Integrated heat dissipation module of computer case

Abstract

The invention discloses an integrated heat dissipation module of a computer case, and relates to the technical field of heat dissipation of computer cases. The device specifically comprises a mounting plate fixed to an inner cavity of a case, a swing mechanism is arranged at the top of the mounting plate, an adsorption assembly is clamped to the end of the swing mechanism, a heat dissipation assembly is arranged at the top of the swing mechanism, a heat conduction coil pipe is wound around the inside and the outside of the heat dissipation assembly, and fixing screws are arranged at the four corners of the top of the mounting plate. The heat dissipation assembly comprises fixing frames, heat insulation plates, side frames, W-shaped copper pipes, a top frame and inserting grooves, the two fixing frames are connected to the inner wall of the case through bolts, the inserting grooves are formed in the four corners of the opposite sides of the two fixing frames, the W-shaped copper pipes are inserted into the inserting grooves, and the side frames are sequentially welded to the outer surfaces of the W-shaped copper pipes at equal intervals. The problem that the heat dissipation effect becomes poor due to the fact that the heat dissipation space of a heat dissipation module in a traditional case is compressed is solved, the heat conduction area is increased, the heat dissipation efficiency is improved, and the problem that the local temperature is high due to heat gathering is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of computer case heat dissipation, and in particular to an integrated heat dissipation module for a computer case. Background Art

[0002] The integrated heat dissipation module of the computer case is a device used to improve the heat dissipation effect of the computer. With the continuous improvement of computer performance and the increase in integration, computer hardware will generate a lot of heat during operation, and overheating may cause hardware damage and performance degradation. Therefore, an effective heat dissipation system is essential to maintain the stable operation of the computer. The design of the integrated heat dissipation module of the computer case is to provide an efficient heat dissipation solution. By optimizing the heat dissipation structure and air duct design, it can effectively reduce the operating temperature of the computer hardware and maintain the hardware stability and performance. With the continuous advancement of technology and the increasing demand for high-performance computers, the functions and performance of computer hardware are also constantly improving. However, with the improvement of hardware performance, the heat generated by the computer during operation also increases accordingly, resulting in the heat dissipation problem becoming an important factor restricting the stability and performance of the computer. In order to solve this problem, computer manufacturers and hardware designers continue to explore innovative heat dissipation solutions, among which the integrated heat dissipation module came into being.

[0003] After searching, the invention with Chinese patent application number CN201922306322X discloses a CPU chip and graphics card integrated heat dissipation module, including: a chassis body, a motherboard and a radiator module; the motherboard is respectively provided with a CPU chip and a graphics card, and the motherboard is arranged inside the chassis body; the radiator module is arranged above the motherboard, and the radiator module is movably connected to the chassis through a detachable connection device, and the radiator module also includes a heat dissipation base plate, heat dissipation fins and a radiator; the bottom surface of the heat dissipation base plate is provided with a first heat conduction plate that matches the size and height of the CPU chip on the motherboard, and a second heat conduction plate that matches the size and height of the graphics card on the motherboard. The integrated heat dissipation module is easier to maintain, more convenient to install and disassemble, and has lower cost. The integrated heat dissipation module for CPU chip and graphics card in the above invention has the following shortcomings:

[0004] Although the above device makes the size of the chassis smaller, the production process is simpler, and the production efficiency is improved, when the overall device is stuck on the top of the motherboard, the space where heat can be dissipated is compressed, and the effect of dissipating the heat in the space through the cooling fins is relatively poor. Therefore, there is an urgent need for an integrated heat dissipation module for a computer chassis. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art and to propose an integrated heat dissipation module for a computer case.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] The integrated heat dissipation module of the computer case comprises a mounting plate fixed to the inner cavity of the case, a swing mechanism is arranged on the top of the mounting plate, an adsorption component is clamped on the end of the swing mechanism, a heat dissipation component is arranged on the top of the swing mechanism, a heat conducting coil is wound inside and outside the heat dissipation component, and fixing screws are arranged at the four corners of the top of the mounting plate.

