Dimming module, preparation method thereof and dimming device

Abstract

A dimming module comprises a first substrate, a second substrate, a plurality of spacers (4), frame sealing glue and dye liquid crystals. The first substrate comprises a first substrate (1), a first conductive layer (2) and a first alignment film (3); the first conductive layer (2) and the first alignment film (3) are sequentially stacked on one side, close to the dye liquid crystal, of the first substrate (1); the spacer (4) is positioned on one side, close to the dye liquid crystal, of the first conducting layer (2); the second substrate comprises a second substrate (11), a second conductive layer (12) and a second alignment film (13); the second conductive layer (12) and the second alignment film (13) are sequentially stacked on one side, close to the dye liquid crystal, of the second substrate (11); the second substrate and the first substrate are oppositely combined, the frame sealing glue is located between the first substrate and the second substrate, and a dimming area is defined by the frame sealing glue; the dye liquid crystal is located in the dimming area; in the dimming area, the spacing distance between every two adjacent spacers is 50-1000 microns.

Description

Dimming module and preparation method thereof, and dimming device Technical Field

[0001] The embodiments of the present disclosure belong to the field of display technology, and specifically relate to a dimming module and a preparation method thereof, and a dimming device. Background Art

[0002] Flexible dye liquid crystal dimming devices have the advantages of being light, flexible, and privacy-resistant. They can better meet the needs of passenger car sunroofs and side windows that are hyperbolic and lightweight. Moreover, their simple gray-black color makes them look more high-end, giving users a more intelligent and comfortable driving experience.

[0003] Summary of the Invention

[0004] In a first aspect, an embodiment of the present disclosure provides a dimming module, comprising: a first substrate, a second substrate, a plurality of spacers, a sealing adhesive, and a dye liquid crystal;

[0005] The first substrate includes a first base, a first conductive layer and a first alignment film;

[0006] The first conductive layer and the first alignment film are sequentially stacked on a side of the first substrate close to the dye liquid crystal;

[0007] The spacer is located on a side of the first conductive layer close to the dye liquid crystal;

[0008] The second substrate includes a second base, a second conductive layer and a second alignment film;

[0009] The second conductive layer and the second alignment film are sequentially stacked on a side of the second substrate close to the dye liquid crystal;

[0010] The second substrate is aligned with the first substrate, the frame sealant is located between the first substrate and the second substrate, and surrounds a dimming area; the dye liquid crystal is located in the dimming area;

[0011] In the dimming area, the spacing distance between adjacent spacers is 50 to 1000 μm.

[0012] In some embodiments, the material of the first substrate is any one of polyethylene terephthalate, polycarbonate, triacetyl cellulose, and cycloolefin polymer, and the material of the second substrate is any one of polyethylene terephthalate, polycarbonate, triacetyl cellulose, and cycloolefin polymer.

[0013] In some embodiments, an orthographic projection of the spacer on the first substrate overlaps with an orthographic projection of the frame sealing adhesive on the first substrate.

[0014] In some embodiments, the minimum distance between the spacer and the first edge of the frame sealant away from the dimming zone is smaller than the spacing distance between adjacent spacers.

[0015] In some embodiments, the minimum distance between the spacer and a first edge of the frame sealant away from the dimming zone is greater than the spacing distance between adjacent spacers.

[0016] In some embodiments, the spacing distance between adjacent spacers ranges from 50 to 500 μm.

[0017] In some embodiments, the radial dimension of the first surface of the spacer located on the first conductive layer ranges from 10 to 40 μm;

[0018] The radial dimension of the second surface of the spacer is in the range of 5 to 30 μm;

[0019] The height of the spacer is in the range of 4 to 30 μm.

[0020] In some embodiments, the radial dimension of the first surface of the spacer is 20 to 30 μm; the radial dimension of the second surface of the spacer is 10 to 20 μm; and the height of the spacer is 8 to 15 μm.

[0021] In some embodiments, the spacer includes a main spacer and an auxiliary spacer;

[0022] The radial dimension of the first surface of the main spacer is greater than the radial dimension of the first surface of the auxiliary spacer;

[0023] and / or, the radial dimension of the second surface of the main spacer is greater than the radial dimension of the second surface of the auxiliary spacer;

[0024] And / or, the height of the main spacer is greater than the height of the auxiliary spacer.

[0025] In some embodiments, the spacing distance between adjacent spacers ranges from 0.05 to 1 mm.

[0026] The spacers extend along a first direction and a second direction to form a grid, wherein the first direction and the second direction are parallel to and intersect with the first substrate.

[0027] In some embodiments, the width of the first surface of the spacer located on the first conductive layer ranges from 10 to 30 μm;

[0028] The width of the second surface of the spacer is in the range of 5 to 20 μm;

[0029] The height of the spacer is in the range of 4 to 30 μm;

[0030] The spacer is in a grid shape; the grid shape includes a square grid shape, a rectangular grid shape or a regular hexagonal grid shape.

[0031] In some embodiments, a black matrix is ​​further included, located between the first conductive layer and the spacer, and the orthographic projection of the spacer on the first substrate is located within the orthographic projection area of ​​the black matrix on the first substrate.

[0032] In some embodiments, at least a portion of the second surface of the spacer is in contact with the second alignment film;

[0033] The dimming module includes a curved surface area;

[0034] The second substrate further includes at least one fixing ring, and the fixing ring is located in the arc surface area;

[0035] The fixing ring is located on a side of the second conductive layer close to the dye liquid crystal and extends through the second alignment film toward the first substrate; or the fixing ring is located on a side of the second alignment film close to the dye liquid crystal and extends toward the first substrate;

[0036] The top of the spacer located in the arc surface area is embedded in the fixing ring.

[0037] In some embodiments, it further comprises a first barrier layer, a second barrier layer and a side coating.

[0038] The first barrier layer and the second barrier layer are located between the first substrate and the second substrate, or the first barrier layer and the second barrier layer are located on a side of the first substrate and the second substrate respectively away from the dye liquid crystal;

[0039] The side adhesive is located between the first barrier layer and the second barrier layer, and the side adhesive is located on a side of the frame sealant away from the dimming area.

[0040] In some embodiments, the first barrier layer is located between the first substrate and the first conductive layer;

[0041] The second barrier layer is located between the second substrate and the second conductive layer;

[0042] The orthographic projections of the first conductive layer, the second conductive layer, the first alignment film, and the second alignment film on the first substrate do not overlap with the orthographic projections of the frame sealant and the side coating glue on the first substrate;

[0043] The orthographic projections of the first barrier layer and the second barrier layer on the first substrate overlap with the orthographic projections of the frame sealant and the side coating glue on the first substrate, and the first barrier layer and the second barrier layer are in contact with and connected to the frame sealant and the side coating glue respectively.

[0044] In some embodiments, the first barrier layer is located on a side of the first substrate facing away from the second substrate;

[0045] The second barrier layer is located on a side of the second substrate facing away from the first substrate;

[0046] The orthographic projection of the side coating glue on the first barrier layer does not overlap with the first substrate;

[0047] The orthographic projection of the side coating glue on the second barrier layer does not overlap with the second substrate;

[0048] The side glue is in contact with and connected to the first barrier layer and the second barrier layer respectively.

[0049] In some embodiments, the material of the first barrier layer and the second barrier layer includes silicon nitride or silicon oxide.

[0050] In some embodiments, the thickness of the first barrier layer ranges from 1 to 2 μm;

[0051] The thickness of the second barrier layer is in the range of 1 to 2 μm.

[0052] In some embodiments, the first barrier layer and the second barrier layer respectively include a base film, a barrier film, and an optical adhesive film, and the base film, the barrier film, and the optical adhesive film are stacked in sequence.

[0053] In some embodiments, the thickness of the first barrier layer ranges from 50 to 200 μm;

[0054] The thickness of the second barrier layer is in the range of 50 to 200 μm.

[0055] In some embodiments, the elastic recovery rate of the spacer under a pressure of 5 to 30 mN is 80% to 90%.

[0056] In some embodiments, the dimming module can withstand a pressure greater than 80 kgf / cm 2 .

[0057] In a second aspect, the embodiments of the present disclosure further provide a dimming device, which includes the above-mentioned dimming module;

[0058] It also includes a first cover plate and a second cover plate, wherein the dimming module is located between the first cover plate and the second cover plate;

[0059] The first substrate in the dimming module and the first cover plate are bonded together by a first adhesive layer;

[0060] The second substrate in the dimming module and the second cover plate are bonded together by a second adhesive layer;

[0061] The first cover plate and the second cover plate are sealed and bonded by the first adhesive layer and the second adhesive layer.

[0062] In some embodiments, a first edge shielding layer and a second edge shielding layer are further included.

