Camera module and electronic equipment

Abstract

The invention discloses a camera module and electronic equipment. The camera module comprises a shell, an optical element and a laser transmitter, wherein the optical element and the laser transmitter are accommodated in the shell; the optical element comprises a reflecting part, a lens group and a photosensitive chip; a light through hole is formed in the shell, the light reflecting part, the lens group and the light sensing chip are arranged in sequence, and the light reflecting part is arranged on the side, close to the light through hole, of the lens group; the peripheral area of a target component in the optical element comprises a shading part and a marking part, the shading part surrounds the marking part, laser can penetrate through the marking part, the shading part cannot penetrate through the laser, and the target component comprises at least one of a reflecting part, a lens group and a photosensitive chip; the laser transmitter is arranged on one side, back to the light through hole, of the target component, and an included angle between light rays emitted by the laser transmitter and a plane where the photosensitive chip is located is greater than 0 degree and less than 180 degrees; when the target part and the light through hole are located on the same first optical axis, the laser emitted by the laser emitter penetrates through the marking part of the target part and is emitted out of the light through hole.

Description

Technical Field

[0001] The present application belongs to the field of optical technology, and specifically relates to a camera module and an electronic device. Background Art

[0002] With the popularization of electronic devices such as mobile phones, electronic devices have various shapes. Cameras are one of the important components in electronic devices. At present, the iterative update of cameras is usually achieved by improving camera pixels, increasing chip bottom, and expanding shooting distance range.

[0003] Due to the thickness limitation of electronic devices such as mobile phones, periscope camera modules that change the light path through reflectors have become indispensable components for electronic devices. The periscope camera module has also been upgraded to improve the image quality. For example, a large aperture, a large photosensitive chip size, a wide range of focus distances, etc. The corresponding design solutions include grouping the lenses and designing the reflectors to have a structure that not only reflects light but also gathers light.

[0004] However, in the relevant technology, the assembly process of the reflective parts, lens group, photosensitive chip, etc. of the periscope camera module is complicated, and it is difficult to detect and ensure that multiple devices are on the same axis. The position deviation of the optical device will lead to a decrease in imaging quality. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a camera module and an electronic device, in which a laser emitter is arranged in the camera module, and a mark that can transmit laser light is arranged on at least one of the reflector, lens group, photosensitive chip, etc. of the camera module. In this way, by pre-designing the position correspondence between the laser emitter and the marks on the reflector, lens group, photosensitive chip and other components, the laser emitted by the laser emitter can be emitted through the light hole, and it can be determined that at least one of the reflector, lens group, photosensitive chip, etc. of the camera module is located on the same optical axis.

[0006] In a first aspect, an embodiment of the present application provides a camera module, which includes: a housing, an optical element, and a laser emitter; the optical element includes a reflector, a lens group, and a photosensitive chip;

[0007] The housing is provided with a light-through hole, the optical element and the laser emitter are accommodated in the housing, the reflector, the lens group and the photosensitive chip are arranged in sequence, and the reflector is arranged on a side of the lens group close to the light-through hole;

[0008] The peripheral area of ​​the target component in the optical element includes a light shielding portion and a marking portion, the light shielding portion surrounds the marking portion, the marking portion can transmit laser light, and the light shielding portion cannot transmit laser light, and the target component includes at least one of the reflector, the lens group, and the photosensitive chip;

[0009] The laser emitter is disposed on a side of the target component facing away from the light-through hole, and the angle between the light emitted by the laser emitter and the plane where the photosensitive chip is located is greater than 0° and less than 180°;

[0010] Wherein, when the target component and the light-through hole are located on the same first optical axis, the laser emitted by the laser emitter penetrates the marking portion of the target component and is emitted from the light-through hole; when the target component and the light-through hole are not located on the same first optical axis, the laser emitted by the laser emitter is blocked by the shading portion of the target component.

[0011] In a second aspect, an embodiment of the present application provides an electronic device, which includes a camera module as described in the first aspect.

