Carrying device and method for semiconductor substrate processing

Abstract

The invention belongs to the technical field of semiconductor substrates, and particularly relates to a carrying device and method for semiconductor substrate processing. Comprising a conveying equipment table and a purification square box; a conveying belt is further arranged on the conveying equipment table, and the purification square box is placed on the conveying belt; a buffer pad is arranged on the inner bottom surface of the purification square box; the semiconductor substrate is positioned in the purification square box and is placed at the top of the buffer pad; the conveying equipment table is further provided with two sets of position moving pressure adjusting assemblies, and the two sets of position moving pressure adjusting assemblies are symmetrically arranged on the two sides of the top of the conveying equipment table, so that the conveying belt is located between the two sets of position moving pressure adjusting assemblies. The semiconductor substrate is prevented from being polluted in the conveying process through the gas-making pollution-stopping unit, the risks of electric leakage or short circuit and the like caused by the fact that particulate matter in air falls into a conductive area on the substrate in the using process are avoided, the integrity of a circuit is kept and guaranteed, the performance and stability of the semiconductor substrate in the using process are improved, and the service life of the semiconductor substrate is prolonged. And the carrying effect of the device is also improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor substrates, and in particular relates to a transport device and method for processing semiconductor substrates. Background Art

[0002] A semiconductor substrate is a basic material used to support and connect various electronic components in semiconductor devices. It is usually made of semiconductor materials such as silicon, germanium, gallium arsenide, etc., or insulating materials such as sapphire and quartz that have been specially treated for use in semiconductor manufacturing. Since the production of semiconductors involves multiple complex processing steps, the handling device can quickly transfer the substrate from one step to the next, avoiding waiting time in the production process, greatly improving the overall production efficiency, and enabling each step to be closely connected.

[0003] Existing handling devices can easily cause the substrates to be contaminated during the process of conveying the substrates, and cannot ensure that the substrates are in a contamination-free state during conveyance. If the substrates are contaminated during the process or particulate matter in the air falls into the conductive area of ​​the chip on the substrate, there will not only be risks of short circuits and leakages, but also the integrity of the circuit will be destroyed, making it impossible to guarantee the performance of the semiconductor substrate, thereby reducing the stability of the substrate during use and reducing the handling effect of the device. Summary of the invention

[0004] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a transport device and method for semiconductor substrate processing, which effectively solves the problems in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a transport device for semiconductor substrate processing, comprising a conveying equipment table and a purification box; a conveyor belt is also arranged on the conveying equipment table, and the purification box is placed on the conveyor belt; a buffer pad is arranged on the inner bottom surface of the purification box, and the semiconductor substrate is located in the purification box and placed on the top of the buffer pad; a position regulating component is also arranged on the conveying equipment table, and the number of the position regulating components is two groups, and they are symmetrically arranged on both sides of the top of the conveying equipment table, so that the conveyor belt is located between the two groups of position regulating components; the position regulating component is used to increase the friction force of the purification box in contact with the conveyor belt during transportation; an air control and pollution prevention unit is also arranged on the purification box, and the air control and pollution prevention unit is used to prevent the semiconductor substrate from being contaminated during transportation.

[0006] Preferably, the air-control and pollution-stopping unit includes a driving motor, which is arranged at the top of the purification box; the bottom of the purification box is placed on the conveyor belt; a braking gear is installed on the output end of the driving motor, and a driving bevel gear is also installed on the side of the braking gear away from the purification box, and a wind-generating and exhaust mechanism is arranged on the driving bevel gear; a braking rack is arranged on the opposite side of the braking gear, and the braking rack is meshed with the braking gear; two braking square plates are installed on the braking rack, and the opposite surfaces of the two braking square plates are commonly connected with a braking cylinder, and a braking substrate is slidably arranged on the braking cylinder, and the braking substrate is fixedly arranged on the top of the purification box.

[0007] Preferably, a bent square rod is installed on a brake square plate at the two brake racks, and the two bent square rods are respectively located on the front and rear sides of the purification square box; the bent square rods are connected to U-shaped square rods, the opening of the U-shaped square rod faces the conveyor belt and is also installed with a brake cross block, and limiting square plates are installed on both sides of the brake cross block, and a limiting cylinder is slidably arranged on the limiting square plate, and the limiting cylinder is fixedly arranged on the purification square box; a limiting spring is sleeved on the limiting cylinder, one end of the limiting spring is fixedly connected to the purification square box, and the other end is fixedly connected to the limiting square plate.

[0008] Preferably, the position-adjusting pressure-regulating assembly comprises two auxiliary bases symmetrically arranged on one side of the top of the conveying equipment platform, an auxiliary square column is fixedly mounted on the auxiliary base, and an auxiliary limit plate is also mounted on one end of the auxiliary square column away from the auxiliary base; an auxiliary spring is sleeved on the auxiliary square column, one end of the auxiliary spring is fixedly connected to the auxiliary limit plate, and the other end is connected to an auxiliary slider, and the auxiliary slider is slidably arranged on the auxiliary square column; an adjusting base plate is mounted on the opposite back surfaces of the two auxiliary sliders, an adjusting cylinder is slidably arranged on the adjusting base plate, one end of the adjusting cylinder is connected to the adjusting limit plate, and the other end is mounted on an adjusting cross plate, and an adjusting locking block is fixedly mounted on the side of the adjusting cross plate facing the top of the auxiliary square column; a plurality of adjusting locking grooves are arranged on the side of the auxiliary square column facing the adjusting locking block, and the adjusting locking block passes through the auxiliary slider and is connected to the adjusting locking groove.

