Electrostatic protection structure and electronic equipment

Abstract

The embodiment of the invention provides an electrostatic protection structure and electronic equipment, and relates to the technical field of terminals, at least one plastic structural part in the electronic equipment is provided with a containing space, a sensitive structure and the electrostatic protection structure are both arranged in the containing space, and the electrostatic protection structure is connected with the sensitive structure and a grounding end; a gap is formed between the at least one plastic structural part and the sensitive structure, and the gap is used for enabling static electricity to enter the accommodating space; the electrostatic protection structure at least comprises an insulating substrate and a conducting layer, the insulating substrate is connected with the sensitive structure, the conducting layer is arranged on the side, away from the sensitive structure, of the insulating substrate, the conducting layer is further connected with the grounding end, and the conducting layer is used for receiving static electricity and making the static electricity not make contact with the sensitive structure. Therefore, static electricity entering the accommodating space is in direct contact with the electrostatic protection structure instead of being in contact with the sensitive structure, the sensitive structure can be protected from being damaged by the static electricity, and the anti-static effect of the electronic equipment is good.

Description

Technical Field

[0001] The present application relates to the field of terminal technology, and in particular to an electrostatic protection structure and an electronic device. Background Art

[0002] Electronic devices such as mobile phones have gradually become an indispensable part of people's work and life. Currently, plastics are often used to prepare some structural parts in electronic devices to achieve the needs of weight reduction and waterproofing of electronic devices.

[0003] When electronic devices are in use, external charged objects or some structures inside the electronic devices can generate static electricity. When these static electricity hits some sensitive structures in the electronic devices, it will cause electrostatic discharge (ESD). If there are no reasonable protection measures for sensitive structures, they are prone to failure due to ESD. Related technologies In order to solve this problem, back glue or glue spots are often set at some locations of electronic devices to block static electricity, that is, back glue or glue spots are used to block static electricity from entering the space with sensitive structures to protect sensitive structures.

[0004] As electronic devices develop towards being thinner and smaller, the space inside electronic devices is getting smaller and smaller, and the space left for adhesive or glue is also very limited. When the size of the adhesive or glue is very small, it is not enough to block static electricity. Then, when static electricity breaks through the adhesive or glue and enters the space with sensitive structures, and because many structural parts in electronic devices are plastic products, there is no static electricity discharge path, resulting in static electricity directly hitting the sensitive structure, causing the sensitive structure to fail, seriously affecting the performance of the electronic equipment. Summary of the invention

[0005] An embodiment of the present application provides an electrostatic protection structure and an electronic device. The electrostatic protection structure is directly connected to a sensitive structure so that static electricity entering the accommodation space through a gap first contacts the electrostatic protection structure closest to it, and does not hit the sensitive structure. The electrostatic protection structure can protect the sensitive structure from damage.

[0006] In order to achieve the above purpose, the embodiment of the present application adopts the following technical solution: In a first aspect, an electrostatic protection structure applied to an electronic device is provided, the electronic device also includes a sensitive structure, a ground terminal and at least one plastic structural member, the at least one plastic structural member has a containing space, the sensitive structure and the electrostatic protection structure are both arranged in the containing space, and the electrostatic protection structure is respectively connected to the sensitive structure and the ground terminal; a gap is provided between the at least one plastic structural member and the sensitive structure, the width of the gap is less than or equal to 2 mm, the height of the gap is 20 μm-40 μm, and the gap is used to allow static electricity to enter the containing space; the electrostatic protection structure includes at least: an insulating substrate, the insulating substrate is connected to the sensitive structure; a conductive layer, the conductive layer is arranged on a side of the insulating substrate away from the sensitive structure, the conductive layer is also connected to the ground terminal, and the conductive layer is used to receive static electricity entering the containing space and prevent the static electricity from contacting the sensitive structure. An embodiment of the present application provides an electrostatic protection structure applied to electronic equipment. The electrostatic protection structure is directly connected to a sensitive structure. In this way, when static electricity enters the accommodation space, the distance between the static electricity and the electrostatic protection structure is the shortest, which means that the impedance is minimal. The static electricity will directly hit the conductive layer. Since the conductive layer and the sensitive structure are separated by an insulating substrate, that is, there is no electrical connection between the conductive layer and the sensitive structure, and they are not conductive, the static electricity will not hit the sensitive structure. Therefore, the electrostatic protection structure increases the electrostatic discharge path, that is, the static electricity can directly hit the electrostatic protection structure for discharge, and the electrostatic protection structure can protect the sensitive structure from damage.

[0007] In a possible implementation of the first aspect, the electrostatic protection structure further includes: a reinforcing piece, which is disposed on a side of the conductive layer away from the insulating substrate, connected to the conductive layer, and has a strength greater than that of the conductive layer. In this implementation, the reinforcing member can enhance the strength of the insulating base and the conductive layer, thereby ensuring that damage to the insulating base and the conductive layer is reduced and better connection between the structures is achieved.

[0008] In a possible implementation manner of the first aspect, the reinforcing member is disposed on a portion of the surface of the conductive layer away from the insulating substrate; and the thickness of the reinforcing member is greater than or equal to 0.15 mm.

[0009] In this implementation, the reinforcing member can enhance the strength of partial areas of the insulating base and the conductive layer, thereby ensuring that damage to the insulating base and the conductive layer is reduced and better connection between the structures is achieved.

[0010] In a possible implementation manner of the first aspect, the electrostatic protection structure further includes: an adhesive layer, which is disposed between the electrostatic protection structure and the sensitive structure, and is used to bond the electrostatic protection structure to the sensitive structure. In this implementation, the adhesive layer can connect the insulating substrate to the sensitive structure, while preventing the conductive layer from being electrically connected to the sensitive structure.

[0011] In a possible implementation of the first aspect, the portion of the conductive layer that penetrates the insulating substrate is the first conductive layer; the electrostatic protection structure also includes: a protective member, which is arranged between the first conductive layer and the grounding terminal, and the protective member is respectively connected to the first conductive layer and the grounding terminal. In this implementation, the protective member can not only protect the conductive layer from corrosion as much as possible, but also ensure impedance continuity after long-term use, so that the position with the protective member can have long-term reliable contact.

[0012] In a possible implementation manner of the first aspect, the electrostatic protection structure further includes: an elastic member, which is arranged between the protection member and the grounding end, and the elastic member is connected to the protection member and the grounding end respectively. In this implementation, since the circuit board or the middle frame cannot be directly connected to the protective member when serving as the ground terminal, an elastic member is added to ensure that the protective member is well connected to the ground terminal through the elastic member.

[0013] In a possible implementation manner of the first aspect, a portion of the conductive layer that penetrates the insulating substrate is a first conductive layer, and the first conductive layer is connected to the ground terminal. In this implementation, the conductive layer itself is grounded, which is simple and easy to implement.

[0014] In a possible implementation manner of the first aspect, the electrostatic protection structure further includes: an elastic member, which is disposed between the first conductive layer and the ground terminal, and is connected to the first conductive layer and the ground terminal respectively. In this implementation, since the circuit board or the middle frame cannot be directly connected to the protective member when serving as the ground terminal, an elastic member is added to ensure that the first conductive layer is well connected to the ground terminal through the elastic member.

[0015] In a possible implementation of the first aspect, the electrostatic protection structure further includes: an anti-oxidation layer, which is arranged on a side of the conductive layer away from the insulating substrate, and is used to protect the conductive layer from oxidation. In this implementation, the anti-oxidation layer can reduce the risk of the conductive layer being oxidized by water, oxygen, etc.

[0016] In a possible implementation manner of the first aspect, the anti-oxidation layer is configured to be capable of being broken down by static electricity of less than 1 kV. In this implementation, when static electricity directly hits the anti-oxidation layer, it can break through the anti-oxidation layer and reach the conductive layer. Since the conductive layer is also grounded, the static electricity goes directly to the ground through the conductive layer. This not only protects the conductive layer and reduces the risk of corrosion by water and oxygen, but also allows static electricity to be discharged through the conductive layer.

[0017] In a possible implementation of the first aspect, the sensitive structure is a rear camera assembly; the electronic device also includes a middle frame, a main board, a plastic main board bracket and a plastic decorative part, the main board, the plastic main board bracket and the plastic decorative part are arranged on the same side of the middle frame, the plastic main board bracket and the plastic decorative part form a accommodating space, the rear camera assembly is arranged in the accommodating space, the middle frame or the main board is used as a grounding terminal, there is a gap between the plastic decorative part and the rear camera assembly, the electrostatic protection structure is arranged around the rear camera assembly, the electrostatic protection structure is connected to the main board or the middle frame, the electrostatic protection structure is arranged between the rear camera assembly and the main board and the plastic main board bracket, and the plastic decorative part is arranged on the side of the plastic main board bracket away from the middle frame. In this implementation, after static electricity enters the accommodation space, the distance to the electrostatic protection structure is the shortest, the impedance is the smallest, there is no conduction between the electrostatic protection structure and the rear camera assembly, and the electrostatic protection structure is also grounded through an elastic member. For static electricity, directly discharging it to the mainboard through the electrostatic protection structure is the shortest impedance path and the path with the smallest impedance. Therefore, static electricity will not hit the rear camera assembly, but directly hit the electrostatic protection structure. The electrostatic protection structure can protect the rear camera assembly from damage.

