Thermosetting resin composition and molded article

Abstract

A thermosetting resin composition containing (A) a thermosetting resin, (B) an ethylenically unsaturated monomer, (C) a phosphate ester compound containing an ethylenically unsaturated group, (D) a low shrinkage agent, (E) an inorganic filler, and (F) a thermal polymerization initiator.

Description

Technical Field The present invention relates to a thermosetting resin composition, a molded product comprising a cured product of the thermosetting resin composition, a method for producing the molded product, an electric or electronic component, and a method for producing the electric or electronic component. Background Art In electronic devices such as motors, coils, and electronic control units installed in automobiles, etc., in order to protect wiring substrates and electronic components mounted on the wiring substrates, it is necessary to fix the components to prevent damage to the components due to vibration or to prevent the intrusion of water and corrosive gases. In this case, a structure in which the entire electronic component is sealed and fixed using a material called a sealing material is usually adopted. Prior art literature Patent Literature Patent Document 1: International Publication No. 2021 / 124626 Summary of the invention Problems to be solved by the invention At this time, if the adhesion of the sealing material is insufficient, gaps will be formed between the components and the sealing material due to the influence of external stresses such as heat and impact during molding, resulting in a reduction in the fixing function of the components, a reduction in the function of preventing the intrusion of water and corrosive gases, and a reduction in the heat dissipation function due to a reduction in thermal conductivity. An object of the present invention is to provide a thermosetting resin composition which can provide a cured product having excellent releasability from a mold and good adhesion to metal components. Means for solving problems The present invention includes the following aspects.

[0001] A thermosetting resin composition comprising: (A) Thermosetting resin, (B) an ethylenically unsaturated monomer, (C) a phosphoric acid ester compound containing an ethylenically unsaturated group, (D) Low shrinkage agent, (E) inorganic filler materials, and (F) Thermal polymerization initiator.

[0002] The thermosetting resin composition according to [1], wherein the (C) ethylenically unsaturated group-containing phosphate compound is one or more compounds selected from monoesters and diesters, and has one or two ethylenically unsaturated groups.

[0003] The thermosetting resin composition according to [1] or [2], wherein the content of the (C) ethylenically unsaturated group-containing phosphate compound is 0.1 to 70 parts by mass based on 100 parts by mass of the (A) thermosetting resin.

[0004] The thermosetting resin composition according to any one of [1] to [3], wherein the (C) ethylenically unsaturated group-containing phosphate compound is a phosphate having a (meth)acryloyloxy group.

[0005] The thermosetting resin composition according to any one of [1] to [4], wherein the (A) thermosetting resin is an unsaturated polyester resin.

[0006] The thermosetting resin composition according to any one of [1] to [5], further comprising (G) glass fibers.

[0007] The thermosetting resin composition according to any one of [1] to [6], further comprising (H) a release agent.

[0008] The thermosetting resin composition according to any one of [1] to [7], wherein With respect to 100 parts by mass of the (A) thermosetting resin, Contains 50 to 200 parts by mass of the (B) ethylenically unsaturated monomer, 0.1 to 70 parts by mass of the (C) phosphate compound containing an ethylenically unsaturated group, Contains 1 to 150 parts by weight of the (D) low shrinkage agent, Containing 80 to 1500 parts by mass of the (E) inorganic filler, The (F) thermal polymerization initiator is contained in an amount of 0.1 to 30 parts by mass.

[0009] A molded article comprising a cured product of the thermosetting resin composition according to any one of [1] to [8].

[0010] A method for producing a molded article, comprising the step of heating and pressurizing the thermosetting resin composition according to any one of [1] to [8] to cure the composition.

[0011] An electric or electronic component comprising a cured product of the thermosetting resin composition according to any one of [1] to [8].