[0012] In the embodiment of the present application, a laser emitter is arranged in the camera module, and a shading portion and a marking portion are designed in advance in the peripheral area of ​​the target component, so that when the target component is kept on the same optical axis as the light-through hole, the laser emitted by the laser emitter can penetrate the marking portion on the target component, so that the laser emitted by the laser emitter can be emitted from the light-through hole of the camera module; if the assembly position of one or at least two target components in the camera module is offset, the laser emitted by the laser emitter will irradiate the shading portion on the target component, thereby preventing the laser emitted by the laser emitter from being emitted from the light-through hole of the camera module. In this way, by observing or detecting whether there is laser emission from the light-through hole of the camera module when the laser emitter emits light, it is possible to determine whether the target component in the camera module is aligned with the optical axis corresponding to the light-through hole, and the assembly position of the target component can be adjusted based on the judgment result, which can improve the assembly accuracy of the camera module and the imaging quality of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a cross-sectional view of the first camera module provided in an embodiment of the present application along the front view direction;

[0014] Figure 2 is a perspective view of the first camera module provided by an embodiment of the present application along a top-down direction;

[0015] Figure 3 is a cross-sectional view of the second camera module provided in an embodiment of the present application along the front view direction;

[0016] Figure 4It is a structural schematic diagram of a target component position offset in a camera module provided in an embodiment of the present application;

[0017] Figure 5 is a cross-sectional view of the third camera module provided in an embodiment of the present application along the front view direction;

[0018] Figure 6 is a schematic diagram of the structure of the second circuit board in an embodiment of the present application;

[0019] Figure 7a It is one of the structural schematic diagrams of the base assembly in the embodiment of the present application;

[0020] Figure 7b This is the second structural schematic diagram of the base assembly in the embodiment of the present application;

[0021] Figure 8 is a schematic structural diagram of a lens assembly in an embodiment of the present application;

[0022] Figure 9a 1 is a schematic diagram of the structure of the reflective member;

[0023] Figure 9b is a schematic diagram of a second surface of a reflective member;

[0024] Fig.9c is a schematic diagram of a third surface of the reflective member;

[0025] Fig.10 It is a schematic diagram of the assembly position of the laser receiver, the driver and the first circuit board in the embodiment of the present application. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0027] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0028] In the related technology, the assembly process of the reflector, lens group, and photosensitive chip of the periscope camera module is complicated. In the process of assembling the camera module, it is difficult to accurately assemble the reflector, lens group, photosensitive chip, etc. on the same optical axis. When there is deviation in the optical axis of components such as the reflector, lens group, photosensitive chip, and light filter, the imaging quality of the camera module will be reduced.

[0029] In the embodiment of the present application, a laser emitter is arranged in the camera module, and the position of the marking portion on the target component including at least one of the reflector, lens group, photosensitive chip and the like is designed in advance to ensure that the laser emitted by the laser emitter can penetrate the marking portion and be emitted from the light through hole when the reflector, lens group and photosensitive chip are located on the same optical axis corresponding to the light through hole. In this way, by observing or detecting whether there is laser emission from the light through hole of the camera module when the laser emitter emits light, it is possible to determine whether the target component in the camera module is aligned with the optical axis corresponding to the light through hole. If it is subsequently determined that the target component in the camera module is not aligned with the optical axis corresponding to the light through hole, the assembly position of the target component can be adjusted, which can improve the assembly accuracy of the camera module and the imaging quality of the camera module.

[0030] The camera module and electronic device provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in combination with the accompanying drawings.

[0031] See also Figure 1 The camera module provided in the embodiment of the present application includes: a housing 1, an optical element and a laser emitter 5, wherein the optical element includes a reflector 2, a lens group 3 and a photosensitive chip 4;

[0032] The housing 1 is provided with a light hole 11, the optical element and the laser emitter 5 are accommodated in the housing 1, the reflector 2, the lens group 3 and the photosensitive chip 4 are arranged in sequence, and the reflector 2 is arranged on one side of the lens group 3 close to the light hole 11;

[0033] The peripheral area of ​​the target component 10 in the optical element includes a light shielding portion 102 and a marking portion 101, the light shielding portion 102 surrounds the marking portion 101, the marking portion 101 can transmit the laser, and the light shielding portion 102 cannot transmit the laser, and the target component 10 includes at least one of a reflector 2, a lens group 3 and a photosensitive chip 4;

[0034] The laser emitter 5 is disposed on a side of the target component 10 that is away from the light hole 11, and the angle between the light emitted by the laser emitter 5 and the plane where the photosensitive chip 4 is located is greater than 0° and less than 180°;

[0035] In which, when the target component 10 and the light hole 11 are located on the same first optical axis X, the laser emitted by the laser emitter 5 penetrates the marking portion 101 of the target component 10 and is emitted from the light hole 11; when the target component 10 and the light hole 11 are not located on the same first optical axis X, the laser emitted by the laser emitter 5 is blocked by the shading portion 102 of the target component 10.

