Production method of thick copper glass substrate PCB (Printed Circuit Board) and thick copper glass substrate PCB

Abstract

The invention relates to the field of PCB production, and discloses a production method of a thick copper glass substrate PCB, and the method comprises the steps: removing a dry film formed by pasting the dry film for the first time in a second glass substrate, carrying out the titanium layer removal of the area where the dry film is pasted for the first time, and carrying out the first chemical polishing of the second glass substrate, and obtaining a third glass substrate; performing second dry film pasting and second pattern electroplating on a third glass substrate to increase the thickness of the copper layer of the first glass substrate by a third copper thickness to obtain a fourth glass substrate; and removing the dry film formed by pasting the dry film for the second time in the fourth glass substrate, and performing chemical polishing on the fourth glass substrate for the second time to obtain a fifth glass substrate. The production quality of the thick copper circuit pattern can be guaranteed, and the stability of the production quality of the glass substrate PCB with the thick copper layer is improved.

Description

Technical Field

[0001] The present application relates to the technical field of PCB board production, and more specifically, to a production method of a thick copper glass substrate PCB board and a thick copper glass substrate PCB board. Background Art

[0002] With the development of PCB production technology, the circuits on PCB are becoming more and more dense, the components are getting smaller and smaller, the requirements for the flatness of the PCB surface and the size precision of the PCB are becoming higher and higher, and the reliability of the component welding of the PCB is also required. Glass substrate PCB has inherent advantages in flatness and the size precision of PCB boards, and the glass substrate PCB has high stability during the processing process, and the service life of glass substrate PCB can reach 20-30 years.

[0003] In the production process of glass substrate PCB, the glass substrate is often provided with a metal titanium layer to improve the bonding force between the copper layer and the glass substrate, and then the metal titanium layer that is not needed to be retained needs to be removed from the glass substrate. In the production process of glass substrate PCB, it is also necessary to design a conductive circuit and a component welding PAD on the surface of the glass substrate PCB, and the copper thickness of the conductive circuit and the component welding pad (welding PAD) must meet certain thickness requirements. In the existing production process of glass substrate PCB, the production quality of thick copper circuit patterns cannot be guaranteed, resulting in unstable production quality of glass substrate PCB with thick copper layer. Summary of the invention

[0004] The purpose of the present application is to provide a production method of a thick copper glass substrate PCB board and a thick copper glass substrate PCB board, which solves the technical problem that the production quality of thick copper circuit graphics cannot be guaranteed, and achieves the technical effect of being able to ensure the production quality of thick copper circuit graphics.

[0005] The present application provides a method for producing a thick copper glass substrate PCB board, the method comprising: performing whole-plate copper electroplating on an original glass substrate to increase the copper thickness by a first copper thickness to obtain a first glass substrate; wherein the original glass substrate is covered with a titanium layer; performing a first dry film application and a first pattern electroplating on the first glass substrate to increase the copper layer thickness of the first glass substrate by a second copper thickness to obtain a second glass substrate; removing the dry film formed by the first dry film application in the second glass substrate, removing the titanium layer from the area where the first dry film application is performed, and performing a first chemical polishing on the second glass substrate to obtain a third glass substrate; performing a second dry film application and a second pattern electroplating on the third glass substrate to increase the copper layer thickness of the first glass substrate by a third copper thickness to obtain a fourth glass substrate; removing the dry film formed by the second dry film application in the fourth glass substrate, and performing a second chemical polishing on the fourth glass substrate to obtain a fifth glass substrate; performing solder masking, ink curing, characterization, surface treatment, molding and testing on the fifth glass substrate to obtain a finished thick copper glass substrate PCB board.

[0006] In a possible implementation, performing a first chemical polishing on the second glass substrate includes: acquiring a second glass substrate image of the second glass substrate, determining a defective area of ​​a first pattern electroplating on the second glass substrate image; and determining a first solution concentration value for chemical polishing the second glass substrate according to the defective area of ​​the first pattern electroplating.

[0007] In another possible implementation, performing a second chemical polishing on the fourth glass substrate includes: acquiring a fourth glass substrate image of the fourth glass substrate, determining a defective area of ​​the second pattern electroplating on the fourth glass substrate image; and determining a second solution concentration value for chemical polishing the fourth glass substrate according to the defective area of ​​the second pattern electroplating.

[0008] In another possible implementation, the method also includes: determining a target defect area where the defect area of ​​the first pattern electroplating and the defect area of ​​the second pattern electroplating overlap; when the area of ​​the target defect area is larger than a preset area value, determining the second solution concentration value to be 3 to 5 times the first solution concentration value.