[0063] The first edge-shielding layer is located on a side of the first cover plate facing away from the second cover plate, and the orthographic projection of the first edge-shielding layer on the first cover plate covers an area from the frame sealant in the dimming module to an edge of the first cover plate;

[0064] The second edge-shielding layer is located on a side of the second cover plate away from the first cover plate, and the orthographic projection of the second edge-shielding layer on the second cover plate covers the area from the frame sealant in the dimming module to the edge of the second cover plate.

[0065] In a third aspect, an embodiment of the present disclosure further provides a method for preparing a dimming module, which includes: preparing a first substrate;

[0066] preparing a second substrate;

[0067] Aligning the first substrate and the second substrate and sealing them with a frame sealant, and pouring dye liquid crystal into the dimming area surrounded by the frame sealant;

[0068] The preparing the first substrate comprises: preparing a first conductive layer on the first base;

[0069] Preparing a plurality of spacers on the first substrate after completing the above steps;

[0070] Preparing a first alignment film on the first substrate after completing the above steps;

[0071] The preparing the second substrate comprises: preparing a second conductive layer on the second base;

[0072] A second alignment film is prepared on the second substrate after completing the above steps.

[0073] In some embodiments, a plurality of spacers are formed on the first substrate on which the first conductive layer is formed using an exposure process, including:

[0074] coating a photoresist film on a side of the first conductive layer facing away from the first substrate;

[0075] Drying the photoresist film at 80-100° C. for 100-120 seconds;

[0076] Expose the photoresist film to ultraviolet light using a mask having a light-transmitting pattern, so that the photoresist film in the area corresponding to the light-transmitting pattern undergoes a polymerization reaction;

[0077] spraying potassium hydroxide solution on the exposed photoresist film to remove the non-polymerized photoresist film in the area outside the light-transmitting pattern to form the pattern of the spacer;

[0078] The spacer pattern is cured at 100-110° C. for 50-60 minutes to form the spacer. BRIEF DESCRIPTION OF THE DRAWINGS

[0079] The accompanying drawings are used to provide a further understanding of the embodiments of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the present disclosure and do not constitute a limitation of the present disclosure. The above and other features and advantages will become more apparent to those skilled in the art by describing the detailed exemplary embodiments with reference to the accompanying drawings, in which:

[0080] FIG1 is a schematic cross-sectional view of the structure of a dye liquid crystal dimming device in the related art.

[0081] Figure 2 is a schematic diagram of white spot defects caused by box thickness collapse.

[0082] FIG3 is a schematic cross-sectional view of the structure of the first substrate in an embodiment of the present disclosure.

[0083] FIG4 is a test curve of the elastic recovery rate of the spacer.

[0084] FIG5 a is a schematic diagram showing the distribution of a plurality of spacers on a flexible first substrate.

[0085] FIG5 b is a schematic diagram showing another distribution of multiple spacers on the flexible first substrate.

[0086] FIG. 5 c is a schematic diagram showing another distribution of a plurality of spacers on the flexible first substrate.

[0087] FIG5 d is a schematic diagram showing the distribution of multiple spacers on the rigid first substrate.

[0088] FIG. 6 a is a schematic diagram showing that spacers are only distributed in the dimming area.

[0089] FIG6 b is a schematic diagram showing that spacers are distributed in both the dimming area and the border area.

[0090] FIG. 6 c is a schematic diagram showing that spacers are distributed in both the dimming area and a portion of the border area.

[0091] FIG7 a is a schematic cross-sectional view of a spacer perpendicular to the first substrate in an embodiment of the present disclosure.

[0092] FIG7 b is a schematic cross-sectional view of a spacer perpendicular to the first substrate in an embodiment of the present disclosure.

[0093] FIG8 a is a schematic cross-sectional view of the structure of a first substrate provided with a main spacer and an auxiliary spacer in an embodiment of the present disclosure.

[0094] FIG8 b is a schematic diagram showing the distribution of the main spacers and the auxiliary spacers in an embodiment of the present disclosure.

[0095] FIG9 a is a schematic diagram showing the distribution of strip-shaped spacers in an embodiment of the present disclosure.

[0096] FIG9 b is a schematic diagram showing the distribution of spacers in a square grid in an embodiment of the present disclosure.

[0097] FIG9 c is a schematic diagram showing the distribution of rectangular grid-shaped spacers in an embodiment of the present disclosure.

[0098] FIG9 d is a schematic diagram showing the distribution of spacers in a regular hexagonal grid in an embodiment of the present disclosure.

[0099] FIG9e is a schematic diagram showing the distribution of spherical spacers in an embodiment of the present disclosure.

[0100] FIG10 is a schematic cross-sectional view of the structure of the first substrate in which spacers are formed of a photoresist material containing a black pigment in an embodiment of the present disclosure.

[0101] FIG11 is a schematic cross-sectional view of the structure of the first substrate with a black matrix disposed at the position of the spacers in an embodiment of the present disclosure.

[0102] FIG12 a is a schematic diagram showing a rubbing shadow area appearing in the first alignment film during the rubbing alignment process.

[0103] FIG12 b is a schematic diagram showing the principle of light leakage caused by the orientation of liquid crystal molecules around the spacer.

[0104] FIG12c is a schematic diagram showing light leakage around spacers in a first alignment film formed by using a rubbing alignment process and a photoalignment process.

[0105] FIG. 13 is a schematic diagram showing a process of sequentially preparing spherical spacers and a first alignment film on a first conductive layer.

[0106] FIG14 is a schematic cross-sectional view of the structure of a dimming module according to an embodiment of the present disclosure.

[0107] FIG15 a is a schematic cross-sectional view of the structure of the arc surface area of ​​the dimming module in an embodiment of the present disclosure.

[0108] FIG15 b is another cross-sectional view of the arc surface area of ​​the dimming module in the embodiment of the present disclosure.

[0109] FIG. 16 is a schematic diagram of the nesting of the top of the spacer and the fixing ring in an embodiment of the present disclosure.

[0110] FIG17 is a schematic cross-sectional view of the structure of a flexible dimming module with a curved surface area in the related art.

[0111] FIG18 is a schematic cross-sectional view of the structure of another dimming module in an embodiment of the present disclosure.

[0112] FIG19 is a schematic cross-sectional view of the structure of another dimming module according to an embodiment of the present disclosure.

[0113] FIG20 is a schematic cross-sectional view of the structure of the dimming device in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0114] To enable those skilled in the art to better understand the technical solutions of the embodiments of the present disclosure, a dimming module, a preparation method thereof, and a dimming device provided by the embodiments of the present disclosure are further described in detail below with reference to the accompanying drawings and specific implementation plans.

[0115] The embodiments of the present disclosure will be described more fully below with reference to the accompanying drawings, but the illustrated embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully enable those skilled in the art to understand the scope of this disclosure.

[0116] The embodiments of the present disclosure are not limited to the embodiments shown in the drawings, but include modifications of the configurations formed based on the manufacturing process. Therefore, the regions illustrated in the drawings are schematic in nature, and the shapes of the regions shown in the drawings illustrate specific shapes of the regions, but are not intended to be limiting.

[0117] 1 , which is a schematic cross-sectional view of the structure of a dye liquid crystal dimming device in the related art; the dye liquid crystal dimming device includes an upper substrate and a lower substrate arranged in a box, and the box is filled with dye liquid crystal; the dye liquid crystal includes liquid crystal molecules 9 and dye molecules 10; the upper substrate and the lower substrate respectively include a flexible substrate 22, an electrode layer 23 and an alignment film 24, and in the upper substrate and the lower substrate, the alignment film 24 is arranged on the side of the electrode layer 23 away from the flexible substrate 22; a supporting spacer 4 is provided in the box, and the supporting spacer 4 is arranged on one of the substrates (such as the lower substrate) for forming support for the upper substrate and the lower substrate of the box.

[0118] In the related art, the support spacers 4 are spherical and are sprayed onto the alignment film 24 of one substrate. They are then bonded to the alignment film 24 after thermal curing. This spraying method can result in poor uniformity in the distribution of the support spacers 4. Furthermore, due to their spherical shape, the support spacers 4 make point contact with the alignment film 24. Consequently, the adhesion between the spherical support spacers 4 and the alignment film 24 after curing is weak, making them susceptible to detachment under external forces. In areas where there are no supporting spacers in the box or in areas where the distribution density of supporting spacers 4 is low, the box thickness of the flexible dye liquid crystal dimming device collapses, resulting in white spot defects (refer to Figure 2, which is a schematic diagram of white spot defects caused by box thickness collapse). The specific principle of white spot defects is: when the flexible dye liquid crystal dimming device is normally used, when the upper and lower electrode layers 23 are not powered, the dye liquid crystal cannot allow light to pass through. At this time, the flexible dye liquid crystal dimming device is in an opaque state; when the upper and lower electrode layers 23 are powered, the dye liquid crystal can allow light to pass through. At this time, the flexible dye liquid crystal dimming device is in a translucent state; the white spot defect is caused by the collapse of the box thickness of the flexible dye liquid crystal dimming device when the upper and lower electrode layers 23 are not powered. There is no dye liquid crystal between the upper and lower substrates at the collapsed position, so the collapsed position cannot achieve the shading function, that is, the collapsed position is in a translucent state.

