Microstrip-waveguide conversion structure, signal transmission device and communication equipment

Abstract

The embodiment of the invention discloses a microstrip-waveguide conversion structure, a signal transmission device and communication equipment. According to the technical scheme provided by the embodiment of the invention, the mounting base and the cover plate which are detachably connected are arranged, the waveguide through hole is formed in the mounting base, and the connecting port communicated with the first end of the waveguide through hole is formed in the mounting base, so that external equipment can be connected to the connecting port; a reflection cavity is formed in the side, corresponding to the second end of the waveguide through hole, of the cover plate, a boss which is used for configuring a transmission zero point position and is of a preset height is arranged in the reflection cavity of the cover plate, and transverse electromagnetic waves are output from the output end of the microstrip circuit board, excited and converted into transverse electromagnetic waves through the reflection cavity and then transmitted along the waveguide through hole. The boss in the reflection cavity can add a transmission zero point in signal transmission, out-of-band rejection of signal transmission can be effectively achieved, the position of the transmission zero point can be preset based on the preset height of the boss, debugging work does not need to be additionally introduced in the production link, and the production efficiency is improved. And the production cost can be greatly reduced while the equipment size is effectively reduced.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of satellite communication technology, and in particular to a microstrip-waveguide conversion structure, a signal transmission device and a communication device. Background Art

[0002] With the development and popularization of satellite communications, there are more and more low-wattage terminal users, and the size of products is getting smaller and smaller. The miniaturization and low cost of products will have a great impact on the application and promotion of products. With the increasingly mature high-gain power amplifier technology, in order to meet sufficient reception channel suppression, it is necessary to add a filter with high suppression on the reception channel after the power amplifier output.

[0003] At present, the scheme to obtain higher out-of-band suppression is mainly achieved by loading a resonant cavity on the output waveguide or loading a tuning screw on the output waveguide. Among them, the resonant cavity achieves the suppression effect by forming a bandpass filter on the output waveguide, but the processing of the resonant cavity is complicated, and the equipment size is large, which is not conducive to the miniaturization of low-power products. The tuning screw achieves out-of-band suppression by introducing a transmission zero point. However, due to the processing method, the position of the tuning screw cannot be solidified, which will introduce the debugging work of the tuning screw in the production process, greatly increasing the production cost of the product. Summary of the invention

[0004] The embodiments of the present invention provide a microstrip-waveguide conversion structure, a signal transmission device and a communication device to solve the technical problems of the large device size of the out-of-band suppression solution in the related art and the high production cost caused by the debugging work, and can reduce the production cost while effectively reducing the device size.

[0005] In a first aspect, an embodiment of the present invention provides a microstrip-waveguide conversion structure, comprising a detachably connected mounting base and a cover plate, wherein:

[0006] The mounting base is provided with a waveguide through hole, and the mounting base is provided with a connection port communicating with a first end of the waveguide through hole, and the connection port is used to connect an external device;

[0007] The cover plate is provided with a reflection cavity on one side corresponding to the second end of the waveguide through hole, and the cover plate is provided with a boss of a preset height for configuring a transmission zero point position in the reflection cavity;

[0008] The cover plate and the mounting base are used to connect a microstrip circuit board, and a signal output end of the microstrip circuit board is located at the second end of the waveguide through hole.

[0009] Furthermore, the mounting base is provided with an output first matching platform between the first end of the waveguide through hole and the connection port.

[0010] Furthermore, the waveguide through hole is an L-shaped through hole or an I-shaped through hole.

[0011] Furthermore, in the case where the waveguide through hole is an L-shaped through hole, the mounting base is provided with a second matching platform at a bending portion of the waveguide through hole.

[0012] Furthermore, the boss is provided in plurality, and different bosses correspond to different preset heights.

[0013] Furthermore, the mounting base is provided with a threaded hole, and the cover plate is provided with a first mounting through hole at a position corresponding to the threaded hole for a screw to pass through and connected to the threaded hole.

[0014] Furthermore, the microstrip circuit board includes a microstrip line and a dielectric substrate, the microstrip line is mounted on the dielectric substrate, and the microstrip line is located on a side of the dielectric substrate facing the cover plate.

[0015] Further, the metal outer skin of the portion of the dielectric substrate located in the waveguide through hole is milled off, or the portion of the dielectric substrate located in the waveguide through hole is hollowed out.

