Pop packaging structure, preparation method thereof and electronic device

Abstract

The application provides a POP packaging structure, a preparation method thereof and an electronic device. The POP packaging structure comprises a first packaging unit, a second packaging unit, at least one conductive lead, and a plastic encapsulation body. The first side of the second packaging unit is away from the first side of the first packaging unit. The second packaging unit is provided with at least one threading channel penetrating in the thickness direction. The middle section of the conductive lead is arranged in the threading channel. The first end of the conductive lead is connected with the first side of the first packaging unit. The second end of the conductive lead is connected with the first side of the second packaging unit. The plastic encapsulation body is arranged on the first side of the first packaging unit and the second packaging unit. The plastic encapsulation body connects the first packaging unit and the second packaging unit, and covers the conductive lead.

Description

Technical Field

[0001] The present application relates to the field of chip packaging technology, and more specifically, to a POP packaging structure, a preparation method thereof, and an electronic device. Background Art

[0002] Existing POP packaging solutions often use BGA solder ball interconnects or copper pillar arrays, but these solutions suffer from low packaging density and high costs. For example, solder ball interconnects are limited in packaging density due to the size of the solder balls, while copper pillar interconnects, while increasing integration, also come with high production costs. Summary of the Invention

[0003] The present application provides a new technical solution for a POP packaging structure, which can at least solve at least one of the problems of low packaging density and high cost of the existing POP packaging structure.

[0004] This application also provides a new technical solution for a method for preparing a POP packaging structure.

[0005] This application also provides a new technical solution for electronic equipment.

[0006] According to the first aspect of the present application, a POP packaging structure is provided, including: a first packaging unit; a second packaging unit, wherein the first side of the second packaging unit faces away from the first side of the first packaging unit, and the second packaging unit is provided with at least one threading channel running through the thickness direction thereof; at least one conductive lead, the middle section of the conductive lead is provided in the threading channel, the first end of the conductive lead is connected to the first side of the first packaging unit, and the second end of the conductive lead is connected to the first side of the second packaging unit; a plastic packaging body, the plastic packaging body is provided on the first sides of the first packaging unit and the second packaging unit, the plastic packaging body connects the first packaging unit and the second packaging unit, and covers the conductive lead.

[0007] Optionally, the POP packaging structure further includes: a support body, the support body is provided between the first side of the first packaging unit and the second side of the second packaging unit, and the plastic packaging body covers at least a portion of the support body.

[0008] Optionally, the POP packaging structure includes a plurality of the supporting bodies.

[0009] Optionally, at least a portion of the support body is formed as a conductive pillar, and the conductive pillar electrically connects the first packaging unit and the second packaging unit.

[0010] Optionally, the support body is an insulator.

[0011] Optionally, the support body is arranged at the edge of the first side of the first packaging unit.

[0012] Optionally, the threading passage is a clearance hole or a clearance notch.

[0013] Optionally, the POP packaging structure comprises a plurality of the conductive leads, and the threading passage is configured to enable the plurality of the conductive leads to pass through.

[0014] According to a second aspect of the present application, a method for manufacturing a POP packaging structure is provided, comprising: connecting a support body between a first packaging unit and a second packaging unit, the first side of the second packaging unit facing away from the first side of the first packaging unit, the second packaging unit being provided with at least one threading passage penetrating in the thickness direction thereof; arranging a middle segment of a conductive lead in the threading passage, and connecting a first end of the conductive lead with the first side of the first packaging unit and a second end of the conductive lead with the first side of the second packaging unit; and performing plastic packaging on the first side of the first packaging unit and the first side of the second packaging unit, the plastic packaging body obtained by the plastic packaging connecting the first packaging unit and the second packaging unit and covering the conductive lead, thereby obtaining the POP packaging structure.

[0015] Optionally, the method further comprises: cutting off the region where the support body of the POP packaging structure is located.

[0016] According to a third aspect of the present application, an electronic device is provided, comprising the POP packaging structure according to any one of the above.

