A control method, system, device and medium for processing X-shaped holes in a circuit board

Abstract

The present application discloses a method, system, device and medium for controlling the machining of X-shaped holes on a circuit board, including the following steps: obtaining a first image of the blind holes on the first side after machining to a preset depth h' for the Nth time; obtaining first hole offset data according to the first image; obtaining first hole machining correction parameters according to the first hole offset data to guide the machining of the blind holes on the first side; obtaining a second image of the blind holes on the second side after machining to the preset depth h' for the Nth time; obtaining second hole offset data according to the second image; obtaining second hole machining correction parameters according to the second hole offset data to guide the machining of the blind holes on the second side; obtaining the symmetry information of the blind holes on the first side and the second side, and judging whether the X-shaped holes are qualified according to the symmetry information. The present application has the advantages of effectively controlling the hole machining quality and high detection accuracy.

Description

Technical Field

[0001] The present application relates to the technical field of hole processing data, and in particular to a circuit board X-shaped hole processing control method, system, equipment and medium. Background Art

[0002] Current ELIC board technology is characterized by a large number of layers while providing thin and light circuit boards (i.e., PCB boards). Such boards have greatly improved the performance of the electronics industry and have become an integral part of the development of electronic devices. They have high performance and can provide multi-layer boards that are lightweight and small in size, thereby achieving high performance and reliability.

[0003] ELIC-based circuit board products need to be processed into relatively symmetrical X-shaped holes with a small middle and large sides. First, the first side of the board is blind-hole processed, and then the second side is turned over to process the blind holes. The blind holes on both sides are connected to form a through hole. The middle position of the hole is smaller, and finally an X-shaped hole is formed (such as Figure 2 As shown in the figure, since both the blind holes on the first side and the blind holes on the second side are tapered holes, the processing parameters need to be adjusted continuously during the processing, and processing errors are easily caused during the adjustment process, resulting in unqualified hole processing quality. The existing X-shaped hole processing method for circuit boards only performs hole processing quality inspection after the processing is completed. The hole processing quality is difficult to effectively control, and simple measuring tools are generally used for detection, and the detection accuracy is low. Summary of the invention

[0004] The main purpose of the present application is to provide a circuit board X-shaped hole processing control method, system, equipment and medium, aiming to solve the technical problem that the existing circuit board X-shaped hole processing method is difficult to effectively control the hole processing quality.

[0005] To achieve the above object, the present application provides a circuit board X-shaped hole processing control method, comprising the following steps:

[0006] Acquire a first image of the first-side blind hole after each processing to a preset depth h'; wherein the first-side blind hole is a blind hole pre-processed on the first side of the target circuit board, and assuming that the current depth of the first-side blind hole processed for the Nth time is H1, then H1=N*h';

[0007] According to the first image, first hole offset data is acquired; wherein the first hole offset data is hole position offset data when the first surface blind hole is processed to the current depth position;

[0008] According to the first hole offset data, a first hole processing correction parameter is obtained to guide the processing of the first surface blind hole;

[0009] Obtain a second image of the second-sided blind hole after each processing to a preset depth h'; wherein, the second-sided blind hole is a blind hole pre-processed on the second side of the target circuit board, the second side is the other side opposite to the first side, and let the current depth reached by the second-sided blind hole after the Nth processing be H2, H2 = N * h'.

[0010] According to the second image, obtain second hole offset data; wherein, the second hole offset data is the hole position offset data when the second-sided blind hole is processed to the current depth position.

[0011] According to the second hole offset data, obtain second hole processing correction parameters to guide the processing of the second-sided blind hole.

[0012] Obtain the symmetry information of the first-sided blind hole and the second-sided blind hole, and judge whether the X-shaped hole is qualified according to the symmetry information; wherein, the X-shaped hole is a through hole formed by the first-sided blind hole and the second-sided blind hole.

[0013] Optionally, according to the first image, obtain first hole offset data, including:

[0014] According to the first image, identify and extract the large circle contour and the small circle contour; wherein, the large circle contour is the contour formed by the large-diameter end at the top in the first-sided blind hole, and the small circle contour is the contour formed by the small-diameter end at the bottom in the first-sided blind hole.

[0015] Select multiple reference points on the large circle contour and construct multiple radius line segments; wherein, the radius line segment is the connection line between the reference point and the center point of the large circle contour.

[0016] Obtain the distance value from the intersection point of each radius line segment and the small circle contour to the corresponding reference point.

[0017] Compare the distance value with the theoretical value to obtain the first hole offset data.