[0009] Preferably, an adjusting spring is sleeved on the adjusting cylinder, one end of the adjusting spring is connected to the adjusting limit plate, and the other end is connected to the adjusting base plate; the opposite surfaces of the two auxiliary sliding blocks are commonly connected to a pressure cross block, and two pressure square columns are slidably arranged on the pressure cross block, and the pressure square columns are installed with a U-shaped base at one end close to the conveyor belt, and a transmission pulley is installed in the U-shaped base, and the two transmission pulleys are commonly connected to the conveyor belt, and the side walls of the conveyor belt are made of rubber and are in contact with the side surfaces of the purification box; a number of load-bearing rollers are installed in the opposite surfaces of the conveyor belt, and the load-bearing rollers are in contact with the inner wall of the conveyor belt close to the purification box; a number of the load-bearing rollers are commonly connected to a supporting base plate, and the supporting base plate is connected to the U-shaped base; a rotating motor is installed on one of the U-shaped bases, and the rotating motor is connected to the transmission pulley; a pressure spring is sleeved on the pressure square column, one end of the pressure spring is connected to the U-shaped base, and the other end is connected to the pressure cross block.

[0010] Preferably, an elastic sliding stop unit is also provided on the brake rack; the elastic sliding stop unit includes a first square plate arranged on both sides of the brake rack, an elastic sliding rod is penetrated through the first square plate, and the elastic sliding rod and the first square plate are slidably matched; a second square plate is installed at the end of the elastic sliding rod away from the brake rack, and the opposite surfaces of the two second square plates are commonly connected with elastic teeth, and the elastic teeth are located on the rotation path of the brake gear and the two are meshed with each other; an extrusion spring is sleeved on the elastic sliding rod, one end of the extrusion spring is connected to the first square plate, and the other end is connected to the second square plate.

[0011] Preferably, the wind-generating and exhausting mechanism includes two symmetrically arranged rotating bevel gears meshingly connected to the driving bevel gear, and a rotating shaft is installed on the opposite back surfaces of the two rotating bevel gears, and a first substrate is installed at the end of the rotating shaft away from the driving bevel gear, and the first substrate is arranged on the top of the purification box; a first helical gear is also installed on the rotating shaft, and the first helical gear is meshingly connected to the second helical gear, and a driving shaft is installed on the second helical gear, and the driving shaft is connected to the second substrate, and the second substrate is arranged on the first substrate; a first pulley is installed at the end of the driving shaft away from the second helical gear, a belt is connected to the first pulley, and the belt is connected to the second pulley, and the belt slides with the second pulley and the first pulley; a wind-generating shaft is installed on the side of the second pulley and the first pulley close to the purification box.

[0012] Preferably, the top of the purification box is provided with ventilation circular grooves corresponding to the number and position of the second pulley and the first pulley, one side of the ventilation circular grooves extends to the inner top surface of the purification box, and the other side extends to the top of the purification box, and a filter plate is installed on the top of the purification box by bolts, and the filter plate covers the ventilation circular grooves; one end of the wind-making shaft away from the second pulley passes through the filter plate and is connected to a plurality of fan blades, and the fan blades are located in the ventilation circular grooves; the two wind-making shafts are commonly connected to a T-shaped substrate, and the T-shaped substrate is arranged on the top of the purification box; a scraping bevel block is also installed on the wind-making shaft, and the inclined surface of the scraping bevel block contacts the top of the filter plate.

[0013] Preferably, a stop cylinder is provided through the brake cross block, and the stop cylinder slides with the brake cross block; a stop limit plate is installed on the end of the stop cylinder away from the purification box; a hollow cylinder is slidably provided on the end of the stop cylinder close to the purification box, and the end of the hollow cylinder away from the stop cylinder is provided on the purification box; an air bag is also provided in the purification box, and air supply holes are also provided on the sides of the air bag and the purification box, and the air supply holes are connected with the hollow cylinder; the air supply holes and the bent square rod are in the same position; the outer wall of the air bag is connected to the inner wall of the purification box, and the inner wall of the air bag contacts the semiconductor substrate when the air bag is inflated; a stop spring is also sleeved on the stop cylinder, one end of the stop spring is connected to the stop limit plate, and the other end is connected to the brake cross block.

[0014] The present invention also provides a method for transporting a semiconductor substrate for processing, comprising the following steps: S001. Place a number of semiconductor substrates to be transported in a clean box, and transport the semiconductor substrates to a use area through the movement of a conveyor belt; S002. Several semiconductor substrates are placed on the cushion pad in the purification box to reduce the impact force caused by the shaking of the semiconductor substrates during transportation; S003. Operate the gas control and pollution prevention unit to provide a clean environment for the semiconductor substrate during transportation to prevent contamination.

