A fully automatic semiconductor cleaning equipment

Abstract

The present invention belongs to the field of semiconductor processing technology, and discloses a fully automatic semiconductor cleaning device, including a workbench, the inner wall of the workbench is installed with a support frame, the left and right sides of the inner wall of the workbench are rotatably installed with support rollers, the outer surface of the support roller is movably sleeved with a conveyor belt, the front of the workbench is installed with a motor, the output shaft of the motor is transmission-connected with the support roller, and the outer surface of the conveyor belt is provided with a plurality of groups of horizontally equidistantly distributed adapter grooves, and the adapter grooves penetrate downward to the top of the support frame. The device redesigns the cleaning component so that the top of the sealing column and the second drain port move to the top of the wafer, and through the inclined design of the first drain port and the second drain port, the chemical agent is sprayed onto the surface of the wafer without dead angles, thereby achieving one-time operation and comprehensive cleaning, thereby eliminating the steps of turning over and switching workstations, and significantly improving the working efficiency of the device.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a fully automatic semiconductor cleaning device. Background Art

[0002] Semiconductor refers to a material with electrical conductivity between that of a conductor and an insulator at room temperature. It is used in integrated circuits, consumer electronics, photovoltaic power generation and other fields. In semiconductor manufacturing, cleaning operations are carried out throughout the entire process to ensure the yield rate. Since the wafer needs to undergo etching, photolithography and other steps during the processing, multiple groups of groove structures are left on its surface to form a circuit. During this period, pollutants and particles are left on the surface of the wafer, which can easily cause a short circuit or damage to the circuit on the surface of the wafer. Therefore, in the prior art, for wafers with high precision requirements, chemical agents are generally sprayed on the surface of the wafer to remove pollutants and particles on the surface, and the flowing chemical agents are used to drive the mixed liquid after the reaction to leave the surface of the wafer to achieve cleaning. However, the spraying method requires the wafers to be operated one by one, and in the prior art, the wafers are often transferred by a robot arm, which is not as efficient as the traditional immersion method (multiple groups of wafers are placed vertically in parallel and immersed in chemical agents, but the method has low precision). In addition, each cleaning operation can only cover one side of the wafer, and an additional flipping operation is required, which further reduces the cleaning efficiency of the device, so it is urgent to solve it. Summary of the invention

[0003] The object of the present invention is to provide a fully automatic semiconductor cleaning equipment to solve the problems raised in the above background technology.

[0004] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a fully automatic semiconductor cleaning equipment, comprising a workbench, a support frame is installed on the inner wall of the workbench, support rollers are rotatably installed on the left and right sides of the inner wall of the workbench, a conveyor belt is movably sleeved on the outer surface of the support roller, a motor is installed on the front of the workbench, the output shaft of the motor is drivingly connected to the support roller, a plurality of groups of horizontally equidistantly distributed adapter grooves are provided on the outer surface of the conveyor belt, the adapter grooves penetrate downward to the top of the support frame, and a plurality of groups of horizontally equidistantly distributed cleaning components are installed on the inner wall of the support frame;

[0005] The cleaning assembly includes a telescopic rod installed at the bottom of the inner wall of the support frame, a No. 2 pump and a liquid storage tank, the telescopic end of the telescopic rod is fixedly connected to a support plate, a transfer groove is fixedly installed at the bottom of the support plate, a connecting pipe is installed between the transfer groove and the No. 2 pump, a plurality of support columns are equidistantly installed on the top circumference of the support plate, the support columns are adapted to be engaged in the adapting groove, a No. 1 cavity, a support groove 1 and a support groove 2 are sequentially provided on the top of the support column along the radial line of the support plate, a No. 3 cavity is provided on one side of the support column close to the axis of the support plate, and a connecting groove is provided between the No. 3 cavity and the No. 1 cavity, a No. 2 cavity is provided at the bottom of the No. 1 cavity, a plurality of groups of drainage ports 1 connected to the No. 3 cavity are provided on the inner side surface of the support column, the internal sealing sleeves of the No. 1 cavity and the No. 2 cavity are provided with sealing columns, the outer surface of the sealing column is provided with a plurality of groups of drainage ports 2, the outer surface of the sealing column is movably sleeved with a spring located inside the No. 2 cavity, and the two ends of the spring are elastically connected to the No. 2 cavity and the sealing column respectively.

