Method, device and equipment for detecting pseudo soldering of power device product and medium

Abstract

The invention discloses a method, a device, equipment and a medium for detecting pseudo soldering of a power device product, and the method comprises the steps: obtaining a plurality of to-be-detected welding spots and tension detection results obtained after wire clamp tension detection is carried out on the to-be-detected welding spots, matching the to-be-detected welding spots with preset normal welding spots for the to-be-detected welding spots, generating matching results, and outputting the matching results. And comparing the matching result with a preset threshold value, and generating a pseudo soldering detection result corresponding to the to-be-detected welding spot according to the comparison result and the tension detection result. According to the scheme, matching detection and tension detection are carried out on thick wire welding spots, non-stick, pseudo soldering and other abnormalities in the welding process are effectively recognized, microscopic examination can be carried out on marked abnormal products after pressure welding is completed, the quality of outflow products is guaranteed, meanwhile, the effective combination area of the wire and the pin is increased through the method of increasing the welding spots on the pin, and the production efficiency is improved. Pin cold solder joint can be effectively prevented.

Description

Technical Field

[0001] The present application relates to the field of semiconductor device technology, and in particular to a method, device, equipment and medium for detecting cold solder joints in power device products. Background Art

[0002] Semiconductor chip packaging consists of chip packaging and post-packaging testing. Chip packaging refers to cutting the tested wafer into individual semiconductor chips through a dicing process, pasting the semiconductor chip on the lead frame with solder paste, soft solder and other adhesive materials through professional adhesive equipment, and wire bonding the semiconductor chip fixed on the lead frame. Finally, the semiconductor chip and the lead frame are connected and fixed by encapsulation with a plastic insulating medium. The lead frame after plastic encapsulation is electroplated with electroplating materials. After electroplating, the excess part of the lead frame is cut off and the pins are bent into the required shape. The finished packaged product is tested through the test process to confirm the semiconductor chip grade.

[0003] Traditionally, in the semiconductor chip packaging process, there are many factors that affect the bonding between the bonding wire and the semiconductor chip. Affected by external factors, when the wire fails to form a bond with the semiconductor chip, the semiconductor chip cannot be connected to the lead pins of the carrier or the bonding area between the semiconductor chip and the wire is reduced. At this time, the product cannot meet the required voltage and current, resulting in product failure.

[0004] Therefore, how to detect cold solder joints to improve the reliability of pin solder joint bonding has become an urgent problem to be solved. Summary of the invention

[0005] The present application aims to at least solve the technical problems existing in the prior art. To this end, the first aspect of the present application proposes a method for detecting cold solder joints in power device products, the method comprising:

[0006] Obtaining a plurality of welding points to be inspected and a tension test result after performing a wire clamp tension test on each welding point to be inspected;

[0007] For each solder joint to be inspected, the solder joint to be inspected is matched with a preset normal solder joint to generate a matching result;

[0008] The matching result is compared with the preset threshold value, and the cold solder joint detection result corresponding to the solder joint to be detected is generated according to the comparison result and the tensile test result.

[0009] In a possible implementation manner, obtaining a plurality of welding points to be inspected includes:

[0010] For each solder joint to be inspected, obtaining inspection surface data corresponding to the solder joint to be inspected;

[0011] Based on the inspection surface data, the solder joints to be inspected are determined.

[0012] In a possible implementation, for each solder joint to be detected, matching the solder joint to be detected with a preset normal solder joint to generate a matching result includes:

[0013] For each solder joint to be inspected, obtain a solder joint image corresponding to the solder joint to be inspected;

[0014] The welding spot picture is matched with the preset normal welding spot in the preset model image to generate a matching result.

[0015] In a possible implementation, matching the welding spot image with the preset normal welding spot in the preset model image to generate a matching result includes:

[0016] Obtaining a first feature point and a second feature point in the solder joint image;

[0017] The first characteristic point and the second characteristic point are matched with a preset normal welding point to generate a matching result.

[0018] In a possible implementation, the matching result is compared with a preset threshold value, and a cold solder joint detection result corresponding to the solder joint to be detected is generated according to the comparison result and the tensile test result, including:

[0019] Compare the matching result with a preset threshold value to generate a comparison result;

[0020] If it is determined based on the comparison result that the matching result is not lower than the preset threshold value and the tensile force test result is normal, then the test result corresponding to the weld to be tested is determined to be passed;

[0021] If it is determined based on the comparison result that the matching result is lower than the preset threshold value and / or the tensile force detection result is abnormal, the detection result corresponding to the weld to be detected is determined to be a failure of the detection.