[0018] Optionally, comparing the distance value with the theoretical value to obtain the first hole offset data includes:

[0019] Filter multiple distance values to screen out the maximum value and the minimum value among the filtered multiple distance values;

[0020] Obtain the first difference between the maximum value and the theoretical value, and obtain the second difference between the minimum value and the theoretical value;

[0021] Output the larger value among the first difference and the second difference as the first hole offset data.

[0022] Optionally, after outputting the larger value among the first difference and the second difference as the first hole offset data, it further includes:

[0023] Judge whether the first hole offset data is greater than the preset offset allowable value;

[0024] If so, obtain a signal to stop processing and send an alarm message;

[0025] If not, proceed to the next step.

[0026] Optionally, obtain the symmetry information of the first-sided blind hole and the second-sided blind hole, and determine whether the X-shaped hole is qualified according to the symmetry information, including:

[0027] Obtain a third image of the first-sided blind hole and a fourth image of the second-sided blind hole after processing; wherein, the third image includes a first top hole contour and a coplanar circle contour corresponding to the first-sided blind hole, and the fourth image includes a corresponding second top hole contour and a coplanar circle contour, and the coplanar circle contour is a circular contour formed by the common bottom hole of the first-sided blind hole and the second-sided blind hole after processing;

[0028] Overlap the coplanar circle contours in the third image and the fourth image to fuse the third image and the fourth image and obtain a fused image;

[0029] Obtain the intersection area S of the first top hole contour and the second top hole contour in the fused image;

[0030] Judge whether the intersection area S is greater than a preset first threshold. If so, judge that the X-shaped hole is unqualified.

[0031] Optionally, if it is judged that the intersection area S is not greater than the preset first threshold, it further includes:

[0032] Obtain a first depth image of the first-sided blind hole and a second depth image of the second-sided blind hole after processing;

[0033] Based on the first depth image, select a plurality of first measurement point coordinates at different depth positions of the first-sided blind hole and along the corresponding circular contour;

[0034] Based on the second depth image, select a plurality of second measurement point coordinates corresponding one-to-one to the first measurement point coordinates at the same depth position of the second-sided blind hole corresponding to the first-sided blind hole and along the corresponding circular contour;

[0035] Obtain the coordinate difference between the second measurement point coordinates and the corresponding first measurement point coordinates;

[0036] Screen out the coordinate difference with the largest value and output it as the characteristic value ΔX;

[0037] Judge whether the characteristic value ΔX is greater than a preset second threshold. If so, judge that the X-shaped hole is unqualified.

[0038] Optionally, if it is judged that the characteristic value ΔX is not greater than the preset second threshold, it further includes:

[0039] According to the intersection area S and the characteristic value ΔX, obtain the symmetry degree U of the first-sided blind hole and the second-sided blind hole. The expression of U is:

[0040] U = U' - (K1 * S + K2 * ΔX);

[0041] Wherein, U' is the initial value of symmetry, K1 is the first adjustment coefficient, and K2 is the second adjustment coefficient;

[0042] Determine whether the symmetry U is greater than a preset third threshold. If so, determine that the X-shaped hole is unqualified; if not, determine that the X-shaped hole is qualified.

[0043] To achieve the above object, the present application further provides a processing control system for X-shaped holes on a circuit board, including:

[0044] A first image acquisition module for acquiring a first image of the first-sided blind hole after each processing to a preset depth h'; wherein, the first-sided blind hole is a blind hole pre-processed on the first side of the target circuit board. Let the current depth reached by the first-sided blind hole in the Nth processing be H1, then H1 = N * h';

[0045] A first data acquisition module for acquiring first hole offset data according to the first image; wherein, the first hole offset data is the hole position offset data when the first-sided blind hole is processed to the current depth position;

[0046] A first correction module for acquiring first hole processing correction parameters according to the first hole offset data to guide the processing of the first-sided blind hole;

[0047] A second image acquisition module for acquiring a second image of the second-sided blind hole after each processing to a preset depth h'; wherein, the second-sided blind hole is a blind hole pre-processed on the second side of the target circuit board, and the second side is the other side opposite to the first side. Let the current depth reached by the second-sided blind hole in the Nth processing be H2, H2 = N * h';

[0048] A second data acquisition module for acquiring second hole offset data according to the second image; wherein, the second hole offset data is the hole position offset data when the second-sided blind hole is processed to the current depth position;

[0049] A second correction module for acquiring second hole processing correction parameters according to the second hole offset data to guide the processing of the second-sided blind hole;

[0050] An inspection module for acquiring the symmetry information of the first-sided blind hole and the second-sided blind hole and judging whether the X-shaped hole is qualified according to the symmetry information; wherein, the X-shaped hole is a through hole formed by the first-sided blind hole and the second-sided blind hole.

