Multi-channel integrated photoelectric conversion transmitting-receiving device

Abstract

The invention provides a multi-path integrated photoelectric conversion transceiver, which relates to the technical field of multiplexing communication and comprises a multi-path optical transceiver assembly, a multi-grid integrated base, a multi-core tail fiber, a multi-core tail fiber coiling cabin and a multi-core tail fiber adaptive female head, wherein each optical transmit-receive assembly is provided with a transmit-receive tube core, a combiner / splitter and an optical signal coupler, and each optical transmit-receive assembly is installed in each grid of the multi-grid integrated base; a receiving wavelength optical signal and a transmitting wavelength optical signal of the transmitting and receiving tube core in each path of optical transmitting and receiving assembly are coupled to one core tail fiber in the multi-core tail fiber through an optical signal coupler after being subjected to wave combination and wave separation by the wave combiner and splitter, so as to complete the transmission of the receiving wavelength optical signal and the transmitting wavelength optical signal. According to the scheme, the technical problem that the cost of the local side equipment is increased due to the fact that the requirement of a high-density interface can only be met through stacking of more equipment when the existing local side equipment accesses more users is solved.

Description

Technical Field

[0001] The present application belongs to the field of multiplexed communication technology, and in particular, relates to a multi-channel integrated optoelectronic conversion transceiver. Background Art

[0002] In the current transmission network, whether it is the backbone network, metropolitan area network or access network, especially the backbone network and metropolitan area network, all have been realized in the direction of fiber opticization, and the access network has gradually developed in the direction of full fiber opticization. These networks are collectively referred to as fiber optic networks. In the fiber optic network, an optoelectronic conversion component needs to be set between the device and the optical fiber medium. The optoelectronic conversion component converts the electrical signal to be sent into an optical signal, and the optical signal to be received into an electrical signal, and modulates it on a specific optical wavelength before transmitting it on the optical fiber medium. The physical shape of the current access network optoelectronic conversion transceiver can be roughly divided into three types: BOSA type, SFF type and SFP type. The common points of these three types are: 1) Each optical transceiver component is a monomer type, with a large volume and a large space occupied by the equipment; 2) Each optical transceiver component is connected to the optical fiber outside the chassis through the SC and LC interfaces on the chassis panel with independent optical fibers, resulting in a small number of optical interfaces that can be accommodated in the limited equipment space or equipment panel, which cannot meet the current demand for extremely high chip interface density and more high-density optical interfaces.

[0003] However, in a local area network or access network, the central office equipment must meet the high-density interface to achieve the rigid indicator of reducing coverage costs. Under the current conditions of single optical modules and optical interfaces, when a central office accesses more users, the high-density interface requirements can only be met by stacking more devices, which will inevitably increase the cost of the central office equipment. Summary of the invention

[0004] The purpose of the present application is to provide a multi-channel integrated optoelectronic conversion transceiver device that can meet the needs of high-density interfaces without increasing the cost of local-end equipment.

[0005] A multi-channel integrated photoelectric conversion transceiver device, comprising: a multi-channel optical transceiver assembly, a multi-grid integrated base, a multi-core pigtail, a multi-core pigtail fiber compartment and a multi-core pigtail adapter female head, wherein: Each optical transceiver assembly is provided with a transceiver tube core, a combiner / demultiplexer and an optical signal coupler. The transceiver tube core, the combiner / demultiplexer and the optical signal coupler in each optical transceiver assembly are respectively installed in each grid of the multi-grid integrated base to form a multi-channel integrated photoelectric conversion transceiver assembly; the receiving wavelength optical signal and the transmitting wavelength optical signal of the transceiver tube core in each optical transceiver assembly are combined and demultiplexed by the combiner / demultiplexer, and then coupled to one core pigtail of the multi-core pigtail through the optical signal coupler to complete the transmission of the receiving wavelength optical signal and the transmitting wavelength optical signal; A multi-channel pigtail coiling cabin is connected to the rear end of the multi-grid integrated base, and the multi-core pigtails are introduced through the introduction holes of the multi-core pigtail coiling cabin. The multi-core pigtails introduced into the multi-core pigtail coiling cabin are then stripped into single-core pigtails, and after lossless coiling of optical signals in the coiling cabin, they are adapted to the optical transceiver components in each grid through optical signal adapters, and the multi-core pigtails led out from the coiling cabin and reserved for a preset length are adapted to the multi-core pigtail adapter female head.

[0006] In one embodiment, the multi-core fiber pigtail adapter female head is inserted into the adapter seat of the multi-core fiber pigtail adapter installed on the chassis panel, and docked with the connecting male head of the multi-core fiber pigtail adapter outside the chassis to complete the adaptation with the optical fiber terminal outside the chassis to form a high-density optical fiber interface on the chassis panel.

