Micro-hole machining equipment and machining method

Abstract

The invention discloses micro-hole machining equipment and a micro-hole machining method, and belongs to the technical field of micro-hole machining. According to the technical scheme, the method comprises the steps that firstly, a pilot through hole is machined in the punching position of a workpiece, then the pilot through hole is machined through water-guided laser, and a final hole is obtained; the diameter of the pilot through hole is not smaller than the diameter of a water beam of the water-guided laser, and the diameter of the pilot through hole is 15-80% of the final hole diameter. The device is applied to the aspect of micro-hole machining, solves the technical problem that in the prior art, when large-depth-diameter-ratio micro-hole machining is carried out, due to accumulated water interference, energy of laser reaching the surface of a workpiece is greatly reduced, and consequently machining efficiency is sharply reduced, and has the advantage of being high in machining efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of micro-hole processing, and in particular relates to a micro-hole processing device and a processing method. Background Art

[0002] Water-guided laser technology has been applied to the processing of tiny deep holes and the cutting of parts, such as the film cooling holes of engine turbine blades. The principle is to couple the laser into a small diameter high-pressure water beam, use the total reflection phenomenon of light at the interface between water and air, conduct the laser to the workpiece surface through the water beam, ablate the workpiece material, and achieve removal processing.

[0003] Chinese patent CN 107344258 B proposes a combined processing method of water-conducting laser and electric machining, the purpose of which is to utilize the characteristics of each of the two processing methods to process a certain feature of the part. For example, when processing a small hole on a turbine blade with a ceramic coating, a water-conducting laser is used to process the surface ceramic coating, and then the metal substrate is processed by electric discharge. Its main features are: there is a water-conducting laser device and an electric discharge machining device, and each of the two devices has a positioning system, called the first positioning system and the second positioning system. During processing, according to the needs of a certain processing feature, the workpiece is switched between the two positioning systems.

[0004] However, when water-guided lasers are used to process tiny holes with a large aspect ratio (the ratio of the hole's depth to its diameter), as the depth increases, it becomes difficult to drain the accumulated water in the hole. The accumulated water will become deeper and deeper, and under the influence of the flow field and gravity field, the accumulated water will seriously interfere with the shape of the water beam, destroying the smooth water-air interface that could have formed total reflection, causing the laser to escape, greatly reducing the energy of the laser reaching the workpiece surface, and causing a sharp drop in processing efficiency. Summary of the invention

[0005] The details of one or more embodiments of the present invention are set forth in the following drawings and description to make other features, objects, and advantages of the present application more readily apparent.

[0006] The present invention proposes a micro-hole processing device and a processing method, which solves the technical problem in the prior art that when processing micro-holes with a large aspect ratio, the energy of the laser reaching the workpiece surface is greatly reduced due to the interference of accumulated water, resulting in a sharp decrease in processing efficiency, and has the characteristic of high processing efficiency.

[0007] On one hand, the present invention discloses a micro-hole processing method for drilling micro-holes in a workpiece, comprising: first processing a pilot hole at a punching position of the workpiece, and then processing the pilot hole with a water-conducting laser to obtain a final hole; the diameter of the pilot hole is not less than the water beam diameter of the water-conducting laser, and the diameter of the pilot hole is 15-80% of the diameter of the final hole.

[0008] In some of the embodiments, the pilot through hole is machined at the drilling position of the workpiece by using electric spark or ultrafast laser.

[0009] In some embodiments, the micro-holes include: micro-holes with a diameter of 0.3-0.6 mm and an aspect ratio greater than 10:1, micro-holes with a diameter of 0.8-1.2 mm and an aspect ratio greater than 15:1, and micro-holes with a diameter greater than 1.2 mm and an aspect ratio greater than 25:1.

[0010] On the other hand, the present invention discloses a micro-hole processing device for the micro-hole processing method described in any of the above technical solutions, comprising: a pilot through-hole processing device, comprising a pilot through-hole processing head; a water-conducting laser device, comprising a water-conducting laser processing head; a motion device, comprising: a Y-axis motion axis, vertically arranged on one side of a workpiece; an X-axis motion axis, horizontally arranged above the workpiece and vertically connected to the Y-axis motion axis; a Z-axis motion axis, connected to the X-axis motion axis, and perpendicular to the Y-axis motion axis and the X-axis motion axis in pairs; the pilot through-hole processing head and the water-conducting laser processing head are installed on the Z-axis motion axis; and a control device, which controls the pilot through-hole processing head to first process the pilot through-hole at the punching position of the workpiece, and then controls the water-conducting laser processing head to process the pilot through-hole to obtain a final hole.