[0015] Compared with the prior art, the present invention has the following beneficial effects: (1) Start the driving motor so that its output end drives the brake gear to rotate, so that the two meshing brake racks move toward each other, so that the brake cylinder moves on the brake substrate. Under the action of the bent square rod, the two U-shaped square rods move toward each other, so that the brake blocks on them move toward the purification box, thereby driving the stop cylinder to move in the hollow cylinder, so that the gas inside it enters the air bag through the air transmission hole, so that the air bag expands from its initial deflated state, so that the inner wall moves and contacts the semiconductor substrate, thereby wrapping the semiconductor, that is, sealing it, to prevent the semiconductor substrate from being contaminated during the transmission process, so that it can be isolated, to prevent particles in the air from falling into the conductive area on the substrate, causing the risk of leakage or short circuit during use, so that the integrity of the circuit can be maintained, and the performance of the semiconductor substrate is guaranteed, thereby improving the stability of the semiconductor substrate during use, and the handling effect of the device can also be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0017] In the attached picture: Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the purification box structure of the present invention; Figure 3 This is a schematic diagram of the structure of the pressure cross block of the present invention; Figure 4 is a cross-sectional view of the airbag of the present invention; Figure 5 This is a schematic diagram of the structure of the brake substrate of the present invention; Figure 6 It is a schematic diagram of the conveyor belt structure of the present invention; Figure 7 It is a cross-sectional view of the hollow cylinder of the present invention; Figure 8 This is a schematic diagram of the brake cross block structure of the present invention; Fig. 9 This is a schematic diagram of the structure of the adjustable lock slot of the present invention; Fig.10 is a cross-sectional view of the cushion of the present invention; Fig.11 For the present invention Figure 5 A schematic diagram of the partially enlarged structure at center A; Fig.12 It is a cross-sectional view of the ventilation circular groove of the present invention.

[0018] In the figure: 1. conveying equipment table; 2. purification box; 3. buffer pad; 4. driving motor; 5. brake gear; 6. driving bevel gear; 7. brake rack; 8. brake square plate; 9. brake cylinder; 10. brake base plate; 11. bending square rod; 12. U-shaped square rod; 13. brake horizontal block; 14. limit square plate; 15. limit cylinder; 16. limit spring; 17. auxiliary base; 18. auxiliary square column; 19. auxiliary limit plate; 20. auxiliary spring; 21. auxiliary slide block; 22. adjustment base plate; 23. adjustment cylinder; 24. adjustment limit plate; 25. adjustment horizontal plate; 26. adjustment lock block; 27. adjustment lock groove; 28. adjustment spring; 29. ​​pressure horizontal block; 30. pressure square column; 31. U-shaped base; 32. transmission slide Wheel; 33, conveyor belt; 34, load-bearing roller; 35, supporting base plate; 36, rotating motor; 37, pressure spring; 38, first square plate; 39, elastic slide bar; 40, second square plate; 41, elastic tooth; 42, extrusion spring; 43, rotating bevel gear; 44, rotating shaft; 45, first base plate; 46, first bevel gear; 47, second bevel gear; 48, driving shaft; 49, second base plate; 50, first pulley; 51, belt; 52, second pulley; 53, wind-generating shaft; 54, ventilation groove; 55, filter plate; 56, fan blade; 57, T-type base plate; 58, scraping oblique block; 59, stop cylinder; 60, stop limit plate; 61, hollow cylinder; 62, air bag; 63, air delivery hole; 64, stop spring. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0020] Example, by Figures 1 to 12 The present invention comprises a conveying device platform 1 and a purification box 2; a conveying belt is also arranged on the conveying device platform 1, and the purification box 2 is placed on the conveying belt; a buffer pad 3 is arranged on the inner bottom surface of the purification box 2, and the semiconductor substrate is located in the purification box 2 and placed on the top of the buffer pad 3; a position regulating component is also arranged on the conveying device platform 1, and the number of the position regulating components is two groups, and they are symmetrically arranged on both sides of the top of the conveying device platform 1, so that the conveying belt is located between the two groups of position regulating components; the position regulating component is used to increase the friction force of the purification box 2 in contact with the conveying belt during transportation; the purification box 2 is also provided with an air control and pollution prevention unit, and the air control and pollution prevention unit is used to prevent the semiconductor substrate from being contaminated during transportation; The semiconductor substrate to be transported is placed in the purification box 2, and the purification box 2 is placed on the conveyor belt, so that the semiconductor substrate can be transported to the area where it is required to be used; it is worth mentioning that the purification box 2 is equivalent to a closed space, which can prevent the semiconductor substrate from being contaminated during the transportation process, and ensure that the semiconductor substrate is in a pollution-free state during transportation, thereby avoiding the risk of short circuit leakage caused by the semiconductor substrate being contaminated during transportation or particulate matter in the air falling into the conductive area of ​​the chip on the substrate, while avoiding damage to the integrity of the circuit. It is worth mentioning that the semiconductor substrate is placed on the buffer pad 3 in the purification box 2, and the buffering absorption performance brought by the buffer pad 3 can prevent the semiconductor substrate from being shaken during transportation and causing damage to it. The impact force generated by the shaking of the semiconductor substrate can be absorbed by the above-mentioned buffering performance, so that the stability of the semiconductor substrate during transportation can be improved, thereby improving the stability of the device when transporting the semiconductor substrate, further avoiding damage to the circuit or chip on the semiconductor substrate, improving the use effect of the device, and ensuring the use performance of the semiconductor substrate, thereby improving the transportation effect of the device.