[0119] In addition, the structure of a rigid dye liquid crystal dimming device, as also shown in Figure 1 , is similarly prepared by spraying the support spacer 4 onto the alignment film 24 of one substrate, and then bonding it to the substrate alignment film 24 after thermal curing. However, in the rigid dye liquid crystal dimming device, the thermal curing conditions for the support spacer 4 are 150°C for 50 minutes. Furthermore, in the rigid dye liquid crystal dimming device, the alignment film 24 is prepared by a film coating and thermal curing process; the thermal curing conditions for the alignment film 24 are 230°C for 20 minutes. However, for flexible dye liquid crystal dimming devices, the process temperature tolerance of the flexible substrate 22 is generally less than 150°C, necessitating the development of a low-temperature preparation process for the support spacer 4 and the alignment film 24.

[0120] In order to solve the above-mentioned problems existing in the related art, on the first aspect, the embodiment of the present disclosure provides a dimming module, which includes: a first substrate, a second substrate, a plurality of spacers, a frame sealant and a dye liquid crystal; the first substrate includes a first base, a first conductive layer and a first orientation film; the first conductive layer and the first orientation film are stacked in sequence on the side of the first substrate close to the dye liquid crystal; the spacer is located on the side of the first conductive layer close to the dye liquid crystal; the second substrate includes a second substrate, a second conductive layer and a second orientation film; the second conductive layer and the second orientation film are stacked in sequence on the side of the second substrate close to the dye liquid crystal; the second substrate is aligned with the first substrate, the frame sealant is located between the first substrate and the second substrate, and is enclosed to form a dimming area; the dye liquid crystal is located in the dimming area; in the dimming area, the spacing distance between adjacent spacers is 50 to 1000 μm.

[0121] In some embodiments, refer to Figure 3, which is a schematic cross-sectional view of the structure of the first substrate in the embodiment of the present disclosure; wherein, the dimming module includes: a first substrate, the first substrate includes a first base 1, a first conductive layer 2, a first orientation film 3 and a plurality of spacers 4; the first conductive layer 2 and the first orientation film 3 are stacked on the first base 1 in sequence; the spacer 4 is located on the first conductive layer 2 and extends through the first orientation film 3 in a direction away from the first base 1; the preparation process temperature of the spacer 4 is lower than the tolerance temperature of the first base 1.

[0122] In some embodiments, the first substrate 1 is made of a flexible, light-transmitting material, such as any one of PET (polyethylene terephthalate), PC (polycarbonate), TAC (triacetyl cellulose), and COP (cycloolefin polymer); and the first conductive layer 2 is made of indium tin oxide. The thickness of the indium tin oxide film can be ultra-thin, which facilitates the flexibility of the first conductive layer 2. The indium tin oxide material is light-transmitting, which facilitates the light-transmitting performance of the first substrate.

[0123] In some embodiments, the thickness of the first alignment film 3 ranges from 65 nm to 100 nm.

[0124] In some embodiments, the spacer 4 is made of a flexible material; the elastic recovery rate of the spacer 4 under a pressure of 5 to 30 mN is 80% to 90%.

[0125] In some embodiments, the dimming module can withstand a pressure greater than 80 kgf / cm 2 .

[0126] Among them, when the dimming module is tested for pressure, the pressure head is 80kgf / cm 2The force is applied to the dimming module formed, and the spacer 4 inside the dimming module is not damaged under the pressure. When the dimming module and the tempered glass are combined in the autoclave, the pressure on the dimming module is less than 80kgf / cm 2 Therefore, the spacer 4 is sufficient to withstand the pressure of the dimming module and the tempered glass.

[0127] In some embodiments, the spacer 4 is made of a photoresist material; the photoresist material includes an acrylic copolymer, a multifunctional monomer, a photoinitiator, diethylene glycol methyl ethyl ether (1-Ethoxy-2-(2-methoxyethoxy)ethane) and propylene glycol monomethyl ether (1-methoxy-2-propanol).

[0128] In some embodiments, in the photoresist material of the spacer 4, the mass proportion of the acrylic copolymer ranges from 10 to 20%; the mass proportion of the multifunctional group monomer ranges from 6 to 12%; the mass proportion of the photoinitiator ranges from less than or equal to 5%; the mass proportion of diethylene glycol methyl ethyl ether ranges from 50 to 67%; and the mass proportion of propylene glycol monomethyl ether ranges from 13 to 17%.

[0129] In some embodiments, as shown in Table 1, the elastic recovery rate test data of the spacer 4 made of the above-mentioned photoresist material under a pressure of 5 to 30 mN is shown.

[0130] Table 1

[0131] 4 is a test curve of the elastic recovery rate of the spacer. From the test data in Table 1, it can be seen that the average elastic recovery rate of the spacer 4 is 83.9%, which can well meet the flexible support performance requirements of the first substrate applied to the flexible dimming module.

[0132] In some embodiments, multiple spacers 4 are arranged in an array at equal intervals, and the spacing between adjacent spacers 4 ranges from 50 to 500 μm. This spacing range between adjacent spacers 4 can well meet the flexible support performance requirements of the first substrate applied to the flexible dimming module.

[0133] In some embodiments, referring to FIG5a, a schematic diagram of the distribution of multiple spacers on a flexible first substrate is shown; wherein the spacing a between adjacent spacers 4 is 150 to 180 μm. In some embodiments, the spacing a between adjacent spacers 4 is 166.67 μm; accordingly, the distribution density of the spacers 4 is 49 ea / mm 2 .

[0134] In some embodiments, referring to FIG5b, another schematic diagram of the distribution of multiple spacers on the flexible first substrate is shown; wherein the spacing distance b between adjacent spacers 4 is 80 to 120 μm. In some embodiments, the spacing distance b between adjacent spacers 4 is 100 μm; accordingly, the distribution density of the spacers 4 is 121 ea / mm 2 .

[0135] In some embodiments, referring to FIG5c, another schematic diagram of the distribution of multiple spacers on the flexible first substrate is shown; wherein the spacing distance c between adjacent spacers 4 is 50 to 80 μm. In some embodiments, the spacing distance c between adjacent spacers 4 is 71.43 μm; accordingly, the distribution density of the spacers 4 is 225 ea / mm 2 .

[0136] In this embodiment, since the dimming module is prone to collapse without the support of the spacers 4, the distribution density settings of the above three spacers 4 can well meet the flexible support performance requirements of the first substrate applied to the flexible dimming module, prevent the local collapse of the flexible dimming module using the first substrate caused by the low distribution density of the spacers 4, and can well solve the white spot problem of the flexible dimming module.

[0137] In some embodiments, the first substrate 1 is made of a rigid material, such as glass. In some embodiments, the spacer 4 is made of a rigid material, such as a hard resin material or glass.

[0138] In some embodiments, the spacing distance between adjacent spacers 4 ranges from 50 to 1500 μm.

[0139] In some embodiments, referring to FIG. 5 d , it is a schematic diagram showing the distribution of a plurality of spacers on a rigid first substrate; wherein the spacing distance d between adjacent spacers 4 is 1000 μm.

[0140] In this embodiment, when the first base 1 is made of rigid material, the first substrate has a certain rigidity. Since the dimming module with better rigidity is not easy to collapse without the support of the spacer 4, the spacing distance setting of the above-mentioned spacer 4 can well meet the rigid support performance requirements of the first substrate applied to the rigid dimming module.

[0141] In some embodiments, referring to Figures 6a and 6b, Figure 6a is a schematic diagram showing that spacers are distributed only in the dimming area; Figure 6b is a schematic diagram showing that spacers are distributed in both the dimming area and the border area; the dimming module includes a dimming area 100 and a border area 101, and the border area 101 is arranged around the outer periphery of the dimming area 100; spacers 4 are distributed in the dimming area 100, and spacers 4 are distributed in at least part of the border area 101.

[0142] In some embodiments, referring to FIG. 6 b , the orthographic projection of the spacer 4 on the first substrate overlaps with the orthographic projection of the frame sealant on the first substrate.

[0143] 6b , the minimum distance between the spacers 4 and the first edge s of the sealant away from the dimming area 100 is smaller than the spacing between adjacent spacers 4. That is, the spacers 4 cover the entire sealant area.

[0144] In some embodiments, referring to Figure 6c, it is a schematic diagram showing that spacers are distributed in both the dimming zone and part of the border zone; multiple spacers 4 are distributed in the dimming zone 100, and at the same time, multiple spacers 4 are also distributed in part of the border zone 101 close to the dimming zone 100; spacers are not distributed in part of the border zone 101 away from the dimming zone 100.