[0011] In some embodiments, the motion device further includes a workbench for fixing the workpiece, and the workbench, the Y-axis motion axis, the X-axis motion axis, and the Z-axis motion axis are installed on the same machine tool base.

[0012] In some of the embodiments, the Z-axis motion axis includes a first Z-axis motion axis connected to the pilot through-hole processing head, and a second Z-axis motion axis connected to the water-guided laser processing head.

[0013] In some embodiments, the water-guided laser processing head includes: a high-pressure water chamber, the inner wall of which forms a chamber, and the chamber is filled with water; a glass window is provided on one side, and a nozzle is opened on the other side, and the nozzle is arranged opposite to the glass window; a focusing lens is arranged opposite to the glass window, and the focusing point is aligned with the nozzle; after the laser is focused by the focusing lens, it passes through the glass window and passes through the nozzle together with the water in the chamber to form a high-pressure water beam coupled with the laser.

[0014] In some embodiments, the pilot through hole machining device is an electric spark device, the electric spark device includes an electric spark machining head, and the electric spark machining head includes: an electrode, the electrode is a hollow electrode, and gas or liquid is passed through the hollow electrode.

[0015] In some of the embodiments, the control device is electrically connected to the pilot through-hole processing device, the water-guided laser device, and the motion device.

[0016] In some of the embodiments, the pilot through hole processing device further includes a pilot through hole processing device host, and the pilot through hole processing device host is electrically connected to the control device and the pilot through hole processing head; the water-conducting laser device further includes a water-conducting laser device host, and the water-conducting laser device host is electrically connected to the control device and the water-conducting laser processing head.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The present invention provides a micro-hole processing method, which first manufactures a pilot through hole with a diameter smaller than the final hole diameter on a workpiece, and then uses a water-guided laser to perform subsequent hole expansion processing on the pilot through hole at the same position, wherein the pilot through hole is used as a prefabricated drainage through hole for water-guided laser processing, thereby facilitating the drainage of accumulated water in the subsequent water-guided laser processing process, greatly improving the processing efficiency;

[0019] The present invention also provides a micro-hole processing device, which uses a pilot through-hole processing device as a pre-processing device for processing the pilot through-hole, and prefabricates drainage through-holes for water-conducting laser processing, which is beneficial for draining accumulated water during subsequent water-conducting laser processing and improves processing efficiency;

[0020] The present invention provides a micro-hole processing device. By limiting the structural form of a motion device and the installation form of the motion device, a pilot through-hole processing device and a water-guided laser device, and further limiting that a workbench and a Y-axis motion axis, an X-axis motion axis and a Z-axis motion axis are installed on the same machine tool base, a uniform positioning reference is provided. After the workpiece is clamped on the workbench, it is no longer disassembled during the processing. The pilot through-hole processing head and the water-guided laser processing head are driven by the motion device to move to the processing position of the workpiece respectively for processing, thereby ensuring the processing efficiency and improving the positioning accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0022] Figure 1 A schematic diagram of the structure of a micro-hole processing device provided by an embodiment of the present invention;

[0023] Figure 2 A schematic diagram of the structure of a water-guided laser processing head provided by an embodiment of the present invention;

[0024] Figure 3A schematic diagram of the drilling principle of a water-guided laser processing head provided in an embodiment of the present invention;

[0025] Figure 4 A schematic diagram of the structure of the electric spark device and a schematic diagram of the punching processing principle provided by an embodiment of the present invention;

[0026] Figure 5 A is a schematic diagram of the processing principle of a micro-hole processing device provided in an embodiment of the present invention;

[0027] Figure 6 Schematic diagram B of the processing principle of the micro-hole processing equipment provided by the embodiment of the present invention;

[0028] Figure 7 Schematic diagram C of the processing principle of the micro-hole processing equipment provided by the embodiment of the present invention;

[0029] Description of the drawings: 101, Y-axis motion axis; 102, X-axis motion axis; 103, first Z-axis motion axis; 104, second Z-axis motion axis; 105, workbench; 106, machine tool base; 201, pilot through-hole processing head; 2011, electrode; 202, pilot through-hole processing device host; 301, water-guided laser processing head; 3011, high-pressure water chamber; 3012, glass window; 3013, nozzle; 3014, focusing lens; 302, water-guided laser device host; 40, control device; 50, workpiece; 501, pilot through hole; 502, final hole; 601, laser; 602, water beam; 603, scattered laser; 604, photo-induced plasma; 605, accumulated water; 701, gas or liquid in the center of the electrode; 702, electro-induced plasma. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical scheme and advantages of the present invention more clearly understood, the present invention is described and illustrated below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. Based on the embodiments provided by the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention.