[0012] A method for manufacturing an electrical and electronic component, comprising the following steps: A step of compression molding, transfer molding or injection molding the thermosetting resin composition according to any one of [1] to [8], and encapsulating components of an electric or electronic component therein; and A step of heating and curing the thermosetting resin composition. Effects of the Invention According to the present invention, a thermosetting resin composition can be provided, which can obtain a cured product having excellent mold release properties from a mold and particularly good adhesion to a metal component. In addition, a molded product comprising the cured product of the thermosetting resin composition and a method for producing the same, and an electric or electronic component comprising the cured product of the thermosetting resin composition and a method for producing the same can be provided. DETAILED DESCRIPTION Hereinafter, embodiments of the present invention will be described in detail. However, the present invention is not limited to the embodiments described below. In this specification, when "to" is used for a numerical range, the numerical values ​​at both ends are respectively an upper limit value and a lower limit value, and are included in the numerical range. In the present specification, “(meth)acrylic acid” means methacrylic acid or acrylic acid, “(meth)acrylate” means acrylate or methacrylate, and “(meth)acryloyloxy” means acryloyloxy or methacryloyloxy. In this specification, the term "thermosetting resin" refers to a resin that forms a cross-linked structure and cures when heated, and refers to a resin in a state before curing. In the present specification, the term “ethylenically unsaturated bond” refers to a double bond formed between carbon atoms other than carbon atoms forming an aromatic ring, and the term “ethylenically unsaturated monomer” refers to a monomer having an ethylenically unsaturated bond. In this specification, the “weight average molecular weight” and “number average molecular weight” are values ​​obtained by measuring at room temperature (23° C.) using a standard polystyrene calibration curve under the following conditions using gel permeation chromatography (GPC). Device: Shodex (trademark) GPC-101 (Showa Denko K.K.) Column: Shodex (trademark) LF-804 (Showa Denko K.K.) Column temperature: 40°C Sample: 0.2 mass% tetrahydrofuran solution of the sample Flow rate: 1mL / min Eluent: Tetrahydrofuran Detector: Shodex (trademark) RI-71S (Showa Denko K.K.) <Thermosetting resin composition> The thermosetting resin composition contains: (A) a thermosetting resin, (B) an ethylenically unsaturated monomer, (C) a phosphate compound containing an ethylenically unsaturated group, (D) a low shrinkage agent, (E) an inorganic filler, and (F) a thermal polymerization initiator. The thermosetting resin composition may further contain at least one selected from (G) glass fiber and (H) a release agent as needed. [(A) Thermosetting resin] (A) thermosetting resin is not particularly limited as long as it is a thermosetting resin commonly used for sealing material purposes. For example, it is preferably a resin having a functional group that can form a cross-linked structure when a thermosetting resin composition is made and heat-cured. In particular, from the viewpoint that (B) ethylenically unsaturated monomers and (C) phosphate compounds containing ethylenically unsaturated groups can react, it is preferably a resin having multiple ethylenically unsaturated groups as functional groups. As a specific example of (A) thermosetting resin, (A-1) unsaturated polyester resin, (A-2) vinyl ester resin, (A-3) carbamate (meth) acrylate resin, (A-4) diallyl phthalate resin, (A-5) epoxy resin, etc. can be cited. From the viewpoint of formability, fluidity, curing shrinkage and dispersibility of adhesion imparting agents, (A) thermosetting resin preferably includes at least (A-1) unsaturated polyester resin. (A) Thermosetting resin can be used alone or in combination of two or more. The (A) thermosetting resin preferably contains the (A-1) unsaturated polyester resin as an essential component from the viewpoints of moldability, fluidity, and cure shrinkage. In the present disclosure, when (A) the thermosetting resin also belongs to (C) the ethylenically unsaturated group-containing phosphate compound, it is handled as the (C) ethylenically unsaturated group-containing phosphate compound. <(A-1) Unsaturated polyester resin> The (A-1) unsaturated polyester resin is a polycondensate of a polyol and an unsaturated polybasic acid, or a polycondensate of a polyol, an unsaturated polybasic acid, and a saturated polybasic acid, and is not particularly limited. The unsaturated polyester resin (A-1) may be used alone or in combination of two or more. By using the unsaturated polyester resin (A-1), a cured product having excellent mechanical strength and heat resistance can be obtained. In addition, in this disclosure, the styrene monomer etc. contained in the commercially available unsaturated polyester resin are classified as (B) ethylenically unsaturated monomers. As long as the polyol is a compound having two or more hydroxyl groups, there is no particular limitation. As the polyol, for example, ethylene glycol, propylene glycol, butanediol, diethylene glycol, dipropylene glycol, triethylene glycol, pentanediol, hexanediol, neopentyl glycol, tetraethylene glycol, polyethylene glycol, 2-methyl-1,3-propanediol, 1,4-cyclohexanedimethanol, hydrogenated bisphenol A and other alkylene glycols; bisphenol A; bisphenol A; bisphenol A oxidized ethylene adducts, bisphenol A oxidized propylene adducts and other bisphenol A modified bisphenol A; glycerol, etc. From the viewpoint of the heat resistance and mechanical strength of the cured product, and the fluidity of the thermosetting resin composition during molding, propylene glycol, dipropylene glycol, neopentyl glycol, hydrogenated bisphenol A and bisphenol A are preferred, and propylene glycol and neopentyl glycol are more preferred. The polyol can be used alone or in combination of two or more. The unsaturated polyacid is not particularly limited as long as it is a compound having an ethylenically unsaturated bond and having two or more carboxyl groups or its anhydride, and known unsaturated polyacids can be used. In particular, unsaturated polyacids having 4 to 6 carbon atoms or their anhydrides are less expensive and can obtain a thermosetting resin composition with better mechanical strength and heat resistance of the cured product, so they are preferred. As unsaturated polyacids, for example, maleic acid, maleic anhydride, fumaric acid, citraconic acid, itaconic acid, chloromaleic acid, etc. can be cited. More preferably, it is an unsaturated polyacid selected from fumaric acid, maleic acid, maleic anhydride and itaconic acid. The unsaturated polyacid can be used alone or in combination of two or more. Preferred combinations of polyols and unsaturated polyacids include, for example, a combination of fumaric acid and neopentyl glycol, a combination of maleic acid and dipropylene glycol, a combination of maleic anhydride and propylene glycol, a combination of fumaric acid and propylene glycol, a combination of fumaric acid, hydrogenated bisphenol A and propylene glycol, a combination of maleic anhydride, propylene glycol and neopentyl glycol, etc. Combinations of fumaric acid and propylene glycol, a combination of fumaric acid, hydrogenated bisphenol A and propylene glycol, and a combination of maleic anhydride, propylene glycol and neopentyl glycol are preferred because they are lower in cost and can produce a thermosetting resin composition having a higher heat deformation temperature of a cured product and better mechanical strength and heat resistance. Saturated polyacids are not particularly limited as long as they are compounds or their anhydrides that do not have ethylenic unsaturated bonds and have more than two carboxyl groups, and known saturated polyacids can be used. As saturated polyacids, for example, aromatic saturated polyacids or their anhydrides such as phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, tetrachlorophthalic anhydride, tetrabromophthalic anhydride, nitrophthalic acid, and halogenated phthalic anhydride can be