[0017] According to the POP packaging structure of the present application, the first packaging unit and the second packaging unit are interconnected by the conductive lead arranged therebetween. Compared with the large-size tin ball and the copper pillar, the conductive lead occupies less space, reduces the space occupation in the horizontal direction, and enables more electronic elements and interconnection structures to be integrated in the limited space, thereby effectively improving the packaging density and the interconnection density. Meanwhile, the use of the conductive lead reduces the dependence on the copper pillar, reduces the production cost, and makes the entire production process more economical and efficient. In addition, the threading passage arranged on the second packaging unit allows the conductive lead to pass through directly, thereby realizing the interconnection of the first side of the first packaging unit and the second packaging unit, and making the interconnection of the first packaging unit and the second packaging unit not limited by the distance therebetween, thereby facilitating the production and manufacturing.

[0018] Other characteristics and advantages of the present application will become clear from the following detailed description of exemplary embodiments thereof, with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0019] The accompanying drawings incorporated in and forming a part of the specification, illustrate embodiments of the present application and, together with the description, serve to explain the principles of the application.

[0020] Figure 1 This is a schematic structural diagram of a POP packaging structure according to an embodiment of the present application;

[0021] Figure 2 This is a structural schematic diagram of a POP packaging structure according to an embodiment of the present application after the first packaging unit is connected to the support body at one viewing angle;

[0022] Figure 3 This is a structural schematic diagram from another perspective after the first packaging unit of the POP packaging structure according to an embodiment provided by the present application is connected to the support body;

[0023] Figure 4 1 is a schematic structural diagram of a second packaging unit of a POP packaging structure according to an embodiment of the present application;

[0024] Figure 5 This is a structural schematic diagram of a POP packaging structure after the second packaging unit is connected to a conductive lead according to an embodiment provided by the present application;

[0025] Figure 6 This is a structural schematic diagram of a POP packaging structure after a first packaging unit and a second packaging unit are connected via a support body according to an embodiment provided by the present application;

[0026] Figure 7 This is a schematic structural diagram of a POP packaging structure before plastic packaging according to an embodiment provided by the present application.

[0027] Reference numerals

[0028] 100. POP packaging structure;

[0029] 10. First packaging unit;

[0030] 20. Second packaging unit; 21. Threading channel;

[0031] 30. Conductive lead; 40. Plastic package; 50. Support body. DETAILED DESCRIPTION

[0032] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0033] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present disclosure, its application, or uses.

[0034] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0035] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0036] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0037] The following first describes in detail the POP packaging structure 100 according to an embodiment of the present application with reference to the accompanying drawings.

[0038] like Figures 1 to 7 As shown, the POP packaging structure 100 according to an embodiment of the present application includes: a first packaging unit 10 , a second packaging unit 20 , at least one conductive lead 30 and a plastic package body 40 .

[0039] Specifically, the first side of the second packaging unit 20 faces away from the first side of the first packaging unit 10. The second packaging unit 20 is provided with at least one threading channel 21 extending through the thickness thereof. The middle section of the conductive lead 30 is provided in the threading channel 21. The first end of the conductive lead 30 is connected to the first side of the first packaging unit 10. The second end of the conductive lead 30 is connected to the first side of the second packaging unit 20. The plastic package body 40 is provided on the first sides of the first packaging unit 10 and the second packaging unit 20. The plastic package body 40 connects the first packaging unit 10 and the second packaging unit 20 and covers the conductive lead 30.

[0040] In other words, if Figures 1 to 7 As shown, the POP packaging structure 100 according to an embodiment of the present application mainly includes a plurality of packaging units, conductive leads 30 and a plastic package body 40, wherein the plurality of packaging units include a first packaging unit 10 and a second packaging unit 20. Taking two packaging units as an example, the packaging unit located at the bottom may be the first packaging unit 10, and the packaging unit located at the top may be the second packaging unit 20. The first packaging unit 10 is mainly composed of a first PCB board and a first electronic component (e.g., a chip, etc.). The first electronic component can be mounted on the first side (e.g., the upper side) of the first PCB board, and the first side of the first PCB board is the first side of the first packaging unit 10; the second packaging unit 20 is mainly composed of a second PCB board and a second electronic component (e.g., a chip, etc.). The second electronic component can be mounted on the first side (e.g., the upper side) of the second PCB board, and the first side of the second PCB board is the first side of the first packaging unit 10.