[0009] In another possible implementation, the method also includes: determining a first quantity value of the defective area of ​​the first graphic electroplating and a second quantity value of the defective area of ​​the second graphic electroplating; when the first quantity value is less than a preset quantity value, determining a quantity ratio of the second quantity value to the first quantity value, and taking the product of the first solution concentration value and the quantity ratio as the second solution concentration value.

[0010] In another possible implementation, the method also includes: when the first quantity value is greater than the preset quantity value, and the second quantity value is greater than the preset quantity value, increasing the first medicine concentration value by a first proportional value, and increasing the second medicine concentration value by a second proportional value; wherein the second proportional value is 2 to 3 times the first proportional value.

[0011] In another possible implementation, performing solder resist on the fifth glass substrate includes: performing solder resist on the fifth glass substrate multiple times so that the height of the solder resist layer in the area where the dry film is applied for the second time is flush with the height of the copper layer of the circuit pattern.

[0012] In another possible implementation, performing solder resist on the fifth glass substrate for multiple times includes: performing high temperature strengthening on the glass substrate when performing high temperature curing on the multiple solder resist layers.

[0013] In another possible implementation, the copper thickness of the circuit pattern of the thick copper glass substrate PCB board is 2 oz to 5 oz.

[0014] The embodiment of the present application also provides a thick copper glass substrate PCB board, which is produced using the production method of the thick copper glass substrate PCB board as described above.

[0015] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0016] The embodiment of the present application provides a production method of a thick copper glass substrate PCB board, and the method comprises: performing whole-plate copper electroplating on an original glass substrate to increase the copper thickness by a first copper thickness to obtain a first glass substrate; wherein the original glass substrate is covered with a titanium layer; performing a first dry film application and a first pattern electroplating on the first glass substrate to increase the copper layer thickness of the first glass substrate by a second copper thickness to obtain a second glass substrate; removing the dry film formed by the first dry film application in the second glass substrate, removing the titanium layer from the area where the first dry film application is performed, and performing a first chemical polishing on the second glass substrate to obtain a third glass substrate; performing a second dry film application and a second pattern electroplating on the third glass substrate to increase the copper layer thickness of the first glass substrate by a third copper thickness to obtain a fourth glass substrate; removing the dry film formed by the second dry film application in the fourth glass substrate, and performing a second chemical polishing on the fourth glass substrate to obtain a fifth glass substrate; performing solder masking, ink curing, characterization, surface treatment, molding and testing on the fifth glass substrate to obtain a finished thick copper glass substrate PCB board. The thick copper glass substrate PCB board in the embodiment of the present application can improve the stability of the circuit pattern quality of the circuit pattern of the thick copper glass substrate PCB board by performing quality inspection on the circuit pattern of multiple pattern electroplating. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] Figure 1 A schematic diagram of a process for producing a thick copper glass substrate PCB board provided in an embodiment of the present application;

[0019] Figure 2 This is a defect image of a circuit pattern on a glass substrate in an example of the present application. DETAILED DESCRIPTION

[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0021] It should be noted that when a component or structure is referred to as being "fixed to" or "disposed on" another component or structure, it may be directly on the other component or structure or indirectly on the other component or structure. When a component or structure is referred to as being "connected to" another component or structure, it may be directly connected to the other component or structure or indirectly connected to the other component or structure.

[0022] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or a component or structure referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0023] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0024] In the existing production process of glass substrate PCB boards, the production quality of thick copper circuit patterns cannot be guaranteed, resulting in unstable production quality of glass substrate PCB boards with thicker copper layers.

[0025] Based on the above reasons, an embodiment of the present application provides a production method for a thick copper glass substrate PCB board, and the method includes: performing whole-board copper electroplating on an original glass substrate to increase the copper thickness by a first copper thickness to obtain a first glass substrate; wherein the original glass substrate is covered with a titanium layer; performing a first dry film application and a first pattern electroplating on the first glass substrate to increase the copper layer thickness of the first glass substrate by a second copper thickness to obtain a second glass substrate; removing the dry film formed by the first dry film application in the second glass substrate, removing the titanium layer from the area where the first dry film application is performed, and performing a first chemical polishing on the second glass substrate to obtain a third glass substrate; performing a second dry film application and a second pattern electroplating on the third glass substrate to increase the copper layer thickness of the first glass substrate by a third copper thickness to obtain a fourth glass substrate; removing the dry film formed by the second dry film application in the fourth glass substrate, and performing a second chemical polishing on the fourth glass substrate to obtain a fifth glass substrate; performing solder masking, ink curing, characterization, surface treatment, molding and testing on the fifth glass substrate to obtain a finished thick copper glass substrate PCB board. The thick copper glass substrate PCB board in the embodiment of the present application can improve the stability of the circuit pattern quality of the circuit pattern of the thick copper glass substrate PCB board by performing quality inspection on the circuit pattern of multiple pattern electroplating.

