Wafer cleaning device and cleaning method thereof

Abstract

The present invention discloses a wafer cleaning device and a cleaning method thereof, which belongs to the field of wafer cleaning, and comprises an operating table having an installation plane thereon, and a cleaning box is removably arranged on the installation plane thereof. The wafer cleaning device and the cleaning method of the present invention, through the arranged driving component, after the staff inserts the driving shaft into the external shaft seat, can form a detachable whole between the driving component and the feeding piece, and by turning on the switch of the second driving motor to rotate the driving shaft, the feeding piece can be driven to rotate, so that the feeding piece can drive multiple groups of wafers to perform cleaning operations in the cleaning box, and at the same time, the first bevel gear and the second bevel gear can be driven to rotate, so as to drive the cam to rotate, and in this process, the counterweight rod sleeve can be arranged so that the extension rod can be counterweighted when rotating.

Description

Technical Field

[0001] The invention belongs to the field of wafer cleaning, and in particular relates to a wafer cleaning device and a cleaning method thereof. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. Domestic wafer production lines are mainly 8 inches and 12 inches. Generally, the colloid and impurities on the surface of the wafer need to be cleaned after processing. How to quickly clean multiple groups of wafers has become a technical problem that needs to be solved urgently.

[0003] The present invention seeks to alleviate or at least mitigate such problems or deficiencies by providing new or otherwise improved wafer cleaning. Summary of the invention

[0004] In view of one or more of the above defects or improvement needs in the prior art, the present invention provides a wafer cleaning device and a cleaning method thereof, which have the advantage of being able to quickly and efficiently clean multiple groups of wafers.

[0005] To achieve the above-mentioned object, the present invention provides a wafer cleaning device, which includes an operating table having a mounting plane, on which a cleaning box is removably arranged;

[0006] A heating component is detachably arranged on the installation plane and can cover the operating table;

[0007] An adjusting member is detachably arranged on the mounting plane and is capable of surrounding the operating table;

[0008] A material feeding and pushing member, which is detachably mounted on the adjusting member;

[0009] A driving member, which is detachably mounted on the adjusting member and can be inserted into the cleaning box;

[0010] A first follow-up shaking member, which is detachably mounted on an inner side wall of the cleaning box;

[0011] A liquid replenishing component, which is detachably installed in the cleaning box;

[0012] A linkage stirring member, which is detachably arranged on the liquid replenishing member;

[0013] A linkage blocking member, which is detachably mounted on the driving member and can penetrate into the fluid replenishing member;

[0014] The second follow-up shaking component is detachably arranged on the inner wall of the cleaning box.

[0015] As a further improvement of the present invention, the adjusting member comprises a first frame which is detachably mounted on the mounting plane, and a slide rail is detachably mounted on the first frame;

[0016] A second frame is detachably arranged on the installation plane, the second frame is located on one side of the first frame, a connecting frame is detachably mounted on the second frame, a first driving motor is detachably mounted on the connecting frame, and an output end of the first driving motor can be inserted into the connecting frame, and a connecting screw is detachably mounted on the output end of the first driving motor;

[0017] A ball bearing base is slidably arranged in the connecting frame, and the connecting screw rod can pass through the ball bearing base;

[0018] A horizontal plate is detachably mounted on the ball bearing base, and a sliding block capable of sliding on the sliding rail is detachably arranged at the bottom of the horizontal plate;

[0019] The first electric cylinder is detachably mounted on the transverse plate, and an external ring is detachably mounted on the output end of the first electric cylinder.

[0020] As a further improvement of the present invention, the feed pushing member includes a third frame, which is detachably mounted on the mounting plane;

[0021] A second electric cylinder is detachably mounted on the third frame, and a feeding tray is detachably mounted on an output end of the second electric cylinder;

[0022] Two groups of feed plates are detachably arranged on the feed tray, a third electric cylinder is detachably arranged on each group of the feed plates, and a positioning plate is detachably arranged on the output end of each group of the third electric cylinder;

[0023] A feeding piece, which is removably arranged on the feeding tray and is located between two sets of positioning plates;

[0024] The feed piece includes multiple groups of supporting sub-plates, on which multiple groups of supporting sub-plates are detachably provided with multiple groups of penetration rods, which combine the multiple groups of supporting sub-plates, and a supporting area for the wafer to pass through is formed between every two of the supporting sub-plates. An external shaft seat is detachably installed on the supporting sub-plates, and a clamping plate is also removably installed on the multiple groups of supporting sub-plates, and the clamping plate can clamp the topmost group of supporting sub-plates and the bottommost group of supporting sub-plates at the same time. Two groups of positioning screws are rotatably provided on the clamping plate, and the positioning screws can penetrate into the topmost group of supporting sub-plates and the bottommost group of supporting sub-plates.

[0025] As a further improvement of the present invention, the driving member includes a second driving motor, which is detachably mounted on the adjusting member, a set of disks is detachably mounted on the second driving motor, a driving shaft is detachably arranged on the output end of the second driving motor, and the driving shaft can be inserted into the cleaning box;

[0026] A first bevel gear is detachably mounted on the drive shaft and is located in the sleeve;

[0027] The extension rod is rotatably arranged in the sleeve, and a second bevel gear is detachably arranged on the extension rod, and the second bevel gear is meshed with the first bevel gear. A counterweight rod sleeve is also detachably installed on the extension rod, and a cam is also detachably installed on one tail end of the extension rod.

[0028] As a further improvement of the present invention, the first follower rocking member comprises a follower plate, which is detachably mounted on an inner side wall of the cleaning box;

[0029] A follower rod is inserted into the follower plate, and the follower rod can slide up and down along the follower plate;

[0030] A follower roller rotatably mounted on the top of the follower rod;

[0031] A stabilizing rod, which is detachably mounted on the top of the follower rod, and the stabilizing rod can pass through the follower plate, and a gasket is arranged on one end of the stabilizing rod passing through the follower plate;

[0032] A second spring removably disposed on the stabilizing rod;

[0033] A follower rocking plate is detachably mounted on the bottom of the follower rod, and a tail plate is detachably mounted on the follower rocking plate;

[0034] Three sets of tooth plates are detachably mounted on the side surfaces of the follower shaking plate, and the number of teeth of the three sets of tooth plates increases gradually from bottom to top;

[0035] An internal shaft seat is detachably mounted on an inner wall of the cleaning box, a gear rod is rotatably arranged in the internal shaft seat, a first follower gear is detachably arranged on the gear rod, in the initial position, the first follower gear is meshed with a set of tooth plates located at the lowest position, a second follower gear is also detachably mounted on the gear rod, a belt is removably arranged on the second follower gear, and the belt can drive multiple sets of second follower gears to rotate, and multiple sets of cross stirring blades are also detachably arranged on the gear rod.

[0036] As a further improvement of the present invention, the liquid replenishing member includes a first vertical plate, which is detachably installed in the cleaning box, and a second vertical plate is slidably arranged in the first vertical plate;

[0037] A liquid infusion tube is detachably mounted on a second vertical plate and has a flow channel in the liquid infusion tube;

[0038] A liquid replenishing box is detachably mounted on the liquid replenishing tube, and a liquid inlet pipe and a liquid outlet pipe are detachably mounted on the liquid replenishing tube;

[0039] A suction pump, which is detachably mounted on the liquid infusion tube, and the suction pump is respectively connected to the liquid infusion tank and one end of the liquid infusion tube;

[0040] The liquid outlet hopper is detachably mounted on a liquid outlet end of the liquid infusion tube, and an inclined angle is formed between the liquid outlet hopper and the liquid infusion tube.

[0041] As a further improvement of the present invention, the linkage stirring member comprises a diamond-shaped sleeve plate, which is detachably mounted on the infusion tube, a stirring shaft is rotatably arranged at the four corners of the diamond-shaped sleeve plate, and a meshing wheel is detachably arranged at one end of the stirring shaft passing through the diamond-shaped sleeve plate;

[0042] A Jiaolong blade is detachably mounted on the stirring shaft;

[0043] A plurality of sets of transverse axes are detachably mounted on the stirring shaft, and are arranged from top to bottom along the length direction of the stirring shaft. An inclined blade is detachably arranged on both ends of each set of the transverse axes.

