Circuit board detection device, circuit board detection method and circuit board analysis device

Abstract

The invention relates to the technical field of circuit testing, in particular to a circuit board detection device and method and an analysis device. The detection device of the circuit board comprises a radio frequency probe used for connecting one end of a test circuit of the circuit board to be tested; the analysis device is connected with the radio frequency probe, the analysis device transmits a detection signal to the test circuit of the to-be-tested circuit board through the radio frequency probe, the detection signal is propagated along the test circuit of the to-be-tested circuit board and is reflected to generate a reflection signal, and the radio frequency probe is further used for receiving the reflection signal and sending the reflection signal to the analysis device; the analysis device is used for determining the defect condition of the circuit board based on the reflected signal. In the application, the analysis device is connected with the radio frequency probe, so that the detection signal can be transmitted to the circuit board to be detected through the radio frequency probe, and the analysis device can also acquire the reflection signal and determine the defect condition of the circuit board based on the reflection signal, so that the defect condition of the circuit board to be detected can be rapidly determined without cutting the circuit board to be detected.

Description

Technical Field

[0001] The present application relates to the technical field of circuit testing, and in particular to a circuit board detection device and method, and an analysis device. Background Art

[0002] During the production process of printed circuit boards, especially for the deposition process, plating defects are prone to occur, such as voids, cracks, nodules, gaps, etc. Sometimes the plating defects are covered by multiple layers of plating, or exist in the inner layer, vias, etc., which are not easy to find.

[0003] In the related art, the circuit board is often sampled and subjected to metallographic section grinding, so as to directly observe the circuit board for defects under a microscope. However, when sampling the circuit board, the defect position may be damaged during the sampling or grinding process.

[0004] Therefore, there is a need for a method for detecting defects in a circuit board that is fast and simple. Summary of the invention

[0005] Based on this, it is necessary to provide a circuit board detection device and method, and an analysis device that can quickly and easily detect the condition of the circuit board in order to address the above technical problems.

[0006] In one aspect, a circuit board detection device is provided, comprising:

[0007] A radio frequency probe, used to connect one end of a test circuit of a circuit board to be tested;

[0008] An analysis device is connected to the radio frequency probe, and the analysis device transmits a detection signal to the test circuit of the circuit board to be tested via the radio frequency probe. The detection signal propagates along the test circuit of the circuit board to be tested and reflects to generate a reflection signal. The radio frequency probe is also used to receive the reflection signal and send the reflection signal to the analysis device. The analysis device is used to determine the defect condition of the circuit board based on the reflection signal.

[0009] In one embodiment, the circuit board detection device further includes:

[0010] A grounding probe is connected to the analyzing device, and the grounding probe is used to connect to the grounding terminal of the circuit board to be tested.

[0011] In one embodiment, the analysis device includes a network analyzer, and the circuit board detection device also includes:

[0012] A radio frequency cable is used to connect the radio frequency probe and the analysis device.

[0013] On the one hand, a circuit board detection method is provided, the circuit board detection method is applied to any of the circuit board detection devices described above, and the circuit board detection method includes:

[0014] Transmitting a detection signal to a test circuit of the circuit board to be tested via the radio frequency probe;

[0015] Receiving a reflection signal of a test circuit of the circuit board to be tested from the radio frequency probe, wherein the detection signal and the reflection signal have different signal parameters;

[0016] Based on the reflected signal, a defect condition of the circuit board to be tested is determined.

[0017] In one embodiment, determining the defect of the circuit board to be tested based on the reflection signal includes:

[0018] Performing time domain conversion on the reflection signal to obtain a time domain curve of the reflection signal;

[0019] Based on the standard curve and the time domain curve, the defect condition of the circuit board to be tested is determined.

[0020] In one embodiment, determining the defect of the circuit board to be tested based on the standard curve and the time domain curve includes:

[0021] Calculating the deviation between the first value of the standard curve and the second value of the time domain curve at the same time;

[0022] When the deviation value is greater than or equal to a preset deviation value, it is determined that the circuit board to be tested has a defect.

