Chip PD automatic test fixture

Abstract

The invention provides a chip PD automatic test fixture which comprises a contact unit main body assembly, a test butt joint assembly is installed on the top of the contact unit main body assembly, a floating head assembly is installed above the test butt joint assembly, and the contact unit main body assembly is installed to a test chip sorting machine through the test butt joint assembly. A feeding trolley assembly and a discharging trolley are arranged on the two sides of the test chip sorting machine respectively. The beneficial effects of the invention are that the test fixture can be applied to the semiconductor automation industry, can carry out the automatic test of a high-power and high-voltage chip, can inhibit the discharge phenomenon of the PD test of the chip, can improve the test efficiency according to the market demands, is more compact in structure, can greatly reduce the cost, prevents an operator from being injured, and is suitable for popularization and application. In addition, the test fixture can be developed towards the direction of higher automation level, safety, intelligence and high efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of chip PD testing, and in particular relates to a chip PD automatic testing fixture. Background Art

[0002] At present, chip PD testing refers to testing high-power chips in a high-voltage environment. Since chip PD testing is performed in a high-voltage environment, discharge may occur. Chip PD testing is performed to ensure that it can maintain stable working performance after long-term operation. However, as the chip testing environment requirements become increasingly stringent, it is difficult to implement. Existing chip PD testing equipment cannot be combined with automated equipment. There are problems such as the inability to implement automated testing, the inability to suppress the chip PD test discharge phenomenon, the inability to perform batch testing during the chip high-voltage test process, and only single chip testing. The inflation pressure cannot be maintained, manual material replacement is required, low efficiency, and low safety. Summary of the invention

[0003] In view of this, the present invention aims to provide a chip PD automated test fixture to solve at least one problem existing in the above-mentioned prior art.

[0004] To achieve the above object, the technical solution of the present invention is achieved as follows: A chip PD automated test fixture comprises a contact unit main body component, a test docking component is installed on the top of the contact unit main body component, a floating head component is installed above the test docking component, the contact unit main body component is installed to a test chip sorting machine through the test docking component, and a feed trolley component and a discharge trolley are respectively provided on both sides of the test chip sorting machine; The communication unit main body component includes a unit main body metal frame, a unit main body ventilation plate, a chip test socket, a docking assembly locating pin, a nested locating pin, a hard limit block, a nested sealing ring, a pad block, a docking assembly sealing ring and a test socket sealing ring. The unit main body ventilation plate is installed on the surface of the unit main body metal frame, and the docking assembly locating pin and the docking assembly sealing ring are respectively installed on one side of the unit main body ventilation plate. The unit main body ventilation plate is also installed with a nested locating pin and a hard limit block, and the nested locating pin passes through the hard limit block and is installed to the floating head assembly. A nested sealing ring is installed above the hard limit block, a pad block is installed below the unit main body metal frame, a chip test socket is installed on one side of the unit main body metal frame, and a test socket sealing ring is installed on the chip test socket.

[0005] Furthermore, the communication unit main body assembly also includes a gasket body and a gasket body, and a gasket sealing ring and a gasket body are provided at the connection between the nested positioning pin and the hard limit block.

[0006] Furthermore, a vent is provided on the ventilation plate of the unit body, and an internal air path of the ventilation plate is also provided on the ventilation plate of the unit body.

[0007] Furthermore, an air interface sealing ring is installed on the chip test socket, and the chip test socket is also provided with an air outlet, which is used to cooperate with the floating head assembly.

[0008] Furthermore, a dovetail groove is provided on the hard limit block, and the dovetail groove is used in conjunction with a nested sealing ring. A boss structure is also provided on one side of the hard limit block.

[0009] Furthermore, the floating head assembly includes a tube leg pressing block, a positioning sleeve, a suction rod, a sealing ring 1, a sealing ring 2 and a suction cup. A positioning sleeve is installed on the lower surface of the tube leg pressing block, and a suction rod and a suction cup are also provided below the tube leg pressing block. Sealing ring 1 and sealing ring 2 are also installed inside the tube leg pressing block.

[0010] Furthermore, a plurality of air holes are provided on the tube leg pressing block, and after the pressure-maintaining gas comes out from the air outlet, it is blown onto the test chip through the air holes to allow air to flow.