[0145] In some embodiments, referring to FIG. 6c , the minimum distance between the spacers 4 and the first edge s of the frame sealant away from the dimming region 100 is greater than the spacing between adjacent spacers 4. That is, the spacers 4 do not cover the entire frame sealant area; rather, the spacers 4 are distributed only in a portion of the frame sealant area near the dimming region 100.

[0146] When the first substrate is used in a flexible dimming module, its border area 101 is used to apply sealant to achieve a sealed frame between the first and second substrates. Border area 101 is the area where the sealant is applied. The area enclosed by the sealant is the dimming area 100, excluding the border area. Spacers 4 are provided in border area 101 to support the sealant in border area 101, thereby supporting the thickness of the box in border area 101.

[0147] In some embodiments, the radial dimension of the first surface of the spacer 4 located on the first conductive layer 2 ranges from 10 to 40 μm; the radial dimension of the second surface of the spacer 4 ranges from 5 to 30 μm; and the height of the spacer 4 ranges from 4 to 30 μm.

[0148] The first and second surfaces of the spacer 4 may be of any shape, and the radial dimensions of the first and second surfaces refer to the dimensions between the two intersection points of a straight line passing through the center of the surface and the edges of the surface.

[0149] In some embodiments, the spacer 4 is in a columnar shape; the columnar shape includes a cylindrical shape, a prism shape, a frustum shape, or a truncated pyramid shape.

[0150] In some embodiments, referring to Figure 7a, which is a schematic cross-sectional view of the spacer perpendicular to the first substrate in the embodiment of the present disclosure; the shape of the spacer 4 is a truncated cone; the diameter size range of the first surface of the spacer 4 located on the first conductive layer 2 is 10 to 40 μm; the diameter size range of the second surface of the spacer 4 is 5 to 30 μm; the height size range of the spacer 4 is 4 to 30 μm.

[0151] In some embodiments, the diameter of the first surface of the spacer 4 is 20-30 μm; the diameter of the second surface of the spacer 4 is 10-20 μm; and the height of the spacer 4 is 8-15 μm.

[0152] In some embodiments, referring to FIG. 7 a , the diameter of the first surface of the spacer 4 is 27 μm; the diameter of the second surface of the spacer 4 is 17 μm; and the height of the spacer 4 is 12 μm.

[0153] 7 a , in some embodiments, the cross-section of the spacer 4 perpendicular to the first substrate 1 is an isosceles trapezoid, and the base angle θ of the isosceles trapezoid is 67°.

[0154] In some embodiments, referring to Figure 7b, which is a schematic cross-sectional view of the spacer perpendicular to the first substrate in the embodiment of the present disclosure; the shape of the spacer 4 is a truncated cone; the diameter size range of the first surface of the spacer 4 located on the first conductive layer 2 is 10 to 25 μm; the diameter size range of the second surface of the spacer 4 is 8 to 20 μm; the height size range of the spacer 4 is 3 to 5 μm.

[0155] In some embodiments, referring to FIG. 7 b , the diameter of the first surface of the spacer 4 is 29 μm; the diameter of the second surface of the spacer 4 is 14 μm; and the height of the spacer 4 is 10 μm.

[0156] 7 b , in some embodiments, the cross-section of the spacer 4 perpendicular to the first substrate 1 is an isosceles trapezoid, and the base angle θ of the isosceles trapezoid is 57°.

[0157] In some embodiments, referring to Figures 8a and 8b, Figure 8a is a structural cross-sectional schematic diagram of the first substrate on which the main spacer and the auxiliary spacer are provided in the embodiment of the present disclosure; Figure 8b is a distribution schematic diagram of the main spacer and the auxiliary spacer in the embodiment of the present disclosure; wherein, the spacer 4 includes a main spacer 41 and an auxiliary spacer 42; the diameter size of the first surface of the main spacer 41 is larger than the diameter size of the first surface of the auxiliary spacer 42; and / or, the diameter size of the second surface of the main spacer 41 is larger than the diameter size of the second surface of the auxiliary spacer 42; and / or, the height size of the main spacer 41 is larger than the height size of the auxiliary spacer 42.

[0158] On the one hand, the main spacer 41 and the auxiliary spacer 42 can provide good support for the first substrate and the second substrate in the flexible dimming module using the first substrate. On the other hand, when the flexible dimming module bends and deforms under the action of external force, it can also ensure that the spacer 4 stably supports the first substrate and the second substrate, avoiding the occurrence of white spot problems.

[0159] In some embodiments, the diameter of the second side of the main spacer 41 is 17 μm, the diameter of the first side of the main spacer 41 is 27 μm, and the height of the main spacer 41 is 12 μm; the diameter of the second side of the auxiliary spacer 42 is 15 μm, the diameter of the first side of the auxiliary spacer 42 is 25 μm, and the height of the auxiliary spacer 42 is 11.5 μm.

[0160] In some embodiments, the array of spacers 4 includes multiple areas 102, and the number of spacers 4 in each area 102 is the same; the number of main spacers 41 in each area 102 is less than the number of auxiliary spacers 42; the main spacers 41 in each area 102 are arranged in an array, and the auxiliary spacers 42 are arranged in an array.

[0161] In some embodiments, referring to FIG. 8 b , 49 spacers 4 are distributed in each area 102 , of which 9 are main spacers 41 and 40 are auxiliary spacers 42 .

[0162] In some embodiments, referring to FIG. 9 a , which is a schematic diagram of the distribution of strip-shaped spacers in an embodiment of the present disclosure; the spacers 4 are strip-shaped; and the length of the spacers 4 extends along the length or width direction of the first substrate 1 .

[0163] In some embodiments, the length of the strip-shaped spacer 4 is equal to the length or width of the first substrate 1 .

[0164] In some embodiments, the spacing distances between adjacent two-strip spacers 4 are equal; the spacing distance between adjacent two-strip spacers 4 ranges from 0.05 to 1 mm.

[0165] In some embodiments, referring to Figures 9b, 9c, and 9d, Figure 9b is a schematic diagram of the distribution of spacers in a square grid in an embodiment of the present disclosure; Figure 9c is a schematic diagram of the distribution of spacers in a rectangular grid in an embodiment of the present disclosure; and Figure 9d is a schematic diagram of the distribution of spacers in a regular hexagonal grid in an embodiment of the present disclosure. Spacers 4 extend along a first direction and a second direction to form a grid, and the first and second directions are parallel to and intersect the first substrate. Spacers 4 are in the shape of a grid; the grid shape includes a square grid, a rectangular grid, or a regular hexagonal grid.

[0166] 9a-9d, the width of the first surface of the spacer 4 on the first conductive layer 2 ranges from 10 to 30 μm; the width of the second surface of the spacer 4 ranges from 5 to 20 μm; and the height of the spacer 4 ranges from 4 to 30 μm.

[0167] The widths of the first and second surfaces of the spacer 4 are respectively the widths of their orthographic projections on the first substrate 1. The height of the spacer 4 is the distance between its second surface and its first surface.

[0168] In the embodiment of the present disclosure, the supporting area of ​​the strip and grid-shaped spacers 4 for the dimming module is larger than the supporting area of ​​the columnar spacers 4, so that the dimming module has a stronger ability to control the box thickness, and when the dimming module is subjected to external force, the strip and grid-shaped spacers 4 can prevent the liquid crystal in the dimming module box from flowing, thereby preventing the liquid crystal from flowing to a local area under the action of external force, resulting in shading or poor light transmittance, and avoiding local blackening of the dimming module.

[0169] In some embodiments, referring to FIG. 9e , which is a schematic diagram of the distribution of spherical spacers in the disclosed embodiments, the spacers 4 are spherical in shape. The spherical spacers 4 are in contact with and connected to both the first conductive layer 2 and the first alignment film 3. Compared to the related art, which only achieves point contact between the support spacers and the alignment film, this greatly increases the contact area between the spherical spacers 4 and the film layer in which they are located, thereby improving the connection strength between the spherical spacers 4 and the film layer in which they are located, improving or preventing the problem of the spherical spacers 4 being easily detached, and thus effectively resolving the white spot problem of the dimming module.

[0170] In some embodiments, referring to Figure 10, there is a schematic cross-sectional view of the structure of the first substrate in which the spacer is formed by a photoresist material containing a black pigment in an embodiment of the present disclosure; the photoresist material also includes a black pigment; the mass percentage of the black pigment in the photoresist material ranges from 5 to 10wt%; the black pigment is in the form of black particles, and the particle size of the black pigment is less than 100nm.

[0171] In some embodiments, black pigments such as carbon are added to the photoresist material to form black acrylic resin. The absorbance (OD, Optical Desity, indicating the light density absorbed by the detected object) of the black acrylic resin material can reach above 3, thereby greatly reducing the light transmittance of the spacer 4.