[0031] Obviously, the drawings described below are only some examples or embodiments of the present invention. For ordinary technicians in this field, the present invention can also be applied to other similar scenarios based on these drawings without creative work. In addition, it can also be understood that although the efforts made in this development process may be complicated and lengthy, for ordinary technicians in this field related to the content disclosed by the present invention, some changes in design, manufacturing or production based on the technical content disclosed by the present invention are just conventional technical means, and should not be understood as insufficient content disclosed by the present invention.

[0032] Reference to "embodiments" in the present invention means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described in the present invention may be combined with other embodiments without conflict.

[0033] Unless otherwise defined, the technical terms or scientific terms involved in the present invention shall have the usual meanings understood by persons with ordinary skills in the technical field to which the present invention belongs. The words "one", "a", "a", "the" and the like involved in the present invention do not indicate a quantity limitation and may indicate the singular or plural. The terms "include", "comprise", "have" and any of their variations involved in the present invention are intended to cover non-exclusive inclusions; for example, a process, method, system, product or device including a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units that are not listed, or may also include other steps or units inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like involved in the present invention are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The "multiple" involved in the present invention refers to two or more. "And / or" describes the association relationship of associated objects, indicating that there may be three relationships, for example, "A and / or B" may indicate: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects in the front and back relation are in an "or" relationship. The terms "first", "second", etc. involved in the present invention are only used to distinguish similar objects and do not represent a specific ordering of the objects.

[0034] On one hand, the present invention discloses a micro-hole processing method for drilling a micro-hole in a workpiece 50, comprising: first processing a pilot hole 501 at a punching position of the workpiece 50, and then processing the pilot hole 501 using a water-guided laser 601 to obtain a final hole 502; the diameter of the pilot hole 501 is not less than the diameter of a water beam 602 of the water-guided laser 601, and the diameter of the pilot hole 501 is 15-80% of the diameter of the final hole 502.

[0035] When the water-guided laser 601 processes tiny holes, it removes the material layer by layer. Deep holes need to be processed repeatedly dozens or even hundreds of times. Before the hole is drilled through, water 605 will accumulate inside the hole. Normally, the high-pressure water beam 602 flushes away the water below the water beam 602, and the water beam 602 can reach the bottom of the hole directly. The laser 601 can be transmitted to the surface of the workpiece 50 along with the water beam 602 to melt or vaporize the material to achieve processing. However, as the depth increases, especially for holes with a small diameter and a large aspect ratio, the high-pressure water beam 602 will be disturbed by the accumulated water 605 reflected and upwelling in the hole, causing the difficulty of processing to increase sharply. Not only will the processing efficiency be greatly reduced, but the shape of the water beam 602 may also be destroyed, causing the processing to be interrupted, or the shape quality of the processed hole will be poor. The above-mentioned micro-hole processing method provided by the present invention first processes a through hole with a smaller diameter than the final required hole, which is called a pilot through hole 501, and then expands the hole. At this time, due to the existence of the pilot through hole 501, the accumulated water 605 can be discharged from the bottom, so the water beam 602 of the water-guided laser 601 can avoid the influence of the accumulated water 605, thereby improving the processing efficiency.

[0036] The above-mentioned micro-hole processing method first manufactures a pilot through hole 501 with a diameter smaller than the diameter of the final hole 502 on the workpiece 50, and then uses a water-conducting laser 601 to perform subsequent hole expansion processing on the pilot through hole 501 at the same position, wherein the pilot through hole 501 is used as a prefabricated drainage through hole for water-conducting laser 601 processing, thereby facilitating the discharge of accumulated water 605 during the subsequent water-conducting laser 601 processing, greatly improving the processing efficiency. This method can be used for the processing of micro-group holes in aircraft engine turbine blades and combustion chambers, and the efficiency can be significantly improved compared to single water-conducting laser 601 processing. Furthermore, compared to the use of water-conducting laser 601 processing alone, the processing efficiency of the above-mentioned method provided by the present invention can be improved several times when processing small diameter and large aspect ratio holes.

