Memory extension module and PCIE (Peripheral Component Interface Express) module

Abstract

The invention provides a memory extension module and a PCIE (Peripheral Component Interface Express) module, and relates to the technical field of electronics. A memory expansion module comprises a first printed circuit board, a second printed circuit board and a third printed circuit board, a memory expansion chip and a radiator covering the memory expansion chip are arranged on the first printed circuit board, and a golden finger used for being connected with a PCIE interface in an inserted mode is arranged on one side of the first printed circuit board; the second printed circuit board is provided with at least two memory slots, the memory slots are arranged on the surfaces of the two sides of the second printed circuit board, and memories are arranged on the memory slots in a pluggable mode; the rotating mechanism is fixed on the first printed circuit board and the second printed circuit board, and the second printed circuit board is rotationally arranged relative to the first printed circuit board through the rotating mechanism; and the electric connection mechanism is arranged between the first printed circuit board and the second printed circuit board and is electrically connected with the memory expansion chip and the memory slot. Through the structure, the maintenance efficiency of the extended memory in the electronic equipment can be improved.

Description

Technical Field

[0001] The present invention relates to the field of electronic technology, and in particular to a memory expansion module and a PCIE module. Background Art

[0002] With the rapid development of technologies such as cloud computing, big data, and artificial intelligence, the amount of data processing has gradually increased, and the demand for memory capacity and bandwidth expansion in electronic devices has also increased. In this case, the PCIE (Peripheral Component Interconnect Express) protocol is one of the ways to achieve memory expansion.

[0003] In the above implementation, a number of memories are inserted into the memory expansion module, and the management of the number of memories is achieved through the expansion control chip, and a heat sink needs to be set for the expansion control chip to dissipate heat. Due to space limitations, the overall size of the memory expansion module needs to be consistent with the size of the PCIE card. Therefore, a number of memories need to be plugged into the memory expansion module in opposite directions, which makes the insertion and removal of the number of memories into the memory expansion module blocked by the expansion control chip and its heat sink. When maintaining the memory on the memory expansion module, the memory expansion module needs to be disassembled and the heat sink removed before the memory can be plugged in and out, which reduces the maintenance efficiency of the memory expansion module. Summary of the invention

[0004] In order to overcome the problems existing in the related art, this specification provides a memory expansion module and a PCIE module.

[0005] According to a first aspect of an embodiment of this specification, a memory expansion module is provided, including:

[0006] A first printed circuit board, wherein a memory expansion chip and a heat sink covering the memory expansion chip are arranged on the first printed circuit board, and a gold finger for plugging into a PCIE interface is arranged on one side of the first printed circuit board;

[0007] A second printed circuit board, wherein at least two memory slots are arranged on the second printed circuit board, the memory slots are arranged on two side surfaces of the second printed circuit board, and memories are pluggably arranged on the memory slots;

[0008] A rotating mechanism, fixed to the first printed circuit board and the second printed circuit board, through which the second printed circuit board is rotatably arranged relative to the first printed circuit board;

[0009] The electrical connection mechanism is disposed between the first printed circuit board and the second printed circuit board, and electrically connects the memory expansion chip and the memory slot.

[0010] Optionally, the electrical connection mechanism is a flexible circuit board;

[0011] The first printed circuit board, the flexible circuit board and the second printed circuit board are integrally formed, and a signal line electrically connecting the memory expansion chip and the memory slot is provided on the flexible circuit board.

[0012] Optionally, the electrical connection mechanism includes:

[0013] A first socket, arranged on the first printed circuit board;

[0014] a second socket, arranged on the second printed circuit board;

[0015] The plug cable is plugged into the first socket and the second socket respectively.

[0016] Optionally, the rotating mechanism comprises:

[0017] A fixing portion, arranged on the first printed circuit board;

[0018] The rotating part is arranged on the second printed circuit board and is rotatably connected to the fixed part via a rotating shaft.