[0051] To achieve the above object, the present application further provides a computer device, which includes a memory and a processor. A computer program is stored in the memory, and the processor executes the computer program to implement the above method.

[0052] To achieve the above object, the present application further provides a computer-readable storage medium, on which a computer program is stored, and a processor executes the computer program to implement the above method.

[0053] The beneficial effects that the present application can achieve are as follows:

[0054] When machining the first-sided blind hole in the present application, a first image can be obtained based on each machining depth h'. The first image can reflect the contour features of the first-sided blind hole after machining to the corresponding depth, so that contour feature recognition can be performed to obtain the first hole offset data, that is, the first hole machining correction parameter for correcting the machining parameters can be obtained. Then, continue to machine the depth h' so that the first-sided blind hole reaches the next stepped depth. At this time, obtain the first image again to obtain the new first hole offset data and the corresponding first hole machining correction parameter. Repeat this operation until the guided machining of the first-sided blind hole is completed. Then, when machining the second-sided blind hole, similarly, obtain a second image based on the above principle after each machining depth h'. Finally, obtain the second hole machining correction parameter to guide the completion of the machining of the second-sided blind hole, and finally obtain the formed X-shaped hole. Therefore, the present application performs image acquisition and analysis based on each machining depth h' and obtains correction data, thereby continuously correcting the hole machining parameters, which can effectively control the machining quality of the X-shaped hole, greatly reducing the risk of the final X-shaped hole being unqualified due to machining errors during the hole machining process. Moreover, after the machining is completed, the symmetry information of the first-sided blind hole and the second-sided blind hole is also detected, and finally it is judged whether the X-shaped hole is qualified according to the symmetry information, thus ensuring the machining quality of the X-shaped hole. Description of the Drawings

[0055] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts do not necessarily draw according to the actual ratio.

[0056] Figure 1 It is a schematic flow chart of a method for controlling the machining of an X-shaped hole on a circuit board in an embodiment of the present application;

[0057] Figure 2 It is a schematic pre-machining structure diagram of an X-shaped hole on a circuit board in an embodiment of the present application;

[0058] Figure 3 It is a schematic principle diagram of calculating multiple spacing values based on the first image in an embodiment of the present application;

[0059] Figure 4 It is a schematic principle diagram of fusing the third image and the fourth image and calculating the staggered area S in an embodiment of the present application;

[0060] Figure 5 Schematic diagram (top view) when selecting multiple first measurement point coordinates based on the first depth image in the embodiment of the present application;

[0061] Figure 6 Schematic diagram (top view) when selecting multiple second measurement point coordinates based on the second depth image in the embodiment of the present application;

[0062] Figure 7 Schematic diagram of point position correspondence (front view) when selecting first measurement point coordinates at different depth positions of the first surface blind hole and selecting second measurement point coordinates at corresponding depth positions of the second surface blind hole in the embodiment of the present application.

[0063] Reference numerals:

[0064] 110 - First surface blind hole, 120 - Second surface blind hole, 130 - Large circle contour, 140 - Small circle contour, 150 - Radius line segment, 160 - First top hole contour, 170 - Coplanar circle contour, 180 - Second top hole contour.

[0065] The realization, functional features and advantages of the object of the present application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. Detailed implementation manners

[0066] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0067] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative position relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0068] In the present application, unless otherwise clearly defined and limited, terms such as "connection" and "fixation" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral body; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0069] In addition, if there are descriptions such as "first" and "second" in the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and / or" appearing throughout the text includes three parallel scenarios. Taking "A and / or B" as an example, it includes Scenario A, or Scenario B, or the scenario where both A and B are satisfied simultaneously. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present application.

[0070] Embodiment 1: Refer to Figures 1 - 7 , this embodiment provides a method for controlling the machining of X-shaped holes on a circuit board, including the following steps:

[0071] Obtain a first image of the first-sided blind hole 110 after each machining to a preset depth h'; wherein, the first-sided blind hole 110 is a blind hole pre-machined on the first side of the target circuit board. Let the current depth reached by the first-sided blind hole 110 after the Nth machining be H1, then H1 = N * h';

[0072] According to the first image, obtain first hole offset data; wherein, the first hole offset data is the hole position offset data when the first-sided blind hole 110 is machined to the current depth position.

[0073] According to the first hole offset data, obtain first hole machining correction parameters to guide the machining of the first-sided blind hole 110.

[0074] Obtain a second image of the second-sided blind hole 120 after each machining to a preset depth h'; wherein, the second-sided blind hole 120 is a blind hole pre-machined on the second side of the target circuit board, and the second side is the other side opposite to the first side. Let the current depth reached by the second-sided blind hole 120 after the Nth machining be H2, H2 = N * h';

[0075] According to the second image, obtain second hole offset data; wherein, the second hole offset data is the hole position offset data when the second-sided blind hole 120 is machined to the current depth position.