[0018] In a possible implementation of the first aspect, a rear camera assembly includes a rear camera substrate, a rear camera module, a voice coil motor metal shell and a lens, the rear camera substrate is arranged on one side of a middle frame, the rear camera module and the voice coil motor metal shell are both arranged on the same side of the rear camera substrate away from the middle frame, the rear camera module and the voice coil motor metal shell are respectively connected to the rear camera substrate, the voice coil motor metal shell is sleeved around the rear camera module, the lens is arranged on one side of the rear camera module and the voice coil motor metal shell away from the middle frame, a gap is provided between the lens and the plastic decorative part, an electrostatic protection structure is arranged between the voice coil motor metal shell and the plastic mainboard bracket, and between the mainboard and the plastic mainboard bracket, and the electrostatic protection structure is respectively connected to the voice coil motor metal shell and the mainboard. In this implementation, after static electricity enters the accommodation space, the distance to the electrostatic protection structure is the shortest, the impedance is the smallest, there is no conduction between the electrostatic protection structure and the rear camera assembly, and the electrostatic protection structure is also grounded through an elastic member. For static electricity, directly discharging it to the mainboard through the electrostatic protection structure is the shortest impedance path. Therefore, static electricity will not hit the rear camera assembly, but directly hit the electrostatic protection structure. The electrostatic protection structure can protect the rear camera assembly from damage.

[0019] In a possible implementation of the first aspect, the electrostatic protection structure includes an insulating base, a conductive layer, a reinforcement, an adhesive layer, a protective member and an elastic member. The insulating base and the conductive layer form a whole that is divided into a first part, a second part and a third part. The first part, the second part and the third part are connected in sequence. The first part and the third part have the same extension direction, and the second part has a different extension direction from the first part and the third part. The insulating bases in the first part and the second part are connected to the metal shell of the voice coil motor through the adhesive layer, and there is a gap between the conductive layer and the plastic motherboard bracket. The third part is arranged between the plastic motherboard bracket and the motherboard, the reinforcement is arranged between the conductive layer in the third part and the plastic motherboard bracket, the protective member is arranged between the conductive layer penetrating the insulating base in the third part and the elastic member, the elastic member is arranged between the protective member and the motherboard, and the motherboard is used as a grounding terminal. In this implementation, when static electricity enters the accommodation space, the distance to the conductive layer is shortest and the impedance is minimum. The conductive layer and the camera module are separated by an insulating substrate and non-conductive glue. That is to say, there is no conduction between the conductive layer and the camera module. The conductive layer is also grounded through an elastic part. For static electricity, directly discharging it to the mainboard through the conductive layer is the shortest impedance path. Therefore, static electricity will not hit the camera module, but directly hit the conductive layer. The conductive layer can protect the camera module from damage. At the same time, the electrostatic protection structure can be bent, thereby making it more widely used.

[0020] In a possible implementation of the first aspect, the sensitive structure is an earpiece assembly; The electronic device also includes a plastic shell, a middle frame, a mainboard, a plastic mainboard bracket and a plastic battery cover. The plastic shell, the plastic mainboard bracket and the plastic battery cover form a accommodating space. The middle frame, the mainboard, the earpiece assembly and the electrostatic protection structure are all arranged in the accommodating space. There is a gap between the plastic shell and the plastic battery cover. The middle frame is arranged on one side of the plastic shell, the earpiece assembly and the mainboard are both arranged on the same side of the middle frame away from the plastic shell, the plastic mainboard bracket is arranged on the side of the earpiece assembly and the mainboard away from the middle frame, the plastic battery cover is arranged on the side of the plastic mainboard bracket away from the middle frame, and the middle frame or the mainboard is used as a grounding terminal. In this implementation, after static electricity enters the accommodation space, the distance to the electrostatic protection structure is the shortest, the impedance is the smallest, there is no conduction between the electrostatic protection structure and the earpiece assembly, and the electrostatic protection structure is also grounded through an elastic member. For static electricity, directly discharging it to the ground through the electrostatic protection structure is the shortest impedance path. Therefore, static electricity will not hit the earpiece assembly, but directly hit the electrostatic protection structure. The electrostatic protection structure can protect the earpiece from damage.

[0021] In a possible implementation of the first aspect, the electrostatic protection structure includes an insulating base, a conductive layer, an adhesive layer, a protective member and an elastic member. The insulating base and the conductive layer form a whole that is divided into a fourth part, a fifth part and a sixth part. The fourth part, the fifth part and the sixth part are connected in sequence. The fourth part and the sixth part have the same extension direction, and the fifth part extends in a different direction from the fourth part and the sixth part. The fourth part is arranged between the earpiece assembly and the plastic motherboard bracket. The insulating bases in the fourth part and the fifth part are bonded to the earpiece assembly through the adhesive layer. The conductive layer in the fourth part is adjacent to the plastic motherboard bracket and has a gap. There is a gap between the conductive layer in the fifth part and the plastic shell. The sixth part is arranged between the middle frame and the plastic battery cover. The protective member is arranged between the conductive layer penetrating the insulating base in the sixth part and the elastic member. The elastic member is arranged between the protective member and the middle frame. The middle frame is used as a grounding terminal. In this implementation, when static electricity enters the accommodation space, the distance to the conductive layer is shortest and the impedance is minimum. The conductive layer and the earpiece are separated by an insulating base and a non-conductive adhesive. That is to say, there is no conduction between the conductive layer and the earpiece. The conductive layer is also grounded through an elastic member. For static electricity, directly discharging it to the middle frame through the conductive layer is the shortest impedance path. Therefore, static electricity will not hit the earpiece, but directly hit the conductive layer. The conductive layer can protect the earpiece from damage. At the same time, the electrostatic protection structure can be bent, thereby making it more widely applicable.

[0022] In a second aspect, an electronic device is provided, comprising an electrostatic protection structure as in the first aspect or any possible implementation of the first aspect.

[0023] An embodiment of the present application provides an electronic device, in which the electromagnetic compatibility problem of hard damage to components or soft failure of component functions is effectively improved, and the performance of the electronic device is greatly improved.

[0024] The embodiments of the present application provide an electrostatic protection structure and an electronic device. The electrostatic protection structure is directly connected to a sensitive structure, so that when static electricity enters the accommodation space, the distance between the static electricity and the electrostatic protection structure is the shortest, which means that the impedance is minimal, and the static electricity will directly hit the conductive layer. Since the conductive layer and the sensitive structure are separated by an insulating substrate, that is, there is no electrical connection between the conductive layer and the sensitive structure, and they are not conductive, the static electricity will not hit the sensitive structure. Then, the electrostatic protection structure increases the electrostatic discharge path, that is, the static electricity can directly hit the electrostatic protection structure for discharge, and the electrostatic protection structure can protect the sensitive structure from damage. When applied to electronic equipment, the electrostatic protection capability of the electronic equipment is improved, the electromagnetic compatibility problem of hard damage of the structure or soft failure of the function in the electronic equipment is reduced, and the performance of the electronic equipment is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1A schematic diagram of the structure of an electronic device provided for related technology; Figure 2 A schematic diagram of the structure of another electronic device provided for related technology; Figure 3 for Figure 2 Schematic diagram of ESD occurring in the middle rear camera assembly; Figure 4 A front schematic diagram of the overall structure of an electronic device provided in an embodiment of the present application; Figure 5 for Figure 1 A schematic diagram of the back side of the electronic device shown; Figure 6 for Figure 1 A schematic diagram of the disassembled structure of the electronic device shown; Figure 7 A front schematic diagram of an electrostatic protection structure provided in an embodiment of the present application; Figure 8 A schematic diagram of the back side of an electrostatic protection structure provided in an embodiment of the present application; Fig. 9 A front schematic diagram of another electrostatic protection structure provided in an embodiment of the present application; Fig.10 A schematic diagram of the back side of another electrostatic protection structure provided in an embodiment of the present application; Fig.11 for Figure 8 and Fig.10 A cross-sectional view after cutting along cutting line T1T2; Fig.12 for Figure 8 and Fig.10 Another cross-sectional view after cutting along cutting line T1T2; Fig.13 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application; Fig.14 A schematic diagram of the structure of another electronic device provided in an embodiment of the present application; Fig.15 A schematic diagram of the structure of another electronic device provided in an embodiment of the present application; Fig.16 A schematic diagram of the structure of another electronic device provided in an embodiment of the present application.

[0026] Reference numerals: 01-electronic device; 20-first plastic structural part; 21-middle frame; 22-mainboard; 23-sensitive structure; 24-static protection; 3-rear camera assembly; 25-static gun; 101-front camera assembly; 102-display screen; 1021-translucent cover; 1022-screen; 104-back shell; 1041-back cover; 1042-frame; 107-installation port; F-gap; JD-static electricity; 7-plastic mainboard bracket; 8-plastic battery cover; 9-glue; 10-plastic decoration Parts; 11-back glue; 12-LENS; 26-static protection structure; 261-insulating base; 262-conductive layer; 263-reinforcement; 264-non-conductive glue; 265-finger protection; 266-elastic part; 267-anti-oxidation layer; 1-plastic shell; 100-RCV component; 4-connection component; 41-BTB support; 42-BTB; 43-FPC; 31-rear camera substrate; 32-rear camera module; 33-VCM metal shell; 14-sealing foam. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be described clearly and in detail below in conjunction with the accompanying drawings. In the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in the text is only a description of the association relationship of the associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0028] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as suggesting or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "multiple" means two or more. "At least one" means one or more.

[0029] In addition, in the present application, directional terms such as "up", "down", "left", "right", "inside" and "outside" are defined relative to the orientation of the components schematically placed in each figure. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they may change accordingly according to the changes in the orientation of the components placed in each figure.

[0030] First, some terms in the embodiments of the present application are explained in detail to facilitate understanding by those skilled in the art.

[0031] ESD refers to the charge transfer phenomenon that occurs when objects with different electrostatic potentials are close to each other or in direct contact.

[0032] An arc refers to the instantaneous spark produced when current passes through certain insulating media (such as air), and is a gas discharge phenomenon.

[0033] Instantaneous current refers to a sudden burst of high electrical energy, which is a transient and distorted state of current and voltage in an AC sinusoidal wave circuit.

[0034] The memory dump (DUMP) crash interface refers to the interface where the operating system automatically generates a memory dump file (DUMP file) when a program or system crashes. The DUMP file contains the memory status when the program or system crashes. It can be used to record the memory status and system information at the time of the crash and facilitate subsequent debugging and analysis.