[0037] The above technical solution further defines that the diameter of the pilot via hole 501 is not less than the diameter of the water beam 602 of the water-conducting laser 601, and the diameter of the pilot via hole 501 is 15-80% of the diameter of the final hole 502. The reason is that if the diameter of the pilot via hole 501 is too small, it is not conducive to drainage during the subsequent water-conducting laser processing, and if it is too large, the processing takes too long, reducing the overall processing efficiency. Taking the diameter of the water beam 602 and the diameter of the final hole 502 as a reference, the smaller the diameter of the final hole 502, the more difficult it is to drain water from the front during water-conducting laser processing, the greater the demand for the drainage effect of the pilot via hole 501, and the larger the diameter ratio of the pilot via hole 501 to the final hole 502, which can reach 80% at most. If it is larger, it will not be conducive to improving the overall processing efficiency. The larger the diameter of the final hole 502, the greater the front drainage capacity, the lower the drainage demand for the pilot hole 501, and the smaller the diameter ratio of the pilot hole 501 to the final hole 502, which can be 15% of the diameter of the final hole 502 or not less than the diameter of the water beam 602. Any smaller diameter will be detrimental to the drainage effect. The diameter of the pilot hole 501 can also be 20%, 30%, 40%, 50%, 60%, 70% of the diameter of the final hole 502, and any point value within the range.

[0038] In some embodiments, an electric spark or ultrafast laser 601 is used to process a pilot hole 501 at the punching position of the workpiece 50. Since the pilot hole 501 has a smaller diameter and the water accumulation 605 problem, the efficiency of processing the pilot hole 501 by water-conducting laser 601 is low, so electric spark perforation processing, ultrafast laser 601 perforation and other methods can be used. Among them, electric spark perforation processing is a widely used method for precision hole making of micro holes, which can process deep holes with diameters of 0.015mm to 3mm. It uses a rod-shaped electrode 2011 made of conductive material. After power is turned on, the medium between the electrode 2011 and the workpiece 50 is ionized, generating high-temperature plasma, and ablating and removing the material of the workpiece 50. The electrode 2011 can be hollow or solid. Among them, water or gas and other media are passed through the hollow electrode 2011, which can process more precise holes.

[0039] In some embodiments, the micro-holes include: micro-holes with a diameter of 0.3-0.6 mm and a depth-to-diameter ratio greater than 10:1, micro-holes with a diameter of 0.8-1.2 mm and a depth-to-diameter ratio greater than 15:1, and micro-holes with a diameter greater than 1.2 mm and a depth-to-diameter ratio greater than 25:1. Micro-holes with the above-mentioned sizes are very difficult to process. The prior art has the problem of low processing efficiency and difficulty in ensuring the quality of the processed through-holes when processing the above-mentioned micro-holes. The micro-hole processing method provided by the above-mentioned embodiment of the present invention first manufactures a pilot through-hole 501 with a diameter smaller than the diameter of the final hole 502 on the workpiece 50, and then uses a water-conducting laser 601 to perform subsequent hole expansion processing on the pilot through-hole 501 at the same position, thereby solving the above-mentioned problems and having the characteristics of high processing efficiency and high processing quality of the final hole 502.

