optical fiber cavity 513 can be formed as follows: Figure 8 The one cavity shown can also be formed into multiple cavities, and the specific number and size of the cavities can be adjusted according to actual conditions. The devices on the front of the PCB board include a transmitter PIC chip, a receiver PIC chip, a driver chip, a transimpedance amplifier TIA chip, and the like.

[0059] like Figure 2 , Fig. 9 As shown, the second housing 52 is at least provided with a second PCB board cavity 522 for accommodating the PCB board 3 and a second optical fiber cavity 523 for accommodating the optical fiber on the front side of the PCB board 3. The second PCB board cavity and the second optical fiber cavity can be formed into one cavity or multiple cavities, and the specific number and size of the cavities can be adjusted according to actual conditions. It is easy for those skilled in the art to understand that, according to different design requirements, the depth of the second PCB board cavity may not penetrate the upper and lower surfaces of the second housing and only form a groove body, or may penetrate the upper and lower surfaces of the second housing and form a hole body.

[0060] In a specific embodiment, Figure 2 , Fig. 9 As shown, the second PCB cavity 522 passes through the upper and lower surfaces of the second housing 52. At this time, the PCB board 3 is accommodated in the second PCB cavity 522. Preferably, as Figure 2 As shown, a fourth housing 54 is provided below the second housing 52, and a through hole for socket connection is provided on the fourth housing 54, so that an external electronic device can be electrically connected to the socket PAD on the back of the PCB board 3 through the through hole. A second device cavity 542 is also provided on the fourth housing, and the second device cavity 542 is used to accommodate the device on the back of the PCB board 3.

[0061] By adopting the above technical solution, the PCB board is wrapped with a fourth shell, and a hole is dug in the Socket area to avoid the Socket PAD. This not only improves the shielding effect of the CPO light engine, but also increases the contact area between the shell and the PCB board, thereby increasing the reliability of the shell wrapping.

[0062] It is easy to understand for those skilled in the art that, according to different design requirements, the depth of the second device cavity 542 may not penetrate the upper and lower surfaces of the fourth shell to form a groove, or may penetrate the upper and lower surfaces of the fourth shell to form a groove. Figure 2 A hole body is shown.

[0063] Preferably, if Figure 2 , Figure 7 , Figure 8 As shown, a flange 9 is provided on the optical fiber connecting line assembly, and the first shell 51 and the second shell 52 are respectively provided with an upper flange groove 101 and a lower flange groove 102. When the first shell 51 and the second shell 52 are matched, the upper flange groove 101 and the lower flange groove 102 form a complete flange groove, and the flange 9 of the optical fiber connecting line assembly 4 is fixed between the first shell 51 and the second shell 52 through the flange groove, so that the optical fiber connecting line assembly 4 is fixed between the first shell 51 and the second shell 52. In a specific embodiment, the first optical fiber connecting line, the second optical fiber connecting line, and the third optical fiber connecting line are respectively provided with a first flange, a second flange, and a third flange, the first shell is provided with a first upper flange groove, a second upper flange groove, and a third upper flange groove, and the second shell is provided with a first lower flange groove, a second lower flange groove, and a third lower flange groove. When the first shell and the second shell are matched, the first upper flange groove and the first lower flange groove, the second upper flange groove and the second lower flange groove, the third upper flange groove and the third lower flange groove form a complete flange groove, and the first flange, the second flange, and the third flange are respectively fixed between the first shell and the second shell through different flange grooves, so that the first optical fiber connecting line, the second optical fiber connecting line, and the third optical fiber connecting line are fixed between the first shell and the second shell. It is easy for those skilled in the art to understand that the first optical fiber connecting line, the second optical fiber connecting line, and the third optical fiber connecting line can also share a flange, and the setting position and number of the flanges can be adjusted according to actual conditions to meet the design requirements of different optical engines.

[0064] In the above embodiments, it is easy for a person skilled in the art to understand that the upper flange groove of the first housing can form a groove body with the PCB board cavity, the device cavity and the optical fiber cavity, or can be formed into multiple groove bodies, and the specific number and size of the groove bodies can be adjusted according to actual conditions. Similarly, the lower flange groove of the second housing can also form a groove body with the PCB board cavity, the device cavity and the optical fiber cavity, or can be formed into multiple groove bodies, and the specific number and size of the groove bodies can be adjusted according to actual conditions.

[0065] like Figure 2 , Fig.10As shown, the third shell 53 is at least used to wrap the outer periphery of the matching body formed by the first shell 51 and the second shell 52. The second shell 52 is connected to the first shell 51 through a threaded structure. A snap-fit ​​structure is provided between the first shell 51 and the third shell 53, and the snap-fit ​​structure is used to fix the first shell 51 and the third shell 53. In a specific embodiment, the fourth shell 54 is pressed and fixed between the flange 531 of the second shell 52 and the third shell 53. It is easy for those skilled in the art to understand that according to different design requirements, the connection method between the shell components can be adjusted according to actual conditions to meet the design requirements of different light engines.