[0007] In one embodiment, the height and width of the multi-core pigtail coiling compartment are determined according to the bending diameter of the pigtails in the coiling compartment without causing any loss in coiling, so as to ensure that no loss in coiling occurs.

[0008] In one embodiment, the bending radius of the single-core pigtail in the fiber coiling compartment is greater than or equal to 10 mm.

[0009] In one embodiment, the introduction hole of the multi-core pigtail winding compartment is provided with a lead-out bayonet, and the multi-core pigtail is inserted into the introduction hole of the multi-core pigtail winding compartment through the lead-out bayonet.

[0010] In one embodiment, the wavelength of the receiving wavelength optical signal of each optical transceiver component in the multi-channel optical transceiver component is equal, and the wavelength of the transmitting wavelength optical signal of each optical transceiver component in the multi-channel optical transceiver component is equal, the wavelength of the receiving wavelength optical signal is 1310nm, and the wavelength of the transmitting wavelength optical signal is 1490nm.

[0011] In one embodiment, the packaging forms include: B-type packaging and S-type packaging, wherein the B-type packaging complies with the mechanical characteristics and electrical performance requirements of the BOSA optical transceiver module, and the S-type packaging complies with the mechanical characteristics and electrical performance requirements of the SFP and SFF optical transceiver modules.

[0012] In one embodiment, the number of channels of the multi-channel optical transceiver assembly includes one of the following specifications: 12 channels, 16 channels, 24 channels, 32 channels, 48 ​​channels and 64 channels, and the rate of the multi-channel optical transceiver assembly includes: Gigabit rate or 10 Gigabit rate.

[0013] In one embodiment, the transceiver die includes: a transmitting die and a receiving die in a vertically arranged state; the combiner includes: a 0-degree green light plate holder, a 0-degree wave plate, and a 45-degree wave plate.

[0014] In the above example, a multi-channel integrated optoelectronic conversion transceiver device is provided, including: a multi-channel optical transceiver component, a multi-grid integrated base, a multi-core pigtail, a multi-core pigtail fiber compartment and a multi-core pigtail connection female head, wherein: each optical transceiver component is provided with a transceiver core, a combiner / demultiplexer and an optical signal coupler, and the transceiver core, combiner / demultiplexer and optical signal coupler in each optical transceiver component are respectively installed in each grid of the multi-grid integrated base to form a multi-channel integrated optoelectronic conversion transceiver component; the receiving wavelength optical signal and the transmitting wavelength optical signal of the transceiver core in each optical transceiver component are combined and demultiplexed by the combiner / demultiplexer, and then coupled to one core pigtail in the multi-core pigtail through the optical signal coupler to complete the transmission of the receiving wavelength optical signal and the transmitting wavelength optical signal. The above solution solves the existing technical problem that when a central office connects to more users, the demand for high-density interfaces can only be met by stacking more devices, which leads to increased costs of central office equipment. The technical effect of meeting the demand for high-density interfaces without increasing the cost of central office equipment is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1 It is a schematic diagram of a high-density optical fiber interface multi-channel integrated optoelectronic conversion transceiver device provided by the present application; Figure 2 It is a schematic diagram of components in each grid of the B-type multi-channel integrated optoelectronic conversion transceiver provided by the present application; Figure 3 It is a schematic diagram of a multi-channel grid of a B-type multi-channel integrated photoelectric conversion transceiver device provided by the present application; Figure 4 This is a schematic diagram of a multi-channel integrated module of a B-type packaged integrated optoelectronic conversion transceiver provided by the present application; Figure 5 This is a schematic diagram of a fiber tray cabin installed on a B-type multi-channel integrated optoelectronic conversion transceiver provided by the present application; Figure 6 It is a schematic diagram of a multi-channel integrated optoelectronic conversion transceiver device adapter and a multi-core fiber pigtail provided by the present application; Figure 7 This is a schematic diagram of the B-type multi-channel integrated optoelectronic conversion transceiver device provided by the present application adapted to a multi-core fiber pigtail; Figure 8 This is a schematic diagram of a 2*B type multi-channel integrated photoelectric conversion transceiver provided by the present application; Fig. 9 It is a schematic diagram of an S-shaped package multi-channel integrated photoelectric conversion transceiver provided by the present application; Fig.10 This is the electrical principle block diagram of the photoelectric conversion module in each grid of the multi-channel integrated module provided by the present application; Fig.11 It is a schematic diagram of the transceiver die and PCBA in each grid of the S-type package provided by the present application; Fig.12 It is a schematic diagram of a multi-channel grid of an S-type multi-channel integrated optoelectronic conversion transceiver device provided by the present application; Fig.13 It is a schematic diagram of a multi-channel module of an S-type multi-channel integrated optoelectronic conversion transceiver provided by the present application; Fig.14 This is a schematic diagram of an S-type multi-channel integrated optoelectronic conversion transceiver provided by the present application with a fiber tray cabin installed; Fig.15 It is a schematic diagram of an S-type packaged multi-channel integrated optoelectronic conversion transceiver adapter and a multi-core pigtail provided by the present application; Fig.16 It is a schematic diagram of the installation adapter and multi-core pigtail of the S-type package multi-channel integrated optoelectronic conversion transceiver device provided by the present application; Fig.17 This is a schematic diagram of an S-type packaged 2*n-channel multi-channel integrated optoelectronic conversion transceiver device provided by the present application. DETAILED DESCRIPTION