[0035] Electromagnetic compatibility (EMC) refers to the ability of a device or system to operate in accordance with requirements in its electromagnetic environment and not produce intolerable electromagnetic interference to any structure in the environment. Therefore, EMC includes two requirements: on the one hand, the electromagnetic interference generated by the device or system to the environment during normal operation cannot exceed a certain limit; on the other hand, any structure has a certain degree of immunity to electromagnetic interference in the environment (also called electromagnetic sensitivity).

[0036] The adhesive backing in electronic devices is usually applied on one side of the film, and then the adhesive is pasted on the structure that needs to be bonded to achieve bonding. The adhesive can use silicone or glass glue, etc., which have good elasticity, wear resistance, temperature resistance and oxidation resistance. These properties make the adhesive backing have electrostatic pressure resistance characteristics. The electrostatic pressure resistance characteristics of the adhesive backing are mainly reflected in its resistance to static electricity and pressure resistance.

[0037] Gluing in electronic devices usually involves applying or smearing glue on a flat surface, and then placing the structure to be bonded to achieve bonding. The glue can be white glue, ultraviolet (UV) glue, or red glue. These glues play a role of reinforcement and sealing during bonding to prevent the intrusion of moisture and humidity. They also have electrostatic pressure resistance characteristics. The electrostatic pressure resistance characteristics of glue dispensing are mainly reflected in its resistance to static electricity and pressure resistance. In the glue dispensing process, the shape and size of the glue dispensing can be controlled by different dispensing heads and glue pressure, speed, trajectory and other parameters, which is suitable for precise dispensing in a smaller area.

[0038] A board-to-board connector (BTB) is a component used to connect different printed circuit boards (PCBs) in electronic devices. It can provide a reliable electrical connection, allowing signals, power or data to be transmitted between one circuit board and another.

[0039] The above is a brief introduction to the nouns involved in the embodiments of the present application, which will not be repeated below.

[0040] For example, Figure 1 An electronic device 01 to which the embodiment of the present application is applicable is shown.

[0041] As we all know, plastic has the advantages of being lighter and less prone to corrosion when exposed to water and oxygen compared to metal. Therefore, if electronic equipment is to be made lighter and more waterproof, plastic can be used to prepare some structural parts in the electronic equipment to optimize the performance of the electronic equipment.

[0042] like Figure 1 As shown, taking the electronic device 01 as a mobile phone as an example, the mobile phone may include a first plastic structural component 20, a middle frame 21, a main board 22 and a sensitive structure 23. The first plastic structural component 20 itself may enclose a receiving space, and the middle frame 21, the main board 22 and the sensitive structure 23 are all arranged in the receiving space.

[0043] Specifically, in the above-mentioned accommodation space, the middle frame 21 is arranged on the first plastic structural member 20, and all surfaces except one surface of the middle frame 21 are in contact with the first plastic structural member 20. The main board 22 is arranged on the surface of the middle frame 21 that is not in contact with the first plastic structural member 20, and the main board 22 is not in contact with the first plastic structural member 20. The sensitive structure 23 is arranged on a side surface of the main board 22 away from the first plastic structural member 20, and the sensitive structure 23 is not in contact with the first plastic structural member 20. The accommodation space is generally not completely sealed, otherwise it may affect the performance and use of the middle frame 21, the main board 22 and the sensitive structure 23, so that the accommodation space can be unsealed by having a gap F between the first plastic structural member 20 itself and the sensitive structure 23.

[0044] In practical applications, the sensitive structure 23 refers to electronic components and traces that are prone to failure after electrostatic contact, such as rear camera components, earpiece components, microphones, audio components, and PCB traces.

[0045] Please refer to Figure 1 The mobile phone may further include an electrostatic shield 24, which is in contact with the first plastic structure 20, and is used to fill at least a portion of the gap F to prevent static electricity from entering the accommodation space.

[0046] In practical applications, the electrostatic shield 24 may be adhesive backing or adhesive dispensing, etc., and it is necessary to use the electrostatic shield 24 such as adhesive backing or adhesive dispensing to block static electricity from entering the accommodation space without affecting the performance and use of the middle frame 21, the mainboard 22 and the sensitive structure 23.

[0047] In order to pursue the ultimate appearance of narrow frame, miniaturization, lightness and thinness, current electronic devices such as mobile phones need to design various structures compactly, and also need to make the internal space of the mobile phone small, which leads to the problem of insufficient space inside the mobile phone. Figure 1 When the electrostatic protection material 24 such as adhesive or glue is generally made to move along the first direction ( Figure 1 The width along the ox direction) and along the second direction ( Figure 1 The height of the electrostatic shield 24 in the oy direction is set to be small. Based on the electrostatic withstand voltage characteristics of the electrostatic shield 24, the product of the size of the electrostatic shield 24 and the withstand voltage characteristics is required to meet the electrostatic test level in order to block the electrostatic JD. If the width of the electrostatic shield 24 along the ox direction and the height along the oy direction are both small, it is difficult to meet this condition, resulting in that when the electrostatic JD enters through the gap F and contacts the electrostatic shield 24 (that is, hits the electrostatic shield 24), the electrostatic JD can easily break through the back glue or the dispensing electrostatic shield 24 and enter the accommodation space. At this time, since the first plastic structural member 20 is all near the sensitive structure 23, the first plastic structural member 20 has no electrostatic JD discharge function, resulting in the electrostatic JD directly hitting the sensitive structure 23, causing a series of electromagnetic compatibility problems such as hard damage or functional soft failure to the sensitive structure 23, thereby causing poor performance of the mobile phone and poor user experience.

[0048] In applications, the static electricity JD may come from static electricity outside the electronic device 01, such as static electricity brought by human body contact, static electricity carried by some objects in the living environment, etc., which is not specifically limited here.

[0049] It should be noted that the mobile phone may not include the electrostatic protection 24. In this case, no structure is set at the gap F of the first plastic structural member 20, that is, it is an air gap, which will inevitably cause static electricity JD to enter the accommodation space and directly hit the sensitive structure 23, resulting in the above-mentioned problem.

[0050] The following are two examples of electrostatic discharge hazards in different locations of two mobile phones provided in the related art.

[0051] Example 1: Figure 2 A schematic diagram of a rear camera assembly 3 and some structures related thereto in an electronic device 01 to which an embodiment of the present application is applicable is shown. It should be noted that: Figure 2 The dotted lines resembling triangles in the figure are not real structures but are just to illustrate the angle of the camera.

[0052] like Figure 2 As shown, the electronic device 01 may include a middle frame 21, a rear camera assembly 3, a mainboard 22, a plastic mainboard bracket 7, a plastic battery cover 8, a glue dispenser 9, a plastic decoration (decoration, DECO) 10, a back glue 11, a LENS 12, a connection assembly 4 and a sealing foam 14. It should be noted that the specific positions of these structures are described in the following embodiments and are not described in detail here.

[0053] The rear camera module 32 in the embodiment of the present application may refer to the rest of the rear camera assembly 3 except the lens (LENS) 12, the rear camera substrate 31 and the voice coil motor (VCM) metal housing 33, such as the camera and the photosensitive device. Furthermore, the LENS 12 may specifically be a glass lens.

[0054] In application, a LENS 12 may be provided on the plastic DECO 10 , and the LENS 12 may allow light to pass through and enter the light incident surface of the rear camera assembly 3 .

[0055] Figure 3 It shows a Figure 2 Schematic diagram of electrostatic discharge of the middle rear camera assembly 3.

[0056] Related Technology In the rear camera assembly of some mobile phones, the plastic DECO leaves very little space for the LENS. In order to prevent static electricity from directly hitting the rear camera module, it is often Figure 1 In this way, a backing glue 11 is arranged near the LENS 12 as an electrostatic shield, so as to block the static electricity through the backing glue and protect the rear camera module from being damaged by static electricity.

[0057] Combination Figure 2 and Figure 3As shown, due to the space limitation of the rear camera assembly 3, the gap between the plastic DECO 10 and the LENS 12 and the space near it are very limited. At this time, if a back glue 11 is set in the space other than the gap between the plastic DECO 10 and the LENS 12 in the rear camera assembly 3 to block the static electricity entering from the gap, the size of the back glue 11 can only be made very small. For example, the width of the back glue 11 along the ox direction is only about 0.8mm. It is difficult for such a small-sized back glue 11 to completely block the static electricity. In this way, when the electrostatic gun 25 is used to perform an ESD test on the rear camera assembly 3 in the CAMERA preview mode, it can be observed that the electrostatic gun 25 performs a 10kV air discharge on the plastic DECO and its vicinity. After the back glue 11 is broken down by the 10kV air discharge, its electrostatic protection function fails. At this time, the electrostatic arc can pass through the plastic DECO 10 and the LENS The gap between 12 and then hits the rear camera assembly 3. For example, static electricity directly hits the VCM metal shell 33 of the rear camera assembly 3, which can cause the VCM metal shell 33 to generate an instantaneous large current. The instantaneous large current will damage the rear camera assembly 3 and drag the mobile phone system, causing the entire system to be abnormally stuck and enter the DUMP freeze interface or the camera function to be abnormal, thereby causing the mobile phone to be abnormal and the user experience to be poor.

[0058] Example 2: The gap between the plastic DECO and the plastic battery cover in the mobile phone and the space nearby are very limited. At this time, if glue is set in the space other than the gap between the plastic DECO and the plastic battery cover to block the static electricity entering from the gap, the size of the glue can only be made very small. Such a small size of glue is difficult to completely block the static electricity. In this way, when the ESD test is performed on the plastic DECO and the plastic battery cover when the mobile phone is in CAMERA preview mode, it can be observed that there is a 10kV air discharge at this position. After the glue is broken down by the 10kV air discharge, its electrostatic protection function fails. At this time, the electrostatic arc can pass through the gap between the plastic DECO and the plastic battery cover and hit the flash of the mobile phone, which can cause the flash of the mobile phone to generate an instantaneous large current. The instantaneous large current will damage the flash power supply path of the power management unit (PMU), and the flash is always on and cannot be turned off normally, causing the mobile phone to be abnormal and the user experience is poor.