[0011] Compared with the prior art, the chip PD automated test fixture described in the present invention has the following advantages: The chip PD automated test fixture of the present invention can be applied to the semiconductor automation industry, can perform automated tests on high-power and high-voltage chips, and can suppress the chip PD test discharge phenomenon. In addition, the test efficiency can be improved according to market needs, the structure is more compact, and the cost can be greatly reduced, operator injuries can be avoided, and a fully automated test process can be realized. In addition, the test fixture can also develop towards a higher level of automation, safety, intelligence, and high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings: Figure 1 This is a schematic diagram of the overall structure of the test fixture according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the main components of the contact unit according to an embodiment of the present invention; Figure 3 It is a schematic top view of the main assembly of the communication unit according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the connection between the floating head assembly and the chip test socket according to an embodiment of the present invention; Figure 5 A schematic diagram of a floating head assembly according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the connection between the floating head assembly and the feeding trolley assembly according to an embodiment of the present invention; Figure 7 A schematic diagram of the test position relationship according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the test status coordination described in an embodiment of the present invention.

[0013] Description of reference numerals: 100, contact unit main body assembly; 101, unit main body metal frame; 102, unit main body ventilation plate; 1021, ventilation port; 1022, ventilation plate internal air path; 103, chip test socket; 1031, air interface sealing ring; 1032, air outlet; 104, docking assembly positioning pin; 105, nesting positioning pin; 106, gasket sealing ring; 107, gasket body; 108, hard limit block; 1081, dovetail groove; 1082, boss structure; 109, nested sealing ring; 110, spacer block; 111, docking assembly sealing ring; 112, test socket sealing ring; 200, floating head assembly; 201, tube leg pressure block; 2011, air hole; 202, positioning sleeve; 203, suction rod; 204, sealing ring one; 205, sealing ring two; 206, suction cup; 300, feed trolley assembly; 400, discharge trolley; 500, test docking assembly. DETAILED DESCRIPTION

[0014] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0015] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0016] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0017] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0018] like Figures 1 to 8 As shown, a chip PD automatic test fixture includes a contact unit main body (CUH) component 100, a test docking component 500 is installed on the top of the contact unit main body component 100, a floating head component 200 is installed above the test docking component 500, and the contact unit main body component 100 is installed to a test chip sorting machine through the test docking component 500, and a feed trolley component 300 and a discharge trolley 400 are respectively provided on both sides of the test chip sorting machine; The contact unit main assembly 100 includes a unit main metal frame 101, a unit main ventilation plate 102, a chip test socket 103, a docking assembly positioning pin 104, a nesting positioning pin 105, a gasket seal 106, a gasket body 107, a hard stop block (Hard stop block), and a contact unit main assembly 101. The unit body vent plate 102 is installed on the surface of the unit body metal outer frame 101, and the docking assembly locating pins 104 and the docking assembly sealing ring 111 are respectively installed on one side of the unit body vent plate 102. The unit body vent plate 102 is also installed with a nested locating pin 105 and a hard stop block 108, and the nested locating pin 105 passes through the hard stop block 108 and is installed to the floating head assembly 200, and a gasket sealing ring 106 and a gasket body 107 are provided at the connection between the nested locating pin 105 and the hard stop block 108, a nested sealing ring 109 is installed above the hard stop block 108, a spacer block 110 is installed below the unit body metal outer frame 101, a chip test socket 103 is installed on one side of the unit body metal outer frame 101, and a test socket sealing ring 112 is installed on the chip test socket 103. This test fixture requires high-power transmission conditions when testing the PD of some chips, that is, it is necessary to increase the voltage to increase the power. After the high voltage is increased, an arc will be generated to threaten the product itself. To solve this problem, the present invention adopts high-voltage resistant materials and multiple ingenious structures to provide a stable, efficient and safe testing environment, realize automated testing, replace manual automatic material replacement, and can also suppress the discharge phenomenon of chip PD testing, realize the pressure maintenance function under the high-voltage test environment of the chip, and protect electronic devices from breakdown.

[0019] In a preferred embodiment of the present invention, the unit body ventilation plate 102 is provided with a ventilation port 1021, and the unit body ventilation plate 102 is also provided with a ventilation plate internal air path 1022. Figure 3 As shown, the vent 1021 and the internal air path 1022 of the vent plate are structural details of the unit main body vent plate 102. The vent 1021 is responsible for connecting the air path with the chip test socket 103. The internal air path 1022 of the vent plate is provided inside the unit main body vent plate 102.