[0044] As a further improvement of the present invention, the linkage blocking member includes a sleeve, which is detachably mounted on the driving member, and two sets of frame frames are detachably arranged on the outer circumferential surface of the sleeve;

[0045] A linkage block is slidably arranged in the frame, and in an initial state, the linkage block can fit with the sleeve;

[0046] A linkage rod is detachably mounted on the linkage block, and the linkage rod can pass through the frame, and a guide block is detachably mounted on one end of the linkage rod passing through the frame;

[0047] A third spring is removably sleeved on the linkage rod and is located inside the frame;

[0048] a collar detachably mounted on the drive member;

[0049] A swing rod, one end of which is rotatably arranged on the linkage block, and the other end of which is rotatably arranged on the sleeve ring;

[0050] A bearing is detachably mounted in the collar, and a side rod is detachably mounted on one end of the bearing;

[0051] A sealing plate is detachably mounted on the side rod, and has three groups of through holes, and the apertures of the three groups of through holes gradually increase from bottom to top. The sealing plate can be inserted into the infusion tube to seal and regulate the flow channel formed by the infusion tube.

[0052] As a further improvement of the present invention, the second follow-up shaking member includes a bonding disk, which is detachably mounted on the driving member, and two groups of non-magnetic rings are detachably arranged in the bonding disk, and a first permanent magnet ring and a second permanent magnet ring are also detachably arranged in the bonding disk, and the first permanent magnet ring and the second permanent magnet ring are respectively located between the two groups of non-magnetic rings;

[0053] A mounting plate is detachably mounted on the inner side wall of the cleaning box, a plug-in plate is slidably arranged in the mounting plate, a pressing wheel is rotatably arranged on one end of the plug-in plate, and a permanent magnetic plate is detachably arranged on the other end of the plug-in plate;

[0054] A mounting rod is detachably mounted on the permanent magnet plate, and the mounting rod can pass through the mounting plate, a limit block is detachably mounted on one end of the mounting rod passing through the mounting plate, and a fourth spring is removably sleeved on the mounting rod;

[0055] The heating component comprises a heating frame, which can cover the cleaning box, and a heating pipe is detachably arranged in the heating frame;

[0056] A connection box is detachably mounted on the mounting plane and can be penetrated by the heating pipe. An inner panel is detachably mounted in the connection box.

[0057] An air bag, which is detachably mounted on the bottom of the connection box;

[0058] A lower pressing plate, on which a plug rod is detachably arranged, and the plug rod can pass through the inner plate, an upper pressing plate is detachably arranged on one end of the plug rod passing through the inner plate, and a first spring is removably sleeved on the plug rod;

[0059] A liquid supply bag is detachably mounted in the connection box, and in an initial position, the liquid supply bag is in contact with the upper pressing plate;

[0060] A spray pipe is detachably mounted on the liquid supply bag and can pass through the connection box. A spray head is detachably arranged on the spray pipe.

[0061] Another technical problem to be solved by the present invention is a cleaning method for a wafer cleaning device.

[0062] S1. Feeding and pushing wafers: loading multiple groups of wafers into a feeder, and pushing the wafers to a predetermined position through a feeder pushing member;

[0063] S2. Wafer conveying operation: opening the adjusting member to complete the adjustment of the driving member along the front-back direction, opening the adjusting member to push the driving member into the feeding member, then opening the feeding pushing member to withdraw it to the initial position, and continuing to open the adjusting member to send the driving member into the cleaning box;

[0064] S3, cleaning operation of the wafer: by turning on the driving component to drive the feeding component to rotate, so that the wafer in the feeding component can be rotated and cleaned in the cleaning box, and as the rotation speed of the driving component is further increased, the linkage blocking component can be driven to be linked to increase the speed of releasing the reaction liquid in the liquid replenishing component, and at the same time, the increase in the rotation speed of the driving component can further improve the cleaning efficiency of the wafer, and the concentration of the reaction liquid in the cleaning box can be increased to improve the cleaning efficiency of the wafer;

[0065] S4, triggering the first follower shaking member: when the driving member is output, the first follower shaking member can be driven to move at the same time, and the mixed liquid in the cleaning box can be shaken in the up and down directions to increase the mixing speed of the reaction liquid and water, and at the same time, the mixed liquid of the reaction liquid and water can be stirred;

[0066] S5. triggering the second follower shaking member: when the driving member is output, the second follower shaking member can vibrate the inner wall of the cleaning box to prevent the reactants from adhering to the inner wall of the cleaning box, and at the same time can shake the mixed liquid of the reaction liquid and water in the front-back direction;

[0067] S6. Heating the cleaning box: The cleaning box can be heated by turning on the heating component to promote the fusion of the reaction liquid and water in the cleaning box. While heating the cleaning box, the reaction liquid can be further fed into the cleaning box.

[0068] In general, compared with the prior art, the above technical solution conceived by the present invention has the following beneficial effects:

[0069] 1. The wafer cleaning equipment and the cleaning method of the present invention, through the arranged driving member, after the staff inserts the driving shaft into the external shaft seat, the driving member and the feeding member can form a detachable whole, and by turning on the switch of the second driving motor to rotate the driving shaft, the feeding member can be driven to rotate, so that the feeding member can drive multiple groups of wafers to perform cleaning operations in the cleaning box, and at the same time, the first bevel gear and the second bevel gear can be driven to rotate, so as to drive the cam to rotate. In this process, the counterweight rod sleeve can be arranged to make the extension rod counterweighted when rotating;

[0070] 2. The wafer cleaning equipment and the cleaning method thereof of the present invention, through the arrangement of the first follower shaking component, when the cam rotates, when the raised end of the cam touches the follower roller, it can drive the follower rod to move downward, and at the same time, the stabilizing rod moves downward, and the second spring is compressed, and after the follower rod moves downward, it can drive the follower shaking plate to move downward, so that the follower shaking plate and the tail plate can shake the mixture of the reaction liquid and water along the up and down directions to accelerate the mixing speed between the reaction liquid and the water, when the smooth disk end of the cam contacts the follower roller, it can drive the follower roller back to the initial position when the second spring retracts, and in the process of the follower shaking plate moving downward, it can also drive the tooth plate to move downward, so that the tooth plate drives the first follower gear to rotate, thereby driving the second follower gear to rotate, and at the same time driving multiple groups of cross stirring blades to further accelerate the reaction liquid and The mixing speed between the reaction liquid and the water is improved by driving the second follower gear at the upper and lower ends to rotate when the second follower gear rotates, so as to drive the cross stirring blades at the upper and lower ends to rotate, so as to accelerate the mixing speed between the reaction liquid and the water in multiple directions. By accelerating the mixing speed between the reaction liquid and the water, the reaction speed between the impurities on the wafer and the mixed liquid can be further promoted. As the follower shaking plate moves downward, the resistance encountered is gradually increased. Therefore, by gradually increasing the number of teeth of the tooth plate from bottom to top, the meshing time between the tooth plate and the first follower gear is increased from bottom to top, which can further extend the rotation time of the second follower gear to accelerate the mixing between the reaction liquid and the water. In addition, in the process of the follower shaking plate moving upward, the cross stirring blade can be driven to reverse to promote the mixing operation of the mixed liquid and the water.

[0071] 3. The wafer cleaning equipment and the cleaning method of the present invention can extract the reaction liquid in the liquid replenishing box into the liquid replenishing pipe by opening the switch of the suction pump through the arranged liquid replenishing member, and the reaction liquid flows out through the liquid outlet end of the liquid replenishing pipe and falls through the liquid outlet bucket. In the process of the feeding pushing member stretching the driving member to move upward, the liquid replenishing member can be synchronously driven to move upward. At this time, the second vertical plate can be extended and retracted up and down in the first vertical plate to cooperate with the feeding pushing member to stretch and move the driving member upward;

[0072] 4. The wafer cleaning equipment and the cleaning method of the present invention, through the arranged linkage stirring components, when the staff makes the toothed disc penetrate until it conflicts with the multiple groups of meshing wheels, when the toothed disc meshes with the meshing wheels, it can drive the four groups of stirring shafts to rotate, so as to drive the four groups of dragon blades to rotate, so as to drive the horizontal axis and the inclined blades to rotate, so that the dragon blades and the inclined blades can stir the reaction liquid and water to accelerate the reaction between the mixed liquid and water, and when the reaction liquid and water are fully mixed, the reaction between the mixed liquid and the impurities on the wafer can be further accelerated to accelerate the cleaning operation of the wafer;

