Low-temperature co-fired ceramic three-dimensional packaging structure

Abstract

The invention discloses a low-temperature co-fired ceramic three-dimensional packaging structure, which belongs to the technical field of semiconductors, and comprises a metal bottom plate, a ceramic bottom plate arranged at the center of the top of the metal bottom plate, a grouting opening formed in the peripheral section of the ceramic bottom plate, a ceramic middle clamping plate arranged at the top of the ceramic bottom plate, and a middle bracket arranged at the center of the top of the ceramic middle clamping plate. An embedded plate frame is arranged at one end of the middle bracket; according to the invention, the ceramic bottom plate is matched with the ceramic middle clamping plate and the ceramic top plate for linkage and mutual matching use, the slurry explosion grooves and the slurry overflow thin grooves are used for guiding ceramic slurry to be injected among the multiple groups of splicing plate bodies in a pressurized manner during a static pressure period, and areas which are easy to damage and have cavities among the multiple groups of splicing plate bodies are filled and reinforced; a static pressure process is matched with ceramic slurry to tightly adhere and fix a plurality of groups of plate bodies, so that holes among the plate bodies are effectively avoided, the connection strength among the plate bodies is improved, and the phenomena of cracks and internal damage caused by the influence of a use environment, temperature and other pressures are avoided.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, in particular to a low-temperature co-fired ceramic three-dimensional packaging structure. Background Art

[0002] Low-temperature co-fired ceramics are made by making low-temperature sintered ceramic powder into a green ceramic tape with precise thickness and density. The required circuit pattern is made on the green ceramic tape by laser drilling, micropore grouting, precision conductor paste printing and other processes, and multiple passive devices are embedded in it for stacking, and finally sintered. ICs and active devices can be mounted on its surface, thus forming a LTCC passive / active integrated functional module; With the development of technology, the requirements for the performance and functions of electronic components and assemblies are getting higher and higher, while the size of products is required to be smaller and smaller. LTCC technology can meet these two requirements, so it has been widely used in the field of microelectronics; LTCC technology is the mainstream technology of passive integration; In combination with the above content, it should be explained that: in the production process of traditional low-temperature co-fired ceramics, multiple sets of substrates need to be connected by static pressing process, which is affected by the tolerance between the substrates, resulting in voids in the assembled low-temperature co-fired ceramics after packaging, which leads to cracks around the voids during subsequent use under the influence of the substrate use environment, temperature and other pressures, resulting in a reduction in the service life of the substrate; In view of the above technical defects, a solution is now proposed. Summary of the invention

[0003] The purpose of the present invention is to provide a low-temperature co-fired ceramic three-dimensional packaging structure, which is used in conjunction with a ceramic bottom plate, a ceramic middle plate and a ceramic top plate, and uses a slurry explosion groove and an overflow groove to guide the ceramic slurry to be pressurized and injected between multiple groups of spliced ​​plates during static pressure, so as to fill and reinforce the fragile and void-prone areas between the multiple groups of spliced ​​plates, and use a static pressure process in conjunction with ceramic slurry to tightly bond and fix the multiple groups of plates, effectively avoiding holes between the plates, and increasing the connection strength between the plates, avoiding cracks and internal damage caused by the use environment, temperature and other pressures, so as to solve the problems raised.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a low-temperature co-fired ceramic three-dimensional packaging structure, comprising a metal bottom plate, a ceramic bottom plate is arranged at the top center of the metal bottom plate, a grouting port is arranged on the outer peripheral cross section of the ceramic bottom plate, a ceramic middle sandwich plate is arranged at the top of the ceramic middle sandwich plate, a middle bracket is arranged at the top center of the ceramic middle sandwich plate, an embedded plate frame is arranged at one end of the middle bracket, a ceramic top plate is arranged at the top of the middle bracket, and a pressure-changing guide column penetrating the ceramic bottom plate, the ceramic middle sandwich plate and the ceramic top plate is arranged at the top of the metal bottom plate; A chipset is arranged at the center of the top of the ceramic top plate, long side locking frames are symmetrically arranged on the outer walls of both sides of the ceramic top plate, short side locking frames are arranged on the top of both ends of the ceramic top plate, and a sealing cover plate is arranged above the ceramic top plate.