[0022] In a possible implementation, the method further includes:

[0023] When the inspection result corresponding to the welding point to be inspected is that the inspection fails, an alarm message is generated.

[0024] In a possible implementation, the method further includes:

[0025] An updated pin double solder spot jump process product pressure welding diagram is obtained, and each solder spot to be detected is processed based on the updated pin double solder spot jump process product pressure welding diagram to obtain a processing result.

[0026] In a second aspect, the present application provides a device for detecting cold solder joints in power device products, the device comprising:

[0027] An acquisition module is used to acquire a plurality of welding points to be detected and a tension test result after performing a wire clamp tension test on each welding point to be detected;

[0028] A generation module is used to match each solder joint to be detected with a preset normal solder joint and generate a matching result;

[0029] The determination module is used to compare the matching result with the preset threshold value, and generate the cold solder joint detection result corresponding to the solder joint to be detected according to the comparison result and the tensile test result.

[0030] In a possible implementation manner, the acquisition module is specifically used to:

[0031] For each solder joint to be inspected, obtaining inspection surface data corresponding to the solder joint to be inspected;

[0032] Based on the inspection surface data, the solder joints to be inspected are determined.

[0033] In a possible implementation manner, the generation module is specifically used to:

[0034] For each solder joint to be inspected, obtain a solder joint image corresponding to the solder joint to be inspected;

[0035] The welding spot picture is matched with the preset normal welding spot in the preset model image to generate a matching result.

[0036] In a possible implementation manner, the generation module is further used to:

[0037] Obtaining a first feature point and a second feature point in the solder joint image;

[0038] The first characteristic point and the second characteristic point are matched with a preset normal welding point to generate a matching result.

[0039] In a possible implementation manner, the above-mentioned determination module is specifically used to:

[0040] Compare the matching result with a preset threshold value to generate a comparison result;

[0041] If it is determined based on the comparison result that the matching result is not lower than the preset threshold value and the tensile force test result is normal, then the test result corresponding to the weld to be tested is determined to be passed;

[0042] If it is determined based on the comparison result that the matching result is lower than the preset threshold value and / or the tensile force detection result is abnormal, the detection result corresponding to the weld to be detected is determined to be a failure of the detection.

[0043] In a possible implementation manner, the above-mentioned determination module is further used to:

[0044] When the inspection result corresponding to the welding point to be inspected is that the inspection fails, an alarm message is generated.

[0045] In a possible implementation manner, the above-mentioned device for detecting cold solder joints in power device products is further used for:

[0046] An updated pin double solder spot jump process product pressure welding diagram is obtained, and each solder spot to be detected is processed based on the updated pin double solder spot jump process product pressure welding diagram to obtain a processing result.

[0047] The third aspect of the present application proposes an electronic device, which includes a processor and a memory, wherein the memory stores at least one instruction, at least one program, a code set or an instruction set, and the at least one instruction, the at least one program, the code set or the instruction set is loaded and executed by the processor to implement the method for detecting cold solder joints in power device products as described in the first aspect.

[0048] The fourth aspect of the present application proposes a computer-readable storage medium, which stores at least one instruction, at least one program, a code set or an instruction set. The at least one instruction, the at least one program, the code set or the instruction set is loaded and executed by a processor to implement the method for detecting cold solder joints in power device products as described in the first aspect.

[0049] The embodiments of the present application have the following beneficial effects:

[0050] The method, device, equipment and medium for detecting cold solder joints in power device products provided in the embodiments of the present application include: obtaining a plurality of solder joints to be detected and the tensile test results after performing a wire clamp tensile test on each solder joint to be detected, matching the solder joint to be detected with a preset normal solder joint for each solder joint to be detected, generating a matching result, comparing the matching result with a preset threshold value, and generating a cold solder joint detection result corresponding to the solder joint to be detected based on the comparison result and the tensile test result. This solution effectively identifies abnormalities such as non-stickiness and cold solder joints in the welding process by performing matching tests and tensile tests on the thick wire solder joints, and can perform microscopic inspection on the marked abnormal products after the pressure welding is completed, thereby ensuring the quality of the outflowing products. At the same time, the method of increasing solder joints by the pins increases the effective bonding area between the wire and the pins, which can effectively prevent cold solder joints on the pins. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 A schematic diagram of the structure of a wire bonding machine provided in an embodiment of the present application;