[0073] 5. The wafer cleaning device and the cleaning method of the present invention, through the arranged linkage blocking components, after the staff drives the driving shaft to rotate, since the driving shaft is connected with the collar, the collar can be driven to rotate and the sleeve can be driven to rotate. As the rotation speed of the driving component increases, the centrifugal force on the linkage block is increased, and the linkage block can be moved outward along the direction of the frame notch. After the two groups of linkage blocks move outward, the collar can be driven to move downward as a whole, and after the collar moves downward , and can drive the side rod and the sealing plate to move downward. After the sealing plate moves downward, the through hole can be replaced so that the small through hole is replaced by a through hole with an increased aperture, which can further accelerate the outflow speed of the reaction liquid in the liquid replenishing tube, so as to accelerate the speed of the reaction liquid flowing into the cleaning box. When the concentration of the reaction liquid in the cleaning box is improved, the reaction speed of the impurities on the wafer can be further accelerated. After the rotation speed of the driving shaft is increased, the rotation speed of the feeding part can be further accelerated, so as to accelerate the rotation speed of the wafer, so as to promote the cleaning speed of the wafer in the cleaning box;

[0074] 6. The wafer cleaning device and the cleaning method of the present invention can drive the bonding disk to rotate by rotating the driving shaft through the arranged second follower shaking member. When the first permanent magnetic ring rotates to correspond to the permanent magnetic plate, due to the principle of magnetic repulsion, the permanent magnetic plate can be driven to move backward. On the one hand, the permanent magnetic plate can drive the pressing wheel to vibrate the inner wall of the cleaning box to prevent impurities from staying on the inner wall of the cleaning box. On the other hand, when the permanent magnetic plate moves backward, the mixed liquid of the reaction liquid and water can be further shaken in the front-to-back direction. The liquid can be shaken in the up-down and front-to-back directions in cooperation with the first follower shaking member at the same time to further accelerate the mixing between the reaction liquid and water. When the non-magnetic ring moves to correspond to the permanent magnetic plate, the fourth spring can retract when it loses compression to push the permanent magnetic plate back to its initial position.

[0075] 7. The wafer cleaning equipment and the cleaning method of the present invention, through the arranged heating components, when the staff turns on the switch of the heating tube, on the one hand, the cleaning box can be annularly heated by the heating frame. By heating the mixture of the reaction liquid and water in the cleaning box, the thermal motion between the liquid molecules can be accelerated and the collision frequency between the molecules can be increased. The increase in the collision frequency is conducive to the uniform distribution and mixing between different liquid components. On the other hand, after being heated by the heating tube, the airbag can be expanded by heat to push the lower pressure plate and the upper pressure plate to move up. When the upper pressure plate moves up, it can push the liquid supply bag to release the reaction liquid into the cleaning box through the nozzle. By replenishing the liquid in the cleaning box, it can be prevented that the reaction liquid reacts with the impurities on the wafer, resulting in a decrease in the concentration of the reaction liquid and a decrease in the cleaning efficiency of the wafer. By increasing the rotation speed of the drive shaft, the cleaning efficiency of the wafer can be accelerated synchronously. On the other hand, it can promote the up and down shaking frequency of the first follow-up shaking component, on the other hand, it can promote the front and back shaking frequency of the second follow-up shaking component, and finally on the other hand, it can synchronously increase the feeding speed of the liquid replenishing component. BRIEF DESCRIPTION OF THE DRAWINGS

[0076] Figure 1 It is a schematic diagram of the overall structure of the wafer cleaning equipment of the present invention;

[0077] Figure 2 It is a structural schematic diagram of the wafer cleaning device of the present invention viewed from another angle;

[0078] Figure 3 It is a schematic diagram of the overall structure of the regulating component of the present invention;

[0079] Figure 4 It is a schematic diagram of the overall structure of the feeding and pushing component of the present invention;

[0080] Figure 5 It is a schematic diagram of the overall structure of the feed piece of the present invention;

[0081] Figure 6 It is a schematic diagram of the structure of the cleaning box and the heating component when they are combined with each other in the present invention;

[0082] Figure 7 It is a schematic diagram of the overall structure of the heating component of the present invention;

[0083] Figure 8 It is a schematic structural diagram of the cleaning box of the present invention when it is combined with the driving component and the liquid replenishing component;

[0084] Fig. 9 It is a schematic diagram of the overall structure of the first follow-up rocking component of the present invention;

[0085] Fig.10 It is a schematic diagram of the overall structure of the second follow-up rocking component of the present invention;

[0086] Fig.11 It is a schematic diagram of the overall structure of the fluid replenishing component of the present invention;

[0087] Fig.12 It is a schematic diagram of the overall structure of the linkage stirring component of the present invention;

[0088] Fig.13 It is a schematic diagram of the overall structure of the linkage blocking component of the present invention;

[0089] Fig.14 An exploded view of the linkage blocking component of the present invention;

[0090] Fig.15 It is a schematic diagram of the overall structure of the driving component of the present invention;

[0091] Fig.16 It is a partial cross-sectional view of the heating component of the present invention.

[0092] In all the drawings, the same reference numerals represent the same technical features, specifically: 1. operating table; 11. cleaning box; 12. heating member; 121. heating frame; 122. heating pipe; 123. connecting box; 124. embedded plate; 125. air bag; 126. lower pressure plate; 127. plug rod; 128. upper pressure plate; 129. first spring; 1291. liquid supply bag; 1292. nozzle; 1293. nozzle; 2. adjusting member; 21. first frame; 22. second frame; 23. slide rail; 24. connecting frame; 25. first drive motor; 26. connecting screw rod; 27. cross plate; 28. Slider; 29. ​​First electric cylinder; 291. External ring; 3. Feeding push member; 31. Third frame; 32. Second electric cylinder; 33. Feeding tray; 34. Feeding plate; 35. Third electric cylinder; 36. Positioning plate; 37. Feeding piece; 371. Loading sub-plate; 372. Through rod; 373. External shaft seat; 374. Clamping plate; 375. Positioning screw; 4. Driving member; 41. Second driving motor; 42. Sleeve disc; 43. Driving shaft; 44. First bevel gear; 45. Extension rod; 46. Second bevel gear; 47. Counterweight rod sleeve; 48. Cam; 49. Toothed disc; 5. The first follow-up shaking member; 51, follow-up plate; 52, follow-up rod; 53, follow-up roller; 54, stabilizing rod; 55, second spring; 56, follow-up shaking plate; 57, tail plate; 58, tooth plate; 59, built-in shaft seat; 591, tooth rod; 592, first follow-up gear; 593, second follow-up gear; 594, belt; 595, cross stirring blade; 6, liquid replenishing member; 61, first vertical plate; 62, second vertical plate; 63, liquid replenishing pipe; 64, liquid replenishing tank; 65, suction pump; 66, liquid outlet bucket; 67, liquid inlet pipe; 68, liquid outlet pipe; 7, linkage stirring member; 71, diamond sleeve plate; 72, stirring Mixing shaft; 73, meshing wheel; 74, dragon blade; 75, horizontal axis; 76, inclined blade; 8, linkage blocking component; 81, sleeve; 82, frame; 83, linkage block; 84, linkage rod; 85, guide block; 86, third spring; 87, rocker arm; 88, sleeve ring; 89, bearing; 891, side rod; 892, sealing plate; 9, second follow-up shaking component; 91, fitting disk; 92, non-magnetic ring; 93, first permanent magnetic ring; 94, second permanent magnetic ring; 95, mounting plate; 96, plug-in plate; 97, pressing wheel; 98, permanent magnetic plate; 981, mounting rod; 982, fourth spring; 983, limit block. DETAILED DESCRIPTION

[0093] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0094] The terms used herein are only for describing specific embodiments and are not intended to limit the present invention. The terms "comprise", "include", etc. used herein indicate the existence of the features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0095] All terms (including technical and scientific terms) used herein have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification, and should not be interpreted in an idealized or overly rigid manner.

[0096] In the embodiment, Figure 1-16 A wafer cleaning device is provided, characterized in that it comprises an operating table 1 having a mounting plane, on which a cleaning box 11 is removably arranged; a heating component 12 is detachably arranged on the mounting plane and can cover the operating table 1; an adjusting component 2 is detachably arranged on the mounting plane and can surround the operating table 1; a feeding pushing component 3 is detachably mounted on the adjusting component 2; and a driving component 4 is detachably mounted on the adjusting component 2. On the top, the driving member 4 can be inserted into the cleaning box 11; the first follower shaking member 5 is detachably installed on an inner wall of the cleaning box 11; the liquid replenishing member 6 is detachably installed in the cleaning box 11; the linkage stirring member 7 is detachably arranged on the liquid replenishing member 6; the linkage blocking member 8 is detachably installed on the driving member 4, and the linkage blocking member 8 can be inserted into the liquid replenishing member 6; the second follower shaking member 9 is detachably arranged on the inner wall of the cleaning box 11.