[0036] It should be noted that, in the embodiments of the present application and the drawings in the specification, the target component 10 is usually illustrated by taking the example of including a reflector 2 and a lens group 3. In some optional embodiments, the target component 10 may include only one of the reflector 2 and the lens group 3, or the target component 10 may also include a photosensitive chip 4, or the target component 10 may also include a filter, etc., which is not specifically limited here.

[0037] The specific configurations of the light shielding portion 102 and the marking portion 101 on different types of devices in the target component 10 may be different.

[0038] For example, for a device with a light-transmitting peripheral region, a light-shielding portion 102 may be provided in the peripheral region of the device by means of ink silk-screen printing, and the ink silk-screen printing may be removed in a smaller region of the light-shielding portion 102 to form a marking portion 101, such as Figures 9a to 9c As shown, the reflector 2 is a prism, and the periphery of the two light-transmitting surfaces of the prism can be formed into a shading portion 102 by ink silk-screen printing, and the ink silk-screen printing is removed in a smaller area of ​​the shading portion 102 to form a marking portion 101.

[0039] For another example, for a device whose peripheral area is not transparent, the marking portion 101 can be provided by punching, and the non-punched area forms the light shielding portion 102, for example: Figure 8 As shown, the lens group 3 includes a lens 301 and a lens barrel 302 surrounding the edge of the lens 301. The lens barrel 302 can be an injection molded part or other non-light-transmitting material. At this time, a through hole can be opened on the lens barrel 302 so that the through hole constitutes the marking part 101, and the other areas of the lens barrel 302 constitute the shading part 102.

[0040] In some embodiments, Figure 3 As shown, the target component 10 may also include a base assembly 9, such as Figure 7a or Figure 7b As shown, the base assembly 9 includes a filter 91 and a base support structure 92 surrounding the periphery of the filter 91. Figure 7a The light shielding portion 102 and the marking portion 101 can be provided on the filter 91 by ink silk screen printing, or can be provided by Figure 7b As shown, the base support structure 92 is provided by punching holes, which is not specifically limited here.

[0041] In addition, if Figure 4 As shown, when the target component 10 is positionally offset relative to the optical axis of the light-through hole 11, the optical axes of the target component 10 and the light-through hole 11 do not overlap, so that the laser emitted by the laser emitter 5 will be blocked by the shading portion 102 on the target component 10, and thus the laser cannot be emitted from the light-through hole 11.

[0042] In some embodiments, the angle between the light emitted by the laser emitter 5 and the plane where the photosensitive chip 4 is located is greater than 0° and less than 180°, for example: the angle between the light emitted by the laser emitter 5 and the plane where the photosensitive chip 4 is located is absolutely equal to 90°, so that the light emitted by the laser emitter 5 is approximately perpendicular to the plane where the photosensitive chip 4 is located, so that the emission direction of the laser emitted by the laser emitter 5 can be approximately parallel to the optical axis of the photosensitive chip 4, and then based on the characteristic of laser propagation in a straight line, the line between the marking portion 101 on the target component 10 and the laser emission point of the laser emitter 5 can be designed in advance to be parallel to the optical axis of the photosensitive chip 4, so that when the laser emitted by the laser emitter 5 can smoothly penetrate the marking portion 101 on the target component 10, it can be ensured that the optical axis of the target component 10 is approximately parallel to the emission direction of the laser emitted by the laser emitter 5, thereby satisfying the consistency of the optical axis of the target component 10 and the light hole 11.

[0043] In some embodiments, the light emitted by the laser emitter 5 is parallel to the first optical axis X.

[0044] In this embodiment, the position of the marking portion 101 on the target component 10 can be designed in advance so that when the target component 10 is aligned with the optical axis of the light-through hole 11, the line between the marking portion 101 on the target component 10 and the laser emission point of the laser emitter 5 is parallel to the first optical axis X. In this way, since the light emitted by the laser emitter 5 is parallel to the first optical axis X, when the light emitted by the laser emitter 5 can penetrate the marking portion 101 on the target component 10 to be emitted from the light-through hole 11, it can be determined that the target component 10 is aligned with the first optical axis X.

[0045] In some embodiments, the length and / or width of the marking portion 101 may be less than or equal to 2 mm.

[0046] It is worth mentioning that the smaller the size of the marking part 101, the lower the tolerance of the laser emitted by the laser emitter 5 to irradiate the marking part 101, that is, the higher the degree of overlap of the optical axes of the target component 10 and the light-through hole 11, the laser emitted by the laser emitter 5 can be emitted from the light-through hole 11, so that the detection accuracy of whether the position of the target component 10 is accurately assembled can be improved.