[0019] Optionally, the fixing portion includes:

[0020] a first fixing sheet extending along the first printed circuit board and fixedly connected to the first printed circuit board;

[0021] A supporting sheet connected to the first fixing sheet and extending toward a side away from the first printed circuit board;

[0022] A connecting piece extending from an edge of the supporting piece away from the center of the first printed circuit board to a side away from the first printed circuit board;

[0023] The rotating part comprises:

[0024] a second fixing sheet extending along the second printed circuit board and fixedly connected to the second printed circuit board;

[0025] A rotating shaft sleeve is connected to an edge of the second fixing plate close to the first printed circuit board, and the rotating shaft is sleeved into the rotating shaft sleeve and penetrates the connecting plate.

[0026] Optionally, the rotating mechanism further includes:

[0027] The locking portion is arranged between the fixed portion and the rotating portion, wherein when the locking portion is in a locked state, the rotation between the fixed portion and the rotating portion is locked, and when the locking portion is in an unlocked state, the rotating portion rotates relative to the fixed portion.

[0028] Optionally, the locking portion includes:

[0029] a protrusion, disposed on one of the fixed portion and the rotating portion;

[0030] A groove is provided on the other of the fixing portion and the rotating portion, and the protrusion slides into the groove to cooperate and lock.

[0031] Optionally, the locking portion includes:

[0032] A locking hole, provided in one of the fixed portion and the rotating portion;

[0033] A captive screw is fixed to the other of the fixed part and the rotating part, and the captive screw is inserted into the locking hole to cooperate with the locking.

[0034] Optionally, the locking portion includes:

[0035] A sliding groove is provided on the fixing portion, wherein the sliding groove extends to an opening at an edge of the fixing portion;

[0036] A locking groove, disposed on the fixing portion and located at an end of the sliding groove, wherein the locking groove extends out of the sliding groove on at least one side of the sliding groove;

[0037] An elastic locking piece, arranged on the rotating part and extending along the edge of the rotating part toward the outer side of the fixed part, the elastic locking piece corresponding to the opening and deviating from the locking groove to the side of the sliding groove;

[0038] Among them, when the elastic locking piece is pressed into the sliding groove and reaches the locking groove, part of the elastic locking piece is accommodated in the side of the locking groove extending out of the sliding groove, and the locking portion is placed in a locked state; when the elastic locking piece is pushed out of the side of the locking groove extending out of the sliding groove and slides out of the opening of the sliding groove along the sliding groove, the locking portion is placed in an unlocked state.

[0039] According to a second aspect of an embodiment of this specification, a PCIE expansion module is provided, comprising at least one memory expansion module as described in any one of the above items.

[0040] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0041] In the embodiment of the present specification, the second printed circuit board can be rotatably arranged relative to the first printed circuit board through a rotating mechanism. When maintaining the memory arranged on the second printed circuit board, the second printed circuit board is rotated so that it is staggered with the first printed circuit board by a certain angle, so that the memory can be conveniently removed from the memory slot, thereby improving the maintenance efficiency of the memory expansion module.

[0042] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0044] Figure 1 It is a structural schematic diagram of a memory expansion module involved in this application;

[0045] Figure 2 It is a structural schematic diagram of a memory expansion module involved in the present application, wherein the second printed circuit board and the first printed circuit board form a certain angle to maintain the memory;

[0046] Figure 3 is a structural schematic diagram of a memory expansion module involved in the present application, wherein the second printed circuit board is arranged vertically with respect to the first printed circuit board;

[0047] Figure 4 It is a schematic diagram of a preparation process of a first printed circuit board, a second printed circuit board and a flexible circuit board in a memory expansion module involved in an embodiment of the present application;

[0048] Figure 5 is a schematic diagram of a memory expansion module structure involved in another embodiment of the present application, wherein the electrical connection mechanism is formed by a socket and a cable;