[0097] The present invention is based on an overall idea that, through the arrangement of the driving member 4, after the staff inserts the driving shaft 43 into the external shaft seat 373, the driving member 4 and the feed member 37 can form a detachable whole, and by turning on the switch of the second driving motor 41, the driving shaft 43 can be rotated, which can drive the feed member 37 to rotate, so that the feed member 37 can drive multiple groups of wafers to perform cleaning operations in the cleaning box 11. At the same time, the first bevel gear 44 and the second bevel gear 46 can be driven to rotate, so as to drive the cam 48 to rotate. In this process, the counterweight rod sleeve 47 can be arranged to extend the The extension rod 45 is counterweighted when rotating; through the arrangement of the first follower shaking member 5, when the cam 48 rotates, when the raised end of the cam 48 touches the follower roller 53, the follower rod 52 can be driven to move downward, and at the same time, the stabilizing rod 54 moves downward, and the second spring 55 is compressed. After the follower rod 52 moves downward, the follower shaking plate 56 can be driven to move downward, so that the follower shaking plate 56 and the tail plate 57 can shake the mixture of the reaction liquid and water in the up and down directions to accelerate the mixing speed between the reaction liquid and the water. When the smooth disk end of the cam 48 contacts the follower roller 53, the second spring 55 can be retracted. The follower roller 53 is driven back to the initial position. When the follower shaking plate 56 moves downward, the tooth plate 58 can be driven downward, so that the tooth plate 58 drives the first follower gear 592 to rotate, thereby driving the second follower gear 593 to rotate, and at the same time driving multiple groups of cross stirring blades 595 to further accelerate the mixing speed between the reaction liquid and water. When the second follower gear 593 rotates, it can also drive the second follower gear 593 located at the upper and lower ends to rotate, thereby driving the cross stirring blades 595 at the upper and lower ends to rotate, so as to accelerate the mixing speed between the reaction liquid and water in multiple directions. The mixing speed between the liquid and the water can further promote the reaction speed between the impurities on the wafer and the mixed liquid; and as the follower shaking plate 56 moves downward, the resistance is gradually increased, so by gradually increasing the number of teeth of the tooth plate 58 from bottom to top, the meshing time between the tooth plate 58 and the first follower gear 592 is increased from bottom to top, which can further extend the rotation time of the second follower gear 593 to speed up the mixing between the reaction liquid and the water. In addition, in the process of the follower shaking plate 56 moving upward, the cross stirring blade 595 can be driven to reverse to promote the mixing operation of the mixed liquid and water;Through the arranged liquid replenishing member 6, the staff can extract the reaction liquid in the liquid replenishing box 64 into the liquid replenishing tube 63 by turning on the switch of the suction pump 65, and the reaction liquid flows out through the liquid outlet end of the liquid replenishing tube 63 and falls through the liquid outlet hopper 66. In the process of the feeding pushing member 3 stretching the driving member 4 to move upward, the liquid replenishing member 6 can be synchronously driven to move upward. At this time, the second vertical plate 62 can be extended and retracted up and down in the first vertical plate 61 to cooperate with the feeding pushing member 3 to stretch and move the driving member 4 upward; through the arranged linkage stirring member 7, When the staff makes the toothed disc 49 penetrate until it conflicts with the multiple groups of meshing wheels 73, when the toothed disc 49 meshes with the meshing wheels 73, it can drive the four groups of stirring shafts 72 to rotate, so as to drive the four groups of dragon blades 74 to rotate, so as to drive the horizontal shaft 75 and the inclined blades 76 to rotate, so that the dragon blades 74 and the inclined blades 76 can stir the reaction liquid and water to accelerate the reaction between the mixed liquid and water. After the reaction liquid and water are fully mixed, the reaction between the mixed liquid and the impurities on the wafer can be further accelerated to accelerate the cleaning operation of the wafer;

[0098] Through the arranged linkage blocking member 8, after the staff drives the driving shaft 43 to rotate, since the driving shaft 43 is connected to the collar 88, the collar 88 can be driven to rotate and the sleeve 81 can be driven to rotate. As the speed of the driving member 4 increases, the centrifugal force on the linkage block 83 can be increased, and the linkage block 83 can be moved outward along the direction of the notch of the frame 82. After the two groups of linkage blocks 83 move outward, the collar can be driven 88 moves downward as a whole, and after the sleeve ring 88 moves downward, it can drive the side rod 891 and the sealing plate 892 to move downward. After the sealing plate 892 moves downward, the through hole can be replaced, so that the small through hole is replaced by a through hole with an increased aperture, which can further speed up the outflow speed of the reaction liquid in the liquid replenishing tube 63, so as to speed up the speed at which the reaction liquid flows into the cleaning box 11. When the concentration of the reaction liquid in the cleaning box 11 is increased, the reaction speed of the impurities on the wafer can be further accelerated, and by increasing the rotation speed of the driving shaft 43 Afterwards, the rotation speed of the feed member 37 can be further accelerated to accelerate the rotation speed of the wafer, so as to promote the cleaning speed of the wafer in the cleaning box 11; by the arranged second follower shaking member 9, by rotating the driving shaft 43, the bonding disk 91 can be driven to rotate, and when the first permanent magnet ring 93 rotates to correspond to the permanent magnet plate 98, due to the principle of magnetic repulsion, the permanent magnet plate 98 can be driven to move backward, on the one hand, the permanent magnet plate 98 can drive the pressing wheel 97 to vibrate the inner wall of the cleaning box 11, To prevent impurities from staying on the inner wall of the cleaning box 11, on the other hand, when the permanent magnetic plate 98 moves backward, the mixture of the reaction liquid and water can be further shaken in the front-to-back direction, and the first follow-up shaking member 5 can be used to shake the liquid in the up-down and front-to-back directions at the same time to further accelerate the mixing of the reaction liquid and water. When the non-magnetic ring 92 moves to correspond to the permanent magnetic plate 98, the fourth spring 982 can retract when it loses compression to push the permanent magnetic plate 98 back to its initial position;

[0099] By laying out the heating component 12, the staff turns on the switch of the heating tube 122, on the one hand, can perform annular heating on the cleaning box 11 through the heating frame 121, and by heating the mixture of the reaction liquid and water in the cleaning box 11, the thermal motion between the liquid molecules can be accelerated, and the collision frequency between the molecules can be increased. This increase in the collision frequency is conducive to the uniform distribution and mixing of different liquid components. On the other hand, after being heated by the heating tube 122, the airbag 125 can be heated and expanded to push the lower pressure plate 126 and the upper pressure plate 128 to move upward. When the upper pressure plate 128 moves upward, it can The push-up liquid supply bag 1291 releases the reaction liquid into the cleaning box 11 through the nozzle 1293. By replenishing the liquid in the cleaning box 11, it can prevent the reaction liquid from reacting with the impurities on the wafer, which will cause the concentration of the reaction liquid to decrease and thus reduce the cleaning efficiency of the wafer. By increasing the rotation speed of the driving shaft 43, the cleaning efficiency of the wafer can be accelerated synchronously. On the other hand, it can promote the up and down shaking frequency of the first follow-up shaking component 5, and on the other hand, it can promote the front and back shaking frequency of the second follow-up shaking component 9. Finally, it can synchronously increase the feeding speed of the liquid replenishing component 6.

[0100] Next, the adjusting member 2 is given a more specific structure and construction as a whole for further explanation. The adjusting member 2 includes a first frame 21, which is detachably mounted on the mounting plane, and a slide rail 23 is detachably mounted on the first frame 21; a second frame 22, which is detachably arranged on the mounting plane, and the second frame 22 is located on one side of the first frame 21, and a connecting frame 24 is detachably mounted on the second frame 22, and a first driving motor 25 is detachably mounted on the connecting frame 24, and the output of the first driving motor 25 The end of the first drive motor 25 can be inserted into the connecting machine frame 24, and a connecting screw rod 26 is detachably installed on the output end of the first drive motor 25; a ball bearing base is slidably arranged in the connecting machine frame 24, and the ball bearing base can be passed through by the connecting screw rod 26; a horizontal plate 27 is detachably installed on the ball bearing base, and a slider 28 that can slide on the slide rail 23 is detachably arranged at the bottom of the horizontal plate 27; a first electric cylinder 29 is detachably installed on the horizontal plate 27, and an external ring 291 is detachably installed on the output end of the first electric cylinder 29;

[0101] Next, the overall working principle of the adjusting member 2 is further explained. The staff turns on the switch of the first driving motor 25 so that the first driving motor 25 drives the connecting screw 26 to rotate, so as to drive the adjustment of the position of the cross plate 27 along the front-to-back direction. After the first electric cylinder 29 moves to the top of the feed pushing member 3, the driving member 4 in the external ring 291 can be pushed into the feed part 37 in the feed pushing member 3 by turning on the first electric cylinder 29.