[0006] As a preferred solution of the present invention, the top of the workbench is fixedly installed with brackets whose number is equal to the cleaning components, the inner side of the bracket is fixedly installed with a protective cylinder, the top of the protective cylinder is fixedly installed with a No. 1 pump, the interior of the protective cylinder is provided with a placement cavity, the top of the inner wall of the protective cylinder is provided with a plurality of groups of drain outlets 1, and the inner wall of the protective cylinder is provided with a plurality of groups of drain outlets 2 located below the drain outlets 1.

[0007] As a preferred solution of the present invention, the cross-sectional shape of the support frame is rectangular, the upper and lower sides of the support frame are respectively abutted against the upper and lower sides of the inner side of the conveyor belt, the front and rear sides of the support frame are fixedly connected to the workbench, the support column passes through the top of the support frame, and in the initial state, the top of the support column is retracted downward to below the conveyor belt.

[0008] As a preferred solution of the present invention, the cross-sectional shape of the transfer trough is "U"-shaped, the top of the transfer trough is connected to the third cavity, and the connecting pipe is made of a corrugated pipe.

[0009] As a preferred solution of the present invention, the number of the adapting slots in each group is four, the number of the supporting columns in a group of the cleaning components is four, and the supporting columns and the transfer slots are distributed in a mutually adaptable manner.

[0010] As a preferred solution of the present invention, the drainage port 1 is arranged in three groups and are vertically equidistantly distributed along the inner side surface of the support column, the drainage port 2 is arranged in three groups and are vertically equidistantly distributed along the inner side surface of the sealing column, the axes of the drainage port 2 are inclined downward toward the axis of the support plate, and the axes of the support column are inclined upward toward the axis of the support plate.

[0011] As a preferred solution of the present invention, the axes of the first discharge port located at different heights are not parallel to each other, and the axes of the second discharge port located at different heights are not parallel to each other.

[0012] As a preferred solution of the present invention, the support groove 1 is higher than the support groove 2 and is farther away from the axis of the support plate than the support groove 2, and the horizontal portion of the inner wall of the support groove 1 and the horizontal portion of the inner wall of the support groove 2 are distributed in concentric circles.

[0013] The beneficial effects of the present invention are as follows:

[0014] 1. The cleaning component of the device is redesigned. Under the support of the support frame, it cooperates with the conveyor belt to realize the function of synchronously cleaning both sides of the wafer at one time, so that the working efficiency of the device is doubled. By installing multiple sets of cleaning components on the inner wall of the support frame, the number of wafers that can be processed simultaneously by the device each time is equal to the number of cleaning components. By providing a telescopic rod to connect the support plate and multiple sets of support columns located on the upper surface of the support plate, the support column is driven to move upward, so that the support column supports the wafer located on the surface of the conveyor belt through the adapter groove. When the support column moves to the highest position, the drainage port 1 opened on the inner side thereof is all moved to the top of the conveyor belt, and the chemical agent in the liquid storage tank is pumped into the drainage port 1 by the second pump. The high-pressure chemical agent pushes the sealing column upward and compresses the spring, so that the top of the sealing column and the drainage port 2 move to the top of the wafer, and the chemical agent is sprayed onto the surface of the wafer without dead angles through the inclined design of the drainage port 1 and the drainage port 2, so as to realize one-time operation and comprehensive cleaning, thereby eliminating the steps of turning over and changing workstations, and significantly improving the working efficiency of the device.

[0015] 2. The device is also designed with multiple sets of protective cylinders located on the top of the workbench, so as to provide protection and flushing functions for the cleaning components. By providing a protective cylinder and covering the top of the wafer, when the drain port 1 and the drain port 2 spray high-pressure chemicals outward, the inner wall of the protective cylinder is used for protection to prevent the chemicals from splashing and corroding the surrounding structures. In addition, by opening the drain port 1 and the drain port 2 on the inner side of the protective cylinder, the top and the periphery of the wafer can be fully re-washed by pure water, realizing the flushing function without dead angles, and can flush away the chemical residues that fall on the surface of the conveyor belt, ensuring a clean environment on the surface of the conveyor belt.

