Photovoltaic cell slicing device and method

Abstract

The invention discloses a photovoltaic cell slicing device and method, and relates to the technical field of photovoltaic cell slicing processing.The photovoltaic cell slicing device comprises carrying mechanisms, a clamping mechanism for clamping a silicon wafer is arranged between the carrying mechanisms, and a conveying mechanism for conveying the silicon wafer is arranged on one side of each carrying mechanism; according to the automatic silicon wafer feeding device, through cooperation of the carrying mechanism, the clamping mechanism and the cleaning mechanism, the upper surfaces of the silicon wafers are cleaned in the feeding process of the silicon wafers, the working efficiency is improved, the labor intensity of workers is lowered, the labor intensity of workers is lowered, and the labor intensity of workers is lowered. And the slicing mechanism is arranged to shield solid particles generated during cutting, the solid particles are prevented from drifting away from the four sides, potential safety hazards are reduced, dirt on the outer surface of the cleaning roller is scraped away through a scraping plate, and pollution to the silicon wafers is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of photovoltaic cell slicing processing, and in particular to a photovoltaic cell slicing device and method. Background Art

[0002] Photovoltaic cells are batteries that use solar energy to convert it into electrical energy. They are a clean and renewable energy method. Solar cells generate electricity based on the photoelectric properties of specific materials. For example, the sun radiates electromagnetic waves of different wavelengths, such as infrared, ultraviolet, visible light, etc. When these rays shine on different conductors or semiconductors, photons interact with free electrons in the conductors or semiconductors to generate electric current. The shorter the wavelength of the rays and the higher the frequency, the higher the energy they have.

[0003] At present, the production process of photovoltaic cells needs to go through processing steps such as slicing, string welding, curing and testing. When photovoltaic cells are laser sliced, the surface of the silicon wafer needs to be kept clean to prevent stains on the surface of the silicon wafer from affecting the laser cutting. However, most of the current laser slicing mechanisms need to clean the surface of the silicon wafer before loading and slicing. The surface of the silicon wafer cannot be cleaned during the loading process, which affects the processing efficiency. In addition, tiny solid particles will be released during the laser cutting process. These particles may cause harm to the respiratory system and there is a certain risk. In response to the above problems, the inventor proposes a photovoltaic cell slicing device and method for solving the above problems. Summary of the invention

[0004] In order to solve the problem that the silicon wafer cannot be cleaned during the loading process and there is no shielding for solid particles; the purpose of the present invention is to provide a photovoltaic cell slicing device and method.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions: a photovoltaic cell slicing device, comprising a conveying mechanism, a clamping mechanism for clamping silicon wafers is arranged between the conveying mechanisms, a transport mechanism for transporting silicon wafers is arranged on one side of the conveying mechanism, a slicing mechanism for cutting silicon wafers is arranged in the middle of the upper surface of the transport mechanism, and a cleaning mechanism for cleaning the surface of the silicon wafer is arranged below the clamping mechanism.

[0006] Preferably, the conveying mechanism includes a support frame, the sides of the two support frames close to each other are slidably installed with a moving seat, the two moving seats on the same side are slidably installed with a vertical plate, the sides of the two vertical plates away from each other are fixedly installed with guide columns, and the end of the guide column away from the vertical plate slides through the support frame, a mounting rod is rotatably installed in the support frame, a rotating plate is fixedly installed on the outer surface of the mounting rod, and the end of the guide column away from the vertical plate slides through the rotating plate, a first cross bar is rotatably installed at the bottom between the two support frames, and the two ends of the first cross bar and the two mounting rods are driven by synchronous wheels and synchronous belts, a mounting plate is fixedly installed on the side of the support frame on the left, a No. 1 motor is fixedly installed on the upper surface of the mounting plate, and the No. 1 motor output shaft is fixedly connected to the first cross bar at one end close to the support frame, and a No. 1 gear plate is fixedly installed on the top of the support frame.

[0007] Preferably, the clamping mechanism includes a fixed plate, and the two ends of the fixed plate are respectively fixedly connected to the two vertical plates, two clamping frames are slidably installed on the lower surface of the fixed plate, and the side surfaces of the bottoms of the two clamping frames are close to each other and are in movably contact with the two sides of the silicon wafer, a horizontal bar is fixedly installed between the top ends of the clamping frames, and the horizontal bar is slidably arranged inside the fixed plate, rotating columns are rotatably installed on both sides of the fixed plate, two rotating bars are fixedly installed on the outer surface of the rotating column, a connecting bar is rotatably installed on the end of the upper surface of the two rotating bars away from the rotating column, and the end of the connecting bar away from the rotating bar is rotatably connected to the horizontal bar, an electric cylinder is fixedly installed on the side of the fixed plate, and the end of the electric cylinder output shaft close to the fixed plate is fixedly connected to the horizontal bar.

[0008] Preferably, the transport mechanism includes a support plate, and the two support plates are located on a side of the support frame away from the fixed plate, a driving rod is rotatably installed between both ends of the two support plates, a No. 2 motor is fixedly installed on the side of the support plate located on the left, and the end of the No. 2 motor output shaft close to the support plate is fixedly connected to the driving rod, two transport wheels are fixedly installed on the outer surface of the driving rod, a transport belt is transmission-installed between the two opposite transport wheels, three connecting blocks are fixedly installed on the outer surface of the transport belt, and a placement plate is fixedly installed on the side of the connecting block away from the transport belt.