[0172] In this embodiment, the photoresist material itself is light-transmissive before being added with black pigment, and its transmittance is greater than 90%, which increases the dark-state transmittance of the dimming module and causes the contrast of the dimming module to decrease; by adding black pigment to the photoresist material, the light transmittance of the spacer 4 can be reduced, thereby reducing the dark-state transmittance of the dimming module, thereby increasing the contrast of the dimming module and enhancing the user's visual experience.

[0173] In some embodiments, referring to Figure 11, which is a schematic structural cross-sectional diagram of the first substrate in the present disclosure in which a black matrix is ​​provided at the spacer position; wherein, the dimming module also includes a black matrix 5, which is located between the first conductive layer 2 and the spacer 4, and the orthographic projection of the spacer 4 on the first substrate 1 is located within the orthographic projection area of ​​the black matrix 5 on the first substrate 1.

[0174] Referring to Figure 11, since the spacer 4 itself is translucent and its transmittance is greater than 90%, the dark state transmittance of the dimming module increases, causing the device contrast to decrease; by arranging a black matrix 5 between the spacer 4 and the first conductive layer 2, it can absorb the light irradiated to the spacer 4, thereby reducing the light transmittance of the spacer 4, and then reducing the dark state transmittance of the dimming module, thereby improving the contrast of the dimming module and enhancing the user's visual experience.

[0175] In some embodiments, the thickness of the black matrix 5 ranges from about 1 to 3 μm. To prevent light from leaking through the spacers 4, the black matrix 5 needs to completely cover the first surface of the spacers 4. That is, the spacers 4 need to be completely placed on the black matrix 5. In other words, the orthographic projection area of ​​the black matrix 5 on the first substrate 1 must be greater than or equal to the first surface area of ​​the spacers 4. The orthographic projection size of the black matrix 5 should be the sum of the first surface size of the spacers 4 and the alignment accuracy of the two. The alignment accuracy of the black matrix 5 and the spacers 4 is generally ±3 μm.

[0176] In some embodiments, the black matrix 5 is made of photoresist material, and the photoresist components include polymer resin, pigment, monomer, photoinitiator, solvent, etc.; the solvent is generally propylene glycol methyl ether acetate (PGMEA); the polymer resin is generally bisphenol A resin; the monomer is a small molecule acrylate; the photoinitiator is a free radical type, generally an oxime ester photoinitiator; the pigment is generally carbon black particles with a particle size of less than 100 nm.

[0177] Based on the above structure of the dimming module, an embodiment of the present disclosure further provides a method for preparing the dimming module, which includes: preparing a first substrate; preparing the first substrate includes: step S1: preparing a first conductive layer on the first base.

[0178] In this step, the first conductive layer is prepared by a patterning process, which includes film formation, photoresist coating, exposure, development, etching and other steps.

[0179] The first conductive layer is made of a light-transmitting indium tin oxide material, which can realize the light-transmitting performance of the first substrate, so as to realize the light-transmitting performance of the dimming module.

[0180] Step S2: preparing a plurality of spacers on the first substrate after completing the above steps.

[0181] In some embodiments, step S2 specifically includes: coating a photoresist film on a side of the first conductive layer facing away from the first substrate; for example, coating a negative photoresist film.

[0182] The photoresist film is dried at 80-100°C for 100-120 seconds to remove small molecule solvents in the photoresist film and reduce the fluidity of the photoresist.

[0183] The photoresist film is exposed to ultraviolet light (i.e., UV light, generally in the 300-436 nm band) using a mask with a light-transmitting pattern, so that the photoresist film in the area corresponding to the light-transmitting pattern undergoes a polymerization reaction.

[0184] A potassium hydroxide (KOH) solution is sprayed on the exposed photoresist film to remove the non-polymerized photoresist film in the area outside the light-transmitting pattern to form a spacer pattern; for example, a potassium hydroxide solution with a mass percentage of 0.04wt% is sprayed to clean the non-polymerized photoresist film.

[0185] The spacer pattern is cured at 100-110° C. for 50-60 minutes to form the spacer.

[0186] In some embodiments, columnar, strip-shaped and grid-shaped spacers can be prepared by the above-mentioned exposure process method, thereby realizing a low-temperature preparation process for the spacers in the dimming module, avoiding damage to the flexibility of the first substrate caused by the high preparation temperature of the spacers.

[0187] In some embodiments, step S2 specifically includes: spraying spherical spacers toward a side of the first conductive layer facing away from the first substrate.

[0188] The spherical spacers are heated at 100-110° C. for 50-60 minutes to melt the surface of the spherical spacers and gather at the contact interface between the spherical spacers and the first conductive layer.

[0189] The spherical spacers are cooled to bond with the first conductive layer.

[0190] In some embodiments, the spherical spacers can be prepared by the above-mentioned spray curing process, which can also realize a low-temperature preparation process for the spacers in the dimming module, thereby avoiding damage to the flexibility of the first substrate caused by excessively high preparation temperature of the spacers.

[0191] In some embodiments, the main spacer and the auxiliary spacer can be prepared by the above-mentioned exposure process method. The difference from the preparation method of the above-mentioned spacer by the exposure process is that a halftone mask (or grayscale mask) is used to adjust the exposure amount during exposure, such as the transmittance of the exposure light at the mask pattern corresponding to the formation of the main spacer pattern is 100%, and the transmittance of the exposure light at the mask pattern corresponding to the formation of the auxiliary spacer pattern is 30-50%, thereby achieving different sizes and heights of the main spacer and the auxiliary spacer.

[0192] Step S3: preparing a first alignment film on the first substrate after completing the above steps.

[0193] In this step, the specific preparation process of the first alignment film includes: forming the first alignment film layer on the first substrate on which the spacers are prepared by adopting a coating process or a spraying process.

[0194] The first alignment film layer is cured at 100-110° C. for 80-90 minutes.

[0195] The first alignment film layer is aligned by using a rubbing alignment process or a photoalignment process to form a first alignment film.

[0196] The above-mentioned preparation method of the first alignment film can realize a low-temperature preparation process of the first alignment film in the dimming module, thereby preventing the preparation temperature of the first alignment film from being too high and causing damage to the flexibility of the first substrate.

[0197] In some embodiments, referring to FIG12a, there is a schematic diagram of a rubbing shadow area appearing during the rubbing alignment process of the first alignment film; FIG12b is a schematic diagram of the principle of light leakage caused by the orientation of liquid crystal molecules around the spacers; in the rubbing alignment process, a rubbing roller 6 is used to rub the surface of the first alignment film layer 7. In the rubbing direction L, due to the obstruction of the spacers 4, a rubbing shadow area 8 (i.e., an area with weakened friction strength) exists. This area, due to weak alignment, will cause abnormal orientation of the liquid crystal molecules 9, resulting in disordered orientation of the liquid crystal molecules 9 around the spacers 4, causing light leakage, as shown in FIG12b. In some embodiments, the optical alignment process does not have a rubbing shadow area, which can solve the light leakage caused by the disordered orientation of the liquid crystal molecules in the rubbing shadow area. Referring to FIG12c, there is a schematic diagram of light leakage around the spacers of the first alignment film formed by the rubbing alignment process and the optical alignment process. As can be seen from FIG12c, the light leakage around the spacers 4 of the first alignment film 3 aligned by the optical alignment process is significantly better than the light leakage around the spacers 4 of the first alignment film 3 aligned by the rubbing alignment process.

[0198] In some embodiments, a coating process is used to form the first alignment film layer. Due to the spacing of the spacers, there may be areas around the spacers where the first alignment film layer liquid has leaked (i.e., not coated). The first alignment film layer is formed by a spraying process, which can avoid the problem of liquid leakage in the first alignment film layer.

[0199] In some embodiments, referring to Figure 13, it is a schematic diagram of the process of sequentially preparing a spherical spacer and a first orientation film on the first conductive layer; the spacer 4 is bonded to the first conductive layer 2, and there is a bonding interface; then the first orientation film 3 is prepared, and the first orientation film 3 can fill the gap between the spacer 4 and the first conductive layer 2; the thicker the first orientation film 3 is, the more sufficient the gap is filled, and the larger the bonding interface between the spacer 4 and the first orientation film 3 is; for example: in the related art, the bonding area between the supporting spacer and the orientation film is ≈ the bonding interface area between the spacer 4 and the first conductive layer 2 in this solution; while in this solution, there is still a part of the bonding interface between the spacer 4 and the first orientation film 3, and the bonding area of ​​the spacer 4 in this solution is larger, and the bonding strength is improved, which can effectively improve or avoid the problem of the spacer being easy to fall off in the related art.

[0200] In some embodiments, the method for preparing the dimming module further includes: preparing a black matrix after preparing the first conductive layer and before preparing the spacers. Preparing the black matrix specifically includes: coating a black matrix-forming photoresist film on a side of the first conductive layer facing away from the first substrate; for example, coating a negative black matrix photoresist film.