[0005] Furthermore, the grouting port extends to the surface of the ceramic base plate, and slurry bursting grooves connected to the grouting port are arranged on both sides of the ceramic base plate surface, and the surface of the ceramic base plate is provided with multiple groups of slurry overflow grooves connecting the slurry bursting grooves and the grouting port.

[0006] Furthermore, a wiring substrate in contact with the ceramic base plate is arranged at the bottom of the ceramic middle plate, a plurality of printed circuits are arranged on the surface of the embedded board frame, mounting parts are arranged on the sides of the printed circuits, a middle card board connected to the embedded board frame is arranged on one side of the middle bracket, and a side long board is arranged at the end of the middle bracket away from the embedded board frame.

[0007] Furthermore, a central column is arranged at the inner center of the transformer guide column, a top pressure sleeve is slidably sleeved on the top of the central column, a column ring is arranged on the top of the top pressure sleeve, a locking ball is arranged on the bottom edge of the column ring, and a connecting rod is arranged on the inner side of the bottom of the top pressure sleeve and slides on the outer periphery of the central column.

[0008] Furthermore, multiple groups of rotating outer blocks are hinged on the inner wall of the middle part of the compression-changing guide column, and a rotating inner block hinged to the inner wall of the compression-changing guide column is arranged above the rotating outer block, and a ball groove is recessed on the top of the rotating inner block, and a traction wire connected to the connecting rod is arranged at the bottom of the rotating inner block.

[0009] Furthermore, side grooves are symmetrically arranged on both sides of the top of the ceramic top plate, a center limiting plate is arranged in the middle of the ceramic top plate, long side strips are arranged on the bottom of both sides of the sealing cover plate, and short side strips are arranged on the bottom of both ends of the sealing cover plate.

[0010] The beneficial effects of the present invention are: 1. The present invention uses a ceramic bottom plate in conjunction with a ceramic middle plate and a ceramic top plate, and uses a slurry explosion groove and an overflow slurry groove to guide the ceramic slurry to be injected into multiple groups of spliced ​​plates during static pressure, so as to fill and reinforce the vulnerable and easily void areas between the multiple groups of spliced ​​plates, and use a static pressure process in conjunction with ceramic slurry to tightly adhere and fix the multiple groups of plates, effectively avoiding holes between the plates, and increasing the connection strength between the plates, so as to avoid cracks and internal damage caused by the use environment, temperature and other pressures; 2. The present invention uses compression-changing guide pillars to assist the use of ceramic top plates, ceramic middle plates and ceramic bottom plates, staggered connections between components on the plate body, and pressure coordination of the static pressing process, which causes the compression-changing guide pillars to deform during the bonding of multiple sets of plate bodies, lock the bonded multiple sets of plate bodies with each other, and cooperate with the static pressing process to increase the connection precision and plate strength between the multiple sets of plate bodies. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings; Figure 1 It is a three-dimensional diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of a local three-dimensional explosion structure of the present invention; Figure 3 It is a schematic diagram of the structure of the ceramic sandwich panel of the present invention; Figure 4 It is a structural schematic diagram of the ceramic base plate of the present invention; Figure 5 It is a schematic structural diagram of the pressure-variable guide column of the present invention; Figure 6 It is a structural schematic diagram of the ceramic top plate of the present invention; Figure 7 It is a structural schematic diagram of the sealing cover plate of the present invention.