[0008] Preferably: the heat dissipation assembly includes a fixing frame, a heat insulation board, a side frame, a W-shaped copper tube, a top frame and a slot, and the two fixing frames are connected to the inner wall of the chassis by bolts, the slots are opened at the four corners of the opposite sides of the two fixing frames, the W-shaped copper tube is plugged into the slot, and the side frames are welded to the outer surface of the W-shaped copper tube in sequence at equal distances. When the heat in the chassis is gathered, it is conducted through the equidistantly arranged side frames and concentrated above the heat insulation board. At this time, the heat above the heat insulation board is conducted through the heat conduction coil.

[0009] Furthermore: the top frame is welded to the top of the side frame, the heat insulation plate is interference-connected to the middle of the bottom of the fixing frame, and the top outer walls of the two fixing frames are respectively provided with temperature sensors.

[0010] On the basis of the above scheme: the heat conducting coil comprises water pipe 1 and water pipe 2, and the inner side of water pipe 1 and water pipe 2 pass through the inside of W-shaped copper pipes arranged at equal distances, and water pipe 1 and water pipe 2 are integrally formed, and the water inlet ends of water pipe 1 and water pipe 2 are connected and fixed by a connecting sleeve. When the heat above the insulation board is conducted by the W-shaped copper pipes arranged at equal distances, the heat will be conducted by water pipe 1 and water pipe 2, and at the same time, the heat inside and outside the W-shaped copper pipe is absorbed by water pipe 1 and water pipe 2.

[0011] A better solution among the above solutions is: the adsorption component includes an arc frame, a microfiber cloth, a groove and a clamping hole, and the arc frame is clamped to the swing end of the swing mechanism through the clamping hole, the groove is opened inside the arc frame, the clamping hole is opened on both sides of the bottom inner wall of the groove, and the microfiber cloth is fixedly connected to the side of the arc frame.

[0012] As a further solution of the present invention: the swing mechanism includes a rotating shaft, a fixed seat, a screw rod 1, a Z-shaped guide rod, a swing rod, a screw rod 2, a servo motor, a connecting rod and a clamping protrusion, and the fixed seat is fixedly connected to the top two sides of the mounting plate, the screw rods 1 and 2 are rotatably connected to the inside of the two fixed seats through bearings, and the servo motor is fixedly connected to one side of the top of the mounting plate through bolts. By starting the servo motor to drive the screw rod 2 to rotate, the rotating screw rod 2 synchronously drives the screw rod 1 to rotate, and at this time, the Z-shaped guide rods located on the circumference of the screw rod 1 and the screw rod 2 move in relative directions. At this time, the swing rod located on the circumference of the screw rod 2 drives the Z-shaped guide rod at its end downward, and the swing rod located on the circumference of the screw rod 1 drives the Z-shaped guide rod at its end upward, thereby driving the connecting rod to rotate around the rotating shaft by a certain angle, so that the adsorption component on the connecting rod is attached to the heat dissipation net.

[0013] At the same time, the output end of the servo motor is connected to the end of the screw rod 2 through a thread, and two Z-shaped guide rods are respectively sleeved on the circumference of the screw rod 1 and the screw rod 2. The two Z-shaped guide rods are centrally symmetrical, and the two rocker rods are rotatably connected to the ends of the two Z-shaped guide rods.

[0014] As a preferred embodiment of the present invention: the rotating shaft is rotatably connected to one side of the top of the mounting plate, the connecting rod is arranged on the top circumference of the rotating shaft, the two ends of the connecting rod form a rotational fit with the ends of the two rocker arms, the clamping protrusion is fixedly connected to the two sides of the top of the connecting rod, and the clamping protrusion and the clamping hole are interference connected with each other, and the screw one and the screw two are connected by a clamping assembly.