[0059] Based on the above description, it can be known that there are many plastic structural parts in electronic devices, such as plastic battery covers, plastic DECOs and plastic motherboard brackets. Once the electrostatic protection materials such as back glue or dispensing that are intended to block static electricity fail, static electricity can enter the accommodation space where the sensitive structure is placed through the gap between the plastic structural parts and the sensitive structure. Since these plastic structural parts around the sensitive structure cannot provide an electrostatic discharge path like metals, static electricity directly hits the sensitive structure, resulting in a series of electromagnetic compatibility problems, which seriously affects the performance of the electronic equipment and poor user experience.

[0060] In view of this, the present application provides an electrostatic protection structure, which is directly connected to the sensitive structure. In this way, when static electricity enters the accommodation space, the distance between the static electricity and the electrostatic protection structure is the shortest, which means that the impedance is minimal, and the static electricity will directly hit the conductive layer. Since the conductive layer and the sensitive structure are separated by an insulating substrate, that is, there is no electrical connection between the conductive layer and the sensitive structure, and they are not conductive, static electricity will not hit the sensitive structure. Then, the electrostatic protection structure increases the electrostatic discharge path, that is, static electricity can directly hit the electrostatic protection structure for discharge, and the electrostatic protection structure can protect the sensitive structure from damage. When applied to electronic equipment, the electrostatic protection capability of the electronic equipment is improved.

[0061] When the electrostatic protection structure of the present application is applied to electronic equipment, the electromagnetic compatibility problem of hard damage of electronic equipment components or soft failure of component functions is effectively improved, and the performance of the electronic equipment is greatly improved.

[0062] The embodiments of the present application do not impose any restrictions on the specific types of electronic devices. In some embodiments, the electronic devices of the present application may include mobile phones, wearable devices (for example, smart bracelets, smart watches and headphones, etc.), tablet computers, laptop computers, handheld computers, notebooks, ultra-mobile personal computers (UMPC), cellular phones, personal digital assistants (PDA), augmented reality (AR) and virtual reality (VR) devices, and other Internet of Things (IOT) devices and vehicle-mounted electronic devices.

[0063] Figure 4 The figure shows a front structural diagram of an electronic device 01 applicable to the embodiment of the present application. Figure 5 Shows Figure 4 A schematic diagram of the back structure of the electronic device 01. Figure 6Shows Figure 4 and Figure 5 The exploded view of the electronic device 01 is shown. It should be noted that, for ease of understanding, the present application embodiment takes the electronic device 01 as a mobile phone as an example. Figures 4 to 6 The electronic device 01 is described by taking a tablet phone as an example.

[0064] In other embodiments, the electronic device may also be other types of mobile phones such as foldable mobile phones, which are not specifically limited here.

[0065] The specific structure of the electronic device 01 applicable to the embodiment of the present application is further described below.

[0066] like Figures 4 to 6 As shown, the mobile phone applicable to the embodiment of the present application may include a display screen 102, a back shell 104 and a mainboard 22. It can be understood that Figures 4 to 6 The following figures only schematically illustrate some components of the mobile phone, and the actual shape, size, position and structure of these components are not subject to Figures 4 to 6 and the limitations of the accompanying drawings below.

[0067] In practical applications, the display screen 102 can be used to display images and videos, etc. The display screen 102 may include a light-transmitting cover plate 1021 and a screen 1022, and the light-transmitting cover plate 1021 and the screen 1022 are stacked. Among them, the light-transmitting cover plate 1021 is mainly used to protect and dustproof the screen 1022. The screen 1022 can be a flexible display screen or a rigid display screen. Exemplarily, the screen 1022 can be any one of a liquid crystal display (LCD), an organic light emitting diode (OLED) screen, a sub-millimeter light emitting diode (Mini LED) screen, and a micro light emitting diode (Micro LED) screen.

[0068] In practical applications, the back shell 104 can be used to protect the electronic components inside the mobile phone. The back shell 104 may include a back cover 1041 and a frame 1042, wherein the back cover 1041 is arranged on a side of the screen 1022 away from the light-transmitting cover plate 1021, and is stacked with the light-transmitting cover plate 1021 and the screen 1022. The frame 1042 is arranged between the back cover 1041 and the light-transmitting cover plate 1021, and is fixed on the back cover 1041.

[0069] In practical applications, the main board 22 may be a hard circuit board, such as a PCB, or the main board 22 may be a flexible printed circuit (FPC), or the main board 22 may be a hard-soft circuit board. Further, the main board 22 may be a single-sided board or a double-sided board. A single-sided board refers to a main board 22 having electronic components ( Figures 4 to 6 Double-sided board means that electronic components are arranged on both sides of the main board 22 ( Figures 3 to 5 The main board 22 may be a radio frequency (RF) board and an application processor (AP) board, etc. The RF board may be used to carry a radio frequency chip (RF IC) and a radio frequency power amplifier (RF PA), etc. The application processor board may be used to carry a SOC, a DDR, a main power management chip, and an auxiliary power management chip, etc.

[0070] exist Figures 4 to 6 In the illustrated embodiment, the shape of the mobile phone applicable to the present application may be a rectangular flat plate, and of course may also be any other shape, which is not specifically limited here.

[0071] Please combine Figures 4 to 6 The mobile phone to which the present application is applicable may also include a camera assembly, which is generally divided into a front camera assembly (camera compact module, CCM) 101 and a rear camera assembly 3.

[0072] like Figure 4 As shown, the front camera assembly 101 can be installed on the upper left portion of the display screen 102 and used for self-portraits.

[0073] like Figure 5 and Figure 6 As shown, the rear camera assembly 3 can be installed on the upper left portion of the back shell 104 and used to shoot the scene around the mobile phone.

[0074] It should be understood that Figures 4 to 6 The installation positions, numbers, etc. of the front camera assembly 101 and the rear camera assembly 3 shown are for reference only and shall be subject to actual application.

[0075] The light incident surface of the rear camera assembly 3 faces the back cover 1041. The back cover 1041 is provided with a mounting opening 107, which can correspond to the plastic battery cover 8. The plastic DECO 10 covers and is fixed at the mounting opening 107. The plastic DECO 10 is connected to the plastic battery cover 8 through the mounting opening 107. The plastic DECO 10 can be used to carry and protect the rear camera assembly 3. In a direction perpendicular to the plastic battery cover 8, the LENS is arranged below the opening of the plastic DECO 10. At this time, the plastic DECO 10 is arranged around the LENS. The user can directly contact the plastic DECO 10. For example, the user's hand can touch the upper surface and / or side of the plastic DECO 10.

[0076] In practical applications, the plastic DECO 10 may be an annular structure, such as a circular ring or a square ring, etc., whereby the annular portion of the plastic DECO 10 may be fixed and supported on one side of the plastic battery cover 8 by threaded connection, clamping or welding. Exemplarily, the annular portion of the plastic DECO 10 may be fixed to the plastic battery cover 8 by screws, so that the plastic DECO 10 may fix the plastic battery cover 8 and prevent it from moving.

[0077] In actual applications, the rear camera assembly 3 can be a periscope camera assembly, or a vertical camera assembly, etc., which is not specifically limited here.

[0078] Only the contents related to the invention are introduced here. The remaining structures can be obtained by referring to the relevant technology and will not be described in detail here.

[0079] Based on the above structure, the electrostatic protection structure provided by the present application is applied to electronic devices. The electrostatic protection structure is directly connected to the sensitive structure. In this way, when static electricity enters the accommodation space, the distance between the static electricity and the electrostatic protection structure is the shortest, which means that the impedance is minimal, and the static electricity will directly hit the conductive layer. Since the conductive layer and the sensitive structure are separated by an insulating substrate, that is, there is no electrical connection between the conductive layer and the sensitive structure, and they are not conductive, static electricity will not hit the sensitive structure. Then, the electrostatic discharge path is increased through the electrostatic protection structure, that is, static electricity can directly hit the electrostatic protection structure for discharge, and the electrostatic protection structure can protect the sensitive structure from damage. When applied to electronic equipment, the electrostatic protection capability of the electronic equipment is improved, the electromagnetic compatibility problems of hard damage of the structure or soft failure of the function in the electronic equipment are reduced, and the performance of the electronic equipment is better.

[0080] Please combine the following Figures 7 to 12 , the electrostatic protection structure 26 applicable to the present application is introduced in detail. It should be noted that, Fig.11 and Fig.12 Yes Figure 8 and Fig.10Obtained after cutting along cutting line T1T2.

[0081] like Figures 7 to 12 As shown, the present application provides an electrostatic protection structure 26 applied to an electronic device, and the electronic device may also include: at least one plastic structural member, a sensitive structure and a grounding terminal, at least one plastic structural member has a accommodating space, the sensitive structure and the electrostatic protection structure are both arranged in the accommodating space, and the electrostatic protection structure is respectively connected to the sensitive structure and the grounding terminal.

[0082] There is a gap between at least one plastic structural member and the sensitive structure, and the gap is along the first direction ( Figures 7 to 12 The width of the gap along the second direction ( Figures 7 to 12 The height of the gap (in the oy direction) is 20μm-40μm, and the gap is used to allow static electricity to enter the accommodation space where the sensitive structure is placed.

[0083] Among them, the electrostatic protection structure 26 may at least include: an insulating base 261 and a conductive layer 262, the insulating base 261 is in contact with the sensitive structure, the conductive layer 262 is arranged on the side of the insulating base 261 away from the sensitive structure, and the conductive layer 262 is also connected to the ground end. The conductive layer 262 is used to receive static electricity entering the accommodating space and prevent the static electricity from hitting the sensitive structure.