[0023] In one embodiment, when the deviation value is greater than a preset deviation value, after determining that the circuit board to be tested has a defect, the method includes:

[0024] When the deviation value is greater than a preset deviation value, determining an abnormal time of the deviation value in the time domain curve based on the deviation value;

[0025] Based on the transmission speed of the detection signal and the abnormal time, the defect position of the circuit board to be tested is determined.

[0026] In one embodiment, the preset deviation value includes ±5%.

[0027] In one embodiment, the calculating of the deviation between the first value of the standard curve and the second value of the time domain curve at the same time comprises:

[0028] When the deviation value is less than the preset deviation value, it is determined that the circuit board to be tested is normal.

[0029] In one aspect, an analysis device is provided, comprising:

[0030] A transmitting module, used for transmitting a detection signal to a test circuit of the circuit board to be tested via the radio frequency probe;

[0031] A receiving module, used for receiving a reflection signal of a test circuit of the circuit board to be tested from the radio frequency probe;

[0032] A determination module is used to determine the defect of the circuit board to be tested based on the reflection signal.

[0033] The detection device and method and analysis device of the above-mentioned circuit board, by setting the analysis device to be connected to the radio frequency probe, can transmit the detection signal to the circuit board to be tested through the radio frequency probe, and at the same time, the analysis device can also obtain the reflected signal and determine the defect of the circuit board based on the reflected signal. In the present application, the defect of the circuit board to be tested can be quickly determined without cutting the circuit board to be tested, thereby improving the protection of the circuit board to be tested. Secondly, in the present application, a grounding probe is set to connect the analysis device and the ground terminal of the circuit board to be tested, thereby achieving coupling of the reflected signal with the ground, thereby improving the detection accuracy. Subsequently, the detection equipment of the circuit board in the present application can be flexibly moved, so that it can be applied to a variety of detection environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 A schematic diagram of the structure of a circuit board detection device provided in one embodiment;

[0036] Figure 2 A schematic structural diagram of a circuit board detection device provided in another embodiment;

[0037] Figure 3 A schematic diagram of a flow chart of a circuit board detection method provided in one embodiment;

[0038] Figure 4 A schematic diagram of a standard curve provided in one embodiment;

[0039] Figure 5 A schematic diagram of a time domain curve provided in an embodiment;

[0040] Figure 6A schematic diagram showing the comparison between a standard curve and a time domain curve provided in an embodiment;

[0041] Figure 7 A schematic diagram showing the comparison between a standard curve and a time domain curve provided in another embodiment;

[0042] Figure 8 A schematic diagram showing the comparison between a standard curve and a time domain curve provided in yet another embodiment;

[0043] Fig. 9 A structural block diagram of an analysis device provided in an embodiment.

[0044] Description of reference numerals: radio frequency probe-100; analysis device-110; ground probe-120; test circuit-200. DETAILED DESCRIPTION

[0045] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0047] It can be understood that the terms "first", "second", etc. used in this application can be used in this article to describe various technical features, but these technical features are not limited by these terms, and these terms are only used for distinction.

[0048] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, an element or feature described as "under other elements" or "under it" or "under it" will be oriented as being "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0049] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element, or connected to the other element through an intermediate element. In addition, the "connection" in the following embodiments should be understood as "electrical connection", "communication connection", etc. if there is transmission of electrical signals or data between the connected objects.

[0050] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" etc. specify the presence of stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0051] In one embodiment, see Figure 1 and Figure 2 , a circuit board detection device is provided. The circuit board detection device includes: a radio frequency probe 100 and an analysis device 110.

[0052] The RF probe 100 can be used to connect to the test circuit 200 of the circuit board to be tested. The RF probe 100 can be connected to one end (eg, the end) of the test circuit 200 of the circuit board to be tested, so as to test the complete test circuit 200.

[0053] The analysis device 110 may be connected to the radio frequency probe 100. As an example, the radio frequency probe 100 and the analysis device 110 may be connected via a radio frequency cable.