[0047] In some embodiments, the reflective element 2 may be any device capable of reflecting light, such as a reflector or a prism. In the embodiments of the present application, the reflective element is a prism as an example for illustration, which does not constitute a specific limitation.

[0048] It is worth mentioning that the reflector 2 is used to change the propagation direction of the light incident from the light hole 11. For example, the light hole 11 is opened on the back of the mobile phone, and the reflector 2, the lens group 3 and the photosensitive chip 4 are arranged at intervals along the plane where the mobile phone is located. At this time, the reflector 2 is aligned with the light hole 11 and reflects the light incident from the light hole 11 to the lens group 3 and the photosensitive chip 4. At this time, the first optical axis X is the axis of the light hole 11 and the axis after the axis is reflected by the reflector 2.

[0049] In some embodiments, it is possible to determine whether the target component 10 in the camera module overlaps with the optical axis of the light hole 11 by artificial visual judgment. For example, when the laser emitter 5 emits laser, if it is observed that the light hole 11 emits laser, it can be determined that the target component 10 in the camera module overlaps with the optical axis of the light hole 11. At this time, it can be determined that the assembly position of the target component 10 in the camera module is accurate enough to enable the camera module to achieve higher imaging quality. When the laser emitter 5 emits laser, if it is observed that the light hole 11 does not emit laser, it can be determined that the target component 10 in the camera module does not overlap with the optical axis of the light hole 11. At this time, it can be determined that the assembly position of the target component 10 in the camera module is not accurate enough, which will reduce the imaging quality of the camera module. Subsequently, the assembly position of the target component 10 in the camera module can be adjusted so that when the laser emitter 5 emits laser, the light hole 11 emits laser.

[0050] In other embodiments, laser detection can be used to determine whether the target component 10 in the camera module overlaps with the optical axis of the light hole 11. For example, when the laser emitter 5 emits laser, if it is detected that the light hole 11 emits laser, it can be determined that the target component 10 in the camera module overlaps with the optical axis of the light hole 11. At this time, it can be determined that the assembly position of the target component 10 in the camera module is accurate enough to enable the camera module to achieve higher imaging quality. When the laser emitter 5 emits laser, if it is detected that the light hole 11 does not emit laser, it can be determined that the target component 10 in the camera module does not overlap with the optical axis of the light hole 11. At this time, it can be determined that the assembly position of the target component 10 in the camera module is not accurate enough, which will reduce the imaging quality of the camera module. Subsequently, the assembly position of the target component 10 in the camera module can be adjusted so that when the laser emitter 5 emits laser, the light hole 11 emits laser.

[0051] For example: Figure 3 As shown, the camera module also includes: a laser receiver 6;

[0052] The laser receiver 6 is at least partially exposed on the first surface 12 of the shell 1, and the first surface 12 is a side surface where the light through hole 11 is located. When the target component 10 and the light through hole 11 are located on the same first optical axis X, the laser emitted by the laser transmitter 5 penetrates the marking portion 101 of the target component 10, is emitted from the light through hole 11, and is received by the laser receiver 6.

[0053] In some embodiments, the laser light received by the laser receiver 6 is the laser light emitted from the light passage 11 and reflected by the surface of an external object.

[0054] In the present embodiment, when the laser emitter 5 emits laser, if the laser receiver 6 receives the laser, it is determined that the target component 10 in the camera module overlaps with the optical axis of the light through hole 11; when the laser emitter 5 emits laser, if the laser receiver 6 does not receive the laser, it is determined that the target component 10 in the camera module does not overlap with the optical axis of the light through hole 11. Compared with the method of using artificial vision to judge whether laser is emitted from the light through hole 11, the degree of automation of the detection process of the assembly accuracy of the target component 10 in the camera module can be improved.

[0055] In some embodiments, Figure 3 or Figure 5 As shown, the first portion of the housing 1 is provided with a first groove 131 or a first through hole 132 , the laser receiver 6 is embedded in the first groove 131 or the first through hole 132 , and there is a gap between the lens group 3 and the first portion of the housing 1 .

[0056] In some embodiments, Figure 5 As shown, by providing a first groove 131 at the first part of the housing 1 and accommodating the laser receiver 6 in the first groove 131, the utilization of the gap in the housing 1 can be improved compared with the method of directly fixing the laser receiver 6 on the surface of the housing 1. That is, the gap between the housing 1 and the lens group 3 is utilized to reduce the increase in the overall size of the camera module caused by the laser receiver 6.