[0066] In summary, the advantages of the present invention are: 1) By changing the built-in laser to an external finished laser, the external finished laser module can be used to provide the light source, which greatly reduces the heat dissipation pressure of the optical engine and improves the reliability of the optical engine. 2) The coupling method between the receiving end PIC chip, the transmitting end PIC chip and the corresponding optical fiber adopts a V-groove coupling method. Compared with the traditional end face coupling method, it avoids the hollowing out of the PCB board, ensures the layout space of the PCB board, and is conducive to reducing the volume. At the same time, the V-groove coupling method can ensure the coupling quality between the optical fiber end face and the PIC chip end face, and improves the performance of the optical engine. 3) The socket connection form is used to replace the traditional pluggable connection form for electrical connection, which shortens the path of high-speed electrical signal transmission between the optical engine and the external electronic device, reduces the insertion loss, and at the same time, reduces the size of the optical engine and reduces power consumption. 4) The shielding effect is good and the shell wrapping reliability is high.

[0067] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the invention may be modified or replaced by equivalents without departing from the scope of the technical solutions of the present invention, which should all be covered by the scope of the claims of the present invention.

Claims

1. A light engine based on CPO technology, characterized by: It includes a transmitting end module, a receiving end module, a PCB board, an optical fiber connecting line assembly and a housing assembly; the optical fiber connecting line assembly is arranged on one side of the PCB board to lead out the optical signal of the light engine; the housing assembly is arranged outside the PCB board to wrap and protect the PCB board; The transmitting end module and the receiving end module are arranged on the front side of the PCB board; The receiving end module includes multiple groups of receiving end components, which are arranged in a side-by-side array on the front of the PCB board, and each group of receiving end components includes a transimpedance amplifier TIA chip, a receiving end PIC chip and a receiving end FA optical fiber array; the transimpedance amplifier TIA chip is electrically connected to the receiving end PIC chip, and the receiving end PIC chip is optically coupled to the receiving end FA optical fiber array; The transmitting end module includes a plurality of groups of transmitting terminal components, which are arranged in a side-by-side array on the front of the PCB board; each group of the transmitting terminal components includes a driver chip, a transmitting end PIC chip, a first transmitting end FA fiber array and a second transmitting end FA fiber array; the driver chip is electrically connected to the transmitting end PIC chip, and the first transmitting end FA fiber array and the second transmitting end FA fiber array are optically coupled to the transmitting end PIC chip respectively; The light engine is electrically connected to external electronic devices via the Socket PAD on the back of the PCB board.

2. The light engine according to claim 1, characterized in that: The transimpedance amplifier TIA chip is electrically connected to the receiving end PIC chip through wire bonding; the driver chip is electrically connected to the transmitting end PIC chip through wire bonding.

3. The light engine according to claim 1, characterized in that: The receiving side optical fiber is optically coupled to the receiving end PIC chip through a V-groove coupling method.

4. The light engine according to claim 1, characterized in that: The first transmitting side optical fiber is optically coupled to the transmitting end PIC chip through a V-groove coupling mode; the second transmitting side optical fiber is optically coupled to the transmitting end PIC chip through a V-groove coupling mode.

5. The light engine according to claim 1, characterized in that: The optical fiber connecting line assembly includes a first optical fiber connecting line, a second optical fiber connecting line and a third optical fiber connecting line; the receiving side optical fiber is led out through the first optical fiber connecting line, the first transmitting side optical fiber is led out through the second optical fiber connecting line, and the second transmitting side optical fiber is led out through the third optical fiber connecting line.

6. The light engine according to any one of claims 1 to 5, characterized in that: The light engine is electrically connected to an external electronic device via a Socket PAD on the back of the PCB board. Specifically, a socket area is provided on the back of the PCB board, and a plurality of Socket PADs are provided in the socket area. The Socket PAD is used to be electrically connected to an external switch.

7. The light engine according to claim 6, characterized in that: The Socket PAD includes a power supply type PAD, a high-speed signal type PAD, and a low-speed signal type PAD; wherein the high-speed signal input / output end of the transimpedance amplifier TIA chip or the driver chip is connected to the Socket high-speed signal type PAD after being DC-isolated by an AC capacitor; when the soldering pad of the AC capacitor overlaps with the high-speed signal type PAD in the Socket PAD, the electrical connection between the soldering pad of the AC capacitor and the high-speed signal type PAD is achieved through a PCB via.

8. The light engine according to any one of claims 1 to 5, characterized in that: The housing assembly comprises at least a first housing, a second housing and a third housing, wherein the first housing, the second housing and the third housing are detachably connected to each other; the first housing is disposed above the PCB board and is capable of covering the front side of the PCB board and the devices and optical fibers located on the front side of the PCB board; the second housing is provided with at least a second PCB board cavity for accommodating the PCB board and a second optical fiber cavity for accommodating the optical fiber; and the third housing at least wraps around the periphery of a fitting body formed by the cooperation of the first housing and the second housing.

9. The light engine according to claim 8, characterized in that: The device further comprises a fourth shell, which is arranged below the second shell and has a through hole for socket connection.

10. The light engine according to claim 8, characterized in that: The optical fiber connecting line assembly is provided with a flange, and the first shell and the second shell are respectively provided with an upper flange groove and a lower flange groove. When the first shell and the second shell are matched, the upper flange groove and the lower flange groove form a complete flange groove, and the flange of the optical fiber connecting line assembly is fixed between the first shell and the second shell through the flange groove.

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