[0201] The photoresist film is dried at 90°C for 120 seconds to remove small molecule solvents in the photoresist film and reduce the fluidity of the photoresist.

[0202] The photoresist film is exposed to ultraviolet light (i.e., UV light, generally in the 300-436 nm band) using a mask with a light-transmitting pattern, so that the photoresist film in the area corresponding to the light-transmitting pattern undergoes a polymerization reaction.

[0203] A potassium hydroxide (KOH) solution is sprayed on the exposed photoresist film to remove the non-polymerized photoresist film in the area outside the light-transmitting pattern to form a black matrix pattern; for example, a potassium hydroxide solution with a mass percentage of 0.04wt% is sprayed to clean the non-polymerized photoresist film.

[0204] The black matrix pattern is cured at 110° C. for 50 to 60 minutes to form a black matrix.

[0205] In some embodiments, the mask plate used in the process of preparing the black matrix and the mask plate used in the process of preparing the spacers may be the same mask plate.

[0206] The present disclosure also provides a dimming module. FIG14 is a schematic cross-sectional view of the structure of a dimming module according to the present disclosure. The dimming module further includes a second substrate and liquid crystal. The second substrate and the first substrate are aligned to form an alignment gap, and the liquid crystal is accommodated in the alignment gap. Spacers 4 are located in the alignment gap to support the second substrate. The liquid crystal includes dye liquid crystal. The dye liquid crystal includes liquid crystal molecules 9 and dye molecules 10. The second substrate includes a second base 11, a second conductive layer 12, and a second alignment film 13. The second conductive layer 12 and the second alignment film 13 are sequentially stacked on the second base 11.

[0207] In some embodiments, at least a portion of the second surface of the spacer 4 contacts the second orientation film 13; the second substrate 11 is made of a flexible material. Referring to Figure 15a , a schematic cross-sectional view of the curved surface region of the dimming module in the disclosed embodiment is shown. The dimming module includes a curved surface region 103. The second substrate further includes at least one fixing ring 14, which is located in the curved surface region 103. The fixing ring 14 is located on the side of the second conductive layer 12 near the dye liquid crystal and extends through the second orientation film 13 toward the first substrate. The top of the spacer 4 located in the curved surface region 103 is embedded in the fixing ring 14. Referring to Figure 16 , a schematic diagram of the nesting of the top of the spacer and the fixing ring is shown in the disclosed embodiment.

[0208] In some embodiments, referring to FIG15 b , another cross-sectional view of the arc surface area of ​​the dimming module in the disclosed embodiment is shown; wherein the fixing ring 14 is located on the side of the second alignment film 13 close to the dye liquid crystal and extends toward the first substrate.

[0209] Referring to Figure 17, it is a schematic structural cross-sectional view of a flexible dimming module with a curved surface area in the related art; the curved surface area 103 of the flexible dimming module is a hyperbolic arc. In the curved surface area 103 with a large curvature, the flexible dimming module is relatively large in curvature. Since the spacer 4 is only bonded to the first substrate 15 and not to the second substrate 16, the first substrate 15 and the second substrate 16 are easily misaligned in the curved surface area 103 with a large curvature, resulting in a change in the box thickness of the curved surface area 103 of the overall flexible dimming module.

[0210] In this embodiment, a fixing ring 14 is provided in the area of ​​the second substrate corresponding to the dimming module arc surface area 103, and the top of the spacer 4 is embedded in the fixing ring 14 after the second substrate is aligned with the first substrate, thereby preventing the second substrate from being misaligned with the first substrate, thereby avoiding changes in the box thickness of the dimming module arc surface area 103.

[0211] In some embodiments, the curved surface area may be an edge curved surface area formed only at the edge of the dimming module, or may be an entire curved surface area formed when the entire dimming module is bent.

[0212] In some embodiments, the retaining ring 14 is made of the same material as the spacer 4; the manufacturing process temperature of the retaining ring 14 is lower than the temperature tolerance of the second substrate 11. In some embodiments, the retaining ring 14 is made of the same flexible photoresist material as the spacer 4; the manufacturing process of the retaining ring 14 is the same as that of the spacer 4; that is, the retaining ring 14 is manufactured through an exposure process, thereby achieving a low-temperature manufacturing process for the retaining ring 14 and preventing damage to the flexibility of the second substrate 11 caused by excessively high manufacturing temperatures of the retaining ring 14.

[0213] In some embodiments, the second conductive layer 12 is made of the same material and prepared using the same process as the first conductive layer 2; and the second alignment film 13 is made of the same material and prepared using the same process as the first alignment film 3. This allows for a low-temperature preparation process for the second alignment film 13, preventing damage to the flexibility of the second substrate 11 caused by excessively high preparation temperatures.

[0214] In some embodiments, the dimming structure further includes a frame sealant (not shown in the figure), which is located in the frame area, and the second substrate is connected to the first substrate through the frame sealant; silicon balls are added to the frame sealant, and the silicon balls can provide support for the frame sealant; and / or, spacers are provided in the area where the frame sealant is located, and the spacers can provide support for the frame sealant.

[0215] In some embodiments, the height of the spacer is 12 μm; the thickness of the alignment gap in the dimming structure is the height of the spacer minus the thickness of the first alignment film.

[0216] In some embodiments, the diameter of the silicon ball is generally from the height of the spacer + 0.1 μm to the height of the spacer + 0.5 μm.

[0217] The embodiment of the present disclosure also provides a dimming module, referring to Figure 18, which is a structural cross-sectional schematic diagram of another dimming module in the embodiment of the present disclosure; Figure 19 is a structural cross-sectional schematic diagram of yet another dimming module in the embodiment of the present disclosure; the dimming module also includes a first barrier layer 25, a second barrier layer 26 and a side coating glue, the first barrier layer 25 and the second barrier layer 26 are located between the first substrate and the second substrate, or the first barrier layer 25 and the second barrier layer 26 are respectively located on the side of the first substrate and the second substrate away from the dye liquid crystal; the side coating glue 28 is located between the first barrier layer 25 and the second barrier layer 26, and the side coating glue 28 is located on the side of the sealing glue 27 away from the dimming area.

[0218] In some embodiments, referring to Figure 18, the first barrier layer 25 is located between the first substrate 1 and the first conductive layer 2; the second barrier layer 26 is located between the second substrate 11 and the second conductive layer 12; the orthographic projections of the first conductive layer 2, the second conductive layer 12, the first orientation film 3 and the second orientation film 13 on the first substrate 1 do not overlap with the orthographic projection of the frame-sealing glue 27 on the first substrate 1; the orthographic projections of the first barrier layer 25 and the second barrier layer 26 on the first substrate 1 overlap with the orthographic projections of the frame-sealing glue 27 on the first substrate 1, and the first barrier layer 25 and the second barrier layer 26 are in contact and connected with the frame-sealing glue 27 and the side coating glue 28, respectively.

[0219] Among them, by setting the first barrier layer 25 and the second barrier layer 26, the gas barrier performance of the first substrate side and the second substrate side can be improved; by making the frame sealing glue 27 contact with the first barrier layer 25 and the second barrier layer 26, the frame sealing glue 27 is prevented from contacting the first orientation film 3 and the second orientation film 13. Compared with the situation in which the frame sealing glue 27 contacts the first orientation film 3 and the second orientation film 13 in the related art, the frame sealing glue 27 can form a larger and more stable and reliable bonding force with the first barrier layer 25 and the second barrier layer 26, thereby avoiding the risk of gas permeation caused by debonding of the frame sealing glue 27 and the first orientation film 3 and the second orientation film 13.

[0220] In some embodiments, the material of the first barrier layer 25 and the second barrier layer 26 includes silicon nitride or silicon oxide.

[0221] In some embodiments, the thickness of the first barrier layer 25 is in the range of 1 to 2 μm; the thickness of the second barrier layer 26 is in the range of 1 to 2 μm.

[0222] In some embodiments, side adhesive 28 is located in the border region, on the side of the frame sealant 27 facing away from the dimming region. Side adhesive 28 is located between the first barrier layer 25 and the second barrier layer 26, and is in contact with and connected to each of the first and second barrier layers 25 and 26. The provision of side adhesive 28 can slow the rate at which ambient air enters the dimming module through the frame sealant 27, further improving the moisture barrier performance of the dimming module's sides.

[0223] In some embodiments, the side adhesive 28 may be made of UV-curable acrylic resin, heat-curable epoxy adhesive, or organic silicone. The width of the side adhesive 28 in the direction away from the frame sealant 27 may be 5 to 10 mm.