[0017] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work should fall within the scope of protection of the present application.

[0018] In order to overcome the problem that the existing single-body optical module occupies a large space on the circuit board and the panel and cannot realize the high-density optical interface of the single device, a multi-channel integrated optoelectronic conversion transceiver device is provided in this example, including: a multi-channel integrated optoelectronic conversion transceiver component, a multi-core pigtail and a multi-core pigtail adapter. The device can not only meet all the electrical performance of the existing single-body optoelectronic conversion transceiver component, but also reduce the overall physical size of the optical transceiver component through the integrated multi-channel component integration process, and combine with the multi-core pigtail adapter to improve the density of the optical interface on the device. Compared with the existing single-body component and the optical interface adapter on the panel, the number of optical interfaces on the panel of the same area of ​​equipment can be increased by more than 10 times, thereby effectively solving the problem that the chip interface density is extremely high, but the physical interface density of the device does not match it, so that the optical interface of a single device or a split device can reach the level of 48, 64, 96, 128, 192, 256, 384, 512, 768 optical interfaces.

[0019] Specifically, in this example, a multi-channel integrated optoelectronic conversion transceiver is provided, which is applied to the relay equipment of multi-channel optical fiber signals in the optical fiber network and the central office equipment of the access network to realize the optoelectronic conversion, relay and transmission of the multi-channel transmission signals. Figure 1 As shown, the multi-channel integrated optoelectronic conversion transceiver device may include: an integrated multi-channel signal optoelectronic conversion transceiver component 1, a multi-core pigtail 11, a multi-core pigtail adapter 13 and a multi-core pigtail compartment cover 9.

[0020] Each channel of the multi-channel integrated optoelectronic conversion device has a transceiver core, a combiner / demultiplexer (2, 3, 4 and 5), an optical signal coupler and a pigtail 7. The receiving wavelength optical signal and the transmitting wavelength optical signal in each channel are combined and demultiplexed by the combiner / demultiplexer, and then coupled to one of the pigtails 7 in the multi-core pigtail 11 through a coupler to complete the transmission of the receiving and transmitting optical signals in the channel. The rear end of the multi-channel integrated optoelectronic conversion transceiver is provided with a multi-core pigtail fiber coiling cabin 8. After the multi-core pigtail 11 is introduced into the coiling cabin through the inlet of the coiling cabin 8, it is separated and orderly coiled and then adapted to the coupler of each optical signal of the multi-channel integrated optoelectronic conversion transceiver. The other end of the multi-core pigtail is encapsulated in the multi-core pigtail adapter connecting female head 12 after a certain length is reserved outside the coiling cabin 8 to form a multi-channel integrated optoelectronic conversion device. The transceiver rate of the multi-channel integrated optoelectronic conversion transceiver device can support 1GE, 10GE or higher, and the transceiver rate can be symmetrical or asymmetrical. For example, the wavelength of the receiving light is 1310nm, and the wavelength of the transmitting light is 1490nm. However, it is worth noting that the wavelength value given in this example is only an exemplary description. When implementing, wavelengths with other values ​​can be selected.

[0021] In this example, the multi-channel optical fiber transceiver assembly is designed in an integrated manner, and is organically combined with a multi-core pigtail and a multi-core pigtail adapter to form a high-density optical fiber interface multi-channel integrated optoelectronic conversion transceiver device, thereby solving the problem that the existing single-type optical transceiver assembly occupies a large space in the device and the optical interface density of the device is not high enough. After using the multi-channel integrated optoelectronic conversion transceiver provided in this example, the optical interface density on the device panel can be increased by more than 10 times compared with the existing single-type optical interface device. The optical interface density on the chassis panel of the same panel area can be increased by more than 10 times, so that the chassis panel that can currently accommodate a single device with 24 or 48 optical fiber interfaces can be achieved, including but not limited to 32, 48, 64, 96, 128, 192, 256, 384, 512, 768 optical interfaces, thereby solving the problem that the existing chip interface density is high, but the physical interface density of the device does not match it.