[0054] The analysis device 110 can transmit a detection signal to the test circuit 200 of the circuit board to be tested via the radio frequency probe 100. As an example, the detection signal may include a millimeter wave. In addition, the radio frequency probe 100 can also be used to receive a reflected signal of the test circuit 200 of the circuit board to be tested. After the detection signal propagates in the test circuit 200, at the discontinuity of the test circuit 200 or the impedance mismatch, the detection signal can form a reflected signal, and the reflected signal returns along the test circuit 200. At this time, the signal parameters of the detection signal and the reflected signal are different. For example, the propagation directions of the detection signal and the reflected signal may be opposite, and the wavelength, frequency, phase and other parameters of the detection signal and the reflected signal may also be different. The radio frequency probe 100 can receive the reflected signal and send the reflected signal to the analysis device 110. The analysis device 110 can distinguish the detection signal from the reflected signal based on the signal parameters. As an example, the analysis device 110 may include a network analyzer.

[0055] After receiving the reflected signal, the analyzing device 110 can determine the defect of the circuit board based on the reflected signal. As an example, when holes, defects, etc. appear in the test circuit 200 of the circuit board to be tested, the reflected signal will change. At this time, the defect of the circuit board to be tested can be determined based on the change of the reflected signal.

[0056] In addition, the detection device of the circuit board may also include a ground probe 120, and the ground probe 120 may be connected to the analysis device 110. The ground probe 120 is used to connect to the ground terminal of the circuit board to be tested. It can be understood that when a ground terminal (GND) is provided on the test circuit board, the ground probe 120 may be connected to the ground terminal. As an example, the material of the ground terminal may include copper, etc. The ground probe 120 is connected to the ground terminal, so as to facilitate the coupling of the reflected signal with the ground, and also provide a stable reference potential for the analysis device 110 to analyze the reflected signal. In addition, the ground probe 120 can also introduce interference signals in the environment into the earth, thereby reducing the impact on the test results and improving the electromagnetic compatibility of the test.

[0057] In this embodiment, firstly, by setting the analysis device 110 to connect to the radio frequency probe 100, a detection signal can be transmitted to the circuit board to be tested through the radio frequency probe 100. At the same time, the analysis device 110 can also obtain the reflected signal and determine the defect of the circuit board based on the reflected signal. In this embodiment, the defect of the circuit board to be tested can be quickly determined without cutting the circuit board to be tested, thereby improving the protection of the circuit board to be tested. Secondly, in this embodiment, by setting the grounding probe 120 to connect the analysis device 110 and the grounding terminal of the circuit board to be tested, the reflected signal is coupled with the ground, thereby improving the detection accuracy. Subsequently, the detection device of the circuit board in this embodiment can be flexibly moved, so that it can be applied to a variety of detection environments.

[0058] Based on the same inventive concept, please refer to Figure 3 In one embodiment, a circuit board detection method is provided. The circuit board detection method in this embodiment can be applied to the circuit board detection device provided in other embodiments of the present application. The circuit board detection method can include the following steps:

[0059] Step S100: transmitting a detection signal to the test circuit 200 of the circuit board to be tested via the radio frequency probe 100.

[0060] Step S200: receiving a reflection signal of a test circuit 200 of a circuit board to be tested from the RF probe 100 .

[0061] Step S300: Determine the defect status of the circuit board to be tested based on the reflection signal.

[0062] In step S100, the analysis device 110 may be controlled to transmit a detection signal to the test circuit 200 of the circuit board to be tested via the radio frequency probe 100. As an example, the detection signal may include a millimeter wave. This embodiment does not specifically limit the frequency, wavelength, and phase of the detection signal.

[0063] In step S200, the reflected signal of the test circuit 200 of the circuit board to be tested received by the RF probe 100 can be obtained in real time. The signal parameters of the detection signal and the reflection signal are different. At this time, the analysis device 110 can distinguish the detection signal from the reflection signal based on different signal parameters.

[0064] Of course, the analyzing device 110 may also transmit the detection signal in the first time period, and stop transmitting the detection signal in a second time period after the first time period, and only receive the reflection signal.

[0065] In step S300, the reflected signal can be analyzed. When an abnormal band appears in the reflected signal, it is considered that the circuit board to be tested has a defect. When there is no abnormal band in the reflected signal, it is considered that the circuit board to be tested is normal.

[0066] In this embodiment, by analyzing the reflected signal, it is determined in the reflected signal whether the circuit board to be tested has a defect, thereby quickly and simply determining the defect of the circuit board to be tested.

[0067] In one embodiment, step S300 may include:

[0068] Step S310: performing time domain conversion on the reflected signal to obtain a time domain curve of the reflected signal.