[0102] Next, a more specific structure and construction is given to the entire feed pushing component 3 for further explanation. The feed pushing component 3 includes a third frame 31, which is detachably mounted on the mounting plane; a second electric cylinder 32, which is detachably mounted on the third frame 31, and a feed tray 33 is detachably mounted on the output end of the second electric cylinder 32; two groups of feed plates 34, which are detachably arranged on the feed tray 33, and a third electric cylinder 35 is detachably arranged on each group of feed plates 34, and a positioning plate 36 is detachably arranged on the output end of each group of third electric cylinders 35; a feed piece 37, which is removably arranged on the feed tray 33, and the feed piece 37 is located between the two groups of positioning plates 36;

[0103] Next, a more specific structure and construction is given to the entire feed piece 37 for further explanation. The feed piece 37 includes a plurality of groups of bearing sub-plates 371, on which a plurality of groups of penetration rods 372 are detachably arranged, the plurality of groups of bearing sub-plates 371 are combined by the plurality of penetration rods 372, a bearing area for the wafer to pass through is formed between every two of the bearing sub-plates 371, an external shaft seat 373 is detachably installed on the bearing sub-plates 371, a clamping plate 374 is also removably installed on the plurality of groups of bearing sub-plates 371, and the clamping plate 374 can clamp the uppermost group of bearing sub-plates 371 and the lowermost group of bearing sub-plates 371 at the same time, two groups of positioning screws 375 are also rotatably arranged on the clamping plate 374, and the positioning screws 375 can penetrate into the uppermost group of bearing sub-plates 371 and the lowermost group of bearing sub-plates 371;

[0104] Next, the overall use principle of the feed pushing member 3 is further explained. The staff turns on the second electric cylinder 32 to push the feed tray 33 to a predetermined position. By turning on the switches of the two sets of third electric cylinders 35, the two sets of positioning plates 36 pre-position the feed piece 37 to prevent the feed piece 37 from shifting sideways when the driving member 4 penetrates into the feed piece 37.

[0105] Next, the working principle of the entire feed piece 37 is further explained. The staff inserts the wafers into the bearing area formed between each pair of bearing sub-plates 371 in turn. After completing the filling operation of multiple groups of wafers, the clamping plate 374 is clamped into the multiple groups of bearing sub-plates 371, and the upper and lower groups of positioning screws 375 are screwed to make the upper group of positioning screws 375 penetrate into the uppermost bearing sub-plate 371, so that the lower group of positioning screws 375 penetrate into the lowermost bearing sub-plate 371 to complete the sealing operation of the multiple groups of wafers. When the driving component 4 penetrates into the external shaft seat 373, the driving component 4 and the feed piece 37 can form a detachable whole.

[0106] Next, a more specific structure and construction is given to the driving member 4 as a whole for further explanation. The driving member 4 includes a second driving motor 41, which is detachably mounted on the adjusting member 2, a set of discs 42 is detachably mounted on the second driving motor 41, a driving shaft 43 is detachably arranged on the output end of the second driving motor 41, and the driving shaft 43 can be inserted into the cleaning box 11; a first bevel gear 44, which is detachably mounted on the driving shaft 43, and the first bevel gear 44 is located in the set of discs 42; an extension rod 45, which is rotatably arranged in the set of discs 42, a second bevel gear 46 is detachably arranged on the extension rod 45, and the second bevel gear 46 and the first bevel gear 44 are meshed with each other, a counterweight rod sleeve 47 is also detachably mounted on the extension rod 45, and a cam 48 is also detachably mounted on one tail end of the extension rod 45;

[0107] Next, the working principle of the driving component 4 as a whole is further explained. After the staff inserts the driving shaft 43 into the external shaft seat 373, the driving component 4 and the feed piece 37 can form a detachable whole. By turning on the switch of the second driving motor 41 to rotate the driving shaft 43, the feed piece 37 can be driven to rotate, so that the feed piece 37 can drive multiple groups of wafers to perform cleaning operations in the cleaning box 11. At the same time, the first bevel gear 44 and the second bevel gear 46 can be driven to rotate to drive the cam 48 to rotate. In this process, the counterweight rod sleeve 47 can be arranged to allow the extension rod 45 to be counterweighted during rotation.

[0108] Next, the first follower shaking member 5 is given a more specific structure and construction as a whole for further explanation. The first follower shaking member 5 includes a follower plate 51, which is detachably mounted on an inner wall of the cleaning box 11; a follower rod 52, which penetrates into the follower plate 51, and the follower rod 52 can slide up and down along the follower plate 51; a follower roller 53, which is rotatably mounted on the top of the follower rod 52; a stabilizing rod 54, which is detachably mounted on the top of the follower rod 52, and the stabilizing rod 54 can pass through the follower plate 51, and a gasket is arranged on the end of the stabilizing rod 54 passing through the follower plate 51; a second spring 55, which is removably arranged on the stabilizing rod 54; a follower shaking plate 56, which is detachably mounted on the bottom of the follower rod 52, and a detachable A tail plate 57 is installed; three groups of tooth plates 58 are detachably installed on the side surfaces of the follower shaking plate 56, and the number of teeth of the three groups of tooth plates 58 increases gradually from bottom to top; an internal shaft seat 59 is detachably installed on an inner side wall of the cleaning box 11, a gear rod 591 is rotatably arranged in the internal shaft seat 59, a first follower gear 592 is detachably arranged on the gear rod 591, in the initial position, the first follower gear 592 is meshed with a group of tooth plates 58 located at the lowest position, a second follower gear 593 is detachably installed on the gear rod 591, a belt 594 is removably arranged on the second follower gear 593, and the belt 594 can drive multiple groups of second follower gears 593 to rotate, and multiple groups of cross stirring blades 595 are detachably arranged on the gear rod 591;

[0109] Next, the overall use principle of the first follower shaking component 5 is further explained. When the cam 48 rotates, when the raised end of the cam 48 touches the follower roller 53, the follower rod 52 can be driven to move downward. At the same time, the stabilizing rod 54 moves downward, and the second spring 55 is compressed. After the follower rod 52 moves downward, the follower shaking plate 56 can be driven downward, so that the follower shaking plate 56 and the tail plate 57 can shake the mixture of the reaction liquid and water in the up and down directions to accelerate the mixing speed between the reaction liquid and the water. When the smooth disk end of the cam 48 contacts the follower roller 53, the follower roller 53 can be driven to return to the initial position when the second spring 55 retracts. In the process of the follower shaking plate 56 moving downward, the tooth plate 58 can be driven downward, so that the tooth plate 58 drives the first follower gear 592 to rotate, thereby driving the second follower gear 593 to rotate, and at the same time driving the multiple groups of cross stirring blades 595 to further In order to accelerate the mixing speed between the reaction liquid and the water, when the second follower gear 593 rotates, it can also drive the second follower gears 593 located at the upper and lower ends to rotate, so as to drive the cross stirring blades 595 at the upper and lower ends to rotate, so as to accelerate the mixing speed between the reaction liquid and the water in multiple directions. By accelerating the mixing speed between the reaction liquid and the water, the reaction speed between the impurities on the wafer and the mixed liquid can be further promoted; and as the follower shaking plate 56 moves downward, the resistance encountered is gradually increased. Therefore, by gradually increasing the number of teeth of the tooth plate 58 from bottom to top, the meshing time between the tooth plate 58 and the first follower gear 592 is increased from bottom to top, which can further extend the rotation time of the second follower gear 593 to accelerate the mixing between the reaction liquid and the water. In addition, in the process of the follower shaking plate 56 moving upward, it can also drive the cross stirring blades 595 to reverse, so as to promote the mixing operation of the mixed liquid and the water.