[0022] That is, in this example, a multi-channel integrated optoelectronic conversion transceiver device is provided, and an optoelectronic conversion transceiver core, a wavelength division plate, an optical coupler, a related transceiver control chip and a pigtail are installed in each grid of the integrated multi-grid base. The optoelectronic conversion transceiver core, the wavelength division plate, the optical coupler, the related transceiver control chip and the adapter in each grid can be divided into two packaging formats: B-type packaging and S-type packaging. The B-type packaging complies with the mechanical characteristics and electrical performance requirements of the BOSA (Bidirectional Optical Assembly) optical transceiver module, and the S-type packaging complies with the mechanical characteristics and electrical performance standard requirements of the SFP and SFF (Small Form Factor) optical transceiver modules, thereby meeting the docking and transmission characteristics of the common BOSA optical transceiver modules, SFP and SFF optical transceiver modules on the market.

[0023] Among them, the pigtails adapted from each optical signal coupler in the multi-channel integrated optoelectronic conversion transceiver assembly are orderly coiled in the fiber coiling compartment at the rear end of the integrated base and converged into multi-core pigtails. The multi-core pigtails are fixedly led out through the lead-out hole, and after reserving an appropriate length, they are packaged into the multi-core pigtail adapter connecting female head to form a high-density optical fiber interface multi-channel integrated optoelectronic conversion transceiver. The multi-core pigtails led out from the fiber coiling compartment of the multi-channel integrated optoelectronic conversion transceiver are composed of the multi-core pigtail connecting female head adapted thereto, the multi-core pigtail adapter on the chassis panel, and the multi-core pigtail connecting male head outside the chassis, thereby realizing the organic combination of the multi-core pigtails and the multi-core pigtail adapter with the multi-channel integrated optoelectronic conversion transceiver.

[0024] The fiber coiling compartment of the multi-channel integrated optoelectronic conversion transceiver device leads out multi-core pigtails instead of single-core pigtails from each transceiver component, so that there are no multiple single-core pigtails randomly entangled on the printed board inside the chassis, so that it is easy to realize the need to weld multiple multi-channel integrated optoelectronic conversion transceivers on the printed board. Furthermore, the multi-core pigtails led out of the fiber coiling compartment of the multi-channel integrated optoelectronic conversion transceiver device are adapted to the multi-core pigtail female connector, and are connected to the multi-core pigtail male connector outside the chassis through the multi-core pigtail adapter on the chassis panel. The multi-core pigtail adapter replaces the LC and SC single-core pigtail adapter interfaces on the existing equipment panel, so that when N multi-channel integrated optoelectronic conversion transceivers can be welded on the printed board inside the chassis, N multi-core pigtail adapter adapters can be configured on the chassis panel.

[0025] When the number of 1 / N multi-channel integrated optoelectronic conversion transceiver devices is equal to n, the optical interface on the chassis panel can be N*n optical interfaces. Among them, the number of n of the multi-channel integrated optoelectronic conversion transceiver devices can be divided into two series of 12, 24, 48 channels and 16, 32, 64 channels, which can adapt to the docking of different numbers of physical interface chips. In this way, it can be configured on the chassis panel of the LC and SC interfaces of N*1 cores, and the fiber adaptation capability of N*n cores can be achieved, so that the optical interface of a single device reaches two series of multi-channel optical interfaces such as 48, 96, 192, 384 channels and 64, 128, 256, 512, 768 channels. The transmission rate of the above-mentioned multi-channel integrated optoelectronic conversion transceiver device can include but is not limited to: Gigabit rate or 10 Gigabit rate, so that it can adapt to the high-speed multi-interface chip in the device and provide the device with a high-density and high-speed optical interface. The patch of the multi-channel integrated optoelectronic conversion transceiver on the printed plate can realize the patch machine production process, thereby reducing the production process cost.

[0026] The above-mentioned multi-channel integrated optoelectronic conversion transceiver device is described below in conjunction with a specific embodiment. It should be noted that this specific embodiment is only for better illustrating the present application and does not constitute an improper limitation on the present application.