[0016] In a second aspect, an embodiment of the present invention provides a signal transmission device, comprising a microstrip-waveguide conversion structure as described in any one of the first aspects.

[0017] In a third aspect, an embodiment of the present invention provides a communication device, comprising the signal transmission device as described in the second aspect.

[0018] The embodiment of the present invention provides a detachably connected mounting base and a cover plate, wherein a waveguide through hole is provided in the mounting base, and a connection port connected to the first end of the waveguide through hole is provided in the mounting base, and an external device can be connected to the connection port; a reflection cavity is provided on the side of the cover plate corresponding to the second end of the waveguide through hole, and a boss of a preset height for configuring a transmission zero point position is provided in the reflection cavity of the cover plate; a transverse electromagnetic wave is output from the output end of the microstrip circuit board and converted into a transverse electromagnetic wave after being excited by the reflection cavity, and then transmitted along the waveguide through hole, and is sent to the external device through the connection port for transmission; and the boss in the reflection cavity can add a transmission zero point in the signal transmission, which can effectively realize out-of-band suppression of the signal transmission, and the transmission zero point position can be pre-set based on the preset height of the boss, and no additional debugging work needs to be introduced in the production link, which can effectively reduce the size of the equipment and greatly reduce the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a structural schematic diagram of a microstrip-waveguide conversion structure provided by an embodiment of the present invention;

[0020] Figure 2is a cross-sectional schematic diagram of a microstrip-waveguide conversion structure provided by an embodiment of the present invention;

[0021] Figure 3 is an exploded schematic diagram of a microstrip-waveguide conversion structure provided by an embodiment of the present invention;

[0022] Figure 4 is a structural schematic diagram of another microstrip-waveguide conversion structure provided by an embodiment of the present invention;

[0023] Figure 5 is a cross-sectional schematic diagram of another microstrip-waveguide conversion structure provided by an embodiment of the present invention;

[0024] Figure 6 is a frequency-amplitude relationship diagram of transverse electric wave transmission provided by an embodiment of the present invention;

[0025] Figure 7 It is a waveguide frequency-amplitude relationship diagram corresponding to a boss with different preset heights provided in this scheme;

[0026] Figure 8 It is a waveguide frequency-amplitude relationship diagram corresponding to bosses of different numbers and different preset heights provided in an embodiment of the present invention;

[0027] Fig. 9 is a principle block diagram of a signal transmission device provided by an embodiment of the present invention;

[0028] Fig.10 It is a principle block diagram of a communication device provided by an embodiment of the present invention.

[0029] Figure numerals: 1, mounting base; 2, cover plate; 3, waveguide through hole; 4, reflection cavity; 5, boss; 6, through groove; 7, first matching platform; 8, second matching platform; 9, threaded hole; 10, first mounting through hole; 11, screw; 12, microstrip circuit board; 121, microstrip line; 122, dielectric substrate; 123, second mounting through hole. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the present invention clearer, the specific embodiments of the present invention are further described in detail in conjunction with the accompanying drawings. It is understood that the specific embodiments described herein are only used to explain the present invention, not to limit the present invention. It should also be noted that, for the convenience of description, only the parts related to the present invention are shown in the accompanying drawings, not all of the contents. In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral whole; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] In the existing out-of-band suppression scheme, out-of-band suppression is achieved by loading a resonant cavity on the output waveguide to form a bandpass filter. Although the desired suppression effect can be obtained, the equipment processing method is complicated and the size is large, which is not conducive to the miniaturization and low cost of low-power products. Out-of-band suppression is achieved by loading a tuning screw on the output waveguide to introduce a transmission zero point. Due to the influence of the equipment processing method, the position of the tuning screw cannot be solidified. The position of the tuning screw must be determined and debugged during the production process, which will introduce debugging work in the production link, thereby increasing the production cost of the product, and the out-of-band suppression effect is difficult to guarantee. Out-of-band suppression is achieved by loading a short-circuited microstrip branch on the microstrip waveguide conversion structure to introduce a partial transmission zero point. The zero point position is related to the microstrip size. It is currently only used at 130GHz, and is obviously not suitable for the Ku band commonly used in satellite communications. Based on this, a microstrip-waveguide conversion structure of an embodiment of the present invention is provided to solve the technical problems that the existing out-of-band suppression scheme has a large equipment size and the debugging work leads to a high production cost.

