High-color-gamut Mini LED packaging device, preparation method thereof and display device

Abstract

The invention provides a high-color-gamut Mini LED packaging device, a preparation method thereof and a display device, the Mini LED packaging device comprises an LED chip and a color conversion film arranged on the light emitting side of the LED chip, and the color conversion film comprises a heat dissipation substrate and a color conversion layer arranged on the side, away from the LED chip, of the heat dissipation substrate; the color conversion layer comprises a photocuring base material and color conversion particles dispersed in the photocuring base material, and the color conversion particles comprise at least one of quantum dots and fluoride fluorescent powder. According to the Mini LED packaging device provided by the invention, the difficulty of a preparation process of the color conversion film can be reduced while a high color gamut is considered, the heat dissipation capability is improved, and the service life of the Mini LED packaging device is prolonged. And the yield and the reliability are improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and specifically to a high color gamut Mini LED packaging device, a preparation method thereof, and a display device. Background Art

[0002] Light Emitting Diode (LED) is an electroluminescent semiconductor light-emitting device. It has been widely used in lighting, display, medical treatment, optical communication and other fields because of its advantages such as low energy consumption, small size, long life, good stability, fast response and stable luminous wavelength.

[0003] Taking the display field as an example, in many scenarios such as office and entertainment, users will use medium and large-sized display devices to carry out activities such as watching movies, e-sports, video editing, image processing, etc., which have high requirements on the color expression of the display panel. However, liquid crystal display devices are still the mainstream of medium and large-sized display devices.

[0004] The liquid crystal display device generally includes two parts: a backlight module and a liquid crystal display panel. The LED light source in the backlight module is used to generate basic light for display. The basic light is processed by the light-homogenizing component in the backlight source and becomes a uniform surface light source to be emitted into the liquid crystal display panel. The liquid crystal display panel includes an array substrate, a liquid crystal layer and a color film substrate. The light emitted by the LED light source and emitted into the liquid crystal display panel passes through the array substrate, the liquid crystal layer and the color film substrate in sequence, and is emitted from the liquid crystal display panel and perceived by the user. Specifically, the output light of the LED package device in the LED light source is white light. The array substrate can control the deflection of the liquid crystal molecules in each sub-pixel unit area, so that the white light in a specific sub-pixel unit area can be transmitted to the color film substrate in the corresponding sub-pixel unit area. After the white light is filtered by the color filter in the color film substrate, each sub-pixel unit area can emit only red, green and blue monochromatic light in the white light, thereby realizing color display. That is, the spectrum of the white light emitted by the LED package device plays a key role in the color performance of the display device. When the color gamut performance of the white light emitted by the LED package device is poor, it will directly affect the color performance of the monochrome emitted light of each sub-pixel unit area, thereby affecting the overall color performance of the liquid crystal display device and reducing its market competitiveness.

[0005] At present, high-end liquid crystal display devices widely use Mini LED backlight sources to improve their display effects and thus increase the added value of products. However, the color gamut performance of white light LED packaging devices with blue light LED chips + conventional phosphors can no longer meet the color performance requirements of high-end display products. Related technologies use special phosphors and quantum dot materials to further improve the color gamut, but special phosphors and quantum dot materials have the problem of poor heat resistance. On the one hand, it will greatly increase the difficulty of preparing the color conversion film containing special phosphors and quantum dot materials on a single blue light LED chip, and reduce the yield of LED packaging devices. On the other hand, the color conversion film containing special phosphors and quantum dot materials has poor heat dissipation performance, and is prone to failure due to the heat influence of the blue light LED chip during the subsequent long-term operation of the blue light LED chip, reducing the reliability of the LED packaging device and shortening its life.

[0006] Therefore, how to improve the color gamut of the output white light of the LED package device while reducing the difficulty of the preparation process of the color conversion film to improve the yield and enhancing the heat dissipation capacity of the color conversion film to improve reliability is a technical problem that technical personnel in this field urgently need to solve. Summary of the invention

[0007] The present application provides a high color gamut Mini LED packaging device and its preparation method and display device, which can effectively solve the technical problem existing in the related art that it is difficult to balance the yield and reliability while improving the color gamut of the output white light of the LED packaging device.