[0015] At the same time, the clamping assembly includes a protrusion, a clamping groove, a fixed ball and a ball-shaped groove, and the protrusion is respectively arranged at the top of the screw rod 1 and the bottom of the screw rod 2, the ball-shaped groove is opened at the end of the screw rod 2, and the fixed ball is fixedly connected to the end of the screw rod 1. When the screw rod 1 is docked with the screw rod 2, the protrusions on the screw rod 1 and the screw rod 2 are clamped with the clamping groove, and the fixed ball at the end of the screw rod 1 is adsorbed in the ball-shaped groove of the screw rod 2, so that the docking of the screw rod 1 and the screw rod 2 is effectively realized.

[0016] As a more optimal solution of the present invention: the slots are respectively opened at the top of the first screw and the bottom of the second screw, the protrusions and the slots are fitted and engaged with each other, and the fixing balls and the ball-shaped slots are adsorbed on each other.

[0017] The beneficial effects of the present invention are:

[0018] 1. With the integrated heat dissipation module of the computer case, when the heat in the case gathers, it is conducted through the equally spaced side frames and concentrated on the top of the heat insulation board. At this time, the heat above the heat insulation board is conducted through the heat conduction coil, which not only solves the problem of poor heat dissipation effect caused by the compression of the heat dissipation space of the heat dissipation module in the traditional case, but also increases the area of ​​heat conduction, improves the heat dissipation efficiency, and avoids the problem of high local temperature caused by heat gathering.

[0019] 2. The integrated heat dissipation module of the computer case, when the heat above the heat insulation board is conducted by the W-shaped copper tubes arranged at equal distances, the heat will be conducted by water pipes 1 and 2. At the same time, the heat inside and outside the W-shaped copper tubes is absorbed by water pipes 1 and 2, which effectively promotes the heat dissipation effect in the case and ensures the rapid conduction of heat.

[0020] 3. The integrated heat dissipation module of the computer case drives the arc frame to swing left and right through the swing mechanism, and the microfiber cloth on one side of the arc frame can effectively adsorb the heat dissipation net to prevent the heat dissipation net on the side of the case from adsorbing dust when the case is working, thereby ensuring the circulation and dissipation of heat in the case, preventing the case from working for a long time and the pores of the heat dissipation net being blocked by dust, and promoting smooth heat conduction.

[0021] 4. The integrated heat dissipation module of the computer case starts the servo motor to drive the second screw to rotate. The rotating second screw synchronously drives the first screw to rotate. At this time, the Z-shaped guide rods on the circumference of the first screw and the second screw move in relative directions. At this time, the swing rod on the circumference of the second screw drives the Z-shaped guide rod at its end downward, and the swing rod on the circumference of the first screw drives the Z-shaped guide rod at its end upward, thereby driving the connecting rod to rotate around the rotating axis by a certain angle, so that the adsorption component on the connecting rod is attached to the heat dissipation net, which promotes the microfiber cloth to adsorb dust on the heat dissipation net, effectively ensures the removal of dust on the heat dissipation net, and ensures the working quality of the heat dissipation net.

[0022] 5. The integrated heat dissipation module of the computer case, when the screw rod 1 is docked with the screw rod 2, the protrusions on the screw rod 1 and the screw rod 2 are engaged with the card slot, and the fixing ball at the end of the screw rod 1 is adsorbed in the ball groove of the screw rod 2, thereby effectively realizing the docking of the screw rod 1 and the screw rod 2, which not only effectively promotes the connection and fixation of the screw rod 1 and the screw rod 2 and ensures the synchronization of the rotation of the two, but also facilitates the loading, unloading and replacement of the screw rod 1 and the screw rod 2. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the main structure of the integrated heat dissipation module for a computer case proposed by the present invention;

[0024] Figure 2 This is a side structural schematic diagram of the integrated heat dissipation module for a computer case proposed by the present invention;

