Electronic device

Abstract

The invention discloses an electronic device which comprises a front frame, a middle frame, a heat dissipation rear cover, a circuit board, at least two first screws, a heating piece, a heat dissipation structure and at least two first springs. The middle frame is fixedly connected to the front frame and provided with at least two first studs. The heat dissipation rear cover is fixedly connected to the front frame to accommodate the middle frame. The circuit board is movably sleeved on the at least two first studs. The at least two first screws are respectively locked on the at least two first studs, so that the circuit board can be movably limited between the at least two first screws and the middle frame. The heating element is installed on the circuit board. The heat dissipation structure is arranged on the heating element. The at least two first springs are respectively sleeved on the at least two first studs and elastically abutted between the circuit board and the middle frame, so that the circuit board is supported between the at least two first screws and the middle frame in a floatable manner and has a trend of moving towards the heat dissipation rear cover, and the heat dissipation structure is abutted against the heat dissipation rear cover. Therefore, the problem of overheating of the element can be effectively prevented.

Description

Technical Field

[0001] The invention relates to an electronic device, in particular to an electronic device which uses a spring to support a circuit board to float relative to a middle frame. Background Art

[0002] Generally speaking, in the structural assembly design of electronic devices, the problem and control of the combined dimensional tolerance between the assembly parts has always been an important issue. In particular, when the electronic device adopts an assembly stacking design in which the middle frame is accommodated between the front frame and the rear cover that are connected front and back, and the internal electronic components are installed on the middle frame, it is often easy to have the problem of component overheating due to the gap in the internal heat transfer path caused by the excessive assembly tolerance, or the situation in which the internal electronic components (such as circuit boards and central processing units) are compressed and damaged during the assembly process due to the small assembly tolerance. Summary of the invention

[0003] Therefore, an object of the present invention is to provide an electronic device that uses a spring to support a circuit board to float relative to a middle frame, so as to solve the above-mentioned problem.

[0004] To achieve the above-mentioned purpose, the present invention provides an electronic device, comprising a front frame, a middle frame, a heat dissipation back cover, a circuit board, at least two first screws, a heating element, a heat dissipation structure, and at least two first springs. The middle frame is fixedly connected to the front frame and has at least two first studs. The heat dissipation back cover is fixedly connected to the front frame to accommodate the middle frame. The circuit board can be movably mounted on the at least two first studs. At least two first screws are respectively locked on the at least two first studs so that the circuit board can be movably limited between the at least two first screws and the middle frame. The heat dissipation element is mounted on the circuit board. The heat dissipation structure is arranged on the heat dissipation element. At least two first springs are respectively mounted on the at least two first studs and elastically abut between the circuit board and the middle frame, so that the circuit board can float and support between the at least two first screws and the middle frame and has a tendency to move toward the heat dissipation back cover, so that the heat dissipation structure abuts against the heat dissipation back cover.

[0005] In summary, the present invention adopts the above-mentioned circuit board elastic floating design. If the assembly tolerance is too large during the assembly process of the electronic device, the first spring system can provide elastic force to drive the circuit board to move toward the heat dissipation rear cover, so that the heat dissipation structure can be positively abutted against the heat dissipation rear cover as the circuit board moves, thereby effectively preventing the problem of component overheating caused by the gap in the internal heat transfer path due to the large assembly tolerance mentioned in the prior art. On the other hand, if the assembly tolerance is too small during the assembly process of the electronic device, the circuit board system can use the elastic compression characteristics of the first spring to move downward accordingly, thereby effectively avoiding the problem mentioned in the prior art that the internal electronic components (such as circuit boards, central processing units) are compressed and damaged during the assembly process due to the small assembly tolerance. In addition, through this elastic floating design, when the electronic device is in an external vibration environment, the electronic device can also use the elastic structural characteristics of the first spring to absorb the vibration energy to produce a shockproof protection effect.

[0006] The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 FIG. 4 is a simplified cross-sectional view of an electronic device according to an embodiment of the present invention.

[0008] Figure 2 FIG. 4 is a simplified cross-sectional view of an electronic device according to another embodiment of the present invention.