[0008] In a first aspect, the present application provides a Mini LED package device, wherein the Mini LED package device comprises: LED chips; A color conversion film is arranged on the light-emitting side of the LED chip, and the color conversion film comprises a heat dissipation substrate and a color conversion layer arranged on a side of the heat dissipation substrate away from the LED chip; The color conversion layer includes a photocurable substrate and color conversion particles dispersed in the photocurable substrate, wherein the photocurable substrate can be obtained from a photocurable organic solvent through a photocuring reaction and baking, the photocurable organic solvent includes propylene glycol methyl ether acetate, a crosslinking agent, and a photosensitizer, the UV light band used in the photocuring reaction is 200nm to 280nm, the baking temperature is 70℃ to 80℃, and the baking time is 90s to 150s, and the color conversion particles include at least one of quantum dots and fluoride phosphors.

[0009] Optionally, the color conversion film further includes a bonding improvement layer, the bonding improvement layer is arranged between the heat dissipation substrate and the color conversion layer, the color conversion layer is arranged on the surface of the bonding improvement layer away from the heat dissipation substrate, wherein the bonding improvement layer includes silicon oxide.

[0010] Optionally, the Mini LED packaging device further includes a bonding layer, wherein the bonding layer is disposed between the LED chip and the color conversion film, wherein the bonding layer includes a bonding substrate and light scattering particles dispersed in the bonding substrate.

[0011] Optionally, the Mini LED packaging device further includes reflective white wall glue, and the reflective white wall glue covers the side wall of the LED chip and the side wall of the color conversion film.

[0012] Optionally, the Mini LED packaging device further includes a protective film, wherein the protective film is arranged on a side of the color conversion film away from the LED chip, and the protective film covers the color conversion film and the reflective white wall glue.

[0013] Optionally, the protective film includes a first inorganic thin film and a second inorganic thin film that are alternately arranged, and the first inorganic thin film and the second inorganic thin film are made of different materials.

[0014] Optionally, the Mini LED package device further includes: A carrier board, on which the LED chip is arranged; The lens is arranged on the carrier board, and the lens has a cavity, and the LED chip and the color conversion film are arranged in the cavity.

[0015] In a second aspect, the present application provides a method for preparing a Mini LED package device, the method for preparing a Mini LED package device comprising the following steps: Prepare a color conversion film, wherein the color conversion film comprises a heat dissipation substrate and a color conversion layer disposed on a side of the heat dissipation substrate away from the LED chip; The color conversion film is arranged on the light emitting surface of the LED chip; The step of preparing the color conversion film comprises: Mixing color conversion particles and a photocurable organic solvent to prepare a photocurable mixed solution, wherein the color conversion particles include at least one of quantum dots and fluoride phosphors, and the photocurable organic solvent includes propylene glycol methyl ether acetate, a crosslinking agent, and a photosensitizer; Applying the photocurable mixed solution onto a heat dissipation substrate by spin coating or scraping; The photocurable mixed liquid on the heat dissipation substrate is subjected to photocuring reaction and baking to convert the photocurable mixed liquid into a color conversion layer, wherein the color conversion layer includes a photocurable substrate and color conversion particles dispersed in the photocurable substrate, wherein the photocurable substrate can be obtained from a photocurable organic solvent through a photocuring reaction, the UV light band used in the photocuring reaction is 200nm to 280nm, the baking temperature is 70°C to 80°C, and the baking time is 90s to 150s.

[0016] Optionally, the step of applying the photocurable mixed solution onto a heat dissipation substrate by spin coating or scraping includes: Providing a heat dissipation substrate; forming a bonding strength improving layer on the heat dissipation substrate, wherein the bonding strength improving layer comprises silicon oxide; The photocurable mixed liquid is coated onto the bonding force improving layer on the heat dissipation substrate by spin coating or scraping.

[0017] In a third aspect, the present application provides a display device, the display device comprising: Backlight module, including LED light board; A liquid crystal display panel is arranged on the light-emitting side of the backlight module, and the liquid crystal display panel comprises an array substrate, a color filter substrate and a liquid crystal layer, wherein the liquid crystal layer is located between the array substrate and the color filter substrate; Wherein, the LED light board includes the Mini LED packaging device described in any one of the above items.