[0049] Figure 6 is a schematic diagram of the structure of a rotating mechanism in a memory expansion module involved in an embodiment of the present application, wherein: Figure 6 (A) The rotating mechanism is in the locked state. Figure 6 (B) The rotating mechanism is in unlocked state;

[0050] Figure 7 is a structural schematic diagram of a rotating mechanism in a memory expansion module involved in another embodiment of the present application;

[0051] Figure 8 is a schematic diagram of the structure of a rotating mechanism in a memory expansion module involved in another embodiment of the present application, wherein: Figure 8(A) The rotating mechanism is in the locked state. Figure 8 (B) The rotating mechanism is in unlocked state;

[0052] Fig. 9 It is a structural diagram of a PCIE module involved in this application. DETAILED DESCRIPTION

[0053] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this specification. Instead, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.

[0054] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this specification. The singular forms "a", "the" and "the" used in this specification and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0055] It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this specification, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0056] The present application provides a memory expansion module 100, such as Figure 1 As shown, including:

[0057] A first printed circuit board 1, on which a memory expansion chip 10 and a heat sink 11 covering the memory expansion chip 10 are arranged, and a gold finger 12 for plugging into a PCIE interface is arranged on one side of the first printed circuit board 1, wherein the first printed circuit board 1 can be electrically connected to a PCIE interface arranged on a mainboard or a PCIE interface on a PCIE expansion module (Riser) through the gold finger 12, so as to realize a physical connection of processor memory expansion on the mainboard;

[0058] A second printed circuit board 2, wherein at least two memory slots 20 are arranged on the second printed circuit board 2, and the memory slots 20 are arranged on both side surfaces 2A and 2B of the second printed circuit board 2, and a memory 21 is pluggably arranged on the memory slots 20, wherein, since the shape and size of the memory expansion module 100 need to be consistent with the PCIE module on the electronic device, the sizes of the first printed circuit board 1 and the second printed circuit board 2 and the various components arranged thereon need to meet the size of the PCIE module;

[0059] The rotating mechanism 3 is fixed to the first printed circuit board 1 and the second printed circuit board 2. The second printed circuit board 2 can be rotated relative to the first printed circuit board 1 through the rotating mechanism 3. The rotating mechanism 3 can be formed by a rigid material. The first printed circuit board 1 and the second printed circuit board 2 can be arranged nearly orthogonally during the operation of the electronic device through the rotating mechanism 3, and the size of the second printed circuit board 2 and the memory slot 20 and memory 21 arranged thereon can be limited as much as possible. In addition, since the rotating mechanism 3 is made of a rigid material, it can provide a higher connection for the first printed circuit board 1 and the second printed circuit board 2. Reliability, the rotating mechanism 3 can form a locked state and an unlocked state. In the locked state, the first printed circuit board 1 and the second printed circuit board 2 can maintain a stable connection state, which is used to provide a fixed connection during the operation of the electronic device. In the unlocked state, the first printed circuit board 1 and the second printed circuit board 2 can be rotated (or separated) to facilitate the staggering of the memory 21 and the heat sink 11 to maintain the memory 21 set on the second printed circuit board 2. That is to say, the rotation of the second printed circuit board 2 relative to the first printed circuit board 1 achieved by the rotating mechanism 3 can be a rotation after the two are separated, or a non-separated rotation between the two;

[0060] The electrical connection mechanism 4 is arranged between the first printed circuit board 1 and the second printed circuit board 2, and electrically connects the memory expansion chip 10 and the memory slot 20. The electrical connection mechanism 4 can be electrically connected by a connector and a cable, or can be a bendable electrical connection formed by pressing between a flexible circuit board and a hard circuit board. It can be set according to actual needs and is not limited to this. The pins of the memory expansion chip 10 on the first printed circuit board 1 are inserted into the vias and other structures set on the first printed circuit board 1, and the pins of the memory slot 20 on the second printed circuit board 2 are inserted into the vias and other structures set on the second printed circuit board 2. In addition, since the two side surfaces 2A and 2B of the second printed circuit board 2 need to be respectively plugged with the memory slots 20, therefore, when the thickness of the second printed circuit board 2 is not enough to accommodate the pins of the memory slots 20 on both sides, the memory slots 20 on both sides can be staggered so that the pins of the memory slots 20 on both sides can use the thickness of the second printed circuit board 2 as much as possible to deploy their internal circuits.