[0026] In some scenarios, a production method of a thick copper glass substrate PCB board in an embodiment of the present application can be applied to the production of thick copper glass substrate PCB boards, which can improve the production quality of circuit graphics on the thick copper glass substrate PCB boards and improve the stability of the production quality of the thick copper glass substrate PCB boards.

[0027] The following is a specific example of a method for producing a thick copper glass substrate PCB board provided in an embodiment of the present application.

[0028] Figure 1 A schematic diagram of a process for producing a thick copper glass substrate PCB board provided in an embodiment of the present application is shown in FIG. Figure 1 As shown, the method includes S110 to S160, and S110 to S160 are described in detail below.

[0029] S110, performing copper electroplating on the original glass substrate to increase the copper thickness by a first copper thickness, thereby obtaining a first glass substrate, wherein the original glass substrate is covered with a titanium layer.

[0030] When producing a thick copper glass substrate, the raw material can be a glass substrate with a titanium layer on the surface as an original glass substrate, and then a circuit pattern is processed on the original glass substrate, and the entire plate is copper plated on the original glass substrate to increase the copper thickness to a first copper thickness, thereby obtaining a first glass substrate.

[0031] During production, in order to produce the first copper layer on the glass substrate, the entire glass substrate can be electroplated with copper to increase the copper thickness by the first copper thickness, thereby obtaining a first glass substrate. The first glass substrate is completely covered with a copper layer of the first copper thickness, and then a circuit pattern can be processed on the copper layer of the first copper thickness.

[0032] S120, performing a first dry film lamination and a first pattern electroplating on the first glass substrate, so that the copper layer thickness of the first glass substrate increases by a second copper thickness, and obtaining a second glass substrate.

[0033] When processing circuit patterns, the first dry film pasting and the first pattern electroplating can be performed on the first glass substrate. The first dry film pasting is used for film pasting, exposure, and development on the first glass substrate. Then, the first pattern electroplating can be performed to increase the second copper thickness on the copper layer of the first glass substrate to obtain a second glass substrate. The copper thickness on the second glass substrate is greater than the copper thickness on the first glass substrate.

[0034] S130, removing the dry film formed by the first dry film application on the second glass substrate, removing the titanium layer from the area where the dry film was applied for the first time, and performing a first chemical polishing on the second glass substrate to obtain a third glass substrate.

[0035] During processing, in order to remove the titanium layer, the dry film formed by the first dry film application in the second glass substrate can be further removed, and the titanium layer can be removed from the area where the dry film was applied for the first time to obtain a third glass substrate.

[0036] During production, after removing the titanium layer from the area where the dry film is first applied, the second glass substrate can be chemically polished for the first time, which helps to remove the titanium layer residue on the surface and smooth the copper layer surface to improve the flatness and finish of the circuit.

[0037] S140, performing a second dry film lamination and a second pattern electroplating on the third glass substrate, so that the copper layer thickness of the third glass substrate increases by a third copper thickness, thereby obtaining a fourth glass substrate.

[0038] During production, in order to increase the copper thickness, a second dry film lamination and a second pattern electroplating can be further performed on the third glass substrate to increase the copper layer thickness of the third glass substrate by a third copper thickness, thereby obtaining a fourth glass substrate, wherein the copper thickness on the fourth glass substrate is greater than the copper thickness on the third glass substrate.

[0039] S150, removing the dry film formed by the second dry film lamination on the fourth glass substrate, and performing a second chemical polishing on the fourth glass substrate to obtain a fifth glass substrate.

[0040] During production, the dry film formed by the second dry film pasting in the fourth glass substrate can be removed, and the fourth glass substrate is subjected to a second chemical polishing. The second chemical polishing can ensure the production quality of the PCB board after the second pattern electroplating and the production quality of the circuit pattern on the glass substrate, thereby obtaining a fifth glass substrate.

[0041] S160, performing solder masking, ink curing, characterization, surface treatment, molding and testing on the fifth glass substrate to obtain a finished thick copper glass substrate PCB board.