[0069] Step S320: Determine the defect status of the circuit board to be tested based on the standard curve and the time domain curve.

[0070] In step S310, as an example, the analysis device 110 can measure the frequency domain characteristics of the reflected signal, and then pre-process the measured frequency domain data, such as denoising, filtering, etc., to improve the data quality. Afterwards, the frequency domain data can be converted into time domain data using functions such as inverse Fourier transform. In addition, multiple time domain data can also be formed into a time domain curve. The time domain curve can represent the change of the reflected signal over time. Of course, the time domain curve can be displayed in a time domain waveform diagram or the like, so as to intuitively understand the change of the reflected signal over time.

[0071] In step S320, as an example, see Figure 4 , Figure 4 The curve shown in can be a preset standard curve, which can be obtained by testing a circuit board similar to the circuit board to be tested. Figure 5 , Figure 5The curve shown in may be a time domain curve.

[0072] At this time, the standard curve and the time domain curve can be superimposed. When the time domain curve is abnormal relative to the standard curve, it is determined that the circuit board to be tested has a defect. Furthermore, at this time, the defect type of the circuit board to be tested can be determined by analyzing the shape of the time domain curve in the abnormal area. As an example, when the abnormal area in the time domain curve is large, it can be considered that a large hole appears in the circuit board to be tested. In another example, when the abnormal area in the time domain curve is small, it can be considered that a narrow gap appears in the circuit board to be tested. For example, see Figure 6 , Figure 7 and Figure 8 ,exist Figure 6 , Figure 7 and Figure 8 In the figure, the time domain curves do not overlap with the standard curves, which means Figure 6 , Figure 7 and Figure 8 The circuit board under test has defects such as holes or gaps. Figure 6 , Figure 7 In the figure, the blue curve represents the standard curve, and the red curve represents a hole in the circuit board to be tested. Figure 8 In the figure, the green curve indicates that there are two holes on the circuit board under test.

[0073] Specifically, step S320 may include:

[0074] Step S321: Calculate the deviation between the first value of the standard curve and the second value of the time domain curve at the same time.

[0075] Step S322: When the deviation value is greater than or equal to the preset deviation value, it is determined that the circuit board to be tested has a defect.

[0076] Step S323: When the deviation value is less than the preset deviation value, it is determined that the circuit board to be tested is normal.

[0077] In step S321 to step S323, as an example, the deviation value between the first value of the standard curve and the second value of the time domain curve at the same moment can be first calculated. The deviation value can represent the deviation of the second value of the time domain curve relative to the first value of the standard curve. When the deviation value is greater than or equal to the preset deviation value, it can be determined that the circuit board to be tested has a defect. When the deviation value is less than the preset deviation value, it can be determined that the circuit board to be tested is normal. As an example, the range of the preset deviation value can be ±1%-±10%, etc. For example, the preset deviation value can include ±5%. The above preset deviation value is used for exemplary description. In actual embodiments, the preset deviation value is not limited to the above values.

[0078] Furthermore, after step S322, the following steps may be included:

[0079] Step S3221: When the deviation value is greater than a preset deviation value, an abnormal time of the deviation value is determined in the time domain curve based on the deviation value.

[0080] Step S3222: Determine the defect location of the circuit board to be tested based on the transmission speed of the detection signal and the abnormal time.

[0081] In step S3221 to step S3222, when it is determined that the circuit board to be tested has a defect, the defect position can be further located. At this time, the abnormal time of the deviation value can be determined in the time domain curve. Afterwards, the specific position of the defect in the circuit board to be tested can be calculated based on the transmission speed of the detection signal and the abnormal time, and the defect can be accurately processed.

[0082] In this embodiment, by setting a preset deviation value, it is possible to accurately determine whether the circuit board to be tested has defects. In addition, in this embodiment, by converting the time domain curve, the defect position of the circuit board to be tested is accurately determined, and the defect can be quickly processed.

[0083] It should be understood that although Figure 3 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, Figure 3 At least part of the steps may include multiple steps or multiple stages. These steps or stages are not necessarily performed at the same time, but can be performed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed in turn or alternately with other steps or at least part of the steps or stages in other steps.