[0032] Figure 1 A schematic diagram of a microstrip-waveguide conversion structure provided by an embodiment of the present invention is given. Figure 2 is a cross-sectional schematic diagram of a microstrip-waveguide conversion structure provided by an embodiment of the present invention, Figure 2 for Figure 1 The cross-sectional diagram of the microstrip-waveguide conversion structure provided is combined with Figure 1 and Figure 2 The microstrip-waveguide conversion structure comprises a detachably connected mounting base 1 and a cover plate 2. The mounting base 1 and the cover plate 2 provided in the present solution are made of metal.

[0033] The mounting base 1 provided in the present solution is provided with a waveguide through hole 3 connecting the two ends, and the two ends of the waveguide through hole 3 connect the inside of the waveguide through hole 3 and the outside of the mounting base 1, wherein a connection port connecting the first end of the waveguide through hole 3 is provided on the mounting base 1, and the connection port can be used to connect an external device (such as an antenna). Optionally, the connection port can be set to an interface of standard waveguide size, which is convenient for connecting with other external devices and realizing interconnection with other external devices. Non-standard sizes can be used for the remaining positions of the microstrip-waveguide conversion structure to further reduce the overall size of the microstrip-waveguide conversion structure.

[0034] Furthermore, the cover plate 2 is provided with a reflection cavity 4 which is recessed inwardly on one side corresponding to the second end of the waveguide through hole 3. When the cover plate 2 is connected to the mounting base 1, the cover plate 2 covers the second end of the waveguide through hole 3, and the reflection cavity 4 on the cover plate 2 corresponds to the second end of the waveguide through hole 3 and is connected to the reflection cavity 4. The cover plate 2 is provided with a boss 5 of a preset height for configuring the transmission zero point position in the reflection cavity 4, and bosses 5 of different preset heights can be configured with different transmission zero point positions to achieve different transmission zero points. The preset height of the boss 5 can be pre-determined according to the transmission zero point position to be configured. When producing the cover plate 2, the cover plate 2 can be produced according to the preset height to achieve the introduction of the target transmission zero point, and there is no need to configure the transmission zero point position by debugging, which greatly improves the production efficiency and reduces the equipment production cost. Optionally, the shape of the boss 5 can be a truncated cone, a square cone, a hexagonal column, a triangular prism, etc.

[0035] The cover plate 2 and the mounting base 1 provided in this solution can be used to connect the microstrip circuit board 12, and when the microstrip circuit board 12 is fixedly connected between the cover plate 2 and the mounting base 1, the signal output end of the microstrip circuit board 12 is located at the second end of the waveguide through hole 3, that is, one side of the signal output end of the microstrip circuit board 12 faces the inside of the waveguide through hole 3, and the other side faces the inside of the reflection cavity 4. Optionally, when the microstrip circuit board 12 is fixedly connected between the cover plate 2 and the mounting base 1, there is a gap between the signal output end of the microstrip circuit board 12 and the boss 5.

[0036] Optionally, a rectangular plane can be provided on the upper surface of the mounting base 1, and the rectangular plane can be used to place a microstrip circuit board 12, the microstrip circuit board 12 is located between the rectangular plane of the mounting base 1 and the cover plate 2, and the microstrip line 121 is located on the upper surface of the microstrip circuit board 12, and is used to convert the signal from the microstrip to the waveguide. A reflection cavity 4 and a boss 5 are provided on the cover plate 2, and the boss 5 is located in the reflection cavity 4, and the zero point position can be adjusted by adjusting the height of the boss 5.

[0037] When connecting the microstrip circuit board 12 and the microstrip-waveguide conversion structure, the microstrip circuit board 12 can be extended toward the position of the second end of the waveguide through hole 3, so that the output end of the microstrip circuit board 12 outputting the transverse electromagnetic wave extends into the second end of the waveguide through hole 3. At this time, the cover plate 2 can be connected to the mounting base 1, and the cover plate 2 and the mounting base 1 will clamp the microstrip circuit board 12 to achieve the connection between the microstrip circuit board 12 and the microstrip-waveguide conversion structure. In addition, an external device such as an antenna can be connected to the connection port on the mounting base 1 to achieve the connection between the external device and the microstrip-waveguide conversion structure.