[0110] Next, a more specific structure and construction is given to the whole of the liquid replenishing component 6 for further explanation. The liquid replenishing component 6 includes a first vertical plate 61, which is detachably installed in the cleaning box 11, and a second vertical plate 62 is slidably arranged in the first vertical plate 61; a liquid replenishing tube 63, which is detachably installed on a second vertical plate 62, and has a flow channel in the liquid replenishing tube 63; a liquid replenishing tank 64, which is detachably installed on the liquid replenishing tube 63, and a liquid inlet pipe 67 and a liquid outlet pipe 68 are detachably installed on the liquid replenishing tube 63; a suction pump 65, which is detachably installed on the liquid replenishing tube 63, and the suction pump 65 is connected to one end of the liquid replenishing tank 64 and the liquid replenishing tube 63 respectively; a liquid outlet hopper 66, which is detachably installed on a liquid outlet end of the liquid replenishing tube 63, and there is an inclination angle between the liquid outlet hopper 66 and the liquid replenishing tube 63;

[0111] Next, the overall usage principle of the liquid replenishing component 6 is further explained. By turning on the switch of the suction pump 65, the staff can extract the reaction liquid in the liquid replenishing tank 64 into the liquid replenishing tube 63, and the liquid flows out through the liquid outlet end of the liquid replenishing tube 63 and falls through the liquid outlet bucket 66. In the process of the feed pushing component 3 stretching the driving component 4 to move upward, the liquid replenishing component 6 can be driven to move upward synchronously. At this time, the second vertical plate 62 can be extended and retracted up and down in the first vertical plate 61 to cooperate with the feed pushing component 3 to stretch and move the driving component 4 upward.

[0112] Next, a more specific structure and construction is given to the whole linkage stirring member 7 for further explanation. The linkage stirring member 7 includes a diamond sleeve 71, which is detachably mounted on the infusion tube 63, a stirring shaft 72 is rotatably arranged at the four corners of the diamond sleeve 71, and a meshing wheel 73 is detachably arranged on one end of the stirring shaft 72 passing through the diamond sleeve 71; a dragon blade 74 is detachably mounted on the stirring shaft 72; multiple groups of horizontal shafts 75 are detachably mounted on the stirring shaft 72, and the multiple groups of horizontal shafts 75 are arranged from top to bottom along the length direction of the stirring shaft 72, and an inclined blade 76 is detachably arranged on both ends of each group of horizontal shafts 75;

[0113] Next, the overall use principle of the linked stirring component 7 is further explained. When the staff allows the toothed disc 49 to penetrate until it conflicts with the multiple sets of meshing wheels 73, when the toothed disc 49 meshes with the meshing wheels 73, it can drive the four sets of stirring shafts 72 to rotate, thereby driving the four sets of dragon blades 74 to rotate, thereby driving the horizontal axis 75 and the inclined blades 76 to rotate, so that the dragon blades 74 and the inclined blades 76 can stir the reaction liquid and water to accelerate the reaction between the mixed liquid and water. After the reaction liquid and water are fully mixed, the reaction between the mixed liquid and impurities on the wafer can be further accelerated to accelerate the cleaning operation of the wafer.

[0114] Next, the linkage blocking member 8 is given a more specific structure and construction as a whole for further explanation. The linkage blocking member 8 includes a sleeve 81, which is detachably mounted on the driving member 4, and two sets of frames 82 are detachably arranged on the outer circumferential surface of the sleeve 81; a linkage block 83, which is slidably arranged in the frame 82, and in the initial state, the linkage block 83 can fit with the sleeve 81; a linkage rod 84, which is detachably mounted on the linkage block 83, and the linkage rod 84 can pass through the frame 82, and a guide block 85 is detachably mounted on the end of the linkage rod 84 passing through the frame 82; a third spring 86, which is removably mounted On the linkage rod 84, and the third spring 86 is located in the frame 82; the collar 88 is detachably mounted on the driving member 4; the swing rod 87, one end of which is rotatably arranged on the linkage block 83, and the other end of which is rotatably arranged on the collar 88; the bearing 89 is detachably mounted in the collar 88, and a side rod 891 is detachably mounted on one end of the bearing 89; the sealing plate 892 is detachably mounted on the side rod 891, and the sealing plate 892 has three groups of through holes, and the apertures of the three groups of through holes are gradually increased from bottom to top, and the sealing plate 892 can be inserted into the infusion tube 63 to be used for blocking and regulating the flow channel formed by the infusion tube 63;

[0115] Next, the overall working principle of the linkage blocking member 8 is further explained. After the staff drives the drive shaft 43 to rotate, since the drive shaft 43 is connected to the collar 88, the collar 88 can be driven to rotate after the drive shaft 43 rotates, and the sleeve 81 can be driven to rotate. After the rotation speed of the driving member 4 increases, the centrifugal force on the linkage block 83 can be increased, and the linkage block 83 can be moved outward along the direction of the notch of the frame 82. After the two groups of linkage blocks 83 move outward, the collar 88 can be driven to move downward as a whole. After the collar 88 moves downward, , and can drive the side rod 891 and the sealing plate 892 to move downward. After the sealing plate 892 moves downward, the through hole can be replaced so that the small through hole is replaced by a through hole with an increased aperture, which can further accelerate the outflow speed of the reaction liquid in the liquid replenishing tube 63, so as to accelerate the speed of the reaction liquid flowing into the cleaning box 11. When the concentration of the reaction liquid in the cleaning box 11 is improved, the reaction speed of the impurities on the wafer can be further accelerated, and by increasing the rotation speed of the driving shaft 43, the rotation speed of the feed part 37 can be further accelerated to accelerate the rotation speed of the wafer, so as to promote the cleaning speed of the wafer in the cleaning box 11.

[0116] Next, the second follower oscillating member 9 is given a more specific structure and construction as a whole for further explanation. The second follower oscillating member 9 includes a bonding plate 91, which is detachably mounted on the driving member 4. Two groups of non-magnetic rings 92 are detachably arranged in the bonding plate 91. A first permanent magnet ring 93 and a second permanent magnet ring 94 are also detachably arranged in the bonding plate 91. The first permanent magnet ring 93 and the second permanent magnet ring 94 are respectively located between the two groups of non-magnetic rings 92; a mounting plate 95, which is detachably mounted inside the cleaning box 11. On the side wall, a plug-in plate 96 is slidably arranged in the mounting plate 95, a pressing wheel 97 is rotatably arranged on one tail end of the plug-in plate 96, and a permanent magnet plate 98 is detachably arranged on the other tail end of the plug-in plate 96; a mounting rod 981 is detachably mounted on the permanent magnet plate 98, and the mounting rod 981 can pass through the mounting plate 95, and a limit block 983 is detachably mounted on the end of the mounting rod 981 passing through the mounting plate 95, and a fourth spring 982 is also removably sleeved on the mounting rod 981;

[0117] It should also be noted that the first permanent magnet ring 93 , the second permanent magnet ring 94 and the permanent magnet plate 98 have the same magnetic properties.

[0118] Next, the overall use principle of the second follower shaking member 9 is further explained. By rotating the drive shaft 43, the bonding disk 91 can be driven to rotate. When the first permanent magnetic ring 93 rotates to correspond to the permanent magnetic plate 98, due to the principle of magnetic repulsion, the permanent magnetic plate 98 can be driven to move backward. On the one hand, the permanent magnetic plate 98 can drive the pressing wheel 97 to vibrate the inner wall of the cleaning box 11 to prevent impurities from staying on the inner wall of the cleaning box 11. On the other hand, when the permanent magnetic plate 98 moves backward, the mixed liquid of the reaction liquid and water can be further shaken in the front-to-back direction. The first follower shaking member 5 can be used to shake the liquid in the up-down and front-to-back directions at the same time to further accelerate the mixing of the reaction liquid and water. When the non-magnetic ring 92 moves to correspond to the permanent magnetic plate 98, the fourth spring 982 can retract when it loses compression to push the permanent magnetic plate 98 back to its initial position.