[0016] 3. In the redesigned cleaning component of the present device, further support adaptation is carried out on the support column used to support the wafer. When facing wafers of different sizes, support groove 1 and support groove 2 are provided on the surface of the support column, so that when the four groups of support columns are evenly distributed around the axis of the support plate, support groove 1 and support groove 2 can automatically adapt to wafers of different sizes without moving along the radial line of the support plate, thereby enhancing the applicability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a front perspective schematic diagram of the overall structure of the present invention;

[0018] Figure 2 It is a front cutaway schematic diagram of the overall structure of the present invention;

[0019] Figure 3 For the present invention Figure 2 A magnified schematic diagram of the structure at center A;

[0020] Figure 4 This is a schematic diagram of the distribution position of the cleaning components of the present invention in the conveyor belt;

[0021] Figure 5 For the present invention Figure 4 A magnified schematic diagram of the structure at B in the middle;

[0022] Figure 6 It is a schematic diagram of the separation of the cleaning component of the present invention;

[0023] Figure 7 It is a schematic diagram of the structure of the support, the protective tube and the No. 1 pump of the present invention;

[0024] Figure 8 It is a schematic diagram of the internal section of the support column and the sealing column of the present invention.

[0025] In the figure: 1. workbench; 2. support roller; 3. conveyor belt; 4. adapter groove; 5. motor; 6. support frame; 7. bracket; 8. protective cylinder; 9. pump No. 1; 10. placement cavity; 11. drain outlet 1; 12. drain outlet 2; 13. telescopic rod; 14. support plate; 15. transfer groove; 16. connecting pipe; 17. pump No. 2; 18. liquid storage tank; 19. support column; 20. connecting groove; 21. drain outlet 1; 22. cavity No. 1; 23. cavity No. 2; 24. sealing column; 25. drain outlet 2; 26. spring; 27. cavity No. 3; 28. support groove 1; 29. ​​support groove 2. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] like Figures 1 to 8As shown, an embodiment of the present invention provides a fully automatic semiconductor cleaning device, comprising a workbench 1, a support frame 6 is installed on the inner wall of the workbench 1, support rollers 2 are rotatably installed on both sides of the inner wall of the workbench 1, a conveyor belt 3 is movably sleeved on the outer surface of the support roller 2, a motor 5 is installed on the front of the workbench 1, the output shaft of the motor 5 is transmission-connected with the support roller 2, a plurality of groups of horizontally equidistantly distributed adapter grooves 4 are provided on the outer surface of the conveyor belt 3, the adapter grooves 4 penetrate downward to the top of the support frame 6, and a plurality of groups of horizontally equidistantly distributed cleaning components are installed on the inner wall of the support frame 6;

[0028] The cleaning assembly includes a telescopic rod 13, a second pump 17 and a liquid storage tank 18 installed at the bottom of the inner wall of the support frame 6. The telescopic end of the telescopic rod 13 is fixedly connected to a support plate 14. A transfer tank 15 is fixedly installed at the bottom of the support plate 14. A connecting pipe 16 is installed between the transfer tank 15 and the second pump 17. A plurality of support columns 19 are equidistantly installed on the top circumference of the support plate 14. The support columns 19 are adapted to fit in the adaption groove 4. The top of the support column 19 is provided with a first cavity 22, a support groove 1 28 and a support groove 2 29 in sequence along the radial line of the support plate 14. The inside of the support column 19 is close to the support A No. 3 cavity 27 is provided on one side of the axis of the support plate 14, and a connecting groove 20 is provided between the No. 3 cavity 27 and the No. 1 cavity 22, a No. 2 cavity 23 is provided at the bottom of the No. 1 cavity 22, and a plurality of groups of drainage ports 1 21 connected to the No. 3 cavity 27 are provided on the inner side of the support column 19, and a sealing column 24 is provided in the inner sealing sleeve of the No. 1 cavity 22 and the No. 2 cavity 23, and a plurality of groups of drainage ports 2 25 are provided on the outer surface of the sealing column 24, and a spring 26 located inside the No. 2 cavity 23 is movably sleeved on the outer surface of the sealing column 24, and the two ends of the spring 26 are elastically connected to the No. 2 cavity 23 and the sealing column 24 respectively;

[0029] The cleaning component of the device is redesigned. Under the support of the support frame 6, it cooperates with the conveyor belt 3 to realize the function of synchronously cleaning both sides of the wafer at one time, so that the working efficiency of the device is doubled. By installing multiple groups of cleaning components on the inner wall of the support frame 6, the number of wafers that can be processed simultaneously by the device each time is equal to the number of cleaning components. By providing a telescopic rod 13 to connect the support plate 14 and multiple groups of support columns 19 located on the upper surface of the support plate 14, the support columns 19 are driven to move upward, so that the support columns 19 support the wafers located on the surface of the conveyor belt 3 through the adapter groove 4. When the support columns 19 move to the highest position When the wafer is in the state of being moved, the drain port 121 opened on the inner side thereof is all moved to the top of the conveyor belt 3, and the chemical agent in the liquid storage tank 18 is pumped into the drain port 121 by the second pump 17. The high-pressure chemical agent pushes the sealing column 24 upward and compresses the spring 26, so that the top of the sealing column 24 and the drain port 225 move to the top of the wafer, and through the inclined design of the drain port 121 and the drain port 225, the chemical agent is sprayed onto the surface of the wafer without dead angles, thereby realizing one-time operation and comprehensive cleaning, thereby eliminating the steps of turning over and changing workstations, and significantly improving the working efficiency of the device.