cited; aliphatic saturated polyacids such as succinic acid, adipic acid, sebacic acid, oxalic acid, malonic acid, azelaic acid, and glutaric acid; and cyclic aliphatic saturated polyacids such as hexahydrophthalic anhydride. Saturated polyacids can be used alone or in combination of two or more. The weight average molecular weight (Mw) of the (A-1) unsaturated polyester resin is not particularly limited. The weight average molecular weight of the (A-1) unsaturated polyester resin is preferably 2,000 to 50,000, more preferably 3,000 to 40,000, and even more preferably 3,500 to 30,000. When the weight average molecular weight is 2,000 to 50,000, the moldability of the thermosetting resin composition becomes better. The unsaturation degree of the unsaturated polyester resin (A-1) is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and further preferably 70 to 100 mol%. When the unsaturation degree is within the above range, the moldability of the thermosetting resin composition containing the unsaturated polyester resin (A-1) is further improved. (A-1) The unsaturation degree of the unsaturated polyester resin can be calculated from the following formula using the molar numbers of the unsaturated polybasic acid and the saturated polybasic acid used as raw materials. Unsaturation degree (mol %) = {(number of moles of unsaturated polyacid × number of ethylenically unsaturated bonds per molecule of unsaturated polyacid) / (number of moles of unsaturated polyacid + number of moles of saturated polyacid)} × 100 ((A-1) Synthesis method of unsaturated polyester resin) The unsaturated polyester resin (A-1) can be synthesized by a known method using the above-mentioned raw materials. Various conditions for synthesizing the unsaturated polyester resin (A-1) can be appropriately set according to the raw materials used and their amounts. Generally, the esterification reaction can be carried out under pressure or reduced pressure at a temperature of 140° C. to 230° C. in a stream of an inert gas such as nitrogen. In the esterification reaction, an esterification catalyst can be used as needed. Examples of the esterification catalyst include known catalysts such as manganese acetate, dibutyltin oxide, stannous oxalate, zinc acetate, and cobalt acetate. The esterification catalyst can be used alone or in combination of two or more. In addition, the unreacted unsaturated polybasic acid after the synthesis of the (A-1) unsaturated polyester resin is regarded as the (B) ethylenically unsaturated monomer mentioned later. In order to increase the molecular weight by increasing the reaction rate and improve the adhesiveness by reducing the acid value, the equivalent weight of the hydroxyl group of the polyol is preferably set to a range of 0.9 to 1.2 relative to the total amount of carboxyl groups of the unsaturated polybasic acid and any saturated polybasic acid. The unreacted unsaturated polybasic acid and any saturated polybasic acid after the synthesis of the unsaturated polyester resin (A-1) may not be removed but may remain in the thermosetting resin composition. The content of the unsaturated polyester resin (A-1) in the (A) thermosetting resin is preferably 75% by mass or more, more preferably 80% by mass or more, and further preferably 90% by mass or more. If the content of the unsaturated polyester resin (A-1) is 75% by mass or more, appropriate moldability, fluidity, curing shrinkage, and dispersibility of the adhesion-imparting agent can be ensured. The upper limit of the content of the unsaturated polyester resin (A-1) in the (A) thermosetting resin is not particularly limited. For example, it can be set to 100% by mass, 97% by mass, or 95% by mass. <(A-2) Vinyl Ester Resin> (A-2) Vinyl ester resin is a compound having an ethylenically unsaturated bond, and is generally obtained by a ring-opening reaction of (a) an epoxy group in an epoxy compound having two or more epoxy groups and (b) a carboxyl group in an unsaturated monobasic acid having an ethylenically unsaturated bond and a carboxyl group. (A-2) Vinyl ester resin is described in, for example, Polyester Resin Handbook (Nikkan Kogyo Shimbun, published in 1988) and the like. The (A-2) vinyl ester resin may be used alone or in combination of two or more. From the perspective of operation, the (A-2) vinyl ester resin is usually diluted with the (B) ethylenically unsaturated monomer before use. By using the (A-2) vinyl ester resin, the material cost of the thermosetting resin composition can be reduced, and a cured product with excellent adhesion can be obtained. The number average molecular weight (Mn) of the vinyl ester resin (A-2) can be adjusted according to desired physical properties, but is preferably in the range of 500 to 5,000 from the viewpoint of handling. ((a) Epoxide compounds) The (a) epoxy compound is not particularly limited as long as it is a compound having two or more epoxy groups. It is preferably at least one compound selected from bisphenol epoxy compounds and novolac phenol epoxy compounds, and more preferably a bisphenol epoxy compound. By using the (a) epoxy compound as a raw material (A-2) vinyl ester resin, the mechanical strength and corrosion resistance of the cured product are further improved. Examples of the bisphenol epoxy compound include a bisphenol epoxy compound obtained by reacting a bisphenol compound such as bisphenol A, bisphenol F, bisphenol S, and tetrabromobisphenol A with epichlorohydrin and / or methyl epichlorohydrin; a bisphenol epoxy compound obtained by reacting a condensate formed by glycidyl-etherifying any one or more of the above bisphenol compounds with epichlorohydrin and / or methyl epichlorohydrin, etc. From the viewpoint of durability, the reaction product of a bisphenol compound and epichlorohydrin is preferred, and the reaction product of bisphenol A and epichlorohydrin is more preferred. Examples of the novolac phenol-type epoxy compound include compounds obtained by reacting phenol novolac or cresol novolac with epichlorohydrin and / or methyl epichlorohydrin. ((b) Unsaturated monobasic acid) (b) The unsaturated monocarboxylic acid is not particularly limited as long as it is a monocarboxylic acid having an ethylenically unsaturated bond, and is preferably methacrylic acid, acrylic acid, crotonic acid, cinnamic acid, etc., more preferably acrylic acid or methacrylic acid, and further preferably methacrylic acid from the viewpoint of corrosion resistance of the cured product. ((A-2) Synthesis method of vinyl ester resin) (A-2) Vinyl ester resin can be synthesized by a known synthesis method. For example, the following method can be mentioned: in a reaction vessel capable of heating and stirring, (b) unsaturated monobasic acid is added in the presence of an esterification catalyst and (a) epoxy compound, and the mixture is reacted at a temperature of 70 to 150°C, preferably 80 to 140°C, and more preferably 90 to 130°C. In addition, the unreacted (b) unsaturated monobasic acid after the synthesis of the (A-2) vinyl ester resin is regarded as the (B) ethylenically unsaturated monomer described later. As the esterification catalyst, for example, known catalysts such as triethylamine, N,N-dimethylbenzylamine, N,N-dimethylaniline, and tertiary amines such as diazabicyclooctane, triphenylphosphine, and diethylamine hydrochloride can be used. Regarding the mixing ratio of (a) epoxy compound and (b) unsaturated monoacid, relative to the total amount of epoxy groups of (a) epoxy compound 1 mol, it is preferred to mix in a manner that the total amount of carboxyl groups of (b) unsaturated monoacid is 0.3 to 1.2 mol, more preferably 0.4 to 1.1 mol, and further preferably 0.5 to 1.0 mol. If the total amount of carboxyl groups of (b) unsaturated monoacid is 0.3 mol or more, when the thermosetting resin composition is cured, a cured product with sufficient hardness can be obtained. On the other hand, if the total amount of carboxyl groups of (b) unsaturated monoacid is 1.2 mol or less, when synthesizing (A-2) vinyl ester resin, unreacted (b) unsaturated monoacid can be reduced, so that a cured product with excellent mechanical strength can be obtained. Unreacted (b) unsaturated monoacid after synthesizing (A-2) vinyl ester resin can be used directly as (B) ethylenically unsaturated monomer of thermosetting resin composition without being