[0061] by Figure 2 to Figure 3 Observing in sequence, when the memory expansion module 100 is installed in the electronic device, the heat sink 11 can be installed on the first printed circuit board 1 first, and then the memory 21 away from the first printed circuit board 1 is installed in the memory slot 20 on the second printed circuit board 2. After that, the rotating mechanism 3 is driven to rotate, so that the second printed circuit board 2 is rotated by a certain angle, and the memory slot 20 of the second printed circuit board 2 and the heat sink 11 on the first printed circuit board 1 are staggered, so as to insert the memory 21 into the memory slot 20 close to the first printed circuit board 1. Finally, the rotating mechanism 3 is operated to rotate back and switch to the locked state, and the installation of the memory expansion module 100 is completed.

[0062] by Figure 3 to Figure 2 Observe the sequence of the steps, when it is necessary to remove the memory 21 from the second printed circuit board 2, the rotating mechanism 3 can be operated to stagger the second printed circuit board 2 and the first printed circuit board 1 by a certain angle, and the rotating mechanism 3 can be unlocked to make the memory 21 close to the first printed circuit board 1 avoid the heat sink 11, and the memory 21 can be removed and replaced. After that, the staff can operate the rotating mechanism 3 again to restore it to the locked state, quickly complete the maintenance of the memory expansion module 100, avoid the problem of removing the heat sink 11 during the maintenance of the memory 21, and thus improve the maintenance efficiency of the memory expansion module 100.

[0063] Optional, such as Figure 2 , 3 As shown, the electrical connection mechanism 4 is a flexible circuit board 40;

[0064] The first printed circuit board 1 , the flexible printed circuit board 40 and the second printed circuit board 2 are integrally formed, and a signal line electrically connecting the memory expansion chip 10 and the memory slot 20 is provided on the flexible printed circuit board 40 .

[0065] Since the memory expansion module 100 includes two printed circuit boards, namely a first printed circuit board 1 and a second printed circuit board 2 , the electrical components disposed on the two printed circuit boards need to be electrically connected via an electrical connection mechanism 4 .

[0066] In order to improve the reliability of electrical connection and reduce the electrical connection operations between the first printed circuit board 1 and the second printed circuit board 2, when preparing the printed circuit board in the memory expansion module 100, it can be prepared by integrating a flexible printed circuit board and a rigid printed circuit board, that is, the first printed circuit board 1 and the second printed circuit board 2 are rigid printed circuit boards, and the flexible circuit board 40 is used to achieve electrical connection between the two.

[0067] Possible implementation methods include: Figure 4 As shown, including but not limited to, using a flexible circuit board 40 as a core board, pre-forming a signal line on the flexible circuit board 40, and the signal line is used for subsequent electrical connection of a memory expansion chip 10 provided on a first printed circuit board 1 and a memory slot 20 on a second printed circuit board 2.

[0068] Rigid printed circuit boards are pressed on both sides of the flexible circuit board 40, and required signal lines are formed on the rigid printed circuit boards. Thereafter, the rigid printed circuit board in the middle is etched away to expose the flexible circuit board 40, the first printed circuit board 1 and the second printed circuit board 2.

[0069] When installing the memory expansion module 100, the setting between the first printed circuit board 1 and the second printed circuit board 2 can be achieved through the rotating mechanism 3 and the flexible circuit board 40. When it is necessary to rotate through the rotating mechanism 3, the flexible circuit board 40 located between the first printed circuit board 1 and the second printed circuit board 2 can provide bendability to achieve electrical connection between the first printed circuit board 1 and the second printed circuit board 2 and the size requirements of the memory expansion module 100 similar to a PCIE plug-in card.