[0076] According to the second hole offset data, obtain second hole machining correction parameters to guide the machining of the second-sided blind hole 120.

[0077] Obtain the symmetry information of the first-sided blind hole 110 and the second-sided blind hole 120, and judge whether the X-shaped hole is qualified according to the symmetry information; wherein, the X-shaped hole is a through hole formed by the first-sided blind hole 110 and the second-sided blind hole 120.

[0078] In this embodiment, when machining the first surface blind hole 110, a first image can be obtained based on each machining depth h'. The first image can reflect the contour features of the first surface blind hole 110 after machining to the corresponding depth, so that the contour features can be recognized to obtain the first hole offset data, that is, the first hole machining correction parameter for correcting the machining parameters can be obtained. Then, the machining depth h' is continued to make the first surface blind hole 110 reach the next stepped depth. At this time, the first image is obtained again to obtain the new first hole offset data and the corresponding first hole machining correction parameter. For example, when machining for the first time to the depth H1, H1 = h', that is, the first image is obtained for detection. Then, when machining for the second time to the depth H2, H2 = 2h', the first image is obtained again for detection. When machining for the third time to the depth H3, H3 = 3h', the first image is obtained continuously for detection, and so on, until the last machining to the total depth h1 of the first surface blind hole 110, thus completing the guiding machining of the first surface blind hole 110. Then, when machining the second surface blind hole 120, similarly, according to the above principle, a second image is obtained after each machining depth h', and finally the second hole machining correction parameter is obtained to guide the completion of the machining of the second surface blind hole 120, and finally the formed X-shaped hole is obtained. Therefore, in this embodiment, image acquisition and analysis are performed after each machining depth h' to obtain correction data, so as to continuously correct the hole machining parameters, effectively control the machining quality of the X-shaped hole, greatly reduce the risk that the final X-shaped hole is unqualified due to machining errors during the hole machining process, and after the machining is completed, the symmetry information of the first surface blind hole 110 and the second surface blind hole 120 is also detected, and finally it is judged whether the X-shaped hole is qualified according to the symmetry information, thus ensuring the machining quality of the X-shaped hole.

[0079] As an alternative embodiment, obtaining the first hole offset data according to the first image includes:

[0080] Identifying and extracting the large circle contour 130 and the small circle contour 140 according to the first image; wherein, the large circle contour 130 is the contour formed by the large diameter end at the top in the first surface blind hole 110, and the small circle contour 140 is the contour formed by the small diameter end at the bottom in the first surface blind hole 110;

[0081] Selecting a plurality of reference points on the large circle contour 130 and constructing a plurality of radius line segments 150; wherein, the radius line segment 150 is the connection line between the reference point and the center point of the large circle contour 130;

[0082] Obtaining the distance value from the intersection point of each radius line segment 150 and the small circle contour 140 to the corresponding reference point;

[0083] Comparing the distance value with the theoretical value to obtain the first hole offset data.

[0084] In this embodiment, when calculating the first hole offset data, according to the first image, the features of the large circle contour 130 formed by the large-diameter end at the top in the first surface blind hole 110 and the features of the small circle contour 140 formed by the small-diameter end at the bottom can be recognized and extracted. Due to the influence of processing errors, the small circle contour 140 formed here is not necessarily circular, and most are elliptical or quasi-circular. Therefore, it is difficult to obtain the center of the small circle contour 140 to calculate the deviation from the center of the large circle contour 130 to obtain the offset data. Therefore, here, multiple radius line segments 150 corresponding to the large circle contour 130 are constructed. The radius line segments 150 will all pass through the small circle contour 140 to form intersection points, and then the distance values from the intersection points to the corresponding reference points on the large circle contour 130 are calculated. As Figure 3 shown, multiple distance values d1, d2, d3,..., dn can be obtained. The distance values are respectively compared with the theoretical values (i.e., the distance between the intersection point and the corresponding reference point when the small circle contour 140 has no deviation), that is, the difference comparison is performed, and accurate and effective first hole offset data can be obtained.

[0085] As an optional embodiment, comparing the distance value with the theoretical value to obtain the first hole offset data includes:

[0086] Screening the multiple distance values to select the maximum value and the minimum value among the screened multiple distance values;

[0087] Obtaining a first difference between the maximum value and the theoretical value, and obtaining a second difference between the minimum value and the theoretical value;

[0088] Outputting the larger value of the first difference and the second difference as the first hole offset data.