[0009] Description of main reference numerals:

[0010] 10, 100 - electronic device, 12 - front frame, 14 - middle frame, 16 - heat dissipation back cover, 18, 102 - circuit board, 20 - first screw, 22 - heating element, 24 - heat dissipation structure, 26 - first spring, 28 - first stud, 30, 112 - positioning column, 32, 114 - socket column, 34, 116 - positioning hole, 36, 38 - thermal paste, 40, 104 - second screw, 42, 108 - second spring, 44, 118 - locking plate, 106 - third screw, 110 - second stud. DETAILED DESCRIPTION

[0011] See also Figure 1 , which is a cross-sectional view of an electronic device 10 according to an embodiment of the present invention. Figure 1As shown, the electronic device 10 can be preferably an image capture analyzer (but not limited to this, that is, the component assembly design of the present invention can be applied to electronic devices that use a front frame and a rear cover to accommodate a middle frame and use the middle frame to carry a circuit board and internal electronic components, such as a laptop computer, a smart phone, etc.) and includes a front frame 12, a middle frame 14, a heat dissipation rear cover 16, a circuit board 18, at least two first screws 20 (in Figure 1 The middle frame 14 is fixed to the front frame 12 and has at least two first studs 28. The heat dissipation rear cover 16 can be preferably made of a heat conductive material (such as metal) and fixed to the front frame 12 to accommodate the middle frame 14 together with the front frame 12 for installing the electronic components inside the electronic device 10. The heat dissipation rear cover 16 and the middle frame 14 can be used as shown in the figure. Figure 1 The screw locking method shown is fixed to the front frame 12 (but not limited to this), and the first screw 20, the first spring 26 and the first stud 28 are fixed to the front frame 12. Figure 1 Two are shown in the figure, but the present invention is not limited thereto, and the number of configurations depends on the actual assembly requirements of the electronic device 10 .

[0012] The following is a detailed description of the elastic floating design of the circuit board 18. Figure 1 It can be seen that the circuit board 18 is movably mounted on the first stud 28, the first screw 20 is locked on the first stud 28 so that the circuit board 18 can be movably limited between the first screw 20 and the middle frame 14, the heating element 22 can be an electronic component (such as a system on module (SOM), a central processing unit, etc.) that has a high heating temperature during operation and needs to be dissipated and is installed on the circuit board 18 (preferably installed in a screw-locked stud manner, but not limited thereto), and the heat dissipation structure 24 is arranged on the heating element 22 to dissipate heat for the heating element 22, wherein the heat dissipation structure 24 is Figure 1 Only a simple structural block is shown in the figure, and the related heat dissipation structure design is common in the prior art and will not be described here. The first spring 26 is sleeved on the first stud 28 and elastically abuts between the circuit board 18 and the middle frame 14, so that the circuit board 18 can float between the first screw 20 and the middle frame 14 and the circuit board 18 has a tendency to move toward the heat dissipation rear cover 16, so that the heat dissipation structure 24 abuts against the heat dissipation rear cover 16, thereby, the heat energy generated by the heating element 22 during operation can be conducted to the heat dissipation rear cover 16 through the heat dissipation structure 24 to produce a heat dissipation effect.

[0013] More specifically, in this embodiment, each first stud 28 may have a positioning column 30 and a sleeve column 32. A positioning hole 34 may be formed at a position of the circuit board 18 corresponding to the positioning column 30. The diameter of the positioning column 30 may be smaller than the diameter of the sleeve column 32. Thus, the circuit board 18 may be positioned on the middle frame 14 by sleeve-mounting the positioning column 30 through the positioning hole 34. The first spring 26 may be sleeved on the sleeve column 32 to elastically abut between the circuit board 18 and the middle frame 14, so that the circuit board 18 may float and abut between the first screw 20 and the sleeve column 32 and the circuit board 18 may have a tendency to move toward the heat dissipation rear cover 16. In addition, by Figure 1 It can be seen that in order to further improve the heat dissipation efficiency, the electronic device 10 may further include thermal conductive pastes 36 and 38. In this embodiment, the thermal conductive paste 36 can be applied on the heat dissipation structure 24, so that when the heat dissipation structure 24 abuts against the heat dissipation back cover 16, the heat energy generated by the heat dissipation element 22 can be more quickly transferred from the heat dissipation structure 24 to the heat dissipation back cover 16, and the thermal conductive paste 38 can be applied on the heat dissipation element 22, so that when the heat dissipation structure 24 is set on the heat dissipation element 22, the heat energy generated by the heat dissipation element 22 can be more quickly transferred to the heat dissipation structure 24.