[0084] As an example, the width of the gap along the ox direction can be 0.1 mm, 0.5 mm, 1 mm, 1.5 mm or 2 mm, etc.; the height of the gap along the oy direction can be 20 mm, 25 mm, 30 mm, 35 mm or 40 mm, etc. In applications, the sensitive structure may be in contact with or not in contact with at least one plastic structural member, which is not specifically limited here, but the sensitive structure is not in direct contact with the ground terminal.

[0085] Similarly, the electrostatic protection structure 26 may be in contact with or not in contact with at least one plastic structural component, which is not specifically limited here.

[0086] It should be understood that the electronic device including at least one plastic structural member may mean that the electronic device includes only one plastic structural member; or, the electronic device includes multiple plastic structural members, which is not specifically limited here. In the case where the electronic device includes one plastic structural member, there is a gap between the plastic structural member itself and between the plastic structural member and the sensitive structure, and static electricity outside the plastic structural member can enter the accommodation space where the sensitive structure is placed through the gap. In the case where the electronic device includes multiple plastic structural members, it may be that one plastic structural member itself has an accommodation space, and this plastic structural member itself and between the plastic structural member and the sensitive structure have a gap; or, it may also be that multiple plastic structural members enclose the accommodation space, and there is a gap between at least two of the multiple plastic structural members and between the plastic structural member and the sensitive structure. Of course, at this time, there may also be a gap between one plastic structural member itself and between the plastic structural member and the sensitive structure, which can be determined according to actual needs.

[0087] Therefore, at least one gap between a plastic structural member and a sensitive structure may mean: a gap between one plastic structural member and the sensitive structure; or, gaps between multiple plastic structural members and the sensitive structure. The number of gaps between each plastic structural member and the sensitive structure may be one or more, which is not specifically limited here. In the case where there are multiple gaps, the sizes and shapes of the multiple gaps may be the same or different, depending on the actual application.

[0088] The grounding terminal can be a PCB or a middle frame in an electronic device, that is, the PCB and the middle frame can be used as a grounding terminal so that the electrostatic protection structure 26 can flow the received static electricity into the ground.

[0089] The volume and position of the aforementioned accommodation space can be determined according to the shape and number of the plastic structural parts, and the volume and position of the sensitive structure and the electrostatic protection structure 26 .

[0090] In application, the insulating substrate 261 can be a rigid insulating substrate or a flexible insulating substrate. In the case where the insulating substrate 261 is a rigid insulating substrate, the rigid insulating substrate cannot be bent. At this time, the electrostatic protection structure 26 can be set at certain positions in the electronic device where the electrostatic protection structure 26 does not need to be bent. In the case where the insulating substrate 261 is a flexible insulating substrate, the flexible insulating substrate can be bent. At this time, the electrostatic protection structure 26 can be set at any position of the electronic device. When the electrostatic protection structure 26 needs to be bent, it will be bent, and when the electrostatic protection structure 26 does not need to be bent, it will not be bent. Therefore, the insulating substrate 261 can meet the bending performance while being suitable for a variety of application scenarios. Among them, the material of the flexible insulating substrate can be polyimide (PI) or polyester (PET), etc.

[0091] The thickness d1 of the insulating base 261 along the oy direction may be greater than or equal to 13 μm, and illustratively, d1 may be 13 μm, 14 μm, 15 μm, 16 μm or 17 μm, etc. Thus, the insulating base 261 can not only support the conductive layer 262, but also isolate the conductive layer 262 from the sensitive structure, so that the conductive layer 262 and the sensitive structure are not in direct contact. In this way, when static electricity enters the accommodation space, air discharge (rather than contact discharge) can hit the electrostatic protection structure 26 instead of the sensitive structure, so as to protect the sensitive structure.

[0092] In applications, the conductive layer 262 may be a conductive foil or a conductive wire, etc. Thus, the conductive layer 262 may be bent along with the flexible substrate when the electrostatic protection structure 26 needs to be bent, and may not be bent when the electrostatic protection structure 26 does not need to be bent.

[0093] The material of the conductive layer 262 may be metal, such as copper (Cu), gold (Au), silver (Ag), etc. When the material of the conductive layer 262 is copper, the material of the conductive layer 262 may be electrolytic copper or rolled copper, etc., which is not specifically limited here.

[0094] The thickness d2 of the conductive layer 262 along the oy direction may be 12 μm-35 μm, and illustratively, d2 may be 12 μm, 15 μm, 20 μm, 25 μm, 30 μm or 35 μm, etc. Thus, the conductive layer 262 is thin, and can be bent well while having good conductivity, and can make the electronic device miniaturized and thin.

[0095] The DC impedance of the conductive layer 262 may be less than or equal to 5Ω. For example, the DC impedance of the conductive layer 262 may be 1Ω, 2Ω, 3Ω, 4Ω or 5Ω, etc. Therefore, the conductive layer 262 has good ductility and conductivity.

[0096] It is understood that the conductive layer 262 can be directly printed on one side of the insulating substrate 261; or, the conductive layer 262 can be bonded to one side of the insulating substrate 261 by an adhesive, which is not specifically limited here. In the case of using an adhesive, the adhesive in the embodiment of the present application can be epoxy resin, etc., so that the adhesive has good bonding performance and does not affect the performance of the insulating substrate 261 and the conductive layer 262.

[0097] In one or more embodiments, the bending radius of the electrostatic protection structure 26 composed of the insulating base 261 and the conductive layer 262 may be greater than or equal to 5h, where h is the thickness of the electrostatic protection structure 26 along the oy direction, that is, the sum of the thickness of the insulating base 261 along the oy direction and the thickness of the conductive layer 262 along the oy direction.

[0098] Furthermore, when the electrostatic protection structure 26 composed of the insulating substrate 261 and the conductive layer 262 needs to be bent, the number of times the structure is bent can be determined according to actual needs. For example, the structure can be bent once or multiple times.

[0099] It should be understood that the contact between the insulating substrate 261 and the sensitive structure may mean that the insulating substrate 261 is directly connected to the sensitive structure; or, the insulating substrate 261 is connected to the sensitive structure through other structures, for example, the insulating substrate 261 may be bonded to the sensitive structure through an adhesive layer.

[0100] The adhesive layer may be a non-conductive adhesive 264, etc., where the non-conductive adhesive 264 may be a non-conductive backing adhesive without metal particles, etc. The insulation resistance of the non-conductive adhesive 264 may be greater than or equal to 10MΩ, and for example, the insulation resistance of the non-conductive adhesive 264 may be 10MΩ, 11MΩ, 12MΩ, 13MΩ, 14MΩ or 15MΩ, etc. The thickness d6 of the non-conductive adhesive 264 along the oy direction may be greater than or equal to 30μm, and for example, d6 may be 30μm, 35μm, 40μm, 45μm, 50μm or 60μm, etc. Thus, the non-conductive adhesive 264 can connect the insulating substrate 261 to the sensitive structure, and make the conductive layer 262 not electrically connected to the sensitive structure.

[0101] It should be understood that the conductive layer 262 is connected to the ground terminal, which may mean that part of the conductive layer 262 penetrates part of the insulating base 261 along the oy direction and directly contacts the ground terminal; or, part of the conductive layer 262 penetrates part of the insulating base 261 along the oy direction and contacts the ground terminal through other protective parts, that is, other protective parts are arranged between the conductive layer 262 that penetrates part of the insulating base 261 and the insulating base 261, and in this case, all other protective parts are arranged on the side of the insulating base 261 away from the conductive layer 262, and the other protective parts are in direct contact with the insulating base 261 and the conductive layer 262 respectively; or, part of the conductive layer 262 does not penetrate part of the insulating base 261 along the oy direction and contacts the ground terminal through other protective parts, and in this case, part of the other protective parts are arranged on the side of the insulating base 261 away from the conductive layer 262, part of the conductive layer 262 and part of the other protective parts are arranged in part of the insulating base 261, and the other protective parts are in direct contact with the insulating base 261 and the conductive layer 262 respectively. In these implementations, the insulating substrate 261 may have at least one through hole, and part of the conductive layer 262 may partially or completely enter the through hole, thereby other protective components may partially enter the through hole or not enter the through hole, which is not specifically limited here.

[0102] Of course, the conductive layer 262 being connected to the ground terminal may also mean that: the conductive layer 262 does not pass through the insulating substrate 261 and directly contacts the ground terminal; or, the conductive layer 262 does not pass through the insulating substrate 261 and contacts the ground terminal through other protective parts. In this case, the other protective parts do not pass through the insulating substrate 261 and contact the ground terminal either. The specific details shall be subject to actual application.

[0103] In applications, the protective element can be Fig.11 The protective finger 265 can be electroplated or coated on the outer surface of one side of the conductive layer 262 penetrating the insulating substrate 261, and the protective finger 265 can be connected to the ground terminal.

[0104] The material of the protection finger 265 can be gold, copper or nickel (Ni), etc. When the material of the protection finger 265 is gold and the material of the conductive layer 262 is copper, gold can be plated on the copper surface to form a gold finger. The gold finger has good ductility and conductivity. In this way, the copper can be protected from corrosion as much as possible through the gold finger, and the impedance continuity can be ensured after long-term use, so that long-term reliable contact can be achieved here.

[0105] Of course, the protection finger 265 may also be a separate structure, and the protection finger 265 may be combined with the outer surface of the conductive layer 262 that penetrates the insulating substrate 261 by adhesive or the like, which is not specifically limited here.

[0106] like Fig.11 As shown, the thickness d4 of the protection finger 265 along the oy direction may be greater than or equal to 5 μm, and specifically, d4 may be 5 μm, 6 μm, 7 μm, 8 μm or 9 μm, etc. Thus, the protection finger can protect the copper from corrosion as much as possible, and can also ensure impedance continuity after long-term use, so that the conductive layer can be in long-term reliable contact with the ground terminal or other structures.