[0021] The air control and pollution prevention unit of this embodiment includes a driving motor 4, which is arranged on the top of the purification box 2; the bottom of the purification box 2 is placed on the conveyor belt; a braking gear 5 is installed on the output end of the driving motor 4, and a driving bevel gear 6 is also installed on the side of the braking gear 5 away from the purification box 2, and a wind-generating and exhausting mechanism is arranged on the driving bevel gear 6; a braking rack 7 is arranged on the opposite side of the braking gear 5, and the braking rack 7 is meshed with the braking gear 5, and two braking square plates 8 are installed on the braking rack 7, and the two braking square plates 8 are opposite to each other. The opposite sides are connected together with a brake cylinder 9, on which a brake substrate 10 is slidably provided, and the brake substrate 10 is fixedly provided on the top of the purification box 2; a bent square rod 11 is installed on a brake square plate 8 at the two brake racks 7, and the two bent square rods 11 are respectively located on the front and rear sides of the purification box 2; the bent square rods 11 are connected to a U-shaped square rod 12, the opening of the U-shaped square rod 12 faces the conveyor belt and is also installed with a brake cross block 13, and limited square plates 14 are installed on both sides of the brake cross block 13, and the limited square plates 14 are slidably provided with A limiting cylinder 15 is fixedly arranged on the purification box 2; a limiting spring 16 is sleeved on the limiting cylinder 15, one end of the limiting spring 16 is fixedly connected to the purification box 2, and the other end is fixedly connected to the limiting plate 14; a stop cylinder 59 is penetrated through the brake block 13, and the stop cylinder 59 slides with the brake block 13; a stop limit plate 60 is installed at the end of the stop cylinder 59 away from the purification box 2; a hollow cylinder 61 is slidably arranged at the end of the stop cylinder 59 close to the purification box 2, and the hollow cylinder 61 is away from the stop One end of the stop cylinder 59 is arranged on the purification box 2; an air bag 62 is also arranged in the purification box 2, and an air delivery hole 63 is also arranged on the side of the air bag 62 and the purification box 2, and the air delivery hole 63 is connected with the hollow cylinder 61; the air delivery hole 63 is in the same position as the bent square rod 11; the outer wall of the air bag 62 is connected to the inner wall of the purification box 2, and the inner wall of the air bag 62 contacts the semiconductor substrate when it is expanded; a stop spring 64 is also sleeved on the stop cylinder 59, one end of the stop spring 64 is connected to the stop limit plate 60, and the other end is connected to the brake horizontal block 13; When the semiconductor substrate to be transported is placed in the purification box 2, the driving motor 4 is started so that its output end drives the brake gear 5 to rotate, so that the two meshing brake racks 7 move toward each other, so that it moves on the brake substrate 10 through the brake cylinder 9, and the two U-shaped square rods 12 move toward each other under the action of the bent square rod 11, so that the brake cross blocks 13 thereon all move toward the purification box 2, thereby driving the stop cylinder 59 to move in the hollow cylinder 61, so that the gas inside it enters the air bag 62 through the air transmission hole 63, so that the air bag 62 expands from the initial deflated state, so that the inner wall moves and contacts the semiconductor substrate, thereby wrapping the semiconductor, that is, sealing it, to prevent the semiconductor substrate from being contaminated during the transmission process, so that it can be isolated, and to prevent particles in the air from falling into the conductive area on the substrate, causing the risk of leakage or short circuit during use, so that the integrity of the circuit is maintained, and the use of the semiconductor substrate is guaranteed. The performance is improved, thereby improving the stability of the semiconductor substrate when in use, so that the handling effect of the device is also improved; and the airbag 62 is made of a material with low pollution and high stability, such as polytetrafluoroethylene; it is worth mentioning that when the brake cross block 13 moves, it moves within the limit position of the limit cylinder 15 through the limit square plate 14, so that the limit spring 16 is in a buffering state, avoiding the brake cross block 13 from shaking when moving, thereby improving the use effect of the airbag 62. At the same time, when the semiconductor substrate does not need to be transported, it means that it needs to be taken out of the purification box 2. At this time, it is only necessary to cut off the power to the drive motor 4, so that the limit spring 16 is no longer limited, and the reset of the limit spring 16 drives the brake cross block 13 to reset and move, so that the airbag 62 is no longer in an expanded state, and the limit setting of the semiconductor substrate is released, so that the semiconductor substrate can be smoothly transferred to the next processing step, reducing the energy consumption of the device when in use, and improving the handling effect of the device; The position regulating assembly of this embodiment includes two auxiliary bases 17 symmetrically arranged on one side of the top of the conveying equipment platform 1, an auxiliary square column 18 is fixedly installed on the auxiliary base 17, and an auxiliary limit plate 19 is also installed on the end of the auxiliary square column 18 away from the auxiliary base 17; an auxiliary spring 20 is sleeved on the auxiliary square column 18, one end of the auxiliary spring 20 is fixedly connected to the auxiliary limit plate 19, and the other end is connected to an auxiliary slider 21, and the auxiliary slider 21 is slidably arranged on the auxiliary square column 18; the two auxiliary sliders 21 The opposite sides are both provided with an adjustment base plate 22, on which an adjustment cylinder 23 is slidably provided, one end of the adjustment cylinder 23 is connected with an adjustment limit plate 24, and the other end is provided with an adjustment horizontal plate 25, and an adjustment lock block 26 is fixedly provided on the side of the adjustment horizontal plate 25 facing the top of the auxiliary square column 18; the auxiliary square column 18 is provided with a plurality of adjustment lock grooves 27 on the side facing the adjustment lock block 26, and the adjustment lock block 26 passes through the auxiliary slider 21 and is connected with the adjustment lock groove 27; the adjustment cylinder 23 is sleeved with an adjustment spring 28 , one end of the adjustment spring 28 is connected to the adjustment limit plate 24, and the other end is connected to the adjustment base plate 22; the opposite surfaces of the two auxiliary sliders 21 are commonly connected with a pressure cross block 29, and two pressure square columns 30 are slidably arranged on the pressure cross block 29, and the pressure square columns 30 are installed with a U-shaped base 31 at one end close to the conveyor belt, and a transmission pulley 32 is installed in the U-shaped base 31. The two transmission pulleys 32 are commonly connected with a conveyor belt 33, and the side wall of the conveyor belt 33 is made of rubber and contacts the side of the purification box 2; A plurality of load-bearing rollers 34 are installed on the opposite surface of the conveyor belt 33, and the load-bearing rollers 34 are in contact with the inner wall of the conveyor belt 33 close to the purification box 2; a plurality of the load-bearing rollers 34 are connected to a supporting base plate 35, and the supporting base plate 35 is connected to the U-shaped base 31; a rotating motor 36 is installed on one of the U-shaped bases 31, and the rotating motor 36 is connected to the transmission pulley 32; a pressure spring 37 is sleeved on the pressure column 30, and one end of the pressure spring 37 is connected to the U-shaped base 31, and the other end is connected to the pressure cross block 29; When the semiconductor substrate moves with the movement of the purification box 2 through the conveyor belt, the two sides of the purification box 2 contact the conveyor belt 33. By starting the rotary motor 36, it drives a transmission pulley 32 to rotate, and the other transmission pulley 32 rotates with the cooperation of the conveyor belt 33, so that the conveyor belt 33 keeps moving, and the movement direction of the conveyor belt 33 is the same as that of the conveyor belt. Since the two sides of the purification box 2 are in contact with the conveyor belt 33, it is not only used to assist the movement of the purification box 2, but also to increase the friction of the purification box 2 when it moves, so as to avoid the purification box 2 from slipping in place due to insufficient friction between the purification box 2 and the conveyor belt, so as to assist the purification box 2 to move smoothly, so that the semiconductor substrate moves smoothly. The body substrate is smoothly conveyed to the area where it is required to be used, and is also used to position the movement of the purification box 2 to avoid deviation or dislocation of the purification box 2 during movement, so that the purification box 2 can be conveyed along the path all the time, which improves the stability of the purification box 2 during movement, and enables it to be always located at the center of the conveyor belt for movement, thereby improving the handling effect of the device; at the same time, the adjustment cross plate 25 can be pulled upward to move on the adjustment substrate 22 through the adjustment cylinder 23, so that the adjustment spring 28 is in a buffering state, and then the adjustment lock block 26 on the adjustment cross plate 25 is separated from the auxiliary slider 21 and is no longer connected to the adjustment lock slot 27, thereby releasing the limit setting of the auxiliary slider 21 At this time, by pulling the pressure cross block 29, the auxiliary slider 21 on it moves at the upper limit position of the auxiliary square column 18, so that the auxiliary spring 20 is in a buffer state, thereby driving the conveyor belt 33 to move under the action of the pressure square column 30 and the pressure spring 37, so that it can adjust the contact distance between the conveyor belt 33 and the purification square box 2 according to different situations, that is, adjust the friction between the two according to the situation, to avoid the purification square box 2 The smaller the number of substrates loaded in the purification square box 2 causes the smaller friction between the purification square box 2 and the conveyor belt, causing the purification square box 2 to slip in place. At this time, the friction between the purification square box 2 and the conveyor belt 33 can be increased, that is, the distance between the two can be reduced, so that the above phenomenon can be avoided, so that the purification square box 2 can be moved at once The device can be used to transport semiconductor substrates of different numbers, thereby preventing the device from being limited to the number of substrates to be transported during transportation, thereby improving the transportation effect of the device; and it can also prevent the purification box 2 from being too heavy due to the large number of substrates loaded in the purification box 2. If the purification box 2 shakes or deviates during transportation, it will strongly hit the conveyor belt 33, causing a large impact force, so that it moves on the pressure cross block 29 through the pressure square column 30, thereby unloading the above-mentioned impact force, and at the same time, the pressure spring 37 is in a buffering state, thereby reducing the impact force caused by the purification box 2 hitting the conveyor belt 33 during transportation, thereby improving the stability of the purification box 2 during transportation, and further improving the use effect of the device;At the same time, when the position adjustment of the conveyor belt 33 is completed, the adjustment cross plate 25 is released, and the adjustment spring 28 is reset to drive the adjustment lock block 26 to reset and move, so that it passes through the auxiliary slider 21 and connects with the adjustment lock slot 27, thereby limiting the conveyor belt 33 to the current position, avoiding displacement or dislocation of the conveyor belt 33 due to non-human factors or the above-mentioned impact force during use, improving the safety of the device during use, and making the auxiliary spring 20 in the buffer state unable to reset, the elastic force brought by it acts on the adjustment lock block 26, thereby strengthening the friction between it and the adjustment lock slot 27, avoiding the adjustment lock block 26 from releasing the limit of the auxiliary slider 21 due to the movement of non-human factors, etc., reducing the limitations of the device during use. ;