[0009] Preferably, the slicing mechanism includes a fixed frame, and the fixed frame is fixedly installed on the support plate, two fixed columns are slidably installed in the middle of the fixed frame, a shielding box is fixedly installed at the bottom end of the fixed column, and the bottom end of the shielding box is in active contact with the lower surface of the silicon wafer, a No. 2 spring is fixedly installed in the middle of the lower surface of the fixed frame, and the bottom end of the No. 2 spring is fixedly connected to the shielding box, two dust suction devices are fixedly installed on the upper surface of the fixed frame, and one end of the suction pipe at the bottom of the dust suction device away from the dust suction device is fixedly connected to the shielding box, a laser cutting device is fixedly installed in the middle of the upper surface of the fixed frame, and the shielding box is slidably sleeved on the output head of the laser cutting device.

[0010] Preferably, the cleaning mechanism includes a mounting box, and the mounting box is located below the fixed plate, a cleaning roller is rotatably mounted in the mounting box, and the outer surface of the cleaning roller is in active contact with the outer surface of the silicon wafer, a square block is fixedly mounted on the side of the mounting box, a vertical cylinder is rotatably mounted in the square block, a No. 3 bevel gear is fixedly mounted on the bottom end of the vertical cylinder, a No. 4 bevel gear is fixedly mounted on one end of the cleaning roller, and the No. 4 bevel gear is meshed with the No. 3 bevel gear, scrapers are rotatably mounted on both sides of the mounting box, and the ends of the two scrapers close to each other are in active contact with the outer surface of the cleaning roller, a third spring is fixedly mounted on the outer surfaces of both ends of the scraper, and the third spring One end of the three springs away from the scraper is fixedly connected to the inside of the installation box, and the end of the scraper away from the vertical cylinder is fixedly installed with a No. 7 bevel gear, and two rectangular bars are fixedly installed on the side of the installation box away from the vertical cylinder, and a second cross bar is rotatably installed in the two rectangular bars, and a No. 8 bevel gear is fixedly installed on the outer surface of the second cross bar, and the No. 8 bevel gear is meshed with the No. 7 bevel gear, and a No. 6 bevel gear is fixedly installed on the outer surface of the middle part of the second cross bar, and a fixing bar is fixedly installed on the side of the installation box away from the vertical cylinder, and a rotating cylinder is rotatably installed in the fixing bar, and a No. 5 bevel gear is fixedly installed on the bottom end of the rotating cylinder, and the No. 5 bevel gear is meshed with the No. 6 bevel gear.

[0011] Material toggling mechanism, its both sides respectively have a cylinder pressure, and the cylinder pressure bar connects swing arm, and the swing arm end face has hook portion, and a bar passes position between the end of two swing arms and the hook portion.

[0012] Preferably, a fixed block is fixedly installed on one side of the upper surface of the horizontal plate, a rotating rod is rotatably installed in the fixed block, a fourth bevel gear is fixedly installed on the end of the rotating rod away from the fixed block, a bearing seat is fixedly installed on the side of the lower surface of the horizontal plate close to the fixed block, a telescopic rod is rotatably installed in the bearing seat, and the bottom end of the telescopic rod is slidably inserted in the vertical cylinder, a third bevel gear is fixedly installed on the top of the telescopic rod, and the third bevel gear and the fourth bevel gear are meshed, a number two gear is fixedly installed on the outer surface of the rotating rod, and a number two gear plate is fixedly installed on the side of the mounting frame on the left, and the number two gear and the number two gear plate are meshed.

[0013] Preferably, a mounting block and a rectangular block are fixedly installed on the side of the upper surface of the horizontal plate away from the fixed block, a driving cylinder is rotatably installed in the mounting block, and a No. 2 bevel gear is fixedly installed on the outer surface of the driving cylinder, a connecting rod is rotatably installed in the side of the horizontal plate away from the fixed block, and the bottom end of the connecting rod is slidably inserted in the rotating cylinder, and the No. 1 bevel gear is fixedly installed on the top of the connecting rod, and the No. 1 bevel gear is meshed with the No. 2 bevel gear, a transmission rod is rotatably installed in the rectangular block, and the end of the transmission rod close to the mounting block is slidably inserted in the driving cylinder, and the end of the transmission rod away from the mounting block is fixedly installed with a driving bar, and a mounting bar is fixedly installed in the mounting frame located on the right side, a baffle bar is fixedly installed on the lower surface of the mounting bar, and the driving bar and the baffle bar are movably contacted, trapezoidal blocks are fixedly installed on both sides of the lower surface of the mounting bar, and the trapezoidal blocks and the two sides of the driving bar are movably contacted.

[0014] A method for processing a photovoltaic cell slicing device comprises the following steps:

[0015] Step 1: Start the electric cylinder to drive the clamping frame to move, clamp and fix the silicon wafer, and start the No. 1 motor to drive the clamping frame to move, and load the silicon wafer;

[0016] Step 2: The horizontal plate is driven to move by the rotation of the rotating rod, and the cleaning roller is driven to move by the movement of the horizontal plate to clean the upper surface of the silicon wafer;

[0017] Step 3: The scraper is driven to swing by the rotation of the transmission rod, so that the scraper contacts the outer surface of the cleaning roller, and the dirt on the outer surface of the cleaning roller is scraped off to avoid contamination of the silicon wafer;

[0018] Step 4: Start the No. 2 motor to drive the driving rod to rotate, and the rotation of the driving rod drives the silicon wafer to move, and the silicon wafer is cut by the laser cutting equipment.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. In the present invention, the upper surface of the silicon wafer is cleaned during the loading process through the cooperation between the conveying mechanism, the clamping mechanism and the cleaning mechanism, thereby improving the work efficiency. In addition, the solid particles generated during cutting are shielded by the slicing mechanism to prevent the solid particles from scattering on all sides and reduce safety hazards.