[0107] In one or more embodiments, the electrostatic protection structure 26 may further include an elastic member 266, which may be a spring sheet, a conductive foam, or other elastic structure. The spring sheet may be a convex spring sheet, or the like.

[0108] As an example, the elastic member 266 is disposed between the protection finger 265 and the ground terminal, and the elastic member 266 contacts the protection finger 265 and the ground terminal respectively. Specifically, the elastic member 266 can be welded or bonded to one side of the protection finger 265, the middle frame 21 or the mainboard 22.

[0109] Furthermore, the effective contact area between the protective finger 265 and the elastic member 266 may be greater than or equal to 10 mm. 2 Specifically, the effective contact area between the protective finger 265 and the elastic member 266 may be 10 mm2 、11mm 2 , 12mm 2 、13mm 2 , 14mm 2 or 15mm 2 Etc. Thus, it is possible to ensure that the finger 265 is in effective contact with the elastic member 266 for a long time.

[0110] It should be noted that the working height of the elastic member 266 can be determined according to the distance between the protection finger 265 and the grounding terminal along the oy direction.

[0111] Since the circuit board or the middle frame cannot be directly connected to the protection finger 265 when used as the grounding terminal, an elastic member 266 is added to ensure that the protection finger 265 is well connected to the grounding terminal through the elastic member 266.

[0112] In one or more embodiments, the insulating base 261 and the conductive layer 262 are relatively soft as a whole. When the electrostatic protection structure 26 has an elastic member 266, the elastic member 266 is likely to break the insulating base 261 and the conductive layer 262 in certain application scenarios. This requires that the grounded portion of the electrostatic protection structure 26 be harder than other portions, that is, have a stronger strength to ensure good performance. Fig.11 and Fig.12 As shown, the electrostatic protection structure 26 may further include a reinforcement piece 263, which is disposed on a side of the conductive layer 262 away from the insulating base 261. The reinforcement piece 263 may be bonded to the conductive layer 262 by adhesives such as glue, thereby ensuring that damage to the insulating base 261 and the conductive layer 262 is reduced and better connection between the structures is achieved.

[0113] As an example, the reinforcing piece 263 can be disposed on a portion of the surface of the conductive layer away from the insulating substrate. If the conductive layer and the insulating substrate need to be bent, the reinforcing piece 263 can be disposed on a portion of the surface of the conductive layer away from the insulating substrate where the bending is not required.

[0114] In application, the thickness d3 of the reinforcing member 263 along the oy direction may be greater than or equal to 0.15 mm, and specifically, d3 may be 0.15 mm, 0.18 mm, 0.2 mm, 0.25 mm or 0.3 mm, etc. Thus, the obtained reinforcing member 263 has a higher strength.

[0115] Furthermore, when the reinforcement 263 is a steel sheet, the thickness of the steel sheet along the oy direction can be greater than or equal to 0.15 mm; or, when the reinforcement 263 is plastic PI, the thickness of the plastic PI along the oy direction can be greater than or equal to 0.25 mm, and no specific limitation is made here.

[0116] In one or more embodiments, when the electrostatic protection structure 26 needs to be set around the sensitive structure, regardless of whether the electrostatic protection structure 26 is provided with structures such as protection fingers 265, elastic members 266, and reinforcing members 263, it is only necessary to set a first hole in the insulating base 261 and a second hole in the conductive layer 262, and the first hole and the second hole at least partially overlap along the oy direction, then the first hole and the second hole are set on the electrostatic protection structure 26, that is, the electrostatic protection structure 26 is set around the sensitive structure. If the electrostatic protection structure 26 is also provided with protection fingers 265, elastic members 266, and reinforcing members 263, these structures can be set in the portion of the insulating base 261 other than the first hole and / or the portion of the conductive layer 262 other than the second hole.

[0117] Significant, such as Fig. 9 and Fig.10 As shown, the first hole and the second hole have the same shape and size. Exemplarily, the first hole and the second hole can be in the shape of a cylinder, a cuboid, or a cube, as long as the insulating base 261 and the conductive layer 262 can be set around the sensitive structure.

[0118] In the case where the shapes of the first hole and the second hole are both cylindrical, it is obvious that the first hole and the second hole are completely overlapped along the oy direction, that is, the diameters of the first hole and the second hole are both Fig. 9 and Fig.10 As shown in D1, D1 can be as small as possible while ensuring that the sensitive structure can work normally. Specifically, D1 needs to be greater than or equal to the maximum length of the portion that cannot be covered when the sensitive structure works normally, so that the insulating base 261 and the conductive layer 262 can be mounted on the sensitive structure and can play a good protective role.

[0119] Furthermore, the above D1 can be equal to the maximum length of the part that cannot be covered when the sensitive structure is working normally, that is, the insulating base 261 and the conductive layer 262 are sleeved on the sensitive structure and in contact with the sensitive structure all around. At this time, the electrostatic protection effect of the electrostatic protection structure 26 is very good.

[0120] In one or more embodiments, Figure 7 and Figure 8 As shown, there are no holes in the insulating base 261 and the conductive layer 262 in the electrostatic protection structure 26. At this time, the electrostatic protection structure 26 cannot be set around the sensitive structure, but can be attached to at least one surface of the sensitive structure, and the electrostatic protection structure 26 can contact at least one surface of the sensitive structure.

[0121] In one or more embodiments, the electrostatic protection structure 26 may further include an anti-oxidation layer 267 , and the anti-oxidation layer 267 is disposed on a side of the conductive layer 262 away from the insulating substrate 261 .

[0122] In applications, the material of the anti-oxidation layer 267 may be ink or gold without metal particles, etc. Thus, the risk of the conductive layer 262 being oxidized by water, oxygen, etc., may be reduced through the protection of the anti-oxidation layer 267 .

[0123] Furthermore, the anti-oxidation layer is used to be able to be broken down by static electricity with a voltage less than 1 kV, and the impedance of the anti-oxidation layer is small. For example, when the anti-oxidation layer can be broken down by static electricity with a voltage of 0.5 kV, static electricity with voltages of 0.8 kV, 1 kV, 1.5 kV, and 10 kV can break down the anti-oxidation layer, and then the static electricity reaches the conductive layer, which leads it to the ground terminal, thereby protecting the sensitive structure.

[0124] When the material of the anti-oxidation layer 267 is ink without metal particles, the anti-oxidation layer 267 is not conductive. It is further required that the thickness d7 of the anti-oxidation layer 267 along the direction perpendicular to the oy satisfy the following requirement: d7×electrostatic withstand voltage parameter (in kV / mm) must be less than 1kV, that is, static electricity less than 1kV can break through the anti-oxidation layer 267.

[0125] When gold is plated on the conductive layer 262 to form the anti-oxidation layer 267, since gold itself is conductive, static electricity can directly pass through the gold to the conductive layer, and then be directly conducted away by the conductive layer being grounded. In this case, the electrostatic breakdown characteristics of the anti-oxidation layer 267 are not restricted.

[0126] In one or more embodiments, the sensitive device needs to be a light-transmitting sensitive device or a sound-transmitting sensitive device, etc.

[0127] An embodiment of the present application provides an electrostatic protection structure, which is directly connected to a sensitive structure. In this way, when static electricity enters the accommodation space, the distance between the static electricity and the electrostatic protection structure is the shortest, which means that the impedance is minimal, and the static electricity will directly hit the conductive layer. Since the conductive layer and the sensitive structure are separated by an insulating substrate, that is, there is no electrical connection between the conductive layer and the sensitive structure, and they are not conductive, static electricity will not hit the sensitive structure. Therefore, an electrostatic discharge path is increased through the electrostatic protection structure, that is, static electricity can directly hit the electrostatic protection structure for discharge, and the electrostatic protection structure can protect the sensitive structure from damage.

[0128] When the electrostatic protection structure of the present application is applied to electronic equipment, the electrostatic protection capability of the electronic equipment is improved, the electromagnetic compatibility problems caused by hard damage to the structure or soft failure of the function in the electronic equipment are reduced, and the performance of the electronic equipment is better.

[0129] The electrostatic protection structure provided by the present application is applied to electronic equipment as follows: Figures 13 to 16 Electronic equipment01.

[0130] Embodiment 1 (the sensitive structure is the rear camera assembly 3): Fig.13 FIG. 1 is a schematic diagram showing a structure of an electronic device 01 applicable to an embodiment of the present application. Fig.10 After cutting at the T3T4 section line position, we can get Fig.13 The electrostatic protection structure in Fig.13 The dashed line with an arrow in the middle is the discharge path during the electrostatic discharge test.

[0131] like Fig.13 As shown, the width h1 of the gap along the ox direction is less than or equal to 2 mm; the height h2 of the gap along the oy direction is 20 μm-40 μm.

[0132] Please refer to Fig.13 The electronic device 01 includes a middle frame 21, a LENS 12, a rear camera module 32, a rear camera substrate 31, a VCM metal shell 33, a main board 22, a plastic main board bracket 7, a plastic battery cover 8, a dispensing glue 9, a plastic DECO 10 and a back glue 11.

[0133] The middle frame 21 is used to support the mainboard 22, the plastic mainboard bracket 7, the plastic battery cover 8, the glue 9, the plastic DECO 10, the back glue 11, the rear camera module 32, the rear camera substrate 31, the VCM metal shell 33 and the LENS 12. In the application, the middle frame 21 can be a metal middle frame, for example, any one of an aluminum alloy middle frame, a magnesium alloy middle frame or a titanium alloy middle frame.