removed. When thermosetting resin composition is heat cured, sometimes unreacted (b) unsaturated monoacid volatilizes or oozes out and affects the adhesion of cured product. Therefore, it is advisable to reduce the content of unreacted (b) unsaturated monoacid as much as possible. For example, relative to the total amount of (A-2) vinyl ester resin and unreacted (b) unsaturated monoacid, the content of unreacted (b) unsaturated monoacid is preferably below 5% by mass, more preferably below 3% by mass. The content of the vinyl ester resin (A-2) in the thermosetting resin (A) is preferably 1% by mass or more, more preferably 3% by mass or more, and further preferably 5% by mass or more. The upper limit of the content of the vinyl ester resin (A-2) in the thermosetting resin (A) is not particularly limited. For example, it can be set to 25% by mass, 20% by mass, or 10% by mass. <(A-3) Urethane (meth)acrylate resin> As the (A-3) urethane (meth)acrylate resin, for example, a resin obtained by introducing (meth)acryloyl groups into hydroxyl groups or isocyanate groups at both terminals of a polyurethane obtained by reacting a polyisocyanate with a polyol can be used. As the polyol, the compounds described as the raw materials of the above-mentioned (A-1) unsaturated polyester resin can be used without particular limitation. Examples of polyisocyanates include aliphatic polyisocyanates such as hexamethylene diisocyanate, lysine diisocyanate, lysine triisocyanate, and trimethylhexane diisocyanate; cyclic aliphatic polyisocyanates such as hydrogenated xylylene diisocyanate, isophorone diisocyanate, methylcyclohexane-2,4 (or 2,6)-diisocyanate, 4,4'-methylenebis(cyclohexyl isocyanate), and 1,3-(isocyanatomethyl)cyclohexane; aromatic polyisocyanates such as toluene diisocyanate, xylylene diisocyanate, diphenylmethane diisocyanate, naphthalene diisocyanate, and triphenylmethane triisocyanate; and adducts, isocyanurates, and biuret forms of these polyisocyanates. The polyisocyanates may be used alone or in combination of two or more. When introducing a (meth)acryloyl group, for example, a method of reacting a terminal isocyanate group with a (meth)acrylic compound containing a hydroxyl group, or a method of reacting a terminal hydroxyl group with an isocyanate group-containing (meth)acrylic compound such as 2-(meth)acryloyloxyethyl isocyanate, 2-(meth)acryloyloxypropyl isocyanate, or 1,1-bis(acryloyloxymethyl)ethyl isocyanate can be used. Examples of the (meth)acrylic acid compound containing a hydroxyl group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, caprolactone-modified hydroxyalkyl (meth)acrylate, polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, tri(hydroxyethyl)isocyanuric acid di(meth)acrylate, pentaerythritol tri(meth)acrylate, glycerol mono(meth)acrylate, and hydroxyethyl acrylamide, and preferably 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, caprolactone-modified hydroxyalkyl (meth)acrylate, and hydroxyethyl acrylamide. The (meth)acrylic acid compound containing an isocyanate group and the (meth)acrylic acid compound containing a hydroxyl group may be used alone or in combination of two or more. In addition, the unreacted hydroxyl group-containing (meth)acrylic compound or the unreacted isocyanate group-containing (meth)acrylic compound after synthesizing the (A-3) urethane (meth)acrylate resin is regarded as the (B) ethylenically unsaturated monomer described later. The content of the (A-3) urethane (meth) acrylate resin in the (A) thermosetting resin is preferably 1% by mass or more, more preferably 3% by mass or more, and further preferably 5% by mass or more. The upper limit of the content of the (A-3) urethane (meth) acrylate resin in the (A) thermosetting resin is not particularly limited. For example, it can be set to 25% by mass, 20% by mass, or 10% by mass. <(A-4) Diallyl Phthalate Resin> The diallyl phthalate resin (A-4) is an oligomer obtained by esterification reaction of diallyl phthalate and a polyol, and any known diallyl phthalate resin can be used without particular limitation. The diallyl phthalate resin (A-4) can be used alone or in combination of two or more. It should be noted that unreacted diallyl phthalate after synthesizing the (A-4) diallyl phthalate resin may not be removed but may exist in the thermosetting resin composition. Unreacted diallyl phthalate after synthesis of the diallyl phthalate resin (A-4) is regarded as the (B) ethylenically unsaturated monomer described later. The content of the diallyl phthalate resin (A-4) in the thermosetting resin (A) is preferably 1% by mass or more, more preferably 3% by mass or more, and further preferably 5% by mass or more. The upper limit of the content of the diallyl phthalate resin (A-4) in the thermosetting resin (A) is not particularly limited. For example, it can be set to 25%, 20% by mass, or 10% by mass. <(A-5) Epoxy resin> As the epoxy resin (A-5), the compounds described in the section (a) Epoxy compound can be used. The epoxy resin (A-5) can be used alone or in combination of two or more. The content of the epoxy resin (A-5) in the (A) thermosetting resin is preferably 1% by mass or more, more preferably 3% by mass or more, and further preferably 5% by mass or more. The upper limit of the content of the epoxy resin (A-5) in the (A) thermosetting resin is not particularly limited. For example, it can be set to 25% by mass, 20% by mass, or 10% by mass. [(B) Ethylenically unsaturated monomer] The (B) ethylenically unsaturated monomer is not particularly limited as long as it is a monomer having an ethylenically unsaturated bond that does not belong to the (C) ethylenically unsaturated group-containing phosphate compound described later. The (B) ethylenically unsaturated monomer may be used alone or in combination of two or more. Specifically, there can be mentioned vinyl compounds (compounds having a vinyl group) such as styrene, vinyltoluene, tert-butylstyrene, methoxystyrene, divinylbenzene, and vinylnaphthalene; methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, tert-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate, stearyl (meth)acrylate, cyclohexyl (meth)acrylate, furfuryl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, and (meth)acrylate. (Meth)acrylates such as phenyl (meth)acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, allyl (meth)acrylate, isobornyl (meth)acrylate, acetoacetoxyethyl (meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, tricyclodecanol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, and cyclic unsaturated compounds such as acenaphthylene and norbornene. From the viewpoint of copolymerizability with the (A) thermosetting resin, a vinyl compound is preferred, and one or more selected from styrene, vinyltoluene, tert-butylstyrene, and methoxystyrene is more preferred, and styrene is still more preferred. Relative to 100 parts by mass of (A) thermosetting resin, the content of (B) ethylenically unsaturated monomer is preferably 50 parts by mass or more, more preferably 70 parts by mass or more, and further preferably 90 parts by mass or more. Relative to 100 parts by mass of (A) thermosetting resin, the content of (B) ethylenically unsaturated monomer is preferably 200 parts by mass or less, more preferably 150 parts by mass or less, and further preferably 120 parts by mass or less. The combination of these lower limits and upper limits can be any combination. Relative to 100 parts by mass of (A) thermosetting resin, the content of (B) ethylenically unsaturated monomer is preferably 50 to 200 parts by mass, more preferably 70 to 150 parts by mass, and further preferably 90 to 120 parts by mass. If the content of (B) ethylenically unsaturated monomer is 50 parts by mass or more, the viscosity of the thermosetting resin composition can be adjusted to a suitable range, and the moldability is good. If the content of (B) ethylenically unsaturated monomer is 200 parts by mass or less, the mechanical strength of the cured product is good. [(C) Phosphate ester compound containing ethylenically unsaturated group] (C) The phosphate compound containing an ethylenically unsaturated group is not particularly limited as long as it is a compound having an ethylenically unsaturated group and a phosphate structure. By using (C) the phosphate compound containing an ethylenically