[0040] The embodiment of the present invention also provides a micro hole processing device, Figure 1 Schematic diagram of the structure of a micro-hole processing device according to an embodiment of the present invention. Figure 1 As shown, the micro-hole processing equipment includes: a pilot through hole 501 processing device, including a pilot through hole processing head 201; a water-conducting laser 601 device, including a water-conducting laser processing head 301; a motion device, including: a Y-axis motion axis 101, which is vertically arranged on one side of the workpiece 50; an X-axis motion axis 102, which is horizontally arranged above the workpiece 50 and vertically connected to the Y-axis motion axis 101; a Z-axis motion axis, which is connected to the X-axis motion axis 102 and is vertical to the Y-axis motion axis 101 and the X-axis motion axis 102; the pilot through hole processing head 201 and the water-conducting laser processing head 301 are installed on the Z-axis motion axis; and a control device 40, which controls the pilot through hole processing head 201 to first process the pilot through hole 501 at the punching position of the workpiece 50, and then controls the water-conducting laser processing head 301 to process the pilot through hole 501 to obtain the final hole 502. When the micro-hole processing equipment is used to process micro-holes, the pilot through hole 501 processing device first processes the pilot through hole 501. The diameter of the hole is much smaller than the diameter or the slit width of the final hole 502. The pilot through hole 501 is only used as an intermediate step to remove the water 605 in the hole during the next water-conducting laser 601 processing. The subsequent water-conducting laser 601 processing process is what really affects the final features of the part. The micro-hole processing equipment uses the pilot through hole 501 processing device as a pre-processing device for processing the pilot through hole 501, and prefabricates the drainage through hole for the water-conducting laser 601 processing, which is conducive to the discharge of the accumulated water 605 during the subsequent water-conducting laser 601 processing and improves the processing efficiency.

[0041] Regarding the above-mentioned motion device, it should be noted that the motion mechanism can have a variety of configurations. Figure 1One typical configuration is shown, in which the pilot through-hole processing head 201 is installed on a Z-axis motion axis, the water-guided laser processing head 301 is installed on another Z-axis motion axis, and the above two Z-axis motion axes are installed on the X-axis motion axis 102 beam, and the above X-axis motion axis 102 is installed on two Y-axis motion axis 101 columns.

[0042] Furthermore, the motion device also includes a workbench 105 for fixing the workpiece 50, and the workbench 105, the Y-axis motion axis 101, the X-axis motion axis 102, and the Z-axis motion axis are installed on the same machine tool base 106. This embodiment defines the structural form of the motion device, and the installation form of the motion device and the pilot through hole 501 processing device and the water-conducting laser 601 device, and further defines that the workbench 105 and the Y-axis motion axis 101, the X-axis motion axis 102, and the Z-axis motion axis are installed on the same machine tool base 106, so that they have a unified positioning reference. The workpiece 50 is clamped on the workbench 105 and is no longer disassembled during the processing. The pilot through hole processing head 201 and the water-conducting laser processing head 301 are driven by the motion device and move to the processing position of the workpiece 50 respectively for processing, thereby ensuring the processing efficiency and improving the positioning accuracy. Specifically:

[0043] The Y-axis motion shaft 101 is mounted on a machine tool base 106. The workpiece 50 to be processed is clamped on the table surface of the workbench 105. The workbench 105 can be a fixed platform or a Figure 1 The precision displacement table 105 with two rotating axes is shown in FIG. The table 105 and the axes of the motion device are mounted on the same machine tool base 106, which is conducive to building a unified positioning reference and reducing positioning work. The above-mentioned motion axes, the table 105 and the machine tool base 106 together constitute the motion device, which has a common positioning reference, and there is no need for repeated positioning during the processing. The structure of the motion device is not limited to Figure 1 The configuration shown is characterized in that the workpiece 50 is fixed on the workbench 105 and is not removed during the entire processing process. The moving device can respectively carry the pilot through-hole processing head 201 and the water-guided laser processing head 301 to the processing position on the workpiece 50 and perform drilling processing.

[0044] In some of the embodiments, the Z-axis motion axis includes a first Z-axis motion axis 103 connected to the pilot through-hole processing head 201 , and a second Z-axis motion axis 104 connected to the water-guided laser processing head 301 .

[0045] like Figure 2As shown, the water-guided laser processing head 301 includes: a high-pressure water chamber 3011, the inner wall of which forms a chamber filled with water; a glass window 3012 is provided on one side, and a nozzle 3013 is provided on the other side, and the nozzle 3013 is arranged opposite to the glass window 3012; a focusing lens 3014 is arranged opposite to the glass window 3012, and the focus point is aligned with the nozzle 3013; after the laser 601 is focused by the focusing lens 3014, it passes through the glass window 3012 and the water in the chamber and passes through the nozzle 3013 to form a high-pressure water beam 602 coupled with the laser 601. Specifically, the high-pressure water chamber 3011 has a light-transmitting glass window 3012 on the upper part and a nozzle 3013 on the lower part, and the diameter of the nozzle 3013 is usually 20-100μm. The high-pressure water is ejected through the nozzle 3013 to form a slender water beam 602. The laser 601 is converged by a focusing mirror and enters the high-pressure water chamber 3011 through a glass window 3012. The focus is aligned with the nozzle 3013, and the laser 601 is introduced into the water beam 602. When the incident angle of the laser 601 at the interface between water and air is greater than the critical angle, total reflection will occur, and the laser 601 can be transmitted in the water beam 602 until it reaches the surface of the workpiece 50, forming a high-temperature photo-induced plasma 604 to ablate and remove the material to achieve processing. Among them, water can not only transmit the laser 601, but also take away the material waste and heat during the processing. However, when the water-guided laser 601 processing area is formed due to poor drainage, Figure 3 When water 605 is accumulated as shown, it will affect the shape of the water beam 602, causing the energy of the laser 601 to dissipate, forming escaped scattered laser 601, which cannot be effectively transmitted to the area to be processed, causing the processing efficiency to drop significantly or even stagnate.