[0052] Figure 2 A flowchart of a method for detecting cold solder joints in power device products provided in an embodiment of the present application;

[0053] Figure 3A flowchart of the steps of obtaining a solder joint to be detected provided in an embodiment of the present application;

[0054] Figure 4 A flowchart of the steps for generating a matching result provided in an embodiment of the present application;

[0055] Figure 5 Another flowchart of steps for generating matching results provided in an embodiment of the present application;

[0056] Figure 6 A flowchart of the steps for generating a cold solder joint detection result provided in an embodiment of the present application;

[0057] Figure 7 A pin single solder point pressure welding diagram provided in an embodiment of the present application;

[0058] Figure 8 A pin double welding point pressure welding diagram provided in an embodiment of the present application;

[0059] Fig. 9 A structural block diagram of a device for detecting cold solder joints in power device products provided in an embodiment of the present application. DETAILED DESCRIPTION

[0060] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0061] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "multiple" means two or more. In addition, the use of "based on" or "according to" means openness and inclusiveness, because the process, steps, calculations or other actions "based on" or "according to" one or more of the conditions or values ​​may be based on additional conditions or values ​​beyond the described values ​​in practice.

[0062] The method for detecting cold solder joints in power device products provided in the present application can be applied to computer equipment (electronic equipment), and the computer equipment can be a wire bonding machine. Figure 1 This is a schematic diagram of the structure of a wire bonding machine provided in an embodiment of the present application. The specific structure of the wire bonding machine can refer to the prior art and will not be described in detail here. Those skilled in the art can understand that Figure 1The structure shown in the figure is only a block diagram of a partial structure related to the solution of the present application, and does not constitute a limitation on the server to which the solution of the present application is applied. Optionally, the server may include more or fewer components than shown in the figure, or combine certain components, or have a different arrangement of components.

[0063] It should be noted that the execution subject of the embodiments of the present application may be a computer device or a device for detecting cold solder joints in power device products. The following method embodiments are described using a computer device as the execution subject.

[0064] In the related technology, semiconductor chip packaging consists of chip packaging and post-packaging testing. Chip packaging refers to cutting the tested wafer into individual wafers, i.e. chips, through a dicing process; pasting the chip on the lead frame with solder paste, soft solder and other adhesive materials through professional adhesive equipment, wire bonding the chip fixed on the frame, connecting the chip and the frame, and encapsulating and fixing it with a plastic insulating medium. The frame fixed with plastic encapsulation is electroplated with electroplating materials, and after electroplating, the excess part of the frame is cut off and the pins are bent into the required shape. The packaged product is tested through a test process to confirm the chip grade.

[0065] The bonding of semiconductor power device packaging wires generally adopts ultrasonic cold welding, which forms a eutectic layer on the metal surface through friction. The bonding wire is usually aluminum wire. The bonding process is that the aluminum wire is pressed tightly on the metal surface of the semiconductor chip. Ultrasonic vibration acts on the welding device through the welding tool. Under the action of pressure and ultrasonic vibration, the aluminum wire becomes soft, and the aluminum wire and the metal atoms on the chip surface diffuse with each other to form a bond. The bonding is completed when the metal atoms on the chip surface and the metal atoms on the aluminum wire share electrons with each other and form a metal covalent bond.

[0066] In the semiconductor chip packaging process, there are many factors that affect the bonding of the bonding wire and the chip. Affected by external factors, when the wire fails to form a bond with the chip, the chip cannot be connected to the lead pins of the carrier or the bonding area between the chip and the wire is reduced. At this time, the product cannot meet the required voltage and current, resulting in product failure.

[0067] With the popularization of new energy vehicles and the development of intelligence and automation in more industries, the use of power devices is becoming more and more extensive, but the quality requirements for products are becoming higher and higher, especially for power devices used in the automotive industry, which have very strict quality requirements, so the quality of power device product packaging has been put forward a greater challenge. Among them, the wire bonding link is directly related to the reliability of the product. It is necessary not only to improve the quality requirements of the bonding process, but also to conduct 100% full inspection of the bonded products to eliminate products with bonding defects during the process.