unsaturated group, the adhesion of the cured product of the thermosetting resin composition to metal becomes good. (C) The phosphate compound containing an ethylenically unsaturated group can be obtained by, for example, esterifying a phosphorus compound such as phosphoric acid, polyphosphoric acid, phosphorus pentoxide, phosphorus oxychloride, and an organic compound having an ethylenically unsaturated group and having an alcoholic hydroxyl group or an epoxy group. Examples of the organic compound having an ethylenically unsaturated group and having an alcoholic hydroxyl group or an epoxy group include hydroxyalkyl (meth)acrylates such as hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, α-hydroxymethyl methacrylate, α-hydroxyethyl methacrylate, α-hydroxymethyl acrylate, n-butyl α-hydroxymethacrylate, and 2-ethylhexyl α-hydroxymethacrylate, and their oxyalkylene adducts, (meth)acrylates such as glycidyl (meth)acrylate and N-hydroxymethyl (meth)acrylamide; and unsaturated alcohols such as allyl alcohol, crotyl alcohol, and isocrotyl alcohol, and their oxyalkylene adducts. Among them, from the viewpoint of adhesive strength, hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, methyl α-hydroxymethacrylate, ethyl α-hydroxymethacrylate, n-butyl α-hydroxymethacrylate, 2-ethylhexyl α-hydroxymethacrylate and other hydroxyalkyl (meth)acrylates are preferred, and from the viewpoint of combination with other ethylenically unsaturated monomers that affect strength and dispersibility, hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate and 3-hydroxypropyl (meth)acrylate are more preferred. From the viewpoint of adhesion and dispersibility to resin, the phosphate compound (C) containing an ethylenically unsaturated group is one or more selected from a monoester and a diester, preferably a compound having 1 or 2 ethylenically unsaturated groups. From the viewpoint of adhesion and dispersibility to resin, the phosphate compound (C) containing an ethylenically unsaturated group is preferably a phosphate having a (meth)acryloyloxy group. Specific examples of such compounds include 2-(meth)acryloyloxyethyl acid phosphate, di[2-(meth)acryloyloxyethyl acid phosphate, and the like. Relative to 100 parts by mass of (A) thermosetting resin, the content of the phosphate compound containing an ethylenically unsaturated group (C) is preferably 0.1 parts by mass or more, more preferably 0.8 parts by mass or more, further preferably 1 parts by mass or more, and further preferably 5 parts by mass or more. Relative to 100 parts by mass of (A) thermosetting resin, the content of the phosphate compound containing an ethylenically unsaturated group (C) is preferably 70 parts by mass or less, more preferably 50 parts by mass or less, and further preferably 30 parts by mass or less. The combination of these lower limits and upper limits can be any combination. Relative to 100 parts by mass of (A) thermosetting resin, the content of the phosphate compound containing an ethylenically unsaturated group (C) is preferably 0.1 to 70 parts by mass, more preferably 0.8 to 50 parts by mass, further preferably 1 to 30 parts by mass, and further preferably 5 to 30 parts by mass. If the content of the phosphate compound containing an ethylenically unsaturated group (C) is 0.1 parts by mass or more, the cured product of the thermosetting resin composition has good adhesion to metal. When the content of the ethylenically unsaturated group-containing phosphoric acid ester compound (C) is 70 parts by mass or less, the releasability from a mold during molding will be good. [(D) Low shrinkage agent] The (D) low shrinkage agent is not particularly limited, and a low shrinkage agent known in the technical field of the present invention can be used. The (D) low shrinkage agent is preferably a thermoplastic resin. The (D) low shrinkage agent includes, for example, polystyrene, polyethylene, polymethyl methacrylate, polyvinyl acetate, saturated polyester, polycaprolactone, styrene-butadiene rubber, etc. The (D) low shrinkage agent can be used alone or in combination of two or more. Relative to 100 parts by mass of (A) thermosetting resin, the content of (D) low shrinkage agent is preferably 1 part by mass or more, more preferably 15 parts by mass or more, and further preferably 30 parts by mass or more. Relative to 100 parts by mass of (A) thermosetting resin, the content of (D) low shrinkage agent is preferably 150 parts by mass or less, more preferably 130 parts by mass or less, and further preferably 110 parts by mass or less. The combination of these lower limits and upper limits can be any combination. Relative to 100 parts by mass of (A) thermosetting resin, the content of (D) low shrinkage agent is preferably 1 to 150 parts by mass, more preferably 15 to 130 parts by mass, and further preferably 30 to 110 parts by mass. If the content of (D) low shrinkage agent is 1 part by mass or more, the shrinkage rate of the cured product becomes small, and the desired dimensional accuracy can be obtained in the molded body. If the content of (D) low shrinkage agent is 150 parts by mass or less, the moldability of the thermosetting resin composition and the mechanical properties of the cured product are better. [(E) Inorganic filler] As the (E) inorganic filler, a particulate material known in the technical field of the present invention can be used. By using the (E) inorganic filler, the molding shrinkage of the molded product can be reduced, the viscosity of the thermosetting resin composition can be adjusted to improve workability, or the strength of the molded product can be improved. As (E) inorganic filler, for example, calcium carbonate, silicon dioxide, aluminum oxide, aluminum hydroxide, barium sulfate, calcium sulfate, calcium hydroxide, calcium oxide, magnesium oxide, magnesium hydroxide, wollastonite, clay, kaolin, mica, gypsum, silicic anhydride, glass powder, etc. can be mentioned. Calcium carbonate, aluminum oxide and aluminum hydroxide are inexpensive and therefore are preferred. (E) Inorganic filler can be used alone or in combination of two or more. The average particle size of the (E) inorganic filler is preferably 1 to 100 μm, more preferably 1 to 60 μm, and further preferably 1 to 50 μm. If the average particle size of the (E) inorganic filler is 1 μm or more, the aggregation of particles can be suppressed. On the other hand, if the average particle size of the (E) inorganic filler is 100 μm or less, the moldability of the thermosetting resin composition is good. In this specification, the “average particle size” refers to the 50% particle size (D50) in the volume-based cumulative particle size distribution measured by a laser diffraction / scattering particle size distribution measuring apparatus (manufactured by Microtrac Bell Co., Ltd., FRA). The shape of the (E) inorganic filler is not particularly limited, and examples thereof include substantially spherical, ellipsoidal, scaly, and amorphous shapes. Relative to 100 parts by mass of (A) thermosetting resin, the amount of (E) inorganic filler is preferably 80 parts by mass or more, more preferably 200 parts by mass or more, and further preferably 500 parts by mass or more. Relative to 100 parts by mass of (A) thermosetting resin, the amount of (E) inorganic filler is preferably 1500 parts by mass or less, more preferably 1300 parts by mass or less, and further preferably 1200 parts by mass or less. The combination of these lower limits and upper limits can be any combination. Relative to 100 parts by mass of (A) thermosetting resin, the amount of (E) inorganic filler is preferably 80 to 1500 parts by mass, more preferably 200 to 1300 parts by mass, and further preferably 500 to 1200 parts by mass. If the amount of (E) inorganic filler is 80 parts by mass or more, the mechanical properties of the cured product are better. When the amount of the inorganic filler (E) is 1500 parts by mass or less, the inorganic filler (E) is more uniformly dispersed in the thermosetting resin composition, and a homogeneous molded product can be produced. [(F) Thermal polymerization initiator] (F) The thermal polymerization initiator is not particularly limited as long as it is a polymerization initiator that generates free radicals by heating, and examples thereof include organic peroxides such as diacyl