[0038] Among them, the signal transmitted by the microstrip circuit board 12 is a transverse electromagnetic wave (TEM wave), and the signal transmitted by the waveguide is a transverse electric wave (TE wave). The microstrip-waveguide conversion structure can convert the transverse electromagnetic wave transmitted in the microstrip into a transverse electric wave transmitted in the waveguide, and the reflection cavity 4 can provide a cavity that enables the microstrip to better excite the waveform of the TE mode. When the microstrip-waveguide conversion structure is working, the end of the microstrip circuit board 12 that outputs the transverse electromagnetic wave outputs the transverse electromagnetic wave, which is converted into a transverse electric wave after being excited by the reflection cavity 4 and transmitted along the waveguide through hole 3, and is sent to the external device through the connection port, thereby realizing the conversion and transmission of the transverse electromagnetic wave to the transverse electric wave. In addition, due to the presence of the boss 5, a transmission zero point at a pre-configured transmission zero point position is introduced in the signal transmission, which can form the required out-of-band suppression for the signal transmission and improve the signal transmission quality.

[0039] In one embodiment, Figure 1 and Figure 2 As shown, the mounting base 1 provided in the present solution is provided with an output first matching platform 7 between the first end of the waveguide through hole 3 and the connection port, for realizing the transition from the waveguide through hole 3 to the connection port and improving the matching between the ports.

[0040] In one embodiment, the waveguide via 3 provided in the present solution may be an L-shaped via or an I-shaped via. The shape of the waveguide via 3 may be set according to the connection requirements between the microstrip-waveguide conversion structure and other equipment or devices to facilitate the connection of the microstrip-waveguide conversion structure.

[0041] Combination Figure 1 and Figure 2 , Figure 2Taking the waveguide through hole 3 as an L-shaped through hole as an example for description, the bending angle of the L-shaped through hole can be 90°. For example, after the waveguide through hole 3 extends from the first end to the inside of the mounting base 1 for a distance, it bends 90° and extends along the bent direction until it is connected to the outside of the mounting base 1 at the second end. After the transverse electromagnetic wave is output from the output end of the microstrip circuit board 12 and converted into a transverse electromagnetic wave by excitation of the reflection cavity 4, it starts to be transmitted along the waveguide through hole 3 from the second end of the waveguide through hole 3, turns and continues to be transmitted at the L-shaped bend of the waveguide through hole 3, and is sent to the external device through the connection port at the first end of the waveguide through hole 3 for further transmission, which facilitates the connection between the microstrip-waveguide conversion structure and the external device while ensuring the conversion and transmission of the signal.

[0042] In one embodiment, when the waveguide through hole 3 is set as an L-shaped through hole, the mounting base 1 provided in the present solution is provided with a second matching platform 8 at the bending part of the waveguide through hole 3. The second matching platform 8 can realize the angle matching of the transverse electric wave at the bending part (realize the 90° matching of the transverse electric wave), thereby improving the signal transmission quality.

[0043] Optionally, the mounting base 1 and the cover plate 2 can be detachably connected by a combination of one or more of screw connection, clamping, sliding groove connection and bonding. In one embodiment, taking the mounting base 1 and the cover plate 2 as an example, Figure 3 is an exploded schematic diagram of a microstrip-waveguide conversion structure provided by an embodiment of the present invention, combined with Figure 1 , Figure 2 and Figure 3 The mounting base 1 provided in the present solution is provided with a plurality of threaded holes 9 (the present solution takes the provision of two threaded holes 9 (one is provided on each side of the second end of the waveguide through hole 3) as an example), the cover plate 2 is provided with a first mounting through hole 10 for the screw 11 to pass through and connected to the threaded hole 9 at a position corresponding to the threaded hole 9, a thread adapted to the screw 11 is provided in the threaded hole 9, the aperture of the end of the first mounting through hole 10 away from the threaded hole 9 is smaller than the diameter of the head of the screw 11, so that the screw 11 passes through the first mounting through hole 10, is connected to the threaded hole 9 and is tightened, and the head of the screw 11 abuts against the position of the cover plate 2 at the end of the first mounting through hole 10, so that the cover plate 2 is stably fixed on the mounting base 1, and the microstrip circuit is stably fixed between the cover plate 2 and the mounting base 1.