[0068] Based on this, the present application provides a method, device, equipment and medium for detecting cold solder joints in power device products. The method includes: obtaining multiple solder joints to be detected and the tensile test results after performing wire clamp tensile test on each solder joint to be detected, matching the solder joint to be detected with a preset normal solder joint for each solder joint to be detected, generating a matching result, comparing the matching result with a preset threshold value, and generating a cold solder joint detection result corresponding to the solder joint to be detected according to the comparison result and the tensile test result. This scheme effectively identifies abnormalities such as non-stickiness and cold solder joints in the welding process by performing matching test and tensile test on the thick wire solder joints, and can perform microscopic inspection on the marked abnormal products after the pressure welding is completed, thereby ensuring the quality of the outflowing products. At the same time, the method of increasing solder joints by the pins increases the effective bonding area between the wire and the pins, which can effectively prevent cold solder joints on the pins.

[0069] Figure 2 A flowchart of a method for detecting cold solder joints in power device products provided in an embodiment of the present application. Figure 2 As shown, the method comprises the following steps:

[0070] Step 202 , obtaining a plurality of welding points to be inspected and obtaining a tension test result after performing a wire clamp tension test on each welding point to be inspected.

[0071] Among them, the solder joints formed under normal bonding conditions are usually complete, while the solder joints formed under abnormal bonding conditions are incomplete or have no solder joints formed. By performing quality inspection on the solder joints to be inspected, cold solder joints can be prevented and detected. Optionally, it is necessary to first obtain multiple solder joints to be inspected and perform tension test results after the wire clamp tension test on each solder joint to be inspected.

[0072] In some optional embodiments, Figure 3 As shown, Figure 3 A flowchart of the steps of obtaining a solder joint to be detected provided in an embodiment of the present application includes:

[0073] Step 302: For each solder joint to be inspected, obtain the inspection surface data corresponding to the solder joint to be inspected.

[0074] Step 304: Determine the solder joint to be inspected based on the inspected surface data.

[0075] Among them, after setting the normal bonding program according to the welding pattern bonding method for the product with the upper core processed, the surfaces required for quality inspection can be added in advance to the normal fine wire bonding program. In addition, the selected range of each surface should not intersect as much as possible, and the two inspection points of each surface are respectively set at the upper left corner and lower right corner of the solder joint.

[0076] That is, corresponding detection surface data is added to the normal fine wire bonding program, and one detection surface data is added to each solder joint, so that when performing cold solder joint detection, the solder joint to be detected can be determined based on the detection surface data.

[0077] Optionally, after each weld is completed, a wire arc control (Active Loop Control, ALC) tension test can be performed to determine the bonding strength of the weld by the displacement distance of the weld head caused by the deformation of the weld wire after the weld head applies tension to the weld, thereby confirming whether the product has a risk of cold welding. In other words, the ALC tension test is a real-time test performed after each weld is welded, which can be achieved by setting parameters such as the wire clamp force, ALC detection force, duration, and ALC tolerance distance threshold in the wire bonding machine.

[0078] Specifically, by verifying welding wires of different specifications, the optimal data of ALC tension, duration and ALC tolerance distance threshold of welding wires of different specifications are found. When there is direct cold solder joint in the product processed by the wire bonding machine, when the ALC tension test is performed after the welding step of the solder joint is completed, because the cold solder joint does not form a reliable bond with the chip, the solder joint will move with the wire clamp during the tension test. When the moving distance is greater than the ALC tolerance distance threshold, the interface of the wire bonding machine will display that the welding head tension test has failed and the machine will stop and alarm, so that the abnormal cold solder joint can be effectively detected.

[0079] After the product wire bonding program is created, enter the parameter editing page, select the corresponding detection mode on the parameter editing page, and turn on the ALC tension detection function. After entering the setting interface, set the interval to 1, so that each product can perform a real-time wire clamp tension test after a solder joint is completed, and finally obtain the tension test results after the wire clamp tension test of each solder joint to be tested.

[0080] Step 204: For each solder joint to be inspected, match the solder joint to be inspected with a preset normal solder joint to generate a matching result.