[0021] 2. In the present invention, a scraper is provided to scrape off the dirt on the outer surface of the cleaning roller to avoid contamination of the silicon wafer, and the scraper is driven to swing by the cooperation between the transmission rod, the driving cylinder, the connecting rod, the rotating cylinder and the second cross bar, so that the scraper and the outer surface of the cleaning roller are in contact, thereby facilitating the cleaning of the cleaning roller.

[0022] 3. In the present invention, the cleaning roller is driven to move back and forth by the cooperation between the rotating rod, the vertical rod and the guide rod. The upper surface of the silicon wafer is cleaned by the reciprocating movement of the cleaning roller, so as to prevent the dirt on the upper surface of the silicon wafer from affecting the laser cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0025] Figure 2 It is a schematic diagram of the overall cross-sectional structure of the present invention.

[0026] Figure 3 It is a schematic diagram of the cross-sectional structure of the transport mechanism of the present invention.

[0027] Figure 4 It is a schematic diagram of the cross-sectional structure of the support frame of the present invention.

[0028] Figure 5 It is a schematic diagram of the cross-sectional structure of the clamping mechanism and the cleaning mechanism of the present invention.

[0029] Figure 6 It is a schematic diagram of the cross-sectional structure of the fixing plate of the present invention.

[0030] Figure 7 It is a schematic diagram of the cross-sectional structure of the mounting frame of the present invention.

[0031] Figure 8 It is a schematic diagram of the cross-sectional structure of the transportation mechanism of the present invention.

[0032] Fig. 9 It is a schematic diagram of the cross-sectional structure of the slicing mechanism of the present invention.

[0033] Fig.10 For the present invention Figure 6 A schematic diagram of the enlarged structure.

[0034] Fig.11 For the present invention Figure 6 An enlarged schematic diagram of the structure at location B.

[0035] Fig.12 For the present invention Figure 6 Enlarged schematic diagram of the structure at location C.

[0036] Fig.13 For the present invention Figure 7Enlarged schematic diagram of the structure at D.

[0037] In the figure: 1. transport mechanism; 101. support frame; 102. mounting plate; 103. No. 1 motor; 104. No. 1 gear plate; 105. moving seat; 106. vertical plate; 107. guide column; 108. rotating plate; 109. mounting rod; 110. first crossbar; 2. clamping mechanism; 201. fixed plate; 202. support block; 203. rotating rod; 204. No. 1 gear; 205. first bevel gear; 206. vertical rod; 207. second bevel gear; 208. clamping frame; 209. crossbar 210, rotating column; 211, rotating bar; 212, connecting bar; 213, electric cylinder; 214, mounting frame; 215, horizontal plate; 216, moving column; 217, spring No. 1; 218, driving plate; 219, guide rod; 220, gear plate No. 2; 221, mounting bar; 222, bearing seat; 223, telescopic rod; 224, third bevel gear; 225, fixing block; 226, rotating rod; 227, fourth bevel gear; 228, gear No. 2; 229, connecting rod; 230, No. 1 bevel gear; 231, mounting block; 232, drive cylinder; 233, No. 2 bevel gear; 234, rectangular block; 235, transmission rod; 236, drive bar; 237, stop bar; 238, trapezoidal block; 3, transportation mechanism; 301, support plate; 302, drive rod; 303, transportation wheel; 304, transportation belt; 305, connection block; 306, placement plate; 307, No. 2 motor; 4, slicing mechanism; 401, fixing frame; 402, laser cutting equipment; 403, shielding box; 40 4. Fixed column; 405. Second spring; 406. Dust collection device; 5. Cleaning mechanism; 501. Mounting box; 502. Scraper; 503. Cleaning roller; 504. Square block; 505. Vertical cylinder; 506. Third bevel gear; 507. Fourth bevel gear; 508. Fixed bar; 509. Rotating cylinder; 510. Fifth bevel gear; 511. Rectangular bar; 512. Second cross bar; 513. Sixth bevel gear; 514. Third spring; 515. Seventh bevel gear; 516. Eighth bevel gear. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] Example: Figure 1-13As shown, the present invention provides a photovoltaic cell slicing device, including a conveying mechanism 1, a clamping mechanism 2 for clamping silicon wafers is provided between the conveying mechanism 1, and the silicon wafers are clamped and fixed; a transport mechanism 3 for transporting silicon wafers is provided on one side of the conveying mechanism 1, and the silicon wafers are transported; a slicing mechanism 4 for cutting silicon wafers is provided in the middle of the upper surface of the transport mechanism 3, and the silicon wafers are cut; a cleaning mechanism 5 for cleaning the surface of the silicon wafer is provided below the clamping mechanism 2, and the upper surface of the silicon wafer is cleaned.

[0040] The transport mechanism 1 includes a support frame 101, and a moving seat 105 is slidably installed on the sides of the two support frames 101 that are close to each other. A vertical plate 106 is slidably installed in the two moving seats 105 on the same side, and a guide column 107 is fixedly installed on the sides of the two vertical plates 106 that are away from each other, and the end of the guide column 107 away from the vertical plate 106 slides through the support frame 101, and a mounting rod 109 is rotatably installed in the support frame 101, and a rotating plate 108 is fixedly installed on the outer surface of the mounting rod 109, and the end of the guide column 107 away from the vertical plate 106 slides A first cross bar 110 is rotatably installed at the bottom between the two support frames 101, and transmission is carried out between the two ends of the first cross bar 110 and the two mounting rods 109 through synchronous wheels and synchronous belts. A mounting plate 102 is fixedly installed on the side of the support frame 101 on the left, and a No. 1 motor 103 is fixedly installed on the upper surface of the mounting plate 102, and the end of the output shaft of the No. 1 motor 103 close to the support frame 101 is fixedly connected to the first cross bar 110, and a No. 1 gear plate 104 is fixedly installed on the top of the support frame 101.