[0042] After the fifth glass substrate is obtained, the fifth glass substrate can be subjected to solder resist, ink curing, characterization, surface treatment, molding and testing to obtain a finished thick copper glass substrate PCB board.

[0043] The beneficial effect brought by the above implementation method is that the thick copper circuit pattern on the thick copper glass substrate PCB is produced through multiple pattern electroplating. In the process of electroplating the thick copper circuit pattern, the quality of each pattern electroplating can be improved by electroplating polishing, thereby improving the production quality of the thick copper glass substrate PCB.

[0044] In some implementations, in the above S130, the second glass substrate is subjected to a first chemical polishing, including S131 to S132, and S131 to S132 are described in detail below.

[0045] S131, acquiring a second glass substrate image of a second glass substrate, and determining a defective area of ​​the first pattern electroplating on the second glass substrate image.

[0046] During chemical polishing, a second glass substrate image of the second glass substrate can be obtained, and then the defective area of ​​the first pattern electroplating on the second glass substrate image can be determined through an image recognition algorithm, and then the chemical polishing process can be controlled according to the defective area of ​​the first pattern electroplating.

[0047] Figure 2 This is a defect image of a circuit pattern on a glass substrate in an example of the present application, such as Figure 2 As shown, there are defects in the circuit pattern and the image electroplating process on the second glass substrate image.

[0048] S132, determining a first solution concentration value for chemically polishing the second glass substrate according to the defective area of ​​the first pattern electroplating.

[0049] When chemical polishing is performed, the concentration value of the first solution for chemical polishing the second glass substrate can be determined by empirical values ​​according to the defective area of ​​the first pattern electroplating.

[0050] The beneficial effect brought by the above implementation method is that the first chemical solution concentration value for chemical polishing of the second glass substrate is determined by the defective area of ​​the first pattern electroplating, so that the effect of chemical polishing of the second glass substrate can be improved.

[0051] In some implementations, in the above S150, the fourth glass substrate is subjected to a second chemical polishing, including S151 to S152, and S151 to S152 are described in detail below.

[0052] S151, acquiring a fourth glass substrate image of a fourth glass substrate, and determining a defective area of ​​the second pattern electroplating on the fourth glass substrate image.

[0053] When performing the second chemical polishing, similarly, a fourth glass substrate image of the fourth glass substrate can be obtained, a defective area of ​​the second pattern plating on the fourth glass substrate image can be determined, and chemical polishing parameters can be determined according to the defective area of ​​the second pattern plating.

[0054] S152, determining a second solution concentration value for chemically polishing the fourth glass substrate according to the defective area of ​​the second pattern electroplating.

[0055] When performing the second chemical polishing, the concentration value of the second solution for chemically polishing the fourth glass substrate can be determined by empirical values ​​according to the defective area of ​​the second pattern electroplating.

[0056] The beneficial effect brought by the above implementation is that the concentration value of the second chemical solution for chemically polishing the fourth glass substrate is determined by the defective area of ​​the second pattern electroplating, so that the effect of chemical polishing the fourth glass substrate can be improved.

[0057] In some implementations, the above method further includes S210 to S220, and S210 to S220 are described in detail below.

[0058] S210, determining a target defect region where a defect region of the first pattern electroplating process overlaps with a defect region of the second pattern electroplating process.

[0059] When chemical polishing is performed, a target defect area where the defect area of ​​the first pattern electroplating overlaps with the defect area of ​​the second pattern electroplating can be determined, and then the concentration of the chemical solution in the chemical polishing process can be controlled according to the target defect area.

[0060] Exemplarily, when determining the target defect area, the defect area of ​​the first pattern electroplating and the defect area of ​​the second pattern electroplating can be stored and recorded. After image registration, the overlapping area of ​​the defect area of ​​the first pattern electroplating and the defect area of ​​the second pattern electroplating can be calculated to obtain the target defect area.

[0061] S220. When the area of ​​the target defect region is greater than the preset area value, the concentration value of the second chemical solution is determined to be 3 to 5 times the concentration value of the first chemical solution.

[0062] When the area of ​​the target defective region is larger than the preset area value, it means that the first chemical polishing did not effectively polish the defective region of the first pattern electroplating. At this time, the second chemical solution concentration value can be determined to be 3 to 5 times the first chemical solution concentration value, so as to polish the defective region of the first pattern electroplating that was not effectively repaired by the first chemical polishing during the second chemical polishing.