[0046] like Figure 4 As shown, the processing device for the pilot through hole 501 is an electric spark device, and the electric spark device includes an electric spark processing head, and the electric spark processing head includes: an electrode 2011, and the electrode 2011 is a hollow electrode 2011, and gas or liquid is passed through the hollow electrode 2011. When processing the pilot through hole 501, the hollow electrode 2011 and the workpiece 50 are respectively connected to the two poles of the power supply, and the gas or liquid is passed through the middle of the hollow electrode 2011. At the end of the electrode 2011, an electric plasma 702 is formed due to the tip discharge, and the material of the workpiece 50 is ablated and removed. The hollow electrode 2011 can move along the feeding direction to achieve the punching process and form the pilot through hole 501.

[0047] In some embodiments, the control device 40 is electrically connected to the pilot through hole 501 processing device, the water-conducting laser 601 device, and the motion device. Further, the pilot through hole 501 processing device also includes a pilot through hole processing device host 202, which is electrically connected to the control device 40 and the pilot through hole processing head 201; the water-conducting laser 601 device also includes a water-conducting laser laser device host 302, which is electrically connected to the control device 40 and the water-conducting laser processing head 301. Among them, the control device 40 connects and uniformly controls the motion device, the water-conducting laser 601 processing device, and the pilot through hole 501 processing device. Human-computer interaction is realized, and processing instructions are issued to the above-mentioned devices for processing. The water-conducting laser 601 device is composed of a water-conducting laser processing head 301, a water-conducting laser laser device host 302, and optical fibers, cables, pipelines, etc. connecting the two. The pilot through hole processing head 201 is connected to the pilot through hole processing device host 202 through cables, pipelines, etc.; the water-conducting laser processing head 301 is connected to the water-conducting laser device host 302 through optical fibers, cables, pipelines, etc.

[0048] The process of using the above-mentioned micro-hole processing equipment to process the workpiece 50 is as follows: Figure 5-Figure 7 As shown, specifically: the position, shape and other data information of the hole of the workpiece 50 to be processed are imported into the CAM programming software, and the data information can be a two-dimensional drawing or a three-dimensional data model. The CAM programming software determines the processing position, motion path and process parameters, generates a processing code, and transmits it to the hole machine tool control device 40. The workpiece 50 is positioned on the workbench 105. The posture and position of the workpiece 50 in the machine tool must be consistent with the data information imported into the CAM programming software, which can usually be ensured by a positioning fixture or a positioning measurement device.

[0049] The various parts of the motion device, especially the first Z-axis motion axis 103, drive the EDM head from the initial parking position to the position to be processed on the workpiece 50, and drill a pilot hole 501 on the workpiece 50. The diameter of the pilot hole 501 is smaller than the diameter of the final hole 502. Generally, it can be 15-80% of the diameter of the final hole 502, and the minimum is not less than the diameter of the water beam 602 of the water-guided laser 601. The diameter of the water beam 602 commonly used in water-guided laser 601 processing is 40-150μm. The optimal aperture of the EDM pilot hole 501 can be determined by experiment, based on the principle of being able to smoothly discharge the accumulated water 605 during the water-guided laser 601 processing process and improving the processing efficiency. Under this premise, the smaller the aperture, the higher the comprehensive efficiency.

[0050] After the processing of the pilot hole 501 is completed, the motion device drives the EDM head to return to the initial parking position. The various parts of the motion device, especially the second Z-axis motion shaft 104, drive the water-conducting laser processing head 301 from the initial parking position to the processing position, and continue processing at the position of the pilot hole 501 until the required hole, that is, the final hole 502, is reached.