[0014] Through the above-mentioned circuit board elastic floating design, if the assembly tolerance is too large during the assembly process of the electronic device 10, the first spring 26 can provide elastic force to drive the circuit board 18 to move toward the heat dissipation rear cover 16, so that the heat dissipation structure 24 can be positively abutted against the heat dissipation rear cover 16 upwards as the circuit board 18 moves, thereby effectively preventing the problem of component overheating caused by the gap in the internal heat transfer path caused by the large assembly tolerance mentioned in the prior art. On the other hand, if the assembly tolerance is too small during the assembly process of the electronic device 10, the circuit board 18 can use the elastic compression characteristics of the first spring 26 to move downward accordingly, thereby effectively avoiding the problem of internal electronic components (such as circuit boards, central processing units) being compressed and damaged during the assembly process due to the small assembly tolerance mentioned in the prior art. In addition, through this elastic floating design, when the electronic device 10 is in an external vibration environment, the electronic device 10 can also use the elastic structural characteristics of the first spring 26 to absorb vibration energy and produce a shockproof protection effect.

[0015] In addition, the present invention can further adopt a spring pull-up design so that the heating element 22 can be surely abutted against the heat dissipation structure 24. For example, Figure 1 As shown, the electronic device 10 may further include at least two second screws 40 and at least two second springs 42 (in Figure 1In the embodiment, two screws are shown, but not limited thereto), the second screw 40 can be movably inserted into the heat dissipation structure 24 to be locked to the heating element 22, and the second spring 42 can be sleeved on the second screw 40 to abut between the heat dissipation structure 24 and the second screw 40. In more detail, in this embodiment, the electronic device 10 can further include a locking plate 44, which is disposed under the heating element 22, whereby the second screw 40 can be movably inserted into the heat dissipation structure 24 and the heating element 22 to be locked to the locking plate 44, so that the heating element 22 can move up and down relative to the heat dissipation structure 24 together with the second screw 40 through the locking between the second screw 40 and the locking plate 44. In this way, the second spring 42 can provide elastic force to drive the second screw 40 to pull the heating element 22 to move upward, so that the heating element 22 can actually abut upward against the heat dissipation structure 24, thereby ensuring that the heat energy generated by the heating element 22 during operation can be smoothly conducted to the heat dissipation structure 24 for heat dissipation.

[0016] It is worth mentioning that the elastic floating design of the present invention can also be applied to the assembly between the heating element and the circuit board to replace the above-mentioned spring pull-up design. For example, see Figure 2 , which is a simplified cross-sectional view of an electronic device 100 according to another embodiment of the present invention. Figure 2 As shown, the electronic device 100 may include a front frame 12, a middle frame 14, a heat dissipation rear cover 16, a circuit board 102, at least two first screws 20, a heat generating element 22, a heat dissipation structure 24, at least two first springs 26, at least two second screws 104, at least two third screws 106, and at least two second springs 108, and the circuit board 102 may have at least two second studs 110, wherein the first screw 20, the first spring 26, the second screw 104, the third screw 106, the second spring 108 and the second stud 110 are arranged in a Figure 2 Two are shown in each embodiment (but not limited to this, and the number of configurations depends on the actual assembly requirements of the electronic device 100), and the components mentioned in this embodiment and the above embodiments have the same number, which means that they have the same or similar structures and functions, and the relevant descriptions can be inferred by referring to the above embodiments, and will not be repeated here.

[0017] Depend on Figure 2 It can be seen that the heating element 22 can be movably mounted on the second stud 110, and the third screw 106 is locked on the second stud 110 so that the heating element 22 can be movably limited between the third screw 106 and the circuit board 102. The second spring 108 is mounted on the second stud 110 and elastically abuts between the heating element 22 and the circuit board 102, so that the heating element 22 can float and support between the third screw 106 and the circuit board 102 and the heating element 22 has a tendency to move toward the heat dissipation structure 24.

[0018] More specifically, in this embodiment, each second stud 110 may have a positioning column 112 and a sleeve column 114, and a positioning hole 116 may be formed at the position of the heating element 22 corresponding to the positioning column 112, and the diameter of the positioning column 112 is smaller than the diameter of the sleeve column 114, whereby the heating element 22 may be positioned on the circuit board 102 by sleeve-mounting the positioning hole 116 on the positioning column 112, and the second spring 108 is sleeved on the sleeve column 114 to elastically abut between the heating element 22 and the circuit board 102, so that the heating element 22 may float and abut between the third screw 106 and the sleeve column 114 and have a tendency to move toward the heat dissipation structure 24. In this way, the second spring 108 may provide elastic force to drive the heating element 22 to abut upward against the heat dissipation structure 24, thereby ensuring that the heat energy generated by the heating element 22 during operation can be smoothly conducted to the heat dissipation structure 24 for heat dissipation.