[0027] In this example, multiple single-type optical transceiver assembly bases are designed into a multi-channel integrated optical transceiver assembly base grid, and the transceiver tube core, 0-degree green light plate seat, 0-degree wave plate, receiving tube core, 45-degree wave plate, transition ring, related transceiver driver, control chip and optical fiber adapter of each transceiver assembly are installed in each grid of the integrated base grid to form a multi-channel integrated optoelectronic conversion transceiver assembly. A multi-channel pigtail optical signal lossless fiber coiling cabin is set at the rear end of the multi-grid integrated base, and a multi-core pigtail is introduced through the fiber coiling cabin introduction port. After the multi-core pigtail introduced into the pigtail cabin is stripped into a single-core pigtail, it is losslessly coiled in the fiber coiling cabin and respectively adapted to the optical fiber transceiver assembly in each grid. At the same time, the other end of the multi-core pigtail introduced into the pigtail cabin is reserved with the required length outside the fiber coiling cabin and adapted to the multi-core pigtail adapter connection female head to form a multi-channel integrated optoelectronic conversion transceiver device. In practical applications, the transceiver pins of the multi-channel integrated optoelectronic conversion transceiver device can be welded to the printed board, and its multi-core fiber pigtail female head can be inserted into the multi-core fiber pigtail adapter adapter seat installed on the chassis panel, and connected with the multi-core fiber pigtail adapter connecting male head outside the chassis to complete the adaptation with the optical fiber terminal outside the chassis, forming a high-density optical fiber interface on the chassis panel, thereby solving the problem of high-density interface that cannot be achieved by existing BOSA type or SFF type or SFP optical module plus LC, SC optical fiber adapter interface.

[0028] The above-mentioned multi-channel integrated optoelectronic conversion transceiver device can adopt a B-type packaging solution or an S-type packaging solution. The B-type packaging complies with the mechanical characteristics and electrical performance requirements of the BOSA optical transceiver module, and the S-type packaging complies with the mechanical characteristics and electrical performance standard requirements of the SFP and SFF optical transceiver modules, thereby fully meeting the docking and transmission characteristics with the common BOSA optical transceiver modules, SFP, and SFF optical transceiver modules on the market. The number of optical interfaces on the chassis panel of the multi-channel integrated optoelectronic conversion transceiver device of the B-type packaging and S-type packaging solutions can be increased by more than 10 times compared with the number of interfaces of the BOSA type or SFF type or SFP optical module plus LC, SC optical fiber adapter, and the optical interface of a single device can reach 48, 64, 96, 128, 192, 256, 384, 512 to 768 optical interfaces.

[0029] That is, in this example, a high-density optical fiber interface multi-channel integrated optoelectronic conversion transceiver device is provided to solve the problem of low density of optical fiber interface of local area network and access network central office equipment. The multi-channel integrated optoelectronic conversion transceiver device adopts B-type packaging and S-type packaging solutions. The B-type packaging complies with the mechanical characteristics and electrical performance requirements of the BOSA optical transceiver module, and the S-type packaging complies with the mechanical characteristics and electrical performance standard requirements of the SFP and SFF optical transceiver modules, thereby meeting the docking and transmission characteristics with the general BOSA optical transceiver module, SFP, and SFF optical transceiver module. Specifically: 1) Type B structure multi-channel integrated photoelectric conversion transceiver: like Figure 3 As shown, the B-type structure multi-channel integrated photoelectric conversion transceiver device may include multiple Figure 2 The multi-channel integrated grid base 16 can be installed with the photoelectric conversion transceiver components, and the following components can be installed in each grid: Figure 2 The photoelectric conversion transceiver tube core (2, 3, 4 and 5), the wavelength combining and demultiplexing plate (20, 21, 22, 23 and 24) shown in the figure are used to form a Figure 4 The multi-channel integrated optoelectronic conversion transceiver module 1 shown. Figure 2 In the figure, 17 represents the mounting hole of the transmitting tube core, 18 represents the mounting hole of the receiving tube core, 19 represents the mounting hole of the adapter, 2 represents the transmitting tube core, 3 represents the lead-out pin of the transmitting tube core, 4 represents the receiving tube core, 5 represents the lead-out pin of the receiving tube core, 20 represents the 0-degree filter, 21 represents the 0-degree filter mounting seat, 22 represents the sealing gasket, 23 represents the 45-degree wave splitter, and 24 represents the transition ring.

[0030] like Figure 5 As shown, it can be Figure 4 The rear end of the multi-channel integrated optoelectronic conversion transceiver module 1 is provided with a multi-channel pigtail fiber coiling compartment 8, Figure 6 The multi-core pigtail shown in the figure is introduced into the fiber coiling compartment through the fiber coiling compartment introduction hole 25, separated into single-path pigtails 7, and the bending radius in the fiber coiling compartment is not less than 10mm. After the fiber coil is fixed, the lead-out pigtail 7 of the optical signal adapter 6 after the combiner / demultiplexer in each grid is formed, and the multi-core pigtail 11 leading out of the fiber coiling compartment 8 is inserted into the introduction hole 25 through the multi-core pigtail lead-out bayonet 10, forming a Figure 7 The multi-channel integrated photoelectric conversion transceiver shown in FIG. Figure 8 The figure shows a schematic diagram of a 2*B type multi-channel integrated optoelectronic conversion transceiver, that is, two fiber coil compartments are connected to a multi-core pigtail adapter connecting female head 12.