[0044] In one embodiment, a second mounting through hole 123 is provided at a position corresponding to the threaded hole 9 of the microstrip circuit board 12. When installing the cover plate 2 and the microstrip circuit board 12, the second mounting through hole 123 on the microstrip circuit board 12 and the first mounting through hole 10 on the cover plate 2 can be aligned with the threaded hole 9 on the mounting base, and the screw 11 is passed through the first mounting through hole 10 and the second mounting through hole 123 in sequence and threadedly connected with the threaded hole 9. Tightening the screw 11 can make the cover plate 2 and the mounting base 1 clamp the microstrip circuit board 12, and under the limiting effect of the screw 11, the microstrip circuit board 12 is stably fixed. This solution realizes a detachable connection between the cover plate 2 and the mounting base 1 through the threaded hole 9, the first mounting through hole 10 and the screw 11, thereby improving the installation and disassembly efficiency of the cover plate 2 and the mounting base 1.

[0045] In one embodiment, the microstrip circuit board 12 provided by the present solution includes a microstrip line 121 and a dielectric substrate 122, wherein the second mounting through hole 123 is configured on the dielectric substrate 122. The microstrip line 121 is mounted on the dielectric substrate 122, and the microstrip line 121 is located on the side of the dielectric substrate 122 facing the cover plate 2, so that the microstrip line 121 outputs transverse electromagnetic waves more accurately, which are converted into transverse electric waves through the excitation of the reflection cavity 4 and output through the waveguide through hole 3, thereby improving the signal transmission quality.

[0046] In one embodiment, the portion of the dielectric substrate 122 located in the waveguide through hole 3 is hollowed out to form a through slot 6, thereby reducing the influence of the dielectric substrate 122 on signal transmission and improving the signal transmission quality. Optionally, the position of the through slot 6 formed by the dielectric substrate 122 being hollowed out corresponds to the projection position of the reflective cavity 4 on the dielectric substrate 122.

[0047] In one embodiment, the metal outer skin of the dielectric substrate 122 located in the waveguide through hole 3 can also be milled off, that is, the dielectric substrate 122 of the microstrip circuit board 12 extends into the microstrip-waveguide conversion structure, and the copper skin of the inner layer and the bottom layer of the dielectric substrate 122 extending into the waveguide portion are milled off, thereby reducing the influence of the metal outer skin of the dielectric substrate 122 on signal transmission and improving the signal transmission quality. Optionally, the position where the copper skin of the dielectric substrate 122 is milled off corresponds to the projection position of the reflection cavity 4 on the dielectric substrate 122.

[0048] Among them, the microstrip-waveguide conversion structure provided by this scheme can be applied to the Ku frequency band commonly used in satellite communications to achieve the conversion between microstrip and waveguide. The microstrip circuit board 12 and the microstrip-waveguide conversion structure can be connected through a microstrip probe. The microstrip-waveguide conversion structure (such as the transverse cross-sectional shape of the waveguide through hole 3) can adopt rectangular or circular waveguides. Except for the final output section (i.e., the connection port) which adopts the standard waveguide size to interconnect with other products, the remaining positions can adopt non-standard sizes, further reducing the overall size of the microstrip-waveguide conversion structure. The microstrip-waveguide conversion structure can be divided into two parts, namely, the cover plate 2 and the mounting base 1, along the plane where the microstrip circuit board 12 (PCB board) is located. The mounting base 1 and the cover plate 2 can be obtained by mold opening. When in use, the cover plate 2, the microstrip circuit board 12, and the mounting base 1 are connected by screws 11. The processing method of the microstrip-waveguide conversion structure is relatively simple, which effectively avoids the trouble of introducing the debugging link in production due to the inability to process from the waveguide port by using the tuning screw 11 type structure, which must introduce the tuning screw 11.

[0049] Figure 4 is a schematic structural diagram of another microstrip-waveguide conversion structure provided by an embodiment of the present invention, Figure 5 is a cross-sectional schematic diagram of another microstrip-waveguide conversion structure provided by an embodiment of the present invention, Figure 5 for Figure 4 The exploded cross-sectional diagram of the microstrip-waveguide conversion structure provided is combined with Figure 4 and Figure 5 The waveguide through hole 3 in the microstrip-waveguide conversion structure is set as an I-type through hole, and the waveguide through hole 3 extends from the first end to the inside of the mounting base 1 until it is connected to the outside of the mounting base 1 at the second end. After the transverse electromagnetic wave is output from the output end of the microstrip circuit board 12 and converted into a transverse electric wave by excitation of the reflection cavity 4, it is transmitted along the waveguide through hole 3 from the second end of the waveguide through hole 3, and is sent to the external device through the connection port at the first end of the waveguide through hole 3 for further transmission, which facilitates the connection between the microstrip-waveguide conversion structure and the external device while ensuring the conversion and transmission of the signal.