[0012] 1. Metal base plate; 2. Long side locking frame; 3. Ceramic top plate; 301. Center limit plate; 302. Side groove; 4. Chip set; 5. Sealing cover plate; 501. Long side strip; 502. Short side strip; 6. Pressure change guide column; 601. Center column; 602. Top pressure sleeve; 603. Column ring; 604. Lock ball; 605. Rotating inner block; 606. Pull wire; 607. Rotating outer block; 608. Connecting rod; 7. Ceramic middle splint; 701. Long side plate; 702. Middle card board; 703. Embedded board frame; 704. Printed circuit; 705. Mounting part; 706. Middle bracket; 707. Wiring substrate; 8. Short side locking frame; 9. Ceramic base plate; 901. Burst groove; 902. Grouting port; 903. Overflow groove. DETAILED DESCRIPTION

[0013] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0014] Embodiment 1: This embodiment is used to solve the problem that multiple groups of substrates need to be connected through a static pressure process, which is affected by the tolerance between the substrates, resulting in the existence of voids in the assembled low-temperature co-fired ceramics after packaging. During subsequent use, under the influence of the substrate use environment, temperature and other pressures, cracks are generated around the voids, resulting in a reduction in the service life of the substrate.

[0015] See also Figure 1 - Figure 5As shown, this embodiment is a low-temperature co-fired ceramic three-dimensional packaging structure, including a metal base plate 1, a ceramic base plate 9 is arranged at the top center of the metal base plate 1, a grouting port 902 is arranged on the outer peripheral cross section of the ceramic base plate 9, a ceramic middle sandwich plate 7 is arranged on the top of the ceramic base plate 9, a middle bracket 706 is arranged at the top center of the ceramic middle sandwich plate 7, an embedded plate frame 703 is arranged at one end of the middle bracket 706, a ceramic top plate 3 is arranged on the top of the middle bracket 706, and a pressure-changing guide column 6 that passes through the ceramic base plate 9, the ceramic middle sandwich plate 7 and the ceramic top plate 3 is arranged on the top of the metal base plate 1. Now, after calibrating the holes on the surface of the ceramic base plate 9 with the pressure edge guide column, they are arranged on the metal base plate 1, and the wiring substrate 707 and the ceramic middle sandwich plate 7 are stacked on the ceramic base plate 9 in sequence, and the side long plate 701, the middle card plate 702 and the embedded plate frame 703 are attached to the top of the ceramic middle sandwich plate 7 in sequence around the middle bracket 706; The grouting port 902 extends to the surface of the ceramic bottom plate 9, and both sides of the surface of the ceramic bottom plate 9 are provided with slurry bursting grooves 901 connected to the grouting port 902, and the surface of the ceramic bottom plate 9 is provided with multiple groups of overflow grooves 903 connecting the slurry bursting grooves 901 and the grouting port 902. After the center limit plate 301 is calibrated with the middle support plate, the ceramic top plate 3 is overlapped on the top of the ceramic middle clamping plate 7, and the long side locking frame 2 and the short side locking frame 8 are clamped on both sides and both ends of the ceramic top plate 3 from top to bottom in turn. The bottom of the inner wall of the long side locking frame 2 is provided with a convex strip 1 clamped with the side groove 302, and the bottom of the short side locking frame 8 is provided with a convex strip 2 clamped with the outer wall of the two ends of the ceramic top plate 3. A wiring substrate 707 in contact with the ceramic base plate 9 is arranged at the bottom of the ceramic middle clamping plate 7, a plurality of printed circuits 704 are arranged on the surface of the embedded board frame 703, and mounting parts 705 are arranged on the side of the printed circuits 704. A middle card plate 702 connected to the embedded board frame 703 is arranged on one side of the middle bracket 706, and a side long plate 701 is arranged at the end of the middle bracket 706 away from the embedded board frame 703. The sealing cover plate 5 is clamped on the long side locking frame 2 and the short side locking frame 8, and the long side strips 501 and the short side strips 502 are calibrated to be inserted into the top of the long side locking frame 2 and the short side locking frame 8 respectively, so as to form a low-temperature co-fired ceramic three-dimensional component.