[0018] Beneficial effects of this application: The present application provides a high color gamut Mini LED package device, a preparation method thereof, and a display device. The Mini LED package device includes an LED chip and a color conversion film, wherein the color conversion film is arranged on the light-emitting side of the LED chip, and the color conversion film includes a heat dissipation substrate and a color conversion layer arranged on the side of the heat dissipation substrate away from the LED chip; wherein the color conversion layer includes a photocurable substrate and color conversion particles dispersed in the photocurable substrate, wherein the photocurable substrate can be obtained from a photocurable organic solvent through a photocuring reaction and baking, the photocurable organic solvent includes propylene glycol methyl ether acetate, a cross-linking agent, and a photosensitizer, the UV light band used in the photocuring reaction is 200nm to 280nm, the baking temperature is 70°C to 80°C, and the baking time is 90s to 150s, and the color conversion particles include at least one of quantum dots and fluoride phosphors. In the Mini LED packaging device provided by the present application, since the color conversion particles adopt at least one of quantum dots and fluoride phosphors, the color gamut of the output white light of the Mini LED packaging device can be effectively improved; in addition, the photocurable substrate serving as the carrier substrate of the color conversion particles can be obtained by photocuring reaction and short-time low-temperature baking, so that it can be well adapted to the poor heat resistance of quantum dots and fluoride phosphors, reduce the difficulty of the preparation process of integrating the color conversion film on a single LED chip, and improve the yield of the LED packaging device; secondly, since a heat dissipation substrate is also provided between the color conversion layer and the LED chip, the heat dissipation substrate can improve the heat dissipation efficiency of the color conversion film, reduce the risk of failure of the color conversion film due to the thermal influence of the blue light LED chip, improve the reliability of the LED packaging device, and extend its life. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0020] Figure 1 A schematic diagram of the structure of a Mini LED packaging device provided in some embodiments of the present application.

[0021] Figure 2 A schematic diagram of the structure of a Mini LED packaging device provided in some embodiments of the present application.

[0022] Figure 3 A schematic diagram of the structure of a Mini LED packaging device provided in some embodiments of the present application.

[0023] Figure 4 A schematic flow chart of a method for preparing a Mini LED package device provided in some embodiments of the present application.

[0024] Figure 5A schematic flow chart of step S10 in the method for preparing a Mini LED package device provided in some embodiments of the present application.

[0025] Figure 6 A schematic flow chart of step S12 in the method for preparing a Mini LED package device provided in some embodiments of the present application.

[0026] Figure 7 A schematic cross-sectional view of a display device provided in some embodiments of the present application.

[0027] Description of reference numerals: LED chip 10; color conversion film 20; heat dissipation substrate 21; color conversion layer 22; photocuring substrate 221; bonding improvement layer 23; inorganic packaging layer 24; bonding layer 30; bonding substrate 301; reflective white wall glue 40; carrier board 50; lens 60; protective film 70; first inorganic film 71; second inorganic film 72; Mini LED packaging device 100; lamp board 200; backlight module 300; liquid crystal display panel 400; array substrate 500; color film substrate 600; liquid crystal layer 700. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0029] The terms "first" and "second" in this document are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0030] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0032] Figure 1 This is a schematic diagram of the structure of the Mini LED packaging device provided in Example 1 of the present application. Figure 1 As shown, in the first aspect, the embodiment of the present application provides a Mini LED package device 100, the Mini LED package device 100 includes an LED chip 10 and a color conversion film 20, the color conversion film 20 is arranged on the light-emitting side of the LED chip 10, the color conversion film 20 includes a heat dissipation substrate 21 and a color conversion layer 22 arranged on the side of the heat dissipation substrate 21 away from the LED chip 10; wherein the color conversion layer 22 includes a photocurable substrate 221 and color conversion particles (not shown in the figure) dispersed in the photocurable substrate 221, wherein the photocurable substrate 221 can be obtained by photocuring reaction and baking of a photocurable organic solvent, the photocurable organic solvent includes propylene glycol methyl ether acetate, a cross-linking agent, and a photosensitizer, the UV light band used in the photocuring reaction is 200nm to 280nm, the baking temperature is 70°C to 80°C, and the baking time is 90s to 150s, and the color conversion particles include at least one of quantum dots and fluoride phosphors.

[0033] In the Mini LED package device 100 provided in the present application, since the color conversion particles use at least one of quantum dots and fluoride phosphors, the color gamut of the output white light of the Mini LED package device 100 can be effectively improved to achieve a high color gamut.

[0034] In addition, the photocurable substrate 221 serving as the carrier substrate of the color conversion particles can be obtained by a photocuring reaction and a short-time and low-temperature baking method. Since the UV light band used in the photocuring reaction is a short-wave UV ultraviolet light of 200nm-280nm, its penetration is relatively weak, but it can still meet the UV curing requirements of the thinned coating, and has no thermal effect on the quantum dots and the fluoride fluorescent layer, and has very little optical effect. It can reduce the environmental requirements for the color conversion layer 22 while ensuring the color gamut of the LED packaging device, thereby improving the yield. The baking temperature is lower than 80°C, and the baking time is less than 150s, which basically does not cause the degradation of the quantum dots and the fluoride fluorescent layer, thereby improving the preparation yield of the color conversion film 20. That is, the photocurable substrate 221 used in the present application can well adapt to the poor heat resistance of quantum dots and fluoride phosphors, reduce the difficulty of the preparation process of integrating the color conversion film 20 on a single LED chip 10, and improve the yield of the LED packaging device.