[0057] In this embodiment, on the one hand, the utilization rate of the gap between the housing 1 and the lens group 3 can be improved, and on the other hand, the risk of dust accumulation caused by the excessive gap space inside the housing 1 can be reduced.

[0058] In other embodiments, Figure 3 As shown, by opening a first through hole 132 at a first portion of the housing 1 and embedding the laser receiver 6 in the first through hole 132, the utilization of the gap in the housing 1 can also be improved compared to the method of directly fixing the laser receiver 6 on the surface of the housing 1. That is, the first groove 131 and the laser receiver 6 are provided in the gap between the housing 1 and the lens group 3.

[0059] In some embodiments, the lens group 3 may include multiple structures, such as sub-lens groups and driving components, circuit boards, etc. In this case, the gap between the lens group 3 and the first part of the shell 1 may be the gap between the inner wall of the shell 1 and the driving components, lens groups, and circuit boards in the lens group 3.

[0060] In some embodiments, the lens group 3 includes at least two lenses, and the lens group can achieve a focusing function.

[0061] Alternatively, if Figure 2 As shown, the lens group 3 includes a first sub-lens group 31, a second sub-lens group 32 and a driving member 33;

[0062] The first sub-lens group 31 and the second sub-lens group 32 are arranged along the first optical axis X at intervals;

[0063] The driving member 33 is fixed to the housing 1 and is used to drive the second sub-lens group 32 and / or the first sub-lens group 31 to move along the first optical axis X.

[0064] In some embodiments, the first sub-lens group 31 and the second sub-lens group 32 may include at least one lens respectively.

[0065] In some embodiments, the first sub-lens group 31 may be located between the second sub-lens group 32 and the reflector 2 , and the second sub-lens group 32 and / or the first sub-lens group 31 may be driven to move along the first optical axis X by the driving member 33 , so as to realize a zoom function.

[0066] Of course, the second sub-lens group 32 may also be arranged between the first sub-lens group 31 and the reflector 2, so that the second sub-lens group 32 and / or the first sub-lens group 31 are driven to move along the first optical axis X by the driving member 33, and the zoom function can also be achieved.

[0067] In some embodiments, the number of the first sub-lens groups 31 can be one group or at least two groups. For example, when the number of the first sub-lens groups 31 is two groups, one group of the first sub-lens groups 31 can be respectively arranged on opposite sides of the second sub-lens group 32 along the first optical axis X.

[0068] In some embodiments, the number of the second sub-lens groups 32 can be one group or at least two groups. For example, when the number of the second sub-lens groups 32 is two groups, one group of second sub-lens groups 32 can be respectively arranged on opposite sides of the first sub-lens group 31 along the first optical axis X.

[0069] In this way, by increasing the number of the first sub-lens group 31 and / or the second sub-lens group 32 , the zoom range and zoom flexibility can be improved.

[0070] In this embodiment, by configuring the lens group 3 to be at least two sub-lens groups that can move relatively along the first optical axis X, and by driving the second sub-lens group 32 and / or the first sub-lens group 31 to move along the first optical axis X through the driving member 33, a zoom function can be achieved.

[0071] In some embodiments, the laser emitted by the laser emitter 5 can be reused to achieve distance measurement of the photographed object, so as to adjust the distance between the second sub-lens group 32 and / or the first sub-lens group 31 according to the object distance to achieve the focusing function of the photographed object. For example, a laser receiver can be provided to calculate the distance between the photographed object and the camera module by measuring the time difference between the laser emitter 5 emitting the laser and the laser receiver receiving the laser reflected by the photographed object.

[0072] As an optional implementation, the laser emitter 5 is arranged on the periphery of the photosensitive chip 4 , and the target component 10 includes a reflective element 2 and a lens group 3 .

[0073] It should be noted that, by arranging the laser emitter 5 on the periphery of the photosensitive chip 4, when the photosensitive chip 4, the lens group 3 and the reflector 2 are located on the same optical axis, the laser emitted by the laser emitter 5 can sequentially penetrate the marking portion on the lens group 3, the marking portion of the reflector 2 facing the lens group 3, and after being reflected by the reflector 2 and penetrating the marking portion on the side of the reflector 2 facing the light-through hole 11, it can be emitted from the light-through hole 11.

[0074] In the present embodiment, by arranging the laser emitter 5 on the periphery of the photosensitive chip 4 and satisfying that the emission direction of the laser emitted by the laser emitter 5 is approximately perpendicular to the plane where the photosensitive chip 4 is located, when the laser emitted by the laser emitter 5 is emitted from the light through hole 11, it can be detected that the photosensitive chip 4 and the reflective element 2 and the lens group 3 located between the photosensitive chip 4 and the light through hole 11 correspond to the same optical axis.