[0030] Among them, the top of the workbench 1 is fixedly installed with a number of brackets 7 equal to the number of cleaning components, the inner side of the bracket 7 is fixedly installed with a protective cylinder 8, the top of the protective cylinder 8 is fixedly installed with a No. 1 pump 9, the inside of the protective cylinder 8 is provided with a placement cavity 10, the top of the inner wall of the protective cylinder 8 is provided with a plurality of groups of drainage ports 11, and the inner wall of the protective cylinder 8 is provided with a plurality of groups of drainage ports 2 12 located below the drainage ports 11;

[0031] The device is also designed with multiple groups of protective cylinders 8 located on the top of the workbench 1, so as to provide protection and flushing functions for the cleaning components. By providing the protective cylinder 8 and covering the top of the wafer, when the drain port 1 21 and the drain port 2 25 spray high-pressure chemicals outward, the inner wall of the protective cylinder 8 is used for protection to prevent the chemicals from splashing and corroding the surrounding structures. In addition, by opening the drain port 1 11 and the drain port 2 12 on the inner side of the protective cylinder 8, the top and the periphery of the wafer can be fully re-washed by pure water, realizing the flushing function without dead angles, and can flush away the chemical residues that fall on the surface of the conveyor belt 3, ensuring a clean environment on the surface of the conveyor belt 3.

[0032] The cross-sectional shape of the support frame 6 is rectangular, the upper and lower sides of the support frame 6 are respectively in contact with the upper and lower sides of the inner side of the conveyor belt 3, the front and rear sides of the support frame 6 are fixedly connected to the workbench 1, and the support column 19 passes through the top of the support frame 6. In the initial state, the top of the support column 19 is retracted downward to the bottom of the conveyor belt 3;

[0033] Pump No. 1 9 is used to provide rigid support for the upper surface of the conveyor belt 3. In the initial state, the conveyor belt 3 needs to rotate, so the top of the support column 19 needs to retract downward into the support frame 6 to prevent the conveyor belt 3 from being stuck during movement.

[0034] The cross-section of the transfer tank 15 is in a "U" shape, the top of the transfer tank 15 is connected to the third chamber 27, and the connecting pipe 16 is made of a corrugated pipe;

[0035] The transfer tank 15 is used to connect the connecting pipe 16 and the bottom openings of the multiple groups of support columns 19, so as to facilitate the chemicals in the liquid storage tank 18 to enter the third chamber 27. The corrugated design of the connecting pipe 16 can facilitate the transfer tank 15 and the support plate 14 to move up and down freely.

[0036] There are four adapter slots 4 in each group, four support columns 19 in one cleaning assembly, and the support columns 19 and the transfer slots 15 are distributed in a mutually adaptive manner;

[0037] There are four adapter grooves 4 in each group, which are equidistantly distributed on the outside of the axis of the support plate 14. The adapter grooves 4 just match the support columns 19. The support columns 19 can penetrate the adapter grooves 4 during the upward movement and support the wafer, completing the preparation work of the wafer before formal cleaning.

[0038] The drain ports 1 21 are arranged in three groups and are vertically and equidistantly distributed along the inner side of the support column 19. The drain ports 25 are arranged in three groups and are vertically and equidistantly distributed along the inner side of the sealing column 24. The axes of the drain ports 25 are all inclined downward toward the axis of the support plate 14, and the axes of the support columns 19 are all inclined upward toward the axis of the support plate 14.

[0039] The inclination directions of drain port 1 21 and drain port 2 25 are just opposite. The purpose of this design is to ensure that both the upper and lower surfaces of the wafer can receive the high-pressure chemical jet, so that when the chemical reaction consumes pollutants and particles, it can also produce a certain flushing effect on the wafer surface.

[0040] The axes of the first discharge port 21 at different heights are not parallel to each other, and the axes of the second discharge port 25 at different heights are not parallel to each other;

[0041] The drain port 1 21 and the drain port 2 25 are at different heights and their axes are not parallel to each other. Such a design enables the chemical agent jet to fully cover the surface of the wafer.