[0041] By adopting the above technical solution, the first cross bar 110 can drive the vertical plate 106 to move.

[0042] The clamping mechanism 2 includes a fixed plate 201, and the two ends of the fixed plate 201 are fixedly connected to the two vertical plates 106 respectively, two clamping frames 208 are slidably installed on the lower surface of the fixed plate 201, and the sides of the bottoms of the two clamping frames 208 close to each other are in active contact with the two sides of the silicon wafer, a horizontal bar 209 is fixedly installed between the tops of the clamping frames 208, and the horizontal bar 209 is slidably set inside the fixed plate 201, rotating columns 210 are rotatably installed on both sides of the fixed plate 201, two rotating bars 211 are fixedly installed on the outer surface of the rotating column 210, a connecting bar 212 is rotatably installed on the end of the upper surface of the two rotating bars 211 away from the rotating column 210, and the end of the connecting bar 212 away from the rotating bar 211 is rotatably connected to the horizontal bar 209, an electric cylinder 213 is fixedly installed on the side of the fixed plate 201, and the end of the output shaft of the electric cylinder 213 close to the fixed plate 201 is fixedly connected to the horizontal bar 209.

[0043] By adopting the above technical solution, the rotating column 210 can drive the clamping frame 208 to move.

[0044] The transport mechanism 3 includes a support plate 301, and the two support plates 301 are located on a side of the support frame 101 away from the fixed plate 201, and a driving rod 302 is rotatably installed between both ends of the two support plates 301, and a No. 2 motor 307 is fixedly installed on the side of the support plate 301 located on the left, and the end of the output shaft of the No. 2 motor 307 close to the support plate 301 is fixedly connected to the driving rod 302, and two transport wheels 303 are fixedly installed on the outer surface of the driving rod 302, and a transport belt 304 is transmission-installed between the two opposite transport wheels 303, and three connecting blocks 305 are fixedly installed on the outer surface of the transport belt 304, and a placement plate 306 is fixedly installed on the side of the connecting block 305 away from the transport belt 304.

[0045] By adopting the above technical solution, the driving rod 302 can drive the placement plate 306 to move.

[0046] The slicing mechanism 4 includes a fixed frame 401, and the fixed frame 401 is fixedly installed on the support plate 301, two fixed columns 404 are slidably installed in the middle of the fixed frame 401, a shielding box 403 is fixedly installed at the bottom end of the fixed column 404, and the bottom end of the shielding box 403 is in active contact with the lower surface of the silicon wafer, a No. 2 spring 405 is fixedly installed in the middle of the lower surface of the fixed frame 401, and the bottom end of the No. 2 spring 405 is fixedly connected to the shielding box 403, two dust suction devices 406 are fixedly installed on the upper surface of the fixed frame 401, and the end of the suction pipe at the bottom of the dust suction device 406 away from the dust suction device 406 is fixedly connected to the shielding box 403, a laser cutting device 402 is fixedly installed in the middle of the upper surface of the fixed frame 401, and the shielding box 403 is slidably mounted on the output head of the laser cutting device 402.

[0047] By adopting the above technical solution, the No. 2 spring 405 can drive the shielding box 403 to move.

[0048] The cleaning mechanism 5 includes a mounting box 501, and the mounting box 501 is located below the fixed plate 201, a cleaning roller 503 is rotatably mounted in the mounting box 501, and the outer surface of the cleaning roller 503 is in active contact with the outer surface of the silicon wafer, a square block 504 is fixedly mounted on the side of the mounting box 501, a vertical cylinder 505 is rotatably mounted in the square block 504, a third bevel gear 506 is fixedly mounted on the bottom end of the vertical cylinder 505, a fourth bevel gear 507 is fixedly mounted on one end of the cleaning roller 503, and the fourth bevel gear 507 is meshed with the third bevel gear 506, scrapers 502 are rotatably mounted on both sides of the mounting box 501, and the ends of the two scrapers 502 that are close to each other are in active contact with the outer surface of the cleaning roller 503, third springs 514 are fixedly mounted on the outer surfaces of both ends of the scrapers 502, and the third springs 514 are away from One end of the scraper 502 is fixedly connected to the inside of the installation box 501, and a No. 7 bevel gear 515 is fixedly installed on the end of the scraper 502 away from the vertical cylinder 505. Two rectangular bars 511 are fixedly installed on the side of the installation box 501 away from the vertical cylinder 505, and a second cross bar 512 is rotatably installed in the two rectangular bars 511. An No. 8 bevel gear 516 is fixedly installed on the outer surface of the second cross bar 512, and the No. 8 bevel gear 516 is meshed with the No. 7 bevel gear 515. A No. 6 bevel gear 513 is fixedly installed on the outer surface of the middle part of the second cross bar 512. A fixed bar 508 is fixedly installed on the side of the installation box 501 away from the vertical cylinder 505, and a rotating cylinder 509 is rotatably installed in the fixed bar 508. A No. 5 bevel gear 510 is fixedly installed on the bottom end of the rotating cylinder 509, and the No. 5 bevel gear 510 is meshed with the No. 6 bevel gear 513.

[0049] By adopting the above technical solution, the vertical cylinder 505 can drive the cleaning roller 503 to rotate.

