Production process of aluminum-based copper-clad aluminum foil circuit board

Abstract

The invention provides a production process of an aluminum-based copper-clad aluminum foil circuit board, which relates to the technical field of circuit board processing, and is characterized by comprising the following steps: step 1, coating a substrate of a circuit board with thermosetting resin, and then performing press fit processing; step 2, cleaning the surface after the press-fit processing is completed, and coating UV ink or non-vulcanized resin adhesive for photocuring treatment; step 3, soaking the circuit board processed in the step 2 in alkali liquor, zinc liquor, nickel liquor and copper liquor; 4, the circuit board processed in the step 3 is cleaned and then dried, and residual water on the surface is removed; step 5, uniformly smearing solder paste on the surface of the to-be-processed position of the circuit board dried in the step 4, and melting and heating to enable the solder paste to be fully bonded with the circuit board; and step 6, cooling the circuit board which is heated and fused in the step 5, and then packaging and storing the circuit board. The method has the advantages that the circuit board processing technology can be simplified, the processing efficiency is improved, and the environmental pollution is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, and in particular to a production process of an aluminum-based copper-clad aluminum foil circuit board. Background Art

[0002] The current production process of circuit boards has also made great progress with the development of materials science. By combining the reasonable ratio of aluminum and copper materials, the weight of the device can be greatly reduced while ensuring the normal connection and operation of the circuit. At the same time, the heat can be fully dissipated during operation to ensure the stable operation of the device. However, the existing processing technology often produces greater pollution, and there are also more heavy metal substances in the production wastewater. If not properly handled, it will cause serious environmental pollution and cannot meet the current actual use needs. Summary of the invention

[0003] The purpose of the present invention is to provide a production process for aluminum-based copper-clad aluminum foil circuit boards, which solves the technical problems in the prior art that the production process is complicated and easily generates more pollution, and achieves the technical effect of simplifying the production process steps and reducing production pollution.

[0004] In order to achieve the above-mentioned object of the invention, the technical solution adopted by the present invention is:

[0005] A production process for an aluminum-based copper-clad aluminum foil circuit board comprises the following steps: step 1, applying a thermosetting resin to the surface of a circuit board substrate, and then laminating the aluminum substrate, the aluminum foil and the copper foil;

[0006] Step 2: After the pressing process is completed, the surface is cleaned and UV ink or non-sulfurized resin glue is applied on the surface of the circuit board for light curing;

[0007] Step 3, soaking the circuit board processed in step 2 in alkali solution, zinc solution, nickel solution and copper solution;

[0008] Step 4: Clean and dry the circuit board processed in step 3 to remove residual moisture on the surface;

[0009] Step 5, evenly apply solder paste on the surface of the circuit board to be processed after drying in step 4, and melt and heat it to make the solder paste fully adhere to the circuit board;

[0010] Step 6: Cool the circuit board that has been heated and fused in step 5, and then package and store it.

[0011] As an improvement, in step 1, the thickness of the thermosetting resin is 170 to 220 μm.

[0012] As an improvement, in the step 3, the temperature of the alkali solution is 50°C to 56°C, and the immersion time is 20 seconds; the temperature of the zinc solution is 30°C to 32°C, and the immersion time is 20 seconds; the temperature of the nickel solution is 40°C to 45°C, and the immersion time is 3 minutes; the temperature of the copper solution is 70°C to 75°C, and the immersion time is 5 minutes.

[0013] As an improvement, the soaking in step 3 needs to be completely rinsed with clean water before being transferred to other soaking pools for soaking.

[0014] As an improvement, the tin content of the solder paste in step 5 is 50%, and the melting heating temperature is 180°C to 210°C.