[0070] Optionally, the electrical connection mechanism 4, such as Figure 5 As shown, including:

[0071] A first socket 41, arranged on the first printed circuit board 1;

[0072] A second socket 42, arranged on the second printed circuit board 2;

[0073] The plug cable 43 is plugged into the first socket 41 and the second socket 42 respectively.

[0074] In some cases, the electrical connection mechanism 4 can also be connected to the memory expansion chip 10 by providing a first socket 41 on the first printed circuit board 1, and providing a second socket 42 on the second printed circuit board 2 to connect the memory slot 20. The plug cable 43 is connected to the first socket 41 and the second socket 42, connecting the memory expansion chip 10 and the memory slot 20, thereby realizing the electrical connection between the memory expansion chip 10 and the expanded memory 21.

[0075] Optionally, the rotating mechanism 3, such as Figure 6 As shown, including:

[0076] A fixing portion 30, arranged on the first printed circuit board 1;

[0077] The rotating part 31 is disposed on the second printed circuit board 2 and is rotatably connected to the fixing part 30 via a rotating shaft 32 .

[0078] The fixing part 30 is mainly used to provide support for the rotating part 31 so that the rotating part 31 can rotate reliably, and a through hole for passing the rotating shaft 32 can be provided between the fixing part 30 and the rotating part 31. The rotating shaft 32 can be passed through the through hole by riveting or screwing. Figure 6 As shown in (A), the fixed part 30 and the rotating part 31 in the rotating mechanism 3 are closed, and the first printed circuit board 1 and the second printed circuit board 2 are at a nearly vertical angle, as shown in FIG. Figure 6 As shown in (B), the fixed part 30 and the rotating part 31 in the rotating mechanism 3 rotate to a certain angle, and the first printed circuit board 1 and the second printed circuit board 2 are arranged at an acute angle.

[0079] When the fixed part 30 is plugged into the PCIE expansion module or the PCIE slot on the mainboard, its movement is limited. At this time, under the action of the rotating shaft 32, the staff can drive the rotating part 31 to rotate relative to the fixed part 30, so that the second printed circuit board 2 can rotate relative to the first printed circuit board 1, thereby eliminating the interference between the memory 21 and the heat sink 11 during installation and disassembly.

[0080] Of course, the form of the rotating shaft 32 is not limited to being set separately from the first printed circuit board 1 and the second printed circuit board 2. The rotating shaft 32 can also be formed integrally by the first printed circuit board 1 or the second printed circuit board 2 through stamping or the like, and a through hole is formed on the printed circuit board on the other side to cooperate with the rotation. It can be set according to actual needs and there is no limitation on this.

[0081] The locking state and unlocking state of the rotating mechanism 3 can be achieved through the structure of the fixing part 30 and the rotating part 31 themselves, or can be achieved by setting other structures separately. It can be set according to actual needs and there is no limitation on this.

[0082] Specifically, the fixing portion 30, such as Figure 6 As shown, including:

[0083] A first fixing piece 30A extends along the first printed circuit board 1 and is fixedly connected to the first printed circuit board 1. The first fixing piece 30A is in a strip shape and has a through hole to achieve fixation with the first printed circuit board 1.

[0084] A support sheet 30B is connected to the first fixing sheet 30A and extends to a side away from the first printed circuit board 1. The support sheet 30B is nearly perpendicular to the first fixing sheet 30A, and the size of the support sheet 30B is limited by the size of the PCIE card.

[0085] A connecting piece 30C extends from an edge of the supporting piece 30B away from the center of the first printed circuit board 1 to a side away from the first printed circuit board 1. The connecting piece 30C may be understood to need to extend to a side of the second printed circuit board 2 to be connected to the rotating portion 31.