[0041] Specifically, the second packaging unit 20 is provided with a threading channel 21 running through it along the thickness direction, that is, the second PCB board of the second packaging unit 20 is provided with a threading channel 21 running through it along the thickness direction in the chip mounting area, so that the end of the conductive lead 30 can pass through the second packaging unit 20, so that the middle section of the conductive lead 30 can be set in the threading channel 21.

[0042] In this embodiment, the second package unit 20 is stacked on top of the first package unit 10. The first end of the conductive lead 30 is welded to the first side of the first package unit 10, electrically connecting the conductive lead 30 and the first package unit 10. The second end of the conductive lead 30 is welded to the first side of the second package unit 20, electrically connecting the conductive lead 30 and the second package unit 20, thereby achieving an electrical connection between the first package unit 10 and the second package unit 20. A plastic package 40 is provided on the first side of the first package unit 10 and the first side of the second package unit 20. The plastic package 40 covers the conductive lead 30 and the entire first side of the second package unit 20, and the plastic package 40 fills the space between the first package unit 10 and the second package unit 20, thereby connecting the first package unit 10 and the second package unit 20 together.

[0043] Therefore, according to the POP packaging structure 100 provided in this embodiment, the first packaging unit 10 and the second packaging unit 20 are interconnected by the provided conductive lead 30. Compared with large-sized solder balls and copper pillars, the conductive lead 30 occupies less space, reduces the horizontal space occupancy, and allows more electronic components and interconnection structures to be integrated in a limited space, which can effectively improve the packaging density and interconnection density; at the same time, since the use of the conductive lead 30 reduces the dependence on the copper pillar, the production cost is reduced, making the entire production process more economical and efficient; in addition, the threading channel 21 provided on the second packaging unit 20 allows the conductive lead 30 to pass directly through, thereby realizing the interconnection of the first side of the first packaging unit 10 and the second packaging unit 20, so that the interconnection of the first packaging unit 10 and the second packaging unit 20 is not limited by the distance between the two, which is convenient for production and manufacturing.

[0044] In some optional examples of the present application, the plastic package body 40 fills the entire threading channel 21, so that the conductive lead 30 can be wrapped in the threading channel 11, thereby avoiding contact between the conductive lead 30 and the inner wall surface of the threading channel 21, which can effectively improve the reliability of the POP packaging structure 100.

[0045] In some embodiments of the present application, the POP packaging structure 100 further includes: a support body 50 , which is disposed between the first side of the first packaging unit 10 and the second side of the second packaging unit 20 , and the plastic package body 40 covers at least a portion of the support body 50 .

[0046] Specifically, if Figures 1 to 3 As shown, a support body 50 is provided between the first side (for example, the upper side) of the first packaging unit 10 and the second side (for example, the lower side) of the second packaging unit 20. The support body 50 can connect the first packaging unit 10 and the second packaging unit 20 before they are plastic-sealed, so that the first packaging unit 10 and the second packaging unit 20 form an integral structure to facilitate subsequent plastic sealing; and the plastic sealing body 40 formed by the plastic sealing can also cover part of or the entire support body 50, which can effectively enhance the stability of the structure.

[0047] According to one embodiment of the present application, the POP packaging structure 100 includes a plurality of support bodies 50 .

[0048] That is to say, if Figure 3 and Figure 7 As shown, the POP package structure 100 includes one or more support bodies 50. When there is only one support body 50, the support body 50 may be in a strip or ring-shaped structure. When there are multiple support bodies 50, the support body 50 may be in a columnar structure. The multiple support bodies 50 may be spaced apart and distributed along the length and / or width of the POP package structure 100, thereby achieving a reliable connection between the first package unit 10 and the second package unit 20 while occupying a small space.

[0049] In some embodiments of the present application, at least a portion of the support body 50 is formed as a conductive pillar, which electrically connects the first package unit 10 and the second package unit 20 .

[0050] Specifically, one or more support bodies 50 are configured as conductive pillars, such as copper pillars, etc. The first end of the conductive pillar is fixedly connected to the first packaging unit 10 and forms an electrical connection, and the second end of the conductive pillar is fixedly connected to the second packaging unit 20 and forms an electrical connection. In this way, the support body 50 can not only enhance stability, but also realize the electrical connection between the first packaging unit 10 and the second packaging unit 20, which can further improve the interconnection density of the POP packaging structure 100.