[0084] Based on the same inventive concept, in one embodiment, please refer to Fig. 9 , an analysis device 110 is provided. As an example, the analysis device 110 may include a network analyzer. Specifically, the analysis device 110 may include a transmitting module, a receiving module, and a determining module.

[0085] The transmitting module can be used to transmit a detection signal to the test circuit 200 of the circuit board to be tested via the radio frequency probe 100 .

[0086] The receiving module can be used to receive the reflection signal of the test circuit 200 of the circuit board to be tested from the RF probe 100 .

[0087] The determination module can be used to determine the defect status of the circuit board to be tested based on the reflection signal.

[0088] For the specific definition of the analysis device 110, please refer to the definition of the detection method of the circuit board in the above text, which will not be repeated here. The various modules in the above-mentioned analysis device 110 can be implemented in whole or in part by software, hardware and their combination. The above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory in the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules. It should be noted that the division of modules in the embodiment of the present application is schematic and is only a logical function division. There may be other division methods in actual implementation.

[0089] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), tape, floppy disk, flash memory or optical memory, etc. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0090] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0091] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0092] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A circuit board detection device, characterized in that: include: A radio frequency probe, used to connect one end of a test circuit of a circuit board to be tested; An analysis device is connected to the radio frequency probe, and the analysis device transmits a detection signal to the test circuit of the circuit board to be tested via the radio frequency probe. The detection signal propagates along the test circuit of the circuit board to be tested and reflects to generate a reflection signal. The radio frequency probe is also used to receive the reflection signal and send the reflection signal to the analysis device. The analysis device is used to determine the defect condition of the circuit board based on the reflection signal.

2. The circuit board detection device according to claim 1, characterized in that: The detection device of the circuit board also includes: A grounding probe is connected to the analyzing device, and the grounding probe is used to connect to the grounding terminal of the circuit board to be tested.

3. The circuit board detection device according to claim 1, characterized in that: The analysis device includes a network analyzer, and the detection device of the circuit board also includes: A radio frequency cable is used to connect the radio frequency probe and the analysis device.

4. A circuit board detection method, characterized in that: The circuit board detection method is applied to the circuit board detection device according to any one of claims 1 to 3, and the circuit board detection method includes: Transmitting a detection signal to a test circuit of the circuit board to be tested via the radio frequency probe; Receive a reflection signal of a test circuit of the circuit board to be tested from the radio frequency probe; Based on the reflected signal, a defect condition of the circuit board to be tested is determined.

5. The circuit board detection method according to claim 4, characterized in that: The step of determining the defect of the circuit board to be tested based on the reflected signal includes: Performing time domain conversion on the reflection signal to obtain a time domain curve of the reflection signal; Based on the standard curve and the time domain curve, the defect condition of the circuit board to be tested is determined.

6. The circuit board detection method according to claim 5, characterized in that: The step of determining the defect of the circuit board to be tested based on the standard curve and the time domain curve includes: Calculating a deviation between a first value of the standard curve and a second value of the time domain curve at the same time; When the deviation value is greater than or equal to a preset deviation value, it is determined that the circuit board to be tested has a defect.

7. The circuit board detection method according to claim 6, characterized in that: When the deviation value is greater than the preset deviation value, after determining that the circuit board to be tested has a defect, the method includes: When the deviation value is greater than a preset deviation value, determining an abnormal time of the deviation value in the time domain curve based on the deviation value; Based on the transmission speed of the detection signal and the abnormal time, the defect position of the circuit board to be tested is determined.

8. The circuit board detection method according to claim 6, characterized in that: The preset deviation value includes ±5%.

9. The circuit board detection method according to claim 6, characterized in that: The calculating, at the same time, a deviation value between a first value of the standard curve and a second value of the time domain curve comprises: When the deviation value is less than the preset deviation value, it is determined that the circuit board to be tested is normal.

10. An analysis device, characterized in that: include: A transmitting module, used for transmitting a detection signal to a test circuit of the circuit board to be tested via a radio frequency probe; A receiving module, used for receiving a reflection signal of a test circuit of the circuit board to be tested from the radio frequency probe; The determination module is used to determine the defect of the circuit board to be tested based on the reflection signal.

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