peroxides, peroxyesters, hydroperoxides, dialkyl peroxides, ketone peroxides, peroxyketals, alkyl peresters, and percarbonates. As the (F) thermal polymerization initiator, among these peroxides, preferred are 1,1-di-tert-hexylperoxycyclohexane, tert-hexylperoxyisopropylcarbonate, tert-butylperoxyoctanoate, tert-butylperoxy-2-ethylhexanoate, tert-hexylperoxy-2-ethylhexanoate, tert-amylperoxy-2-ethylhexanoate, benzoyl peroxide, 1,1-di-tert-butylperoxy-3,3,5-trimethylcyclohexane, tert-butylperoxyisopropylcarbonate, tert-butylperoxybenzoate, diisopropylbenzene peroxide, and di-tert-butylperoxide. The (F) thermal polymerization initiator may be used alone or in combination of two or more. Relative to 100 parts by mass of the thermosetting resin (A), the amount of the thermopolymerization initiator (F) is preferably 0.1 parts by mass or more, more preferably 1 parts by mass or more, and further preferably 5 parts by mass or more. Relative to 100 parts by mass of the thermosetting resin (A), the amount of the thermopolymerization initiator (F) is preferably 30 parts by mass or less, more preferably 25 parts by mass or less, and further preferably 20 parts by mass or less. The combination of these lower limits and upper limits can be any combination. Relative to 100 parts by mass of the thermosetting resin (A), the amount of the thermopolymerization initiator (F) is preferably 0.1 to 30 parts by mass, more preferably 1 to 25 parts by mass, and further preferably 5 to 20 parts by mass. If the amount of the thermopolymerization initiator (F) is 0.1 parts by mass or more, the curing reaction during the molding of the thermosetting resin composition is carried out uniformly, and the physical properties and appearance of the cured product become good. If the amount of the thermopolymerization initiator (F) is 30 parts by mass or less, the storage stability of the thermosetting resin composition becomes good and the operability is improved. [(G) Glass fiber] The thermosetting resin composition may contain (G) glass fiber as required. The (G) glass fiber is not particularly limited as long as it is a fibrous material with an aspect ratio of 3 or more. Specific examples thereof include chopped strand glass and the like. The fiber length of the (G) glass fiber is preferably 20 mm or less, more preferably 10 mm or less, and further preferably 5 mm or less. If the fiber length is 20 mm or less, the thermosetting resin composition has good moldability and the appearance of the cured product is good. The fiber length is preferably 0.1 mm or more, more preferably 0.5 mm or more, and further preferably 1 mm or more. If the fiber length is 0.1 mm or more, the strength of the cured product is good. The average fiber diameter of the (G) glass fiber is preferably 3 to 100 μm, and more preferably 5 to 30 μm. The content of the glass fiber (G) is preferably 10 to 300 parts by mass, more preferably 50 to 250 parts by mass, and further preferably 80 to 210 parts by mass relative to 100 parts by mass of the (A) thermosetting resin. If the content of the glass fiber (G) is 10 parts by mass or more, the mechanical properties of the molded body obtained from the thermosetting resin composition are better. If the content of the glass fiber (G) is 300 parts by mass or less, the glass fiber (G) is more evenly dispersed in the thermosetting resin composition, and a homogeneous molded body can be manufactured. [(H) Release agent] The thermosetting resin composition may contain (H) a release agent as required. The (H) release agent is not particularly limited, and a release agent known in the technical field of the present invention can be used. Examples of the (H) release agent include stearic acid, oleic acid, zinc stearate, calcium stearate, aluminum stearate, magnesium stearate, stearamide, oleamide, silicone oil, synthetic wax, and the like. The (H) release agent may be used alone or in combination of two or more. The content of the (H) release agent when used is preferably 0.1 to 40 parts by mass, more preferably 5 to 30 parts by mass, and further preferably 8 to 25 parts by mass relative to 100 parts by mass of the (A) thermosetting resin. If the content of the (H) release agent is 0.1 parts by mass or more, the release property of the cured product during mold forming is good, and the productivity of the product becomes good. On the other hand, if the content of the (H) release agent is 40 parts by mass or less, the excessive release agent will not contaminate the surface of the cured product, and a cured product with good appearance can be obtained. [Other additives] The thermosetting resin composition may contain, in addition to the above components, components known in the technical field of the present invention such as viscosity modifiers such as tackifiers and viscosity reducers, colorants, polymerization inhibitors, and molding aids, within a range that does not inhibit the effects of the present invention. The thickener is a compound other than the (E) inorganic filler that exhibits a thickening effect, and an example thereof may be an isocyanate compound. The thickener may be used alone or in combination of two or more. The amount of the thickener added may be appropriately adjusted according to the operability and fluidity required for the thermosetting resin composition. Coloring agents can be used in cases such as the case of coloring the cured product. Examples of coloring agents include various dyes, inorganic pigments, and organic pigments. Coloring agents can be used alone or in combination of two or more. The amount of coloring agent added can be appropriately adjusted according to the desired degree of coloring of the cured product. Examples of polymerization inhibitors include hydroquinone, trimethylhydroquinone, p-benzoquinone, naphthoquinone, tert-butylhydroquinone, catechol, p-tert-butylcatechol, 2,6-di-tert-butyl-4-methylphenol, etc. The polymerization inhibitors may be used alone or in combination of two or more. The amount of the polymerization inhibitor added may be appropriately adjusted according to the storage environment, storage period, curing conditions, etc. of the thermosetting resin composition. <Method for producing thermosetting resin composition> The thermosetting resin composition can be produced by mixing (A) a thermosetting resin, (B) an ethylenically unsaturated monomer, (C) a phosphoric acid ester compound containing an ethylenically unsaturated group, (D) a low shrinkage agent, (E) an inorganic filler and (F) a thermal polymerization initiator, and optional components used as needed, namely (G) glass fiber, (H) a release agent and other additives. Examples of the mixing method include kneading. The kneading method is not particularly limited, and for example, a kneader, a disperser, a planetary mixer, etc. can be used. The kneading temperature is preferably 5°C to 50°C, more preferably 10 to 40°C. There is no particular restriction on the order of mixing the components when manufacturing the thermosetting resin composition. For example, if the other components are mixed after mixing the (A) thermosetting resin with a part or all of the (B) ethylenically unsaturated monomer, it is easy to obtain a thermosetting resin composition in which the components are fully dispersed or uniformly mixed, so it is preferred. At least a part of the (B) ethylenically unsaturated monomer can also be mixed with the (A) thermosetting resin in advance in a manner that functions as a solvent, a dispersion medium, etc. <Method for producing cured product> The thermosetting resin composition can be cured by heating. The conditions for curing the thermosetting resin composition can be appropriately set according to the materials used and the decomposition temperature of the (F) thermal polymerization initiator. As an example of preferred conditions, the temperature is 120 to 180°C, more preferably 120 to 160°C; and the curing time is 1 to 30 minutes. <Production method of molded products> The thermosetting resin composition can be molded into a desired shape and heated to produce a molded product containing a cured product of the thermosetting resin composition. There are no particular limitations on the molding and curing methods, and methods commonly used in the technical field of the present invention can be cited, such as compression