[0051] According to one embodiment of the present application, the support body 50 is an insulator.

[0052] In this embodiment, the support body 50 is made of insulating material. This design effectively avoids unnecessary electrical short circuits and ensures the yield of the POP packaging structure 100. In addition, insulating materials are generally more economical than conductive materials, which can effectively reduce the production cost of the POP packaging structure 100.

[0053] In some embodiments of the present application, the support body 50 is disposed at an edge of the first side of the first packaging unit 10 .

[0054] In other words, the support body 50 can be arranged at the edge of the first side of the first package unit 10. This layout allows sufficient space in the central area of ​​the first package unit 10 for mounting other components. This design ensures the integration of the central area of ​​the first package unit 10, thereby efficiently utilizing space and ensuring the packaging density of the POP package structure 100.

[0055] According to one embodiment of the present application, the threading channel 21 is an avoidance hole or an avoidance gap.

[0056] Specifically, if Figures 5 to 7 As shown, the second packaging unit 20 is provided with an avoidance hole running through it in the thickness direction. The avoidance hole can be a rectangular hole or a circular hole, etc. The inner wall surface of the avoidance hole defines a threading channel 21, thereby providing a shorter arrangement path for the conductive lead 30 at the central position of the second packaging unit 20, which is beneficial to shortening the length of the conductive lead 30 and is convenient for production and manufacturing.

[0057] Furthermore, the edge of the second packaging unit 20 is provided with an avoidance gap extending through the thickness direction thereof, and the inner wall surface of the avoidance gap defines a threading channel 21 open on one side. The open threading channel 21 facilitates the conductive lead 30 to pass through the threading channel 21, thereby effectively improving the production efficiency of the POP packaging structure 100.

[0058] In some embodiments of the present application, the POP packaging structure 100 includes a plurality of conductive leads 30 , and the threading channel 21 is configured to allow the plurality of conductive leads 30 to pass through.

[0059] That is to say, if Figure 5 As shown, both the first package unit 10 and the second package unit 20 are provided with a plurality of electrical connection areas (e.g., pads on a PCB or pins on an electronic component), and the electrical connection areas of the first package unit 10 and the second package unit 20 are interconnected via a plurality of conductive leads 30. In this embodiment, the size of the threading channel 21 is designed to be relatively large, so that multiple conductive leads 30 can pass through the same threading channel 21. That is, one threading channel 21 can accommodate multiple conductive leads 30, thereby effectively improving the integration of the remaining areas and allowing more components to be integrated into a limited space.

[0060] like Figure 1 As shown, in some optional examples of the present application, the height of the conductive lead 30 is not higher than (i.e., equal to or lower than) the height of the second packaging unit 20. This design allows a thinner plastic package 40 to cover the conductive lead 30, which can effectively improve the packaging density.

[0061] In summary, according to the POP packaging structure 100 provided in this embodiment, the first packaging unit 10 and the second packaging unit 20 are interconnected by the provided conductive lead 30. Compared with large-sized solder balls and copper pillars, the conductive lead 30 occupies less space, so that more electronic components and interconnection structures can be integrated in a limited space, which can effectively improve the packaging density and interconnection density; at the same time, since the use of the conductive lead 30 reduces the dependence on copper pillars, the production cost is reduced, making the entire production process more economical and efficient; in addition, the threading channel 21 provided on the second packaging unit 20 allows the conductive lead 30 to pass directly through, thereby realizing the interconnection of the first side of the first packaging unit 10 and the second packaging unit 20, so that the interconnection of the first packaging unit 10 and the second packaging unit 20 is not limited by the distance between the two, which is convenient for production and manufacturing.

[0062] An embodiment of the present application further provides a method for preparing a POP packaging structure 100 . The POP packaging structure 100 may be the POP packaging structure 100 described in any of the above embodiments. The preparation method includes: S100 to S300 .