[0050] Mounting frames 214 are fixedly installed on the lower surfaces of both sides of the fixed plate 201, a horizontal plate 215 is slidably installed between the two mounting frames 214, two moving columns 216 are slidably installed on both sides of the horizontal plate 215, and the bottom ends of the moving columns 216 are fixedly connected to the mounting box 501, and a No. 1 spring 217 is fixedly installed on the lower surfaces of both sides of the horizontal plate 215, and the bottom ends of the No. 1 spring 217 are fixedly connected to the mounting box 501, a vertical rod 206 is rotatably installed in the fixed plate 201, a driving plate 218 is fixedly installed on the bottom end of the vertical rod 206, and a guide rod 21 is fixedly installed on the lower surface of the driving plate 218 away from the vertical rod 206 9, and the end of the guide rod 219 away from the driving plate 218 slides through the horizontal plate 215, the top of the vertical rod 206 is fixedly installed with a second bevel gear 207, the upper surfaces of both sides of the fixed plate 201 are fixedly installed with support blocks 202, the rotating rod 203 is rotatably installed in the two support blocks 202, and the two ends of the rotating rod 203 are slidably inserted in the support frame 101, the first bevel gear 205 is fixedly installed on the outer surface of the middle part of the rotating rod 203, and the first bevel gear 205 is meshed with the second bevel gear 207, and the No. 1 gear 204 is fixedly installed at both ends of the rotating rod 203, and the No. 1 gear 204 is movably meshed with the No. 1 gear plate 104.

[0051] By adopting the above technical solution, the rotating rod 203 can drive the installation box 501 to move.

[0052] A fixed block 225 is fixedly installed on one side of the upper surface of the horizontal plate 215, and a rotating rod 226 is rotatably installed in the fixed block 225. A fourth bevel gear 227 is fixedly installed on the end of the rotating rod 226 away from the fixed block 225. A bearing seat 222 is fixedly installed on the side of the lower surface of the horizontal plate 215 close to the fixed block 225. A telescopic rod 223 is rotatably installed in the bearing seat 222, and the bottom end of the telescopic rod 223 is slidably inserted in the vertical tube 505. A third bevel gear 224 is fixedly installed on the top of the telescopic rod 223, and the third bevel gear 224 and the fourth bevel gear 227 are meshed with each other. A number two gear 228 is fixedly installed on the outer surface of the rotating rod 226, and a number two tooth plate 220 is fixedly installed on the side of the mounting frame 214 on the left, and the number two gear 228 and the number two tooth plate 220 are meshed with each other.

[0053] By adopting the above technical solution, the rotating rod 226 can drive the vertical tube 505 to rotate.

[0054] A mounting block 231 and a rectangular block 234 are fixedly installed on the side of the upper surface of the horizontal plate 215 away from the fixed block 225, a driving cylinder 232 is rotatably installed inside the mounting block 231, and a second bevel gear 233 is fixedly installed on the outer surface of the driving cylinder 232. A connecting rod 229 is rotatably installed inside the side of the horizontal plate 215 away from the fixed block 225, and the bottom end of the connecting rod 229 is slidably inserted in the rotating cylinder 509, and a first bevel gear 230 is fixedly installed on the top of the connecting rod 229, and the first bevel gear 230 and the second bevel gear 233 are meshed, and the rectangular block 2 A transmission rod 235 is rotatably installed in 34, and the end of the transmission rod 235 close to the mounting block 231 is slidably inserted in the driving cylinder 232, and the end of the transmission rod 235 away from the mounting block 231 is fixedly installed with a driving bar 236, and a mounting bar 221 is fixedly installed in the mounting frame 214 on the right side, and a blocking bar 237 is fixedly installed on the lower surface of the mounting bar 221, and the driving bar 236 and the blocking bar 237 are in movable contact, and trapezoidal blocks 238 are fixedly installed on both sides of the lower surface of the mounting bar 221, and the trapezoidal blocks 238 and both sides of the driving bar 236 are in movable contact.

[0055] By adopting the above technical solution, the transmission rod 235 can drive the rotating cylinder 509 to rotate.

[0056] A method for processing a photovoltaic cell slicing device comprises the following steps:

[0057] Step 1: Start the electric cylinder 213 to drive the clamping frame 208 to move, clamp and fix the silicon wafer, and start the No. 1 motor 103 to drive the clamping frame 208 to move, and load the silicon wafer;

[0058] Step 2: The horizontal plate 215 is driven to move by the rotation of the rotating rod 203, and the cleaning roller 503 is driven to move by the movement of the horizontal plate 215 to clean the upper surface of the silicon wafer;

[0059] Step 3: The scraper 502 is driven to swing by the rotation of the transmission rod 235, so that the scraper 502 and the outer surface of the cleaning roller 503 are in contact, and the dirt on the outer surface of the cleaning roller 503 is scraped off to avoid contamination of the silicon wafer;

[0060] Step 4: Start the second motor 307 to drive the driving rod 302 to rotate, and the rotation of the driving rod 302 drives the silicon wafer to move, and the silicon wafer is cut by the laser cutting device 402.