[0020] In a preferred embodiment of the present invention, an air interface sealing ring 1031 is installed on the chip test socket 103 , and the chip test socket 103 is also provided with an air outlet 1032 , which is used to cooperate with the floating head assembly 200 .

[0021] In a preferred embodiment of the present invention, a dovetail groove 1081 is provided on the hard stop block 108, and the dovetail groove 1081 is used in conjunction with the nested sealing ring 109. A boss structure 1082 is also provided on one side of the hard stop block 108. In this embodiment, Figure 8 As shown, the dovetail groove 1081 and the boss structure 1082 are structural details of the hard stop block 108. The dovetail groove 1081 adopts a dovetail groove structure. When the floating head assembly 200 contacts the hard stop block 108 and the nested sealing ring 109, pressure is applied inside the nested sealing ring 109. The outer diameter of the nested sealing ring 109 is squeezed by the dovetail groove 1081, and the inner diameter avoids deformation when the nested sealing ring 109 is compressed, which can effectively prevent the nested sealing ring 109 from falling off and wearing. The boss structure 1082 is used to block the arc generated during the chip PD test to lead the current through the gasket body 107, affecting the operator or equipment.

[0022] In a preferred embodiment of the present invention, the floating head assembly 200 includes a tube leg pressing block 201, a positioning sleeve 202, a suction rod 203, a sealing ring 1 204, a sealing ring 205 and a suction cup 206. The positioning sleeve 202 is installed on the lower surface of the tube leg pressing block 201, and a suction rod 203 and a suction cup 206 are also provided below the tube leg pressing block 201. A sealing ring 1 204 and a sealing ring 205 are also installed inside the tube leg pressing block 201.

[0023] In a preferred embodiment of the present invention, the tube leg pressing block 201 is provided with a plurality of air holes 2011. Figure 4 As shown, an air hole 2011 is punched on the leg pressing block 201 aligned with the chip leg. During the chip PD test, the pressure-maintaining gas flows out from the outlet 1032 and is blown into the chip (IC) surface through the air hole 2011 to ensure that the internal air is in a circulating state during the test, thereby preventing arcing during the PD high voltage test.

[0024] In a preferred embodiment of the present invention, Figure 6 As shown, the floating head assembly 200 cooperates with the shuttle assembly, and the feed trolley assembly 300 and the discharge trolley 400 have the same structure.

[0025] In a preferred embodiment of the present invention, Figure 7 As shown, the contact unit main body assembly 100 is fixed on the test chip handler (Handler) through the test docking assembly 500. The test chip handler (Handler) provides inflation pressure. During the test, the floating head assembly 200 provides downward pressure.

[0026] Example 1 When the chip test handler (Handler) tests the chip, it is necessary to design the corresponding fixture according to the chip. The local invention mainly performs PD (Power-Delivery) test on the chip, that is, power transmission test, such as Figure 1 As shown in the figure, there are five components, which constitute a complete test fixture, referred to as PD test fixture.

[0027] like Figure 1 As shown, the contact unit main component 100 is CUH (Contact Unit Holder), also known as Docking, which is responsible for connecting the chip test sorting machine (Handler) and the test machine. The floating head component 200 is the floating head component (Nest), which is responsible for carrying the chip (IC) and providing test pressure. The input trolley component 300 is the input trolley component (Input shuttle), and the output trolley 400 is the output shuttle (Output shuttle). The input trolley component 300 and the output trolley 400 have the same structure and are collectively called the shuttle, which is responsible for carrying the chip (IC). The test docking component 500 is used to connect the CUH with the chip test sorting machine to realize automated testing.