[0119] Next, the heating component 12 is given a more specific structure and construction for further explanation. The heating component 12 includes a heating frame 121, which can cover the cleaning box 11, and a heating pipe 122 is detachably arranged in the heating frame 121; a connecting box 123, which is detachably installed on the installation plane and can be penetrated by the heating pipe 122, and an inner panel 124 is detachably installed in the connecting box 123; an air bag 125, which is detachably installed at the bottom of the connecting box 123; a lower pressing plate 126, on which a plug rod 12 is detachably arranged. 7, and the insertion rod 127 can pass through the inner plate 124, an upper pressing plate 128 is detachably arranged on the end of the insertion rod 127 passing through the inner plate 124, and a first spring 129 is removably sleeved on the insertion rod 127; a liquid supply bag 1291 is detachably installed in the connection box 123, and in the initial position, the liquid supply bag 1291 is in contact with the upper pressing plate 128; a nozzle 1292 is detachably installed on the liquid supply bag 1291, and the nozzle 1292 can pass through the connection box 123, and a nozzle 1293 is detachably arranged on the nozzle 1292;

[0120] Next, the overall use principle of the heating component 12 is further explained. When the staff turns on the switch of the heating tube 122, on the one hand, the cleaning box 11 can be annularly heated by the heating frame 121. By heating the mixture of the reaction liquid and water in the cleaning box 11, the thermal motion between the liquid molecules can be accelerated and the collision frequency between the molecules can be increased. The increase in the collision frequency is conducive to the uniform distribution and mixing of different liquid components. On the other hand, after being heated by the heating tube 122, the airbag 125 can be heated and expanded to push the lower pressure plate 126 and the upper pressure plate 128 upward. When the upper pressure plate After moving up, 128 can push the liquid supply bag 1291 to release the reaction liquid into the cleaning box 11 through the nozzle 1293. By replenishing the liquid in the cleaning box 11, it can prevent the reaction liquid from reacting with the impurities on the wafer, resulting in a decrease in the concentration of the reaction liquid and a decrease in the cleaning efficiency of the wafer. By increasing the rotation speed of the drive shaft 43, the cleaning efficiency of the wafer can be accelerated synchronously. On the other hand, it can promote the up and down shaking frequency of the first follow-up shaking component 5, and on the other hand, it can promote the front and back shaking frequency of the second follow-up shaking component 9. Finally, it can synchronously increase the feeding speed of the liquid replenishing component 6.

[0121] Another technical problem to be solved by the present invention is a cleaning method for a wafer cleaning device.

[0122] S1. Feeding and pushing wafers: multiple groups of wafers are loaded into the feed piece 37, and the wafers are pushed to a predetermined position by the feed pushing member 3;

[0123] S2, wafer conveying operation: by opening the adjusting member 2, the driving member 4 is adjusted along the front-back direction, and the adjusting member 2 is opened to push the driving member 4 into the feeding member 37, and then the feeding pushing member 3 is opened and withdrawn to the initial position, and the adjusting member 2 is continued to be opened to send the driving member 4 into the cleaning box 11;

[0124] S3, cleaning operation of the wafer: by turning on the driving member 4, the feeding member 37 is driven to rotate, so that the wafer in the feeding member 37 can be rotated and cleaned in the cleaning box 11, and as the rotation speed of the driving member 4 is further increased, the linkage blocking member 8 can be driven to be linked, so as to increase the speed of releasing the reaction liquid in the liquid replenishing member 6, and at the same time, the increase in the rotation speed of the driving member 4 can further improve the cleaning efficiency of the wafer, and can increase the concentration of the reaction liquid in the cleaning box 11 to improve the cleaning efficiency of the wafer;

[0125] S4, triggering the first follower shaking member 5: when the driving member 4 is output, the first follower shaking member 5 can be driven to move at the same time, and the mixed liquid in the cleaning box 11 can be shaken in the up and down directions to increase the mixing speed of the reaction liquid and water, and at the same time, the mixed liquid of the reaction liquid and water can be stirred;

[0126] S5, triggering the second follower shaking member 9: when the driving member 4 is output, the second follower shaking member 9 can vibrate the inner wall of the cleaning box 11 to prevent the reactants from adhering to the inner wall of the cleaning box 11, and at the same time can shake the mixed liquid of the reaction liquid and water in the front and back directions;

[0127] S6. Heating the cleaning box 11: By turning on the heating component 12, the cleaning box 11 can be heated to promote the fusion of the reaction liquid and water in the cleaning box 11. While heating the cleaning box 11, the reaction liquid can be further fed into the cleaning box 11.

[0128] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer cleaning device, characterized in that: It comprises an operating table (1) having a mounting plane on it, and a cleaning box (11) is removably arranged on the mounting plane; A heating component (12) is detachably arranged on the installation plane and is capable of covering the operating table (1); An adjusting component (2) which is detachably arranged on the mounting plane and is capable of surrounding the operating table (1); A material feeding pushing component (3) which is detachably mounted on the adjusting component (2); A driving member (4) which is detachably mounted on the adjusting member (2), and the driving member (4) is capable of penetrating into the cleaning box (11); A first follower rocking member (5) which is detachably mounted on an inner side wall of the cleaning box (11); A liquid replenishing component (6) which is detachably mounted in the cleaning box (11); A linked stirring member (7) which is detachably arranged on the liquid replenishing member (6); A linkage blocking component (8) which is detachably mounted on the driving component (4), and the linkage blocking component (8) can be inserted into the fluid replenishing component (6); a second follower oscillating member (9) which is detachably arranged on the inner wall of the cleaning box (11); the second follower oscillating member (9) can be driven when the driving member (4) is output, and when the second follower oscillating member (9) is driven, it can perform a knocking operation on the inner wall of the cleaning box (11); The first follower rocking member (5) comprises a follower plate (51) which is detachably mounted on an inner side wall of the cleaning box (11); A follower rod (52) is inserted into the follower plate (51), and the follower rod (52) can slide up and down along the follower plate (51); A follower roller (53) rotatably mounted on the top of the follower rod (52); A stabilizing rod (54) is detachably mounted on the top of the follower rod (52), and the stabilizing rod (54) can pass through the follower plate (51), and a gasket is arranged on one end of the stabilizing rod (54) passing through the follower plate (51); a second spring (55) which is removably arranged on the stabilizing rod (54); A follower rocking plate (56) is detachably mounted on the bottom of the follower rod (52), and a tail plate (57) is detachably mounted on the follower rocking plate (56); Three sets of tooth plates (58) are detachably mounted on the side surfaces of the follower shaking plate (56), and the number of teeth of the three sets of tooth plates (58) increases gradually from bottom to top; An internal shaft seat (59) is detachably mounted on an inner side wall of the cleaning box (11); a gear rod (591) is rotatably arranged in the internal shaft seat (59); a first follower gear (592) is detachably arranged on the gear rod (591); in an initial position, the first follower gear (592) is meshed with a set of toothed plates (58) located at the lowest position; a second follower gear (593) is also detachably mounted on the gear rod (591); a belt (594) is removably arranged on the second follower gear (593); and the belt (594) is capable of driving multiple sets of second follower gears (593) to rotate; and multiple sets of cross stirring blades (595) are also detachably arranged on the gear rod (591).

2. The wafer cleaning equipment according to claim 1, characterized in that: The adjusting component (2) comprises a first frame (21) which is detachably mounted on the mounting plane, and a slide rail (23) is detachably mounted on the first frame (21); A second frame (22) is detachably arranged on the installation plane, the second frame (22) is located on one side of the first frame (21), a connecting frame (24) is detachably mounted on the second frame (22), a first drive motor (25) is detachably mounted on the connecting frame (24), and an output end of the first drive motor (25) can be inserted into the connecting frame (24), and a connecting screw rod (26) is detachably mounted on the output end of the first drive motor (25); A ball bearing base, which is slidably arranged in the connecting machine frame (24), and the connecting screw rod (26) can pass through the ball bearing base; A horizontal plate (27) is detachably mounted on the ball bearing base, and a sliding block (28) capable of sliding on the sliding rail (23) is detachably arranged at the bottom of the horizontal plate (27); The first electric cylinder (29) is detachably mounted on the transverse plate (27), and an external ring (291) is detachably mounted on the output end of the first electric cylinder (29).

3. The wafer cleaning equipment according to claim 1, characterized in that: The material feeding pushing component (3) comprises a third frame (31) which is detachably mounted on the mounting plane; A second electric cylinder (32) is detachably mounted on the third frame (31), and a material feeding tray (33) is detachably mounted on the output end of the second electric cylinder (32); Two groups of feed plates (34) are detachably arranged on the feed tray (33); a third electric cylinder (35) is detachably arranged on each group of the feed plates (34); and a positioning plate (36) is detachably arranged on the output end of each group of the third electric cylinder (35); An inlet piece (37) is removably arranged on the inlet tray (33), and the inlet piece (37) is located between two sets of positioning plates (36); The feed member (37) comprises a plurality of groups of bearing sub-plates (371), on which a plurality of groups of penetration rods (372) are detachably arranged, the plurality of groups of bearing sub-plates (371) are combined by the plurality of penetration rods (372), and a bearing area for the wafer to pass through is formed between every two of the bearing sub-plates (371), an external shaft seat (373) is detachably mounted on the bearing sub-plates (371), a clamping plate (374) is also removably mounted on the plurality of groups of bearing sub-plates (371), and the clamping plate (374) can simultaneously clamp the uppermost group of bearing sub-plates (371) and the lowermost group of bearing sub-plates (371), and two groups of positioning screws (375) are also rotatably arranged on the clamping plate (374), and the positioning screws (375) can penetrate into the uppermost group of bearing sub-plates (371) and the lowermost group of bearing sub-plates (371).