[0061] Working principle: First, turn on the electric cylinder 213 to drive the horizontal bar 209 on one side to move, and the movement of the horizontal bar 209 drives the connecting bar 212 to swing, and the swing of the connecting bar 212 drives the rotating column 210 to rotate, and the rotation of the rotating column 210 drives the connecting bar 212 on the other side to swing, and the swing of the connecting bar 212 on the other side drives the horizontal bar 209 on the other side to move. At this time, the movement of the two horizontal bars 209 drives the clamping frame 208 to move, so that the sides of the clamping frame 208 that are close to each other contact with the silicon wafer, and the silicon wafer is clamped and fixed. Turn on the first motor 103 to drive the first The crossbar 110 rotates, and the installation rod 109 is driven to rotate by the rotation of the first crossbar 110, and the rotating plate 108 is driven to rotate by the rotation of the installation rod 109, and the guide column 107 is driven to move by the rotation of the rotating plate 108, so that the guide column 107 moves along the n-shaped groove in the support frame 101, and the vertical plate 106 is driven to move by the movement of the guide column 107, and the fixed plate 201 is driven to move by the movement of the vertical plate 106, and the clamping frame 208 is driven to move by the movement of the fixed plate 201, and the silicon wafer is driven to move by the movement of the clamping frame 208, so that the silicon wafer moves and drives the placement plate 306;

[0062] Secondly, during the movement, the support block 202 is moved by the movement of the fixed plate 201, the support block 202 is moved by the movement of the rotating rod 203, the first gear 204 is moved by the movement of the rotating rod 203, and when the first gear 204 and the first gear plate 104 are meshed, the rotating rod 203 is driven to rotate, and the first bevel gear 205 is driven to rotate by the rotation of the rotating rod 203, and the second bevel gear 207 is driven to rotate by the rotation of the first bevel gear 205, and the vertical rod is driven by the rotation of the second bevel gear 207. 206 rotates, the driving plate 218 rotates through the rotation of the vertical rod 206, and the guide rod 219 is driven to make a circular motion through the rotation of the driving plate 218. At this time, the circular motion can be decomposed into lateral movement and longitudinal movement. When the guide rod 219 moves longitudinally, the guide rod 219 is slidably arranged inside the horizontal plate 215. When the guide rod 219 moves horizontally, it drives the horizontal plate 215 to move, and the movement of the horizontal plate 215 drives the moving column 216 to move, and the movement of the moving column 216 drives the installation box 501 to move;

[0063] The movement of the horizontal plate 215 drives the fixed block 225 to move, the movement of the fixed block 225 drives the rotating rod 226 to move, the movement of the rotating rod 226 drives the second gear 228 to move, at this time, the second gear 228 is meshed with the second gear plate 220 to drive the second gear 228 to rotate, the rotation of the second gear 228 drives the rotating rod 226 to rotate, the rotation of the rotating rod 226 drives the fourth bevel gear 227 to rotate, the rotation of the fourth bevel gear 227 drives the third bevel gear 224 to rotate, the rotation of the third bevel gear 224 drives the telescopic rod 223 to rotate, the rotation of the telescopic rod 223 drives the vertical cylinder 505 to rotate, the rotation of the vertical cylinder 505 drives the third bevel gear 506 to rotate, the rotation of the third bevel gear 506 drives the fourth bevel gear 507 to rotate, the rotation of the fourth bevel gear 507 drives the cleaning roller 503 to rotate, and the upper surface of the silicon wafer is cleaned by the rotation of the cleaning roller 503;

[0064] Then, during the cleaning process, the movement of the horizontal plate 215 drives the mounting block 231 and the rectangular block 234 to move, the movement of the rectangular block 234 drives the transmission rod 235 to move, the movement of the transmission rod 235 drives the driving bar 236 to move, at this time, the driving bar 236 is pushed to swing through the blocking of the blocking bar 237, the swinging of the driving bar 236 drives the transmission rod 235 to rotate, the rotation of the transmission rod 235 drives the driving cylinder 232 to rotate, the rotation of the driving cylinder 232 drives the second bevel gear 233 to rotate, the rotation of the second bevel gear 233 drives the first bevel gear 230 to rotate, the rotation of the first bevel gear 230 drives the connecting rod 229 to rotate, and the connecting rod 229 drives the connecting rod 229 to rotate. The rotation of the rod 229 drives the rotating cylinder 509 to rotate, and the rotation of the rotating cylinder 509 drives the fifth bevel gear 510 to rotate, and the rotation of the fifth bevel gear 510 drives the sixth bevel gear 513 to rotate, and the rotation of the sixth bevel gear 513 drives the second crossbar 512 to rotate, and the rotation of the second crossbar 512 drives the eighth bevel gear 516 to rotate, and the rotation of the eighth bevel gear 516 drives the seventh bevel gear 515 to rotate, and the rotation of the seventh bevel gear 515 drives the scraper 502 to rotate, and the scraper 502 is adjusted so that the scraper 502 contacts the outer surface of the cleaning roller 503, and the dirt on the outer surface of the cleaning roller 503 is scraped off to avoid contamination of the silicon wafer;

[0065] Finally, turn on the second motor 307 to drive the driving rod 302 to rotate, and the rotation of the driving rod 302 drives the transport wheel 303 to rotate, and the rotation of the transport wheel 303 drives the transport belt 304 to move, and the movement of the transport belt 304 drives the connecting block 305 to move, and the movement of the connecting block 305 drives the placement plate 306 to move, so that the placement plate 306 passes through the laser cutting equipment 402, and the silicon wafer is cut by the laser cutting equipment 402. At the same time, the solid particles are shielded by the shielding box 403 to prevent the solid particles from floating on all sides, and the dust collection equipment 406 is turned on to collect the solid particles.

[0066] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A photovoltaic cell slicing device, comprising a transport mechanism (1), characterized in that: A clamping mechanism (2) for clamping the silicon wafer is provided between the transporting mechanisms (1), a transporting mechanism (3) for transporting the silicon wafer is provided on one side of the transporting mechanism (1), a slicing mechanism (4) for cutting the silicon wafer is provided in the middle of the upper surface of the transporting mechanism (3), and a cleaning mechanism (5) for cleaning the surface of the silicon wafer is provided below the clamping mechanism (2).