[0035] Secondly, since a heat dissipation substrate 21 is also provided between the color conversion layer 22 and the LED chip 10, the heat dissipation substrate 21 can improve the heat dissipation efficiency of the color conversion film 20, reduce the risk of failure of the color conversion film 20 due to the thermal influence of the blue light LED chip, improve the reliability of the LED packaging device, and extend its life.

[0036] In some embodiments of the present application, the LED chip 10 is a blue light LED chip.

[0037] In some embodiments of the present application, the LED chip 10 in the Mini LED package device 100 is a Mini LED chip, and the size of the Mini LED chip is between 100 microns and 300 microns.

[0038] In some embodiments of the present application, the color conversion film 20 also includes a bonding improvement layer 23, the bonding improvement layer 23 is arranged between the heat dissipation substrate 21 and the color conversion layer 22, and the color conversion layer 22 is arranged on the surface of the bonding improvement layer 23 away from the heat dissipation substrate 21, wherein the bonding improvement layer 23 includes silicon oxide.

[0039] The applicant discovered in internal research that when the color conversion layer 22 is prepared on a heat dissipation substrate 21 of a certain material, the photocurable organic solvent and / or the prepared photocurable substrate 221 are prone to insufficient bonding with the heat dissipation substrate 21, thereby affecting the stability of the color conversion film 20. In the Mini LED package device 100 provided in the embodiment of the present application, since a bonding improvement layer 23 is provided between the heat dissipation substrate 21 and the color conversion layer 22, and the bonding improvement layer 23 includes silicon oxide, the bonding improvement layer 23 including silicon oxide can be used as a direct contact film layer of the color conversion layer 22, which greatly improves the film stability of the photocurable organic solvent and / or the prepared photocurable substrate 221 on the heat dissipation substrate 21, further improves the reliability of the color conversion film 20, ensures the optical effect of the Mini LED package device 100, and extends its life.

[0040] In some embodiments of the present application, the heat dissipation substrate 21 may be a sapphire substrate, a polyimide organic film, or a polyethylene terephthalate organic film.

[0041] In some embodiments of the present application, the Mini LED package device 100 further includes a bonding layer 30 , and the bonding layer 30 is disposed between the LED chip 10 and the color conversion film 20 .

[0042] In the Mini LED package device 100 provided in the embodiment of the present application, the adhesive layer 30 disposed between the LED chip 10 and the color conversion film 20 is used to fix the color conversion film 20 on the LED chip 10 .

[0043] In some embodiments of the present application, the bonding layer 30 includes a bonding substrate 301, and the bonding substrate 301 in the bonding layer 30 fixes the color conversion film 20 on the LED chip 10. Optionally, the bonding substrate 301 is UV curable glue.

[0044] In some embodiments of the present application, the bonding layer 30 includes the bonding substrate 301 and light scattering particles (not shown in the figure) dispersed in the bonding substrate 301 .

[0045] In the Mini LED packaging device 100 provided in the embodiment of the present application, the light scattering particles in the bonding layer 30 can scatter the light incident into the bonding layer 30 to scatter the outgoing light of the LED chip 10 so as to irradiate the color conversion film 20 more evenly, thereby improving the color conversion efficiency of the color conversion film 20 and further improving the color gamut.

[0046] In some embodiments of the present application, the light scattering particles may be organic particles or inorganic particles. If the light scattering particles are organic particles, they may be polymethyl methacrylate particles, styrene-acrylate copolymer particles, melamine resin particles, polycarbonate particles, polystyrene particles, cross-linked polystyrene particles, polyvinyl chloride particles, benzoguanamine-melamine-formaldehyde condensation polymer particles, etc. If the light scattering particles are inorganic particles, they may be silicon dioxide particles, zirconium dioxide particles, titanium dioxide particles, aluminum oxide particles, indium oxide particles, zinc oxide particles, tin dioxide particles, antimony trioxide particles.

[0047] In some embodiments of the present application, the thermal conductivity of the light scattering particles is smaller than the thermal conductivity of the bonding substrate 301 .

[0048] In the Mini LED packaging device 100 provided in the embodiment of the present application, since the thermal conductivity of the light scattering particles is smaller than the thermal conductivity of the bonding layer 30, the present application can utilize the light scattering particles to improve the thermal insulation performance of the bonding layer 30, thereby reducing the thermal impact of the LED chip 10 on the color conversion film 20 in the working state.