[0063] S100, connecting the support body 50 between the first packaging unit 10 and the second packaging unit 20, with the first side of the second packaging unit 20 facing away from the first side of the first packaging unit 10, and the second packaging unit 20 having at least one threading channel 21 penetrating along the thickness direction thereof;

[0064] Specifically, electronic components such as chips are first mounted on the first side (for example, the upper side) of the first PCB board to form a first packaging unit 10, and then the support body 50 is mounted on the first side (for example, the upper side) of the first packaging unit 10 to form a first packaging assembly; electronic components such as chips are mounted on the first side (for example, the upper side) of the second PCB board, and a threading channel 21 is set on the second PCB board along its thickness direction according to the circuit layout to form a second packaging unit 20, and then the second side (for example, the lower side) of the second packaging unit 20 is mounted on the end of the support body 50 away from the first packaging unit 10, so that the first packaging unit 10 and the second packaging unit 20 are connected to an integral structure through the support body 50.

[0065] Alternatively, electronic components such as chips are first mounted on the first side (for example, the upper side) of the second PCB board, and a threading channel 21 is set on the second PCB board along its thickness direction according to the circuit layout to form a second packaging unit 20, and then the support body 50 is mounted on the second side (for example, the lower side) of the second packaging unit 20 to form a second packaging assembly; then electronic components such as chips are mounted on the first side (for example, the upper side) of the first PCB board to form a first packaging unit 10; finally, the first side (for example, the upper side) of the first packaging unit 10 is mounted on the end of the support body 50 away from the second packaging unit 20, so that the first packaging unit 10 and the second packaging unit 20 are connected to form an integral structure through the support body 50.

[0066] S200, placing the middle section of the conductive lead 30 in the threading channel 21, and connecting the first end of the conductive lead 30 to the first side of the first packaging unit 10, and the second end of the conductive lead 30 to the first side of the second packaging unit 20;

[0067] In detail, the conductive lead 30 has a first end and a second end. First, the first end of the conductive lead 30 is welded to the pad of the first PCB board on the first packaging unit 10 or the pin of the electronic component. Then, the second end of the conductive lead 30 is passed through the threading channel 21 and welded to the pad of the second PCB board on the first packaging unit 10 or the pin of the electronic component, so that the first packaging unit 10 and the second packaging unit 20 are electrically connected to form a component to be plastic-encapsulated.

[0068] Alternatively, the second end of the conductive lead 30 is first welded to the pad of the second PCB board on the second packaging unit 20 or the pin of the electronic component, and then the first end of the conductive lead 30 is passed through the threading channel 21 and welded to the pad of the first PCB board on the first packaging unit 10 or the pin of the electronic component, so that the first packaging unit 10 and the second packaging unit 20 are electrically connected to form a component to be plastic-encapsulated.

[0069] S300 , plastic-sealing the first side of the first packaging unit 10 and the first side of the second packaging unit 20 , and the plastic-sealed body 40 obtained by plastic sealing connects the first packaging unit 10 and the second packaging unit 20 and covers the conductive lead 30 to obtain a POP packaging structure 100 .

[0070] That is to say, after the conductive lead 30 connects the first packaging unit 10 and the second packaging unit 20, an injection molding process can be performed on the first side of the first packaging unit 10 and the first side of the second packaging unit 20 using a plastic packaging device, so that the plastic packaging body 40 obtained by injection molding covers the conductive lead 30 and the entire first side of the second packaging unit 20, and the plastic packaging body 40 fills the space between the first packaging unit 10 and the second packaging unit 20 to connect the first packaging unit 10 and the second packaging unit 20 together, thereby obtaining a POP packaging structure 100.

[0071] Therefore, according to the preparation method of the POP packaging structure 100 of the embodiment of the present application, the first packaging unit 10 and the second packaging unit 20 are connected as a whole through the support body 50, which makes subsequent plastic packaging more convenient, and the first packaging unit 10 and the second packaging unit 20 are interconnected by the conductive lead 30. Compared with large-size solder balls and copper pillars, the conductive lead 30 occupies less space, reduces the horizontal space occupation, and allows more electronic components and interconnection structures to be integrated in a limited space, which can effectively improve the packaging density and interconnection density; at the same time, since the use of the conductive lead 30 reduces the dependence on copper pillars, the production cost is reduced, making the entire production process more economical and efficient; in addition, the threading channel 21 set on the second packaging unit 20 allows the conductive lead 30 to pass directly through, thereby realizing the interconnection of the first side of the first packaging unit 10 and the second packaging unit 20, so that the interconnection of the first packaging unit 10 and the second packaging unit 20 is not limited by the distance between the two, which is convenient for production and manufacturing.