2. A photovoltaic cell slicing device as claimed in claim 1, characterized in that: The transport mechanism (1) comprises a support frame (101), wherein two sides of the support frames (101) close to each other are slidably mounted with a moving seat (105), and two moving seats (105) on the same side are slidably mounted with a vertical plate (106), and two sides of the vertical plates (106) away from each other are fixedly mounted with a guide column (107), and one end of the guide column (107) away from the vertical plate (106) slides through the support frame (101), and a mounting rod (109) is rotatably mounted in the support frame (101), and a rotating plate (108) is fixedly mounted on the outer surface of the mounting rod (109), and the guide column (107) is away from the vertical plate (106). ) slides through a rotating plate (108), a first cross bar (110) is rotatably installed at the bottom between the two support frames (101), and transmission is carried out between the two ends of the first cross bar (110) and the two mounting bars (109) via synchronous wheels and synchronous belts, a mounting plate (102) is fixedly installed on the side of the support frame (101) on the left, a No. 1 motor (103) is fixedly installed on the upper surface of the mounting plate (102), and an end of the No. 1 motor (103) output shaft close to the support frame (101) is fixedly connected to the first cross bar (110), and a No. 1 toothed plate (104) is fixedly installed on the top of the support frame (101).

3. A photovoltaic cell slicing device as claimed in claim 1, characterized in that: The clamping mechanism (2) comprises a fixed plate (201), and the two ends of the fixed plate (201) are respectively fixedly connected to the two vertical plates (106), and two clamping frames (208) are slidably mounted on the lower surface of the fixed plate (201), and the side surfaces of the bottoms of the two clamping frames (208) close to each other are in active contact with the two sides of the silicon wafer, and a horizontal bar (209) is fixedly mounted between the top ends of the clamping frames (208), and the horizontal bar (209) is slidably arranged inside the fixed plate (201), and both sides of the fixed plate (201) are rotatably mounted. A rotating column (210) is provided, and two rotating bars (211) are fixedly installed on the outer surface of the rotating column (210); a connecting bar (212) is rotatably installed on one end of the upper surface of the two rotating bars (211) away from the rotating column (210), and one end of the connecting bar (212) away from the rotating bar (211) is rotatably connected to a horizontal bar (209); an electric cylinder (213) is fixedly installed on the side of the fixed plate (201), and one end of the output shaft of the electric cylinder (213) close to the fixed plate (201) is fixedly connected to the horizontal bar (209).

4. A photovoltaic cell slicing device as claimed in claim 1, characterized in that: The transport mechanism (3) comprises a support plate (301), and the two support plates (301) are located on a side of the support frame (101) away from the fixed plate (201), a driving rod (302) is rotatably installed between the two ends of the two support plates (301), a second motor (307) is fixedly installed on the side of the support plate (301) located on the left, and the end of the output shaft of the second motor (307) close to the support plate (301) is fixedly connected to the driving rod (302), two transport wheels (303) are fixedly installed on the outer surface of the driving rod (302), a transport belt (304) is transmission-installed between the two opposite transport wheels (303), three connection blocks (305) are fixedly installed on the outer surface of the transport belt (304), and a placement plate (306) is fixedly installed on the side of the connection block (305) away from the transport belt (304).

5. The photovoltaic cell slicing device according to claim 1, characterized in that: The slicing mechanism (4) comprises a fixed frame (401), and the fixed frame (401) is fixedly mounted on the support plate (301), two fixed columns (404) are slidably mounted in the middle of the fixed frame (401), a shielding box (403) is fixedly mounted at the bottom end of the fixed column (404), and the bottom end of the shielding box (403) is in active contact with the lower surface of the silicon wafer, and a No. 2 spring (405) is fixedly mounted in the middle of the lower surface of the fixed frame (401), and the No. 2 spring ( The bottom end of the fixed frame (405) is fixedly connected to the shielding box (403), two dust collecting devices (406) are fixedly installed on the upper surface of the fixed frame (401), and the end of the suction pipe at the bottom of the dust collecting device (406) away from the dust collecting device (406) is fixedly connected to the shielding box (403), a laser cutting device (402) is fixedly installed in the middle of the upper surface of the fixed frame (401), and the shielding box (403) is slidably mounted on the output head of the laser cutting device (402).

6. The photovoltaic cell slicing device according to claim 1, characterized in that: The cleaning mechanism (5) comprises a mounting box (501), and the mounting box (501) is located below the fixed plate (201), a cleaning roller (503) is rotatably mounted in the mounting box (501), and the outer surface of the cleaning roller (503) is in active contact with the outer surface of the silicon wafer, a square block (504) is fixedly mounted on the side of the mounting box (501), a vertical cylinder (505) is rotatably mounted in the square block (504), and a number three bevel gear is fixedly mounted at the bottom end of the vertical cylinder (505). (506), a fourth bevel gear (507) is fixedly mounted on one end of the cleaning roller (503), and the fourth bevel gear (507) is meshed with the third bevel gear (506), scrapers (502) are rotatably mounted on both sides of the installation box (501), and the ends of the two scrapers (502) close to each other are in active contact with the outer surface of the cleaning roller (503), and the outer surfaces of both ends of the scrapers (502) are fixedly mounted with third springs (514), and the third springs (514) are away from the scrapers. One end of the plate (502) is fixedly connected to the inside of the installation box (501), and a number seven bevel gear (515) is fixedly installed on the end of the scraper (502) away from the vertical cylinder (505). Two rectangular bars (511) are fixedly installed on the side of the installation box (501) away from the vertical cylinder (505), and a second cross bar (512) is rotatably installed in the two rectangular bars (511). The outer surface of the second cross bar (512) is fixedly installed with a number eight bevel gear (516), and the number eight bevel gear ( A sixth bevel gear (513) is fixedly mounted on the outer surface of the middle portion of the second cross bar (512); a fixing bar (508) is fixedly mounted on the side of the mounting box (501) away from the vertical cylinder (505); a rotating cylinder (509) is rotatably mounted in the fixing bar (508); a fifth bevel gear (510) is fixedly mounted on the bottom end of the rotating cylinder (509), and the fifth bevel gear (510) and the sixth bevel gear (513) are meshed with each other.