[0089] In this embodiment, since there are a large number of distance value data, if the difference comparison with the theoretical value is performed for all of them, the calculation pressure is large. Therefore, only the maximum value and the minimum value among the multiple distance values are screened out here, which can represent the relatively representative offset degree. Then, the maximum value and the minimum value are respectively compared with the theoretical value to obtain the first difference and the second difference (both are absolute values). Finally, the larger value of the first difference and the second difference is output as the first hole offset data. Finally, representative hole offset data can be obtained, providing accurate parameters for the correction of processing parameters to improve the hole processing quality.

[0090] As an optional embodiment, after outputting the larger value of the first difference and the second difference as the first hole offset data, it further includes:

[0091] Judging whether the first hole offset data is greater than a preset offset allowable value;

[0092] If so, obtaining a stop processing signal and sending an alarm message;

[0093] If not, proceeding to the next step.

[0094] In this embodiment, after obtaining the first hole offset data, it is also compared with the offset allowable value. If it is greater than the offset allowable value, it indicates that the first surface blind hole 110 machined to the current depth has exceeded the machining quality requirements, that is, it already belongs to a non-conforming hole. Therefore, there is no need to continue machining. Here, a stop machining signal can be obtained to control the machining equipment to stop machining, avoid ineffective machining, reduce the waste of machining time, and send an alarm message to notify the staff to scrap the current workpiece.

[0095] It should be noted that the specific steps for obtaining the second hole offset data according to the second image are the same as the implementation steps for obtaining the first hole offset data according to the first image, and will not be elaborated here.

[0096] As an alternative embodiment, obtaining the symmetry information of the first surface blind hole 110 and the second surface blind hole 120, and judging whether the X-shaped hole is qualified includes:

[0097] Obtaining a third image of the first surface blind hole 110 and a fourth image of the second surface blind hole 120 after machining is completed; wherein, the third image includes a first top hole contour 160 and a coplanar circle contour 170 corresponding to the first surface blind hole 110, and the fourth image includes a corresponding second top hole contour 180 and a coplanar circle contour 170. The coplanar circle contour 170 is a circular contour formed by the common bottom hole of the first surface blind hole 110 and the second surface blind hole 120 after machining is completed;

[0098] Coincide the coplanar circle contours 170 in the third image and the fourth image to fuse the third image and the fourth image and obtain a fused image;

[0099] Obtaining the intersection area S of the first top hole contour 160 and the second top hole contour 180 in the fused image;

[0100] Judging whether the intersection area S is greater than a preset first threshold. If so, it is judged that the X-shaped hole is unqualified.

[0101] In this embodiment, when detecting the symmetry of the first surface blind hole 110 and the second surface blind hole 120, first obtain a third image of the first surface blind hole 110 and a fourth image of the second surface blind hole 120 after machining is completed. At this time, the third image may include a first top hole contour 160 and a coplanar circle contour 170, and the fourth image may include a second top hole contour 180 and a coplanar circle contour 170. Since both images have the coplanar circle contour 170 with the same feature, the coplanar circle contours 170 in the two images are coincided here to fuse the third image and the fourth image and obtain a fused image. By identifying the intersection area S of the first top hole contour 160 and the second top hole contour 180 after fusion (such as Figure 4The area of the shaded part (in the figure) can be used to characterize the symmetry of the upper and lower top holes of the first-sided blind hole 110 and the second-sided blind hole 120. If S = 0, it means that the first top hole contour 160 and the second top hole contour 180 also completely coincide without offset. If S > 0, it means that there is a certain offset between the upper and lower top holes, resulting in the first-sided blind hole 110 and the second-sided blind hole 120 not being symmetric enough. However, considering a certain allowable error, a first threshold can be set here. By comparing the intersection area S with the first threshold, if the intersection area S is greater than the first threshold, it indicates that the symmetry is poor, and it can be determined that the X-shaped hole is unqualified.

[0102] As an alternative implementation, if it is determined that the intersection area S is not greater than the preset first threshold, it further includes:

[0103] Obtain a first depth image of the first-sided blind hole 110 and a second depth image of the second-sided blind hole 120 after processing;

[0104] Based on the first depth image, select multiple first measurement point coordinates at different depth positions of the first-sided blind hole 110 along the corresponding circular contour;

[0105] Based on the second depth image, at the same depth positions of the second-sided blind hole 120 corresponding to the first-sided blind hole 110, select multiple second measurement point coordinates that correspond one-to-one with the first measurement point coordinates along the corresponding circular contour;

[0106] Obtain the coordinate difference between the second measurement point coordinates and the corresponding first measurement point coordinates;

[0107] Screen out the coordinate difference with the largest value and output it as the characteristic value ΔX;

[0108] Determine whether the characteristic value ΔX is greater than the preset second threshold. If so, determine that the X-shaped hole is unqualified.