[0063] The beneficial effect brought about by the above implementation method is that by calculating the overlapping area of ​​the defective area of ​​the first pattern electroplating and the defective area of ​​the second pattern electroplating, the defective area of ​​the first pattern electroplating that was not effectively repaired by the first chemical polishing can be polished during the second chemical polishing, thereby improving the production quality of the PCB board.

[0064] In some implementations, the above method further includes S310 to S320, and S310 to S320 are described in detail below.

[0065] S310, determining a first quantity value of defective areas in the first pattern electroplating and a second quantity value of defective areas in the second pattern electroplating.

[0066] When adjusting the concentration of the chemical solution during chemical polishing, the first quantity value of the defective area of ​​the first pattern electroplating and the second quantity value of the defective area of ​​the second pattern electroplating can be determined, and the concentration of the chemical solution during chemical polishing can be scientifically adjusted according to the number of defects to improve the quality of chemical polishing.

[0067] S320: When the first quantity value is less than the preset quantity value, determine a quantity ratio of the second quantity value to the first quantity value, and use the product of the first medicine concentration value and the quantity ratio as the second medicine concentration value.

[0068] When the first quantity value is less than the preset quantity value, it indicates that the number of defective areas of the first circuit pattern is within a reasonable range, and at this time, there is no need to adjust the concentration of the chemical solution during the first chemical polishing.

[0069] When adjusting the solution concentration value during the second chemical polishing, the quantity ratio of the second quantity value to the first quantity value can be determined, and the product of the first solution concentration value and the quantity ratio can be used as the second solution concentration value, so that the second solution concentration value can be within a suitable concentration range for the second chemical polishing.

[0070] Exemplarily, the first quantity value may be the number of defective regions within a unit area.

[0071] The beneficial effect brought by the above implementation method is that when the number of defective areas of the first circuit pattern is within a reasonable range, only the concentration value of the second chemical solution is adjusted so that the concentration value of the second chemical solution can be within an appropriate concentration range for the second chemical polishing.

[0072] In some implementations, the method further includes: when the first quantity value is greater than a preset quantity value and the second quantity value is greater than a preset quantity value, increasing the first medicine solution concentration value by a first proportional value and increasing the second medicine solution concentration value by a second proportional value, wherein the second proportional value is 2 to 3 times the first proportional value.

[0073] When the first quantity value is greater than the preset quantity value, it indicates that the number of defective areas of the first circuit pattern is not within a reasonable range. In this case, the concentration of the chemical solution needs to be adjusted during the first chemical polishing.

[0074] When the second quantity value is greater than the preset quantity value, it indicates that the number of defective areas of the second circuit pattern is not within a reasonable range. In this case, the concentration of the chemical solution needs to be adjusted during the second chemical polishing.

[0075] Since it is necessary to adjust the concentration of the solution during the first chemical polishing and the concentration of the solution during the second chemical polishing at the same time, the first solution concentration value can be increased by a first proportional value, and the second solution concentration value can be increased by a second proportional value to ensure the polishing quality of defects during graphic electroplating.

[0076] Since the defects of the first and second pattern electroplating on the PCB board will be superimposed, when adjusting the concentration of the solution, the second ratio value can be set to 2 to 3 times the first ratio value, so that the defects of the circuit pattern can be repaired by a higher concentration of solution during the second chemical polishing.

[0077] The beneficial effect brought about by the above-mentioned implementation method is that when the number of defective areas of the first circuit pattern is not within a reasonable range and the number of defective areas of the second circuit pattern is not within a reasonable range, the concentration of the chemical solution is adjusted during the first chemical polishing and the concentration of the chemical solution is adjusted during the second chemical polishing, thereby ensuring the polishing quality of the circuit pattern.

[0078] The beneficial effect brought about by the above implementation method is that since the defects of the first and second pattern electroplating on the PCB board will be superimposed, when the concentration of the solution is adjusted, the defects of the circuit pattern can be repaired by a higher concentration of solution during the second chemical polishing.

[0079] In some implementations, the step of performing solder resist on the fifth glass substrate includes: performing solder resist on the fifth glass substrate multiple times so that the height of the solder resist layer in the area where the dry film is applied for the second time is flush with the height of the copper layer of the circuit pattern.

[0080] When in use, by performing solder masking on the fifth glass substrate multiple times, the height of the solder mask layer in the area where the dry film is applied for the second time can be made flush with the height of the copper layer of the circuit pattern, thereby ensuring the overall flatness of the PCB board.