[0049] In some embodiments of the present application, the Mini LED package device 100 further includes a reflective white wall glue 40 , and the reflective white wall glue 40 covers the side wall of the LED chip 10 and the side wall of the color conversion film 20 .

[0050] In the Mini LED packaging device 100 provided in the embodiment of the present application, the reflective white wall glue 40 can be formed on the side walls of the LED chip 10 and the side walls of the color conversion film 20 through a dispensing process. The reflective white wall glue 40 can reflect the light emitted from the side, thereby allowing more light to enter the color conversion layer 22, thereby reducing light loss and improving the problem of blue halo generated by the LED packaging device due to blue light leakage from the edge of the LED chip 10.

[0051] In some embodiments of the present application, the Mini LED package device 100 further includes a carrier 50 , and the LED chip 10 is disposed on the carrier 50 .

[0052] In the Mini LED package device 100 provided in the embodiment of the present application, the LED chip 10 is electrically connected to the carrier 50, and the carrier 50 is made of a high thermal conductivity material to improve the heat dissipation efficiency of the LED chip 10. Exemplarily, the carrier 50 is a ceramic carrier, which includes a ceramic substrate and an electrical connection layer arranged on both sides of the ceramic substrate, the ceramic substrate has a through hole, and the electrical connection layers on both sides of the ceramic substrate are electrically connected to each other through the through hole, the electrical connection layer on one side of the ceramic substrate is welded and fixed to the LED chip 10, and the electrical connection layer on the other side of the ceramic substrate is electrically connected to an external driving element, such as a driving circuit board and a driving IC.

[0053] In some embodiments of the present application, the Mini LED package device 100 further includes a lens 60 , wherein the lens 60 is disposed on the carrier 50 , the lens 60 has a cavity, and the LED chip 10 and the color conversion film 20 are disposed in the cavity.

[0054] In the Mini LED package device 100 provided in the embodiment of the present application, the lens 60 is arranged on the carrier 50, and the lens 60 can adjust the light emission angle of the Mini LED package device 100 so that the Mini LED package device 100 can be adapted to different types of products.

[0055] In some embodiments of the present application, the substrate of the lens 60 can be glass or sealant. The sealant can be prepared by dispensing and molding processes to well cover the LED chip 10 and the color conversion film 20, thereby improving the sealing of the cavity and further improving the water-proof oxygen intrusion capability of the Mini LED packaging device 100.

[0056] In some embodiments of the present application, the lens 60 further includes thermally conductive particles doped into the sealant to enhance the thermal conductivity of the lens 60 .

[0057] Figure 2 This is a schematic diagram of the structure of a Mini LED packaging device provided in some embodiments of the present application. Figure 2 As shown, in some embodiments of the present application, the Mini LED packaging device 100 further includes a protective film 70 , which is disposed on a side of the color conversion film 20 away from the LED chip 10 , and the protective film 70 covers the color conversion film 20 and the reflective white wall glue 40 .

[0058] The applicant found in internal research that quantum dots and fluoride phosphors have poor resistance to water and oxygen erosion, and are prone to failure due to inadvertent contact with external water and oxygen, thereby affecting the light efficiency and color gamut of the Mini LED package device 100. In the Mini LED package device 100 provided in the embodiment of the present application, since the protective film 70 is provided on the side of the color conversion film 20 away from the LED chip 10, and the protective film 70 covers the color conversion film 20 and the reflective white wall glue 40, the protective film 70 can form a stable and closed accommodating cavity that can effectively isolate external water and oxygen with the reflective white wall glue 40 and the LED chip 10, and the color conversion film 20 is accommodated in the closed accommodating cavity, thereby further improving the sealing performance of the color conversion film 20 and improving the reliability of the LED package device.

[0059] In some embodiments of the present application, the protective film 70 includes a first inorganic thin film 71 and a second inorganic thin film 72 that are alternately arranged, and the first inorganic thin film 71 and the second inorganic thin film 72 are made of different materials.

[0060] In the Mini LED package device 100 provided in the embodiment of the present application, the present application can greatly improve the ability of the front side of the color conversion layer 22 to resist water and oxygen intrusion by using the first inorganic thin film 71 and the second inorganic thin film 72 of different materials arranged alternately, the front side of the color conversion layer 22, that is, the surface of the color conversion layer 22 on the side away from the heat dissipation substrate 21. In addition, the film thickness and material of the first inorganic thin film 71 and the second inorganic thin film 72 can be set so that the protective film 70 has the effect of anti-reflection and anti-transmission.