[0109] In this embodiment, if the intersection area S is not greater than the preset first threshold, there may be a situation where the first-sided blind hole 110 and the second-sided blind hole 120 are asymmetric at the same depth position due to error accumulation. Therefore, here, a first depth image corresponding to the first-sided blind hole 110 and a second depth image corresponding to the second-sided blind hole 120 are also obtained respectively (which can be collected based on a depth camera). Here, a reference coordinate system is constructed with the center of the plane where the coplanar bottom holes of the first-sided blind hole 110 and the second-sided blind hole 120 are located as the origin, the horizontal axis as the x-axis, and the vertical axis as the y-axis. Then, based on the first depth image and the second depth image respectively, at different depth positions of the first-sided blind hole 110 and along the corresponding circular contour, multiple first measurement point coordinates are selected. For example, at the first layer depth position, multiple first measurement point coordinates are selected and denoted as a 1 (x 1 ,y 1 ), a 1 (x 2, y 2 ), a 1 (x 3 , y 3 ),..., a 1 (x n , y n ), at the second depth position, select multiple first measurement point coordinates and record them as b 1 (x 1 , y 1 ), b 1 (x 2 , y 2 ), b 1 (x 3 , y 3 ),..., b 1 (x n , y n ), and so on. Similarly, when selecting the second measurement point coordinates on the second blind hole 120, select them at the same first layer depth position as the first blind hole 110, and record them as a 2 (x 1 , y 1 ), a 2 (x 2 , y 2 ), a 2 (x 3 , y 3 ),..., a 2 (x n , y n ), and a 2 (x n , y n ) corresponds to a 1 (x n , y n ), that is, the y-axis coordinates are the same. The second measurement point coordinates selected at the second depth position are b 2 (x 1 , y 1 ), b 2 (x 2 , y 2 ), b 2 (x 3 , y 3 ),..., b 2 (x n , y n) Then, perform the comparison of the differences at the same positions. Since the y-axis coordinates at the same positions are equal, it is the comparison of the x-axis coordinate differences, thereby obtaining multiple coordinate differences. Output the coordinate difference with the largest value as the characteristic value ΔX, which represents the maximum degree of asymmetry between the first-side blind hole 110 and the second-side blind hole 120 at the same depth position. Finally, compare the characteristic value ΔX with the second threshold. If it exceeds the second threshold, it indicates that the symmetry is unqualified, and it can be determined that the X-shaped hole is unqualified, thus realizing the on-line detection of the symmetry of the X-shaped hole without relying on manual measurement tools, reducing the human measurement error, and improving the detection accuracy.

[0110] As an alternative implementation, if it is determined that the characteristic value ΔX is not greater than the preset second threshold, it further includes:

[0111] According to the staggered area S and the characteristic value ΔX, obtain the symmetry U of the first-side blind hole 110 and the second-side blind hole 120. The expression of U is:

[0112] U = U' - (K1 * S + K2 * ΔX);

[0113] In the formula, U' is the initial value of symmetry, K1 is the first adjustment coefficient, and K2 is the second adjustment coefficient;

[0114] Judge whether the symmetry U is greater than the preset third threshold. If so, determine that the X-shaped hole is unqualified. If not, determine that the X-shaped hole is qualified.

[0115] In this embodiment, if both the staggered area S and the characteristic value ΔX meet the qualified standards, but due to the existence of allowable errors, the combined effect of the two parameters may have a certain impact on the quality of the X-shaped hole. Therefore, the calculation of the symmetry U is introduced here, taking both the staggered area S and the characteristic value ΔX into account. Since the staggered area S and the characteristic value ΔX are parameters of different unit magnitudes, the first adjustment coefficient K1 and the second adjustment coefficient K2 are used for separate conversion and adjustment here, so that the two parameters can be superimposed on each other. The larger the staggered area S and the characteristic value ΔX, the worse the symmetry, that is, the smaller the value of the symmetry U. If both the staggered area S and the characteristic value ΔX are 0, it indicates that the first-side blind hole 110 and the second-side blind hole 120 are completely symmetric. Similarly, under certain allowable error conditions, a third threshold is set here. If the symmetry U exceeds the third threshold, it is finally determined that the X-shaped hole is unqualified. Otherwise, it can be determined that the X-shaped hole is qualified, thereby further improving the symmetry quality detection of the X-shaped hole, ensuring the quality of the finally formed X-shaped hole, and thus improving the quality of the circuit board product.