[0081] Among them, after obtaining multiple solder joints to be detected, pattern recognition (PR) detection can be performed on each solder joint to be detected, that is, the solder joint to be detected is matched with the preset normal solder joint to generate a matching result. Optionally, the preset normal solder joint can be a solder joint in a preset model image, and the preset model image can be regarded as a standard solder joint image. It should be noted that the wire welding machine is a dual-welding head device, that is, a wire welding machine has two welding heads, namely the left welding head and the right welding head, and the left and right welding heads have PR detection capabilities. However, in actual production, the right welding head generally detects whether there is a cold solder joint problem in the solder joint welded by the left welding head before wire bonding, that is, PR detection can usually be performed on the multiple solder joints to be detected corresponding to the left welding head.

[0082] In some optional embodiments, Figure 4 As shown, Figure 4 A flowchart of steps for generating a matching result provided in an embodiment of the present application includes:

[0083] Step 402: For each solder joint to be inspected, obtain a solder joint image corresponding to the solder joint to be inspected.

[0084] Step 404: Match the welding point image with the preset normal welding point in the preset model image to generate a matching result.

[0085] Among them, for each solder joint to be detected, a solder joint image corresponding to the solder joint to be detected can be obtained first, and optionally, a solder joint image corresponding to the solder joint to be detected can be obtained by a preset image acquisition device. Then, the solder joint image is matched with a preset normal solder joint in a preset model image to generate a matching result.

[0086] In some optional embodiments, Figure 5 As shown, Figure 5 Another flowchart of steps for generating matching results provided in an embodiment of the present application includes:

[0087] Step 502: Obtain a first feature point and a second feature point in the solder joint image.

[0088] Step 504: Match the first feature point and the second feature point with the preset normal welding point to generate a matching result.

[0089] Among them, when obtaining the first feature point and the second feature point in the weld image, optionally, the first feature point can be selected at the front end of the weld to be detected, and the second feature point can be selected at the tail of the weld to be detected, that is, the position where the welding wire starts.

[0090] Thus, the first characteristic point and the second characteristic point can be matched with the preset normal welding point to generate a matching result. Optionally, the matching result can be a similarity value obtained after similarity calculation, or can be obtained by other means, which is not specifically limited in the embodiment of the present application. In addition, if the similarity value is obtained after similarity calculation, the embodiment of the present application does not limit the specific similarity calculation algorithm.

[0091] Step 206: compare the matching result with the preset threshold value, and generate a cold solder joint detection result corresponding to the solder joint to be detected according to the comparison result and the tensile force detection result.

[0092] Among them, in some optional embodiments, such as Figure 6 As shown, Figure 6 A flowchart of the steps for generating a cold solder joint detection result provided in an embodiment of the present application includes:

[0093] Step 602: Compare the matching result with the preset threshold value to generate a comparison result.

[0094] Step 604: If it is determined based on the comparison result that the matching result is not lower than the preset threshold value and the tensile force detection result is normal, then the detection result corresponding to the weld to be detected is determined to be passed.

[0095] Step 606: If it is determined based on the comparison result that the matching result is lower than the preset threshold value and / or the tensile force detection result is abnormal, then the detection result corresponding to the weld to be detected is determined to be a failure.

[0096] Among them, the preset threshold value is a pre-defined setting. After the normal wire bonding program is set up, the program can be checked. In addition, the fine wire bonding surface also needs to be confirmed to ensure that the corresponding surface of the solder joint is selected as the bonding surface rather than the detection surface.

[0097] Next, after the program has been checked and found to be correct, the product processing begins. The solder joints to be detected here are thick-line solder joints. After the wire bonding is completed, when the thick-line solder joints are normal, the matching results are compared with the preset threshold value to generate a comparison result. If the matching result is determined to be not lower than the preset threshold value based on the comparison result, the match passes, that is, the normal solder joints are identified. After the equipment completes the wire bonding, the current product is skipped and the next product is switched.

[0098] When a thick solder joint has a cold solder joint, the matching result is compared with the preset threshold value to generate a comparison result. If the matching result is determined to be lower than the preset threshold value based on the comparison result, the matching fails, that is, the normal solder joint cannot be identified. In addition, the operator can also mark the abnormal products and skip them. After the entire product is processed on the equipment track, the product is taken out from the equipment and the marked abnormal product is checked under a microscope.