[0050] based on Figure 1 The signal conversion and transmission simulation of the microstrip-waveguide conversion structure provided can be obtained as follows Figure 6 The frequency-amplitude relationship diagram of a transverse electric wave transmission is shown in FIG. 1 , wherein the horizontal axis of the frequency-amplitude relationship diagram is the signal frequency and the vertical axis is the signal amplitude. Figure 6 It can be seen that the microstrip-waveguide conversion structure provided by this solution is 12.45GHz (e.g. Figure 6 A transmission zero point is introduced at the lowest point of the mid-transverse radio wave transmission curve S21), thereby producing a good suppression effect within the satellite receiving passband (10.7-12.75GHz). Figure 7A waveguide frequency-amplitude relationship diagram corresponding to a boss 5 with different preset heights provided in an embodiment of the present invention, wherein H is the preset height, and Figure 7 It can be seen that when the boss 5 with different preset heights is set, its transmission zero point is distributed at different positions (the lowest point of different curves). The preset height of the boss 5 can be determined in advance according to the need for out-of-band suppression of signal transmission, so as to introduce a transmission zero point at a specific frequency point, thereby suppressing out-of-band interference signals. There is no need to debug the position of the boss 5 again, thereby improving the production efficiency of the microstrip-waveguide conversion structure and reducing the deviation of the transmission zero point due to collision and misoperation during the transmission, movement and use of the equipment, thereby affecting the signal transmission quality.

[0051] In one embodiment, a plurality of bosses 5 may be provided at corresponding positions of the reflection cavity 4, and different bosses 5 may correspond to different preset heights, so as to introduce transmission zero points at different transmission zero point positions, thereby achieving a richer out-of-band suppression effect. Figure 8 A waveguide frequency-amplitude relationship diagram corresponding to different numbers of bosses 5 with different preset heights provided in an embodiment of the present invention. Since the position of the transmission zero point is related to the height of the boss 5, multiple bosses 5 with different heights can be introduced to generate multiple transmission zero points, that is, the number of transmission zero points can be increased by increasing the number of bosses 5, thereby increasing the width of the suppression band, or introducing multiple stop bands to meet the suppression requirements of different frequency bands. Figure 8 The waveguide frequency-amplitude relationship diagram using two bosses 5 with different preset heights is shown. It can be seen that the bosses 5 with two different preset heights produce two transmission zero points, thereby increasing the suppression bandwidth.

[0052] As mentioned above, by setting a detachably connected mounting base 1 and a cover plate 2, a waveguide through hole 3 is set in the mounting base 1, and a connecting port connected to the first end of the waveguide through hole 3 is set in the mounting base 1, and an external device can be connected to the connecting port, and a reflection cavity 4 is set on the side of the cover plate 2 corresponding to the second end of the waveguide through hole 3, and the cover plate 2 is provided with a boss 5 of a preset height for configuring the transmission zero point position in the reflection cavity 4, and the transverse electromagnetic wave is output from the output end of the microstrip circuit board 12 and converted into a transverse electromagnetic wave by the excitation of the reflection cavity 4, and then transmitted along the waveguide through hole 3 and sent to the external device through the connecting port for transmission, and the boss 5 in the reflection cavity 4 can add a transmission zero point in the signal transmission, which can effectively realize the out-of-band suppression of the signal transmission, and the transmission zero point position can be pre-set based on the preset height of the boss 5, and there is no need to introduce additional debugging work in the production link, which can effectively reduce the size of the equipment and greatly reduce the production cost. By adding the boss 5 in the reflection cavity 4, a new transmission zero point is introduced, which meets the requirements for blocking in satellite communications, greatly reduces the size of the waveguide conversion structure, and reduces the processing and debugging requirements of the waveguide conversion structure.

[0053] In one embodiment, the present invention further provides a signal transmission device, such as Fig. 9 As shown in the principle block diagram of a signal transmission device provided, the signal transmission device includes the microstrip-waveguide conversion structure provided by any of the above embodiments.