molding, transfer molding, and injection molding. As a molding and curing method of a thermosetting resin composition, for example, a method of opening a mold, injecting a thermosetting resin composition into the mold and curing it; and a method of injecting a thermosetting resin composition from the outside into a closed mold through a hole provided in the mold such as a gate under reduced pressure or under a state where pressure is applied from the outside of the mold such as injection molding, and curing it. The conditions for curing the thermosetting resin composition in the mold can be appropriately set according to the material used. As an example of preferred conditions, the temperature is 120 to 180°C, more preferably 120 to 160°C; and the curing time is 1 to 30 minutes. In one embodiment, an electrical and electronic component may be provided, which includes a cured product of a thermosetting resin composition. The electrical and electronic component may be manufactured, for example, by encapsulating the components of the electrical and electronic component with a thermosetting resin composition and heat-curing the thermosetting resin composition. The encapsulation of the components of the electrical and electronic component may be performed, for example, by injecting the thermosetting resin composition into a frame having the components inside. Hereinafter, the present invention will be described in more detail using Examples and Comparative Examples, but the present invention is not limited to the following Examples. (A) Synthesis examples of thermosetting resins are shown below. [Synthesis Example 1] (A-1) Synthesis of unsaturated polyester resin Into a 4-necked flask equipped with a thermometer, a stirrer, an inert gas inlet and a reflux condenser, 1.72 kg (17.5 mol) of maleic anhydride, 0.67 kg (8.8 mol) of propylene glycol and 0.91 kg (8.8 mol) of neopentyl glycol were added. The temperature was raised to 200°C while heating and stirring under a nitrogen stream to perform an esterification reaction to obtain an unsaturated polyester resin. Then, styrene monomer was added in an amount of 40% by mass relative to the total of the unsaturated polyester resin and the styrene monomer to obtain a mixture of an unsaturated polyester resin and styrene. The unsaturation degree of the obtained unsaturated polyester resin was 100 mol% and the weight average molecular weight was 20,000. As other components, the following components were used. (B) Ethylenically unsaturated monomers: ·Styrene (Idemitsu Kosan Co., Ltd.) (C) Phosphate compounds containing ethylenically unsaturated groups Light Ester P-1M (2-methacryloyloxyethyl acid phosphate, manufactured by Kyoeisha Chemical Co., Ltd.) (D) Low shrinkage agent: MS-200 (polystyrene, manufactured by Sekisui Chemicals Co., Ltd., weight average molecular weight: 200,000, specific gravity: 1.05), ・Asaplene (trademark) T-411G (styrene-butadiene rubber, manufactured by Asahi Kasei Corporation, styrene / butadiene ratio = 30 / 70, specific gravity 0.95) (E) Inorganic filling materials: ・Softon 1200 (calcium carbonate, average particle size 1.80 μm, manufactured by Bihoku Powder Industry Co., Ltd.) B103 (aluminum hydroxide, average particle size 7 μm, manufactured by Nippon Light Metal Co., Ltd.) (F) Thermal polymerization initiator: ·Parhexyl (trademark) I (tert-hexyl peroxyisopropyl carbonate, manufactured by NOF Corporation) (G) Glass fiber: Chopped strands ECS-03B173 / P9 (chopped glass strands, fiber diameter 13 μm, fiber length 3.0 mm, manufactured by Nippon Electric Glass Co., Ltd.) (H) Release agent ·Calcium stearate (manufactured by NOF Co., Ltd.) Other additives · Triazine containing tetraethoxysilane (triazine-based adhesive agent, manufactured by Shikoku Chemical Industry Co., Ltd.), 3-Methacryloxypropyltrimethoxysilane (silane-based adhesion-imparting agent, manufactured by Shin-Etsu Chemical Co., Ltd.) <Example 1> (Preparation of Thermosetting Resin Composition) 167 parts by mass of a mixture of the unsaturated polyester resin obtained in Synthesis Example 1 and styrene (100 parts by mass of the unsaturated polyester resin and 67 parts by mass of styrene) as (A) a thermosetting resin and (B) an ethylenically unsaturated monomer, 41 parts by mass of styrene as (B) an ethylenically unsaturated monomer, 0.8 parts by mass of Light Ester P-1M as (C) a phosphate compound containing an ethylenically unsaturated group, 54.2 parts by mass each of MS-200 and Aspren (trademark) T-411G as (D) a low shrinkage agent, 1000 parts by mass of Softon 1200 as (E) an inorganic filler, and 400 parts by mass of Perhexyl (trademark) I as (F) a thermal polymerization initiator were added. 10 parts by mass of (G) chopped strands of glass fiber ECS-03B173 / P9167 parts by mass, and 25 parts by mass of calcium stearate as (H) a release agent were placed in a double-arm kneader and kneaded at 30° C. for 30 minutes to prepare a thermosetting resin composition. (Determination of fluidity) The fluidity was evaluated by the flow length (spiral flow value) based on the spiral flow test. Specifically, a semicircular spiral flow mold with a cross-sectional shape of φ3 mm was installed in a 50t transfer molding machine, and the spiral flow value (cm) of the thermosetting resin composition was measured under the conditions of a raw material filling amount of 50 g, a molding temperature of 150°C, and a molding pressure of 10 MPa. The results are shown in Table 1. (Determination of molding shrinkage) According to JIS K-6911 (2006) 5.7, a disc-shaped test piece (φ90 mm×11 mm) was obtained by compression molding (compression molding machine manufactured by Technomar Corporation) under the conditions of molding temperature of 150°C, molding pressure of 5 MPa, and molding time of 3 minutes, and the molding shrinkage was calculated. The results are shown in Table 1. (Evaluation of demoulding properties from mold) After preparing the test body for measuring the molding shrinkage, the case where no material adhered to the surface of the mold was evaluated as good, the case where the material adhered to 0.1 to 5% of the surface area of ​​the mold was evaluated as acceptable, and the case where the material adhered to more than 5% of the surface area of ​​the mold was evaluated as unsatisfactory. The results are shown in Table 1. (Evaluation of adhesion to metal) The thermosetting resin composition thus prepared was molded using a transfer molding machine (manufactured by PresMaschinen Co., Ltd., model MF-070) at a mold temperature of 140° C. and a molding pressure of 16 kgf / cm 2 , and the curing time is 180 seconds, and a molded product with a pudding cup shape (the diameter of the substrate side is 5mm and the height is 3mm) is obtained on SPCC, copper (C1100), aluminum alloy (A6061) and SUS (SUS304) substrates. For the four kinds of molded products obtained, a wafer shear strength tester (made by Nodson Digi, model 4000PXY) was used to apply a lateral load at a constant speed of 2mm / min, and the strength when shear failure occurred was measured 5 times at 23°C and 150°C, and the average value was used as the adhesion to various metals. The results are shown in Table 1. <Examples 2 to 8, Comparative Examples 1 to 5> Thermosetting resin compositions were prepared in the same manner as in Example 1 except that the types and compositions of the raw materials were changed as shown in Table 1. Styrene used to dilute the thermosetting resin (A) was excluded from the blending amount of the component (A) and added to the blending amount of the ethylenically unsaturated monomer (B). Then, various evaluations were performed in the same manner as in Example 1. The results are shown in Table 1. [Table 1-1] [Table 1-2] Industrial Availability According to the present invention, a thermosetting resin composition can be provided, which can obtain a cured product having excellent demoldability from a mold and particularly good adhesion to a metal component. In addition, according to the present invention, a molded product comprising a cured product of a thermosetting resin composition, specifically an electric or electronic component comprising a cured product of a thermosetting resin composition can be provided. The thermosetting resin composition can be preferably used as a sealing material for electric or electronic components.