[0022] The brake rack 7 of this embodiment is also provided with an elastic sliding stop unit; the elastic sliding stop unit comprises a first square plate 38 provided on both sides of the brake rack 7, an elastic slide bar 39 is provided through the first square plate 38, and the elastic slide bar 39 and the first square plate 38 are slidably matched; a second square plate 40 is installed at one end of the elastic slide bar 39 away from the brake rack 7, and the opposite surfaces of the two second square plates 40 are commonly connected with elastic teeth 41, and the elastic teeth 41 are located on the rotation path of the brake gear 5 and the two are meshed; an extrusion spring 42 is sleeved on the elastic slide bar 39, and one end of the extrusion spring 42 is connected to the first square plate 38, and the other end is connected to the second square plate 40; When the brake gear 5 rotates, it will mesh with the brake rack 7 and move. When the brake rack 7 moves to the maximum position, it cannot move, and the brake gear 5 will mesh with the elastic tooth 41. When the two are meshed, the elastic tooth 41 moves to the upper limit position of the first square plate 38 through the elastic slide bar 39 on the second square plate 40, so that the squeezing spring 42 is in a buffer state. When the brake gear 5 is in the rotation gap, it is no longer in contact with the elastic tooth 41, so that it is not subjected to force, resulting in the squeezing spring 42 no longer being limited, so that it is reset and drives the elastic tooth 41 to reset and move, so that it moves to the next tooth groove of the brake gear 5 to wait. The next time the brake gear 5 contacts the elastic tooth 41, and the above movement is repeated, the elastic tooth 41 continuously moves back and forth, causing the brake gear 5 to continuously rotate and continuously apply pressure to the brake rack 7. However, since the brake rack 7 has been displaced to the maximum position, the brake rack 7 can always be in the current position through the above description, avoiding the brake rack 7 from resetting when in use, so that the stop cylinder 59 is always in the current position to avoid movement and cause gas loss in the air bag 62, so that the air bag 62 is always in the current state and the wind-generating and exhausting mechanism can continuously circulate in the purification box 2. The gas and the surrounding gas during transmission are purified, so that the wind-generating and exhausting mechanism and the air-control and pollution-stopping unit share a driving source, which reduces the limitations of the device when in use, reduces energy consumption, improves the environmental protection effect of the device when in use, avoids the use of multiple driving sources when the device is in use, resulting in increased energy consumption and increased use cost of the device, and improves the handling effect of the device; it is worth mentioning that when the brake cross block 13 on the air-control and pollution-stopping unit drives the stop cylinder 59 to move in the hollow cylinder 61, when the stop cylinder 59 moves to the maximum position, that is, after the airbag 62 is fully expanded, the stop cylinder 59 It is unable to move. At this time, the brake rack 7 can continue to move, so that it drives the brake cross block 13 to continue to move, so that it moves to the upper limit of the stop cylinder 59, so that the stop spring 64 is in a buffering state, thereby increasing the connection strength between the stop cylinder 59 and the hollow cylinder 61. The buffering force brought by the stop spring 64 ensures that even if the airbag 62 is slightly displaced due to the stop cylinder 59 during use, the gas in the airbag 62 will not be reduced. At the same time, the contact strength between the brake gear 5 and the elastic tooth 41 is increased, thereby improving the carrying effect of the device, and the effect of the air-control and pollution-stopping unit during use is also improved.