[0116] Example 2: Refer to Figures 1 - 2 , based on the same inventive concept as the foregoing embodiment, this embodiment further provides a processing control system for the X-shaped holes of a circuit board, including:

[0117] A first image acquisition module, configured to acquire a first image of the first-sided blind hole 110 after each processing of a preset depth h'; wherein, the first-sided blind hole 110 is a blind hole pre-processed on the first side of the target circuit board. Let the current depth reached by the first-sided blind hole 110 after the Nth processing be H1, then H1 = N * h'.

[0118] A first data acquisition module, configured to acquire first hole offset data according to the first image; wherein, the first hole offset data is the hole position offset data when the first-sided blind hole 110 is processed to the current depth position.

[0119] A first correction module, configured to acquire first hole processing correction parameters according to the first hole offset data to guide the processing of the first-sided blind hole 110.

[0120] A second image acquisition module, configured to acquire a second image of the second-sided blind hole 120 after each processing of a preset depth h'; wherein, the second-sided blind hole 120 is a blind hole pre-processed on the second side of the target circuit board, and the second side is the other side opposite to the first side. Let the current depth reached by the second-sided blind hole 120 after the Nth processing be H2, H2 = N * h'.

[0121] A second data acquisition module, configured to acquire second hole offset data according to the second image; wherein, the second hole offset data is the hole position offset data when the second-sided blind hole 120 is processed to the current depth position.

[0122] A second correction module, configured to acquire second hole processing correction parameters according to the second hole offset data to guide the processing of the second-sided blind hole 120.

[0123] An inspection module, configured to acquire symmetry information of the first-sided blind hole 110 and the second-sided blind hole 120, and judge whether the X-shaped hole is qualified according to the symmetry information; wherein, the X-shaped hole is a through hole formed by the first-sided blind hole 110 and the second-sided blind hole 120.

[0124] For the relevant explanations and examples of each module in the device of this embodiment, reference can be made to the method of the foregoing embodiment, which will not be elaborated here.

[0125] Embodiment 3: Based on the same inventive concept as the foregoing embodiment, this embodiment provides a computer device, which includes a memory and a processor. A computer program is stored in the memory, and the processor executes the computer program to implement the above method.

[0126] Embodiment 4: Based on the same inventive concept as the foregoing embodiment, this embodiment provides a computer-readable storage medium. A computer program is stored on the computer-readable storage medium, and the processor executes the computer program to implement the above method.

[0127] The above are only the preferred embodiments of the present application, which do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of the present application.

Claims

1. A circuit board X-shaped hole processing control method, characterized in that: The following steps are involved: Acquire a first image of the first-side blind hole after each processing to a preset depth h'; wherein the first-side blind hole is a blind hole pre-processed on the first side of the target circuit board, and assuming that the current depth of the first-side blind hole processed for the Nth time is H1, then H1=N*h'; According to the first image, first hole offset data is acquired; wherein the first hole offset data is hole position offset data when the first surface blind hole is processed to a current depth position; Obtaining a first hole processing correction parameter according to the first hole offset data to guide the processing of the first-face blind hole; Acquire a second image of the second-side blind hole after each processing to a preset depth h'; wherein the second-side blind hole is a blind hole pre-processed on the second side of the target circuit board, the second side is the other side opposite to the first side, and the current depth of the second-side blind hole processed for the Nth time is H2, H2=N*h'; According to the second image, second hole offset data is acquired; wherein the second hole offset data is hole position offset data when the second surface blind hole is processed to the current depth position; According to the second hole offset data, obtaining a second hole processing correction parameter to guide the processing of the second surface blind hole; The symmetry information of the first-surface blind holes and the second-surface blind holes is obtained, and whether the X-shaped holes are qualified is determined according to the symmetry information; wherein the X-shaped holes are through holes formed by the first-surface blind holes and the second-surface blind holes.

2. A circuit board X-shaped hole processing control method as claimed in claim 1, characterized in that: The step of acquiring first hole offset data according to the first image includes: According to the first image, a large circle contour and a small circle contour are identified and extracted; wherein the large circle contour is a contour formed by the top large diameter end of the blind hole in the first surface, and the small circle contour is a contour formed by the bottom small diameter end of the blind hole in the first surface; Select multiple reference points on the outline of the large circle and construct multiple radius line segments; wherein the radius line segment is a line connecting the reference point to the center point of the outline of the large circle; Obtaining the distance value from the intersection point of each of the radius line segments and the small circle contour to the corresponding reference point; The spacing value is compared with a theoretical value to obtain first hole offset data.

3. A circuit board X-shaped hole processing control method as claimed in claim 2, characterized in that: The step of comparing the spacing value with a theoretical value to obtain first hole offset data comprises: Screening the plurality of spacing values ​​to screen out the maximum value and the minimum value among the plurality of spacing values; Obtain a first difference between the maximum value and the theoretical value, and obtain a second difference between the minimum value and the theoretical value; A larger value of the first difference value and the second difference value is output as first hole offset data.