7. A photovoltaic cell slicing device as claimed in claim 3, characterized in that: The lower surfaces of both sides of the fixed plate (201) are fixedly installed with mounting frames (214), a horizontal plate (215) is slidably installed between the two mounting frames (214), two movable columns (216) are slidably installed in both sides of the horizontal plate (215), and the bottom ends of the movable columns (216) are fixedly connected to the mounting box (501), and the lower surfaces of both sides of the horizontal plate (215) are fixedly installed with a No. 1 spring (217), and the bottom end of the No. 1 spring (217) is fixedly connected to the mounting box (501), a vertical rod (206) is rotatably installed in the fixed plate (201), a driving plate (218) is fixedly installed at the bottom end of the vertical rod (206), and a guide rod (218) is fixedly installed on the end of the lower surface of the driving plate (218) away from the vertical rod (206). 19), and one end of the guide rod (219) away from the driving plate (218) slides through the horizontal plate (215), the top of the vertical rod (206) is fixedly installed with a second bevel gear (207), the upper surfaces of both sides of the fixed plate (201) are fixedly installed with support blocks (202), the two support blocks (202) are rotatably installed with a rotating rod (203), and the two ends of the rotating rod (203) are slidably inserted into the support frame (101), the middle outer surface of the rotating rod (203) is fixedly installed with a first bevel gear (205), and the first bevel gear (205) and the second bevel gear (207) are meshed, and the two ends of the rotating rod (203) are fixedly installed with a No. 1 gear (204), and the No. 1 gear (204) and the No. 1 toothed plate (104) are movably meshed.

8. A photovoltaic cell slicing device as claimed in claim 7, characterized in that: A fixed block (225) is fixedly mounted on one side of the upper surface of the transverse plate (215), a rotating rod (226) is rotatably mounted in the fixed block (225), a fourth bevel gear (227) is fixedly mounted on one end of the rotating rod (226) away from the fixed block (225), a bearing seat (222) is fixedly mounted on one side of the lower surface of the transverse plate (215) close to the fixed block (225), a telescopic rod (223) is rotatably mounted in the bearing seat (222), and the telescopic rod (223) is rotatably mounted in the bearing seat (222). The bottom end of the telescopic rod (223) is slidably inserted into the interior of the vertical cylinder (505), a third bevel gear (224) is fixedly mounted on the top of the telescopic rod (223), and the third bevel gear (224) and the fourth bevel gear (227) are meshed with each other, a second gear (228) is fixedly mounted on the outer surface of the rotating rod (226), and a second toothed plate (220) is fixedly mounted on the side of the mounting frame (214) on the left side, and the second gear (228) and the second toothed plate (220) are meshed with each other.

9. A photovoltaic cell slicing device as claimed in claim 7, characterized in that: A mounting block (231) and a rectangular block (234) are fixedly mounted on a side of the upper surface of the transverse plate (215) away from the fixed block (225); a driving cylinder (232) is rotatably mounted inside the mounting block (231); a second bevel gear (233) is fixedly mounted on the outer surface of the driving cylinder (232); a connecting rod (229) is rotatably mounted inside a side of the transverse plate (215) away from the fixed block (225); the bottom end of the connecting rod (229) is slidably inserted into the interior of the rotating cylinder (509); a first bevel gear (230) is fixedly mounted on the top end of the connecting rod (229); the first bevel gear (230) and the second bevel gear (233) are meshed with each other; the rectangular block A transmission rod (235) is rotatably installed in (234), and one end of the transmission rod (235) close to the mounting block (231) is slidably inserted into the driving cylinder (232), and one end of the transmission rod (235) away from the mounting block (231) is fixedly installed with a driving bar (236), and a mounting bar (221) is fixedly installed in the mounting frame (214) located on the right side, and a blocking bar (237) is fixedly installed on the lower surface of the mounting bar (221), and the driving bar (236) and the blocking bar (237) are in movable contact, and trapezoidal blocks (238) are fixedly installed on both sides of the lower surface of the mounting bar (221), and the trapezoidal blocks (238) and the two sides of the driving bar (236) are in movable contact.

10. A method for processing a photovoltaic cell slicing device according to any one of claims 1 to 9, characterized in that: The steps include: Step 1: Start the electric cylinder (213) to drive the clamping frame (208) to move, clamp and fix the silicon wafer, and start the No. 1 motor (103) to drive the clamping frame (208) to move, and load the silicon wafer; Step 2: The rotating rod (203) is rotated to drive the horizontal plate (215) to move, and the movement of the horizontal plate (215) drives the cleaning roller (503) to move, so as to clean the upper surface of the silicon wafer; Step 3: The scraper (502) is driven to swing by the rotation of the transmission rod (235), so that the scraper (502) and the outer surface of the cleaning roller (503) are in contact with each other, and the dirt on the outer surface of the cleaning roller (503) is scraped off to avoid contamination of the silicon wafer; Step 4: Start the second motor (307) to drive the driving rod (302) to rotate, and the rotation of the driving rod (302) drives the silicon wafer to move, and the silicon wafer is cut by the laser cutting device (402).

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