[0099] Finally, the comparison result and the tension test result after the wire clamp tension test on the solder joint to be tested can be combined to finally generate the cold solder joint test result corresponding to the solder joint to be tested. That is, if it is determined based on the comparison result that the matching result is not lower than the preset threshold value and the tension test result is a normal test, then the test result corresponding to the solder joint to be tested is determined to be passed. If it is determined based on the comparison result that the matching result is lower than the preset threshold value and / or the tension test result is an abnormal test, then the test result corresponding to the solder joint to be tested is determined to be failed.

[0100] In some optional embodiments, when the detection result corresponding to the weld to be detected is a failure to pass the detection, an alarm message is generated. Optionally, the alarm message can be displayed in any form such as text, image or voice, and the embodiment of the present application does not specifically limit the form of the alarm message.

[0101] In some optional embodiments, Figure 7 and Figure 8 As shown, Figure 7 A pin single solder point pressure welding diagram provided in an embodiment of the present application, Figure 8 A pin double welding point pressure welding diagram provided in an embodiment of the present application, wherein: Figure 7 The dotted line frame is a schematic diagram of a single solder point. Figure 8 The dotted line frame is a schematic diagram of the double solder joints of the pins. By verifying the jump-beating process of the single solder joint and the double solder joints of the pins on the same product, the effective bonding area between the solder wire and the frame of the double solder joint process is relatively large, and the pins of the double solder joint process products are less likely to have abnormal cold solder joints. Therefore, the double solder joint jump-beating process on the pins can reduce the risk of abnormal cold solder joints of the product pins. In other words, the double solder joints of the pins become double insurance. If one of the solder joints has a cold solder joint, the other solder joint is normal and does not affect the use of the product at all, thereby greatly reducing the product failure abnormality caused by the cold solder joints of the pins during use and ensuring the reliability of the product.

[0102] Therefore, in some optional embodiments, an updated pin double solder point jump process product pressure welding diagram can be obtained, and each solder point to be detected is processed based on the updated pin double solder point jump process product pressure welding diagram to obtain a processing result. By increasing the solder point of the pin, the effective bonding area of ​​the wire and the pin is increased, which can effectively prevent the pin from being poorly soldered.

[0103] The present application provides a method for detecting cold solder joints in power device products, the method comprising: obtaining a plurality of solder joints to be detected and the tensile test results after performing a wire clamp tensile test on each solder joint to be detected, matching the solder joint to be detected with a preset normal solder joint for each solder joint to be detected, generating a matching result, comparing the matching result with a preset threshold value, and generating a cold solder joint detection result corresponding to the solder joint to be detected based on the comparison result and the tensile test result. This scheme effectively identifies abnormalities such as non-stickiness and cold solder joints in the welding process by performing matching tests and tensile tests on thick wire solder joints, and can perform microscopic inspection on marked abnormal products after pressure welding is completed, thereby ensuring the quality of the outflowing products. At the same time, the method of increasing solder joints by pins increases the effective bonding area between the wire and the pins, which can effectively prevent cold solder joints on the pins.

[0104] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0105] Fig. 9 A structural block diagram of a device for detecting cold solder joints in power device products provided in an embodiment of the present application.

[0106] like Fig. 9 As shown, the device 900 for detecting cold solder joints in power device products includes:

[0107] The acquisition module 902 is used to acquire a plurality of welding points to be detected and a tension test result after performing a wire clamp tension test on each welding point to be detected.

[0108] The generation module 904 is used to match each solder joint to be detected with a preset normal solder joint to generate a matching result.

[0109] The determination module 906 is used to compare the matching result with the preset threshold value, and generate a cold solder joint detection result corresponding to the solder joint to be detected according to the comparison result and the tensile force detection result.

[0110] Regarding the device in the above embodiment, the specific manner in which each module performs the operation has been described in detail in the embodiment of the method, and will not be elaborated here. Each module in the above-mentioned graph-based retrieval enhancement generation device can be implemented in whole or in part by software, hardware, and a combination thereof. The above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations of the above modules.

[0111] In one embodiment of the present application, a computer device is provided, the computer device comprising a memory and a processor, the memory storing a computer program, and the processor implementing the following steps when executing the computer program:

[0112] Obtaining a plurality of welding points to be inspected and a tension test result after performing a wire clamp tension test on each welding point to be inspected;

[0113] For each solder joint to be inspected, the solder joint to be inspected is matched with a preset normal solder joint to generate a matching result;

[0114] The matching result is compared with the preset threshold value, and the cold solder joint detection result corresponding to the solder joint to be detected is generated according to the comparison result and the tensile test result.