[0025] Figure 3 This is a top view structural schematic diagram of the integrated heat dissipation module for a computer case proposed by the present invention;

[0026] Figure 4 This is a structural schematic diagram of the swing mechanism in the integrated heat dissipation module of the computer case proposed by the present invention;

[0027] Figure 5It is a partial structural schematic diagram of the swing mechanism in the integrated heat dissipation module of the computer case proposed by the present invention;

[0028] Figure 6 This is a schematic diagram of the structure of the heat dissipation component in the integrated heat dissipation module of the computer case proposed by the present invention;

[0029] Figure 7 This is a schematic diagram of the structure of the heat-conducting coil in the integrated heat dissipation module of the computer case proposed by the present invention;

[0030] Figure 8 The present invention is a schematic cross-sectional structural diagram of the joint between screw 1 and screw 2 in the integrated heat dissipation module of a computer case.

[0031] In the figure: 1. mounting plate; 2. fixing screws; 3. adsorption assembly; 4. heat dissipation assembly; 5. swing mechanism; 6. connecting sleeve; 7. heat conducting coil; 8. temperature sensor; 301. arc frame; 302. microfiber cloth; 303. groove; 304. card hole; 401. fixing frame; 402. heat insulation board; 403. side frame; 404. W-shaped copper tube; 405. top frame; 406. slot; 501. shaft; 502. fixing seat; 503. screw rod 1; 504. Z-shaped guide rod; 505. swing rod; 506. screw rod 2; 507. servo motor; 508. connecting rod; 509. card convex; 510. protrusion; 511. card slot; 512. fixing ball; 513. ball groove; 701. water pipe 1; 702. water pipe 2. DETAILED DESCRIPTION

[0032] The technical solution of the present invention is further described in detail below in conjunction with specific implementation methods.

[0033] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0034] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set" should be understood in a broad sense, for example, they can be fixedly connected or set, or detachably connected or set, or integrally connected or set. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] Embodiment 1:

[0037] Computer case integrated cooling module, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 As shown in, it includes a mounting plate 1 fixed to the inner cavity of the chassis, a swing mechanism 5 is arranged on the top of the mounting plate 1, and an adsorption component 3 is clamped at the end of the swing mechanism 5, a heat dissipation component 4 is arranged on the top of the swing mechanism 5, and a heat-conducting coil 7 is wound inside and outside the heat dissipation component 4, and fixing screws 2 are threadedly connected to the four corners of the top of the mounting plate 1.

[0038] In order to solve the problem that the heat dissipation space of the heat dissipation module in the traditional chassis is compressed, resulting in poor heat dissipation effect; Figure 6 and Figure 7 As shown, the heat dissipation component 4 includes a fixing frame 401, a heat insulation board 402, a side frame 403, a W-shaped copper tube 404, a top frame 405 and a slot 406, and the two fixing frames 401 are connected to the inner wall of the chassis by bolts, the slots 406 are opened at four corners of the opposite sides of the two fixing frames 401, the W-shaped copper tube 404 is plugged into the inside of the slot 406, and the side frames 403 are welded to the outer surface of the W-shaped copper tube 404 in sequence and at equal distances, and the top frame 405 is welded to the top of the side frame 403, the heat insulation board 402 is interference-connected to the middle of the bottom of the fixing frame 401, and the top outer walls of the two fixing frames 401 are respectively fixed with temperature sensors 8 by bolts, and the model of the temperature sensor 8 is MAX31865; the temperature in the chassis can be sensed by the two temperature sensors 8, and the temperature signal is transmitted to the control system of the chassis;

[0039] When the heat in the chassis gathers, it is conducted through the equidistantly arranged side frames 403 and concentrated on the top of the insulation board 402. At this time, the heat above the insulation board 402 is conducted through the heat-conducting coil 7. Not only can the problem of the heat dissipation space of the heat dissipation module in the traditional chassis being compressed, resulting in poor heat dissipation effect, but also the heat conduction area is increased, the heat dissipation efficiency is improved, and the problem of high local temperature caused by heat gathering is avoided.