[0023] The wind-generating and exhausting mechanism of this embodiment includes two symmetrically arranged rotating bevel gears 43 meshing with the driving bevel gear 6, and rotating shafts 44 are installed on the opposite back surfaces of the two rotating bevel gears 43. A first substrate 45 is installed at the end of the rotating shaft 44 away from the driving bevel gear 6, and the first substrate 45 is arranged on the top of the purification box 2; a first bevel gear 46 is also installed on the rotating shaft 44, and the first bevel gear 46 is meshingly connected with a second bevel gear 47, and a driving shaft 48 is installed on the second bevel gear 47, and a second substrate 49 is connected to the driving shaft 48, and the second substrate 49 is arranged on the first substrate 45; a first pulley 50 is installed at the end of the driving shaft 48 away from the second bevel gear 47, and a belt 51 is connected to the first pulley 50, and a second pulley 52 is connected to the belt 51, and the belt 51 slides with the second pulley 52 and the first pulley 50; the first A wind-generating shaft 53 is installed on one side of the second pulley 52 and the first pulley 50 close to the purification box 2; a ventilation circular groove 54 corresponding to the number and position of the second pulley 52 and the first pulley 50 is provided on the top of the purification box 2, one side of the ventilation circular groove 54 extends to the inner top surface of the purification box 2, and the other side extends to the top of the purification box 2, and a filter plate 55 is installed on the top of the purification box 2 by bolts, and the filter plate 55 covers the ventilation circular groove 54; one end of the wind-generating shaft 53 away from the second pulley 52 passes through the filter plate 55 and is connected to a plurality of fan blades 56, and the fan blades 56 are located in the ventilation circular groove 54; the two wind-generating shafts 53 are commonly connected to a T-shaped base plate 57, and the T-shaped base plate 57 is arranged on the top of the purification box 2; a scraping inclined block 58 is also installed on the wind-generating shaft 53, and the inclined surface of the scraping inclined block 58 contacts the top of the filter plate 55; When in use, the driving motor 4 will also drive the driving bevel gear 6 to rotate, so that it meshes with the two rotating bevel gears 43 to rotate, so that it drives the first pulley 50 to rotate through the transmission of the rotating shaft 44, the second bevel gear 47 and the driving shaft 48, so that it drives the second pulley 52 to rotate under the cooperation of the belt 51, so that the second pulley 52 and the wind-making shaft 53 on the first pulley 50 rotate, thereby driving a plurality of fan blades 56 to rotate in the ventilation circular groove 54, and the generated wind force acts on the purification box 2, thereby introducing the external gas into the purification box 2, so as to neutralize the polluted gas in the purification box 2, and avoid the risk of the semiconductor substrate being contaminated due to the large amount of polluted gas and heavy concentration carried in the purification box 2. At the same time, the filter plate 55 provided can prevent the particulate matter mixed in the external gas from entering the purification box 2 and falling into the conductive area of ​​the substrate, so as to avoid the risk of short circuit or leakage of the substrate when in use, further avoid the integrity of the circuit from being damaged, and ensure the usability of the substrate. It is worth mentioning that when the driving bevel gear 6 rotates in the meshing and symmetrical arrangement of the two rotating bevel gears 43, the two rotating bevel gears 43 rotate in opposite directions, so that a plurality of fan blades 56 at one place introduce external gas into the purification box 2, and a plurality of fan blades 56 at another place discharge the gas in the purification box 2, thereby avoiding the harmful gas carried by the semiconductor substrate when loaded in the purification box 2 and being in it for a long time, causing damage to the substrate, strengthening the circulation effect of the gas around the substrate in the purification box 2, so that the stability of the substrate during use is improved, and the handling effect of the device is improved; at the same time, the wind-generating shaft 53 will drive the scraping bevel 58 to rotate when rotating, so that it rotates continuously on the top of the filter plate 55, so that the impurities or harmful substances adhered and adsorbed on the top of the filter plate 55 can be scraped off, and it is avoided that they are accumulated on the top of the filter plate 55 for a long time, causing the fluidity of the gas to be affected, thereby reducing the limitations of the device during use and improving the use effect of the wind-generating and exhausting mechanism.