[0134] The mainboard 22 is arranged on one side of the middle frame 21, the plastic mainboard bracket 7 is arranged on the side of the mainboard 22 away from the middle frame 21, the plastic battery cover 8 is arranged on the side of the plastic mainboard bracket 7 away from the middle frame 21, the plastic DECO 10 is arranged on the side of the plastic battery cover 8 away from the middle frame 21, and the plastic DECO 10 is connected to the plastic battery cover 8 through the glue 9. The plastic mainboard bracket 7, the plastic battery cover 8 and the plastic DECO 10 constitute a receiving space, and the rear camera module 32, the rear camera substrate 31, the VCM metal shell 33 and the LENS 12 are all arranged in the receiving space.

[0135] Among them, the rear camera substrate 31 is arranged on one side of the middle frame 21, the rear camera module 32 is arranged on the side of the rear camera substrate 31 away from the middle frame 21, the rear camera module 32 is connected to the rear camera substrate 31, the VCM metal shell 33 is sleeved around the rear camera module 32, the VCM metal shell 33 is also arranged on the side of the rear camera substrate 31 away from the middle frame 21, the VCM metal shell 33 is also connected to the rear camera substrate 31, the LENS 12 is arranged on the side of the rear camera module 32 and the VCM metal shell 33 away from the middle frame 21, the LENS 12 is not connected to the rear camera module 32 and the VCM metal shell 33 respectively, and the LENS 12 is also connected to the plastic DECO 10 through the back glue 11.

[0136] The electronic device 01 further includes a BTB support 41, a BTB 42 and an FPC 43. The BTB support 41 is arranged on a side of the mainboard 22 away from the middle frame 21. The BTB 42 is arranged on a side of the BTB support 41 away from the middle frame 21. The BTB 42 is connected to the BTB support 41. The BTB 42 is connected to the rear camera substrate 31 through the FPC 43.

[0137] The electronic device 01 also includes an electrostatic protection structure, which is mounted outside the VCM metal shell 33 and is connected to the VCM metal shell 33 . The electrostatic protection structure is also located in a partial area between the mainboard 22 , the plastic mainboard bracket 7 and the VCM metal shell 33 .

[0138] The electrostatic protection structure includes an insulating base 261, a conductive layer 262, a reinforcement piece 263, a non-conductive glue 264, a protective finger 265 and an elastic piece 266. The insulating base 261 and the conductive layer 262 are composed of a first part, a second part and a third part. The first part, the second part and the third part are connected in sequence. The first part and the third part extend along the ox direction, and the second part extends along the oy direction. The first part and the second part are both arranged between the VCM metal shell 33 and the plastic motherboard bracket 7. Specifically, the insulating base 261 in the first part and the second part are connected to the VCM metal shell 33 through the non-conductive glue 264, the conductive layer 262 does not contact the plastic motherboard bracket 7, and the third part is arranged A reinforcing piece 263 is also provided between the plastic motherboard bracket 7 and the motherboard 22, and between the conductive layer 262 in the third part and the plastic motherboard bracket 7. The reinforcing piece 263 contacts the conductive layer 262, but has a gap with the plastic motherboard bracket 7. A protective finger 265 and an elastic piece 266 are also provided between the insulating base 261 in the third part and the motherboard 22. The protective finger 265 is provided between the insulating base 261 and the elastic piece 266. The protective finger 265 contacts the conductive layer 262 and the elastic piece 266 penetrating the insulating base 261, respectively. The elastic piece 266 is provided between the protective finger 265 and the motherboard 22. The elastic piece 266 contacts the protective finger 265 and the motherboard 22, respectively. The motherboard 22 is used as a grounding terminal.

[0139] Since the electrostatic protection structure is smaller in size and weaker in strength than sensitive structures, problems such as warping may occur in the actual assembly of electronic equipment. Therefore, from the perspective of improving the difficulty of assembling the electrostatic protection structure, the electrostatic protection structure can be directly attached to the VCM metal shell and then reliably connected to the ground terminal. It is only necessary to ensure that the electrostatic protection structure is set around the VCM metal shell. In this way, when static electricity enters the accommodation space through the gap between the plastic DECO and the LENS, it will first hit the electrostatic protection structure, thereby playing an electrostatic protection role for the VCM metal shell.

[0140] It should be noted that the first part (composed of the insulating base 261 , the non-conductive adhesive 264 and the conductive layer 262 ) can cover the surface of the VCM metal housing 33 along the ox direction, so as to better achieve the electrostatic protection function.

[0141] An embodiment of the present application provides an electronic device, which has a storage space for placing a rear camera assembly, so that when static electricity enters the storage space, the distance to the conductive layer is the shortest, the impedance is the smallest, and the conductive layer is isolated from the VCM metal shell by an insulating substrate and a non-conductive adhesive, that is, there is no conduction between the conductive layer and the VCM metal shell, and the conductive layer is also grounded through an elastic member. For static electricity, directly discharging it to the mainboard through the conductive layer is the shortest impedance path, so the static electricity will not hit the VCM metal shell, but directly hit the conductive layer. The conductive layer can protect the rear camera module from damage, thereby greatly improving the performance of the electronic device.

[0142] Embodiment 2 (the sensitive structure is a receiver (RCV) component 100): Fig.14 A schematic structural diagram of an electronic device 01 applicable to an embodiment of the present application is shown.

[0143] like Fig.14 As shown, the width h1 of the gap along the ox direction is less than or equal to 2 mm; the height h2 of the gap along the oy direction is 20 μm-40 μm.

[0144] Please refer to Fig.14 The electronic device includes: a plastic shell 1, a middle frame 21, a mainboard 22, a plastic mainboard bracket 7, a plastic battery cover 8, a BTB 42, a back glue 11, an RCV component 100, an insulating base 261, a conductive layer 262, a non-conductive glue 264, a finger protection 265 and an elastic member 266. The plastic shell 1, the plastic mainboard bracket 7 and the plastic battery cover 8 form a receiving space, the middle frame 21, the mainboard 22, the BTB 42, adhesive 11, RCV assembly 100, insulating base 261, conductive layer 262, non-conductive adhesive 264, protective finger 265 and elastic member 266 are all arranged in the accommodating space, there is a gap F between the plastic shell 1 and the plastic battery cover 8, the adhesive 11 blocks part of the gap F, the adhesive 11 contacts the plastic shell 1 and the plastic battery cover 8 respectively, the middle frame 21 is arranged on one side of the plastic shell 1, and the surface of the middle frame 21 facing the plastic shell 1 contacts the plastic shell 1 respectively, the RCV assembly 100 and the main board 22 are both arranged along the oy direction on the side of the middle frame 21 away from the plastic shell 1, the BTB 42 is arranged along the oy direction between the main board 22 and the plastic main board bracket 7, and the BTB42 contacts the main board 22 and the RCV assembly 100 respectively.

[0145] The whole formed by the insulating base 261 and the conductive layer 262 is composed of the fourth part, the fifth part and the sixth part, which are connected in sequence, and the fourth part and the sixth part both extend along the ox direction, and the fifth part extends along the oy direction. The fourth part is arranged between the RCV component 100 and the plastic motherboard bracket 7 along the oy direction. Specifically, the insulating base 261 in the fourth part is bonded to the RCV component 100 through the non-conductive adhesive 264, and there is a gap between the conductive layer 262 in the fourth part and the plastic motherboard bracket 7. The fifth part is arranged between the plastic shell 1 and the RCV component 100 along the ox direction. Specifically, the insulating base 261 in the fifth part is bonded to the RCV component 100 through the non-conductive adhesive 264, and there is a gap between the conductive layer 262 in the fifth part and the plastic shell 1. The sixth part is arranged between the middle frame 21 and the plastic battery cover 8 along the oy direction. A protective finger 265 and an elastic member 266 are also arranged between the insulating base 261 in the sixth part and the middle frame 21. The protective finger 265 is arranged between the insulating base 261 and the elastic member 266. The protective finger 265 is respectively in contact with the conductive layer penetrating the insulating base 261 and the elastic member 266. The elastic member 266 is arranged between the protective finger 265 and the middle frame 21. The elastic member 266 is respectively in contact with the protective finger 265 and the middle frame 21. The middle frame 21 is used as a grounding terminal. There is a gap between the conductive layer 262 in the sixth part and the plastic battery cover 8.

[0146] An embodiment of the present application provides an electronic device having a storage space for placing an earpiece, so that when static electricity enters the storage space, the distance to the conductive layer is shortest, the impedance is minimum, and the conductive layer and the earpiece are isolated by an insulating substrate and a non-conductive adhesive, that is, there is no conduction between the conductive layer and the earpiece, and the conductive layer is also grounded. For static electricity, directly discharging to the middle frame through the conductive layer is the shortest impedance path. Therefore, static electricity will not hit the earpiece, but directly hit the conductive layer. The conductive layer can protect the earpiece from damage, reduce a series of electromagnetic compatibility problems caused by hard damage of the device or soft failure of the device function for the electronic device, and greatly improve the performance of the electronic device.

[0147] Embodiment 3: like Fig.15 As shown, the width h1 of the gap along the ox direction is less than or equal to 2 mm; the height h2 of the gap along the oy direction is 20 μm-40 μm. Fig.16 You can refer to Fig.15 gap.

[0148] Please refer to Fig.15 and Fig.16The electronic device 01 includes: a first plastic structure 20, a middle frame 21, a mainboard 22, a sensitive structure 23 and an electrostatic protection structure 26. The first plastic structure 20 itself can enclose a containing space. A gap F is provided between the first plastic structure 20 itself and the first plastic structure 20 itself and the sensitive structure 23. The middle frame 21 is provided on the first plastic structure 20. All surfaces except one surface of the middle frame 21 are in contact with the first plastic structure 20. The mainboard 22 is provided on a surface of the middle frame 21 that is not in contact with the first plastic structure 20. The mainboard 22 is not in contact with the first plastic structure 20. The mainboard 22 is used as a ground terminal. The sensitive structure 23 is provided on a side surface of the mainboard 22 away from the first plastic structure 20. The sensitive structure 23 is not in contact with the first plastic structure 20.