[0086] The rotating part 31 includes:

[0087] A second fixing piece 31A extends along the second printed circuit board 2 and is fixedly connected to the second printed circuit board 2. The second fixing piece 31A is in a strip shape and has a through hole to achieve fixation with the second printed circuit board 2.

[0088] The shaft sleeve 31B is connected to the edge of the second fixing plate 31A close to the first printed circuit board 1 , and the shaft 32 is inserted into the shaft sleeve 31B and penetrates the second fixing plate 31A.

[0089] By forming the second fixing piece 31A and the shaft sleeve 31B on the rotating part 31, the rotating part 31 can fix the shaft 32 more reliably, and can be connected to the connecting piece 30C of the fixing part 30 by riveting or screwing. After the installation is completed, the second printed circuit board 2 can be rotated relative to the first printed circuit board 1 by the shaft 32.

[0090] Optionally, the rotating mechanism 3, such as Figure 6 As shown, it also includes:

[0091] The locking portion 33 is disposed between the fixed portion 30 and the rotating portion 31 , wherein when the locking portion 33 is in a locked state, the rotation between the fixed portion 30 and the rotating portion 31 is locked, and when the locking portion 33 is in an unlocked state, the rotating portion 31 rotates relative to the fixed portion 30 .

[0092] By locking the fixing portion 30 and the rotating portion 31 through the locking portion 33, loosening of the rotating mechanism 3 due to vibration or the like can be avoided, thereby improving the stability of the memory expansion module.

[0093] Specifically, the locking portion 33, such as Figure 6 As shown, including:

[0094] a protrusion 33A, disposed on one of the fixed portion 30 and the rotating portion 31;

[0095] The groove 33B is provided in the other of the fixing portion 30 and the rotating portion 31 , and the protrusion 33A slides into the groove 33B to cooperate and lock.

[0096] exist Figure 6 In the embodiment, the protrusion 33A is formed on the rotating part 31, and can be formed by stamping on the elastic arm 33C of the second fixing piece 31A close to the first printed circuit board 1, and the groove 33B is formed on the connecting piece 30C of the fixing part 30. In a top view, the groove 33B formed on the connecting piece 30C can accommodate the protrusion 33A.

[0097] The projection 33A may be in an arc shape when viewed from above, that is, it has a certain guiding function. When the projection 33A abuts against the edge of the connecting piece 30C, the locking portion 33 slides along the arc of the projection 33A to the top of the arc and is elastically compressed by the guiding function of the projection 33A. When the projection 33A slides into the groove 33B, the compression is released, and the projection 33A can abut against the edge of the groove 33B to provide a certain clamping force to achieve locking.

[0098] That is, the locking portion 33 can be directly formed on the fixing portion 30 and the rotating portion 31 without adding additional components, so that the size of the memory expansion module 100 can be more easily limited.

[0099] Specifically, the locking portion 33, such as Figure 7 As shown, including:

[0100] The locking hole 33C is provided in one of the fixing portion 30 and the rotating portion 31. Figure 7 The rotating part 31 is arranged in the middle;

[0101] A captive screw 33D is fixed to the other of the fixed portion 30 and the rotating portion 31, and the captive screw 33D is inserted into the locking hole 33C to cooperate with the locking. Figure 7 The fixing portion 30 is provided in the middle.

[0102] The locking force is controlled by the depth of the captive screw 33D inserted into the locking hole 33C, thereby further improving the locking reliability of the memory expansion module 100.

[0103] Optionally, the locking portion 33, such as Figure 8 As shown, including:

[0104] A sliding groove 33E, provided on the fixing portion 30, wherein the sliding groove 33E extends to an opening 33F at an edge of the fixing portion 30;

[0105] A locking groove 33G, which is disposed on the fixing portion 30 and is located at the end of the sliding groove 33F, and on at least one side of the sliding groove 33E, the locking groove 33G extends out of the sliding groove 33E;

[0106] An elastic locking piece 33H is disposed on the rotating portion 31 and extends along the edge of the rotating portion 31 toward the outer side of the fixing portion 30 . The elastic locking piece 33H corresponds to the opening 33F and extends toward the locking groove 33G and out of the sliding groove 33E.