Claims

1. A thermosetting resin composition comprising: (A) Thermosetting resin, (B) an ethylenically unsaturated monomer, (C) a phosphoric acid ester compound containing an ethylenically unsaturated group, (D) Low shrinkage agent, (E) inorganic filler materials, and (F) Thermal polymerization initiator.

2. The thermosetting resin composition according to claim 1, wherein the (C) phosphate compound containing an ethylenically unsaturated group is one or more compounds selected from monoesters and diesters, and has one or two ethylenically unsaturated groups. 3 . The thermosetting resin composition according to claim 1 , wherein the content of the (C) ethylenically unsaturated group-containing phosphoric acid ester compound is 0.1 to 70 parts by mass based on 100 parts by mass of the (A) thermosetting resin. 4 . The thermosetting resin composition according to claim 1 , wherein the (C) ethylenically unsaturated group-containing phosphoric acid ester compound is a phosphoric acid ester having a (meth)acryloyloxy group. 5 . The thermosetting resin composition according to claim 1 , wherein the (A) thermosetting resin is an unsaturated polyester resin. 6 . The thermosetting resin composition according to claim 1 , further comprising (G) glass fiber. 7 . The thermosetting resin composition according to claim 1 , further comprising (H) a release agent.

8. The thermosetting resin composition according to claim 1 or 2, wherein: With respect to 100 parts by mass of the (A) thermosetting resin, Contains 50 to 200 parts by mass of the (B) ethylenically unsaturated monomer, 0.1 to 70 parts by mass of the (C) phosphate compound containing an ethylenically unsaturated group, Contains 1 to 150 parts by weight of the (D) low shrinkage agent, Containing 80 to 1500 parts by mass of the (E) inorganic filler, The (F) thermal polymerization initiator is contained in an amount of 0.1 to 30 parts by mass. 9 . A molded article comprising a cured product of the thermosetting resin composition according to claim 1 or 2 .

10. A method for producing a molded article, comprising the step of heating and pressurizing the thermosetting resin composition according to claim 1 or 2 to cure it. 11 . An electric or electronic component comprising a cured product of the thermosetting resin composition according to claim 1 or 2.

12. A method for manufacturing an electrical or electronic component, comprising the following steps: A step of compression molding, transfer molding or injection molding the thermosetting resin composition according to claim 1 or 2, and encapsulating components of electric and electronic components therein; and A step of heating and curing the thermosetting resin composition.

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