[0149] Please refer to Fig.15 The electrostatic protection structure 26 is disposed on one side of the sensitive structure 23 along the ox direction, and the electrostatic protection structure 26 is in contact with the sensitive structure 23 and the main board 22 respectively.

[0150] Please refer to Fig.16 The electrostatic protection structure 26 covers all surfaces of the sensitive structure 23 and contacts the main board 22 .

[0151] An embodiment of the present application provides an electronic device having a storage space for placing a sensitive structure, so that when static electricity enters the storage space, the distance between the static electricity and the electrostatic protection structure is the shortest, the impedance is the smallest, and the electrostatic protection structure is isolated from the sensitive structure, that is, the electrostatic protection structure and the sensitive structure are not conductive, and the electrostatic protection structure is also grounded. For static electricity, directly discharging to the mainboard through the electrostatic protection structure is the shortest impedance path. Therefore, static electricity will not hit the sensitive structure, but directly hit the electrostatic protection structure. The electrostatic protection structure can protect the sensitive structure from damage, thereby reducing a series of electromagnetic compatibility problems caused by hard damage of devices or soft failure of device functions for the electronic device, and greatly improving the performance of the electronic device.

[0152] Only some contents related to the invention are introduced here. The rest of the contents can be obtained by referring to the relevant technology and will not be described in detail here.

[0153] It should be understood that the above is only to help those skilled in the art better understand the embodiments of the present application, and is not intended to limit the scope of the embodiments of the present application. Based on the above examples given, those skilled in the art can obviously make various equivalent modifications or changes, for example, some steps in each embodiment of the method may be non-essential, or some new steps may be added, etc.; or a combination of any two / multiple embodiments described above. Such modified, changed or combined solutions also fall within the scope of the embodiments of the present application.

[0154] It should also be understood that the above description of the embodiments of the present application focuses on emphasizing the differences between the various embodiments. The same or similar points that are not mentioned can be referenced to each other. For the sake of brevity, they will not be repeated here.

[0155] It should be further understood that the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0156] It should also be understood that the division of the methods, situations, categories and embodiments in the embodiments of the present application is only for the convenience of description and should not constitute a special limitation. The features of various methods, categories, situations and embodiments can be combined without contradiction.

[0157] It should also be understood that in the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced to each other, and the technical features in different embodiments can be combined to form new embodiments according to their internal logical relationships.

[0158] Finally, it should be noted that the above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electrostatic protection structure, characterized in that: Applied to electronic equipment, the electronic equipment further comprises a sensitive structure, a ground terminal and at least one plastic structural member, the at least one plastic structural member has a containing space, the sensitive structure and the electrostatic protection structure are both arranged in the containing space, the electrostatic protection structure is respectively connected to the sensitive structure and the ground terminal; there is a gap between at least one plastic structural member and the sensitive structure, the width of the gap is less than or equal to 2 mm, the height of the gap is 20 μm-40 μm, and the gap is used to allow static electricity to enter the containing space; The electrostatic protection structure at least comprises: An insulating substrate connected to the sensitive structure; A conductive layer is arranged on a side of the insulating base away from the sensitive structure, and the conductive layer is also connected to the ground terminal. The conductive layer is used to receive static electricity entering the accommodating space and prevent the static electricity from contacting the sensitive structure.

2. The electrostatic protection structure according to claim 1, characterized in that: The electrostatic protection structure also includes: A reinforcing piece, wherein the reinforcing piece is arranged on a side of the conductive layer away from the insulating substrate, the reinforcing piece is connected to the conductive layer, and the strength of the reinforcing piece is greater than the strength of the conductive layer.

3. The electrostatic protection structure according to claim 2, characterized in that: The reinforcing member is arranged on a portion of the surface of the conductive layer away from the insulating substrate; The thickness of the reinforcing piece is greater than or equal to 0.15 mm.

4. The electrostatic protection structure according to any one of claims 1 to 3, characterized in that: The electrostatic protection structure also includes: An adhesive layer is disposed between the electrostatic protection structure and the sensitive structure, and is used to bond the electrostatic protection structure to the sensitive structure.

5. The electrostatic protection structure according to any one of claims 1 to 3, characterized in that: The portion of the conductive layer that passes through the insulating substrate is a first conductive layer; The electrostatic protection structure also includes: A protection member is disposed between the first conductive layer and the ground terminal, and is connected to the first conductive layer and the ground terminal respectively.

6. The electrostatic protection structure according to claim 5, characterized in that: The electrostatic protection structure also includes: An elastic member is disposed between the protective member and the grounding end, and the elastic member is connected to the protective member and the grounding end respectively.

7. The electrostatic protection structure according to any one of claims 1 to 3, characterized in that: The portion of the conductive layer that passes through the insulating substrate is a first conductive layer, and the first conductive layer is connected to the ground terminal.

8. The electrostatic protection structure according to claim 7, characterized in that: The electrostatic protection structure also includes: An elastic member is disposed between the first conductive layer and the grounding end, and the elastic member is connected to the first conductive layer and the grounding end respectively.

9. The electrostatic protection structure according to any one of claims 1 to 3, characterized in that: The electrostatic protection structure also includes: The anti-oxidation layer is arranged on a side of the conductive layer away from the insulating substrate, and is used to protect the conductive layer from being oxidized.

10. The electrostatic protection structure according to claim 9, characterized in that: The anti-oxidation layer is used to be able to be broken down by static electricity less than 1 kV.

11. The electrostatic protection structure according to any one of claims 1 to 3, characterized in that: The sensitive structure is a rear camera assembly; The electronic device also includes a middle frame, a main board, a plastic main board bracket and a plastic decorative part. The main board, the plastic main board bracket and the plastic decorative part are arranged on the same side of the middle frame. The plastic main board bracket and the plastic decorative part form a accommodating space. The rear camera assembly is arranged in the accommodating space. The middle frame or the main board is used as the grounding terminal. There is a gap between the plastic decorative part and the rear camera assembly. The electrostatic protection structure is sleeved around the rear camera assembly. The electrostatic protection structure is connected to the main board or the middle frame. The electrostatic protection structure is arranged between the rear camera assembly, the main board and the plastic main board bracket. The plastic decorative part is arranged on a side of the plastic main board bracket away from the middle frame.

12. The electrostatic protection structure according to claim 11, characterized in that: The rear camera assembly includes a rear camera substrate, a rear camera module, a voice coil motor metal shell and a lens. The rear camera substrate is arranged on one side of the middle frame. The rear camera module and the voice coil motor metal shell are both arranged on the same side of the rear camera substrate away from the middle frame. The rear camera module and the voice coil motor metal shell are respectively connected to the rear camera substrate. The voice coil motor metal shell is sleeved around the rear camera module. The lens is arranged on one side of the rear camera module and the voice coil motor metal shell away from the middle frame. There is a gap between the lens and the plastic decorative part. The electrostatic protection structure is arranged between the voice coil motor metal shell and the plastic mainboard bracket, and between the mainboard and the plastic mainboard bracket. The electrostatic protection structure is respectively connected to the voice coil motor metal shell and the mainboard.

13. The electrostatic protection structure according to claim 12, characterized in that: The electrostatic protection structure comprises the insulating base, the conductive layer, a reinforcing member, an adhesive layer, a protective member and an elastic member. The insulating base and the conductive layer are integrally divided into a first part, a second part and a third part. The first part, the second part and the third part are sequentially connected. The first part and the third part have the same extension direction, and the second part has a different extension direction from the first part and the third part. The insulating bases in the first part and the second part are connected to the metal shell of the voice coil motor through the adhesive layer, there is a gap between the conductive layer and the plastic mainboard bracket, the third part is arranged between the plastic mainboard bracket and the mainboard, the reinforcement is arranged between the conductive layer in the third part and the plastic mainboard bracket, the protective part is arranged between the conductive layer penetrating the insulating base in the third part and the elastic part, the elastic part is arranged between the protective part and the mainboard, and the mainboard is used as the grounding terminal.

14. The electrostatic protection structure according to any one of claims 1 to 3, characterized in that: The sensitive structure is an earpiece assembly; The electronic device also includes a plastic shell, a middle frame, a mainboard, a plastic mainboard bracket and a plastic battery cover, the plastic shell, the plastic mainboard bracket and the plastic battery cover form a accommodating space, the middle frame, the mainboard, the earpiece assembly and the electrostatic protection structure are all arranged in the accommodating space, the plastic shell and the plastic battery cover have the gap, the middle frame is arranged on one side of the plastic shell, the earpiece assembly and the mainboard are both arranged on the same side of the middle frame away from the plastic shell, the plastic mainboard bracket is arranged on a side of the earpiece assembly and the mainboard away from the middle frame, the plastic battery cover is arranged on a side of the plastic mainboard bracket away from the middle frame, the middle frame or the mainboard is used as the grounding terminal.

15. The electrostatic protection structure according to claim 14, characterized in that: The electrostatic protection structure comprises the insulating substrate, the conductive layer, the adhesive layer, the protective member and the elastic member, the insulating substrate and the conductive layer are formed into a fourth part, a fifth part and a sixth part, the fourth part, the fifth part and the sixth part are connected in sequence, the fourth part and the sixth part extend in the same direction, and the fifth part extends in a direction different from that of the fourth part and the sixth part; The fourth part is arranged between the earpiece assembly and the plastic mainboard bracket, the insulating bases in the fourth part and the fifth part are bonded to the earpiece assembly through the adhesive layer, the conductive layer in the fourth part is adjacent to the plastic mainboard bracket and has a gap, the conductive layer in the fifth part and the plastic shell have a gap, the sixth part is arranged between the middle frame and the plastic battery cover, the protective member is arranged between the conductive layer penetrating the insulating base in the sixth part and the elastic member, the elastic member is arranged between the protective member and the middle frame, and the middle frame is used as the grounding terminal.

16. An electronic device, characterized in that: The invention comprises the electrostatic protection structure according to any one of claims 1 to 15.

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