[0024] The present invention also provides a method for transporting a semiconductor substrate for processing, comprising the following steps: S001. Place a number of semiconductor substrates to be transported in the purification box 2, and transport the semiconductor substrates to the use area through the movement of the conveyor belt; S002. Several semiconductor substrates are placed on the buffer pad 3 in the purification box 2 to reduce the impact force caused by the shaking of the semiconductor substrates during transportation; S003. Operate the gas control and pollution prevention unit to provide a clean environment for the semiconductor substrate during transportation to prevent contamination.

[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A transport device for semiconductor substrate processing, comprising a transport device platform (1) and a purification box (2); the transport device platform (1) is also provided with a conveyor belt, and the purification box (2) is placed on the conveyor belt; the characteristics are: A buffer pad (3) is provided on the inner bottom surface of the purification box (2), and the semiconductor substrate is located in the purification box (2) and placed on the top of the buffer pad (3); the conveying device platform (1) is also provided with a position-controlled pressure-regulating assembly, and the number of the position-controlled pressure-regulating assemblies is two groups, and they are symmetrically arranged on both sides of the top of the conveying device platform (1), so that the conveyor belt is located between the two groups of position-controlled pressure-regulating assemblies; the position-controlled pressure-regulating assembly is used to increase the friction between the purification box (2) and the conveyor belt during transportation; the purification box (2) is also provided with an air-control and pollution-preventing unit, and the air-control and pollution-preventing unit is used to prevent the semiconductor substrate from being contaminated during transportation; The air control and pollution prevention unit comprises a driving motor (4), wherein the driving motor (4) is arranged on the top of the purification box (2); the bottom of the purification box (2) is placed on a conveyor belt; a braking gear (5) is installed on the output end of the driving motor (4), and a driving bevel gear (6) is also installed on the side of the braking gear (5) away from the purification box (2), and a wind-generating and air-discharging mechanism is arranged on the driving bevel gear (6); a braking rack (7) is arranged on the opposite side of the braking gear (5), and the braking rack (7) is meshingly connected with the braking gear (5); two braking square plates (8) are installed on the braking rack (7), and the opposite surfaces of the two braking square plates (8) are commonly connected to a braking cylinder (9), and a braking substrate (10) is slidably arranged on the braking cylinder (9), and the braking substrate (10) is fixedly arranged on the top of the purification box (2).

2. A semiconductor substrate processing transport device according to claim 1, characterized in that: A bent square rod (11) is mounted on each braking square plate (8), and the two bent square rods (11) are respectively located on the front and rear sides of the purification box (2); the bent square rod (11) is connected to a U-shaped square rod (12), the opening of the U-shaped square rod (12) faces the conveyor belt and is also mounted with a braking cross block (13), and limiting square plates (14) are mounted on both sides of the braking cross block (13), and limiting cylinders (15) are slidably mounted on the limiting square plates (14), and the limiting cylinders (15) are fixedly mounted on the purification box (2); a limiting spring (16) is sleeved on the limiting cylinder (15), and one end of the limiting spring (16) is fixedly connected to the purification box (2), and the other end is fixedly connected to the limiting square plate (14).

3. A semiconductor substrate processing transport device according to claim 1, characterized in that: The position regulating assembly comprises two auxiliary bases (17) symmetrically arranged on one side of the top of the conveying equipment platform (1), an auxiliary square column (18) being fixedly mounted on the auxiliary base (17), and an auxiliary limiting plate (19) being mounted on one end of the auxiliary square column (18) away from the auxiliary base (17); an auxiliary spring (20) is sleeved on the auxiliary square column (18), one end of the auxiliary spring (20) is fixedly connected to the auxiliary limiting plate (19), and the other end is connected to an auxiliary slider (21), and the auxiliary slider (21) is slidably arranged on the auxiliary square column (18); the two auxiliary An adjustment base plate (22) is installed on the opposite back side of the slider (21), an adjustment cylinder (23) is slidably arranged on the adjustment base plate (22), one end of the adjustment cylinder (23) is connected to an adjustment limit plate (24), and the other end is installed with an adjustment transverse plate (25), and an adjustment lock block (26) is fixedly installed on the side of the adjustment transverse plate (25) facing the top of the auxiliary square column (18); a plurality of adjustment lock grooves (27) are arranged on the side of the auxiliary square column (18) facing the adjustment lock block (26), and the adjustment lock block (26) passes through the auxiliary slider (21) and is connected with the adjustment lock groove (27).