[0015] The beneficial effects of the present invention are as follows: by performing pre-treatment processes such as coating on the surface of the circuit board, the shaping and use of the circuit board as a whole is facilitated, and the subsequent solution immersion process is also facilitated. By immersing the circuit board in alkaline solution, zinc solution, nickel solution and copper solution respectively, the subsequent processing is further facilitated, and at the same time, the waste of heavy metal solution can be greatly reduced, and environmental pollution can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The present invention is a flow chart of a production process of an aluminum-based copper-clad aluminum foil circuit board. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0018] It should be noted that the terms "first" and "second" in this application are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0019] like Figure 1As shown, a production process of aluminum-based copper-clad aluminum foil circuit board includes the following steps: step 1, applying thermosetting resin to the surface of the circuit board substrate, and then laminating the aluminum substrate, aluminum foil and copper foil; step 2, cleaning the surface after the laminating process, and applying UV ink or non-sulfurized resin glue on the surface of the circuit board for light curing; step 3, soaking the circuit board processed in step 2 in alkali solution, zinc solution, nickel solution and copper solution; step 4, washing and drying the circuit board processed in step 3 to remove residual moisture on the surface; step 5, evenly applying solder paste on the surface of the processing position of the circuit board dried in step 4, and melting and heating to make the solder paste fully bonded to the circuit board; step 6, cooling the circuit board heated and fused in step 5, and then packaging and storing. The circuit board substrate can be processed using a preset plate, and the corresponding pad and processing space are reserved.

[0020] The thickness of the thermosetting resin in step 1 is 170 to 220 μm. In step 3, the temperature of the alkali solution is 50°C to 56°C, and the immersion time is 20 seconds. The temperature of the zinc solution is 30°C to 32°C, and the immersion time is 20 seconds. The temperature of the nickel solution is 40°C to 45°C, and the immersion time is 3 minutes. The temperature of the copper solution is 70°C to 75°C, and the immersion time is 5 minutes. The immersion in step 3 needs to be completely rinsed with clean water before transferring to other immersion pools for immersion. In step 5, the tin content of the solder paste is 50%, and the melting heating temperature is 180°C to 210°C. The clean water used in step 3 is distilled water, and the temperature of the water is 10°C to 20°C. When cleaning, the material temperature needs to be fully reduced before processing.

[0021] When in use, the circuit board is processed and then pressed. In this process, it is necessary to ensure that the processing positions of each material are aligned and set, and then fixed processing is performed. The circuit board is then placed in alkaline solution, zinc solution, nickel solution and copper solution in turn for full immersion. During the immersion process, the operator needs to observe the temperature of the immersion solution to ensure that each solution is within the preset temperature range. Then, it is fully cleaned and dried to ensure that there is no residual moisture on the surface of the circuit board. Then, the corresponding solder paste is applied to the surface of the circuit board and heated to melt so that it can be fully combined in the pad. After completion, it is placed to cool and packaged.

[0022] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A production process for aluminum-based copper-clad aluminum foil circuit boards, characterized in that: The following steps are involved: Step 1: Apply thermosetting resin to the surface of the circuit board substrate, and then press the aluminum substrate, aluminum foil and copper foil together; Step 2: After the pressing process is completed, the surface is cleaned and UV ink or non-sulfurized resin glue is applied on the surface of the circuit board for light curing; Step 3, soaking the circuit board processed in step 2 in alkali solution, zinc solution, nickel solution and copper solution; Step 4: Clean and dry the circuit board processed in step 3 to remove residual moisture on the surface; Step 5, evenly apply solder paste on the surface of the circuit board to be processed after drying in step 4, and melt and heat it to make the solder paste fully adhere to the circuit board; Step 6: Cool the circuit board that has been heated and fused in step 5, and then package and store it.

2. The production process of an aluminum-based copper-clad aluminum foil circuit board according to claim 1, characterized in that: The thickness of the thermosetting resin in step 1 is 170 to 220 μm.

3. The production process of an aluminum-based copper-clad aluminum foil circuit board according to claim 1, characterized in that: In the step 3, the temperature of the alkali solution is 50°C to 56°C, and the immersion time is 20 seconds; the temperature of the zinc solution is 30°C to 32°C, and the immersion time is 20 seconds; the temperature of the nickel solution is 40°C to 45°C, and the immersion time is 3 minutes; the temperature of the copper solution is 70°C to 75°C, and the immersion time is 5 minutes.

4. The production process of an aluminum-based copper-clad aluminum foil circuit board according to claim 3, characterized in that: During the soaking in step 3, the samples need to be completely rinsed with clean water before being transferred to other soaking pools for soaking.

5. The production process of an aluminum-based copper-clad aluminum foil circuit board according to claim 1, characterized in that: The tin content of the solder paste in step 5 is 50%, and the melting heating temperature is 180° C. to 210° C.

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