[0224] In some embodiments, the first substrate 1 and the second substrate 11 can be made of transparent polymer materials such as PET, PEN, PC, PPSU, PES, PMMA, etc., and the thickness can be 50 to 200 μm; the first conductive layer 2 and the second conductive layer 12 can be made of materials such as indium tin oxide, gallium nitride, nanosilver, etc., and the thickness can be 50 to 100 nm; the first orientation film 3 and the second orientation film 13 can be made of polyimide material, and the thickness can be 500 to 1000 angstroms; the spacer 4 can be the spacer 4 in the above embodiment, and the height of the spacer 4 is 8 to 20 μm; the liquid crystal material can be a gray-black dye liquid crystal material with a guest-host effect; the material of the frame sealing glue 27 is a mixture of light-curing and heat-curing acrylic resin and epoxy resin, and the width of the frame sealing glue 27 along the direction away from the mating gap can be 1 to 5 mm.

[0225] The embodiment of the present disclosure further provides a dimming module, referring to FIG. 19 , wherein the first barrier layer 25 is located on a side of the first substrate facing away from the second substrate; the second barrier layer 26 is located on a side of the second substrate facing away from the first substrate.

[0226] In some embodiments, the side glue 28 is located in the border area and on the side of the frame glue 27 away from the dimming area. The side glue 28 is located between the first barrier layer 25 and the second barrier layer 26 and is in contact with and connected to the first barrier layer 25 and the second barrier layer 26 respectively.

[0227] In some embodiments, the first barrier layer 25 and the second barrier layer 26 include a base film 29 , a barrier film 30 , and an optical adhesive film 31 , respectively. The base film 29 , the barrier film 30 , and the optical adhesive film 31 are stacked in sequence.

[0228] In some embodiments, the base film 29 is made of a transparent polymer material, and the barrier film 30 is made of silicon nitride or silicon oxide. In some embodiments, the base film 29 is made of PET material, and the optical adhesive film 31 is made of a transparent optical adhesive material.

[0229] In some embodiments, the thickness of the first barrier layer 25 ranges from 50 to 200 μm, the thickness of the second barrier layer 26 ranges from 50 to 200 μm, the thickness of the base film 29 ranges from 25 to 175 μm, the thickness of the barrier film 30 ranges from 1 to 2 μm, and the thickness of the optical adhesive film 31 ranges from 5 to 25 μm.

[0230] The first and second barrier layers 25 and 26 in Figure 19 are directly attached to the outsides of the first and second substrates, respectively. The first and second barrier layers 25 and 26 in Figure 18 are fabricated via chemical vapor deposition. The dimming module in Figure 19 simplifies the fabrication process for the first and second barrier layers 25 and 26 compared to the dimming module in Figure 18, while still achieving good gas barrier performance. However, the dimming module in Figure 19 has more film layers and a more complex structure, posing challenges to the durability of the optical adhesive film 31 in the first and second barrier layers 25 and 26, as well as the thermal compatibility between the base film 29 and the first and second substrates 1 and 11. Material selection requires greater attention to the durability of the optical adhesive film 31 against UV light, and the base film 29, first and second substrates 1 and 11 must exhibit comparable thermal shrinkage.

[0231] In some embodiments, based on the above-mentioned structure of the dimming module, the preparation method of the dimming module in the embodiment of the present disclosure also includes: preparing a second substrate; dripping dye liquid crystal on the mating surface of the first substrate, applying sealing glue on the four border areas around the mating surface of the second substrate, and then vacuum-fitting the first substrate and the second substrate; cutting off the excess parts of the four border areas and binding the peripheral circuit board to form a dimming module.

[0232] In some embodiments, the first substrate and the second substrate are subjected to a bonding pressure test. The three distribution densities of the spacers in the first substrate have a bonding pressure bearing capacity greater than 80 kgf / cm2 on the dimming module in the test. 2 .

[0233] In some embodiments, preparing the first substrate further comprises: forming a first barrier layer before forming the first conductive layer on the first substrate. Preparing the second substrate further comprises: forming a second barrier layer on the second substrate; forming a second conductive layer on the second substrate having completed the above steps; and forming a second alignment film on the second substrate having completed the above steps.

[0234] The first barrier layer and the second barrier layer are formed into film layers through chemical vapor deposition, exposure, and dry etching processes.

[0235] In some embodiments, based on the above-mentioned structure of the dimming module, the preparation method of the dimming module in the embodiment of the present disclosure also includes: preparing a second substrate; aligning the first substrate and the second substrate; the preparation method also includes: preparing a first barrier layer on the side of the first substrate facing away from the second substrate; preparing a second barrier layer on the side of the second substrate facing away from the first substrate.

[0236] Among them, the first barrier layer and the second barrier layer are respectively prepared to form a stacked film layer composed of a base film, a barrier film and an optical adhesive film stacked in sequence. After the first substrate and the second substrate are aligned, the first barrier layer and the second barrier layer are respectively attached to the first substrate and the second substrate through the optical adhesive film.

[0237] The dimming module provided in the embodiment of the present disclosure, on the one hand, by positioning the spacer 4 on the first conductive layer 2 and extending through the first orientation film 3 in a direction away from the first substrate 1, the spacer 4 is in contact with and connected to both the first conductive layer 2 and the first orientation film 3. Compared with the connection method in the related art that can only realize point contact between the supporting spacer and the orientation film, the contact and connection area between the spacer 4 and the film layer where it is located is greatly increased, thereby improving the connection strength between the spacer 4 and the film layer where it is located, improving or avoiding the problem that the spacer 4 is easy to fall off, and thus better solving the white spot problem of the dimming module; on the other hand, the surface of the area around the position of the spacer 4 is covered by the first orientation film 3, and the first orientation film 3 can align the liquid crystal molecules in the dimming module, which can improve the liquid crystal around the spacer 4. The problem of disordered molecular orientation is solved, thereby improving the phenomenon of light leakage around the spacer 4; on the other hand, the first substrate 1 adopts a flexible light-transmitting material, and the process temperature that the first substrate 1 can withstand during the preparation process of the dimming module is lower than the tolerance temperature of the traditional hard substrate (such as the glass substrate) (such as 230°C for the glass substrate), such as the tolerance process temperature of the flexible first substrate 1 is generally less than 150°C; at the same time, the warping of the flexible first substrate 1 during the preparation process needs to be less than 0.5mm; by making the preparation process temperature of the spacer 4 lower than the tolerance temperature of the first substrate 1, it can be ensured that the preparation of the spacer 4 will not change the flexibility performance parameters of the first substrate 1, so that the flexibility performance of the dimming module formed with the spacer 4 structure in this embodiment is more stable, thereby being able to meet the flexibility performance requirements of the dimming module.

[0238] The present embodiment also provides a dimming device, refer to Figure 20, which is a structural cross-sectional schematic diagram of the dimming device in the present embodiment; wherein, the dimming device includes the dimming module 17 in the above embodiment; it also includes a first cover plate 18 and a second cover plate 19, and the dimming module 17 is located between the first cover plate 18 and the second cover plate 19; the first substrate in the dimming module 17 and the first cover plate 18 are bonded together by a first adhesive layer 20; the second substrate in the dimming module 17 and the second cover plate 19 are bonded together by a second adhesive layer 21; the first cover plate 18 and the second cover plate 19 are sealed and bonded by the first adhesive layer 20 and the second adhesive layer 21.

[0239] In some embodiments, the dimming device is formed by aligning the first cover plate 18, the dimming module 17, and the second cover plate 19, heating to melt the first adhesive layer 20 and the second adhesive layer 21, and then applying pressure to close the pieces. The closing pressure of the dimming device is generally 12 bar ≈ 12 kgf / cm 2 It can be seen that the spacers of the three distribution densities in the dimming module of the above embodiment can all withstand the closing pressure of the dimming device.

[0240] In some embodiments, the dimming device further includes a first edge masking layer 32 and a second edge masking layer 33. The first edge masking layer 32 is located on a side of the first cover plate 18 facing away from the second cover plate 19. The orthographic projection of the first edge masking layer 32 on the first cover plate 18 covers the area from the frame sealant 27 in the dimming module 17 to the edge of the first cover plate 18. The second edge masking layer 33 is located on a side of the second cover plate 19 facing away from the first cover plate 18. The orthographic projection of the second edge masking layer 33 on the second cover plate 19 covers the area from the frame sealant 27 in the dimming module 17 to the edge of the second cover plate 19. That is, the orthographic projections of the first edge masking layer 32 and the second edge masking layer 33 on the first cover plate 18 cover the frame sealant 27, the side adhesive 28, and the edge areas of the first and second cover plates 18 and 19 on the side of the side adhesive 28 away from the frame sealant 27.

[0241] In some embodiments, the first edge masking layer 32 is formed by printing ink on the peripheral edge areas of the first cover plate 18 , and the second edge masking layer 33 is formed by printing ink on the peripheral edge areas of the second cover plate 19 .

[0242] The dimming device provided in the embodiments of the present disclosure can solve the white spot problem of the dimming device and improve the quality of the dimming device by adopting the dimming module in the above embodiments.

[0243] The dimming device in the embodiment of the present disclosure can be used as various dimming windows, such as vehicle windows, indoor windows, etc.