4. A semiconductor substrate processing transport device according to claim 3, characterized in that: The adjusting cylinder (23) is sleeved with an adjusting spring (28), one end of the adjusting spring (28) is connected to the adjusting limit plate (24), and the other end is connected to the adjusting base plate (22); the opposing surfaces of the two auxiliary sliding blocks (21) are commonly connected to a pressure cross block (29), two pressure square columns (30) are slidably arranged on the pressure cross block (29), and the ends of the pressure square columns (30) close to the conveyor belt are both installed with a U-shaped base (31), a transmission pulley (32) is installed in the U-shaped base (31), and the two transmission pulleys (32) are commonly connected to a conveyor belt (33), and the side wall of the conveyor belt (33) is made of rubber and is connected to the purification box (2). The conveyor belt (33) is provided with a plurality of load-bearing rollers (34) mounted on the opposite surface of the conveyor belt (33), and the load-bearing rollers (34) and the conveyor belt (33) are in contact with the inner wall of the purification box (2); the plurality of load-bearing rollers (34) are connected to a supporting base plate (35), and the supporting base plate (35) is connected to the U-shaped base (31); a rotating motor (36) is mounted on one of the U-shaped bases (31), and the rotating motor (36) is connected to the transmission pulley (32); a pressure spring (37) is sleeved on the pressure column (30), and one end of the pressure spring (37) is connected to the U-shaped base (31), and the other end is connected to the pressure cross block (29).

5. The semiconductor substrate processing transport device according to claim 2, characterized in that: The brake rack (7) is also provided with an elastic sliding stop unit; the elastic sliding stop unit comprises a first square plate (38) provided on both sides of the brake rack (7); an elastic sliding rod (39) is provided through the first square plate (38); the elastic sliding rod (39) and the first square plate (38) are slidably matched; a second square plate (40) is installed at one end of the elastic sliding rod (39) away from the brake rack (7); the opposite surfaces of the two second square plates (40) are connected with elastic teeth (41); the elastic teeth (41) are located on the rotation path of the brake gear (5) and the two are meshed; an extrusion spring (42) is sleeved on the elastic sliding rod (39); one end of the extrusion spring (42) is connected to the first square plate (38), and the other end is connected to the second square plate (40).

6. The semiconductor substrate processing transport device according to claim 1, characterized in that: The wind-generating and air-discharging mechanism comprises two symmetrically arranged rotating bevel gears (43) meshingly connected with the driving bevel gear (6); rotating shafts (44) are mounted on opposite sides of the two rotating bevel gears (43); a first substrate (45) is mounted on one end of the rotating shaft (44) away from the driving bevel gear (6); the first substrate (45) is disposed on the top of the purification box (2); a first bevel gear (46) is also mounted on the rotating shaft (44); the first bevel gear (46) is meshingly connected with a second bevel gear (47); a driving rotating shaft (48) is mounted on the second bevel gear (47). A second base plate (49) is connected to the driving shaft (48), and the second base plate (49) is arranged on the first base plate (45); a first pulley (50) is installed at one end of the driving shaft (48) away from the second bevel gear (47), a belt (51) is connected to the first pulley (50), and the belt (51) is connected to the second pulley (52), and the belt (51) is slidably matched with the second pulley (52) and the first pulley (50); a wind-generating shaft (53) is installed on the side of the second pulley (52) and the first pulley (50) close to the purification box (2).

7. A semiconductor substrate processing transport device according to claim 6, characterized in that: The top of the purification box (2) is provided with ventilation circular grooves (54) corresponding in number and position to the second pulley (52) and the first pulley (50); one side of the ventilation circular groove (54) extends to the inner top surface of the purification box (2), and the other side extends to the top of the purification box (2); a filter plate (55) is installed on the top of the purification box (2) by bolts, and the filter plate (55) covers the ventilation circular groove (54); one end of the wind-generating rotating shaft (53) away from the second pulley (52) passes through the filter plate (55) and is connected to a plurality of fan blades (56), and the fan blades (56) are located in the ventilation circular groove (54); the two wind-generating rotating shafts (53) are commonly connected to a T-shaped base plate (57), and the T-shaped base plate (57) is arranged on the top of the purification box (2); a scraping inclined block (58) is also installed on the wind-generating rotating shaft (53), and the inclined surface of the scraping inclined block (58) contacts the top of the filter plate (55).

8. The semiconductor substrate processing transport device according to claim 2, characterized in that: A stop cylinder (59) is provided through the brake block (13), and the stop cylinder (59) is slidably matched with the brake block (13); a stop limit plate (60) is installed at the end of the stop cylinder (59) away from the purification box (2); a hollow cylinder (61) is slidably provided at the end of the stop cylinder (59) close to the purification box (2), and the end of the hollow cylinder (61) away from the stop cylinder (59) is provided on the purification box (2); an air bag (62) is also provided in the purification box (2), and the air bag (62) An air delivery hole (63) is also provided on the side of the purification box (2), and the air delivery hole (63) is communicated with the hollow cylinder (61); the air delivery hole (63) and the bent square rod (11) are located at the same position; the outer wall of the airbag (62) is connected to the inner wall of the purification box (2), and the inner wall of the airbag (62) contacts the semiconductor substrate when it is expanded; a stop spring (64) is also sleeved on the stop cylinder (59), one end of the stop spring (64) is connected to the stop limit plate (60), and the other end is connected to the brake horizontal block (13).

9. A method for conveying a semiconductor substrate for processing, using the conveying device for semiconductor substrate processing according to claim 1, characterized in that: Includes steps: S001. Placing a plurality of semiconductor substrates to be transported in the purification box (2), so that the semiconductor substrates can be transported to the use area by the movement of the conveyor belt; S002. A plurality of semiconductor substrates are placed on a buffer pad (3) in a purification box (2) to reduce the impact force generated by shaking of the semiconductor substrates during transportation; S003. Operate the gas control and pollution prevention unit to provide a clean environment for the semiconductor substrate during transportation to prevent contamination.

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