[0016] Example 2: Please refer to Figure 1 , Figure 5 - Figure 7 As shown, this embodiment is a low-temperature co-fired ceramic three-dimensional packaging structure, including a chipset 4 arranged at the top center of a ceramic top plate 3, long-side locking frames 2 symmetrically arranged on the outer walls of both sides of the ceramic top plate 3, short-side locking frames 8 arranged on the tops of both ends of the ceramic top plate 3, and a sealing cover plate 5 arranged above the ceramic top plate 3. The preliminarily assembled low-temperature co-fired ceramic three-dimensional component is transferred to the inside of the static pressure process device, and the metal bottom plate 1 is fixed by the device, and the ceramic slurry guide is connected to the grouting port 902. The sealing cover plate 5 is continuously pressed down and pressurized from top to bottom by the static pressure process device, so that the sealing cover plate 5, the ceramic top plate 3, and the ceramic middle clamping plate 7 are pushed down; A central column 601 is arranged at the center of the transformer guide column 6, a top pressure sleeve 602 is slidably sleeved on the top of the central column 601, a column ring 603 is arranged on the top of the top pressure sleeve 602, a locking ball 604 is arranged on the bottom edge of the column ring 603, and a connecting rod 608 attached to the outer periphery of the central column 601 and slidingly arranged on the inner side of the bottom of the top pressure sleeve 602; The top pressure sleeve 602 at the top of the edge pressure guide column slides down under the force, and the top pressure sleeve 602 drives the locking ball 604 and the connecting rod 608 to slide down synchronously, and the connecting rod 608 drives the multiple sets of column rings 603 to move and slide down synchronously, and the connecting rod 608 slides down and drags the traction wire 606, and the traction wire 606 drags the rotating inner block 605 to rotate, and the rotating inner block 605 rotates and pushes the top of the rotating outer block 607, causing the rotating outer block 607 to deflect and convex outward, and the adjacent areas of the ceramic top plate 3, the ceramic middle clamping plate 7 and the ceramic bottom plate 9 are pressed and locked, and the connecting rod 608 continues to slide down, causing the locking ball 604 to be stuck in the ball groove of the rotating inner block 605, causing the rotating inner block 605 and the rotating outer block 607 to be stuck, and combined with the continuous downward pressure of the sealing cover plate 5, the long side strip 501 and the short side strip 502 are respectively stuck in the long side locking frame 2 and the short side locking frame 8; A plurality of rotating outer blocks 607 are hinged on the inner wall of the middle part of the pressure-changing guide column 6, and a rotating inner block 605 hinged to the inner wall of the pressure-changing guide column 6 is arranged above the rotating outer block 607, and a ball groove is arranged in a depression on the top of the rotating inner block 605, and a traction wire 606 connected to the connecting rod 608 is arranged at the bottom of the rotating inner block 605; Side grooves 302 are symmetrically arranged on both sides of the top of the ceramic top plate 3, a central limiting plate 301 is arranged in the middle of the ceramic top plate 3, long side strips 501 are arranged at the bottom of both sides of the sealing cover plate 5, and short side strips 502 are arranged at the bottom of both ends of the sealing cover plate 5; With the continuous pressurization treatment of the static pressure process device, the guide guides the ceramic slurry along the grouting port 902 into the ceramic base plate 9. The grouting port 902 is provided with micropores connected to the slurry explosion groove 901, and the grouting port 902 and the top of the slurry explosion groove 901 are guided by the overflow groove to guide the ceramic slurry to be evenly distributed to the bottom of the wiring substrate 707. The wiring substrate 707 and the ceramic middle plate 7 are provided with a plurality of groups of through grooves. The ceramic slurry penetrates and is arranged along the grooves to the upper and lower surfaces of the ceramic middle plate 7, so as to promote grouting and filling between the ceramic middle plate 7 and the ceramic base plate 9 and the ceramic top plate 3. Under the continuous treatment of the static pressure process, the internal plates of the low-temperature co-fired ceramic three-dimensional packaging component are precisely bonded to each other as a whole.

[0017] In combination with Example 1 and Example 2, the ceramic bottom plate 9 can be used in conjunction with the ceramic middle plate 7 and the ceramic top plate 3, and the slurry explosion groove 901 and the overflow groove can be used to guide the ceramic slurry to be pressurized and injected between multiple groups of spliced ​​plates during static pressure, so that the fragile and void-prone areas between the multiple groups of spliced ​​plates can be filled and reinforced, and the static pressure process can be used in conjunction with the ceramic slurry to tightly bond and fix the multiple groups of plates, effectively avoiding holes between the plates, and increasing the connection strength between the plates, avoiding cracks and internal damage caused by the use environment, temperature and other pressures.