[0040] The heat conducting coil 7 includes a water pipe 1 701 and a water pipe 2 702, and the inner sides of the water pipe 1 701 and the inner sides of the water pipe 2 702 pass through the W-shaped copper tubes 404 arranged at equal intervals, and the water pipe 1 701 and the water pipe 2 702 are integrally formed, and the water inlet ends of the water pipe 1 701 and the water pipe 2 702 are connected and fixed by a connecting sleeve 6;

[0041] When the heat above the insulation board 402 is conducted by the W-shaped copper tubes 404 arranged at equal distances, the heat will be conducted by water pipe 1 701 and water pipe 2 702. At the same time, the heat inside and outside the W-shaped copper tube 404 is absorbed by water pipe 1 701 and water pipe 2 702, which effectively promotes the heat dissipation effect in the chassis and ensures the rapid conduction of heat.

[0042] In order to adsorb the heat dissipation net on the side of the chassis during heat conduction to ensure the heat dissipation quality; Figure 2 , Figure 3 , Figure 5 As shown, the adsorption assembly 3 includes an arc frame 301, a microfiber cloth 302, a groove 303 and a clamping hole 304, and the arc frame 301 is clamped to the swing end of the swing mechanism 5 through the clamping hole 304, the groove 303 is opened inside the arc frame 301, the clamping hole 304 is opened on both sides of the bottom inner wall of the groove 303, and the microfiber cloth 302 is fixedly connected to the side of the arc frame 301;

[0043] The arc frame 301 is driven to swing left and right through the swing mechanism 5, and the microfiber cloth 302 on one side of the arc frame 301 can effectively adsorb the heat dissipation net, so as to avoid the heat dissipation net on the side of the chassis adsorbing dust when the chassis is working, thereby ensuring the circulation and dissipation of heat in the chassis, preventing the problem of the heat dissipation net pores being blocked by dust when the chassis works for a long time, and promoting smooth heat conduction.

[0044] In this embodiment, when the heat in the chassis gathers, it is conducted through the equidistantly arranged side frames 403 and concentrated on the top of the heat insulation board 402. At this time, the heat above the heat insulation board 402 is conducted through the heat conduction coil 7. During this period, the heat above the heat insulation board 402 will be conducted by the water pipe 1 701 and the water pipe 2 702. At the same time, the heat inside and outside the W-shaped copper tube 404 is absorbed by the water pipe 1 701 and the water pipe 2 702. In this process, the arc frame 301 is driven to swing left and right through the swing mechanism 5, and the microfiber cloth 302 on one side of the arc frame 301 can effectively adsorb the heat dissipation net, thereby preventing the heat dissipation net on the side of the chassis from adsorbing dust when the chassis is working.

[0045] Embodiment 2:

[0046] Computer case integrated cooling module, such as Figure 2 , Figure 4 , Figure 5 , Figure 8As shown, in order to effectively adsorb the heat dissipation net and ensure the working quality of the heat dissipation net; the swing mechanism 5 includes a rotating shaft 501, a fixing seat 502, a screw rod 1 503, a Z-shaped guide rod 504, a swing rod 505, a screw rod 2 506, a servo motor 507, a connecting rod 508 and a clamping protrusion 509, and the fixing seat 502 is fixedly connected to the top two sides of the mounting plate 1, the screw rod 1 503 and the screw rod 2 506 are rotatably connected to the inside of the two fixing seats 502 through bearings, and the servo motor 507 is fixedly connected to one side of the top of the mounting plate 1 by bolts, and the output end of the servo motor 507 is connected to the end of the screw rod 2 506 through a thread, and the two Z-shaped guide rods 504 are respectively sleeved on the circumference of the screw rod 1 503 and the screw rod 2 506, and the two Z-shaped guide rods 504 are centrally symmetrical, and the two swing rods 505 are rotatably connected to the ends of the two Z-shaped guide rods 504;