[0075] As an optional implementation, Fig.10 As shown, the camera module also includes: a first circuit board 7;

[0076] In the case where the lens assembly 3 includes the driving member 33 , the driving member 33 and the laser receiver 6 are electrically connected to the first circuit board 7 , respectively.

[0077] In this embodiment, the first circuit board 7 that provides power and control signals to the driver 33 can be reused to provide power and signal transmission to the laser receiver 6 .

[0078] For example: the driving component 33 is a motor, and the first circuit board 7 can be called a motor circuit board. At this time, the multiplexed motor circuit board provides power for the laser receiver 6, and transmits the laser receiving signal collected by the laser receiver 6 to a controller for determining whether the target component in the camera module is aligned with the optical axis corresponding to the light hole.

[0079] As an optional implementation, the camera module further includes: a second circuit board 8;

[0080] The laser emitter 5 and the photosensitive chip 4 are arranged on the second circuit board 8 .

[0081] In some embodiments, Figure 6 As shown, the photosensitive chip 4 is arranged in the middle area of ​​the second circuit board 8, and the laser emitter 5 is arranged in the area of ​​the second circuit board 8 located on the right side of the photosensitive chip 4, so that the photosensitive chip 4 and the laser emitter 5 remain relatively fixed, and the emission direction of the laser emitted by the laser emitter 5 is roughly perpendicular to the plane where the photosensitive chip 4 is located.

[0082] It should be noted that if Figure 6 As shown, other electronic devices 20 besides the photosensitive chip 4 and the laser emitter 5 may be arranged on the second circuit board 8, which is not specifically limited here.

[0083] In some embodiments, Figure 3 As shown, the second circuit board 8 can be electrically connected to the camera module connector 802 through structures such as a flexible circuit board 801 and a hard circuit board, so as to realize electrical connection between the camera module and other devices in the electronic device through the camera module connector 802.

[0084] In the present embodiment, the second circuit board 8 where the multiplexed photosensitive chip 4 is located provides power supply and signal transmission for the laser emitter 5, which can simplify the structural complexity of the camera module.

[0085] In some embodiments, Figure 9a , Figure 9b and Fig.9c As shown, in the case where the target component 10 includes a reflector 2, the reflector 2 includes a second surface 21, a third surface 22 and a reflective surface 23, and the second surface 21, the third surface 22 and the reflective surface 23 surround to form a triangular prism structure;

[0086] The first area of ​​the second surface 21 includes a first light shielding portion 102A and a first marking portion 101A, the first light shielding portion 102A surrounds the first marking portion 101A, the first marking portion 101A can transmit the laser, and the first light shielding portion 102A cannot transmit the laser, and the first area includes the laser irradiation area of ​​the laser emitter 5;

[0087] The second area of ​​the third surface 22 includes a second light shielding portion 102B and a second marking portion 101B. The second light shielding portion 102B surrounds the second marking portion 101B. The second marking portion 101B can transmit the laser, and the second light shielding portion 102B cannot transmit the laser.

[0088] The first marking portion 101A and the second marking portion 101B are axially symmetrically distributed along the reflection axis of the reflection surface 23 , and the first region and the second region are axially symmetrically distributed along the reflection axis of the reflection surface 23 .

[0089] In some embodiments, the first area includes the laser irradiation area of ​​the laser emitter 5, which can mean that the first area is included in a certain assembly position deviation range, and the laser emitter 5 may be in the irradiation area on the second surface 21. As shown in Figure 1, the laser emitter 5 is arranged on the upper side of the photosensitive chip 4. According to the principle that laser propagates in a straight line, the laser emitted by the laser emitter 5 may irradiate the upper area of ​​the second surface 21. At this time, the edge area on the upper side of the second surface 21 can be set as the first area. In the first area, the portion that is on the same axis as the emission direction of the laser emitted by the laser emitter 5 is used as the first marking portion 101A, and the remaining area is used as the first shading portion 102A.

[0090] In some embodiments, the second region and the first region are axially symmetrically distributed along the reflection axis of the reflection surface 23, the second marking portion 101B and the first marking portion 101A are axially symmetrically distributed along the reflection axis of the reflection surface 23, and the second shading portion 102B and the first shading portion 102A are axially symmetrically distributed along the reflection axis of the reflection surface 23.