[0061] In some embodiments of the present application, one of the first inorganic thin film 71 and the second inorganic thin film 72 includes aluminum oxide, and the other of the first inorganic thin film 71 and the second inorganic thin film 72 includes titanium oxide.

[0062] Figure 3 This is a schematic diagram of the structure of a Mini LED packaging device provided in some embodiments of the present application. Figure 3 As shown, in some embodiments of the present application, the color conversion film 20 includes a heat dissipation substrate 21, a color conversion layer 22, and a bonding improvement layer 23 arranged between the heat dissipation substrate 21 and the color conversion layer 22, wherein the color conversion film 20 also includes an inorganic packaging layer 24, and the inorganic packaging layer 24 covers the side walls of the heat dissipation substrate 21 and the side walls of the color conversion layer 22.

[0063] In the Mini LED packaging device 100 provided in the embodiment of the present application, the inorganic packaging layer 24 covering the side walls of the heat dissipation substrate 21 and the side walls of the color conversion layer 22 can further improve the ability of the color conversion film 20 to resist water and oxygen intrusion, thereby further improving the reliability of the Mini LED packaging device 100.

[0064] In some embodiments of the present application, the inorganic encapsulation layer 24 can be formed by chemical vapor deposition or atomic layer deposition after the patterning process of the color conversion layer 22. The inorganic encapsulation layer 24 can avoid direct contact between the reflective white wall glue 40 and the color conversion layer 22, thereby reducing the quality requirements for the reflective white wall glue 40 and improving the problem of failure of the color conversion layer 22 caused by the poor quality of the reflective white wall glue 40.

[0065] Figure 4 A schematic diagram of a method for preparing a Mini LED package device according to some embodiments of the present application. Figures 1 to 4 As shown, in the second aspect, an embodiment of the present application provides a method for preparing a Mini LED package device 100, and the method for preparing the Mini LED package device 100 includes step S10 and step S20, wherein step S10 includes: preparing a color conversion film 20, wherein the color conversion film 20 includes a heat dissipation substrate 21 and a color conversion layer 22 arranged on a side of the heat dissipation substrate 21 away from the LED chip 10; step S20 includes: setting the color conversion film 20 on the light emitting surface of the LED chip 10.

[0066] In the preparation method of the Mini LED packaging device 100 provided in the embodiment of the present application, the present application prepares the Mini LED packaging device 100 by first preparing a color conversion film 20 with a multi-layer film structure, and then fixing the color conversion film 20 to the light-emitting surface of the LED chip 10. The advantage of this preparation method is that the process of the LED chip 10 and the process of the color conversion film 20 can be separated, and the film forming quality of the color conversion film 20 can be more effectively controlled, thereby optimizing the color gamut of the LED packaging device, and also helping to improve the stability of the color conversion layer 22 on the heat dissipation substrate 21.

[0067] Figure 5A flow chart of step S10 in the method for preparing a Mini LED package device provided in some embodiments of the present application. In some embodiments of the present application, the step S10 of preparing the color conversion film 20 includes steps S11, S12, S13 and S14, wherein step S11 includes: mixing color conversion particles and a photocurable organic solvent to prepare a photocurable mixed liquid, wherein the color conversion particles include at least one of quantum dots and fluoride phosphors, and the photocurable organic solvent includes propylene glycol methyl ether acetate, a crosslinking agent, and a photosensitizer; step S12 includes: applying the photocurable mixed liquid to a heat dissipation substrate by spin coating or scraping. The heat dissipation substrate 21 is on the heat dissipation substrate 21; step S13 comprises: performing a photocuring reaction and baking on the photocurable mixed liquid on the heat dissipation substrate 21, so that the photocurable mixed liquid is converted into a color conversion layer 22, the color conversion layer 22 comprises a photocurable substrate 221 and color conversion particles dispersed in the photocurable substrate 221, wherein the photocurable substrate 221 can be obtained by a photocuring reaction of a photocurable organic solvent, the UV light band used in the photocuring reaction is 200nm to 280nm, the baking temperature is 70℃ to 80℃, and the baking time is 90s to 150s.

[0068] In the method for preparing the Mini LED package device 100 provided in the embodiment of the present application, the present application forms a light-curable mixed liquid containing color conversion particles and a light-curable organic solvent through step S11, and sets the light-curable mixed liquid on the heat dissipation substrate 21 through step S12, and then converts the light-curable mixed liquid into a color conversion layer 22 through step S13, thereby forming a color conversion film 20. The above-mentioned process for preparing the color conversion film 20 adopts UV light curing and low-temperature short-time baking, and can prepare a color conversion film 20 with high yield, high reliability, and strong heat dissipation capability at a low temperature, and the preparation cost is low.