[0042] Among them, the support groove 1 28 is higher than the support groove 29 and is further away from the axis of the support plate 14 than the support groove 29. The horizontal part of the inner wall of the support groove 1 28 and the horizontal part of the inner wall of the support groove 2 29 are distributed in concentric circles.

[0043] In the redesigned cleaning component of the present device, further support adaptation is carried out on the support column 19 for supporting the wafer. When facing wafers of different sizes, support groove 1 28 and support groove 2 29 are provided on the surface of the support column 19. Therefore, when the four groups of support columns 19 are evenly distributed around the circumference of the axis of the support plate 14, the support groove 1 28 and support groove 2 29 can automatically adapt to wafers of different sizes without moving along the radial line of the support plate 14, thereby enhancing the applicability of the device.

[0044] Working principle:

[0045] First, start the motor 5, and drive the support roller 2 and the adapter slot 4 to rotate, so that the transport direction of the top of the conveyor belt 3 is from right to left. The robot arm places the wafer on the surface of the conveyor belt 3, so that the conveyor belt 3 placed each time is just located in the middle of each group of adapter slots 4. When the top of the conveyor belt 3 is filled with three groups of adapter slots 4 and all move to the position corresponding to the cleaning component, turn off the motor 5 and the conveyor belt 3, so that the wafer is in a static state, and prepare to start the cleaning mode;

[0046] Then, the telescopic rod 13 is started, and the support plate 14, the transfer tank 15 and the support column 19 are driven to move up and down. The top of the support column 19 just passes through the support frame 6 and the conveyor belt 3, and the wafer is supported by the support groove 1 28 or the support groove 2 29 (depending on the size of the wafer, the larger size is supported by the support groove 1 28, and the smaller size is supported by the support groove 2 29), and the wafer is driven to move upward, so that all the drainage ports 1 21 opened on the surface of the support column 19 are moved to the top of the conveyor belt 3, and the No. 2 pump 17 is started, and the chemical agent in the liquid storage tank 18 is pumped into the No. 3 chamber 27 through the connecting pipe 16 transfer tank 15, and the chemical agent enters the No. 2 chamber 23 through the connecting groove 20, and quickly fills the inner cavity of the No. 2 chamber 23 and the No. 3 chamber 27, and is sealed. The column 24 moves upward under the push of the chemical agent and compresses the spring 26. At this time, the sealing column 24 moves upward and the second drainage port 25 opened on its surface moves all to the top of the support column 19. At this time, the cleaning mode is fully turned on, and the chemical agent is sprayed obliquely from the second drainage port 25 and the first drainage port 21 to the upper and lower surfaces of the wafer respectively, so that the chemical agent reacts with the pollutants on the surface of the wafer and consumes them. At the same time, the impact force generated by the chemical agent is used to wash away the particles on the surface of the wafer to complete the cleaning. The lower surface of the wafer automatically discharges the chemical agent and the liquid generated by the mixing consumption downward under the action of gravity. Since the liquid jets generated by the second drainage port 25 and the first drainage port 21 are in opposite directions, the pressure on the surface of the wafer is just offset to stabilize it.

[0047] Finally, turn off pump No. 2 17 and cut off the supply of chemicals, so that the sealing column 24 is reset by the resilience of the sealing column 24 when the hydraulic thrust is lost. At this time, the liquid inlet end of pump No. 1 9 is connected to pure water and pumped into the placement chamber 10, and then passes through drain port 1 11 and drain port 2 12 respectively, so as to rinse the wafer surface in multiple directions. Subsequently, start the telescopic rod 13 to drive the support plate 14 and the support column 19 downward to reset the wafer, so that the wafer falls back on the surface of the conveyor belt 3 and is automatically transported. It should be noted that the adapter slot 4 located at the top of the conveyor belt 3 can be expanded to no less than ten groups as needed, so that the device can process ten groups of wafers at a time.