[0028] like Figure 2As shown, the unit body metal frame 101 is responsible for resisting the deformation caused by the downward pressure test of the floating head assembly 200, the unit body ventilation plate 102 is responsible for providing test conditions and transmitting the air pressure required for the test to the test area of ​​each chip test socket 103, the docking assembly positioning pin 104 is responsible for positioning with the test docking assembly 500, the nested positioning pin 105 is responsible for positioning with the positioning sleeve 202, the gasket sealing ring 106 ensures that when the number of the gasket body 107 is adjusted, the hard limit block 108 and the unit body ventilation plate 102 can be installed to achieve a sealed state, the nested sealing ring 109 ensures that there is no air leakage when the floating head assembly 200 and the hard limit block 108 are in contact, and the height of the pad block 110 is consistent with the thickness of the chip test socket 103, ensuring that the circuit test board (PCB) will not be deformed or damaged during the test, and the circuit test board (PCB) is connected to the bottom of the chip test socket 103 and remains sealed. The docking assembly sealing ring 111 ensures that the unit body vent plate 102 and the test docking assembly 500 are in a sealed state when installed, and the test socket sealing ring 112 ensures that the chip test socket 103 and the unit body vent plate 102 are in a sealed state when installed; like Figure 7 As shown, when the chip test sorter (Handler) is inflated, the unit body vent plate 102 transmits the air pressure to the vent 1021. At this time, the chip test socket 103 transmits the air pressure of the vent 1021 to the outlet 1032 of the chip test socket 103. After the air path passes through the unit body vent plate 102, the gas flows out from here. When the floating head assembly 200 is pressed down, a closed space is formed in the groove of the chip test socket 103. That is, during the test, a closed space is formed, and gas is filled into the closed space. The greater the gas pressure, the better the effect of suppressing the discharge phenomenon.

[0029] Specifically, the following problems are likely to occur during the discharge phenomenon: The discharge phenomenon generated during high-voltage chip testing may cause the surrounding air to ionize and form plasma, which may interfere with the accuracy of the test signal and affect the precise evaluation of chip performance.

[0030] If the heat generated by discharge cannot be dissipated in time, it may cause local overheating, causing thermal damage to the chip, affecting its reliability and life, and may even directly cause chip damage.

[0031] Continuous discharge may also cause electromagnetic interference to the test equipment, affecting the normal operation and measurement accuracy of the equipment, and in the long run may also shorten the service life of the equipment.

[0032] Therefore, the filling of gas and the control of pressure in this embodiment can play the following roles: Improve heat dissipation: Filling with appropriate gas and maintaining a certain pressure can enhance the gas's thermal conductivity, help dissipate the heat generated by discharge faster, and reduce the risk of local overheating of the chip. For example, helium has good thermal conductivity and can effectively take away heat at a certain pressure, maintaining the chip temperature within a reasonable range.

[0033] Reduce discharge energy: Appropriate gas pressure can change the gas's insulation properties and electron migration characteristics, etc. For example, when filled with sulfur hexafluoride (SF6) gas, it has strong insulation properties at higher pressures, which can inhibit the occurrence of discharge, reduce discharge energy, and reduce the impact on the chip and test environment.

[0034] Stabilize the test environment: By controlling the gas pressure in a confined space, the electric field distribution in the space can be stabilized, reducing electric field fluctuations caused by factors such as air flow, making the test environment more stable, and improving the repeatability and accuracy of the test results.

[0035] like Figures 4 to 5 As shown, the air interface seal ring 1031 is connected with the vent 1021 during installation, and the air path is transmitted to the outlet 1032 to reach the chip (IC) test area. The tube leg pressing block 201 is used to position the chip and limit the chip (IC) tube legs. The positioning sleeve 202 is responsible for positioning with the trolley when taking and placing materials during transportation, and positioning with the contact unit main assembly 100 during testing. The suction rod 203 and the suction cup 206 are responsible for sucking the chip (IC). After the air path flows out from the outlet 1032, it is blown into the chip (IC) surface through the air hole 2011 to ensure the internal air circulation during testing.

[0036] like Figure 6 As shown, the floating head assembly 200 is in a cooperative state when picking up materials from the feed trolley assembly 300. The feed trolley assembly 300 transfers the chip to the specified position, the floating head assembly 200 moves to the material picking position and turns on the vacuum, the suction cup 206 adsorbs the chip (IC) on the suction rod 203 and moves to the test area. After the test is completed, the floating head assembly 200 places the chip in the discharge trolley 400 for transportation.

[0037] like Figure 7 As shown, the contact unit main body component 100 is installed on the chip test handler (Handler) through the test docking component 500. After the floating head component 200 takes the chip (IC) out of the feed trolley component 300, it moves to the top of the contact unit main body component 100 to prepare for testing.