[0069] In the preparation method of the Mini LED packaging device 100 provided in the embodiment of the present application, since the UV light band used in the photocuring reaction is a short-wave UV ultraviolet light of 200nm-280nm, its penetration is relatively weak, but it can still meet the UV curing requirements of the thinned coating, and has no thermal effect on the quantum dots and fluoride fluorescent layer, and the optical effect is very small. While ensuring the color gamut of the LED packaging device, it can reduce the environmental requirements for the color conversion layer 22 and improve the yield.

[0070] The present application controls the baking temperature to be between 70°C and 80°C and the baking time to be between 90s and 150s, which basically does not cause degradation of the quantum dots and the fluoride fluorescent layer. The color conversion layer 22 can have an excellent film morphology and improve its stability without affecting the quality of the color conversion particles.

[0071] Figure 6 A flow chart of step S12 in the method for preparing a Mini LED package device provided for some embodiments of the present application. In some embodiments of the present application, the step S12 of applying the photocurable mixed liquid to a heat dissipation substrate 21 by spin coating or scraping includes step S121, step S122 and step S123, wherein step S121 includes: providing a heat dissipation substrate 21; step S122 includes: forming a bonding improvement layer 23 on the heat dissipation substrate 21, wherein the bonding improvement layer 23 includes silicon oxide; step S13 includes: applying the photocurable mixed liquid to the bonding improvement layer 23 on the heat dissipation substrate 21 by spin coating or scraping.

[0072] The applicant discovered in internal research that when the color conversion layer 22 is prepared on a heat dissipation substrate 21 of a certain material, the photocurable organic solvent and / or the prepared photocurable substrate 221 are prone to insufficient bonding with the heat dissipation substrate 21, thereby affecting the stability of the color conversion film 20. In the preparation method of the Mini LED package device 100 provided in the embodiment of the present application, since a bonding improvement layer 23 is provided between the heat dissipation substrate 21 and the color conversion layer 22, and the bonding improvement layer 23 includes silicon oxide, the bonding improvement layer 23 including silicon oxide can be used as a direct contact film layer of the color conversion layer 22, which greatly improves the film stability of the photocurable organic solvent and / or the prepared photocurable substrate 221 on the heat dissipation substrate 21, further improves the reliability of the color conversion film 20, ensures the optical effect of the Mini LED package device 100, and prolongs the life of the Mini LED package device 100.

[0073] Figure 7 This is a cross-sectional schematic diagram of a display device provided in some embodiments of the present application. Figure 7 As shown, in the third aspect, the embodiment of the present application also provides a display device, wherein the display device includes a backlight module 300 and a liquid crystal display panel 400, wherein the backlight module includes an LED light board 200, and the liquid crystal display panel 400 is arranged on the light emitting side of the backlight module 300, and the liquid crystal display panel 400 includes an array substrate 500, a color film substrate 600 and a liquid crystal layer 700, and the liquid crystal layer 700 is located between the array substrate 500 and the color film substrate 600; wherein the LED light board includes the Mini LED package device 10 with a high color gamut as described in any one of the above items.

[0074] In summary, the present application provides a high color gamut Mini LED package device and a preparation method thereof, and a display device, wherein the Mini LED package device includes an LED chip and a color conversion film, wherein the color conversion film is arranged on the light-emitting side of the LED chip, and the color conversion film includes a heat dissipation substrate and a color conversion layer arranged on the side of the heat dissipation substrate away from the LED chip; wherein the color conversion layer includes a photocurable substrate and color conversion particles dispersed in the photocurable substrate, wherein the photocurable substrate can be obtained by a photocurable organic solvent through a photocuring reaction and baking, the photocurable organic solvent includes propylene glycol methyl ether acetate, a cross-linking agent, and a photosensitizer, the UV light band used in the photocuring reaction is 200nm to 280nm, the baking temperature is 70°C to 80°C, and the baking time is 90s to 150s, and the color conversion particles include at least one of quantum dots and fluoride phosphors. In the Mini LED packaging device provided by the present application, since the color conversion particles adopt at least one of quantum dots and fluoride phosphors, the color gamut of the output white light of the Mini LED packaging device can be effectively improved; in addition, the photocurable substrate serving as the carrier substrate of the color conversion particles can be obtained by photocuring reaction and short-time low-temperature baking, so that it can be well adapted to the poor heat resistance of quantum dots and fluoride phosphors, reduce the difficulty of the preparation process of integrating the color conversion film on a single LED chip, and improve the yield of the LED packaging device; secondly, since a heat dissipation substrate is also provided between the color conversion layer and the LED chip, the heat dissipation substrate can improve the heat dissipation efficiency of the color conversion film, reduce the risk of failure of the color conversion film due to the thermal influence of the blue light LED chip, improve the reliability of the LED packaging device, and extend its life.