[0091] In the present embodiment, by designing the marking portion and the shading portion on the two light-transmitting surfaces of the triangular prism, the optical axis of the reflector 2 can be made consistent with the optical axis of the photosensitive chip 4 and the light-through hole 11, so that the laser emitted by the laser emitter 5 can pass through the first marking portion 101A on the second surface 21 of the reflector 2, and be reflected by the reflecting surface 23, and penetrate the second marking portion 101B on the second surface 22 of the reflector 2, and then be emitted from the light-through hole 11. This structure can improve the detection accuracy of the assembly position of the reflector 2.

[0092] In the embodiment of the present application, a laser emitter is arranged in the camera module, and a shading portion and a marking portion are designed in advance in the peripheral area of ​​the target component, so that when the target component is kept on the same optical axis as the light-through hole, the laser emitted by the laser emitter can penetrate the marking portion on the target component, so that the laser emitted by the laser emitter can be emitted from the light-through hole of the camera module; if the assembly position of one or at least two target components in the camera module is offset, the laser emitted by the laser emitter will irradiate the shading portion on the target component, thereby preventing the laser emitted by the laser emitter from being emitted from the light-through hole of the camera module. In this way, by observing or detecting whether there is laser emission from the light-through hole of the camera module when the laser emitter emits light, it is possible to determine whether the target component in the camera module is aligned with the optical axis corresponding to the light-through hole, and the assembly position of the target component can be adjusted based on the judgment result, which can improve the assembly accuracy of the camera module and the imaging quality of the camera module.

[0093] An embodiment of the present application also provides an electronic device, which includes any camera module provided by the aforementioned embodiments of the present application.

[0094] In some embodiments, the electronic device of the embodiments of the present application may be a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted electronic device, a mobile Internet device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc. It may also be a server, a network attached storage (NAS), a personal computer (PC), a television (TV), a teller machine or a self-service machine, etc., and the embodiments of the present application are not specifically limited.

[0095] The electronic device in the embodiment of the present application can utilize the laser alignment principle to detect whether the position of each component in the camera module is offset or loose during the production, delivery and / or use of the electronic device. When it is found that the position of the component in the camera module is offset or loose, the defect of the camera module can be quickly located.

[0096] In some embodiments, the electronic device further comprises: a controller;

[0097] The controller is in communication connection with the laser emitter, the controller is used to send a first signal to the laser emitter, and the laser emitter is used to adjust at least one of the time, frequency and emission power of the laser emitter according to the first signal;

[0098] When the camera module also includes a laser receiver, the controller is also communicatively connected to the laser receiver, and the laser receiver is used to send a second signal to the controller when receiving the laser, so that the controller determines whether the target component and the light hole are located on the same optical axis based on the second signal.

[0099] In some embodiments, the controller may reuse a processor in an electronic device, or may be a controller separately provided for a camera module, which is not specifically limited herein.

[0100] In some implementations, the first signal may be a digital signal or an analog signal, which is not specifically limited herein.

[0101] In some implementations, the second signal may be a digital signal or an analog signal, which is not specifically limited herein.

[0102] In some embodiments, the controller can control the laser emitter to emit laser or stop emitting laser through a first signal. At this time, the controller can determine whether a second signal is received from the laser receiver within a certain time range after controlling the laser emitter to emit laser. If so, it can be determined whether the target component and the light-through hole are located on the same optical axis; otherwise, it is determined that the optical axis of the target component and the light-through hole are not aligned.

[0103] In some embodiments, the controller controls the frequency and / or power of the laser emitted by the laser transmitter through a first signal. At this time, the controller can determine whether the laser received by the laser receiver is the laser emitted by the laser transmitter based on the frequency and / or power of the laser received by the laser receiver reflected by the second signal. If so, it can be determined whether the target component and the light-through hole are located on the same optical axis; otherwise, it is determined that the optical axis of the target component and the light-through hole are not aligned.

[0104] In some embodiments, the laser transmitter and laser receiver in the camera module can be reused to implement focus and ranging functions. For example, the controller records the first time when the laser transmitter emits the laser, and records the second time when the laser receiver receives the laser, and calculates the distance between the electronic device and the photographed object based on the time difference between the first time and the second time, thereby adjusting the focal length of the camera module according to the distance.

[0105] In some embodiments, the controller can control the frequency and / or power of the laser emitted by the laser emitter for detecting whether the target component is aligned with the optical axis of the light-through hole through the first signal, which can be different from the frequency and / or power of the laser emitted by the laser emitter for focusing and ranging.

[0106] For example: in the process of detecting whether the target component is aligned with the optical axis of the light-passing hole, the laser emitter emits laser at a first frequency and a first power, and in the process of focusing and ranging, the laser emitter emits laser at a second frequency and a second power. At this time, the first frequency can be less than the second power, and / or the second power can be less than the second power.