[0244] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A dimming module, wherein: include: A first substrate, a second substrate, a plurality of spacers, a frame sealant and a dye liquid crystal; The first substrate comprises a first base, a first conductive layer and a first alignment film; The first conductive layer and the first alignment film are sequentially stacked on a side of the first substrate close to the dye liquid crystal; The spacer is located on a side of the first conductive layer close to the dye liquid crystal; The second substrate comprises a second base, a second conductive layer and a second alignment film; The second conductive layer and the second alignment film are sequentially stacked on a side of the second substrate close to the dye liquid crystal; The second substrate is aligned with the first substrate, the frame sealant is located between the first substrate and the second substrate, and is surrounded to form a dimming area; the dye liquid crystal is located in the dimming area; In the dimming area, the spacing distance between adjacent spacers is 50-1000 μm.

2. The dimming module according to claim 1, wherein: The material of the first substrate is any one of polyethylene terephthalate, polycarbonate, triacetyl cellulose, and cycloolefin polymer, and the material of the second substrate is any one of polyethylene terephthalate, polycarbonate, triacetyl cellulose, and cycloolefin polymer.

3. The dimming module according to claim 1, wherein: The orthographic projection of the spacer on the first substrate overlaps with the orthographic projection of the frame sealing adhesive on the first substrate.

4. The dimming module according to claim 3, wherein: The minimum distance between the spacer and a first edge of the frame sealant away from the dimming zone is smaller than the spacing distance between adjacent spacers.

5. The dimming module according to claim 3, wherein: The minimum distance between the spacer and a first edge of the frame sealant away from the dimming zone is greater than the spacing distance between adjacent spacers.

6. The dimming module according to claim 1, wherein: The spacing distance between adjacent spacers ranges from 50 to 500 μm.

7. The dimming module according to claim 6, wherein: The radial dimension of the first surface of the spacer located on the first conductive layer is in the range of 10 to 40 μm; The radial dimension of the second surface of the spacer is in the range of 5 to 30 μm; The height of the spacer is in the range of 4 to 30 μm.

8. The dimming module according to claim 7, wherein: The radial dimension of the first surface of the spacer is 20 to 30 μm; the radial dimension of the second surface of the spacer is 10 to 20 μm; and the height of the spacer is 8 to 15 μm.

9. The dimming module according to claim 1, wherein: The spacers include main spacers and auxiliary spacers; The radial dimension of the first surface of the main spacer is greater than the radial dimension of the first surface of the auxiliary spacer; and / or, the radial dimension of the second surface of the main spacer is greater than the radial dimension of the second surface of the auxiliary spacer; And / or, the height dimension of the main spacer is greater than the height dimension of the auxiliary spacer.

10. The dimming module according to claim 1, wherein: The spacing distance between adjacent spacers ranges from 0.05 to 1 mm. The spacers extend along a first direction and a second direction to form a grid, and the first direction and the second direction are parallel to and intersect the first substrate.

11. The dimming module according to claim 10, wherein: The width of the first surface of the spacer located on the first conductive layer is in the range of 10 to 30 μm; The width of the second surface of the spacer is in the range of 5 to 20 μm; The height of the spacer is in the range of 4 to 30 μm; The spacer is in a grid shape; the grid shape includes a square grid shape, a rectangular grid shape or a regular hexagonal grid shape.

12. The dimming module according to claim 1, wherein: It also includes a black matrix located between the first conductive layer and the spacer, and the orthographic projection of the spacer on the first substrate is located within the orthographic projection area of ​​the black matrix on the first substrate.

13. The dimming module according to claim 2, wherein: At least a portion of the second surface of the spacer is in contact with the second alignment film; The dimming module includes a curved surface area; The second substrate further comprises at least one fixing ring, and the fixing ring is located in the arc surface area; The fixing ring is located on a side of the second conductive layer close to the dye liquid crystal, and extends through the second alignment film toward the first substrate; Alternatively, the fixing ring is located on a side of the second alignment film close to the dye liquid crystal, and extends in a direction close to the first substrate; The top of the spacer located in the arc surface area is embedded in the fixing ring.

14. The dimming module according to claim 1, wherein: It also includes a first barrier layer, a second barrier layer and a side coating layer. The first barrier layer and the second barrier layer are located between the first substrate and the second substrate, or the first barrier layer and the second barrier layer are located on the first substrate and the second substrate, respectively, on a side away from the dye liquid crystal; The side-coated glue is located between the first barrier layer and the second barrier layer, and the side-coated glue is located on a side of the frame-sealing glue away from the dimming area.

15. The dimming module according to claim 14, wherein: The first barrier layer is located between the first substrate and the first conductive layer; The second barrier layer is located between the second substrate and the second conductive layer; The orthographic projections of the first conductive layer, the second conductive layer, the first alignment film, and the second alignment film on the first substrate do not overlap with the orthographic projections of the frame sealant and the side coating glue on the first substrate; The orthographic projections of the first barrier layer and the second barrier layer on the first substrate overlap with the orthographic projections of the frame sealant and the side coating glue on the first substrate, and the first barrier layer and the second barrier layer are in contact and connected with the frame sealant and the side coating glue respectively.

16. The dimming module according to claim 14, wherein: The first barrier layer is located on a side of the first substrate facing away from the second substrate; The second barrier layer is located on a side of the second substrate facing away from the first substrate; The orthographic projection of the side coating glue on the first barrier layer does not overlap with the first substrate; The orthographic projection of the side coating glue on the second barrier layer does not overlap with the second substrate; The side coating glue is in contact with and connected to the first barrier layer and the second barrier layer respectively.

17. The dimming module according to claim 15, wherein: The materials of the first barrier layer and the second barrier layer include silicon nitride or silicon oxide.

18. The dimming module according to claim 15, wherein: The thickness of the first barrier layer ranges from 1 to 2 μm; The thickness of the second barrier layer is in the range of 1 to 2 μm.

19. The dimming module according to claim 16, wherein: The first barrier layer and the second barrier layer respectively include a base film, a barrier film and an optical adhesive film, and the base film, the barrier film and the optical adhesive film are stacked in sequence.

20. The dimming module according to claim 19, wherein: The thickness of the first barrier layer ranges from 50 to 200 μm; The thickness of the second barrier layer is in the range of 50 to 200 μm.

21. The dimming module according to claim 1, wherein: The elastic recovery rate of the spacer under a pressure of 5 to 30 mN is 80% to 90%.

22. The dimming module according to claim 1, wherein: The dimming module can withstand the pressure of the combined piece greater than 80kgf / cm 2 .

23. A dimming device, wherein: A dimming module comprising any one of claims 1 to 22; It also includes a first cover plate and a second cover plate, and the dimming module is located between the first cover plate and the second cover plate; The first substrate in the dimming module is bonded to the first cover plate via a first adhesive layer; The second substrate in the dimming module is bonded to the second cover plate through a second adhesive layer. Knot; The first cover plate and the second cover plate are sealed and bonded by the first adhesive layer and the second adhesive layer.

24. The dimming device according to claim 23, wherein: It also includes a first edge shielding layer and a second edge shielding layer, The first edge-shielding layer is located on a side of the first cover plate away from the second cover plate, and the orthographic projection of the first edge-shielding layer on the first cover plate covers the area from the sealing glue in the dimming module to the edge of the first cover plate; The second edge-shielding layer is located on a side of the second cover plate away from the first cover plate, and the orthographic projection of the second edge-shielding layer on the second cover plate covers the area from the sealing glue in the dimming module to the edge of the second cover plate.

25. A method for preparing a dimming module, wherein: include: preparing a first substrate; preparing a second substrate; Aligning the first substrate with the second substrate and sealing them with a frame sealant, and injecting dye liquid crystal into the dimming area surrounded by the frame sealant; The preparing the first substrate comprises: preparing a first conductive layer on the first base; Preparing a plurality of spacers on the first substrate after completing the above steps; Preparing a first alignment film on the first substrate after completing the above steps; The preparing the second substrate comprises: preparing a second conductive layer on the second base; A second alignment film is prepared on the second substrate after completing the above steps.

26. The method for preparing a dimming module according to claim 25, wherein: The method comprises: preparing a plurality of spacers on the first substrate on which the first conductive layer is prepared by using an exposure process, comprising: coating a photoresist film on a side of the first conductive layer facing away from the first substrate; Drying the photoresist film at 80-100° C. for 100-120 seconds; Using a mask having a light-transmitting pattern to expose the photoresist film to ultraviolet light, so that the photoresist film in the area corresponding to the light-transmitting pattern undergoes a polymerization reaction; Spraying potassium hydroxide solution on the exposed photoresist film to remove the photoresist film in the area other than the light-transmitting pattern where no polymerization reaction has occurred, thereby forming the pattern of the spacer; The pattern of the spacer is cured at 100-110° C. for 50-60 minutes to form the spacer.

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