[0107] Among them, Figure 8 As shown in (A), when the elastic locking piece 33H is pressed into the sliding groove 33E and reaches the locking groove 33G, part of the elastic locking piece 33H is accommodated in the locking groove 33G and extends out of the sliding groove 33E, and the locking portion 33 is placed in a locked state; Figure 8 As shown in (B), when the elastic locking piece 33H is pushed out of the locking groove 33G to extend out of one side of the sliding groove 33E and slides out of the opening 33F of the sliding groove 33E along the sliding groove 33E, the locking portion 33 is placed in an unlocked state.

[0108] It should be noted that the locking portion 33 may also be implemented in other ways, which is not limited thereto.

[0109] In addition, the above-mentioned rotating mechanism 3 can be arranged in groups, formed on both sides of the first printed circuit board 1 and the second printed circuit board 2, or only arranged on one side of the first printed circuit board 1 and the second printed circuit board 2, and not arranged on the other side, or the above-mentioned rotating mechanism 3 can be implemented on one side of the first printed circuit board 1 and the second printed circuit board 2, and other mechanisms supporting the first printed circuit board 1 and the second printed circuit board 2 can be implemented on the other side. Through the above-mentioned different deployment methods, the relative rotation function of the second printed circuit board 2 relative to the first printed circuit board 1 (or combined with the locking and unlocking functions) can be realized.

[0110] Correspondingly, the present application also provides a PCIE expansion module 200, such as Fig. 9 As shown, it includes at least one memory expansion module 100 as described in any one of the above items.

[0111] In addition, the electronic device including the PCIE expansion module 200 may be a personal computer, a server, a switch, a router, etc., which can be deployed according to actual needs without any limitation.

[0112] A plurality of PCIE slots 201 may be provided on a PCIE expansion module 200, one or more of the plurality of PCIE slots 201 may be plugged with a memory expansion module 100, and a PCIE slot 201 not plugged with a memory expansion module 100 may be plugged with other gold fingers conforming to the PCIE protocol, and the specific implementation may be set according to the requirements without limitation.

[0113] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0114] In the embodiment of the present specification, the second printed circuit board can be rotatably arranged relative to the first printed circuit board through a rotating mechanism. When maintaining the memory arranged on the second printed circuit board, the second printed circuit board is rotated so that it is staggered with the first printed circuit board by a certain angle, so that the memory can be conveniently removed from the memory slot, thereby improving the maintenance efficiency of the memory expansion module.

[0115] The implementation process of the functions and effects of each module in the above-mentioned device is specifically described in the implementation process of the corresponding steps in the above-mentioned method, which will not be repeated here.

[0116] For the device embodiment, since it basically corresponds to the method embodiment, the relevant parts can refer to the partial description of the method embodiment. The device embodiment described above is only schematic, wherein the modules described as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules, that is, they may be located in one place, or they may be distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this specification. A person of ordinary skill in the art can understand and implement it without paying creative labor.

[0117] Those skilled in the art will readily appreciate other embodiments of the specification after considering the specification and practicing the invention claimed herein. The specification is intended to cover any variations, uses or adaptations of the specification that follow the general principles of the specification and include common knowledge or customary techniques in the art that are not claimed in the specification. The specification and examples are to be considered exemplary only, and the true scope and spirit of the specification are indicated by the following claims.

[0118] It should be understood that the present description is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present description is limited only by the appended claims.