[0038] like Figure 8As shown, the sealing ring 1 204 and the sealing ring 205 ensure that the floating head assembly 200 is sealed. During the test, the floating head assembly 200 moves downward and provides downward pressure until the floating head assembly 200 sends the chip into the chip test socket 103 and contacts with the hard stop block 108 and the nested sealing ring 109 to achieve sealing. The chip test sorter (Handler) inflates the test docking assembly 500 to maintain pressure. A stable and equal pressure will be formed in the internal test area of ​​each chip test socket 103, so that the chip can be protected from the impact of the high voltage test environment when doing PD testing. After the test is completed, the floating head assembly 200 moves the test chip (IC) to the unloading trolley 400 to complete the test process.

[0039] This test fixture greatly improves the chip testing efficiency, realizes the pressure-maintaining function, and avoids injuries to personnel during operation. This test fixture can replace manual labor, can efficiently and automatically change materials, and can also solve the problems of chip PD testing and testing in a high-voltage environment.

[0040] This test fixture can be used in the semiconductor automation industry and can perform automated testing on high-power and high-voltage chips. In addition, it can improve test efficiency according to market needs, has a more compact structure, can greatly reduce costs, and realize a fully automated test process. In addition, this test fixture can also develop towards a higher level of automation, safety, intelligence, and high efficiency.

[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip PD automated test fixture, characterized by: The invention comprises a communication unit main body component (100), a test docking component (500) is installed on the top of the communication unit main body component (100), a floating head component (200) is installed above the test docking component (500), the communication unit main body component (100) is installed on a test chip sorting machine through the test docking component (500), and a material inlet trolley component (300) and a material outlet trolley (400) are respectively provided on both sides of the test chip sorting machine; The communication unit main body component (100) comprises a unit main body metal outer frame (101), a unit main body ventilation plate (102), a chip test socket (103), a docking component positioning pin (104), a nesting positioning pin (105), a hard limit block (108), a nesting sealing ring (109), a pad block (110), a docking component sealing ring (111) and a test socket sealing ring (112); the unit main body ventilation plate (102) is mounted on the surface of the unit main body metal outer frame (101), and the docking component positioning pins (104) are mounted on one side of the unit main body ventilation plate (102). 4) and a docking assembly sealing ring (111), a nested positioning pin (105) and a hard stop block (108) are also installed on the unit body ventilation plate (102), and the nested positioning pin (105) passes through the hard stop block (108) and is installed to the floating head assembly (200), a nested sealing ring (109) is installed above the hard stop block (108), a pad block (110) is installed below the unit body metal frame (101), a chip test socket (103) is installed on one side of the unit body metal frame (101), and a test socket sealing ring (112) is installed on the chip test socket (103).

2. A chip PD automated test fixture according to claim 1, characterized in that: The communication unit main body component (100) further comprises a gasket sealing ring (106) and a gasket body (107), and the gasket sealing ring (106) and the gasket body (107) are provided at the connection between the nested positioning pin (105) and the hard limit block (108).

3. The chip PD automatic test fixture according to claim 1, characterized in that: The unit main body ventilation plate (102) is provided with a ventilation port (1021), and the unit main body ventilation plate (102) is also provided with a ventilation plate internal air path (1022).

4. The chip PD automatic test fixture according to claim 1, characterized in that: The chip test socket (103) is provided with an air interface sealing ring (1031), and the chip test socket (103) is also provided with an air outlet (1032), and the air outlet (1032) is used to cooperate with the floating head assembly (200).

5. The chip PD automatic test fixture according to claim 1, characterized in that: The hard limit block (108) is provided with a dovetail groove (1081), which is used in conjunction with the nested sealing ring (109), and a boss structure (1082) is also provided on one side of the hard limit block (108).

6. The chip PD automatic test fixture according to claim 4, characterized in that: The floating head assembly (200) comprises a tube leg pressing block (201), a positioning sleeve (202), a suction rod (203), a sealing ring 1 (204), a sealing ring 2 (205) and a suction cup (206); the positioning sleeve (202) is installed on the lower surface of the tube leg pressing block (201); a suction rod (203) and a suction cup (206) are also provided below the tube leg pressing block (201); and a sealing ring 1 (204) and a sealing ring 2 (205) are also installed inside the tube leg pressing block (201).

7. The chip PD automatic test fixture according to claim 6, characterized in that: The tube leg pressing block (201) is provided with a plurality of air holes (2011). After the pressure-maintaining air comes out from the air outlet (1032), it is blown onto the test chip through the air holes (2011) to allow air to flow.

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