[0031] like Fig. 9 As shown, a multi-core pigtail adapter connecting female head 12 can be configured at the head end of the multi-core pigtail 11 (inside the box) reserved outside the fiber coil cabin, such as Figure 1 As shown, a multi-core fiber pigtail adapter adapter seat 13 is installed on the chassis panel to connect with the multi-core fiber pigtail adapter female connector 12 inside the chassis and the multi-core fiber pigtail adapter male connector 14 outside the chassis, and a multi-core fiber pigtail 15 (outside the chassis) is led out from the multi-core fiber pigtail adapter male connector 14.

[0032] 2) S-shaped multi-channel integrated photoelectric conversion transceiver: like Fig.10As shown, it is an electrical principle block diagram of the photoelectric conversion module in each grid of the S-type packaged multi-channel integrated module. The photoelectric conversion module in each grid may include pins: VCCT, TD+, TD-, VEET, monitoring control signal I / O, VCCR, RD+, RD-, VEER, modules: cache, LD driver, temperature compensation circuit, automatic optical power control circuit, PD, LD, MCU monitoring control circuit, cache, limiting amplifier, low-pass filter, preamplifier, and the laser shutdown control signal is transmitted between the MCU monitoring control circuit and the automatic optical power control circuit.

[0033] like Fig.11 As shown, it is a multi-channel integrated grid base of an S-shaped packaged optoelectronic conversion transceiver component, such as Fig.12 As shown, install the following in each grid: Fig.11 The photoelectric conversion transceiver cores (2, 3, 4 and 5), the wavelength combining and demultiplexing plates (27, 30, 31 and 32), and the adapter mounting hole 29 are shown. Fig.13 The multi-channel integrated optoelectronic conversion transceiver module 26 is shown.

[0034] like Fig.14 As shown, a multi-channel pigtail fiber compartment 8 is provided at the rear end of the multi-channel integrated optoelectronic conversion transceiver module 26, and Fig.15 The multi-core pigtail shown in the figure is introduced into the fiber coiling compartment through the fiber coiling compartment introduction hole 25, separated into single-path pigtails 7, and the bending radius in the fiber coiling compartment is not less than 10mm. After the fiber coil is fixed, the lead-out pigtail 7 of the optical signal adapter 28 after the combiner / demultiplexer in each grid is formed, and the multi-core pigtail 11 leading out of the fiber coiling compartment 8 is inserted into the introduction hole 25 through the multi-core pigtail lead-out bayonet 10, forming a Fig.16 The multi-channel integrated photoelectric conversion transceiver shown in FIG. Fig.17 The figure shows a schematic diagram of an S-type package 2*n-channel multi-channel integrated photoelectric conversion transceiver. Fig.17 As shown, the head end of the multi-core fiber pigtail 11 reserved outside the fiber optic coil cabin is equipped with a multi-core fiber pigtail adapter connecting female head 12, and a multi-core fiber pigtail adapter adapter seat 13 is installed on the chassis panel to connect the multi-core fiber pigtail adapter connecting female head 12 inside the chassis with the multi-core fiber pigtail adapter connecting male head 14 outside the chassis.

[0035] The optical transmission and reception wavelengths of each channel in the above-mentioned multi-channel integrated optoelectronic conversion transceiver device are equal, and may include but are not limited to a 1310nm receiving wavelength and a 1490nm transmitting wavelength.

[0036] In the above example, by using a high-density multi-fiber interface multi-channel optoelectronic conversion transceiver, the number of optical interfaces on the chassis panel of the same area can be increased by more than 10 times compared with the use of SC, LC interfaces or plug-in optical modules, which can effectively solve the problem that the existing chip interface density is high but the physical interface density of the equipment does not match it. As a result, the optical interface of a single device can reach 48, 64, 96, 128, 192, 256, 384, 512, 768 optical interfaces, solving the existing problem that when a local area network or access network office connects to more users, it can only use more equipment stacking to meet the needs of high-density interfaces, thereby greatly saving the investment cost of office equipment.