[0119] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

Claims

1. A memory expansion module, characterized in that: include: A first printed circuit board, on which a memory expansion chip and a heat sink covering the memory expansion chip are arranged, and a gold finger for plugging in a high-speed interconnection PCIE interface of a peripheral component is arranged on one side of the first printed circuit board; A second printed circuit board, wherein at least two memory slots are arranged on the second printed circuit board, the memory slots are arranged on two side surfaces of the second printed circuit board, and memories are pluggably arranged on the memory slots; A rotating mechanism, fixed to the first printed circuit board and the second printed circuit board, through which the second printed circuit board is rotatably arranged relative to the first printed circuit board; The electrical connection mechanism is disposed between the first printed circuit board and the second printed circuit board, and electrically connects the memory expansion chip and the memory slot.

2. The memory expansion module according to claim 1, characterized in that: The electrical connection mechanism is a flexible circuit board; The first printed circuit board, the flexible circuit board and the second printed circuit board are integrally formed, and a signal line electrically connecting the memory expansion chip and the memory slot is provided on the flexible circuit board.

3. The memory expansion module according to claim 1, characterized in that: The electrical connection mechanism comprises: A first socket, arranged on the first printed circuit board; a second socket, arranged on the second printed circuit board; The plug cable is plugged into the first socket and the second socket respectively.

4. The memory expansion module according to claim 1, characterized in that: The rotating mechanism comprises: A fixing portion, arranged on the first printed circuit board; The rotating part is arranged on the second printed circuit board and is rotatably connected to the fixed part via a rotating shaft.

5. The memory expansion module according to claim 4, characterized in that: The fixing part comprises: a first fixing sheet extending along the first printed circuit board and fixedly connected to the first printed circuit board; A supporting sheet connected to the first fixing sheet and extending toward a side away from the first printed circuit board; A connecting piece extending from an edge of the supporting piece away from the center of the first printed circuit board to a side away from the first printed circuit board; The rotating part comprises: a second fixing sheet extending along the second printed circuit board and fixedly connected to the second printed circuit board; A rotating shaft sleeve is connected to an edge of the second fixing plate close to the first printed circuit board, and the rotating shaft is sleeved into the rotating shaft sleeve and penetrates the connecting plate.

6. The memory expansion module according to claim 4, characterized in that: The rotating mechanism further comprises: The locking portion is arranged between the fixed portion and the rotating portion, wherein when the locking portion is in a locked state, the rotation between the fixed portion and the rotating portion is locked, and when the locking portion is in an unlocked state, the rotating portion rotates relative to the fixed portion.

7. The memory expansion module according to claim 6, characterized in that: The locking portion comprises: a protrusion, disposed on one of the fixed portion and the rotating portion; A groove is provided on the other of the fixing portion and the rotating portion, and the protrusion slides into the groove to cooperate and lock.

8. The memory expansion module according to claim 6, characterized in that: The locking portion comprises: A locking hole, provided in one of the fixed portion and the rotating portion; A captive screw is fixed to the other of the fixed part and the rotating part, and the captive screw is inserted into the locking hole to cooperate with the locking.

9. The memory expansion module according to claim 6, characterized in that: The locking portion comprises: A sliding groove is provided on the fixing portion, wherein the sliding groove extends to an opening at an edge of the fixing portion; A locking groove, disposed on the fixing portion and located at an end of the sliding groove, wherein the locking groove extends out of the sliding groove on at least one side of the sliding groove; An elastic locking piece, arranged on the rotating part and extending along the edge of the rotating part toward the outer side of the fixed part, the elastic locking piece corresponding to the opening and deviating from the locking groove to the side of the sliding groove; Among them, when the elastic locking piece is pressed into the sliding groove and reaches the locking groove, part of the elastic locking piece is accommodated in the side of the locking groove extending out of the sliding groove, and the locking portion is placed in a locked state; when the elastic locking piece is pushed out of the side of the locking groove extending out of the sliding groove and slides out of the opening of the sliding groove along the sliding groove, the locking portion is placed in an unlocked state.

10. A PCIE expansion module, characterized in that: Includes at least one memory expansion module as described in any one of claims 1 to 9.

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