[0047] The rotating shaft 501 is rotatably connected to one side of the top of the mounting plate 1, the connecting rod 508 is connected to the top circumference of the rotating shaft 501 by threads, the two ends of the connecting rod 508 are rotatably matched with the ends of the two swing rods 505, the clamping protrusion 509 is fixedly connected to the two sides of the top of the connecting rod 508, and the clamping protrusion 509 and the clamping hole 304 are interference connected with each other, the screw rod 1 503 and the screw rod 2 506 are connected by a clamping assembly, and the model of the servo motor 507 is SG90;

[0048] By starting the servo motor 507 to drive the screw rod 2 506 to rotate, the rotating screw rod 2 506 synchronously drives the screw rod 1 503 to rotate. At this time, the Z-shaped guide rod 504 located on the circumference of the screw rod 1 503 and the screw rod 2 506 moves in relative directions. At this time, the swing rod 505 located on the circumference of the screw rod 2 506 drives the Z-shaped guide rod 504 at its end downward, and the swing rod 505 located on the circumference of the screw rod 1 503 drives the Z-shaped guide rod 504 at its end upward, thereby driving the connecting rod 508 to rotate around the rotating shaft 501 by a certain angle, so that the adsorption component 3 on the connecting rod 508 is attached to the heat dissipation net, which promotes the microfiber cloth 302 to adsorb dust on the heat dissipation net, effectively ensuring the removal of dust on the heat dissipation net and ensuring the working quality of the heat dissipation net.

[0049] The clamping assembly includes a protrusion 510, a clamping groove 511, a fixing ball 512 and a ball-shaped groove 513, and the protrusion 510 is respectively arranged at the top of the first screw 503 and the bottom of the second screw 506, the ball-shaped groove 513 is opened at the end of the second screw 506, the fixing ball 512 is fixedly connected to the end of the first screw 503, and the clamping groove 511 is respectively opened at the top of the first screw 503 and the bottom of the second screw 506, the protrusion 510 and the clamping groove 511 are mutually fitted and clamped, and the fixing ball 512 and the ball-shaped groove 513 are mutually adsorbed;

[0050] When screw rod 1 503 is docked with screw rod 2 506 , the protrusions 510 on screw rod 1 503 and screw rod 2 506 are engaged with the slots 511 , and the fixing balls 512 at the ends of screw rod 1 503 are adsorbed in the spherical slots 513 of screw rod 2 506 , thereby effectively achieving the docking of screw rod 1 503 and screw rod 2 506 . This not only effectively promotes the connection and fixation of screw rod 1 503 and screw rod 2 506 , ensuring the synchronous rotation of the two, but also facilitates the loading, unloading and replacement of screw rod 1 503 and screw rod 2 506 .

[0051] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A computer case integrated heat dissipation module, comprising a mounting plate (1) fixed to an inner cavity of the case, characterized in that: A swing mechanism (5) is arranged on the top of the mounting plate (1), and an adsorption assembly (3) is clamped at the end of the swing mechanism (5), a heat dissipation assembly (4) is arranged on the top of the swing mechanism (5), and a heat conduction coil (7) is wound inside and outside the heat dissipation assembly (4), and fixing screws (2) are arranged at the four corners of the top of the mounting plate (1).

2. The computer case integrated heat dissipation module according to claim 1, characterized in that: The heat dissipation assembly (4) comprises a fixing frame (401), a heat insulation board (402), a side frame (403), a W-shaped copper tube (404), a top frame (405) and a slot (406), wherein the two fixing frames (401) are connected to the inner wall of the chassis by bolts, the slots (406) are arranged at four corners on opposite sides of the two fixing frames (401), the W-shaped copper tube (404) is plugged into the inside of the slot (406), and the side frames (403) are welded to the outer surface of the W-shaped copper tube (404) in sequence and at equal distances.