[0048] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0049] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A fully automatic semiconductor cleaning device, comprising a workbench (1), the inner wall of the workbench (1) is provided with a support frame (6), support rollers (2) are rotatably provided on both sides of the inner wall of the workbench (1), a conveyor belt (3) is movably sleeved on the outer surface of the support roller (2), a motor (5) is provided on the front of the workbench (1), and the output shaft of the motor (5) is drivingly connected to the support roller (2), characterized in that: The outer surface of the conveyor belt (3) is provided with a plurality of groups of horizontally equidistantly distributed adapting grooves (4), the adapting grooves (4) extending downward to the top of the support frame (6), and the inner wall of the support frame (6) is provided with a plurality of groups of horizontally equidistantly distributed cleaning components; The cleaning assembly comprises a telescopic rod (13) installed at the bottom of the inner wall of the support frame (6), a second pump (17) and a liquid storage tank (18); the telescopic end of the telescopic rod (13) is fixedly connected to a support plate (14); a transfer tank (15) is fixedly installed at the bottom of the support plate (14); a connecting pipe (16) is installed between the transfer tank (15) and the second pump (17); a plurality of support columns (19) are equidistantly installed on the top circumference of the support plate (14); the support columns (19) are adapted to be engaged in the adaption groove (4); a first cavity (22), a support groove one (28) and a support groove two (29) are sequentially provided on the top of the support column (19) along the radial line of the support plate (14); the inside of the support column (19) is close to the first cavity (22); and a second cavity (29) is provided on the second cavity (29). A No. 3 cavity (27) is provided on one side of the axis of the support plate (14), and a connecting groove (20) is provided between the No. 3 cavity (27) and the No. 1 cavity (22). A No. 2 cavity (23) is provided at the bottom of the No. 1 cavity (22). The inner side surface of the support column (19) is provided with a plurality of drainage ports (21) connected with the No. 3 cavity (27). The inner sealing sleeves of the No. 1 cavity (22) and the No. 2 cavity (23) are provided with a sealing column (24). The outer surface of the sealing column (24) is provided with a plurality of drainage ports (25). The outer surface of the sealing column (24) is movably sleeved with a spring (26) located inside the No. 2 cavity (23), and the two ends of the spring (26) are elastically connected to the No. 2 cavity (23) and the sealing column (24) respectively.

2. The fully automatic semiconductor cleaning equipment according to claim 1, characterized in that: The top of the workbench (1) is fixedly mounted with brackets (7) whose number is equal to the number of cleaning components; the inner side of the bracket (7) is fixedly mounted with a protective tube (8); the top of the protective tube (8) is fixedly mounted with a No. 1 pump (9); a placement cavity (10) is provided inside the protective tube (8); the top of the inner wall of the protective tube (8) is provided with a plurality of groups of drainage ports 1 (11); the inner wall of the protective tube (8) is provided with a plurality of groups of drainage ports 2 (12) located below the drainage ports 1 (11).

3. The fully automatic semiconductor cleaning equipment according to claim 1, characterized in that: The cross-sectional shape of the support frame (6) is rectangular. The upper and lower sides of the support frame (6) are respectively in contact with the upper and lower sides of the inner side of the conveyor belt (3). The front and rear sides of the support frame (6) are fixedly connected to the workbench (1). The support column (19) passes through the top of the support frame (6). In the initial state, the top of the support column (19) is retracted downward to below the conveyor belt (3).

4. The fully automatic semiconductor cleaning equipment according to claim 3, characterized in that: The cross-sectional shape of the transfer trough (15) is "U"-shaped, the top of the transfer trough (15) is connected to the third chamber (27), and the connecting pipe (16) is made of a corrugated pipe.

5. The fully automatic semiconductor cleaning equipment according to claim 4, characterized in that: The number of the adapting slots (4) in each group is four, the number of the supporting columns (19) in a group of the cleaning components is four, and the supporting columns (19) and the transfer slots (15) are distributed in a mutually adaptable manner.

6. The fully automatic semiconductor cleaning equipment according to claim 5, characterized in that: The drainage ports 1 (21) are arranged in three groups and are vertically and equidistantly distributed along the inner side surface of the support column (19); the drainage ports 2 (25) are arranged in three groups and are vertically and equidistantly distributed along the inner side surface of the sealing column (24); the axes of the drainage ports 2 (25) are all inclined downwardly toward the axis of the support plate (14); and the axes of the support columns (19) are all inclined upwardly toward the axis of the support plate (14).

7. The fully automatic semiconductor cleaning equipment according to claim 6, characterized in that: The axes of the drainage ports 1 (21) located at different heights are not parallel to each other, and the axes of the drainage ports 2 (25) located at different heights are not parallel to each other.

8. The fully automatic semiconductor cleaning equipment according to claim 7, characterized in that: The support groove 1 (28) is higher than the support groove 2 (29) and is further away from the axis of the support plate (14) than the support groove 2 (29). The horizontal part of the inner wall of the support groove 1 (28) and the horizontal part of the inner wall of the support groove 2 (29) are distributed in concentric circles.

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