[0115] In one embodiment of the present application, when the processor executes the computer program, the processor further implements the following steps:

[0116] For each solder joint to be inspected, obtaining inspection surface data corresponding to the solder joint to be inspected;

[0117] Based on the inspection surface data, the solder joints to be inspected are determined.

[0118] In one embodiment of the present application, when the processor executes the computer program, the processor further implements the following steps:

[0119] For each solder joint to be inspected, obtain a solder joint image corresponding to the solder joint to be inspected;

[0120] The welding spot picture is matched with the preset normal welding spot in the preset model image to generate a matching result.

[0121] In one embodiment of the present application, when the processor executes the computer program, the processor further implements the following steps:

[0122] Obtaining a first feature point and a second feature point in the solder joint image;

[0123] The first characteristic point and the second characteristic point are matched with a preset normal welding point to generate a matching result.

[0124] In one embodiment of the present application, when the processor executes the computer program, the processor further implements the following steps:

[0125] Compare the matching result with a preset threshold value to generate a comparison result;

[0126] If it is determined based on the comparison result that the matching result is not lower than the preset threshold value and the tensile force test result is normal, then the test result corresponding to the weld to be tested is determined to be passed;

[0127] If it is determined based on the comparison result that the matching result is lower than the preset threshold value and / or the tensile force detection result is abnormal, the detection result corresponding to the weld to be detected is determined to be detection failure.

[0128] In one embodiment of the present application, when the processor executes the computer program, the processor further implements the following steps:

[0129] When the inspection result corresponding to the welding point to be inspected is that the inspection fails, an alarm message is generated.

[0130] In one embodiment of the present application, when the processor executes the computer program, the processor further implements the following steps:

[0131] An updated pin double solder spot jump process product pressure welding diagram is obtained, and each solder spot to be detected is processed based on the updated pin double solder spot jump process product pressure welding diagram to obtain a processing result.

[0132] The computer device provided in the embodiment of the present application has similar implementation principles and technical effects to those of the above-mentioned method embodiment, and will not be described in detail here.

[0133] In one embodiment of the present application, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented:

[0134] Obtaining a plurality of welding points to be inspected and a tension test result after performing a wire clamp tension test on each welding point to be inspected;

[0135] For each solder joint to be inspected, the solder joint to be inspected is matched with a preset normal solder joint to generate a matching result;

[0136] The matching result is compared with the preset threshold value, and the cold solder joint detection result corresponding to the solder joint to be detected is generated according to the comparison result and the tensile test result.

[0137] In one embodiment of the present application, when the computer program is executed by a processor, the following steps are further implemented:

[0138] For each solder joint to be inspected, obtaining inspection surface data corresponding to the solder joint to be inspected;

[0139] Based on the inspection surface data, the solder joints to be inspected are determined.

[0140] In one embodiment of the present application, when the computer program is executed by a processor, the following steps are further implemented:

[0141] For each solder joint to be inspected, obtain a solder joint image corresponding to the solder joint to be inspected;

[0142] The welding spot picture is matched with the preset normal welding spot in the preset model image to generate a matching result.

[0143] In one embodiment of the present application, when the computer program is executed by a processor, the following steps are further implemented:

[0144] Obtaining a first feature point and a second feature point in the solder joint image;

[0145] The first characteristic point and the second characteristic point are matched with a preset normal welding point to generate a matching result.

[0146] In one embodiment of the present application, when the computer program is executed by a processor, the following steps are further implemented:

[0147] Compare the matching result with a preset threshold value to generate a comparison result;

[0148] If it is determined based on the comparison result that the matching result is not lower than the preset threshold value and the tensile force test result is normal, then the test result corresponding to the weld to be tested is determined to be passed;

[0149] If it is determined based on the comparison result that the matching result is lower than the preset threshold value and / or the tensile force detection result is abnormal, the detection result corresponding to the weld to be detected is determined to be a failure of the detection.

[0150] In one embodiment of the present application, when the computer program is executed by a processor, the following steps are further implemented:

[0151] When the inspection result corresponding to the welding point to be inspected is that the inspection fails, an alarm message is generated.