[0051] During the processing, all through holes to be processed can be processed by electric spark, and then the hole expansion processing of water-conducting laser 601 can be carried out; or one or several through holes can be processed by electric spark, and then the water-conducting laser 601 processing can be carried out, and the cycle is repeated until all holes are processed. It should be noted that the electric spark processing in this scheme can also be replaced by common ordinary laser 601 processing transmitted in the air, such as picosecond femtosecond ultrafast laser 601 processing, etc., which is also for the purpose of pre-processing a through hole with a smaller diameter for drainage, which is convenient for the subsequent water-conducting laser 601 processing.

[0052] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A micro hole processing method for drilling micro holes in a workpiece, characterized in that: include: First, a pilot via hole is processed at the punching position of the workpiece, and then the pilot via hole is processed by a water-conducting laser to obtain a final hole; the diameter of the pilot via hole is not less than the water beam diameter of the water-conducting laser, and the diameter of the pilot via hole is 15-80% of the diameter of the final hole.

2. The micro hole processing method according to claim 1, characterized in that: The pilot through hole is processed at the punching position of the workpiece by using electric spark or ultrafast laser.

3. The micro hole processing method according to claim 1, characterized in that: The micro-holes include: micro-holes with a diameter of 0.3-0.6 mm and a depth-to-diameter ratio greater than 10:1, micro-holes with a diameter of 0.8-1.2 mm and a depth-to-diameter ratio greater than 15:1, and micro-holes with a diameter greater than 1.2 mm and a depth-to-diameter ratio greater than 25:

1.

4. A micro-hole processing device for use in the micro-hole processing method according to any one of claims 1 to 3, characterized in that: include: A pilot through-hole processing device, comprising a pilot through-hole processing head; A water-guided laser device, including a water-guided laser processing head; Sports equipment, including: The Y-axis motion axis is set vertically on one side of the workpiece; An X-axis motion axis is horizontally arranged above the workpiece and vertically connected to the Y-axis motion axis; The Z-axis motion axis is connected to the X-axis motion axis and is perpendicular to the Y-axis motion axis and the X-axis motion axis in pairs; the pilot through-hole processing head and the water-guided laser processing head are installed on the Z-axis motion axis; And a control device controls the pilot through hole processing head to first process the pilot through hole at the punching position of the workpiece, and then controls the water-conducting laser processing head to process the pilot through hole to obtain a final hole.

5. The micro hole processing equipment according to claim 4, characterized in that: The motion device also includes a workbench for fixing the workpiece, and the workbench, the Y-axis motion axis, the X-axis motion axis, and the Z-axis motion axis are installed on the same machine tool base.

6. The micro hole processing equipment according to claim 4, characterized in that: The Z-axis motion axis includes a first Z-axis motion axis connected to the pilot through-hole processing head, and a second Z-axis motion axis connected to the water-guided laser processing head.

7. The micro hole processing equipment according to claim 4, characterized in that: The water-guided laser processing head comprises: The high-pressure water chamber has an inner wall forming a chamber filled with water; one side is provided with a glass window, and the other side is provided with a nozzle, and the nozzle is arranged opposite to the glass window; A focusing lens is arranged opposite to the glass window, and a focusing point is aligned with the nozzle; after being focused by the focusing lens, the laser passes through the glass window and the water in the chamber and passes through the nozzle to form a high-pressure water beam coupled with the laser.

8. The micro-hole processing equipment according to claim 4, characterized in that: The pilot through hole machining device is an electric spark device, and the electric spark device includes an electric spark machining head, and the electric spark machining head includes: an electrode, and the electrode is a hollow electrode, and gas or liquid is passed through the hollow electrode.

9. The micro-hole processing equipment according to claim 4, characterized in that: The control device is electrically connected to the pilot through hole processing device, the water-conducting laser device and the motion device.

10. The micro hole processing equipment according to claim 4, characterized in that: The pilot through hole processing device also includes a pilot through hole processing device host, and the pilot through hole processing device host is electrically connected to the control device and the pilot through hole processing head; the water-conducting laser device also includes a water-conducting laser device host, and the water-conducting laser device host is electrically connected to the control device and the water-conducting laser processing head.

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