[0037] The multi-channel integrated optoelectronic conversion transceiver provided in this example can be used as an optoelectronic conversion transceiver module in the device, with an optical-to-electrical conversion and receiving circuit in the receiving direction, and a driving circuit and an electrical-to-optical conversion device in the sending direction. The optical signal with a specified receiving wavelength and carrying data information transmitted by the optical fiber can be converted into an electrical signal through the optical-to-electrical conversion function of the device, and after passing through the receiving shaping and amplifying circuit of the electrical signal, it is input into the corresponding receiving circuit of the device; similarly, the data electrical signal that the device needs to transmit is sent to the electrical-to-optical conversion module through the transmitting circuit of the device, and converted into an optical signal of a specified transmitting wavelength and sent out. That is, the multi-channel integrated optoelectronic conversion transceiver can be used to integrate the monomer optical modules into multi-channel integrated optical modules, and use multi-core pigtails and multi-core pigtail adapters for integrated design, which solves the problem that the existing monomer optical transceiver components occupy a large space in the device and the optical interface density of the device is not high enough.

[0038] In an embodiment of the present application, a multi-channel integrated photoelectric conversion transceiver is provided, which can meet the requirements of high-density interfaces without increasing the cost of the central office equipment. Specifically, the multi-channel integrated photoelectric conversion transceiver may include: a multi-channel optical transceiver component, a multi-channel integrated base grid and a multi-core pigtail, wherein: Each optical transceiver assembly is provided with a transceiver core, a combiner and an optical signal coupler. The transceiver core, the combiner and the optical signal coupler in each optical transceiver assembly are respectively installed in each grid of the multi-grid integrated base to form a multi-channel integrated optoelectronic conversion transceiver assembly; the receiving wavelength optical signal and the transmitting wavelength optical signal of the transceiver core in each optical transceiver assembly are combined by the combiner and coupled to one core of the multi-core pigtail through the optical signal coupler to complete the transmission of the receiving wavelength optical signal and the transmitting wavelength optical signal.

[0039] In one embodiment, in order to prevent the pigtails from being messy, the above-mentioned multi-channel integrated optoelectronic conversion transceiver device may also include: a multi-core pigtail coiling cabin, the multi-core pigtails introduced through the introduction hole of the multi-core pigtail coiling cabin, after being stripped into single-core pigtails in the multi-core pigtail coiling cabin, the optical signals are losslessly coiled in the coiling cabin, and then adapted to the optical transceiver components in each grid through optical signal adapters.

[0040] Furthermore, in order to achieve the adaptation and optical fiber connection outside the chassis, the above-mentioned multi-channel integrated optoelectronic conversion transceiver device also includes: a connecting female head of a multi-core pigtail adapter, and the other end of the multi-core pigtail introduced into the multi-core pigtail coiling compartment is adapted to the connecting female head after a preset length is reserved outside the coiling compartment. The connecting female head of the multi-core pigtail adapter is used to be inserted into the adapter seat of the multi-core pigtail adapter installed on the chassis panel, and docked with the connecting male head of the multi-core pigtail adapter outside the chassis to complete the adaptation with the optical fiber terminal outside the chassis, forming a high-density optical fiber interface on the chassis panel.

[0041] When packaging the above-mentioned multi-channel integrated optoelectronic conversion transceiver device, the packaging forms that can be used include: B-type packaging and S-type packaging, among which the B-type packaging complies with the mechanical characteristics and electrical performance requirements of the BOSA optical transceiver module, and the S-type packaging complies with the mechanical characteristics and electrical performance requirements of the SFP and SFF optical transceiver modules.

[0042] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the hardware + program embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0043] The above is a description of a specific embodiment of the specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0044] Although the present application provides method operation steps as described in the embodiments or flowcharts, more or fewer operation steps may be included based on conventional or non-creative labor. The order of steps listed in the embodiments is only one way of executing the order of many steps and does not represent the only execution order. When the actual device or client product is executed, it can be executed in the order of the method shown in the embodiments or the drawings or in parallel (for example, in a parallel processor or multi-threaded processing environment).

[0045] For the convenience of description, the above devices are described in various modules according to their functions. Of course, when implementing the embodiments of this specification, the functions of each module can be implemented in the same or more software and / or hardware, or the module implementing the same function can be implemented by a combination of multiple sub-modules or sub-units. The device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0046] Those skilled in the art also know that, in addition to implementing the controller in a purely computer-readable program code, the controller can be made to implement the same function in the form of logic gates, switches, application-specific integrated circuits, programmable logic controllers, and embedded microcontrollers by logically programming the method steps. Therefore, such a controller can be considered as a hardware component, and the devices for implementing various functions included therein can also be considered as structures within the hardware component. Or even, the devices for implementing various functions can be considered as both software modules for implementing the method and structures within the hardware component.

[0047] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems) and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0048] The present specification embodiments may be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. The present specification embodiments may also be practiced in distributed computing environments where tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules may be located in local and remote computer storage media, including storage devices.