[0072] According to one embodiment of the present application, the POP packaging structure 100 further includes: S400.

[0073] S400 , cutting off the area where the support body 50 of the POP packaging structure 100 is located.

[0074] In this embodiment, the support body 50 can be located at the edge of the POP packaging structure 100. When the required circuit does not exist at the corresponding positions of the support body 50 and the first packaging unit 10 and the second packaging unit 20, the area where the support body 50 of the POP packaging structure 100 is located can be cut off using cutting equipment, thereby obtaining a POP packaging structure 100 with a smaller size and higher packaging density.

[0075] The present application also provides an electronic device including the POP packaging structure 100 described in any of the above embodiments. Since the POP packaging structure 100 according to the present application has the above technical effects, the electronic device according to the present application also has the corresponding technical effects, which will not be described in detail in this embodiment.

[0076] While certain embodiments of the application have been described by way of example with specific reference to the drawings, it will be appreciated that the application is not limited by any of the examples described. It will be further appreciated that modifications can be made to the described embodiments without departing from the scope and spirit of the application. The scope of the application is defined in the claims that follow.

Claims

1. A POP packaging structure, characterized in that: include: a first packaging unit (10); a second packaging unit (20), wherein a first side of the second packaging unit (20) faces away from the first side of the first packaging unit (10), and the second packaging unit (20) is provided with at least one threading channel (21) penetrating in a thickness direction thereof; at least one conductive lead (30), wherein a middle section of the conductive lead (30) is provided in the threading channel (21), a first end of the conductive lead (30) is connected to a first side of the first packaging unit (10), and a second end of the conductive lead (30) is connected to a first side of the second packaging unit (20); A plastic package body (40), the plastic package body (40) being arranged on a first side of the first packaging unit (10) and the second packaging unit (20), the plastic package body (40) connecting the first packaging unit (10) and the second packaging unit (20), and covering the conductive lead (30).

2. The POP packaging structure according to claim 1, characterized in that: Also includes: A support body (50) is provided between a first side of the first packaging unit (10) and a second side of the second packaging unit (20), and the plastic package body (40) covers at least a portion of the support body (50).

3. The POP packaging structure according to claim 2, characterized in that: The POP packaging structure includes a plurality of support bodies (50).

4. The POP packaging structure according to claim 2, characterized in that: At least a portion of the support body (50) is formed as a conductive column, and the conductive column electrically connects the first packaging unit (10) and the second packaging unit (20).

5. The POP packaging structure according to claim 2, characterized in that: The support body (50) is an insulator.

6. The POP packaging structure according to claim 2, characterized in that: The support body (50) is provided at an edge of a first side of the first packaging unit (10).

7. The POP packaging structure according to claim 1, characterized in that: The threading channel (21) is a avoidance hole or an avoidance gap.

8. The POP packaging structure according to claim 1, characterized in that: The POP packaging structure includes a plurality of conductive leads (30), and the threading channel (21) is configured to allow the plurality of conductive leads (30) to pass through.

9. A method for preparing a POP packaging structure, characterized in that: include: Connecting a support body (50) between a first packaging unit (10) and a second packaging unit (20), wherein a first side of the second packaging unit (20) faces away from a first side of the first packaging unit (10), and the second packaging unit (20) is provided with at least one threading channel (21) penetrating along a thickness direction thereof; The middle section of the conductive lead (30) is arranged in the threading channel (21), and the first end of the conductive lead (30) is connected to the first side of the first packaging unit (10), and the second end of the conductive lead (30) is connected to the first side of the second packaging unit (20); The first side of the first packaging unit (10) and the first side of the second packaging unit (20) are plastic-sealed, and the plastic-sealed body (40) obtained by the plastic sealing connects the first packaging unit (10) and the second packaging unit (20) and covers the conductive lead (30), thereby obtaining a POP packaging structure.

10. The method for preparing a POP packaging structure according to claim 9, wherein: Also includes: The area where the support body (50) of the POP packaging structure is located is cut away.

11. An electronic device, characterized in that: A POP packaging structure comprising any one of claims 1 to 8.

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