3. The computer case integrated heat dissipation module according to claim 2, characterized in that: The top frame (405) is welded to the top of the side frame (403), the heat insulation board (402) is interference-connected to the middle of the bottom of the fixed frame (401), and the top outer walls of the two fixed frames (401) are respectively provided with temperature sensors (8).

4. The computer case integrated heat dissipation module according to claim 1, characterized in that: The heat-conducting coil (7) comprises a water pipe 1 (701) and a water pipe 2 (702), and the inner sides of the water pipe 1 (701) and the water pipe 2 (702) pass through the interior of W-shaped copper pipes (404) arranged at equal intervals, and the water pipe 1 (701) and the water pipe 2 (702) are integrally formed, and the water inlet ends of the water pipe 1 (701) and the water pipe 2 (702) are connected and fixed by a connecting sleeve (6).

5. The computer case integrated heat dissipation module according to claim 1, characterized in that: The adsorption component (3) comprises an arc frame (301), a microfiber cloth (302), a groove (303) and a clamping hole (304), wherein the arc frame (301) is clamped to the swing end of the swing mechanism (5) through the clamping hole (304), the groove (303) is arranged inside the arc frame (301), the clamping hole (304) is arranged on both sides of the bottom inner wall of the groove (303), and the microfiber cloth (302) is fixedly connected to the side of the arc frame (301).

6. The computer case integrated heat dissipation module according to claim 1, characterized in that: The swing mechanism (5) comprises a rotating shaft (501), a fixing seat (502), a screw rod 1 (503), a Z-shaped guide rod (504), a swing rod (505), a screw rod 2 (506), a servo motor (507), a connecting rod (508) and a clamping protrusion (509), wherein the fixing seat (502) is fixedly connected to both sides of the top of the mounting plate (1), the screw rod 1 (503) and the screw rod 2 (506) are rotatably connected to the inside of the two fixing seats (502) through bearings, and the servo motor (507) is fixedly connected to one side of the top of the mounting plate (1) through bolts.

7. The computer case integrated heat dissipation module according to claim 6, characterized in that: The output end of the servo motor (507) is connected to the end of the second screw rod (506) through a thread, and the two Z-shaped guide rods (504) are respectively sleeved on the circumference of the first screw rod (503) and the second screw rod (506), the two Z-shaped guide rods (504) are centrally symmetrical, and the two swing rods (505) are rotatably connected to the ends of the two Z-shaped guide rods (504).

8. The computer case integrated heat dissipation module according to claim 6, characterized in that: The rotating shaft (501) is rotatably connected to one side of the top of the mounting plate (1); the connecting rod (508) is arranged on the top circumference of the rotating shaft (501); the two ends of the connecting rod (508) are rotatably matched with the ends of the two swing rods (505); the clamping protrusion (509) is fixedly connected to the two sides of the top of the connecting rod (508); the clamping protrusion (509) and the clamping hole (304) are interference-connected with each other; the screw rod 1 (503) and the screw rod 2 (506) are connected via a clamping assembly.

9. The computer case integrated heat dissipation module according to claim 8, characterized in that: The snap-fit ​​assembly comprises a protrusion (510), a slot (511), a fixing ball (512) and a ball-shaped slot (513), wherein the protrusion (510) is respectively arranged at the top of the first screw rod (503) and the bottom of the second screw rod (506), the ball-shaped slot (513) is opened at the end of the second screw rod (506), and the fixing ball (512) is fixedly connected to the end of the first screw rod (503).

10. The computer case integrated heat dissipation module according to claim 9, characterized in that: The clamping groove (511) is respectively opened at the top of the first screw rod (503) and the bottom of the second screw rod (506), the protrusion (510) and the clamping groove (511) are mutually fitted and clamped, and the fixing ball (512) and the ball groove (513) are mutually adsorbed.

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