[0049] Each embodiment in this specification is described in a progressive manner, and the same and similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment. In the description of this specification, the description of the reference terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of this specification. In this specification, the schematic representation of the above terms does not necessarily target the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, in the absence of mutual contradiction, a person skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0050] The above is only an example of the embodiment of the present specification and is not intended to limit the embodiment of the present specification. For those skilled in the art, the embodiment of the present specification may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the embodiment of the present specification shall be included in the scope of the claims of the embodiment of the present specification.

Claims

1. A multi-channel integrated photoelectric conversion transceiver, characterized in that: include: Multi-channel optical transceiver components, multi-grid integrated base, multi-core pigtails, multi-core pigtail trays and multi-core pigtail adapter female heads, including: Each optical transceiver assembly is provided with a transceiver tube core, a combiner / demultiplexer and an optical signal coupler. The transceiver tube core, the combiner / demultiplexer and the optical signal coupler in each optical transceiver assembly are respectively installed in each grid of the multi-grid integrated base to form a multi-channel integrated photoelectric conversion transceiver assembly; the receiving wavelength optical signal and the transmitting wavelength optical signal of the transceiver tube core in each optical transceiver assembly are combined and demultiplexed by the combiner / demultiplexer, and then coupled to one core pigtail of the multi-core pigtail through the optical signal coupler to complete the transmission of the receiving wavelength optical signal and the transmitting wavelength optical signal; A multi-core fiber pigtail cabin is arranged at the rear end of the multi-grid integrated base. The multi-core fiber pigtail introduced through the introduction hole of the multi-core fiber pigtail cabin is stripped into single-core fiber pigtails in the multi-core fiber pigtail cabin and optical signals are losslessly coiled in the cabin. Then, they are adapted to the optical transceiver components in each grid through optical signal adapters respectively, and the multi-core fiber pigtail led out from the cabin and reserved for a preset length is adapted to the multi-core fiber pigtail adapter female head.

2. The multi-channel integrated photoelectric conversion transceiver according to claim 1, characterized in that: The multi-core fiber pigtail adapter female head is inserted into the adapter seat of the multi-core fiber pigtail adapter installed on the chassis panel, and docked with the connecting male head of the multi-core fiber pigtail adapter outside the chassis to complete the adaptation with the optical fiber terminal outside the chassis to form a high-density optical fiber interface on the chassis panel.

3. The multi-channel integrated photoelectric conversion transceiver according to claim 1, characterized in that: The height and width of the multi-core pigtail fiber coiling cabin are determined according to the bending diameter of the pigtail fiber in the coiling cabin without causing any loss in the coiling of the fiber, so as to ensure that no loss in the coiling of the fiber is caused.

4. The multi-channel integrated photoelectric conversion transceiver according to claim 3, characterized in that: The bending radius of the single-core pigtail in the fiber coil compartment is greater than or equal to 10 mm.

5. The multi-channel integrated photoelectric conversion transceiver according to claim 1, characterized in that: The introduction hole of the multi-core pigtail fiber winding cabin is provided with a lead-out bayonet, and the multi-core pigtail is inserted into the introduction hole of the multi-core pigtail fiber winding cabin through the lead-out bayonet.

6. The multi-channel integrated photoelectric conversion transceiver according to claim 1, characterized in that: The wavelength of the receiving wavelength optical signal of each optical transceiver component in the multi-channel optical transceiver component is equal, and the wavelength of the transmitting wavelength optical signal of each optical transceiver component in the multi-channel optical transceiver component is equal, the wavelength of the receiving wavelength optical signal is 1310nm, and the wavelength of the transmitting wavelength optical signal is 1490nm.

7. The multi-channel integrated photoelectric conversion transceiver according to claim 1, characterized in that: The packaging forms include: B-type packaging and S-type packaging. Among them, the B-type packaging complies with the mechanical characteristics and electrical performance requirements of the BOSA optical transceiver module, and the S-type packaging complies with the mechanical characteristics and electrical performance requirements of the SFP and SFF optical transceiver modules.

8. The multi-channel integrated photoelectric conversion transceiver according to claim 1, characterized in that: The number of channels of the multi-channel optical transceiver assembly includes one of the following specifications: 12 channels, 16 channels, 24 channels, 32 channels, 48 ​​channels and 64 channels, and the rate of the multi-channel optical transceiver assembly includes: 1 Gigabit rate or 10 Gigabit rate.

9. The multi-channel integrated photoelectric conversion transceiver according to any one of claims 1 to 8, characterized in that: The transceiver tube core includes: a transmitting tube core and a receiving tube core in a vertical setting state; the combiner / splitter includes: a 0-degree green light plate holder, a 0-degree wave plate, and a 45-degree wave plate.

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