[0107] In this embodiment, the controller can control the time, frequency and / or power of the laser emitter to emit the laser, and when the laser emitter emits the laser, it determines whether the target component and the light hole are located on the same optical axis by determining whether a second signal is received from the laser receiver.

[0108] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0109] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A camera module, characterized in that: include: housing, optics and laser emitters; The optical element includes a reflector, a lens group and a photosensitive chip; The housing is provided with a light-through hole, the optical element and the laser emitter are accommodated in the housing, the reflector, the lens group and the photosensitive chip are arranged in sequence, and the reflector is arranged on a side of the lens group close to the light-through hole; The peripheral area of ​​the target component in the optical element includes a light shielding portion and a marking portion, the light shielding portion surrounds the marking portion, the marking portion can transmit laser light, and the light shielding portion cannot transmit laser light, and the target component includes at least one of the reflector, the lens group, and the photosensitive chip; The laser emitter is disposed on a side of the target component that is away from the light-through hole, and the angle between the light emitted by the laser emitter and the plane where the photosensitive chip is located is greater than 0° and less than 180°; Wherein, when the target component and the light-through hole are located on the same first optical axis, the laser emitted by the laser emitter penetrates the marking portion of the target component and is emitted from the light-through hole; when the target component and the light-through hole are not located on the same first optical axis, the laser emitted by the laser emitter is blocked by the shading portion of the target component.

2. The camera module according to claim 1, characterized in that: The laser emitter is arranged on the periphery of the photosensitive chip, and the target component includes the reflective element and the lens group.

3. The camera module according to claim 1, characterized in that: The lens group includes a first sub-lens group, a second sub-lens group and a driving member; The first sub-lens group and the second sub-lens group are arranged at intervals along the first optical axis; The driving member is fixed to the housing, and is used for driving the second sub-lens group and / or the first sub-lens group to move along the first optical axis.

4. The camera module according to any one of claims 1 to 3, characterized in that: Also includes: Laser receiver; The laser receiver is at least partially exposed on the first surface of the shell, and the first surface is a side surface where the light through hole is located. When the target component and the light through hole are located on the same first optical axis, the laser emitted by the laser transmitter penetrates the marking portion of the target component, is emitted from the light through hole, and is received by the laser receiver.

5. The camera module according to claim 4, characterized in that: A first groove or a first through hole is provided at a first portion of the housing, the laser receiver is embedded in the first groove or the first through hole, and a gap is provided between the lens group and the first portion of the housing.

6. The camera module according to claim 4, characterized in that: Also includes: a first circuit board; In the case where the lens assembly includes a driving member, the driving member and the laser receiver are electrically connected to the first circuit board respectively; and / or, The camera module also includes: a second circuit board; The laser emitter and the photosensitive chip are arranged on a second circuit board.

7. The camera module according to any one of claims 1 to 3, characterized in that: The light emitted by the laser emitter is parallel to the first optical axis.

8. The camera module according to any one of claims 1 to 3, characterized in that: In the case where the target component includes the reflector, the reflector includes a second surface, a third surface and a reflective surface, and the second surface, the third surface and the reflective surface surround to form a triangular prism structure; The first area of ​​the second surface includes a first light shielding portion and a first marking portion, the first light shielding portion surrounds the first marking portion, the first marking portion can transmit laser light, and the first light shielding portion cannot transmit laser light, and the first area includes a laser irradiation area of ​​the laser emitter; The second area of ​​the third surface includes a second light shielding portion and a second marking portion, the second light shielding portion surrounds the second marking portion, the second marking portion can transmit the laser, and the second light shielding portion cannot transmit the laser; The first marking portion and the second marking portion are axially symmetrically distributed along the reflection axis of the reflection surface, and the first area and the second area are axially symmetrically distributed along the reflection axis of the reflection surface.

9. An electronic device, characterized in that: Comprising a camera module as described in any one of claims 1 to 8.

10. The electronic device according to claim 9, characterized in that: Also includes: Controller; The controller is in communication connection with the laser emitter, the controller is used to send a first signal to the laser emitter, and the laser emitter is used to adjust at least one of the time, frequency and emission power of the laser emitter according to the first signal; When the camera module also includes a laser receiver, the controller is also communicatively connected to the laser receiver, and the laser receiver is used to send a second signal to the controller when receiving the laser, so that the controller determines whether the target component and the light hole are located on the same optical axis based on the second signal.

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