[0018] The above contents are merely examples and explanations of the structure of the present invention. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the structure of the invention or exceed the scope defined by the claims, they should all fall within the protection scope of the present invention.

[0019] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0020] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A low temperature co-fired ceramic three-dimensional packaging structure, comprising a metal base plate (1), characterized in that: A ceramic bottom plate (9) is arranged at the top center of the metal bottom plate (1), a grouting port (902) is arranged on the outer peripheral cross section of the ceramic bottom plate (9), a ceramic middle sandwich plate (7) is arranged at the top of the ceramic bottom plate (9), a middle bracket (706) is arranged at the top center of the ceramic middle sandwich plate (7), an embedded plate frame (703) is arranged at one end of the middle bracket (706), a ceramic top plate (3) is arranged at the top of the middle bracket (706), and a pressure-changing guide column (6) that passes through the ceramic bottom plate (9), the ceramic middle sandwich plate (7) and the ceramic top plate (3) is arranged at the top of the metal bottom plate (1); A chipset (4) is arranged at the top centre of the ceramic top plate (3), long side locking frames (2) are symmetrically arranged on the outer walls of both sides of the ceramic top plate (3), short side locking frames (8) are arranged at the tops of both ends of the ceramic top plate (3), and a sealing cover plate (5) is arranged above the ceramic top plate (3).

2. The low-temperature co-fired ceramic three-dimensional packaging structure according to claim 1, characterized in that: The grouting port (902) extends to the surface of the ceramic bottom plate (9), and grouting grooves (901) connected to the grouting port (902) are provided on both sides of the surface of the ceramic bottom plate (9), and a plurality of groups of grouting fine grooves (903) connecting the grouting grooves (901) and the grouting port (902) are provided on the surface of the ceramic bottom plate (9).

3. The low-temperature co-fired ceramic three-dimensional packaging structure according to claim 1, characterized in that: A wiring substrate (707) in contact with the ceramic bottom plate (9) is arranged at the bottom of the ceramic middle sandwich plate (7); a plurality of printed circuits (704) are arranged on the surface of the embedded board frame (703); a mounting component (705) is arranged on the side of the printed circuit (704); a middle card (702) connected to the embedded board frame (703) is arranged on one side of the middle bracket (706); and a side long plate (701) is arranged at one end of the middle bracket (706) away from the embedded board frame (703).

4. The low-temperature co-fired ceramic three-dimensional packaging structure according to claim 1, characterized in that: A central column (601) is arranged at the center of the transformer guide column (6), a top pressure sleeve (602) is slidably sleeved on the top of the central column (601), a column ring (603) is arranged on the top of the top pressure sleeve (602), a locking ball (604) is arranged on the bottom edge of the column ring (603), and a connecting rod (608) is arranged on the inner side of the bottom of the top pressure sleeve (602) and is attached to the outer periphery of the central column (601) and slides.

5. The low-temperature co-fired ceramic three-dimensional packaging structure according to claim 4, characterized in that: A plurality of sets of rotating outer blocks (607) are hingedly connected to the inner wall of the middle portion of the pressure-changing guide column (6); a rotating inner block (605) hingedly connected to the inner wall of the pressure-changing guide column (6) is arranged above the rotating outer block (607); a ball groove is recessed at the top of the rotating inner block (605); and a traction wire (606) connected to a connecting rod (608) is arranged at the bottom of the rotating inner block (605).

6. The low-temperature co-fired ceramic three-dimensional packaging structure according to claim 1, characterized in that: Side grooves (302) are symmetrically arranged on both sides of the top of the ceramic top plate (3), a central limiting plate (301) is arranged in the middle of the ceramic top plate (3), long side strips (501) are arranged at the bottom of both sides of the sealing cover plate (5), and short side strips (502) are arranged at the bottom of both ends of the sealing cover plate (5).

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