4. The wafer cleaning equipment according to claim 1, characterized in that: The driving member (4) comprises a second driving motor (41) which is detachably mounted on the adjusting member (2); a set of disks (42) is detachably mounted on the second driving motor (41); a driving shaft (43) is detachably arranged on the output end of the second driving motor (41); and the driving shaft (43) is capable of passing into the cleaning box (11); A first bevel gear (44) is detachably mounted on the drive shaft (43), and the first bevel gear (44) is located inside the sleeve disc (42); An extension rod (45) is rotatably arranged in the sleeve (42); a second bevel gear (46) is detachably arranged on the extension rod (45), and the second bevel gear (46) and the first bevel gear (44) are meshed with each other; a counterweight rod sleeve (47) is also detachably mounted on the extension rod (45); and a cam (48) is also detachably mounted on a rear end of the extension rod (45).

5. The wafer cleaning equipment according to claim 4, characterized in that: The liquid replenishing component (6) comprises a first vertical plate (61) which is detachably mounted in the cleaning box (11); a second vertical plate (62) is slidably arranged in the first vertical plate (61); A liquid infusion tube (63) is detachably mounted on a second vertical plate (62), and a flow channel is provided in the liquid infusion tube (63); A liquid replenishing box (64) is detachably mounted on the liquid replenishing tube (63), and a liquid inlet tube (67) and a liquid outlet tube (68) are detachably mounted on the liquid replenishing tube (63); A suction pump (65) is detachably mounted on the liquid replenishing tube (63), and the suction pump (65) is respectively connected to the liquid replenishing tank (64) and one end of the liquid replenishing tube (63); The liquid outlet hopper (66) is detachably mounted on a liquid outlet end of the liquid replenishing tube (63), and an inclined angle is formed between the liquid outlet hopper (66) and the liquid replenishing tube (63).

6. The wafer cleaning equipment according to claim 5, characterized in that: The linked stirring member (7) comprises a rhombus-shaped sleeve (71) which is detachably mounted on the infusion tube (63); a stirring shaft (72) is rotatably arranged at four corners of the rhombus-shaped sleeve (71); and a meshing wheel (73) is detachably arranged at one end of the stirring shaft (72) that passes through the rhombus-shaped sleeve (71); A dragon blade (74) detachably mounted on the stirring shaft (72); A plurality of sets of transverse shafts (75) are detachably mounted on the stirring shaft (72), and the plurality of sets of transverse shafts (75) are arranged from top to bottom along the length direction of the stirring shaft (72), and an inclined blade (76) is detachably arranged at both ends of each set of the transverse shafts (75).

7. The wafer cleaning equipment according to claim 6, characterized in that: The linkage blocking component (8) comprises a sleeve (81) which is detachably mounted on the driving component (4), and two sets of frame frames (82) are detachably arranged on the outer circumferential surface of the sleeve (81); A linkage block (83) is slidably disposed in the frame (82); in an initial state, the linkage block (83) is able to fit in with the sleeve (81); A linkage rod (84) is detachably mounted on the linkage block (83), and the linkage rod (84) can pass through the frame (82). A guide block (85) is detachably mounted on one end of the linkage rod (84) passing through the frame (82); a third spring (86) which is removably sleeved on the linkage rod (84), and the third spring (86) is located inside the frame (82); a collar (88) detachably mounted on the drive member (4); A swing rod (87), one end of which is rotatably disposed on the linkage block (83), and the other end of which is rotatably disposed on the sleeve ring (88); A bearing (89) is detachably mounted in the sleeve ring (88), and a side rod (891) is detachably mounted on one end of the bearing (89); A sealing plate (892) is detachably mounted on the side rod (891); the sealing plate (892) has three groups of through holes, and the apertures of the three groups of through holes gradually increase from bottom to top; the sealing plate (892) can be inserted into the infusion tube (63) to perform a blocking and regulating operation on the flow channel formed by the infusion tube (63).

8. The wafer cleaning equipment according to claim 7, characterized in that: The second follower oscillating member (9) comprises a bonding disk (91) which is detachably mounted on the driving member (4); two groups of non-magnetic rings (92) are detachably arranged in the bonding disk (91); a first permanent magnet ring (93) and a second permanent magnet ring (94) are also detachably arranged in the bonding disk (91); the first permanent magnet ring (93) and the second permanent magnet ring (94) are respectively located between the two groups of non-magnetic rings (92); A mounting plate (95) is detachably mounted on the inner side wall of the cleaning box (11); a plug-in plate (96) is slidably disposed in the mounting plate (95); a pressing wheel (97) is rotatably disposed on one end of the plug-in plate (96); and a permanent magnet plate (98) is detachably disposed on the other end of the plug-in plate (96); A mounting rod (981) is detachably mounted on the permanent magnet plate (98), and the mounting rod (981) is capable of passing through the mounting plate (95); a limit block (983) is detachably mounted on one end of the mounting rod (981) passing through the mounting plate (95); and a fourth spring (982) is removably sleeved on the mounting rod (981); The heating component (12) comprises a heating frame (121), the heating frame (121) being capable of covering the cleaning box (11), and a heating pipe (122) being detachably arranged in the heating frame (121); A connection box (123) is detachably mounted on the mounting plane and can be penetrated by the heating pipe (122). An inner panel (124) is detachably mounted in the connection box (123); An air bag (125) detachably mounted on the bottom of the connection box (123); A lower pressing plate (126) on which a plug rod (127) is detachably provided, and the plug rod (127) is capable of passing through the inner plate (124); an upper pressing plate (128) is detachably provided on one end of the plug rod (127) passing through the inner plate (124); and a first spring (129) is removably sleeved on the plug rod (127); A liquid supply bag (1291) is detachably mounted in the connection box (123); in an initial position, the liquid supply bag (1291) is in contact with the upper pressing plate (128); The nozzle (1292) is detachably mounted on the liquid supply bag (1291), and the nozzle (1292) can pass through the connection box (123). A nozzle (1293) is detachably arranged on the nozzle (1292).

9. A cleaning method applied to the wafer cleaning equipment according to any one of claims 1 to 8, characterized in that: S1. Feeding and pushing wafers: loading multiple groups of wafers into the feed piece (37), and pushing the wafers to a predetermined position through the feed pushing component (3); S2, wafer conveying operation: opening the adjusting member (2) to complete the adjustment of the driving member (4) along the front-back direction, opening the adjusting member (2) to push the driving member (4) into the feeding member (37), then opening the feeding pushing member (3) to withdraw it to the initial position, and continuing to open the adjusting member (2) to send the driving member (4) into the cleaning box (11); S3, cleaning operation of the wafers: by turning on the driving component (4), the feeding component (37) is driven to rotate, so that the wafers in the feeding component (37) can be rotated and cleaned in the cleaning box (11); as the rotation speed of the driving component (4) is further increased, the linkage blocking component (8) can be driven to be linked, so as to increase the speed of releasing the reaction liquid in the liquid replenishing component (6); at the same time, the increase in the rotation speed of the driving component (4) can further improve the cleaning efficiency of the wafers, and can increase the concentration of the reaction liquid in the cleaning box (11) to improve the cleaning efficiency of the wafers; S4, triggering the first follower shaking member (5): when the driving member (4) is output, the first follower shaking member (5) can be driven to move at the same time, so as to shake the mixed liquid in the cleaning box (11) in the up and down directions, so as to increase the mixing speed of the reaction liquid and water, and at the same time stir the mixed liquid of the reaction liquid and water; S5, triggering the second follower shaking member (9): when the driving member (4) is output, the second follower shaking member (9) can vibrate the inner wall of the cleaning box (11) to prevent the reactants from adhering to the inner wall of the cleaning box (11), and at the same time can shake the mixed liquid of the reaction liquid and water in the front-back direction; S6. Heating the cleaning box (11): By turning on the heating component (12), the cleaning box (11) can be heated to promote the fusion of the reaction liquid and water in the cleaning box (11). While heating the cleaning box (11), the reaction liquid can be further fed into the cleaning box (11).

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