[0081] In some implementations, performing solder resist on the fifth glass substrate multiple times includes: performing high temperature strengthening on the glass substrate when performing high temperature curing on the multiple solder resist layers.

[0082] During processing, the glass substrate can be strengthened at high temperature while the multi-layer solder resist layer is being cured at high temperature, thereby improving the overall strength of the PCB board and being able to improve the production efficiency of the PCB board.

[0083] In some implementations, the copper thickness of the circuit pattern of the thick copper glass substrate PCB is 2 oz to 5 oz, which can meet the copper thickness requirement of the thick copper PCB.

[0084] The present application also provides a thick copper glass substrate PCB board, which is produced by the above-mentioned thick copper glass substrate PCB board production method. The thick copper glass substrate PCB board provided by the present application can improve the production quality of thick copper glass substrate PCB boards.

[0085] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A method for producing a thick copper glass substrate PCB board, characterized in that: The method comprises: Performing whole-plate copper electroplating on the original glass substrate to increase the copper thickness by a first copper thickness, thereby obtaining a first glass substrate; wherein the original glass substrate is covered with a titanium layer; Performing a first dry film lamination and a first pattern electroplating on the first glass substrate, so that the copper layer thickness of the first glass substrate increases by a second copper thickness, thereby obtaining a second glass substrate; The dry film formed by the first dry film application in the second glass substrate is removed, the titanium layer is removed from the area where the dry film is applied for the first time, and the second glass substrate is chemically polished for the first time to obtain a third glass substrate; Performing a second dry film lamination and a second pattern electroplating on the third glass substrate, so that the copper layer thickness of the first glass substrate increases by a third copper thickness, thereby obtaining a fourth glass substrate; removing the dry film formed by the second dry film lamination on the fourth glass substrate, and performing a second chemical polishing on the fourth glass substrate to obtain a fifth glass substrate; The fifth glass substrate is subjected to solder resist, ink curing, characterization, surface treatment, molding and testing to obtain a finished thick copper glass substrate PCB board.

2. The method according to claim 1, characterized in that The second glass substrate is subjected to a first chemical polishing, comprising: Acquire a second glass substrate image of the second glass substrate, and determine a defective area of ​​the first pattern electroplating on the second glass substrate image; According to the defective area of ​​the first pattern electroplating, a concentration value of a first chemical solution for chemically polishing the second glass substrate is determined.

3. The method according to claim 2, characterized in that The fourth glass substrate is subjected to a second chemical polishing, comprising: Acquire a fourth glass substrate image of the fourth glass substrate, and determine a defective area of ​​the second pattern electroplating on the fourth glass substrate image; The concentration value of the second solution for chemically polishing the fourth glass substrate is determined according to the defective area of ​​the second pattern electroplating.

4. The method according to claim 3, characterized in that The method further comprises: Determine a target defect area where a defect area of ​​the first pattern electroplating overlaps with a defect area of ​​the second pattern electroplating; When the area of ​​the target defect region is greater than the preset area value, the second chemical solution concentration value is determined to be 3 to 5 times the first chemical solution concentration value.

5. The method according to claim 4, characterized in that The method further comprises: Determine a first quantity value of defective areas of a first pattern electroplating and a second quantity value of defective areas of a second pattern electroplating; When the first quantity value is less than the preset quantity value, a quantity ratio of the second quantity value to the first quantity value is determined, and a product of the first liquid medicine concentration value and the quantity ratio is used as the second liquid medicine concentration value.

6. The method according to claim 5, characterized in that The method further comprises: When the first quantity value is greater than the preset quantity value and the second quantity value is greater than the preset quantity value, the first medicine concentration value is increased by a first proportional value and the second medicine concentration value is increased by a second proportional value; wherein the second proportional value is 2 to 3 times the first proportional value.

7. The method according to claim 6, characterized in that Performing solder resist on the fifth glass substrate, comprising: The fifth glass substrate is subjected to multiple solder resists so that the height of the solder resist layer in the area where the dry film is applied for the second time is flush with the height of the copper layer of the circuit pattern.

8. The method according to claim 7, characterized in that The fifth glass substrate is subjected to multiple solder resist processes, including: high temperature strengthening of the glass substrate when the multiple solder resist layers are subjected to high temperature curing.

9. The method according to claim 8, characterized in that The copper thickness of the circuit pattern of the thick copper glass substrate PCB board is 2oz to 5oz.

10. A thick copper glass substrate PCB board, characterized in that: The thick copper glass substrate PCB board is produced by the production method of any one of claims 1 to 9.

Images