[0019] It should be noted that Figure 2 It can be seen that in this embodiment, the second screw 104 can be movably inserted into the heat dissipation structure 24 to be locked to the heating element 22. Furthermore, the electronic device 10 can further include a locking plate 118, which is disposed under the heating element 22. Thereby, the second screw 104 can be movably inserted into the heat dissipation structure 24 and the heating element 22 to be locked to the locking plate 118, so that the heating element 22 can move up and down relative to the heat dissipation structure 24 together with the second screw 104 through the locking between the second screw 104 and the locking plate 118.

[0020] The above descriptions are only preferred embodiments of the present invention. All equivalent changes and modifications made according to the claims of the present invention should fall within the scope of the present invention.

Claims

1. An electronic device, characterized in that: include: front frame; A middle frame, fixedly connected to the front frame and having at least two first studs; A heat dissipation back cover, fixedly connected to the front frame to accommodate the middle frame; A circuit board, which can be movably mounted on the at least two first studs; At least two first screws are respectively fixed on the at least two first studs, so that the circuit board can be movably limited between the at least two first screws and the middle frame; A heating element, mounted on the circuit board; A heat dissipation structure is arranged on the heating element; as well as At least two first springs are respectively mounted on the at least two first studs and elastically abut against the circuit board and the middle frame, so that the circuit board can float between the at least two first screws and the middle frame and has a tendency to move toward the heat dissipation back cover, so that the heat dissipation structure abuts against the heat dissipation back cover.

2. The electronic device according to claim 1, wherein: Also includes: At least two second screws, which can be movably inserted into the heat dissipation structure to be locked to the heat generating element; as well as At least two second springs are respectively sleeved on the at least two second screws to abut between the heat dissipation structure and the at least two second screws, and are used to provide elastic force to drive the at least two second screws to pull the heating element to abut against the heat dissipation structure.

3. The electronic device according to claim 2, wherein: The heating element is installed on the circuit board by means of screws locking studs.

4. The electronic device as claimed in claim 2, characterized in that: Also includes: A locking plate is arranged under the heating element, and the at least two second screws can movably pass through the heat dissipation structure and the heating element to be locked to the locking plate.

5. The electronic device according to claim 1, wherein: The circuit board has at least two second studs, and the heating element can be movably mounted on the at least two second studs. The electronic device further includes: At least two second screws, which can be movably inserted into the heat dissipation structure to be locked to the heat generating element; at least two third screws, respectively fixed on the at least two second studs so that the heating element can be movably limited between the at least two third screws and the at least two second studs; and At least two second springs are respectively sleeved on the at least two second studs to abut between the heating element and the circuit board, and are used to provide elastic force to make the heating element abut against the heat dissipation structure.

6. The electronic device as claimed in claim 5, characterized in that: Also includes: A locking plate is arranged under the heating element, and the at least two second screws can movably pass through the heat dissipation structure and the heating element to be locked to the locking plate.

7. The electronic device as claimed in claim 5, characterized in that: Each second stud has a positioning column portion and a sleeve column portion, and the heating element is formed with a positioning hole at a position corresponding to the positioning column portion. The diameter of the positioning column portion is smaller than the diameter of the sleeve column portion, and the positioning hole is sleeved on the positioning column portion, and the first spring is sleeved on the sleeve column portion to elastically abut between the heating element and the circuit board.

8. The electronic device as claimed in claim 1, wherein: Also includes: The thermal conductive paste is coated on the heat dissipation structure and is used for conducting the heat energy generated by the heating element from the heat dissipation structure to the heat dissipation back cover when the heat dissipation structure abuts against the heat dissipation back cover.

9. The electronic device as claimed in claim 1, wherein: Also includes: The thermal conductive paste is coated on the heating element and is used for conducting the heat energy generated by the heating element to the heat dissipation structure when the heat dissipation structure is arranged on the heating element.

10. The electronic device according to claim 1, wherein: Each first stud has a positioning column portion and a sleeve column portion, and a positioning hole is formed on the circuit board at a position corresponding to the positioning column portion. The diameter of the positioning column portion is smaller than the diameter of the sleeve column portion, and the positioning hole is sleeved on the positioning column portion, and the first spring is sleeved on the sleeve column portion to elastically abut between the circuit board and the middle frame.

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