[0075] The above is a detailed introduction to a high color gamut Mini LED packaging device and its preparation method and display device provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A Mini LED packaging device, characterized in that: The Mini LED package device includes: LED chips; A color conversion film is arranged on the light-emitting side of the LED chip, and the color conversion film comprises a heat dissipation substrate and a color conversion layer arranged on a side of the heat dissipation substrate away from the LED chip; The color conversion layer includes a photocurable substrate and color conversion particles dispersed in the photocurable substrate, and the color conversion particles include at least one of quantum dots and fluoride phosphors.

2. The Mini LED package device according to claim 1, characterized in that: The color conversion film further includes a bonding improvement layer, which is disposed between the heat dissipation substrate and the color conversion layer, and the color conversion layer is disposed on a surface of the bonding improvement layer away from the heat dissipation substrate, wherein the bonding improvement layer includes silicon oxide.

3. The Mini LED package device according to claim 2, characterized in that: The Mini LED packaging device further includes a bonding layer, which is disposed between the LED chip and the color conversion film, wherein the bonding layer includes a bonding substrate and light scattering particles dispersed in the bonding substrate.

4. The Mini LED package device according to claim 2, characterized in that: The Mini LED packaging device also includes reflective white wall glue, and the reflective white wall glue covers the side wall of the LED chip and the side wall of the color conversion film.

5. The Mini LED package device according to claim 2, characterized in that: The Mini LED packaging device also includes a protective film, which is arranged on a side of the color conversion film away from the LED chip, and the protective film covers the color conversion film and the reflective white wall glue.

6. The Mini LED package device according to claim 5, characterized in that: The protective film includes a first inorganic thin film and a second inorganic thin film which are alternately arranged, and the first inorganic thin film and the second inorganic thin film are made of different materials.

7. The Mini LED package device according to claim 1, characterized in that: The Mini LED package device further includes: A carrier board, on which the LED chip is arranged; The lens is arranged on the carrier board, and the lens has a cavity, and the LED chip and the color conversion film are arranged in the cavity.

8. A method for preparing a Mini LED package device, characterized in that: The method for preparing the Mini LED package device comprises the following steps: Prepare a color conversion film, wherein the color conversion film comprises a heat dissipation substrate and a color conversion layer disposed on a side of the heat dissipation substrate away from the LED chip; The color conversion film is arranged on the light emitting surface of the LED chip; The step of preparing the color conversion film comprises: Mixing color conversion particles and a photocurable organic solvent to prepare a photocurable mixed solution, wherein the color conversion particles include at least one of quantum dots and fluoride phosphors, and the photocurable organic solvent includes propylene glycol methyl ether acetate, a crosslinking agent, and a photosensitizer; Applying the photocurable mixed solution onto a heat dissipation substrate by spin coating or scraping; The photocurable mixed liquid on the heat dissipation substrate is subjected to photocuring reaction and baking to convert the photocurable mixed liquid into a color conversion layer, wherein the color conversion layer includes a photocurable substrate and color conversion particles dispersed in the photocurable substrate, wherein the photocurable substrate can be obtained from a photocurable organic solvent through a photocuring reaction, the UV light band used in the photocuring reaction is 200nm to 280nm, the baking temperature is 70°C to 80°C, and the baking time is 90s to 150s.

9. The method for preparing a Mini LED package device according to claim 8, characterized in that: The step of applying the photocurable mixed solution onto a heat dissipation substrate by spin coating or scraping includes: Providing a heat dissipation substrate; forming a bonding strength improving layer on the heat dissipation substrate, wherein the bonding strength improving layer comprises silicon oxide; The photocurable mixed liquid is coated onto the bonding force improving layer on the heat dissipation substrate by spin coating or scraping.

10. A display device, characterized in that: The display device comprises: Backlight module, including LED light board; A liquid crystal display panel is arranged on the light-emitting side of the backlight module, and the liquid crystal display panel comprises an array substrate, a color filter substrate and a liquid crystal layer, wherein the liquid crystal layer is located between the array substrate and the color filter substrate; Wherein, the LED light board includes the Mini LED packaging device as described in any one of claims 1 to 7.

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