4. A circuit board X-shaped hole processing control method as claimed in claim 3, characterized in that: After outputting the larger value of the first difference and the second difference as the first hole offset data, the method further includes: Determining whether the first hole offset data is greater than a preset offset allowable value; If so, a stop processing signal is obtained and an alarm message is sent; If not, proceed to the next step.

5. A circuit board X-shaped hole processing control method as claimed in any one of claims 1 to 4, characterized in that: The obtaining symmetry information of the first-side blind hole and the second-side blind hole, and judging whether the X-shaped hole is qualified according to the symmetry information, comprises: Acquire a third image of the first-surface blind hole after processing and a fourth image of the second-surface blind hole; wherein the third image includes a first top hole contour and a coplanar circle contour corresponding to the first-surface blind hole, and the fourth image includes a corresponding second top hole contour and a coplanar circle contour, and the coplanar circle contour is a circular contour formed by a common bottom hole of the first-surface blind hole and the second-surface blind hole after processing; Overlapping the coplanar circle contours in the third image and the fourth image to fuse the third image and the fourth image to obtain a fused image; Acquire an intersecting area S of the first top hole outline and the second top hole outline in the fused image; It is determined whether the interleaving area S is greater than a preset first threshold value. If so, the X-shaped hole is determined to be unqualified.

6. A circuit board X-shaped hole processing control method as claimed in claim 5, characterized in that: If it is determined that the interleaving area S is not greater than a preset first threshold, the method further includes: Acquire a first depth image of the first-side blind hole and a second depth image of the second-side blind hole after processing; Based on the first depth image, selecting a plurality of first measurement point coordinates at different depth positions of the blind hole on the first surface and along the corresponding circular contour; Based on the second depth image, selecting a plurality of second measurement point coordinates corresponding one-to-one to the first measurement point coordinates at the same depth position of the second-side blind hole corresponding to the first-side blind hole and along the corresponding circular contour; Obtaining a coordinate difference between the coordinates of the second measurement point and the corresponding coordinates of the first measurement point; Filter out the coordinate difference with the largest value and output it as the characteristic value ΔX; It is determined whether the characteristic value ΔX is greater than a preset second threshold value. If so, it is determined that the X-shaped hole is unqualified.

7. A circuit board X-shaped hole processing control method as claimed in claim 6, characterized in that: If it is determined that the characteristic value ΔX is not greater than a preset second threshold, the method further includes: According to the staggered area S and the characteristic value ΔX, the symmetry U of the first-side blind hole and the second-side blind hole is obtained, and the expression of U is: U = U'-(K1*S+K2*ΔX); Wherein, U' is the initial value of symmetry, K1 is the first adjustment coefficient, and K2 is the second adjustment coefficient; It is determined whether the symmetry U is greater than a preset third threshold value. If so, the X-shaped hole is determined to be unqualified; if not, the X-shaped hole is determined to be qualified.

8. A circuit board X-shaped hole processing control system, characterized in that: include: A first image acquisition module is used to acquire a first image of the first-side blind hole after each processing to a preset depth h'; wherein the first-side blind hole is a blind hole pre-processed on the first side of the target circuit board, and assuming that the current depth of the first-side blind hole processed for the Nth time is H1, then H1=N*h'; A first data acquisition module is used to acquire first hole offset data according to the first image; wherein the first hole offset data is hole position offset data when the first surface blind hole is processed to a current depth position; A first correction module, used for obtaining a first hole processing correction parameter according to the first hole offset data to guide the processing of the first-face blind hole; A second image acquisition module is used to acquire a second image of the second-side blind hole after each processing of a preset depth h'; wherein the second-side blind hole is a blind hole pre-processed on the second side of the target circuit board, the second side is the other side opposite to the first side, and the current depth of the second-side blind hole processed for the Nth time is H2, H2=N*h'; A second data acquisition module is used to acquire second hole offset data according to the second image; wherein the second hole offset data is hole position offset data when the second surface blind hole is processed to a current depth position; A second correction module, used for obtaining a second hole processing correction parameter according to the second hole offset data, so as to guide the processing of the second-surface blind hole; The inspection module is used to obtain the symmetry information of the blind holes on the first surface and the blind holes on the second surface, and judge whether the X-shaped hole is qualified according to the symmetry information; wherein the X-shaped hole is a through hole formed by the blind holes on the first surface and the blind holes on the second surface.

9. A computer device, characterized in that: The computer device includes a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement a circuit board X-shaped hole processing control method as described in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and the processor executes the computer program to implement a circuit board X-shaped hole processing control method as described in any one of claims 1-7.

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