[0152] In one embodiment of the present application, when the computer program is executed by a processor, the following steps are further implemented:

[0153] An updated pin double solder spot jump process product pressure welding diagram is obtained, and each solder spot to be detected is processed based on the updated pin double solder spot jump process product pressure welding diagram to obtain a processing result.

[0154] The computer-readable storage medium provided in this embodiment has similar implementation principles and technical effects to those of the above method embodiments, and will not be described in detail here.

[0155] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0156] It is easy to understand that those skilled in the art can combine, split, reorganize, etc. the embodiments of the present application to obtain other embodiments based on the several embodiments provided in the present application, and these embodiments do not exceed the protection scope of the present application.

[0157] The above specific implementation methods further explain in detail the purpose, technical solutions and beneficial effects of the embodiments of the present application. It should be understood that the above are only specific implementation methods of the embodiments of the present application and are not used to limit the protection scope of the embodiments of the present application. Any modifications, equivalent substitutions, improvements, etc. made on the basis of the technical solutions of the embodiments of the present application should be included in the protection scope of the embodiments of the present application.

Claims

1. A method for detecting cold solder joints in power device products, characterized in that: The method comprises: Acquire multiple welding points to be tested and the tension test results after performing wire clamp tension test on each welding point to be tested; For each of the solder joints to be detected, matching the solder joint to be detected with a preset normal solder joint to generate a matching result; The matching result is compared with a preset threshold value, and a cold solder joint detection result corresponding to the solder joint to be detected is generated according to the comparison result and the tension detection result.

2. The method according to claim 1, characterized in that The step of obtaining a plurality of welding points to be inspected comprises: For each solder joint to be inspected, obtaining inspection surface data corresponding to the solder joint to be inspected; The welding point to be inspected is determined based on the inspection surface data.

3. The method according to claim 1 or 2, characterized in that: For each of the solder joints to be detected, matching the solder joint to be detected with a preset normal solder joint to generate a matching result includes: For each of the solder joints to be detected, obtaining a solder joint image corresponding to the solder joint to be detected; The welding point picture is matched with the preset normal welding point in the preset model image to generate the matching result.

4. The method according to claim 3, characterized in that The step of matching the welding spot picture with the preset normal welding spot in the preset model image to generate the matching result includes: Obtaining a first feature point and a second feature point in the solder joint image; The matching result is generated based on matching the first feature point and the second feature point with the preset normal welding point.

5. The method according to claim 1 or 2, characterized in that: The step of comparing the matching result with a preset threshold value and generating a cold solder joint detection result corresponding to the solder joint to be detected according to the comparison result and the tensile force detection result includes: Compare the matching result with a preset threshold value to generate the comparison result; If it is determined based on the comparison result that the matching result is not lower than the preset threshold value and the tension test result is normal, then the test result corresponding to the weld to be tested is determined to be passed; If it is determined based on the comparison result that the matching result is lower than the preset threshold value and / or the tension detection result is a detection abnormality, then it is determined that the detection result corresponding to the weld to be detected is a detection failure.

6. The method according to claim 5, characterized in that The method further comprises: When the inspection result corresponding to the welding point to be inspected is that the inspection fails, an alarm message is generated.

7. The method according to claim 1 or 2, characterized in that: The method further comprises: An updated pin double solder spot jump process product welding diagram is obtained, and each solder spot to be detected is processed based on the updated pin double solder spot jump process product welding diagram to obtain a processing result.

8. A device for detecting cold solder joints in power device products, characterized in that: The device comprises: An acquisition module is used to acquire a plurality of welding points to be detected and a tension test result after performing a wire clamp tension test on each welding point to be detected; A generating module, for matching each of the solder joints to be detected with a preset normal solder joint, and generating a matching result; The determination module is used to compare the matching result with a preset threshold value, and generate a cold solder joint detection result corresponding to the solder joint to be detected according to the comparison result and the tension detection result.

9. An electronic device, characterized in that: The electronic device includes a processor and a memory, wherein the memory stores at least one instruction, at least one program, a code set or an instruction set, and the at least one instruction, the at least one program, the code set or the instruction set is loaded and executed by the processor to implement the method for detecting cold solder joints in power device products as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The storage medium stores at least one instruction, at least one program, a code set or an instruction set, and the at least one instruction, the at least one program, the code set or the instruction set are loaded and executed by the processor to implement the method for detecting cold solder joints in power device products as described in any one of claims 1 to 7.

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