[0054] As described above, the signal transmission device is provided with a mounting base and a cover plate detachably connected in a microstrip-waveguide conversion structure, a waveguide through hole is provided in the mounting base, and a connection port connected to the first end of the waveguide through hole is provided in the mounting base, and an external device can be connected to the connection port, and a reflection cavity is provided on the side of the cover plate corresponding to the second end of the waveguide through hole, and the cover plate is provided with a boss of a preset height for configuring the transmission zero point position in the reflection cavity, and the transverse electromagnetic wave is output from the output end of the microstrip circuit board and converted into a transverse electromagnetic wave after being excited by the reflection cavity, and then transmitted along the waveguide through hole, and sent to the external device through the connection port for transmission, and the boss in the reflection cavity can add a transmission zero point in the signal transmission, which can effectively realize out-of-band suppression of the signal transmission, and the transmission zero point position can be pre-set based on the preset height of the boss, and no additional debugging work needs to be introduced in the production link, which can effectively reduce the size of the equipment and greatly reduce the production cost.

[0055] In one embodiment, the present invention further provides a communication device, such as Fig.10 As shown in the principle block diagram of a communication device provided, the communication device includes the signal transmission device provided in the above embodiment.

[0056] As described above, the communication device is provided with a mounting base and a cover plate detachably connected in a microstrip-waveguide conversion structure, a waveguide through hole is provided in the mounting base, and a connection port connected to the first end of the waveguide through hole is provided in the mounting base, and an external device can be connected to the connection port, and a reflection cavity is provided on the side of the cover plate corresponding to the second end of the waveguide through hole, and the cover plate is provided with a boss of a preset height for configuring the transmission zero point position in the reflection cavity, and the transverse electromagnetic wave is output from the output end of the microstrip circuit board and converted into a transverse electromagnetic wave after being excited by the reflection cavity, and then transmitted along the waveguide through hole, and sent to the external device through the connection port for transmission, and the boss in the reflection cavity can add a transmission zero point in the signal transmission, which can effectively realize out-of-band suppression of the signal transmission, and the transmission zero point position can be pre-set based on the preset height of the boss, and no additional debugging work needs to be introduced in the production link, which can effectively reduce the size of the equipment and greatly reduce the production cost.

[0057] The above are only preferred embodiments of the present invention and the technical principles used. The present invention is not limited to the specific embodiments provided here, and various obvious changes, readjustments and substitutions that can be made by those skilled in the art will not deviate from the protection scope of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may also include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the claims.

Claims

1. A microstrip-waveguide conversion structure, characterized in that: It includes a detachably connected mounting base and a cover plate, wherein: The mounting base is provided with a waveguide through hole, and the mounting base is provided with a connection port communicating with a first end of the waveguide through hole, and the connection port is used to connect an external device; The cover plate is provided with a reflection cavity on one side corresponding to the second end of the waveguide through hole, and the cover plate is provided with a boss of a preset height for configuring a transmission zero point position in the reflection cavity; The cover plate and the mounting base are used to connect a microstrip circuit board, and a signal output end of the microstrip circuit board is located at the second end of the waveguide through hole.

2. The microstrip-waveguide conversion structure according to claim 1, characterized in that: The mounting base is provided with an output first matching platform between the first end of the waveguide through hole and the connection port.

3. The microstrip-waveguide conversion structure according to claim 1, characterized in that: The waveguide through hole is an L-shaped through hole or an I-shaped through hole.

4. The microstrip-waveguide conversion structure according to claim 3, characterized in that: In the case where the waveguide through hole is an L-shaped through hole, the mounting base is provided with a second matching platform at a bending position of the waveguide through hole.

5. The microstrip-waveguide conversion structure according to claim 1, characterized in that: The bosses are provided in plurality, and different bosses correspond to different preset heights.

6. The microstrip-waveguide conversion structure according to claim 1, characterized in that: The mounting base is provided with a threaded hole, and the cover plate is provided with a first mounting through hole for a screw to pass through and connected to the threaded hole at a position corresponding to the threaded hole.

7. The microstrip-waveguide conversion structure according to claim 1, characterized in that: The microstrip circuit board comprises a microstrip line and a dielectric substrate. The microstrip line is mounted on the dielectric substrate. The microstrip line is located on a side of the dielectric substrate facing the cover plate.

8. The microstrip-waveguide conversion structure according to claim 7, characterized in that: The metal outer skin of the portion of the dielectric substrate located in the waveguide through hole is milled off, or the portion of the dielectric substrate located in the waveguide through hole is hollowed out.

9. A signal transmission device, characterized in that: It comprises the microstrip-waveguide conversion structure as described in any one of claims 1 to 8.

10. A communication device, characterized in that: Comprising the signal transmission device as claimed in claim 9.

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